JP2002110742A - Method for manufacturing semiconductor device, and apparatus for manufacturing semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve processing capability in chip bonding. SOLUTION: When recognition marks 1c, 4a of a semiconductor 1 and a wiring board 4 are imaged by means of an optical system 12h, by moving a collet 12i of the tip of a bonding head, the recognition mark 1c of the semiconductor chip 1 and the recognition mark 4a of the wiring board 4 are arranged facing. As a result, positions, of the facing recognition marks 1c, 4a of the semiconductor chip 1 and the wiring board 4 are obtained by one recognizing operation of the optical system 12h, and by repeating this operation for the two recognition marks 1c, 4a, the positions of the semiconductor chip 1 and the wiring board 4 are effectively recognized and both are bonded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique, and more particularly to a technique effective when applied to an improvement in throughput in a semiconductor manufacturing apparatus such as a flip chip bonder.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

A flip chip bonder is known as a semiconductor manufacturing apparatus for bonding a semiconductor chip to a wiring board (chip supporting member) by flip chip mounting.

Further, as an example of a miniaturized semiconductor device, a semiconductor device called a CSP (Chip Scale Package) has been developed. In this CSP, a chip supporting member for supporting a semiconductor chip is mainly made of a film. A thin-film tape-shaped wiring substrate is used.

Therefore, using a flip chip bonder, C
When performing the chip bonding of the SP, the main surface of the semiconductor chip and the chip supporting surface of the tape-shaped wiring board are arranged to face each other, and an optical system in which a recognition camera is installed is arranged between the semiconductor chip and the semiconductor chip. The position of the chip and the wiring board are aligned and the two are joined.

At this time, in aligning the semiconductor chip and the wiring board arranged opposite to each other, an optical system having two visual fields is used, one of the two recognition cameras is used for recognition of the semiconductor chip, and the other is used for recognition of the wiring board. Used for recognition.

[0007] For various flip chip bonders, see, for example, Press Journal Inc., July 7, 1998.
Published on March 27, "Monthly Semiconductor World Extra Number '99
Semiconductor Assembly / Inspection Technology ", pp. 119-123.

[0008]

However, in the flip chip bonder of the above-mentioned technology, for example, the upper side (semiconductor chip side) and the lower side (wiring board side) of the semiconductor chip and the wiring board which are arranged opposite to each other. And the two recognition patterns are recognized respectively to obtain the positions of the two. In this case, if the respective recognition patterns are not opposed to each other and are shifted, four times in the recognition using the two-field optical system. Recognition operation is required.

That is, one recognition camera performs two recognition operations on the semiconductor chip side (upper side) to read two recognition patterns to determine the position of the semiconductor chip. Recognition operations are performed twice on the wiring board side (lower side) by the other wiring board recognition camera, and two recognition patterns are read to determine the position of the wiring board.

Therefore, even if an optical system having two visual fields is used, four times of recognition operations are required to recognize the positions of the semiconductor chip and the wiring board.

As a result, the image input to the optical system is 1
Four operations are required in a cycle, and as a result, it takes an enormous amount of time to find the positions of the semiconductor chip and the wiring board, which causes a problem that productivity is extremely reduced.

An object of the present invention is to provide a semiconductor device manufacturing method and a semiconductor manufacturing apparatus for improving the processing capability in chip bonding.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the method of manufacturing a semiconductor device according to the present invention, the semiconductor chip and the chip support are provided between a semiconductor chip supported by a bonding tool and a chip support member mounted on a stage so as to face the semiconductor chip. A step of disposing an optical system capable of capturing an image of a recognition point of both members, and a step of moving at least one of the bonding tool and the stage to dispose the recognition point of either of the members opposite to each other; Obtaining a position of the recognition point opposite to the two by a single recognition operation of the optical system by capturing an image of the recognition point opposite to the two by the optical system; Aligning and joining the semiconductor chip and the chip support member on the basis of
The position of the opposing recognition point between the semiconductor chip and the chip supporting member is determined by a single recognition operation, and the two are joined together.

According to the present invention, it is possible to simultaneously capture an image of a recognition position of a semiconductor chip and a recognition position of a chip supporting member facing the semiconductor chip, and as a result, it is possible to obtain the positions of both at substantially the same time.

