CN106488695A - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

The present invention provides a kind of electronic component mounting apparatus, and it is it can be avoided that electronic unit interference each other, and conveys electronic unit as much as possible, the reduction of suppression productivity ratio.Electronic component mounting apparatus possess：Mounting head unit, it has multiple mounting heads；Mobile system, it makes the suction nozzle of mounting head move；Part dimension data acquisition, its obtaining parts sized data；Mounting head sized data obtaining section, it obtains mounting head sized data；And mounting head control unit, it is based on part dimension data and mounting head sized data, export the 1st control signal, so that implementing to pass through the 1st mounting head after the detached action of supporting surface by the 1st electronic unit that the supporting surface of electronic part feeder supports, implement for the 2nd bigger than the 1st electronic unit for the overall dimensions being supported by supporting surface electronic unit to utilize the 2nd mounting head from the detached action of supporting surface.

Description

Electronic component mounting apparatus and electronic component mounting method

Technical field

The present invention relates to electronic component mounting apparatus and electronic component mounting method.

Background technology

Electronic unit is installed on substrate using the mounting head unit with multiple mounting heads by electronic component mounting apparatus.Peace Dress head is along prescribed direction configuration multiple (with reference to patent documentation 1,2).

Patent documentation 1：Japanese Unexamined Patent Publication 10-322096 publication

Patent documentation 2：Japanese Unexamined Patent Publication 2000-165093 publication

In order to improve the productivity ratio of electronic component mounting apparatus, following ways are effective, i.e. will supply from electronic unit Multiple electronic units of unit feeding are kept together using multiple mounting heads, are delivered to substrate and are installed.But, according to electricity The overall dimensions of subassembly or the size of mounting head, if attempt to adjacent mounting head to keep electronic unit simultaneously, electricity Subassembly is each other it may happen that interfere.In order to prevent electronic unit interference each other from utilizing detached mounting head to keep electronics In the case of part, there is the mounting head not keeping electronic unit.As a result, from electronic part feeder to substrate being The quantity of the electronic unit that can convey in 1 conveying action of mounting head unit only tails off, and leads to electronic unit to install dress The productivity ratio put reduces.

Content of the invention

The purpose of mode of the present invention is, provides a kind of electronic component mounting apparatus and electronic component mounting method, its When the electronic unit supplying from electronic part feeder being delivered to substrate using the mounting head unit with multiple mounting heads, Avoiding electronic unit interference each other while conveying electronic unit as much as possible, the reduction of productivity ratio can be suppressed.

According to the 1st mode of the present invention, provide a kind of electronic component mounting apparatus, electronic unit is installed on substrate by it, This electronic component mounting apparatus possesses：Mounting head unit, it has support member and multiple mounting head, and the plurality of mounting head is respectively There is the suction nozzle releasably keeping described electronic unit, along the 1st direction of principal axis configuration in predetermined surface, this support member is to multiple Described mounting head is supported；Mobile system, it has installation head driving apparatus and suction nozzle driving means, and this mounting head drives dress Put and can make described support along the 2nd direction of principal axis orthogonal with described 1st direction of principal axis in described 1st direction of principal axis and described predetermined surface Part moves, and this suction nozzle driving means can make described mounting head edge orthogonal with described predetermined surface with respect to described support member 3rd direction of principal axis moves；Part dimension data acquisition, its obtaining parts sized data, this part dimension data represents from electronics The overall dimensions of the described electronic unit of assembly supply device supply；Mounting head sized data obtaining section, it obtains mounting head chi Very little data, this mounting head sized data represents the central shaft of described mounting head and at a distance of the farthest described mounting head of described central shaft The distance between the most external i.e. maximum overall dimensions of described mounting head and along adjacent the 1st the installing of described 1st direction of principal axis The distance between head and the 2nd mounting head；And mounting head control unit, it is based on described part dimension data and described mounting head chi Very little data, exports the 1st control signal, to implement by the described electricity parallel with described predetermined surface using described 1st mounting head The 1st electronic unit that the supporting surface of subassembly feedway supports, after the detached action of described supporting surface, is implemented to utilize institute State the 2nd mounting head by the 2nd bigger than described 1st electronic unit for the overall dimensions being supported by described supporting surface electronic unit from described The detached action of supporting surface, and make the distance between described 3rd axial described 1st electronic unit and described supporting surface big In the distance between described 2nd electronic unit and described supporting surface.

According to the 1st mode of the present invention, in the 2nd big ministry of electronics industry of the 1st little electronic unit of overall dimensions and overall dimensions Part, in the case of electronic part feeder supply, based on part dimension data and mounting head sized data, is being implemented to utilize 1st mounting head by the 1st electronic unit after the detached action of supporting surface, implement using the 2nd mounting head by the 2nd electronic unit from The detached action of supporting surface so that the distance between the 1st electronic unit and supporting surface be more than the 2nd electronic unit and supporting surface it Between distance, thus, though the central shaft of the 1st electronic unit and at a distance of the 1st farthest electronic unit of this central shaft most external The distance between, the central shaft of the 2nd electronic unit and between the farthest most external of the 2nd electronic unit of this central shaft away from It is more than the distance between the central shaft of the 1st mounting head and the central shaft of the 2nd mounting head from sum it is also possible to avoid the 1st ministry of electronics industry Interference between part and the 2nd electronic unit, and by the 1st electronic unit supplying from electronic part feeder and the 2nd electronics Part is kept together and is delivered to substrate by mounting head unit.Therefore, suppression from electronic part feeder to substrate be The situation that the quantity of the electronic unit that can convey in 1 conveying action of mounting head unit only tails off, conveying is as many as possible Electronic unit, therefore suppress productivity ratio reduction.

In the 1st mode of the present invention, preferably described mounting head control unit exports described 1st control signal, so that institute State the distance between the described most external of the 3rd axial described 1st mounting head and described supporting surface and be more than described 2nd electricity of holding The distance between the described suction nozzle of described 2nd mounting head of subassembly and described supporting surface.

Thus, though the size (highly) of the 3rd axial 2nd electronic unit big it is also possible to avoid the 1st mounting head and the Interference between 2 electronic units, and the 1st electronic unit and the 2nd electronic unit are kept together by mounting head unit.

In the 1st mode of the present invention, preferably there is interference detection unit, this interference detection unit is based on described part dimension number According to described mounting head sized data, the description below is judged, i.e. by implementing institute using described 1st mounting head State the 1st electronic unit to implement described 2nd electronic unit after the detached action of described supporting surface using described 2nd mounting head From the detached action of described supporting surface, if the interference between described 1st electronic unit and described 2nd electronic unit can be avoided, In the case of being judged to avoid described the interference, described mounting head control unit exports described 1st control signal, is being judged to not In the case of described the interference can be avoided, described mounting head control unit exports the 2nd control signal, to implement using described 1st peace Dress head by described 1st electronic unit after the detached action of described supporting surface, enforcement using compared with described 2nd mounting head more Plus away from described 1st mounting head the 3rd mounting head by described 2nd electronic unit from the detached action of described supporting surface.

