JP2022047297A - Bonding system, and manufacturing method of chip component using the same - Google Patents

Abstract

To provide a bonding system capable of precisely mounting a component in a short time by reducing error in the recognition position of a component as the bonding target even if the stop accuracy of the prism deteriorates.SOLUTION: The bonding system includes: a reflector that reflects an image of a chip entered from a first entrance in a first direction, and reflects an image of a bonding position entered from a second entrance in a second direction; and a movable light guide including at least: a first last reflection surface that is placed immediately below the first exit, which inclines generally parallel to the reflector to reflect entered image of the chip right overhead; and a second last reflection surface that is placed immediately below the second exit, which inclines generally parallel to the reflector to reflect the entered image of the bonding position right overhead.SELECTED DRAWING: Figure 8

Description

The present disclosure relates to a bonding apparatus and a method of manufacturing a chip component using the bonding apparatus.

In the process of manufacturing a semiconductor device, a bonding step of bonding a semiconductor chip (hereinafter, simply abbreviated as "chip") to a substrate by ultrasonic bonding or the like is executed. Since high position accuracy is required in the bonding process, the position error during the bonding process is corrected by image recognition. For example, the bonding apparatus of Patent Document 1 includes a recognition system that captures and recognizes a chip and a mounting positioning mark on a substrate immediately before mounting. In order to achieve high productivity while ensuring high position accuracy, this bonding device displays the image of the chip and the image of the bonding position at the first incident port and the first, respectively, when advancing between the chip and the substrate. A movable prism having a function of incident from two incident ports and emitted upward from the first exit port and the second exit port, an image of the emitted chip, and an image of the bonding position function as a double reflection mirror. It is provided with an image pickup unit that captures images by four image pickup units via a fixed optical unit provided with four prisms.

Japanese Unexamined Patent Publication No. 2019-201006

However, in the configuration of Patent Document 1, there is a problem that the recognition position of the chip position shifts more than the stopping accuracy when the movable prism moves depending on the reflected optical path.

This disclosure was devised in view of the above-mentioned conventional situation, and even if the stopping accuracy of the prism deteriorates, the error of the recognition position of the component to be bonded is reduced, and the component is mounted with high accuracy in a short time. The purpose is to provide the device.

The present disclosure is a bonding apparatus in which the bonding tool holds the chip and lowers the bonding tool toward the stage on which the substrate is placed so as to face the chip to bond the chip to the bonding position of the substrate. When it is located between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and from the first incident port. It is emitted upward from the first exit port separated in the horizontal direction, and the image of the bonding position of the substrate is incident from the second incident port facing the bonding position and horizontally from the first incident port. A movable light guide body that emits upward from a second exit port that is separated, a first image pickup means that captures an image of the chip emitted from the first exit port, and an exit from the second exit port. Based on the second imaging means for capturing the image of the bonding position, the image of the chip imaged by the first imaging means, and the image of the bonding position captured by the second imaging means. , A detecting means for detecting a relative misalignment between the chip and the bonding position, and an alignment means for relatively moving the bonding tool and the stage based on the misalignment detected by the detecting means. The movable light guide has a moving means for moving the movable light guide back and forth in the space between the chip and the substrate located above the bonding position, and the movable light guide is from the first incident port. A reflector that reflects the incident image of the chip in the first direction and reflects the image of the bonding position incident from the second incident port in the second direction, and directly below the first exit port. The first final reflecting surface having an inclination substantially parallel to the reflector and the bonding position arranged and incident just below the second exit port are arranged and incident on the image of the chip. Provided is a bonding apparatus including at least a second final reflecting surface having an inclination substantially parallel to the reflecting surface of the reflector, which reflects the image of the above.

Further, in the present disclosure, the bonding tool holds the chip, and the bonding tool is lowered in the direction of the stage on which the substrate is placed so as to face the chip, and the chip is bonded to the bonding position of the substrate. In the apparatus, when the image of the chip is incident between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and from the first incident port. The image of the bonding position of the substrate is incident from the second incident port facing the bonding position while being emitted upward from the first emission port separated in the horizontal direction, and horizontally from the first incident port. A movable light guide body that emits upward from a second exit port that is separated, and a first image pickup means that captures a first partial image that is a part of an image of the chip emitted from the first exit port. A second image pickup means for capturing a second partial image which is a part corresponding to the first partial image of the image of the bonding position emitted from the second exit port, and the first image pickup means. A third image pickup means for capturing a third partial image which is a part different from the first partial image of the image of the chip emitted from the exit port, and the above-mentioned ejected from the second exit port. A fourth image pickup means for capturing a fourth partial image which is a part corresponding to the third partial image of the image of the bonding position, and the first partial image captured by the first image pickup means. The second partial image captured by the second imaging means, the third partial image captured by the third imaging means, and the fourth partial image captured by the fourth imaging means. The bonding tool and the stage are relatively moved based on the detection means for detecting the relative misalignment between the chip and the bonding position and the misalignment detected by the detection means. The movable light guide has an alignment means and a moving means for moving the movable light guide back and forth in the space between the chip and the substrate located above the bonding position, and the movable light guide is the first. A reflector that reflects the image of the chip incident from the incident port in the first direction and reflects the image of the bonding position incident from the second incident port in the second direction, and the first emission. The image of the chip placed directly under the mouth and incident is reflected directly above, and the first final reflecting surface having an inclination substantially parallel to the reflector and the first final reflecting surface arranged directly under the second exit port are placed and incident. Image of the bonding position Provided is a bonding apparatus including, at least, a second final reflecting surface having an inclination substantially parallel to the reflector.

Further, in the present disclosure, when the chip is held between the chip held above the bonding position of the substrate by the bonding tool and the substrate, the image of the chip is incident on the first incident port facing the chip. The first incident port is horizontally separated from the first incident port, and the image of the bonding position is incident from the second incident port facing the bonding position. Using a movable light guide that emits upward from a second exit port that is horizontally separated from the chip, the bonding tool is lowered toward the stage on which the substrate is placed so as to face the chip, and the chip is lowered. A bonding method for bonding to the bonding position of the substrate, the first imaging step of imaging the image of the chip emitted from the first exit port, and the bonding emitted from the second exit port. The chip is based on a second imaging step of imaging a position image, an image of the chip imaged by the first imaging means, and an image of the bonding position imaged by the second imaging means. A detection step of detecting the relative misalignment of the bonding position, an alignment step of relatively moving the bonding tool and the stage based on the misalignment detected by the detection means, and the bonding. The movable light guide includes a moving step of moving the movable light guide back and forth in the space between the chip located above the position and the substrate, and the movable light guide includes the chip incident from the first incident port. The image of the bonding position is reflected in the first direction, and the image of the bonding position incident from the second incident port is reflected in the second direction. An image of the incident bonding position, which reflects the image of the incident chip directly above and is arranged directly under the second exit port and the first final reflection surface having an inclination substantially parallel to the reflector. Provided is a bonding method including at least a second final reflecting surface having an inclination substantially parallel to the reflector.

Further, in the present disclosure, when the chip is held between the chip held above the bonding position of the substrate by the bonding tool and the substrate, the image of the chip is incident from the first incident port facing the chip. The first incident port is horizontally separated from the first incident port, and the image of the bonding position is incident from the second incident port facing the bonding position. Using a movable light guide that emits upward from a second exit port that is horizontally separated from the chip, the bonding tool is lowered toward the stage on which the substrate is placed so as to face the chip, and the chip is lifted. A bonding method for bonding to a bonding position of the substrate, the first imaging step of imaging a first partial image which is a part of an image of the chip emitted from the first ejection port, and the first imaging step. A second imaging step of imaging a second partial image which is a part corresponding to the first partial image of the image of the bonding position emitted from the exit port 2, and exiting from the first exit port. A third imaging step of imaging a third partial image which is a part different from the first partial image of the image of the chip, and an image of the bonding position emitted from the second exit port. A fourth imaging step of imaging a fourth partial image which is a part corresponding to the third partial image, and the first partial image and the second partial image captured by the first imaging means. Based on the second partial image captured by the imaging means, the third partial image captured by the third imaging means, and the fourth partial image captured by the fourth imaging means. A detection step of detecting a relative misalignment between the chip and the bonding position, and an alignment step of relatively moving the bonding tool and the stage based on the misalignment detected by the detecting means. The movable light guide body includes a moving step of advancing and retreating the movable light guide body into the space between the chip located above the bonding position and the substrate, and the movable light guide body is incident from the first incident port. The image of the chip is reflected in the first direction, and the image of the bonding position incident from the second incident port is reflected in the second direction, and directly below the first exit port. The first final reflecting surface, which is arranged and reflects the image of the incident chip directly above and has an inclination substantially parallel to the reflector, and the bonding which is arranged and incident just below the second exit port. The image of the position is directly above Provided is a bonding method including at least a second final reflecting surface that reflects and has an inclination substantially parallel to the reflector.

According to the present disclosure, even if the stopping accuracy of the prism deteriorates, the error of the recognition position of the component to be bonded can be reduced, and the component can be mounted with high accuracy in a short time.

Perspective view of the bonding apparatus according to the first embodiment Side view of the bonding apparatus according to the first embodiment Front view of the bonding apparatus according to the first embodiment Bottom view of the image pickup unit equipped in the bonding apparatus according to the first embodiment. Sectional drawing of the image pickup unit equipped in the bonding apparatus which concerns on Embodiment 1. (A), (b) Operation explanatory diagram of the bonding apparatus according to the first embodiment. The perspective view which shows the structure of the movable light guide body in the bonding apparatus which concerns on Embodiment 1. Explanatory diagram of an image pickup unit used for image pickup of a chip and a bonding position by the bonding apparatus according to the first embodiment, and an image pickup field of view acquired. An explanatory diagram of an image acquisition path in imaging a chip and a bonding position by the bonding apparatus according to the first embodiment. The block diagram which shows the structure of the control system of the bonding apparatus which concerns on Embodiment 1. Perspective view showing the configuration of the movable light guide body in the bonding apparatus according to the comparative example. (A), (b) Operation explanatory diagram showing the visual recognition position when the position shift occurs in the movable light guide body according to the comparative example. An operation explanatory view showing a visual recognition position when a misalignment occurs in the movable prism according to the first embodiment.

Hereinafter, embodiments in which the bonding apparatus and bonding method according to the present disclosure are specifically disclosed will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of already well-known matters and duplicate explanations for substantially the same configuration may be omitted. This is to avoid unnecessary redundancy of the following description and to facilitate the understanding of those skilled in the art. It should be noted that the accompanying drawings and the following description are provided for those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims. The bonding method is a method for manufacturing chip parts using a bonding apparatus.