With this configuration, the positions of the recognition points where the semiconductor chip and the chip supporting member face each other can be obtained almost simultaneously by one recognition operation of the optical system. Therefore, the recognition time of the position of the semiconductor chip and the position of the chip supporting member can be obtained. Can be greatly reduced.

As a result, the processing time in chip bonding can be greatly reduced, thereby improving the processing capability in chip bonding.

Therefore, it is possible to shorten the setup time and to save time and labor in the chip mounting apparatus, and as a result, it is possible to improve the efficiency of the chip mounting process.

Further, the semiconductor manufacturing apparatus of the present invention is arranged such that a bonding tool movable while supporting the semiconductor chip and a chip supporting member which can be joined to the semiconductor chip can be arranged facing the semiconductor chip. A movable stage provided, movably installed between the bonding tool and the stage, a recognition location of the semiconductor chip supported by the bonding tool, and opposed to the semiconductor chip and mounted on the stage. An optical system that captures an image of the recognition location of the chip support member, and a recognition unit that determines the position of the recognition location where both the semiconductor chip and the chip support member face each other based on information captured by the optical system. The semiconductor chip and the chip supporting member based on the positions of the two recognition points obtained by the recognition unit; And a bonding processing unit that performs bonding of the two. When the optical system captures an image of the two recognition points, at least one of the bonding tool and the stage is moved to recognize either of the two. The positions are arranged so as to oppose each other, and the position of the opposing recognition point can be obtained by one recognition operation of the optical system.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 is a schematic structural view showing a structure of a flip chip bonder as an example of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a view of a semiconductor device manufactured using the flip chip bonder shown in FIG. FIG. 3 is a sectional view showing a structure of a CSP as an example, FIG. 3 is a manufacturing process flow chart showing an example of an assembling procedure of a method of manufacturing a CSP as a semiconductor device according to an embodiment of the present invention, and FIG. 4 is a flip chip shown in FIG. FIG. 5 is a schematic view showing an example of a state at the time of chip bonding in the bonder, FIG. 5 is a recognition principle diagram showing an example of a chip / substrate position recognition method in the flip chip bonder shown in FIG. 1, and FIG. 6 is a view in the flip chip bonder shown in FIG. Tip ・
It is a recognition principle figure showing an example of a substrate position recognition method.

The flip chip bonder as an example of the semiconductor manufacturing apparatus of the present embodiment shown in FIG. 1 is used to assemble the CSP 6 as an example of the small semiconductor device shown in FIG.
This is a manufacturing apparatus for bonding (mounting) the semiconductor chip 1 to the wiring board (chip supporting member) 4, and joins the semiconductor chip 1 and the wiring board 4.

In this embodiment, a case where a tape-shaped thin film wiring substrate 4 is used as an example of the wiring substrate 4 will be described. Therefore, the flip chip bonder shown in FIG.
The semiconductor chip 1 is mounted on a tape-shaped wiring board 4 which is a chip supporting member.

The schematic configuration of the flip chip bonder according to the present embodiment will be described with reference to FIGS. 1 to 6. The wafer set section 11 for picking up individual semiconductor chips 1 from the diced semiconductor wafer 7 and the semiconductor chip FIG. 4 shows a bonding head 12 a which is a movable bonding tool while supporting the semiconductor chip 1, and a movable board 4 which is provided so that a wiring board 4 which can be bonded to the semiconductor chip 1 can be arranged facing the semiconductor chip 1. Mounting stage (stage) 12b shown and bonding head 12a
And the mounting mark 12c of the semiconductor chip 1 movably installed between the mounting stage 12b and supported by the bonding head 12a and the wiring board 4 opposed to the mounting mark and mounted on the mounting stage 12b. The optical system 12h shown in FIG. 5 for imaging the recognition mark (recognition location) 4a, and the positions of the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4 facing each other are determined based on the information captured by the optical system 12h. The recognition unit 13 to be determined, and the bonding processing unit 1 that joins the semiconductor chip 1 and the wiring substrate 4 based on the positions of the recognition marks 1 c and 4 a of the semiconductor chip 1 and the wiring substrate 4 determined by the recognition unit 13.
2 and a transport unit 9 for transporting and supplying the wiring substrate 4 to the bonding processing unit 12.