Even if implement using the 1st mounting head by the 1st electronic unit after the detached action of supporting surface, implement to utilize the 2nd electronic unit from the detached action of supporting surface, according to part dimension data and mounting head sized data, is also had by 2 mounting heads The interference between the 1st electronic unit and the 2nd electronic unit possibly cannot be avoided.Based on part dimension data and installation cephalic module According in the case of being judged to avoid the interference between the 1st electronic unit and the 2nd electronic unit, by the 1st electronic unit profit Kept with the 1st mounting head, the 2nd electronic unit is utilized the 3rd mounting head to keep, thus, it is possible to avoid the 1st electronic unit and the 2nd electricity Interference between subassembly, and the 1st electronic unit and the 2nd electronic unit are conveyed together by mounting head unit.

In the 1st mode of the present invention, preferably based on described part dimension data and described mounting head sized data, by Even if described interference detection unit is judged to implement described 1st electronic unit using described 1st mounting head from described support simultaneously The detached action in face and using described 2nd mounting head by described 2nd electronic unit from the detached action of described supporting surface, also can keep away In the case of exempting from the interference between described 1st electronic unit and described 2nd electronic unit, described mounting head control unit output the 3rd Control signal, with implement simultaneously using described 1st mounting head by described 1st electronic unit from the detached action of described supporting surface and Using described 2nd mounting head by described 2nd electronic unit from the detached action of described supporting surface.

According to part dimension data and mounting head sized data, even if sometimes implement electric by the 1st using the 1st mounting head simultaneously Subassembly from the detached action of supporting surface and using the 2nd mounting head by the 2nd electronic unit from the detached action of supporting surface it is also possible to Avoid the interference between the 1st electronic unit and the 2nd electronic unit.Based on part dimension data and mounting head sized data, sentencing In the case of being set to the interference that can avoid between the 1st electronic unit and the 2nd electronic unit, implement will using the 1st mounting head simultaneously 1st electronic unit from the detached action of supporting surface and utilizes the 2nd mounting head by the 2nd electronic unit from the detached action of supporting surface, Thus shorten the time of the action that the multiple electronic units supplying from electronic part feeder are kept by mounting head unit, Therefore suppress the reduction of productivity ratio.

In the 1st mode of the present invention, preferably described mounting head control unit exports the 4th control signal, so that maintaining In the state of relative position between described 3rd axial described 1st mounting head and described 2nd mounting head, make described 1st electricity Subassembly and described 2nd electronic unit are from the position movement relative with described supporting surface to the position relative with the surface of described substrate Put.

Thereby, it is possible to avoid the interference between the 1st electronic unit and the 2nd electronic unit, and will by mounting head unit together The 1st electronic unit keeping and the 2nd electronic unit are delivered to substrate.

In the 1st mode of the present invention, preferably described mounting head control unit exports the 5th control signal, to implement to utilize After described 2nd electronic unit is installed on the action of described substrate by described 2nd mounting head, implement to utilize described 1st mounting head Described 1st electronic unit is installed on the action of described substrate.

Thereby, it is possible to avoid the interference between the 1st electronic unit and the 2nd electronic unit, and by the 1st electronic unit and the 2nd Electronic unit is installed on substrate.

In the 1st mode of the present invention, preferably in described 1st electronic unit from the surface separation predetermined distance of described substrate In the state of, described 2nd electronic unit is installed on described substrate, described electronic component mounting apparatus possess part detection dress Put, this part detection device with described 2nd electronic unit is installed on the action of described substrate concurrently to from described substrate Surface separates the described 1st electronic unit irradiating and detecting light of described predetermined distance, and described 1st electronic unit is detected.

Concurrently implement by part detection device to the 1st ministry of electronics industry with the action that the 2nd electronic unit is installed on substrate The detection action of part, thus suppresses the reduction of productivity ratio.

In the 1st mode of the present invention, described suction nozzle the comprising from described 2nd mounting head of preferably described 2nd mounting head Described outermost flange part protrudes towards described substrate, and the overall dimensions of the described suction nozzle in described predetermined surface are less than described the The described maximum overall dimensions of 2 mounting heads, by the most external of the described 3rd axial described 2nd mounting head and described suction nozzle The distance between leading section be set to L, the size of the described 3rd axial described 1st electronic unit is set to Ha, by described The size of 3 axial described 2nd electronic units is set to Hb, by the surface of the described 3rd axial described substrate and described inspection When the distance between light-metering is set to A, meet the condition of L >=A+Ha-Hb.

Thereby, it is possible to avoid and be installed on substrate the 2nd electronic unit interference, and to by the 1st mounting head keep the 1st Electronic unit irradiating and detecting light and the 1st electronic unit is detected.

According to the 2nd mode of the present invention, provide a kind of electronic component mounting apparatus, electronic unit is installed on substrate by it, This electronic component mounting apparatus possesses：Mounting head unit, it has support member and multiple mounting head, and the plurality of mounting head is respectively There is the suction nozzle releasably keeping described electronic unit, along the 1st direction of principal axis configuration in predetermined surface, this support member is to multiple Described mounting head is supported；Mobile system, it has installation head driving apparatus and suction nozzle driving means, and this mounting head drives dress Put and can make described support along the 2nd direction of principal axis orthogonal with described 1st direction of principal axis in described 1st direction of principal axis and described predetermined surface Part moves, and this suction nozzle driving means can make described mounting head edge orthogonal with described predetermined surface with respect to described support member 3rd direction of principal axis moves；Part dimension data acquisition, its obtaining parts sized data, this part dimension data represents from electronics The overall dimensions of the described electronic unit of assembly supply device supply；Mounting head sized data obtaining section, it obtains mounting head chi Very little data, this mounting head sized data represents the central shaft of described mounting head and at a distance of the farthest described mounting head of described central shaft The distance between the most external i.e. maximum overall dimensions of described mounting head and along adjacent the 1st the installing of described 1st direction of principal axis The distance between head and the 2nd mounting head；And mounting head control unit, it is based on described part dimension data and described mounting head chi Very little data, exports the 1st control signal, to implement by the described electricity parallel with described predetermined surface using described 1st mounting head The 1st electronic unit that the supporting surface of subassembly feedway supports, after the detached action of described supporting surface, is implemented to utilize institute State the 2nd mounting head by the 2nd electronic unit being supported by described supporting surface from the detached action of described supporting surface, and make described The distance between 3 axial described 1st electronic units and described supporting surface are more than described 2nd electronic unit and described supporting surface The distance between, the described suction nozzle of described 2nd mounting head comprises described outermost flange part direction from described 2nd mounting head Described substrate protrudes, and the overall dimensions of the described suction nozzle in described predetermined surface are less than the described maximum profile of described 2nd mounting head Size, the distance between leading section of the most external of the described 3rd axial described 2nd mounting head and described suction nozzle is being set to L, the size of the described 3rd axial described 1st electronic unit is set to Hc, by the described 3rd axial described 2nd ministry of electronics industry The size of part is set to Hd, when the distance between the surface of the described 3rd axial described substrate and described detection light are set to A, Meet the condition of L >=A+Hc-Hd.