First, the configuration of the bonding apparatus 1 for bonding chips such as semiconductor chips to the bonding positions of the substrate will be described with reference to FIGS. 1, 2, and 3. FIG. 1 is a perspective view of the bonding apparatus 1 according to the first embodiment. FIG. 2 is a side view of the bonding apparatus 1 according to the first embodiment. FIG. 3 is a front view of the bonding apparatus 1 according to the first embodiment.

In the figure with arrows indicating the directions, the X-axis indicates the right-left direction of the bonding device, the Y-axis indicates the front-rear direction of the bonding device, and the Z-axis indicates the vertical direction of the bonding device. The X-axis and Y-axis are orthogonal to each other and are included in the horizontal plane. The Z axis is included in the vertical plane. Further, the bullet circle marked at the orthogonal point of any two axes indicates the front of the tip of the arrow, and the bullet circle indicates the back of the rear end of the arrow. In FIG. 1, the bonding apparatus 1 includes a chip supply unit 2, a substrate holding unit 3, a bonding mechanism 4, and a control unit 5 that controls each of these units.

The chip supply unit 2 has a function of supplying chips that are parts to be bonded. As shown in FIG. 2, the chip supply unit 2 includes a supply stage 11 arranged on the upper surface of the first XY table 10. The wafer sheet 13 is held in a stretched state on the upper surface of the supply stage 11, and the chip 14 in a state of being divided into individual pieces is placed on the upper surface of the wafer sheet 13 in a posture in which the active surface on which the bump is formed faces upward. It is pasted with. By driving the first XY table 10, the supply stage 11 can move in the X direction and the Y direction, and can be positioned at the extraction position [P1] of any chip 14 to be extracted.

As shown in FIG. 1, a pickup head 15 is coupled to the tip of an arm portion extending from the pickup head drive portion 16. By driving the pickup head drive unit 16, the pickup head 15 moves between the take-out position [P1] of the chip 14 above the supply stage 11 and the delivery position pickup position [P2] to the bonding mechanism 4. In the pickup of the chip 14, the chip 14 to be picked up is peeled off from the wafer sheet 13 by the operation of the ejector 12 arranged on the lower surface side of the wafer sheet 13. The peeled chip 14 is held by the pickup head 15 in a posture in which the active surface faces upward.

The pickup head 15 holding the chip 14 at the take-out position [P1] rises and moves to the pickup position [P2] by the bonding head 26 of the bonding mechanism 4 (see arrow c). By turning the pickup head 15 upside down (see arrow d) during this movement, the pickup head 15 is in a state of holding the chip 14 in a posture in which the active surface is facing downward at the pickup position [P2]. The pickup head 15 and the pickup head drive unit 16 constitute a chip transfer unit 17 that transfers the chip 14 taken out from the chip supply unit 2 at the take-out position [P1] to the pickup position [P2] by the optical head 30.

The configuration of the board holding portion 3 will be described. As shown in FIGS. 1 and 2, a substrate holding stage 21 holding the substrate 22 to be bonded is arranged on the upper surface of the second XY table 20. By driving the second XY table 20, the substrate holding stage 21 moves in the X direction and the Y direction. As a result, the bonding position 22a (see FIG. 6) set on the substrate 22 can be positioned at the working position [P3]. The chip 14 is bonded to the bonding position 22a aligned with the working position [P3] by the bonding tool 29 (see below) of the bonding mechanism 4.

The configuration of the bonding mechanism 4 will be described. As shown in FIGS. 1 and 2, the Y-axis frame 23 is horizontally arranged in the Y direction above the chip supply unit 2 and the substrate holding unit 3. A linear motor 24 having two rows of guide rails 25 is arranged along the side surface of the Y-axis frame 23. The guide rail 25 extends horizontally above the substrate holding stage 21. A first moving base 26a is movably mounted on the guide rail 25 via a slider 25a (see FIG. 3). The guide rail 25 is equipped with a second moving base 30a that can move along the guide rail 25 independently of the first moving base 26a.

A bonding head 26 is attached to the first moving base 26a. The bonding head 26 has a configuration in which the bonding tool 29 is held by the bonding tool holding unit 28 driven by the bonding tool driving unit 27. By driving the bonding tool driving unit 27 in the holding state of the chip 14 by the bonding tool 29, the bonding tool 29 lowers and joins the held chip 14 to the bonding position 22a of the substrate 22 (see FIG. 6). That is, in the bonding apparatus 1 according to the first embodiment, the bonding tool 29 holds the chip 14, and the bonding tool 29 is lowered in the direction of the substrate holding stage 21 on which the substrate 22 is placed so as to face the chip 14. , The chip 14 is bonded to the bonding position 22a of the substrate 22.

A light source box 31 is mounted on the second moving base 30a. As shown in FIG. 2, a movable optical unit 32 having a movable prism 32a (see FIG. 7), which is a movable light guide, is coupled to an arm portion 31a extending downward from the lower part of the light source box 31. .. Here, the arm portion 31a is provided so as to be bent toward the bonding head 26 side, and the movable prism 32a is in a form of being offset toward the bonding head 26 side with respect to the center of the optical head 30.

By driving the linear motor 24, the first moving base 26a and the second moving base 30a move along the guide rail 25, whereby the bonding head 26 and the optical head 30 move in the Y direction. Therefore, the linear motor 24 and the guide rail 25 are moving means for moving the bonding head 26 and the optical head 30.

That is, this moving means moves the bonding head 26 between the pickup position [P2] where the bonding tool 29 picks up the chip 14 and the working position [P3] where the chip 14 is bonded, and has a movable prism 32a built-in. The optical head 30 is moved in order to move the movable optical unit 32 in and out of the working position [P3].

Then, by moving the optical head 30, the function of advancing and retreating the movable prism 32a, which is a movable light guide body built in the movable optical unit 32, in the space between the chip 14 located above the bonding position 22a and the substrate 22. Have. As described above, by configuring the bonding head 26 and the optical head 30 to operate by the same moving means, it is possible to simplify the mechanism of the bonding apparatus and reduce the equipment cost.

As shown in FIG. 3, on the lower surfaces of the Y-axis frame 23 and the linear motor 24, the image pickup unit 34 shown in FIG. 4 is placed in the X direction via the base portion 35a of the image pickup section moving mechanism 35 which is the image pickup section moving means. It is mounted so that it can be moved in the Y direction. The image pickup unit 34 has four image pickup units individually provided with a camera.

Further, on the lower surface of the linear motor 24, an upper left prism 45 (an example of a first light guide), an upper right prism 46 (an example of a third light guide), and a lower left prism 47 shown in FIGS. (An example of a second light guide body), a fixed optical unit 33 incorporating a lower right prism 48 (an example of a fourth light guide body) is arranged. The movable optical unit 32 moves back and forth between the chip 14 and the substrate 22. In the first embodiment, the image pickup unit 34 is combined with the fixed optical unit 33 and the movable optical unit 32 so that the chip 14 and the substrate 22 are imaged by the image pickup unit 34.

As shown in FIGS. 2 and 3, a pair of spot lights 36 are arranged on the upper part of the Y-axis frame 23 so as to sandwich the work position [P3] from both sides. The spot illumination 36 is held by the tip of the holding bracket 36a extending from the Y-axis frame 23, and is arranged in a posture in which the irradiation direction is directed toward the movable optical unit 32 located at the working position [P3]. The illumination light emitted from the spot illumination 36 is incident on the movable prism 32a in the movable optical unit 32 and is irradiated to the bonding position 22a of the substrate 22 (see FIG. 13). That is, the spot illumination 36 is an illumination means for irradiating the substrate 22 with illumination light from above.

Next, with reference to FIGS. 4 and 5, the structure of the image pickup unit moving mechanism 35 for moving the image pickup unit 34 and the image pickup unit 34 will be described. FIG. 4 is a bottom view of the image pickup unit 34 mounted on the bonding device 1 according to the first embodiment. FIG. 5 is a cross-sectional view of an image pickup unit 34 equipped in the bonding device 1 according to the first embodiment.

FIG. 4 shows the lower surface of the image pickup unit 34 shown in FIG. 3, and FIG. 5 shows a cross section taken along the line AA in FIG. The base portion 35a shown in FIG. 4 is a rectangular base plate, and is mounted on the lower surface of the Y-axis frame 23 and the linear motor 24 (see FIG. 3). That is, in the first embodiment, the first image pickup means and the second image pickup means (see FIG. 8) constituting the image pickup unit 34 are moved by the linear motor 24 or the linear motor 24 which is a moving means for moving the bonding head 26 and the optical head 30. It is configured to be mounted on the lower surface of the Y-axis frame 23 that supports the moving means.

The configuration of the image pickup unit moving mechanism 35 will be described. A slider 37a fixed to a substantially rectangular X-direction moving table 35X is slidably fitted to a pair of guide rails 37 arranged in the X direction at both ends of the base portion 35a in the Y direction. An X-axis nut member 39X is arranged at an extension portion provided at one end of the X-direction moving table 35X in the Y direction. A feed screw 39Xa rotationally driven by the image pickup unit X-axis motor 34X is screwed into the X-axis nut member 39X. By driving the image pickup unit X-axis motor 34X in the forward and reverse directions, the X-direction moving table 35X reciprocates in the X direction. The image pickup unit X-axis motor 34X, the X-axis nut member 39X, and the feed screw 39Xa constitute a first movement mechanism included in the image pickup unit movement mechanism 35.

A plurality of sliders 38a fixed to the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 are slidably fitted to the pair of guide rails 38 arranged on the X-direction moving table 35X. In each of the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2, a first Y-axis nut member 39Y1 and a second Y-axis nut member 39Y2 are provided at the extending portions provided at one end in the X direction, respectively. Have been placed. A feed screw 39Ya rotationally driven by the image pickup unit Y-axis motor 34Y is screwed into the first Y-axis nut member 39Y1 and the second Y-axis nut member 39Y2.

Here, the feed groove formed in the feed screw 39Ya has a lead angle opposite in the range screwed into the first Y-axis nut member 39Y1 and the range screwed into the second Y-axis nut member 39Y2. By driving the image pickup unit Y-axis motor 34Y in the forward and reverse directions, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 move in directions that approach or separate from each other in the Y direction. The image pickup unit Y-axis motor 34Y, the first Y-axis nut member 39Y1, the second Y-axis nut member 39Y2, and the lead screw 39Ya constitute a second movement mechanism included in the image pickup unit moving mechanism 35.