Therefore, the feature of the flip chip bonder of the present embodiment is that when the optical system 12h captures the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4, the bonding head 12a is moved and the semiconductor chip 1 is moved. And any of the recognition marks 1c and 4a on the wiring board 4.
Are arranged so as to face each other.
The positions of the recognition marks 1c and 4a facing each other on the semiconductor chip 1 and the wiring board 4 are obtained by a single recognition operation, and this is repeated for a plurality of (for example, two) recognition marks 1c and 4a. The positions of the chip 1 and the wiring board 4 are recognized, and the two are joined.

That is, after moving the bonding head 12a to dispose the recognition marks 1c, 4a of the semiconductor chip 1 and the wiring board 4 so as to face each other, the optical system 1
By determining the positions of the recognition marks 1c and 4a facing each other on the semiconductor chip 1 and the wiring board 4 by one recognition operation of 2h, the optical system 12h of the conventional flip chip bonder is obtained.
Of the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4 by the recognition operation of about one half of the recognition operation of the semiconductor chip 1 and the positions of the recognition marks 1c and 4a. It is shortened to

The recognition mark 1c on the semiconductor chip 1 is, for example, a pad 1b as a surface electrode as shown in FIG. 2, but may be a dedicated recognition mark 1c other than the pad 1b.

The recognition mark 4a of the wiring board 4 is, for example, a wiring pattern of the wiring board 4, but may be a dedicated recognition mark 4a other than the wiring pattern.

Further, the recognition mark 1c of the semiconductor chip 1
The timing for recognizing the position of the recognition mark 4a of the wiring board 4 facing the same may be substantially simultaneous or slightly deviated.

Next, the structure of the main part of the flip chip bonder shown in FIG. 1 will be described.

First, the bonding section 12 of the flip chip bonder according to the present embodiment includes a mount stage 12b, which is a stage for supporting the wiring substrate 4, and a bonding head provided above and opposed to the mount stage 12b. The semiconductor chip 1 picked up from the semiconductor wafer 7 is supported by the collet 12i at the tip of the bonding head 12a by suction or the like.

Further, the bonding section 12 includes a camera head 12e having an optical system 12h mounted thereon, as shown in FIG. 5, a semiconductor chip 1 supported by a collet 12i of the bonding head 12a, and a mount stage 12b. It is provided movably so that it can be arranged between the mounted wiring board 4.

The optical system 12h includes a chip recognition camera 12c for picking up an image of the recognition mark 1c of the semiconductor chip 1,
A tape recognition camera 12d for imaging the recognition mark 4a of the wiring board 4, and a prism 12 for reflecting the respective images
f, 12 g.

The bonding head 12a is installed so as to be rotatable and movable in the XYZ directions.

Further, the mounting stage 12 shown in FIG.
b is an XY table 1 shown in FIG.
0, and is guided by a Z movement mechanism, thereby being movable in the XYZ directions.

The mount stage 12b and the bonding head 12a placed opposite to the mount stage 12b apply a load and heat to the semiconductor chip 1 and the wiring board 4 to join them.

As shown in FIG. 1, a wafer support 11a on which a diced semiconductor wafer 7 is disposed and a diced semiconductor wafer 7 mounted on the wafer support 11a are provided in the wafer setting section 11. And a flip head 11b for picking up the semiconductor chip 1 to be bonded and transferring the picked-up semiconductor chip 1 upside down to the collet 12i of the bonding head 12a. Pickup of the semiconductor chip 1 from the semiconductor wafer 7 and transfer of the semiconductor chip 1 to the bonding head 12a.

The transfer of the semiconductor wafer 7 to the wafer setting section 11 is performed by the wafer lifter 8.

The wiring board 4 is sent out to the transfer section 9 by a loader 17, and the wiring board 4 after chip bonding is accommodated in an unloader 18.

Next, the structure of the CSP 6 shown in FIG. 2 to which chip bonding has been performed using the flip chip bonder (semiconductor manufacturing apparatus) of the present embodiment will be described.

The CSP 6 is a small-sized one whose external size is slightly larger than that of the semiconductor chip 1, and is provided on the outer peripheral portion of the main surface 1 a (the surface on which the semiconductor integrated circuit is formed) of the semiconductor chip 1. Plural pads 1b
Will be described.