According to the 2nd mode of the present invention, supply from electronic part feeder in the 1st electronic unit and the 2nd electronic unit In the case of, based on part dimension data and mounting head sized data, implement by the 1st electronic unit utilize the 1st mounting head from After the detached action of supporting surface, implement for the 2nd electronic unit to utilize the 2nd mounting head from the detached action of supporting surface, so that The distance between 1st electronic unit and supporting surface are more than the distance between the 2nd electronic unit and supporting surface, thus, even if the 1st electricity The central shaft of subassembly and at a distance of the distance between farthest most external of the 1st electronic unit of this central shaft, the 2nd electronic unit Central shaft and apart the distance between farthest most external of the 2nd electronic unit of this central shaft sum are more than in the 1st mounting head The distance between central shaft of heart axle and the 2nd mounting head is it is also possible to avoid dry between the 1st electronic unit and the 2nd electronic unit Relate to, and the 1st electronic unit supplying from electronic part feeder and the 2nd electronic unit are protected together by mounting head unit Hold and be delivered to substrate.Therefore, suppression is dynamic in 1 conveying of the mounting head unit to substrate from electronic part feeder The situation that the quantity of the electronic unit that can convey in work tails off, conveys electronic unit as much as possible.In addition, it can be avoided that with It is installed on the interference of the 2nd electronic unit of substrate, and right to the 1st electronic unit irradiating and detecting light being kept by the 1st mounting head 1st electronic unit is detected.Therefore, suppress the reduction of productivity ratio.

According to the 3rd mode of the present invention, provide a kind of electronic component mounting method, electronic unit is installed on substrate by it, This electronic component mounting method comprises following step：Obtaining parts sized data, this part dimension data represents from electronic unit The overall dimensions of the described electronic unit of feedway supply；Obtain mounting head sized data, this mounting head sized data represents There is the central shaft and at a distance of the distance between farthest most external of described mounting head of described central shaft i.e. of the mounting head of suction nozzle The maximum overall dimensions of described mounting head and by support member supports, along the 1st direction of principal axis in predetermined surface adjacent the 1st peace Dress the distance between head and the 2nd mounting head, wherein, this suction nozzle releasably keeps described electronic unit；Based on described part chi Very little data and described mounting head sized data, using described 1st mounting head by by the described ministry of electronics industry parallel with described predetermined surface The 1st electronic unit that the supporting surface of part feedway supports separates the 1st distance from described supporting surface；Using the described 1st installation Head will described 1st electronic unit after described supporting surface is separately, will be supported by described supporting surface using described 2nd mounting head Profile 2nd electronic unit bigger than described 1st electronic unit, from the described in described supporting surface segregation ratio the 1st apart from the short the 2nd away from From；In the state of maintaining the described 1st mounting head and described 2nd mounting head relative position with respect to described support member, make Described 1st electronic unit and described 2nd electronic unit are from the position movement relative with described supporting surface to the table with described substrate The relative position in face；Making, described 1st electronic unit and described 2nd electronic unit are mobile extremely relative with the surface of described substrate After position, using described 2nd mounting head, described 2nd electronic unit is installed on described substrate；And using the described 2nd peace After described 2nd electronic unit is installed on described substrate by dress head, using described 1st mounting head, described 1st electronic unit is pacified It is loaded on described substrate.

According to the 3rd mode of the present invention, in the 2nd big ministry of electronics industry of the 1st little electronic unit of overall dimensions and overall dimensions Part in the case of electronic part feeder supply, based on part dimension data and mounting head sized data, by the 1st electronics Part utilize the 1st mounting head from supporting surface separate the 1st distance afterwards, by the 2nd electronic unit utilize the 2nd mounting head from supporting surface with Than the 1st apart from the 2nd short distance separation, thus, though the central shaft of the 1st electronic unit and at a distance of this central shaft farthest the 1st The distance between most external of electronic unit, the central shaft of the 2nd electronic unit and at a distance of the 2nd farthest electronic unit of this central shaft The distance between most external sum be more than the distance between the central shaft of the 1st mounting head and the central shaft of the 2nd mounting head, also can Enough avoid the interference between the 1st electronic unit and the 2nd electronic unit, by the 1st ministry of electronics industry supplying from electronic part feeder Part and the 2nd electronic unit are delivered to substrate together.Therefore, suppression 1 conveying to substrate from electronic part feeder The situation that the quantity of the electronic unit that can convey in action tails off, conveys electronic unit as much as possible, and therefore suppression produces The reduction of rate.In addition, maintain the 1st mounting head and the 2nd mounting head with respect to the relative position of support member in the state of, make the 1 electronic unit and the 2nd electronic unit from the position movement relative with supporting surface to the position relative with the surface of substrate, thus, it is possible to Enough avoid the interference between the 1st electronic unit and the 2nd electronic unit, and by the 1st electronic unit and the 2nd electronic unit from the ministry of electronics industry Part feedway is delivered to substrate.In addition, after the 2nd electronic unit is installed on substrate using the 2nd mounting head, using the 1st 1st electronic unit is installed on substrate by mounting head, thus, it is possible to avoid the interference between the 1st electronic unit and the 2nd electronic unit, And the 1st electronic unit and the 2nd electronic unit are installed on substrate.

The effect of invention

According to mode of the present invention, provide a kind of electronic component mounting apparatus and electronic component mounting method, itself it can be avoided that Electronic unit interference each other, and electronic unit as much as possible is delivered to substrate, suppression life from electronic part feeder The reduction of yield.

Brief description

Fig. 1 is the schematic diagram of an example representing the electronic component mounting apparatus involved by the 1st embodiment.

Fig. 2 is the oblique view of an example showing schematically the mounting head unit involved by the 1st embodiment.

Fig. 3 is the side view of an example representing the mounting head unit involved by the 1st embodiment.

Fig. 4 is the functional block diagram of an example representing the electronic component mounting apparatus involved by the 1st embodiment.

Fig. 5 is to represent the mounting head involved by the 1st embodiment and the electronic unit from electronic part feeder supply Between relation schematic diagram.

Fig. 6 is the flow chart of an example representing the electronic component mounting method involved by the 1st embodiment.

Fig. 7 is the schematic diagram of an example representing the action of electronic component mounting apparatus involved by the 1st embodiment.