In the above configuration, since the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 are fixedly arranged on the X-direction moving table 35X, the first Y is driven by driving the above-mentioned first moving mechanism. The direction moving table 35Y1 and the second Y direction moving table 35Y2 move in the same direction and the same distance. Further, by driving the above-mentioned second moving mechanism, the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2 can be moved by the same distance in opposite directions.

In the first Y-direction moving table 35Y1 and the second Y-direction moving table 35Y2, the upper left image pickup unit 41 (an example of the first image pickup unit) and the upper right image pickup unit 43 (of the third image pickup unit) constituting the image pickup unit 34, respectively. An example), a lower left imaging unit 42 (an example of a second imaging unit), and a lower right imaging unit 44 (an example of a fourth imaging unit) are arranged in the X direction.

Here, the configuration of the imaging unit constituting the imaging unit 34 will be described. These image pickup units are configured such that incident portions and cameras are attached to both ends of a cylindrical lens barrel portion, and coaxial illumination is arranged on the side surface of the lens barrel portion located between the incident portion and the camera. In this configuration, the image of the image pickup target vertically incident on the incident portion is transmitted horizontally through the lens barrel portion and incident on the camera, whereby the image to be imaged is acquired. At this time, the illumination light from the coaxial illumination is irradiated by the half mirror in the direction toward the image pickup target along the image pickup optical axis, and is incident on the image pickup target from the coaxial direction.

Specifically, the upper left image pickup unit 41, which is the first image pickup unit, has an upper left lens barrel unit 41a, an upper left coaxial illumination 41b, an upper left camera 41c, which is the first camera, and an upper left incident unit 41d. is doing. The upper right image pickup unit 43, which is a third image pickup unit, has an upper right lens barrel unit 43a, an upper right coaxial illumination 43b, an upper right camera 43c, which is a third camera, and an upper right incident unit 43d. Similarly, the lower left image pickup unit 42, which is the second image pickup unit, has a lower left lens barrel unit 42a, a lower left coaxial illumination 42b, a lower left camera 42c, which is a second camera, and a lower left incident unit 42d. There is. The lower right image pickup unit 44, which is the fourth image pickup unit, has a lower right lens barrel unit 44a, a lower right coaxial illumination 44b, a lower right camera 44c, which is a fourth camera, and a lower right incident unit 44d.

As shown in the example of the upper left image pickup unit 41 and the upper right image pickup unit 43 in FIG. 5, the upper left lens barrel portion 41a and the upper right lens barrel portion 43a are holding brackets coupled to the lower surface of the first Y direction moving table 35Y1. It is held by 41e and 43e. A fixed optical unit 33 fixed to the base portion 35a is located above the upper left incident portion 41d and the upper right incident portion 43d. The fixed optical unit 33 has a configuration in which an upper left prism 45, an upper right prism 46, a lower left prism 47, and a lower right prism 48 are built in the storage portion 33a. The upper left prism 45, the upper right prism 46, the lower left prism 47, and the lower right prism 48 internally reflect the image incident from the incident edges 45a, 46a, 47a, 48a and emit the exit edges 45b, 46b, 47b, It has a function of emitting downward from 48b (see FIG. 8).

The fixed optical unit 33 divides the upper and lower two-field images of the chip 14 and the bonding position 22a captured by the movable optical unit 32 described below into two left and right chip images and two left and right bonding position images. It is transmitted to one imaging unit. That is, the upper left incident portion 41d, the lower left incident portion 42d, the upper right incident portion 43d, and the lower right incident portion 44d are located above the exit edge portions 45b, 47b, 46b, 48b shown in FIG. 8, respectively. The left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are aligned. This alignment is performed using the function of the image pickup unit moving mechanism 35 described above.

That is, the image pickup unit moving mechanism 35, which is an image pickup unit moving means, includes an upper left image pickup unit 41 (an example of a first image pickup unit), a lower left image pickup unit 42 (an example of a second image pickup unit), and an upper right image pickup unit 43. (An example of a third image pickup unit), a lower right image pickup unit 44 (an example of a fourth image pickup unit), an upper left prism 45 (an example of a first light guide body), and a lower left prism 47 (a second example). It is moved relative to the light guide body), the upper right prism 46 (an example of the third light guide body), and the lower right prism 48 (an example of the fourth light guide body). As a result, the upper left incident portion 41d, the lower left incident portion 42d, the upper right incident portion 43d, and the lower right incident portion 44d are aligned with the exit edge portions 45b, 47b, 46b, 48b.

6 (a) and 6 (b) are operation explanatory views of the bonding apparatus 1 which concerns on Embodiment 1. FIG. That is, FIGS. 6 (a) and 6 (b) show the up and down two-direction recognition in the bonding operation performed in the bonding device 1, and the bonding operation subsequently executed. That is, prior to the execution of the bonding operation, as shown in FIG. 6A, the bonding tool 29 holding the chip 14 is positioned above the bonding position 22a, and the movable optical unit is located between the bonding position 22a and the chip 14. Advance 32.

Here, since the movable optical unit 32 is offset toward the bonding head 26 with respect to the center of the optical head 30, the bonding position 22a does not cause interference between the optical head 30 and the bonding head 26. It is possible to position the movable optical unit 32 between the chip 14 and the chip 14. Imaging and position recognition of the chip 14 and the bonding position 22a by the imaging unit 34 are performed in this state. The chip 14 and the elephant at the bonding position 22a incident on the movable optical unit 32 are incident on the image pickup unit 34 via the fixed optical unit 33 fixed upward (see FIG. 8).

After imaging and position recognition for one chip 14 are completed, the optical head 30 is moved in the retracting direction (see arrow e) as shown in FIG. 6 (b). As a result, the movable optical unit 32 retracts from between the bonding position 22a and the chip 14 (see arrow f), and the space between the bonding position 22a and the chip 14 becomes free. Then, in this state, by driving the bonding tool driving unit 27 to lower the bonding tool 29 (see arrow g), the bonding head 26 joins the chip 14 held by the bonding tool 29 to the bonding position 22a of the substrate 22. ..

At this time, the positioning of the chip 14 with respect to the bonding position 22a is performed to reflect the above-mentioned position recognition result. In this position recognition, the chip 14 and the bonding position 22a are simultaneously imaged immediately before the chip 14 is mounted to detect these relative positional deviations. As a result, the bonding device 1 can detect the misaligned state with high accuracy, and can secure the bonding result with high accuracy.

Next, with reference to FIG. 7, the configuration and function of the movable prism 32a incorporated in the movable optical unit 32 will be described. FIG. 7 is a perspective view showing a configuration of a movable light guide body in the bonding device according to the first embodiment. The solid line arrow overlaid on the imaging path in FIG. 7 indicates the viewing direction, and the arrow at the end indicates the viewing position of the chip 14. Further, the broken line arrow overlaid on the imaging path indicates the viewing direction, and the arrow at the end indicates the viewing position of the substrate 22. As described above, the movable optical unit 32 is free to move back and forth between the chip 14 and the substrate 22. When the movable prism 32a is located between the chip 14 located above the bonding position 22a of the substrate 22 and the substrate 22, the image of the chip 14 and the image of the bonding position 22a are transferred to the fixed optical unit 33 located above. introduce.

In FIG. 7, the movable prism 32a is a multi-faceted reflective prism made of a translucent member, and is a pair of substantially diamond-shaped first block bodies 53 (an example of a first light guide body) and a second block body 54 (an example). An example of the second light guide body) is mainly a prism body in which the sharp end side ends are connected via a rectangular body-shaped reflector 50. The reflector 50 has a configuration in which the hypotenuses of the first light guide 51 and the second light guide 52 having a right-angled triangular column shape are combined and combined, and the upper surface and the lower surface of the combined surface are reflective surfaces that reflect light ( It functions as a first reflecting surface 71 and a fifth reflecting surface 75). The hypotenuse surfaces provided at the left and right ends of the first block body 53 and the second block body 54 are reflective surfaces (second reflective surface 72, third reflective surface 73, sixth reflective surface) that reflect light inside the member. 76, functioning as the seventh reflecting surface 77).

The upper surface of the first light guide body 51 and the lower surface of the second light guide body 52 are a first incident port 61 and a second incident port 62 for incident an image to be imaged, respectively. When the movable prism 32a is positioned between the chip 14 and the substrate 22, the reflector 50 is aligned so as to be located between the chip 14 and the substrate 22. In this state, the first incident port 61 and the second incident port 62 are located at positions facing the bonding positions 22a (see FIG. 6) of the chip 14 and the substrate 22, respectively.

On the outer surface of the right end of the first block body 53 and the second block body 54, a fifth light guide body 55 and a sixth light guide 56 having a right-angled triangular column shape are formed on one right-angled surface, respectively. It is provided so as to be flush with the upper surface of the block body 53 of 1 and the upper surface of the second block body 54. The oblique side surfaces of the fifth light guide body 55 and the sixth light guide body 56 are reflective surfaces (fourth reflective surface 74,) that upwardly reflect light incident from the side of the first block body 53 and the second block body 54. It functions as an eighth reflecting surface 78). The upper surfaces of the fifth light guide body 55 and the sixth light guide body 56 are a first outlet 63 and a second outlet 64 for emitting reflected light. Here, the first exit port 63 and the second exit port 64 are provided at positions horizontally separated from the first incident port 61 and the second incident port 62.

Details of the function of the movable prism 32a in imaging the chip 14 and the bonding position 22a will be described. When the movable prism 32a is located between the chip 14 and the substrate 22, the image of the chip 14 is incident from the first incident port 61 facing the chip 14, and the elephant of the bonding position 22a is referred to as the bonding position 22a. It is incident from the opposite second incident port 62.

Next, the image of the chip 14 incident from the first incident port 61 is reflected by the first reflecting surface 71 of the reflector 50 in the first horizontal direction (see, for example, arrow h1). At the same time, the image of the bonding position 22a incident from the second incident port 62 is moved in the second horizontal direction (see, for example, arrow h2) opposite to the first horizontal direction by the fifth reflecting surface 75 of the reflector 50. It reflects (see FIG. 9).

That is, in the bonding device 1, the first horizontal direction (see, for example, arrow h1) and the second horizontal direction (see, for example, arrow h2) are opposite to each other and are horizontal.

Next, the image of the chip 14 reflected in the first horizontal direction is sequentially reflected by a plurality of chip image reflecting surfaces (second reflecting surface 72, third reflecting surface 73, and fourth reflecting surface 74), and first. It leads to the exit port 63 of. At the same time, the image of the bonding position 22a reflected in the second horizontal direction is sequentially reflected by the plurality of substrate image reflecting surfaces (sixth reflecting surface 76, seventh reflecting surface 77, and eighth reflecting surface 78). It leads to the exit port 64 of 2.