However, the location where the pad 1b is provided is not particularly limited, and the semiconductor chip 1
May be an outer peripheral portion of the main surface 1a, an inner side (for example, a center pad arrangement), or both.

The configuration of the CSP 6 has a lead 4c connected to the pad 1b of the semiconductor chip 1 and a wiring 4d connected to the lead 4c and also to the bump electrode 2 as an external terminal. The thin-film tape-shaped wiring board 4, the elastomer 3, which is an elastic member disposed between the semiconductor chip 1 and the wiring board 4, and the pad 1 formed by sealing resin or the like in the opening 4 b of the wiring board 4.
b and a sealing portion 5 formed by sealing the lead 4c.

Here, the thin-film tape-shaped wiring board 4 is
For example, it is formed of a polyimide-based film substrate.

The sealing resin used for the sealing portion 5 is, for example, an epoxy-based thermosetting resin or the like, and the resin is sealed by molding or potting.

Next, the semiconductor device (C
The manufacturing method of SP6) including the chip bonding (chip mounting) method will be described with reference to the manufacturing process flow chart shown in FIG.

First, as shown in step S1, a thin-film tape-shaped wiring board 4 made of polyimide or the like is prepared, and an elastomer for attaching the elastomer 3, which is an elastic member, is performed (step S2).

On the other hand, the diced semiconductor wafer 7 is set by the wafer lifter 8 on the wafer support table 11a of the wafer setting section 11 of the flip chip bonder shown in FIG.

Subsequently, the chip mount (chip bonding) shown in step S3 is performed using the flip chip bonder of the present embodiment shown in FIG.

At that time, first, the semiconductor chip 1 to be subjected to chip bonding in the wafer setting section 11 is picked up from the semiconductor wafer 7 by the flip head 11b, and the flip chip 11 is turned upside down and moved to the bonding processing section 12.

Thereafter, the back surface 1d of the semiconductor chip 1 is sucked and held by the collet 12i provided at the tip of the bonding head 12a, and waits above the mount stage 12b.

On the other hand, the tape-shaped wiring board (chip supporting member) 4 is sent out from the loader 17 to
From the mounting stage 12b of the bonding section 12
The wiring board 4 on which the elastomer 3 is adhered is arranged.

Subsequently, as shown in FIG. 5, the collet 12 of the bonding head 12a as a bonding tool is formed.
i and the wiring board 4 mounted on the mount stage 12b so as to face the semiconductor chip 1
An optical system 12h mounted on the camera head 12e and capable of imaging the recognition mark 1c of the semiconductor chip 1 and the recognition mark 4a of the wiring board 4 is disposed between the optical system 12h.

Further, by moving the bonding head 12a supporting the semiconductor chip 1, the recognition mark (recognition location) 1c of the semiconductor chip 1 and the recognition mark (recognition location) 4a of the wiring board 4 are arranged to face each other.

At this time, first, the camera head 12e is moved to a position where the image of the recognition mark 4a of the wiring board 4 can be captured by the tape recognition camera 12d, and then the recognition mark 1 of the semiconductor chip 1 is moved by the chip recognition camera 12c.
The semiconductor chip 1 is moved by the bonding head 12a to a position where the image of c can be taken.

That is, with the camera head 12e interposed,
The semiconductor chip 1 is moved by the collet 12i of the bonding head 12a so that the recognition mark 4a of the wiring board 4 and the recognition mark 1c of the semiconductor chip 1 are arranged above and below the semiconductor chip 1 so as to face each other.

Thereafter, the prism 1 is moved by the chip recognition camera 12c and the tape recognition camera 12d of the optical system 12h.
Semiconductor chip 1 and wiring board 4 via 2f and 12g
The opposing recognition marks 1c and 4a are respectively imaged, and the positions of the opposing recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4 are respectively obtained by one recognition operation of the optical system 12h. (2 sets) for the opposite recognition marks 1c and 4a.

At that time, first, as shown in FIG. 5, the first recognition marks 1c and 1c of the semiconductor chip 1 and the wiring board 4 are formed.
The image of 4a is fetched almost simultaneously by the chip recognition camera 12c and the tape recognition camera 12d, and data processing is performed.