Fig. 8 is the schematic diagram of an example representing the action of electronic component mounting apparatus involved by the 1st embodiment.

Fig. 9 is the schematic diagram of an example representing the action of electronic component mounting apparatus involved by the 1st embodiment.

Figure 10 is the signal of an example representing the action of electronic component mounting apparatus involved by the 1st embodiment Figure.

Figure 11 is the signal of an example representing the action of electronic component mounting apparatus involved by the 1st embodiment Figure.

Figure 12 is the signal of an example representing the action of electronic component mounting apparatus involved by the 1st embodiment Figure.

Figure 13 is the schematic diagram representing the example of the 1st mounting head and the 2nd mounting head involved by the 2nd embodiment.

The explanation of label

1 electronic component mounting apparatus

2 base board delivery devices

2G guide member

2H substrate holder

3 electronic part feeders

4 mobile systems

5 replacing suction nozzle holding meanss

6 chambers

7 control devices

8 Y-axis driving means

8G guide member

9 X-axis driving means

9G guide member

10 mounting heads

10A the 1st mounting head

10B the 2nd mounting head

11 suction nozzles

12 support members

13 suction nozzle axles

14 retainers

15 Z axis driving means

16 θ Z driving means

17 ball-screws

18 part detection devices

18A injection part

18B light accepting part

19 storage devices

20 input equipment

30 most external

31 flange parts

32 helical springs

71 part dimension data acquisition

72 mounting head sized data obtaining sections

73 interference detection units

74 mounting head control units

100 mounting head unit

AX central shaft

C electronic unit

P substrate

Specific embodiment

Below, referring to the drawings, embodiment involved in the present invention is illustrated, but the present invention is not limited to this. The element of the embodiment being illustrated below can be appropriately combined.In addition, sometimes not using the element of a part. In addition, in the element of the embodiment being described below, comprise that those skilled in the art can be readily apparent that will Key element in the so-called equivalency range such as plain, substantially the same key element.

In the following description, set XYZ orthogonal coordinate system, with reference to this XYZ orthogonal coordinate system, while to each portion Position relationship illustrates.Parallel with the 1st axle direction in predetermined surface is set to X-direction (the 1st direction of principal axis), by predetermined surface The interior direction parallel with the 2nd axle being orthogonal to the 1st axle is set to Y direction (the 2nd direction of principal axis), by be orthogonal to the of predetermined surface The parallel direction of 3 axles is set to Z-direction (the 3rd direction of principal axis).Rotation (inclination) direction centered on X-axis (the 1st axle) is set to θ X-direction, rotation (inclination) direction centered on Y-axis (the 2nd axle) is set to θ Y-direction, by the rotation centered on Z axis (the 3rd axle) Turn (inclination) direction and be set to θ Z-direction.Predetermined surface comprises X/Y plane.X/Y plane comprises X-axis and Y-axis.In the present embodiment, advise It is parallel for determining face with horizontal plane.Z-direction is vertical (above-below direction).Z axis are orthogonal with X/Y plane.

＜ the 1st embodiment ＞

1st embodiment is illustrated.Fig. 1 is the electronic component mounting apparatus 1 representing involved by present embodiment The schematic diagram of one example.Fig. 2 is to show schematically the installation that the electronic component mounting apparatus 1 involved by present embodiment have The oblique view of one example of head unit 100.Fig. 3 is an example representing the mounting head unit 100 involved by present embodiment The side view of son.

Electronic unit C is installed on substrate P by electronic component mounting apparatus 1.Electronic component mounting apparatus 1 are also referred to as surface Erecting device 1 or chip mounter 1.Electronic unit C can be the lead-type electronic-part (insert type electronic unit) with lead, It can be the chip-type electronic component (mounting type electronic unit) without lead.Lead-type electronic-part passes through to substrate P Opening inserts lead and is installed on substrate P.Chip-type electronic component is installed on substrate P by carrying to substrate P.

Electronic component mounting apparatus 1 possess：Base board delivery device 2, its conveying substrate P；Electronic part feeder 3, its Electronic unit C can be supplied；Mounting head unit 100, it has multiple mounting heads 10, and electronic unit C is supplied from electronic unit Device 3 is delivered to substrate P；Mobile system 4, it is mobile by the suction nozzle 11 of mounting head 10；Change suction nozzle holding meanss 5, it is to entering The suction nozzle 11 that row is changed is kept；Chamber 6, it houses at least a portion of electronic component mounting apparatus 1；And control device 7, it controls electronic component mounting apparatus 1.

Base board delivery device 2 conveys to the substrate P that will be mounted electronic unit C.Base board delivery device 2 comprises：Draw Lead part 2G, it guides substrate P along Y direction；And actuator, it can make to keep the substrate holder 2H of substrate P Move along Z-direction.Substrate P can be guided by guide member 2G and move along Y direction.Base board delivery device 2 makes substrate P extremely Move along Y direction less.Additionally, base board delivery device 2 can also make substrate P along X-axis, Y-axis, Z axis, θ X, θ Y and θ Z this six Direction is moved.At least a portion on the surface of substrate P installs electronic unit C.

Base board delivery device 2 can make in the way of the surface of substrate P is relative with least a portion of mounting head unit 100 Substrate P moves.Substrate P is supplied to electronic component mounting apparatus 1 from substrate feeding device (not shown).From substrate feeding device The substrate P of supply is transported to the assigned position of guide member 2G, is kept by substrate holder 2H.Substrate holder 2H with The surface mode parallel with X/Y plane of substrate P is made to keep substrate P.The mounting head 10 of mounting head unit 100 is being configured at its rule The surface mounted electronic parts C positioning the substrate P put installs.After electronic unit C is installed in substrate P, this substrate P is passed through Base board delivery device 2 is delivered to the device of next operation.

Electronic part feeder 3 supplies electronic unit C to mounting head 10.Electronic part feeder 3 supports multiple Electronic unit C.Mounting head unit 100 can be in the electronic unit drainage area supplying electronic unit C from electronic part feeder 3 Move between the installation region that domain and substrate P are configured.Electronic unit supply area and installation region are different regions.? In present embodiment, electronic part feeder 3 is configured at the both sides (+X side of the transport path of the substrate P of base board delivery device 2 And-X side).The electronic unit C supplying from electronic part feeder 3 is installed on substrate P by mounting head 10.Supply from electronic unit Electronic unit C to device 3 supply can be electronic unit of the same race or different electronic units.

Change suction nozzle holding meanss 5 and keep multiple suction nozzles 11.Change suction nozzle holding meanss 5 keep multiple with respect to mounting head The suction nozzle 11 that 10 are changed.By changing suction nozzle holding meanss 5, the suction nozzle 11 of mounting head 10 to be installed on is changed.Peace The suction nozzle 11 that dress 10 is installed by it keeps electronic unit C.