The plurality of chip image reflecting surfaces provided on the first block body 53 are arranged directly below the first exit port 63, and the first final image of the horizontally incident chip 14 is reflected directly above. At least one relay reflection surface (second reflection surface) that guides the image of the reflection surface (fourth reflection surface 74) and the chip 14 horizontally reflected by the first reflection surface 71 to the first final reflection surface. It has a form including a surface 72 and a third reflecting surface 73).

Further, the above-mentioned substrate image reflecting surface provided on the second block body 54 is arranged directly below the second exit port 64, and the second final image reflecting the horizontally incident image of the bonding position 22a is directly above. At least one second relay reflecting surface (sixth) that guides the image of the reflecting surface (eighth reflecting surface 78) and the bonding position 22a horizontally reflected by the fifth reflecting surface 75 to the second final reflecting surface. It has a form including a reflecting surface 76 and a seventh reflecting surface 77).

The movable prism 32a is a chip from the first relay reflection surface (third reflection surface 73) to the first final reflection surface that directly guides the image of the chip 14 to the first final reflection surface (fourth reflection surface 74). The direction of the optical path to the first final reflection surface of the 14 images and the second relay reflection surface (seventh reflection surface) that directly guides the image of the bonding position 22a to the second final reflection surface (eighth reflection surface 78). The direction of the optical path from 77) to the second final reflection surface of the image of the bonding position 22a with respect to the second final reflection surface is substantially the same.

Then, in the movable prism 32a, the direction of the optical path to the first final reflection surface (fourth reflection surface 74) and the direction of the optical path to the second final reflection surface (eighth reflection surface 78) are the movements of the movable prism 32a. Is substantially parallel to the direction of (direction along the Y axis).

In the movable prism 32a having the above configuration, the first final reflecting surface (fourth reflecting surface 74) is arranged directly below the first exit port 63, and reflects the image of the incident chip 14 directly above to reflect the image. It has an inclination substantially parallel to the first reflecting surface 71 of the body 50. Further, the second final reflection surface (eighth reflection surface 78) is arranged directly below the second exit port 64, reflects the incident image of the bonding position 22a directly above, and is the fifth reflection of the reflector 50. It has an inclination substantially parallel to the surface 75. Here, the first reflecting surface 71 and the fifth reflecting surface 75 are parallel to each other. That is, in the movable prism 32a, the first final reflection surface (fourth reflection surface 74) and the second final reflection surface (eighth reflection surface 78) are substantially parallel to each other.

Then, the movable prism 32a has a direction of the optical path to the first final reflection surface (fourth reflection surface 74) (for example, arrow h2) and a direction of the optical path to the second final reflection surface (eighth reflection surface 78). For example, the arrow h2) is substantially parallel to the moving direction of the movable prism 32a (for example, the arrow h1 and the arrow h2).

The first block body 53 and the second block body 54 pass through the center of the reflector 50 in the first horizontal direction (for example, arrow h1), the second horizontal direction (for example, arrow h2), and in the horizontal plane. It is non-axisymmetric with respect to the orthogonal straight line (center line CL). The first block body 53 can be formed of, for example, a transparent body having a trapezoidal shape in a plan view and having two or more side portions having a reflection plane. The second block body 54 can be formed of, for example, a transparent body having a parallelogram in a plan view and having two or more side portions having a reflection plane. In addition to including true parallelism, substantially parallel means to include an error in parallelism to the extent that there is no problem in alignment.

Summarizing the functions of the movable prism 32a, when the movable prism 32a is located between the chip 14 located above the bonding position 22a and the substrate 22, the image of the chip 14 faces the chip 14 first. Is incident from the incident port 61 of the above, and is emitted upward from the first exit port 63 horizontally separated from the first incident port 61. In both cases, the movable prism 32a has an image of the bonding position 22a of the substrate 22 incident on the second incident port 62 facing the bonding position 22a and horizontally separated from the second incident port 62 from the second exit port 64. It has a function to emit upward.

As described above, as a movable light guide body used for simultaneously recognizing two upper and lower fields of view by advancing and retreating between the chip 14 held by the bonding tool 29 and the bonding position 22a of the substrate 22, the present embodiment is used. By using the movable prism 32a having the configuration as shown below, the effects described below can be obtained. First, since the movable prism 32a is configured by combining prisms such as the first block body 53 and the second block body 54, the thickness dimension in the overall shape of the movable optical unit 32 can be made as small as possible and the weight can be reduced as much as possible. It is possible to reduce the weight of the.

Therefore, in the imaging operation shown in FIG. 6A, it is possible to set the standby height for holding the bonding tool 29 holding the chip 14 as low as possible. As a result, in the bonding operation shown in FIG. 6B, the bonding operation stroke in which the bonding tool 29 moves up and down can be reduced, and the operation tact time is shortened. In addition, in the advancing / retreating operation of moving the movable optical unit 32, the weight is reduced, so that high-speed operation becomes possible and the operation tact time is further shortened.

In the first embodiment, an example in which a movable prism 32a using a multi-faceted reflection prism is used as the movable light guide is shown, but the present invention is not limited to the movable prism 32a. That is, a movable light guide body may be configured by incorporating a reflector such as a mirror or an optical element such as a lens as long as the above-mentioned function can be realized.

Further, in the first embodiment, a configuration is adopted in which the first outlet 63 and the second outlet 64 are arranged at positions horizontally separated from the first incident port 61 and the second incident port 62. However, it is not limited to such a configuration. That is, the image of the chip 14 captured from the first incident port 61, the second incident port 62, and the image of the bonding position 22a are taken into the upper left imaging unit 41 (an example of the first imaging unit) and the lower left imaging unit. A movable prism so that it can be transmitted to 42 (an example of a second image pickup unit), an upper right image pickup unit 43 (an example of a third image pickup unit), and a lower right image pickup unit 44 (an example of a fourth image pickup unit). It suffices if the connection portion between the 32a and the fixed optical unit 33 and the image pickup unit 34 is set.

Next, FIGS. 8 and 9 are shown with respect to the imaging field of view and the imaging path when the chip 14 and the bonding position 22a are imaged by the imaging unit 34 using the combination of the movable prism 32a and the fixed optical unit 33 having the above configuration. It will be explained with reference to. In FIG. 8, the upper left image UL and the upper right image UR shown above the reflector 50 of the movable prism 32a show an image of the chip 14 to be imaged, and the lower left image DL shown below the reflector 50. The lower right image DR shows an image of the bonding position 22a to be imaged. Note that C1 to C11 shown by the broken line of the thick line indicate the image pickup path in which the image of the chip 14 is guided to the image pickup unit 34, and B1 to B11 shown by the alternate long and short dash line of the thick line indicate the image of the bonding position 22a. The image pickup path guided to the image pickup unit 34 is shown.

Here, the upper left image UL corresponds to the first partial image which is a part (left half) of the image of the chip 14, and the upper right image UR is different from the first partial image of the image of the chip 14. It corresponds to the third partial image which is a part (right half). Further, the lower left image DL corresponds to a second partial image which is a part (left half) corresponding to the first partial image of the image of the bonding position 22a, and the lower right image DR corresponds to the second image of the bonding position 22a. It corresponds to the fourth partial image which is a part (right half) corresponding to the partial image of 3. Here, "corresponding" means that the imaging fields of view when acquiring these partial images are in a state of being overlapped vertically.

The upper left image UL and the upper right image UR of the chip 14 are incident on the first incident port 61 on the upper surface of the reflector 50 (path C1), and are guided in the first block body 53 to be a fifth light guide body. It exits upward from the first outlet 63 on the upper surface of the 55 (path C5). The lower left image DL and the lower right image DR of the bonding position 22a are incident on the second incident port 62 on the lower surface of the reflector 50 (path B1), and are guided in the second block body 54 to guide the sixth light guide. It exits upward from the second outlet 64 on the upper surface of the body 56 (path B5).

As shown in FIGS. 8 and 9, in the first block body 53, the image of the chip 14 (path C2) incident from the reflector 50 is incident on the second reflecting surface 72 and reflected in the X direction ( Path C3), and further incident on the third reflecting surface 73 and reflected in the Y direction (path C4). Next, it enters the fourth reflecting surface 74 of the fifth light guide 55 and is reflected upward to reach the first exit port 63. Further, in the second block body 54, the image of the bonding position 22a (path B2) incident from the reflector 50 is incident on the sixth reflecting surface 76 and reflected in the X direction (path B3), and further, the seventh reflecting surface. It is incident on 77 and reflected in the Y direction (path B4). Next, it is incident on the eighth reflecting surface 78 of the sixth light guide 56 and reflected upward to reach the second exit port 64.

The incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46 are located above the fifth light guide body 55, and the lower left prism is located above the sixth light guide body 56. The incident edge portion 47a of 47 and the incident edge portion 48a of the lower right prism 48 are located (see FIG. 8). Here, in the upper left prism 45 and the upper right prism 46, the incident edge portion 45a and the incident edge portion 46a are the first in which the first exit port 63 on the upper surface of the fifth light guide body 55 is divided into two in the left-right direction. It is arranged so as to be located above the left exit port 63L and the first right exit port 63R (see FIG. 7). Further, in the lower left prism 47 and the lower right prism 48, the incident edge portion 47a and the incident edge portion 48a divide the second outlet 64 on the upper surface of the sixth light guide 56 into two in the left-right direction. They are arranged so as to be located above the left exit port 64L and the second right exit port 64R (see FIG. 7).

With such a configuration, each of the four partial images obtained by dividing the image of the chip 14 and the image of the bonding position 22a into two on the left and right can be captured by the four imaging units constituting the imaging unit 34. There is. That is, among the images of the chip 14 emitted from the first exit 63, the upper left image UL emitted from the first left exit 63L and the upper right image UR emitted from the first right exit 63R are , The incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46 are incident on each (paths C6 and C7).

The upper left image UL and the upper right image UR incident on the incident edge portion 45a of the upper left prism 45 and the incident edge portion 46a of the upper right prism 46 are the emission edge portions in the upper left prism 45 and the upper right prism 46, respectively. 45b is reflected toward the exit edge portion 46b (see paths C8 and C10 shown in FIG. 8), where it is reflected downward and incident on the upper left image pickup unit 41 and the upper right image pickup section 43 (pathways C9 and C11).