Then, as shown in FIG. 6, the second recognition mark 4 on the wiring board 4 is
The camera head 12e is moved to a position where the image of a can be captured, and then the semiconductor chip 1 is moved by the bonding head 12a to a position where the image of the second recognition mark 1c of the semiconductor chip 1 can be captured by the chip recognition camera 12c.

That is, with the camera head 12e interposed,
The collet 12 of the bonding head 12a is arranged such that the second recognition mark 4a of the wiring board 4 and the second recognition mark 1c of the semiconductor chip 1 are arranged above and below the opposing surface.
The semiconductor chip 1 is moved by i.

Subsequently, the semiconductor chip 1 and the wiring board 4
The images of the second recognition marks 1c and 4a are captured almost simultaneously by the chip recognition camera 12c and the tape recognition camera 12d, respectively, and processed.

Thereafter, the semiconductor chip 1 and the wiring board 4 are aligned and joined based on the determined positions of the recognition marks 1c and 4a on the wiring board 4.

At this time, the position information of the recognition marks 1c and 4a on the wiring board 4 and the semiconductor chip 1 registered in advance in the flip chip bonder as data or by teaching or the like, and the first and second recognition marks 1c , 4a, the positions of the semiconductor chip 1 and the wiring board 4 are determined based on the information obtained by processing the image information of the recognition unit 13.

Subsequently, the semiconductor chip 1 and the wiring substrate 4 are aligned based on the determined positions of the semiconductor chip 1 and the wiring substrate 4, and as shown in FIG. 4, the mounting stage 12b and the bonding head 12a are used. A load, heat, or the like is applied to the semiconductor chip 1 and the wiring substrate 4 to join them to perform chip mounting (chip bonding).

As a result, in the flip chip bonder of the present embodiment, the recognition marks 1c, 4 of the semiconductor chip 1 and the wiring substrate 4 facing each other are recognized by one recognition operation of the optical system 12h.
The position of a can be obtained, and this can be performed on the plurality of recognition marks 1c and 4a to efficiently obtain both positions.

After the chip mounting, the wiring board 4 is sent to the unloader 18 and stored therein.

Thereafter, the lead bonding shown in step S4 of FIG. 3 is performed.

Here, the pads 1b of the semiconductor chip 1 shown in FIG. 2 and the leads 4c of the wiring board 4 are connected using an inner lead bonder or the like.

Thereafter, the sealing shown in step S5 is performed.

In the sealing step, the semiconductor chip 1 may be molded (or molded) by using a sealing resin.
The pad 1b and the lead 4c are sealed with resin, thereby forming a sealing portion 5.

Subsequently, ball attachment shown in step S6 is performed.

Here, a predetermined number of bump electrodes 2 are formed by mounting solder balls as external terminals one by one on lands at predetermined positions connected to the wiring 4d of the wiring board 4.

Thereafter, the sorting / marking shown in step S7 is performed, and the assembly of the CSP 6 shown in FIG. 2 is completed.

According to the method of manufacturing a semiconductor device (CSP6) and the semiconductor manufacturing device (flip chip bonder) of the present embodiment, the following operational effects can be obtained.

That is, when the positions of the semiconductor chip 1 and the wiring substrate 4 disposed opposite to the semiconductor chip 1 are determined in the chip bonding, the bonding head 12a is moved to recognize the recognition marks 1c of the semiconductor chip 1 and the wiring substrate 4.
The recognition marks 1c of the semiconductor chip 1 are obtained by imaging the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4 facing each other with the optical system 12h.
And the recognition mark 4a of the wiring board 4 opposed thereto can be simultaneously imaged. As a result, the positions of the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4 can be obtained almost simultaneously.

Thus, the positions of the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring substrate 4 facing each other can be obtained almost simultaneously by one recognition operation of the optical system 12h.

Therefore, the semiconductor chip 1 and the wiring board 4
The time required for recognizing the position can be significantly reduced (approximately １ ／ of the prior art), thereby greatly reducing the processing time in chip bonding.

As a result, the processing capability (throughput) in chip bonding can be improved.

Further, the time required for recognizing the positions of the semiconductor chip 1 and the wiring board 4 can be greatly reduced, so that the time required for bonding one chip can be significantly reduced. As a result, the chip of the flip chip bonder (semiconductor manufacturing apparatus) can be obtained. Throughput in bonding can be improved.