As shown in Figures 2 and 3, mounting head unit 100 has：Multiple mounting heads 10, they configure along X-direction；And Support member 12, it supports multiple mounting heads 10.Mounting head 10 has：Suction nozzle 11, it releasably keeps electronic unit C；With And suction nozzle axle 13, it supports suction nozzle 11.Mounting head unit 100 has：Retainer 14, it keeps suction nozzle axle 13；And supporting part Part 12, it supports retainer 14.

Multiple mounting heads 10 are configured to string along X-direction.In the present embodiment, mounting head 10 arranges multiple (4). Multiple mounting heads 10 are respectively provided with the suction nozzle 11 releasably keeping electronic unit C.Suction nozzle 11 is the absorption of absorption electronic unit C Suction nozzle, is configured at the bottom of suction nozzle axle 13.It is provided with the adsorption hole attracting gas in the bottom of suction nozzle 11.In suction nozzle 11 In the state of bottom contacts with electronic unit C, by attracting gas from adsorption hole, so that suction nozzle 11 keeps electronic unit C. In addition, by stopping attracting gas from adsorption hole, thus electronic unit C is released from suction nozzle 11.Additionally, suction nozzle 11 can also be The grasping suction nozzle that electronic unit C clamping is kept.

Mobile system 4 has：Y-axis driving means 8, it makes mounting head unit 100 move along Y direction；X-axis driving means 9, it makes mounting head unit 100 move along X-direction；Z axis driving means 15, it makes mounting head 10 move along Z-direction；And θ Z driving means 16, it makes mounting head 10 mobile (rotation) along θ Z-direction.

Y-axis driving means 8 have：Guide member 8G, mounting head unit 100 is guided by it along Y direction；And activate Device, it produces for making mounting head unit 100 along the power of Y direction movement.X-axis driving means 9 have：Guide member 9G, Guide member 8G is guided by it along X-direction；And actuator, it produces for making guide member 9G along X-direction movement Power.Moved along X-direction by the guide member 8G that X-axis driving means 9 make Y-axis driving means 8, thus make by guide member The mounting head unit 100 that 8G supports is moved along X-direction together with guide member 8G.

Y-axis driving means 8 are connected with support member 12.Support member 12 is by the guide member 8G of Y-axis driving means 8 along Y Direction of principal axis guides.So that support member 12 is moved along Y direction by Y-axis driving means 8, thus, supported by support member 12 Multiple mounting heads 10 are moved along Y direction together with support member 12.By X-axis driving means 9 via Y-axis driving means 8 Guide member 8G makes support member 12 along X-direction movement, the multiple mounting heads 10 thus being supported by support member 12 and support Part 12 moves along X-direction together.

Z axis driving means 15 are supported by support member 12, so that retainer 14 is moved along Z-direction.Z axis driving means 15 are wrapped Motivation containing electric rotating.Z axis driving means 15 are connected with retainer 14 via ball-screw 17, so that retainer 14 is moved along Z-direction Dynamic.If retainer 14 moves along Z-direction, the mounting head 10 being kept by this retainer 14 is together with retainer 14 along Z axis Direction is moved.

θ Z driving means 16 are supported by retainer 14, make suction nozzle axle 13 mobile (rotation) along θ Z-direction.θ Z driving means 16 Comprise electric rotating motivation.θ Z driving means 16 are connected with the upper end of suction nozzle axle 13, so that suction nozzle axle 13 is moved along θ Z-direction.If Suction nozzle axle 13 moves along θ Z-direction, then the suction nozzle 11 being supported by this suction nozzle axle 13 is moved along θ Z-direction together with suction nozzle axle 13.

It is respectively directed to multiple mounting head 10 configuration retainers 14, Z axis driving means 15 and θ Z driving means 16.Multiple installations 10 (suction nozzles 11) pass through the work of Z axis driving means 15 and θ Z driving means 16, can be with respect to support member 12 respectively along Z Direction of principal axis and this 2 directions of θ Z-direction are moved.

In the present embodiment, suction nozzle 11 can be made to move along this 4 directions of X-axis, Y-axis, Z axis and θ Z by mobile system 4 Dynamic.Y-axis driving means 8 and X-axis driving means 9 are as the installation that can make support member 12 movement along X-direction and Y direction Head driving apparatus work.Z axis driving means 15 and θ Z driving means 16 are as can make mounting head with respect to support member 12 10 (suction nozzles 11) work along the suction nozzle driving means of Z-direction and θ Z-direction movement.

As shown in figure 3, mounting head unit 100 has the part inspection that the electronic unit C being kept by suction nozzle 11 is detected Survey device 18.Part detection device 18 is optically detected to electronic unit C using detection light LB.Part detection device 18 by Support member 12 supports.Support member 12 is made to move along X-direction and Y direction by X-axis driving means 9 and Y-axis driving means 8 Dynamic, thus moved together with support member 12 by the part detection device 18 that this support member 12 supports.

Part detection device 18 detects to the state of the electronic unit C being kept by suction nozzle 11.The state of electronic unit C At least one of the shape comprising electronic unit C and the attitude of electronic unit C that kept by suction nozzle 11.Part detection device 18 Comprise：Injection part 18A, it contains the light source projecting detection light LB；And light accepting part 18B, it contains can be to from injection part 18A At least a portion of detection light LB projecting carries out the photo detector of light.The light source of injection part 18A can be used as detection light LB And produce laser.Light accepting part 18B is configured at the position relative with injection part 18A.In the Z-axis direction, injection part 18A and light accepting part 18B configures identical position (highly).Part detection device 18 is to the electronic unit C irradiating and detecting light being kept by suction nozzle 11 LB, detects to the state of electronic unit C.

Injection part 18A and light accepting part 18B configures along Y direction.Injection part 18A and X/Y plane abreast project detection light LB.In the present embodiment, injection part 18A projects detection light LB in the way of parallel with Y-axis.

Fig. 4 is the functional block diagram of an example representing the electronic component mounting apparatus 1 involved by present embodiment.Control Device 7, to mounting head 10 and mobile system 4 output control signal, controls mounting head 10 and mobile system 4.Storage device 19 and defeated Enter device 20 to be connected with control device 7.

Control device 7 comprises computer system.Control device 7 comprises such as CPU (Central Processing Unit) Processor.In addition, control device 7 comprise can mounting head 10, mobile system 4, storage device 19 and input equipment 20 it Between implement signal input and output input/output interface circuit.Storage device 19 comprises such as ROM (Read Only ) or the internal storage of RAM (Random Access Memory) and the external memory storage of such as hard disk unit Memory.Input Device 20 comprises the input equipment being operated by operator.Input equipment 20 comprises at least one of keyboard, mouse and touch panel.