Further, among the images of the bonding position 22a emitted from the second exit port 64, the lower left image DL emitted from the second left exit port 64L (see FIG. 7) and the second right exit port 64R (FIG. 7). The lower right image DR emitted from (see) is incident on the incident edge portion 47a of the lower left prism 47 and the incident edge portion 48a of the lower right prism 48, respectively (paths B6 and B7). The lower left image DL and the lower right image DR incident on the incident edge portion 47a of the lower left prism 47 and the incident edge portion 48a of the lower right prism 48 are the emission edge portions in the lower left prism 47 and the lower right prism 48, respectively. 47b is reflected toward the exit edge portion 48b (see paths B8 and B10 shown in FIG. 8), where it is reflected downward and incident on the lower left image pickup unit 42 and the lower right image pickup section 44 (pathways B9 and B11).

In the above configuration, the upper left image pickup unit 41 captures a first partial image (upper left image UL) which is a part of the image of the chip 14 emitted from the first exit port 63, and the lower left image pickup unit 42. Takes a second partial image (lower left image DL) which is a part corresponding to the first partial image (upper left image UL) of the image of the bonding position 22a emitted from the second exit port 64. Further, the upper right image pickup unit 43 is a third partial image (upper right image) which is a part different from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63. UR) is imaged, and the lower right image pickup unit 44 is a part corresponding to the third partial image (upper right image UR) of the image of the bonding position 22a emitted from the second exit port 64. A partial image (lower right image DR) is imaged.

More specifically, the fixed optical unit 33 provided in the bonding device 1 incidents a first partial image (upper left image UL) which is a part of the image of the chip 14 emitted from the first exit port 63. The first light guide body (upper left prism 45) to be emitted is incident, and the second partial image (lower left image DL) which is a part of the image of the bonding position 22a emitted from the second emission port 64 is incident. The second light guide body (lower left prism 47) to be emitted is a different part from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63. The second part of the image of the third light guide body (upper right prism 46) that incidents and emits the third partial image (upper right image UR) and the bonding position 22a emitted from the second exit port 64. It is provided with a fourth light guide body (lower right prism 48) that incidents and emits a fourth partial image (lower right image DR) that is a part different from the image (lower left image DL).

Then, the upper left image pickup unit 41 takes an image of the first partial image (upper left image UL) emitted from the first light guide body (upper left prism 45), and the lower left image pickup unit 42 takes a second light guide. A second partial image (lower left image DL) emitted from the body (lower left prism 47) is imaged. Further, the upper right image pickup unit 43 takes an image of a third partial image (upper right image UR) emitted from the third light guide body (upper right prism 46), and the lower right image pickup unit 44 takes a fourth guide. The fourth partial image (lower right image DR) emitted from the light body (lower right prism 48) is imaged.

In imaging the chip 14 and the bonding position 22a by the imaging unit 34 having the above configuration, it may be necessary to adjust the position of the imaging field of view depending on the shape, size, position of the recognition point, etc. of the chip 14 to be imaged and the bonding position 22a. .. In such a case, the upper left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are combined with the upper left prism 45, the lower left prism 47, and the upper side by the image pickup unit moving mechanism 35. By moving the prism 46 relative to the right prism 46 and the lower right prism 48, the position of the imaging field of view of each imaging unit is adjusted.

Here, as shown in FIG. 8, the field of view of the upper left image pickup unit 41 in the chip 14 (upper left image UL) and the field of view of the lower left image pickup unit 42 at the bonding position 22a (lower left image DL) are vertically overlapped positions. There is a relationship. Similarly, the field of view of the upper right image pickup unit 43 (upper right image UR) on the chip 14 and the field of view of the lower right image pickup unit 44 at the bonding position 22a (lower right image DR) are in a vertically overlapping positional relationship.

As described above, in the configuration of the image pickup unit moving mechanism 35, the upper left image pickup unit 41, the lower left image pickup unit 42, the upper right image pickup unit 43, and the lower right image pickup unit 44 are moved in the X direction by the first movement mechanism. Move the same distance in the same direction. Then, by the second moving mechanism, the upper left image pickup unit 41 and the upper right image pickup unit 43 are moved in the same direction by the same distance, and the lower left image pickup unit 42 and the lower right image pickup unit 44 are moved to the upper left image pickup unit 41. It can be moved by the same distance in the direction opposite to the upper right image pickup unit 43.

By moving the upper left image pickup unit 41, the upper right image pickup unit 43, the lower left image pickup unit 42, and the lower right image pickup unit 44 under such conditions, the image pickup unit moving mechanism 35 can see the field of view and the lower side of the upper left image pickup unit 41. While maintaining the state in which the fields of view of the left image pickup unit 42 overlap and the field of view of the upper right image pickup unit 43 and the field of view of the lower right image pickup unit 44 overlap, the upper left image pickup unit 41, the lower left image pickup unit 42, and the upper right The image pickup unit 43 and the lower right image pickup unit 44 can be moved. This makes it possible to adjust the position of the imaging field of view of each imaging unit while correctly maintaining the positional relationship of the four partial images that divide each of the two upper and lower imaging targets of the chip 14 and the bonding position 22a. ing.

When the components used for imaging the chip 14 and the bonding position 22a are classified for each imaging target, the first combination of the upper left prism 45 and the upper left imaging unit 41 or the upper right prism 46 and the upper right imaging is performed. The third combination with the unit 43 constitutes a first imaging means for capturing an image of the chip 14 emitted from the first ejection port 63 of the movable prism 32a. Further, the second combination of the lower left prism 47 and the lower left image pickup unit 42, or the fourth combination of the lower right prism 48 and the lower right image pickup unit 44 is emitted from the second outlet 64 of the movable prism 32a. A second imaging means for imaging the image of the bonding position 22a is configured.

In the first imaging means and the second imaging means, only one of the two combinations may be used, or both may be used. When only one combination is used, for example, when the first combination is used as the first imaging means and the second combination is used as the second imaging means, only a partial image on one side of the imaging field of view is used. This refers to the case of imaging.

That is, when the bonding target is a small chip 14 and recognition at the time of bonding operation is sufficient for recognition of one point at the center of the chip, only the image pickup unit on one side is used. On the other hand, when the bonding target is a large chip 14 and it is necessary to recognize two points such as the diagonal position of the chip in recognition during the bonding operation, both of the above two combinations are used. To do so. That is, both the chip 14 and the bonding position 22a are imaged by the two imaging units. As described above, the bonding device 1 according to the first embodiment can handle a wide variety of chips from small chips to large chips, and a bonding device having excellent versatility is realized.

Then, based on the image of the chip 14 imaged by the above-mentioned first imaging means and the image of the bonding position 22a imaged by the second imaging means, the relative positional deviation between the chip 14 and the bonding position 22a is generated. , Detected by image recognition. The position shift detection by image recognition is executed by the processing function of the image recognition unit 93 (see FIG. 10) provided in the control unit 5. Therefore, the image recognition unit 93 of the control unit 5 is a detection means for detecting the relative positional deviation between the chip 14 and the bonding position 22a based on the image of the chip 14 and the image of the bonding position 22a.

The alignment processing unit 92 (FIG. 10) of the control unit 5 controls the second XY table 20 based on the relative positional deviation between the chip 14 and the bonding position 22a detected by the detection means in this way. As a result, the bonding tool 29 holding the chip 14 and the substrate holding stage 21 holding the substrate 22 are relatively moved to perform an alignment process for aligning the chip 14 with the bonding position 22a. Therefore, the alignment processing unit 92 of the control unit 5 constitutes an alignment means for relatively moving the bonding tool 29 and the substrate holding stage 21.

A plurality of definitions of the image pickup means in the bonding apparatus 1 can be defined, and the following definitions may be used. That is, the combination of the upper left prism 45 and the upper left image pickup unit 41 captures a first partial image (upper left image UL) which is a part of the image of the chip 14 emitted from the first exit port 63. The combination of the lower left prism 47 and the lower left image pickup unit 42 is defined as the image pickup means of 1, and the first partial image of the image of the bonding position 22a emitted from the second exit port 64 (upper left image UL). It is defined as a second image pickup means for capturing a second partial image (lower left image DL) which is a part corresponding to the above.

Further, the combination of the upper right prism 46 and the upper right image pickup unit 43 is a part different from the first partial image (upper left image UL) of the image of the chip 14 emitted from the first exit port 63. It is defined as a third image pickup means for capturing a partial image of 3 (upper right image UR), and the combination of the lower right prism 48 and the lower right image pickup unit 44 is combined with the bonding position 22a emitted from the second outlet 64. It is defined as a fourth image pickup means for capturing a fourth partial image (lower right image DR) which is a part corresponding to the third partial image (upper right image UR) of the image.

Then, the first partial image (upper left image UL) captured by the above-mentioned first imaging means, the second partial image (lower left image DL) captured by the second imaging means, and the third. The chip 14 and the bonding position based on the third partial image (upper right image UR) captured by the imaging means and the fourth partial image (lower right image DR) captured by the fourth imaging means. The relative misalignment of 22a is detected by the detection means described above. Then, based on the relative positional deviation between the chip 14 and the bonding position 22a detected by the detecting means in this way, the bonding tool 29 and the substrate holding stage 21 are relatively moved by the above-mentioned alignment means. , The alignment process for aligning the chip 14 and the bonding position 22a is performed.

Next, the configuration of the control system will be described with reference to FIG. FIG. 10 is a block diagram showing a configuration of a control system of the bonding apparatus according to the first embodiment. In FIG. 10, the control unit 5 includes a bonding operation control unit 91, an alignment processing unit 92, an image recognition unit 93, a visual field position setting unit 94, and a storage unit 95 as internal processing function units. Further, the control unit 5 includes a linear motor 24, a first XY table 10, a second XY table 20, a bonding head 26, a pickup head 15, an image pickup unit X-axis motor 34X, an image pickup unit Y-axis motor 34Y, and an upper left camera. 41c, lower left camera 42c, upper right camera 43c, lower right camera 44c, upper light source 81, lower light source 82, spot lighting 36, upper left coaxial lighting 41b, lower left coaxial lighting 42b, upper right coaxial lighting 43b, lower right The coaxial illumination 44b and the touch panel 96 are connected. The touch panel 96 displays a recognition screen by the image recognition unit 93, an operation input to the control unit 5, an operation screen for data input, and the like.

The bonding operation control unit 91 controls the linear motor 24, the first XY table 10, the second XY table 20, the bonding head 26, and the pickup head 15, so that the chip taken out from the chip supply unit 2 by the pickup head 15 The bonding operation of bonding 14 to the substrate 22 by the bonding head 26 is controlled.