Further, the flip chip bonder can be differentiated from other companies in the same industry, so that it is possible to expand the sales of the flip chip bonder.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above embodiment, the recognition mark 1c of the semiconductor chip 1 and the recognition mark 4a of the wiring board 4 are recognized almost simultaneously using two cameras, the chip recognition camera 12c and the tape recognition camera 12d. However, as shown in the chip / substrate position recognition method of the modified example of FIGS. 7A and 7B, even if only one recognition camera 12j is used, similarly to the above-described embodiment, the optical system 12 is used.
The position of the recognition marks 1c and 4a of the semiconductor chip 1 and the wiring board 4 facing each other can be obtained by one recognition operation of h.

That is, as the optical system 12h mounted on the camera head 12e, one recognition camera 12j and one rotatable prism 12k are installed, and as shown in FIG. After imaging the recognition mark 1c, as shown in FIG. 7B, the recognition mark 4a of the wiring board 4 is imaged by rotating the prism 12k by 90 °.

As a result, only one recognition camera 12j and one prism 12k need be installed as the optical system 12h, so that the cost of the flip chip bonder can be reduced.

In the above embodiment, the case where the semiconductor device is the CSP 6 has been described. However, the semiconductor device is assembled by joining the semiconductor chip 1 and the chip supporting member by the chip bonding method of the embodiment. The semiconductor device according to the modification shown in FIGS.

First, the semiconductor device of the modification shown in FIG.
A flip-chip product 19 such as a multi-chip module in which the semiconductor chip 1 and a wiring board 14 such as a printed wiring board as a chip supporting member are flip-chip connected, for example, a gold bump 2 provided on the semiconductor chip 1
0 and the board-side terminals 14a of the wiring board 14 are gold-gold-connected.

Also in this case, when performing the chip bonding, the camera head 12e (see FIG. 5) is arranged between the semiconductor chip 1 and the wiring board 14, and the semiconductor chip 1 is formed by the chip bonding method of the embodiment. And the wiring board 14.

The semiconductor device of the modification shown in FIG.
The semiconductor chip 1 mounted on the tape substrate 15a, which is a chip supporting member, and the tape substrate 15a are bonding wires 1
5b, a mold portion 15c formed by molding, and a bump electrode 15d as an external terminal are provided.

Also in assembling the CSP 15, when performing chip bonding, the camera head 12e (see FIG. 5) is arranged between the semiconductor chip 1 and the tape substrate 15a, and the semiconductor is mounted by the chip bonding method of the embodiment. The edge and the like of the chip 1 are imaged to determine the position, whereby the semiconductor chip 1 and the tape substrate 15a are obtained.
Is to be joined.

Further, the semiconductor device of the modified example shown in FIG. 10 has an LOC (Lead O) assembled using a lead frame.
n Chip) 16, the semiconductor chip 1 is supported by an inner lead 16a as a chip supporting member via an insulating tape 16c, and the inner lead 16a and the semiconductor chip 1 are connected by a bonding wire 16d.
Further, a mold portion 16e formed by the mold
And an outer lead 16b which is a J-shaped external terminal.

In assembling the LOC 16, when performing chip bonding (chip mounting), the camera head 12e (see FIG. 5) is disposed between the semiconductor chip 1 and the inner lead 16a of the lead frame which is a chip supporting member. Then, the semiconductor chip 1 and the inner leads 16a are joined by the chip bonding method of the embodiment.

In the above embodiment, the case where the semiconductor manufacturing apparatus is a flip chip bonder has been described.
The semiconductor manufacturing device may be another assembling device such as a die bonder, a chip mounter, or a positioning device as long as the semiconductor chip 1 and the chip supporting member are connected by the chip bonding method of the embodiment.

In the above embodiment, the recognition mark 1c of the semiconductor chip 1 is used in the flip chip bonder.
When the semiconductor chip 1 (bonding head 12a side) supported by the bonding head 12a is moved when the recognition mark 4a of the wiring board 4 and the recognition mark 4a of the wiring board 4 are arranged to face each other, the wiring board 4 side, that is, the mounting stage has been described. 12b is moved to the recognition mark 1 of the semiconductor chip 1.
c and the recognition mark 4a of the wiring board 4 may be opposed to each other, or the recognition mark 1c of the semiconductor chip 1 and the recognition mark 4a of the wiring board 4 may be moved by moving both sides of the bonding head 12a and the mount stage 12b. May be opposed to each other.