The processor of control device 7, according to the computer program being stored in storage device 19, generates for controlling electronics The control signal of apparatus for mounting component 1.The various functions of control device 7 are by computing device.

Control device 7 has：Part dimension data acquisition 71, its obtaining parts sized data, this part dimension data Represent the overall dimensions of the electronic unit C from electronic part feeder 3 supply；Mounting head sized data obtaining section 72, it takes Obtain mounting head sized data, this mounting head sized data represents the central shaft AX of mounting head 10 and at a distance of the farthest peace of central shaft AX The distance between most external 30 of dress 10 i.e. maximum overall dimensions of mounting head 10 and along 2 adjacent mounting heads of X-direction 10 distance；And mounting head control unit 74, it is based on part dimension data and mounting head sized data, and output is to mounting head 10 And the control signal that mobile system 4 is controlled.

In addition, control device 7 has interference detection unit 73, this interference detection unit 73 is based on part dimension data and mounting head Sized data, judges whether electronic unit C is interfered with other electronic units C.

Fig. 5 is to represent the mounting head 10 involved by present embodiment and the ministry of electronics industry from electronic part feeder 3 supply The schematic diagram of the relation between part C.Mounting head 10 configures multiple along X-direction.The construction of multiple mounting heads 10 and size essence Upper identical.Multiple mounting heads 10 are supported by support member 12.The relative position of multiple mounting heads 10 of X-direction and Y direction Substantially do not change.By comprising the suction nozzle driving means of Z axis driving means 15 and θ Z driving means 16, make Z-direction and θ Z The relative position change of multiple mounting heads 10 in direction.

In the following description, 1 mounting head 10 of certain in the multiple mounting heads 10 that will configure along X-direction suitably claims For the 1st mounting head 10A, the mounting head 10 being configured at the adjacent of the 1st mounting head 10A in the X-axis direction is properly termed as the 2nd Mounting head 10B.In addition, the suction nozzle 11 of the 1st mounting head 10A is properly termed as suction nozzle 11A, by the suction nozzle 11 of the 2nd mounting head 10B It is properly termed as suction nozzle 11B.

The construction of the 1st mounting head 10A and the construction of size and the 2nd mounting head 10B and size are substantially the same.1st installation Head 10A and the 2nd mounting head 10B are respectively provided with central shaft AX.Central shaft AX is parallel with Z axis.

1st mounting head 10A and the 2nd mounting head 10B are respectively provided with flange part 31.Outside the flange part 31 of the 1st mounting head 10A Surface is the most external 30 at a distance of the 1st farthest mounting head 10A of central shaft AX.The outer surface of the flange part 31 of the 2nd mounting head 10B It is the most external 30 at a distance of the 2nd farthest mounting head 10B of central shaft AX.In mounting head 10 (the 1st mounting head 10A and the 2nd mounting head In in X/Y plane in 10B), overall dimensions the best part is most external 30.

Suction nozzle 11A protrudes towards -Z direction from the flange part 31 of the most external 30 comprising the 1st mounting head 10A.In X/Y plane Suction nozzle 11A overall dimensions be less than the 1st mounting head 10A most external 30 overall dimensions (maximum overall dimensions).Suction nozzle 11B Protrude towards -Z direction from the flange part 31 of the most external 30 comprising the 2nd mounting head 10B.The profile of the suction nozzle 11B in X/Y plane It is smaller in size than the overall dimensions (maximum overall dimensions) of the most external 30 of the 2nd mounting head 10B.

Electronic part feeder 3 is configured at the lower section (- Z side) of the 1st mounting head 10A and the 2nd mounting head 10B.The ministry of electronics industry Part feedway 3 supplies multiple electronic unit C.Electronic part feeder 3 have multiple electronic unit C are supported Support face 3S.Supporting surface 3S is substantial parallel with X/Y plane.The suction nozzle 11A of the 1st mounting head 10A is from comprising the 1st mounting head 10A Outside 30 flange part 31 protrudes towards the supporting surface 3S of electronic part feeder 3.The suction nozzle 11B of the 2nd mounting head 10B is from bag The flange part 31 of the most external 30 containing the 2nd mounting head 10B protrudes towards the supporting surface 3S of electronic part feeder 3.

Electronic part feeder 3 can supply the different multiple electronic unit C of overall dimensions.As shown in figure 5, the ministry of electronics industry Part feedway 3 can supply the 1st electronic unit Ca and overall dimensions are more than the 2nd electronic unit Cb of the 1st electronic unit Ca.

Part dimension data acquisition 71 obtaining parts sized data, this part dimension data represents from electronic unit supply The overall dimensions (overall dimensions of the 1st electronic unit Ca and the 2nd electronic unit Cb) of the electronic unit C of device 3 supply.

The overall dimensions of the 1st electronic unit Ca comprise apart from Ra, and this is apart from the central shaft CXa that Ra is the 1st electronic unit Ca With in X/Y plane the distance between at a distance of the farthest most external of the 1st electronic unit Ca of central shaft CXa.In addition, the 1st ministry of electronics industry The overall dimensions of part Ca comprise height Ha, this height Ha be the 1st electronic unit Ca in Z-direction upper and lower surface it Between distance.

The overall dimensions of the 2nd electronic unit Cb comprise apart from Rb, and this is apart from the central shaft CXb that Rb is the 2nd electronic unit Cb With in X/Y plane the distance between at a distance of the farthest most external of the 2nd electronic unit Cb of central shaft CXb.In addition, the 2nd ministry of electronics industry The overall dimensions of part Cb comprise height Hb, this height Hb be the 2nd electronic unit Cb in Z-direction upper and lower surface it Between distance.

In the present embodiment, the 2nd electronic unit Cb apart from Rb be more than the 1st electronic unit Ca apart from Ra.2nd electronics The height Hb of part Cb be more than (higher than) the height Ha of the 1st electronic unit Ca.

Mounting head sized data obtaining section 72 obtains mounting head sized data, and this mounting head sized data represents mounting head 10 Central shaft AX and at a distance of the farthest mounting head of central shaft AX 10 the i.e. mounting head 10 of the distance between most external 30 maximum outer Shape size and along the distance between the 1st adjacent mounting head 10A of X-direction and the 2nd mounting head 10B.

The maximum overall dimensions of the 1st mounting head 10A comprise apart from F, this apart from F be the 1st mounting head 10A central shaft AX and At a distance of the distance between farthest most external 30 of the 1st mounting head 10A of the central shaft AX of the 1st mounting head 10A in X/Y plane.

The maximum overall dimensions of the 2nd mounting head 10B comprise apart from F, this apart from F be the 2nd mounting head 10B central shaft AX and At a distance of the distance between farthest most external 30 of the 2nd mounting head 10B of the central shaft AX of the 2nd mounting head 10B in X/Y plane.