The image recognition unit 93 recognizes and processes the image obtained by imaging the chip 14 and the bonding position 22a by the upper left camera 41c, the lower left camera 42c, the upper right camera 43c, and the lower right camera 44c, thereby forming the chip 14 and the chip 14. The positional deviation from the bonding position 22a is detected. That is, the image recognition unit 93 is a detection means for detecting the relative positional deviation between the chip 14 and the bonding position 22a. At the time of imaging by the upper left camera 41c, the lower left camera 42c, the upper right camera 43c, and the lower right camera 44c, the upper light source 81, the lower light source 82, the spot illumination 36, and the upper left coaxial are provided by the lighting control function provided in the image recognition unit 93. The lighting of the illumination 41b, the lower left coaxial illumination 42b, the upper right coaxial illumination 43b, and the lower right coaxial illumination 44b is controlled.

The field of view position setting unit 94 moves the image pickup unit 34 by controlling the drive of the image pickup unit X-axis motor 34X and the image pickup unit Y-axis motor 34Y. As a result, the positions of the imaging fields of view of the upper left imaging unit 41, the lower left imaging unit 42, the upper right imaging unit 43, and the lower right imaging unit 44 are set according to the imaging target. The storage unit 95 includes bonding data used for controlling the bonding operation by the bonding operation control unit 91, recognition data used for recognition processing by the image recognition unit 93, and an imaging field of view used for setting the visual field position by the visual field position setting unit 94. Store data such as data.

Next, the operation of the bonding apparatus 1 according to the first embodiment will be described.

In the bonding device 1 or the bonding method according to the first embodiment, the bonding tool 29 holds the chip 14 and bonds the substrate 22 toward a stage (for example, the substrate holding stage 21) on which the substrate 22 is placed so as to face the chip 14. The tool 29 is lowered to bond the chip 14 to the bonding position 22a of the substrate 22. When the bonding apparatus 1 is located between the chip 14 located above the bonding position 22a and the substrate 22, the first image of the chip 14 (upper left image UL, upper right image UR) faces the chip 14. The image of the bonding position 22a of the substrate 22 (lower left image DL, lower right image DR) is emitted upward from the first exit port 63 which is incident from the incident port 61 and is horizontally separated from the first incident port 61. ) Is incident from the second incident port 62 facing the bonding position 22a, and the movable light guide body (movable prism 32a) is emitted upward from the second exit port 64 horizontally separated from the first incident port 61. Have. The bonding device 1 is emitted from a first imaging means (upper left imaging unit 41, upper left prism 45) that captures an image of a chip 14 emitted from a first emission port 63, and a second emission port 64. The image of the chip 14 captured by the first imaging means and the second imaging means are captured by the second imaging means (lower left imaging unit 42, lower left prism 47) that captures the image of the bonding position 22a. A detection means (image recognition unit 93) that detects a relative positional deviation between the chip 14 and the bonding position 22a based on the image of the bonding position 22a, and a bonding tool 29 based on the positional deviation detected by the detection means. An alignment means (alignment processing unit 92) that relatively moves the and the stage, and a moving means (linear motor) that moves the movable light guide body back and forth in the space between the chip 14 and the substrate 22 located above the bonding position 22a. 24, a guide rail 25), and the like. The movable light guide reflects the image of the chip 14 incident from the first incident port 61 in the first direction (for example, arrow h1), and the image of the bonding position 22a incident from the second incident port 62 is the second. The image of the reflector 50 that reflects in two directions (for example, arrow h2) and the image of the incident chip 14 that is arranged directly below the first exit port 63 is reflected directly above and has an inclination substantially parallel to the reflector 50. The image of the first final reflecting surface (fourth reflecting surface 74) and the incident bonding position 22a arranged directly under the second exit port 64 is reflected directly above, and is substantially parallel to the reflecting surface of the reflector 50. It includes at least a second final reflecting surface (eighth reflecting surface 78) having an inclination.

Prior to the description of the operation in the bonding apparatus 1 according to the first embodiment, the movable prism according to the comparative example will be described with reference to FIGS. 11, 12, and 13. FIG. 11 is a perspective view showing a configuration of a movable light guide body in the bonding device according to the comparative example. 12 (a) and 12 (b) are operation explanatory views showing a visual recognition position when a positional shift occurs in the movable light guide body according to the comparative example. FIG. 13 is an operation explanatory view showing a visual recognition position when a positional deviation occurs in the movable prism 32a according to the first embodiment. In the movable prism 101 of the comparative example shown in FIG. 11, a plurality of chip image reflecting surfaces provided on the first block body 103 are arranged directly under the first exit port 63, and an image of the chip 14 incident horizontally. The first final reflection surface (fourth reflection surface 109) and the image of the chip 14 horizontally reflected by the first reflection surface 71 are reflected on the first final reflection surface (fourth reflection surface 109). ), Including at least one relay reflecting surface (second reflecting surface 72, third reflecting surface 105).

In the movable prism 101, a first block body 103 and a second block body 54, a first final reflection surface (fourth reflection surface 109), a second final reflection surface (eighth reflection surface 78), and a second. The relay reflection surface (second reflection surface 72, third reflection surface 105) and the second relay reflection surface (sixth reflection surface 76, seventh reflection surface 77) of 1 pass through the center of the reflector 50. It is line-symmetrical with respect to a straight line (center line CL) orthogonal to the first horizontal direction (for example, arrow h1) and the second horizontal direction (for example, arrow h2) in the horizontal plane. Other configurations are the same as the movable prism 32a.

In FIG. 11, the solid line arrow marked on the imaging path of the movable prism 101 indicates the viewing direction from the first exit port 63, and the most advanced arrow indicates the viewing position of the chip 14. Further, the broken line arrow marked on the image pickup path of the movable prism 101 indicates the viewing direction from the second exit port 64, and the most advanced arrow indicates the viewing position of the substrate 22. The movable prism 101 can move forward and backward along the Y axis between the chip 14 and the substrate 22.

As shown in FIG. 12 (a), in this movable prism 101, the line of sight to the chip 14 visually recognized from the first outlet 63 is traced in the direction opposite to the incident direction of the light (actually, from the chip 14). The light is incident in the direction opposite to the arrow), first, the chip passes through the fourth reflecting surface 109, the third reflecting surface 105 (see FIG. 11), the second reflecting surface 72 (see FIG. 11), and the first reflecting surface 71. It leads to 14. Further, in the movable prism 101, when the line of sight to the bonding position 22a visually recognized from the second exit port 64 is traced in the direction opposite to the incident direction (actually, the light from the bonding position 22a is incident in the direction opposite to the arrow). First, the eighth reflecting surface 78, the seventh reflecting surface 77 (see FIG. 11), the sixth reflecting surface 76 (see FIG. 11), and the fifth reflecting surface 75 are passed through in this order to reach the bonding position 22a.

Here, when the movable prism 101 is moved in the forward direction (Y direction), for example, when a deviation of ΔY occurs from the original stop position as shown in FIG. 12 (b), the chip 14 and the bonding position 22a The center of the reflector 50 is displaced by ΔY in the Y direction with respect to the virtual vertical straight line KL passing through the center. At this time, the line of sight looking at the fourth reflecting surface 109 shifts upward, and the line of sight looking at the first reflecting surface 71 also shifts upward. Since the first reflecting surface 71 is inclined to the opposite side in the Y direction with respect to the fourth reflecting surface 109 and is non-parallel, the front side of the chip 14 is visually recognized by a distance of 2ΔY. That is, the position where the chip 14 is visually recognized from the first outlet 63 is a position deviated by 2ΔY in the Y direction from the virtual vertical line KL.

On the other hand, the line of sight looking at the eighth reflecting surface 78 shifts downward, and the line of sight looking at the fifth reflecting surface 75 also shifts downward, but since the eighth reflecting surface 78 and the fifth reflecting surface 75 are parallel to each other, the second line of sight is shifted downward. The position where the bonding position 22a is visually recognized from the exit port 64 of the above is not deviated from the virtual vertical straight line KL. Therefore, in the movable prism 101, when the movable prism 101 moves forward beyond the stopping accuracy, a positional deviation of 2ΔY occurs between the chip 14 and the bonding position 22a.

On the other hand, when the movable prism 32a of FIG. 13A used in the bonding apparatus 1 according to the first embodiment moves in the forward direction (Y direction), as shown in FIG. 13B, the original movable prism 32a When a deviation of ΔY occurs with respect to the stop position, the center of the reflector 50 is displaced by ΔY in the Y direction with respect to the virtual vertical straight line KL passing through the center of the chip 14 and the bonding position 22a. At this time, the line of sight looking at the fourth reflecting surface 74 shifts downward, and the line of sight looking at the first reflecting surface 71 also shifts downward. Since the first reflecting surface 71 is parallel to the fourth reflecting surface 74, the first reflecting surface 71 and the fourth reflecting surface 74 are only translated in the Y direction, and the center of the chip 14 remains visible. .. As a result, the position where the chip 14 is visually recognized from the first outlet 63 does not deviate from the virtual vertical line KL.

Further, as described above, the line of sight looking at the eighth reflecting surface 78 shifts downward, and the line of sight looking at the fifth reflecting surface 75 also shifts downward, but the eighth reflecting surface 78 and the fifth reflecting surface 75 are parallel to each other. Therefore, the position where the bonding position 22a is visually recognized from the second exit port 64 does not deviate from the virtual vertical straight line KL. Therefore, in the movable prism 32a, when the movable prism 32a is moved in the forward direction, the visible position does not deviate between the chip 14 and the bonding position 22a. As a result, according to the bonding device 1, even if the stopping accuracy of the movable prism 32a deteriorates, the recognition position can be prevented from changing, and the component can be mounted with high accuracy in a short time.

Further, in the bonding device 1, the image pickup unit 34 captures an image of the chip 14 and an image of the bonding position 22a in a state where the optical head 30 is moved to position the movable optical unit 32 between the chip 14 and the substrate 22. do. This makes it possible for the bonding device 1 to simplify the mechanism and reduce the equipment cost.

Further, in the bonding device 1, the movable light guide body is a first relay that guides the image of the chip 14 reflected in the first direction (for example, arrow h1) to the first final reflection surface (fourth reflection surface 74). The image of the reflecting surface (second reflecting surface 72, third reflecting surface 73) and the bonding position 22a reflected in the second direction (for example, arrow h2) is transferred to the second final reflecting surface (eighth reflecting surface 78). A second relay reflecting surface (sixth reflecting surface 76, seventh reflecting surface 77) to be guided is further included.