[0095]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). When determining the positions of the semiconductor chip and the chip supporting member arranged opposite thereto in chip bonding, the recognition points of the semiconductor chip and the chip supporting member are arranged facing each other, and the semiconductor chip and the chip supporting member are arranged by an optical system. By picking up an image of the opposing recognition points, the positions of the opposing recognition points can be obtained almost simultaneously by one recognition operation of the optical system. Therefore, the time for recognizing the position of the semiconductor chip and the position of the chip supporting member can be significantly reduced, thereby greatly reducing the processing time in chip bonding.

(2). According to the above (1), the processing capability (throughput) in chip bonding can be improved.

(3). Since the recognition time of the position of the semiconductor chip and the chip supporting member can be greatly reduced, the time required for bonding one chip can be significantly reduced, and as a result,
The chip bonding throughput of the semiconductor manufacturing apparatus can be improved. Further, the semiconductor manufacturing apparatus can be differentiated from other companies in the same industry, and this can lead to an increase in sales of the semiconductor manufacturing apparatus.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating a structure of a flip chip bonder as an example of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a structure of a CSP as an example of a semiconductor device manufactured using the flip chip bonder shown in FIG.

FIG. 3 is a CSP as a semiconductor device according to the embodiment of the present invention;
FIG. 7 is a manufacturing process flow chart showing an example of an assembling procedure of the manufacturing method of FIG.

FIG. 4 is a schematic diagram showing an example of a state at the time of chip bonding in the flip chip bonder shown in FIG. 1;

FIG. 5 is a recognition principle diagram showing an example of a chip / substrate position recognition method in the flip chip bonder shown in FIG. 1;

FIG. 6 is a recognition principle diagram showing an example of a chip / substrate position recognition method in the flip chip bonder shown in FIG. 1;

FIGS. 7A and 7B are recognition principle diagrams showing a chip / substrate position recognition method according to a modification of the chip / substrate position recognition method shown in FIGS. 5 and 6. FIG.

FIG. 8 is a cross-sectional view illustrating a structure of a semiconductor device according to a modification example assembled using the chip / substrate position recognition method in the semiconductor device manufacturing method of the present invention.

FIG. 9 is a cross-sectional view illustrating a structure of a semiconductor device according to a modification example assembled using the chip / substrate position recognition method in the semiconductor device manufacturing method of the present invention.

FIG. 10 is a cross-sectional view showing a structure of a semiconductor device according to a modified example assembled using the chip / substrate position recognition method in the method of manufacturing a semiconductor device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1a Main surface 1b Pad 1c Recognition mark (recognition location) 1d Back surface 2 Bump electrode 3 Elastomer 4 Wiring board (chip support member) 4a Recognition mark (recognition location) 4b Opening 4c Lead 4d Wiring 5 Sealing part 6 CSP (Semiconductor device) 7 Semiconductor wafer 8 Wafer lifter 9 Transfer unit 10 XY table 11 Wafer setting unit 11a Wafer support stand 11b Flip head 12 Bonding processing unit 12a Bonding head (bonding tool) 12b Mount stage (stage) 12c Chip recognition camera 12d Tape recognition Camera 12e Camera head 12f, 12g Prism 12h Optical system 12i Collet 12j Recognition camera 12k Prism 13 Recognition unit 14 Wiring board (chip support member) 14a Substrate side terminal 15 CSP Semiconductor device) 15a Tape substrate (chip supporting member) 15b Bonding wire 15c Mold portion 15d Bump electrode 16 LOC (semiconductor device) 16a Inner lead (chip supporting member) 16b Outer lead 16c Insulating tape 16d Bonding wire 16e Mold portion 17 Loader 18 Unloader 19 Flip chip product (semiconductor device) 20 Gold bump