The distance between 1st mounting head 10A and the 2nd mounting head 10B comprise apart from D, and this is apart from the 1st peace that D is X-direction The distance between central shaft AX of the central shaft AX of dress head 10A and the 2nd mounting head 10B.In addition, the 1st mounting head 10A and the 2nd peace The distance between dress head 10B comprises size G, and this size G is that the most external the 30 and the 2nd of the 1st mounting head 10A of X-direction is installed Gap between the most external 30 of head 10B.

As shown in figure 5, the most external 30 (lower surface of flange part 31) of the 1st mounting head 10A of Z-direction and suction nozzle 11A The distance between leading section be L.Similarly, the most external 30 (following table of flange part 31 of the 2nd mounting head 10B of Z-direction Face) and the distance between the leading section of suction nozzle 11B be L.In the present embodiment, in suction nozzle 11 (suction nozzle 11A and suction nozzle 11B) Surrounding configuration helical spring 32.By helical spring 32, suction nozzle 11 keeps acting on suction nozzle 11 and electronic unit during electronic unit C The impact of C is alleviated.

Mounting head control unit 74 is based on part dimension data and mounting head sized data to the 1st mounting head 10A, the 2nd installation Head 10B and mobile system 4 export the 1st control signal, so that implementing to be propped up by the supporting surface 3S of electronic part feeder 3 1st electronic unit Ca of support utilizes the 1st mounting head 10A after the detached action of supporting surface 3S, and enforcement will be pacified by electronic unit The 2nd electronic unit Cb that the supporting surface 3S of assembling device 3 supports utilizes the 2nd mounting head 10B from the detached action of supporting surface 3S.Separately Outward, mounting head control unit 74 exports the 1st control signal, so that between the 1st electronic unit Ca and supporting surface 3S of Z-direction Distance is more than the distance between the 2nd electronic unit Cb and supporting surface 3S.

Part dimension data and mounting head sized data are stored in storage device 19.Part dimension data acquisition 71 is from depositing Storage device 19 obtaining parts sized data.Mounting head sized data obtaining section 72 obtains from storage device 19 and installs cephalic module According to.In addition it is also possible to be operator's operation input equipment 20, input block sized data and mounting head sized data.Part chi Very little data acquisition 71 can also be from input equipment 20 obtaining parts sized data.Mounting head sized data obtaining section 72 can also Obtain mounting head sized data from input equipment 20.

1st mounting head 10A keep the 1st electronic unit Ca in the case of so that the central shaft AX of the 1st mounting head 10A and The consistent state of the central shaft CXa of the 1st electronic unit Ca, keeps the upper surface of the 1st electronic unit Ca by suction nozzle 11A.That is, 1 mounting head 10A keeps the center of the upper surface of the 1st electronic unit Ca by suction nozzle 11A.

2nd mounting head 10B keep the 2nd electronic unit Cb in the case of so that the central shaft AX of the 2nd mounting head 10B and The consistent state of the central shaft CXb of the 2nd electronic unit Cb, keeps the upper surface of the 2nd electronic unit Cb by suction nozzle 11B.That is, 2 mounting heads 10B keep the center of the upper surface of the 2nd electronic unit Cb by suction nozzle 11B.

In Figure 5, apart from Ra and apart from Rb sum be less than or equal to apart from D when, even with the 1st mounting head 10A Suction nozzle 11A keeps the action of the 1st electronic unit Ca and keeps the 2nd electronic unit Cb to move using the suction nozzle 11B of the 2nd mounting head 10B Implement simultaneously, also can avoid the interference (contact) between the 1st electronic unit Ca and the 2nd electronic unit Cb.

Apart from Ra and apart from Rb sum be more than apart from D when, if using the 1st mounting head 10A suction nozzle 11A keep the 1st The action of electronic unit Ca and using the 2nd mounting head 10B suction nozzle 11B keep the 2nd electronic unit Cb action implement simultaneously, then The probability that 1st electronic unit Ca and the 2nd electronic unit Cb interferes (contact) uprises.

On the other hand, even if being more than apart from D apart from Ra with apart from Rb sum, adjustment using the 1st mounting head 10A keep by The 1st electronic unit Ca that support face 3S supports the timing that rises and keep being supported by supporting surface 3S using the 2nd mounting head 10B 2nd electronic unit Cb the timing rising, thus can avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb (to connect Touch).

Interfere detection unit 73 to be based on part dimension data and mounting head sized data, the description below is judged, i.e. be logical Cross and implementing to implement the 1st electronic unit Ca after the detached action of supporting surface 3S using the 2nd peace using the 1st mounting head 10A Dress head 10B is by the 2nd electronic unit Cb from the detached action of supporting surface 3S, if can avoid the 1st electronic unit Ca and the 2nd ministry of electronics industry Interference between part Cb.

Mounting head control unit 74 exports the 1st control signal, so that being judged to avoid doing by interfering detection unit 73 In the case of relating to, implementing to utilize the 1st mounting head 10A by the 1st electronic unit Ca after the detached action of supporting surface 3S, implementing Using the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S.

Next, with reference to Fig. 6 to Figure 12, electronic unit C is installed on substrate P to using electronic component mounting apparatus 1 Method illustrates.Fig. 6 is the flow chart of an example representing the electronic component mounting method involved by present embodiment.Figure 7 to Figure 12 is the schematic diagram of an example representing the action of electronic component mounting apparatus 1 involved by present embodiment.

Determine to carry out the plan (step SP1) of installation process using mounting head unit 100.

Part dimension data acquisition 71 obtaining parts sized data, this part dimension packet contains from electronic unit supply Device 3 supply electronic unit C apart from R (Ra, Rb) and height H (Ha, Hb).Mounting head sized data obtaining section 72 obtains bag Containing apart from F and apart from D in interior mounting head sized data (step SP2).

Interfere detection unit 73 based on the part dimension data being obtained by part dimension data acquisition 71 with by mounting head chi The mounting head sized data that very little data acquisition 72 obtains, judges to the description below, i.e. even if implement to utilize the 1st simultaneously Mounting head 10A by the 1st electronic unit Ca from the detached action of supporting surface 3S and using the 2nd mounting head 10B by the 2nd electronic unit Cb From the detached action of supporting surface 3S, if also can avoid the interference (step between the 1st electronic unit Ca and the 2nd electronic unit Cb SP3).

Apart from Ra with when being less than or equal to apart from D apart from Rb sum, even if implement using the 1st mounting head 10A simultaneously Suction nozzle 11A keeps the action of the 1st electronic unit Ca and keeps the 2nd electronic unit Cb's using the suction nozzle 11B of the 2nd mounting head 10B Action, also can avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb.Detection unit 73 is interfered to be based on part dimension Data and mounting head sized data, judge to the description below, i.e. whether can avoid the 1st electronic unit Ca and the 2nd Interference between electronic unit Cb, implements suction nozzle 11A using the 1st mounting head 10A to being supported by supporting surface 3S simultaneously The holding action of the 1st electronic unit Ca and using the 2nd mounting head 10B suction nozzle 11B to the 2nd ministry of electronics industry being supported by supporting surface 3S The holding action of part Cb.