In this bonding device 1, the movable prism 32a has a first relay reflection surface (second reflection surface 72, third reflection surface 73) and a second relay reflection surface (sixth reflection surface 76, seventh reflection surface 77). ) And. The first relay reflection surface (second reflection surface 72, third reflection surface 73) is provided on the first block body 53. The second relay reflection surface (sixth reflection surface 76, seventh reflection surface 77) is provided on the second block body 54. The first block body 53 is a chip 14 that is reflected in a first direction (for example, arrow h1) by being formed of a transparent body having a trapezoidal shape in a plan view and having two or more side portions having a reflection plane. Can be guided to the first final reflective surface (fourth reflective surface 74) in the second direction (eg, arrow h2). The second relay reflection surface (sixth reflection surface 76, seventh reflection surface 77) is provided on the second block body 54. The second block body 54 is reflected in a second direction (for example, arrow h2) by being formed of a transparent body having a parallelogram in a plan view and two or more side portions having a reflection plane. The image of the chip 14 can be guided to the second final reflecting surface (eighth reflecting surface 78) in the second direction (for example, the arrow h2). As a result, the first final reflection surface (fourth reflection surface 74) and the second final reflection surface (eighth reflection surface 78) can be arranged in parallel.

Further, the bonding device 1 directly guides the image of the chip 14 to the first final reflection surface (fourth reflection surface 74) from the first relay reflection surface (third reflection surface 73) to the first final reflection surface. The direction of the optical path to the first final reflection surface of the image of the chip 14 (for example, arrow h2) and the second relay that directly guides the image of the bonding position 22a to the second final reflection surface (eighth reflection surface 78). The direction of the optical path from the reflecting surface (seventh reflecting surface 77) to the second final reflecting surface of the image of the bonding position 22a with respect to the second final reflecting surface (for example, arrow h2) is substantially the same.

In this bonding device 1, the direction of the optical path from the third reflecting surface 73 to the fourth reflecting surface 74 and the direction of the optical path from the seventh reflecting surface 77 to the eighth reflecting surface 78 are substantially the same direction (for example, an arrow). It becomes h2). As a result, the parallel arrangement of the first final reflection surface (fourth reflection surface 74) and the second final reflection surface (eighth reflection surface 78) is realized, and the displacement direction (for example, the displacement direction of the movable prism 32a or more) is higher than the stop accuracy. It is possible to match the directions of the optical paths to the fourth reflecting surface 74 and the eighth reflecting surface 78 arranged in parallel with the arrow h2).

Further, in the bonding device 1, the direction of the optical path to the first final reflection surface (for example, arrow h2) and the direction of the optical path to the second final reflection surface (for example, arrow h2) are the directions of movement of the movable light guide body (for example, arrow h2). For example, it is substantially parallel to the arrow h1 and the arrow h2).

In this bonding device 1, the fourth reflecting surface 74 and the eighth reflecting surface 78 are arranged in parallel, and the direction of the optical path with respect to the fourth reflecting surface 74 and the eighth reflecting surface 78 (for example, arrow h2) is the movable prism 32a. It is substantially parallel to the direction of movement (for example, arrow h1 and arrow h2). This makes it possible to configure an optical system in which the recognition position does not change even if the stop accuracy of the movable prism 32a deteriorates and the stop position of the movable prism 32a shifts.

Further, in the bonding device 1, the first direction (for example, arrow h1) and the second direction (for example, arrow h2) are opposite to each other.

In this bonding device 1, the reflector 50 provided on the movable prism 32a incidents the light from the upper chip 14 from the first reflecting surface 71 and the light from the lower substrate 22 from the fifth reflecting surface 75. Let me. The reflector 50 is formed on the front and back surfaces of a surface on which the first reflecting surface 71 and the fifth reflecting surface 75 are inclined at 45 ° with respect to the virtual vertical line KL. As a result, the movable prism 32a can be moved back and forth between the chip 14 held by the bonding tool 29 and the bonding position 22a of the substrate 22 to simultaneously recognize the upper and lower fields of view.

Further, in the bonding device 1, the first direction (for example, arrow h1) and the second direction (for example, arrow h2) are horizontal directions.

In this bonding device 1, the movable prism 32a is moved in the directions of the arrows h1 and the arrow h2, and the reflector 50 provided on the movable prism 32a can simultaneously recognize the upper and lower fields of view. As a result, the thickness dimension of the movable prism 32a in the overall shape can be made as small as possible, and the weight can be reduced.

Further, the bonding device 1 or the bonding method in which the image of the bonding position 22a (lower left image DL, lower right image DR) and the image of the chip 14 (upper left image UL, upper right image UR) are imaged by a plurality of imaging means , The bonding tool 29 holds the chip 14, and the bonding tool 29 is lowered toward the stage (board holding stage 21) on which the substrate 22 is placed so as to face the chip 14, and the chip 14 is placed at the bonding position of the substrate 22. Join to 22a. When the bonding device 1 is located between the chip 14 located above the bonding position 22a and the substrate 22, the image of the chip 14 is incident on the first incident port 61 facing the chip 14, and the first incident is performed. The image of the bonding position 22a of the substrate 22 is incident from the second incident port 62 facing the bonding position 22a while being emitted upward from the first exit port 63 horizontally separated from the port 61. It has a movable light guide body (movable prism 32a) that emits upward from a second outlet 64 that is horizontally separated from 61. The bonding device 1 is a first image pickup means (upper left image pickup unit 41,) for taking a first partial image (upper left image UL) which is a part of an image of the chip 14 emitted from the first exit port 63. The upper left prism 45) and the second partial image (lower left image DL) which is a part corresponding to the first partial image of the image of the bonding position 22a emitted from the second exit port 64 are imaged. A third partial image which is a part different from the first partial image of the image of the chip 14 emitted from the first image pickup means (lower left image pickup unit 42, lower left prism 47) and the first exit port 63. A third image pickup means (upper right image pickup unit 43, upper right prism 46) for imaging (upper right image UR) and a third partial image of the bonding position 22a emitted from the second exit port 64. A fourth imaging means (lower right imaging unit 44, lower right prism 48) that captures a fourth partial image (lower right image DR) that is a corresponding part, and a first image captured by the first imaging means. Based on the partial image of the image, the second partial image captured by the second imaging means, the third partial image captured by the third imaging means, and the fourth partial image captured by the fourth imaging means. The bonding tool 29 and the stage (board holding stage 21) are based on the detection means (image recognition unit 93) that detects the relative positional deviation between the chip 14 and the bonding position 22a, and the positional deviation detected by the detection means. The moving means (linear motor 24, It has a guide rail 25) and. The movable light guide reflects the image of the chip 14 incident from the first incident port 61 in the first direction (for example, arrow h1), and the image of the bonding position 22a incident from the second incident port 62 is the second. The image of the reflector 50 that reflects in two directions (for example, arrow h2) and the image of the incident chip 14 that is arranged directly below the first exit port 63 is reflected directly above and is substantially parallel to the reflection surface of the reflector 50. The image of the first final reflecting surface (fourth reflecting surface 74) having an inclination and the image of the incident bonding position 22a arranged directly under the second exit port 64 is reflected directly above the reflecting surface of the reflector 50. It includes at least a second final reflecting surface (eighth reflecting surface 78) having a substantially parallel inclination.

In this bonding device 1, it is possible to prevent the recognition position from changing even if the stopping accuracy of the movable prism 32a deteriorates due to the action obtained by the same configuration as described above, and the components are mounted with high accuracy and in a short time. It becomes possible. In addition, the mechanism can be simplified and the equipment cost can be reduced.

In addition to this, the bonding apparatus 1 has a first partial image (upper left image UL), a third partial image (upper right image UR), and a second partial image of the chip 14 emitted from the first exit port 63. The second partial image (lower left image DL) and the fourth partial image (lower right image DR) of the chip 14 at the bonding position 22a emitted from the ejection port 64 are reflected downward by the four prisms. These reflected images are incident on the four image pickup units of the image pickup unit 34 and imaged. In this configuration, the bonding device 1 adjusts the positions of the imaging fields of view by the four imaging units by moving the four imaging units relative to the four prisms of the fixed optical unit 33 by the imaging unit moving means. .. This makes it possible to target a wide variety of chips 14 having different sizes and positions of recognition points.

Further, in the bonding device 1 in which the image of the bonding position 22a and the image of the chip 14 are imaged by a plurality of imaging means, the movable light guide body first reflects the image of the chip 14 reflected in the first direction. A second relay that guides the image of the first relay reflection surface (second reflection surface 72, third reflection surface 73) leading to the surface and the bonding position 22a reflected in the second direction to the second final reflection surface. It further includes a reflective surface (sixth reflective surface 76, seventh reflective surface 77).

In this bonding device 1, in addition to being able to target various types of chips 14 having different sizes and positions of recognition points, a first final reflection surface (fourth reflection surface 74) and a second final reflection surface are available. (8th reflecting surface 78) can be arranged in parallel.

Further, the bonding apparatus 1 in which the image of the bonding position 22a and the image of the chip 14 are imaged by a plurality of imaging means is a first from the first relay reflection surface that directly guides the image of the chip 14 to the first final reflection surface. The direction of the optical path of the image of the chip 14 to the first final reflection surface with respect to the final reflection surface of 1, and the second final from the second relay reflection surface that directly guides the image of the bonding position 22a to the second final reflection surface. The direction of the optical path to the second final reflecting surface of the image of the bonding position 22a with respect to the reflecting surface is substantially the same.

In this bonding device 1, in addition to being able to target a wide variety of chips 14 having different sizes and positions of recognition points, a first final reflection surface (fourth reflection surface 74) and a second final reflection surface can be targeted. An optical path to the fourth reflecting surface 74 and the eighth reflecting surface 78 arranged in parallel in a displacement direction (for example, arrow h2) that realizes the parallel arrangement of the (eighth reflecting surface 78) and is equal to or higher than the stopping accuracy of the movable prism 32a. It is possible to match the directions of.

Further, in the bonding device 1 in which the image of the bonding position 22a and the image of the chip 14 are imaged by a plurality of imaging means, the direction of the optical path to the first final reflection surface and the direction of the optical path to the second final reflection surface are different. It is substantially parallel to the direction of movement of the movable light guide.

In this bonding device 1, in addition to being able to target a wide variety of chips 14 having different sizes and recognition point positions, even if the stop accuracy deteriorates and the stop position of the movable prism 32a shifts, it is recognized. It is possible to configure an optical system that does not change the position.

Further, in the bonding apparatus 1 in which the image of the bonding position 22a and the image of the chip 14 are imaged by a plurality of imaging means, the first direction and the second direction are opposite to each other.

In this bonding device 1, in addition to being able to target a wide variety of chips 14 having different sizes and recognition point positions, the movable prism 32a is a bonding position between the chip 14 and the substrate 22 held by the bonding tool 29. It is possible to recognize the upper and lower visual fields at the same time by advancing and retreating between the 22a and the 22a.

