JPH04252100A - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component

Info

Publication number
JPH04252100A
JPH04252100A JP3001925A JP192591A JPH04252100A JP H04252100 A JPH04252100 A JP H04252100A JP 3001925 A JP3001925 A JP 3001925A JP 192591 A JP192591 A JP 192591A JP H04252100 A JPH04252100 A JP H04252100A
Authority
JP
Japan
Prior art keywords
small
sized
mounting
image
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3001925A
Other languages
Japanese (ja)
Inventor
Masamichi Tomita
Kazuo Honma
Shigemi Igarashi
Tatsu Takizawa
Keisuke Fujishiro
Makoto Honma
Tomoya Tomita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3001925A priority Critical patent/JPH04252100A/en
Publication of JPH04252100A publication Critical patent/JPH04252100A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an apparatus for rapidly mounting various electronic components on a printed board coping with the large and small components.
CONSTITUTION: An image sensor 9 for selectively imaging the image of a small- sized electronic component 5 and the image of a positioning mark 15 by a beam splitter 16 and a shutter 17, and image sensor 10 for imaging a mounting pattern 7 are provided in a mounting head 2, and an image sensor 8 for a large-sized component 4 is secured to a mounting apparatus body. A movable mirror 18 is provided under a suction nozzle 3, and the small-sized component 5 is imaged during conveying. Since the small-sized component 5 can be imaged during the conveyance, it can be mounted at a high speed. Since both the small- sized component 5 and the mark 15 can be imaged by the sensor 9, a simple and inexpensive structure is provided.
COPYRIGHT: (C)1992,JPO&Japio
JP3001925A 1991-01-11 1991-01-11 Apparatus and method for mounting electronic component Pending JPH04252100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3001925A JPH04252100A (en) 1991-01-11 1991-01-11 Apparatus and method for mounting electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3001925A JPH04252100A (en) 1991-01-11 1991-01-11 Apparatus and method for mounting electronic component

Publications (1)

Publication Number Publication Date
JPH04252100A true JPH04252100A (en) 1992-09-08

Family

ID=11515178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3001925A Pending JPH04252100A (en) 1991-01-11 1991-01-11 Apparatus and method for mounting electronic component

Country Status (1)

Country Link
JP (1) JPH04252100A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153511A (en) * 2006-12-19 2008-07-03 Juki Corp Component mounting equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153511A (en) * 2006-12-19 2008-07-03 Juki Corp Component mounting equipment

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