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tomoji Suda 3-3-2 Fujibashi, Ome-shi, Tokyo Within Hitachi Tokyo Electronics Co., Ltd. (72) Inventor Yutaka Koda 3-2-2, Fujibashi, Ome-shi, Tokyo Hitachi Tokyo Electronics Co., Ltd. F-term (reference) 5F044 PP15 PP17

Claims (5)

[Claims] An image of a recognition position of both the semiconductor chip and the chip supporting member can be taken between a semiconductor chip supported by a bonding tool and a chip supporting member mounted on a stage so as to face the semiconductor chip. Arranging an optical system; moving at least one of the bonding tool and the stage to arrange either of the recognition points facing each other; and opposing the two by the optical system. A step of imaging a recognition point to determine the positions of the recognition points facing each other in a single recognition operation of the optical system; and, based on the determined positions of the recognition points, the semiconductor chip and the chip support. Aligning and joining a member, and a pair of the semiconductor chip and the chip supporting member in one recognition operation of the optical system. The method of manufacturing a semiconductor device, characterized in that said seeking a position of recognition points for joining the two. 2. A recognition position of both the semiconductor chip and the wiring substrate between a semiconductor chip supported by a bonding tool and a wiring substrate which is a chip supporting member mounted on a stage so as to face the semiconductor chip. Arranging an optical system capable of capturing an image; moving at least one of the bonding tool and the stage so as to oppose any one of the two recognition points; and A step of obtaining the positions of the recognition points facing each other in a single recognition operation of the optical system by taking an image of the recognition points facing each other, and performing this for a plurality of the recognition points; Positioning and joining the semiconductor chip and the wiring board based on the position of the recognition location of the optical system, and performing a single recognition operation of the optical system. The method of manufacturing a semiconductor device characterized by joining the said two doing this to a plurality of said recognition portion seeking the position of the recognition points facing the semiconductor chip and the wiring substrate. 3. Between a semiconductor chip supported by a bonding tool and a wiring board which is a chip supporting member mounted on a stage so as to face the bonding tool, a recognition position of both the semiconductor chip and the wiring board is determined. Arranging an optical system capable of capturing an image; moving the bonding tool supporting the semiconductor chip to arrange any one of the recognition points facing each other; and opposing the two by the optical system. A step of obtaining a position of a recognition point facing the both by a single recognition operation of the optical system by capturing an image of a recognition point, and performing this for a plurality of the recognition points; Positioning and joining the semiconductor chip and the wiring board based on the position of the optical system. The method of manufacturing a semiconductor device characterized by bonding the both done this for a plurality of said recognition portion seeking the position of the recognition points facing the wiring board. 4. A bonding tool that is movable while supporting the semiconductor chip, and a movable stage that is provided so that a chip supporting member that can be bonded to the semiconductor chip can be arranged to face the semiconductor chip. A recognition position of the semiconductor chip supported by the bonding tool and movably disposed between the bonding tool and the stage, and a recognition position of the chip support member opposed to the semiconductor chip and mounted on the stage; An optical system that captures an image, a recognition unit that obtains the position of the recognition location where the semiconductor chip and the chip support member face each other based on information captured by the optical system, and the two that are obtained by the recognition unit. Bonding process for joining the semiconductor chip and the chip support member based on the position of the recognition position of A part, and when imaging the two recognition points by the optical system, at least one of the bonding tool or the stage is moved to dispose one of the two recognition points facing each other. The semiconductor manufacturing apparatus is characterized in that the position of the recognition portion facing the both can be obtained by one recognition operation of the optical system. 5. A bonding tool movable while supporting a semiconductor chip, and a moving tool provided so as to be able to arrange a wiring board which is a chip supporting member capable of being joined to the semiconductor chip so as to face the semiconductor chip. A flexible stage, and a movable portion of the semiconductor chip supported between the bonding tool and the stage, the semiconductor chip supported by the bonding tool, and the wiring board facing the same and mounted on the stage. An optical system that captures an image of a recognition location; a recognition unit that determines the position of the recognition location opposite to both the semiconductor chip and the wiring board based on information captured by the optical system; A bonding processing unit for bonding the semiconductor chip and the wiring board based on the positions of the recognition points of the two; When taking an image of the two recognition points with the optical system, the bonding tool is moved to arrange one of the two recognition points to face each other, and one recognition operation of the optical system is performed. Wherein the position of the recognition location facing the two can be obtained.