Further, in the bonding apparatus 1 in which the image of the bonding position 22a and the image of the chip 14 are imaged by a plurality of imaging means, the first direction and the second direction are horizontal directions.

In this bonding device 1, in addition to being able to target a wide variety of chips 14 having different sizes and positions of recognition points, the thickness dimension in the overall shape of the movable prism 32a can be made as small as possible, and the weight can be reduced. It will be possible.

Therefore, according to the bonding apparatus 1 according to the first embodiment, the recognition position does not change even if the stopping accuracy of the prism deteriorates, and the component can be mounted with high accuracy in a short time.

Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can come up with various modifications, modifications, substitutions, additions, deletions, and even examples within the scope of the claims. It is understood that it naturally belongs to the technical scope of the present disclosure. Further, each component in the various embodiments described above may be arbitrarily combined as long as the gist of the invention is not deviated.

The present disclosure is useful as a bonding apparatus and a bonding method for mounting a component with high accuracy in a short time by reducing an error in the recognition position of a component to be bonded even if the stop accuracy of the prism deteriorates.

1 Bonding device 14 Chip 21 Board holding stage 22 Board 22a Bonding position 24 Linear motor 25 Guide rail 29 Bonding tool 61 First entrance port 62 Second entrance port 63 First exit port 64 Second exit port 32a Movable prism 41 Upper left imaging unit 42 Lower left imaging unit 43 Upper right imaging unit 44 Lower right imaging unit 45 Upper left prism 46 Upper right prism 47 Lower left prism 48 Lower right prism 50 Reflector 72 Second reflecting surface 73 Third reflecting surface 74 4th reflective surface 76 6th reflective surface 77 7th reflective surface 78 8th reflective surface 92 Alignment processing unit 93 Image recognition unit

Claims (14)

A bonding device in which a bonding tool holds a chip and lowers the bonding tool toward a stage on which a substrate is placed so as to face the chip to bond the chip to the bonding position of the substrate.
When it is located between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and horizontally from the first incident port. A second emission that is horizontally separated from the first incident port by incident the image of the bonding position from the second incident port facing the bonding position while emitting upward from the separated first emission port. A movable light guide that emits upward from the mouth,
A first image pickup means for capturing an image of the chip emitted from the first exit port, and a first image pickup means.
A second imaging means for capturing an image of the bonding position emitted from the second outlet, and
The relative positional deviation between the chip and the bonding position is detected based on the image of the chip imaged by the first imaging means and the image of the bonding position imaged by the second imaging means. Detection means and
An alignment means for relatively moving the bonding tool and the stage based on the misalignment detected by the detection means, and an alignment means.
It has a moving means for moving the movable light guide body back and forth in the space between the chip and the substrate located above the bonding position.
The movable light guide body is
A reflector that reflects the image of the chip incident from the first incident port in the first direction and the image of the bonding position incident from the second incident port in the second direction.
A first final reflecting surface, which is arranged directly below the first exit port, reflects an incident image of the chip directly above, and has an inclination substantially parallel to the reflector.
A second final reflective surface, which is arranged directly below the second exit port, reflects the incident image of the bonding position directly above, and has an inclination substantially parallel to the reflector, and includes at least.
Bonding equipment. The movable light guide body is
A first relay reflecting surface that guides the image of the chip reflected in the first direction to the first final reflecting surface, and
Further includes a second relay reflection surface that guides the image of the bonding position reflected in the second direction to the second final reflection surface.
The bonding apparatus according to claim 1. The direction of the optical path of the image of the chip from the first relay reflection surface that directly guides the image of the chip to the first final reflection surface to the first final reflection surface, and the image of the bonding position are the first. The direction of the optical path of the image of the bonding position from the second relay reflection surface directly leading to the final reflection surface of 2 to the second final reflection surface is substantially the same.
The bonding apparatus according to claim 2. The direction of the optical path of the image of the chip to the first final reflection surface and the direction of the optical path of the image of the bonding position to the second final reflection surface are the directions of movement of the movable light guide body. Almost parallel,
The bonding apparatus according to claim 3. The first direction and the second direction are opposite to each other.
The bonding apparatus according to any one of claims 1 to 4. The first direction and the second direction are horizontal directions.
The bonding apparatus according to any one of claims 1 to 5. A bonding device in which a bonding tool holds a chip and lowers the bonding tool toward a stage on which a substrate is placed so as to face the chip to bond the chip to the bonding position of the substrate.
When it is located between the chip located above the bonding position and the substrate, the image of the chip is incident from the first incident port facing the chip and horizontally from the first incident port. A second emission that is horizontally separated from the first incident port by incident the image of the bonding position from the second incident port facing the bonding position while emitting upward from the separated first emission port. A movable light guide that emits upward from the mouth,
A first image pickup means for photographing a first partial image which is a part of an image of the chip emitted from the first exit port, and a first image pickup means.
A second image pickup means for photographing a second partial image which is a part corresponding to the first partial image of the image of the bonding position emitted from the second exit port.
A third image pickup means for capturing a third partial image which is a part different from the first partial image of the image of the chip emitted from the first exit port.
A fourth image pickup means for photographing a fourth partial image which is a part corresponding to the third partial image of the image of the bonding position emitted from the second exit port.
The first partial image captured by the first imaging means, the second partial image captured by the second imaging means, and the third partial image captured by the third imaging means. And the detecting means for detecting the relative positional deviation between the chip and the bonding position based on the fourth partial image captured by the fourth imaging means.
An alignment means for relatively moving the bonding tool and the stage based on the misalignment detected by the detection means, and an alignment means.
It has a moving means for moving the movable light guide body back and forth in the space between the chip and the substrate located above the bonding position.
The movable light guide body is
A reflector that reflects the image of the chip incident from the first incident port in the first direction and the image of the bonding position incident from the second incident port in the second direction.
A first final reflecting surface, which is arranged directly below the first exit port, reflects an incident image of the chip directly above, and has an inclination substantially parallel to the reflector.
A second final reflective surface, which is arranged directly below the second exit port, reflects the incident image of the bonding position directly above, and has an inclination substantially parallel to the reflector, and includes at least.
Bonding equipment. The movable light guide body is
The image of the first relay reflection surface that guides the image of the chip reflected in the first direction to the first final reflection surface and the image of the bonding position reflected in the second direction are the second. Further including a second relay reflective surface leading to the final reflective surface,
The bonding apparatus according to claim 7. The direction of the optical path of the image of the chip from the first relay reflection surface that directly guides the image of the chip to the first final reflection surface to the first final reflection surface, and the image of the bonding position are the first. The direction of the optical path of the image of the bonding position from the second relay reflection surface directly leading to the final reflection surface of 2 to the second final reflection surface is substantially the same.
The bonding apparatus according to claim 8. The direction of the optical path of the image of the chip to the first final reflection surface and the direction of the optical path of the image of the bonding position to the second final reflection surface are the directions of movement of the movable light guide body. Almost parallel,
The bonding apparatus according to claim 9. The first direction and the second direction are opposite to each other.
The bonding apparatus according to any one of claims 7 to 10. The first direction and the second direction are horizontal directions.
The bonding apparatus according to any one of claims 7 to 11. When the chip is positioned between the chip held above the bonding position of the substrate by the bonding tool and the substrate, the image of the chip is incident from the first incident port facing the chip and the first incident port is made. The image of the bonding position was incident from the second incident port facing the bonding position and horizontally separated from the first incident port while being emitted upward from the first exit port horizontally separated from the bonding position. Using a movable light guide that emits upward from the second outlet, the bonding tool is lowered toward the stage on which the substrate is placed so as to face the chip, and the chip is placed at the bonding position of the substrate. It is a bonding method to join,
The first imaging step of imaging the image of the chip emitted from the first exit port, and
A second imaging step of imaging an image of the bonding position emitted from the second exit port, and
The relative positional deviation between the chip and the bonding position is detected based on the image of the chip captured by the first imaging step and the image of the bonding position captured by the second imaging step. Detection process and
An alignment step of relatively moving the bonding tool and the stage based on the misalignment detected by the detection step, and an alignment step.
A moving step of moving the movable light guide body back and forth in the space between the chip located above the bonding position and the substrate is included.
The movable light guide body is
A reflector that reflects the image of the chip incident from the first incident port in the first direction and the image of the bonding position incident from the second incident port in the second direction.
A first final reflecting surface, which is arranged directly below the first exit port, reflects an incident image of the chip directly above, and has an inclination substantially parallel to the reflector.
A second final reflective surface, which is arranged directly below the second exit port, reflects the incident image of the bonding position directly above, and has an inclination substantially parallel to the reflector, and includes at least.
Bonding method. When the chip is positioned between the chip held above the bonding position of the substrate by the bonding tool and the substrate, the image of the chip is incident from the first incident port facing the chip and the first incident port is made. The image of the bonding position was incident from the second incident port facing the bonding position and horizontally separated from the first incident port while being emitted upward from the first exit port horizontally separated from the bonding position. Using a movable light guide that emits upward from the second outlet, the bonding tool is lowered toward the stage on which the substrate is placed so as to face the chip, and the chip is placed at the bonding position of the substrate. It is a bonding method to join,
A first imaging step of imaging a first partial image which is a part of an image of the chip emitted from the first exit port, and
A second imaging step of imaging a second partial image which is a part corresponding to the first partial image of the image of the bonding position emitted from the second exit port.
A third imaging step of imaging a third partial image which is a part different from the first partial image of the image of the chip emitted from the first exit port.
A fourth imaging step of imaging a fourth partial image which is a part corresponding to the third partial image of the image of the bonding position emitted from the second exit port.
The first partial image captured by the first imaging step, the second partial image captured by the second imaging step, and the third partial image captured by the third imaging step. And a detection step of detecting the relative positional deviation between the chip and the bonding position based on the fourth partial image captured by the fourth imaging step.
An alignment step of relatively moving the bonding tool and the stage based on the misalignment detected by the detection step, and an alignment step.
A moving step of moving the movable light guide body back and forth in the space between the chip located above the bonding position and the substrate is included.
The movable light guide body is
A reflector that reflects the image of the chip incident from the first incident port in the first direction and the image of the bonding position incident from the second incident port in the second direction.
A first final reflecting surface, which is arranged directly below the first exit port, reflects an incident image of the chip directly above, and has an inclination substantially parallel to the reflector.
A second final reflective surface, which is arranged directly below the second exit port, reflects the incident image of the bonding position directly above, and has an inclination substantially parallel to the reflector, and includes at least.
Bonding method.

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