In step SP3, it is being judged to if implemented the 1st electronic unit Ca using the 1st mounting head 10A from support simultaneously The detached action of face 3S and using the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S, then the 1st electronics Part Ca and the 2nd electronic unit Cb can interfere in the case of (step SP3：No), detection unit 73 is interfered to be based on part dimension Data and mounting head sized data, judge to the description below, i.e. by implementing to utilize the 1st mounting head 10A electric by the 1st Subassembly Ca, after the detached action of supporting surface 3S, is implemented the 2nd electronic unit Cb using the 2nd mounting head 10B from supporting surface The detached action of 3S, if the interference (step SP4) between the 1st electronic unit Ca and the 2nd electronic unit Cb can be avoided.

Even if apart from Ra and being more than apart from D apart from Rb sum, adjustment keeps the 1st using the suction nozzle 11A of the 1st mounting head 10A The action of electronic unit Ca and using the 2nd mounting head 10B suction nozzle 11B keep the 2nd electronic unit Cb action order, thus It is possible to avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb.Detection unit 73 is interfered to be based on part dimension data With mounting head sized data, the description below is judged, i.e. adjustment using the 1st mounting head 10A suction nozzle 11A to by supporting Face 3S support the holding action of the 1st electronic unit Ca and supported to by supporting surface 3S using the suction nozzle 11B of the 2nd mounting head 10B The holding action of the 2nd electronic unit Cb order, thus whether can avoid the 1st electronic unit Ca and the 2nd electronic unit Cb it Between interference.

In step SP4, it is being judged to implement to separate the 1st electronic unit Ca from supporting surface 3S using the 1st mounting head 10A Action after, implement using the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S, thus can avoid (step SP4 in the case of interference between 1st electronic unit Ca and the 2nd electronic unit Cb：No), mounting head control unit 74 is to peace Dress 10 (the 1st mounting head 10A and the 2nd mounting head 10B) and mobile system 4 export the 1st control signal, so that implementing to utilize 1st mounting head 10A will be separated from supporting surface 3S by the 1st electronic unit Ca that the supporting surface 3S of electronic part feeder 3 supports Action after, implement using the 2nd mounting head 10B by the 2nd electronic unit Cb being supported by supporting surface 3S from supporting surface 3S separate Action.By exporting the 1st control signal, thus being kept by the suction nozzle 11A of the 1st mounting head 10A in the 1st little electronic unit Ca And after rising, the 2nd big electronic unit Cb is kept by the suction nozzle 11B of the 2nd mounting head 10B and rises (step SP5).

Fig. 7, Fig. 8 and Fig. 9 are the schematic diagrams of the action representing step SP5.Mounting head control unit 74 is to X-axis driving means 9 And at least one of Y-axis driving means 8 is controlled, the position of the mounting head unit 100 (support member 12) in adjustment X/Y plane Put, so that the central shaft CXa of the central shaft AX and the 1st electronic unit Ca of the 1st mounting head 10A is consistent.In the 1st mounting head 10A Central shaft AX and the 1st electronic unit Ca central shaft CXa consistent after, mounting head control unit 74 control Z axis driving means 15, Make the 1st mounting head 10A mobile (decline) along -Z direction with respect to support member 12.Thus, as shown in fig. 7, in the 1st mounting head In the state of the central shaft CXa of the central shaft AX of 10A and the 1st electronic unit Ca is consistent, the 1st ministry of electronics industry that supported by supporting surface 3S Part Ca is kept by the suction nozzle 11A of the 1st mounting head 10A.

After the 1st electronic unit Ca being supported by supporting surface 3S is kept by the suction nozzle 11A of the 1st mounting head 10A, mounting head Control unit 74 controls Z axis driving means 15, makes the 1st mounting head 10A mobile (rising) along +Z direction.Thus, propped up by supporting surface 3S 1st electronic unit Ca of support separates from supporting surface 3S.

The 1st electronic unit Ca with by the 1st mounting head 10A keep state from supporting surface 3S separate after, mounting head control Portion 74 processed is controlled at least one of X-axis driving means 9 and Y-axis driving means 8, the mounting head unit in adjustment X/Y plane The position of 100 (support members 12), so that the central shaft CXb of the central shaft AX and the 2nd electronic unit Cb of the 2nd mounting head 10B Unanimously.After the central shaft CXb of the central shaft AX and the 2nd electronic unit Cb of the 2nd mounting head 10B is consistent, mounting head control unit 74 control Z axis driving means 15, make the 2nd mounting head 10B mobile (decline) along -Z direction with respect to support member 12.Thus, such as Shown in Fig. 8, in the state of the central shaft CXb of the central shaft AX and the 2nd electronic unit Cb of the 2nd mounting head 10B is consistent, by supporting The 2nd electronic unit Cb that face 3S supports is kept by the suction nozzle 11B of the 2nd mounting head 10B.

After the 2nd electronic unit Cb being supported by supporting surface 3S is kept by the suction nozzle 11B of the 2nd mounting head 10B, mounting head Control unit 74 controls Z axis driving means 15, makes the 2nd mounting head 10B mobile (rising) along +Z direction.Thus, as shown in figure 9, by The 2nd electronic unit Cb that supporting surface 3S supports separates from supporting surface 3S.

As shown in figure 9, mounting head control unit 74 exports the 1st control signal, so that the 1st electronic unit Ca of Z-direction Lower surface more than the 2nd electronic unit Cb of lower surface and the distance between supporting surface 3S and the distance between supporting surface 3S.That is, Mounting head control unit 74 controls Z axis driving means 15, so that being configured at by the 1st electronic unit Ca that the 1st mounting head 10A keeps The top of the 2nd electronic unit Cb being kept by the 2nd mounting head 10B.Thus, the 1st electronic unit Ca being supported by supporting surface 3S from Supporting surface 3S separates the 1st distance, and the 2nd electronic unit Cb being supported by supporting surface 3S is from supporting surface 3S segregation ratio the 1st apart from short 2nd distance.

As shown in figure 9, mounting head control unit 74 exports the 1st control signal, so that the 1st mounting head 10A of Z-direction The distance between most external 30 and supporting surface 3S A1, the suction nozzle 11B's of the 2nd mounting head 10B more than holding the 2nd electronic unit Cb The distance between leading section (upper surface of the 2nd electronic unit Cb) and supporting surface 3S A2.As shown in figure 9, in the present embodiment, Mounting head control unit 74 exports the 1st control signal, so that the lower surface of the 1st electronic unit Ca being kept by the 1st mounting head 10A It is configured at the top of the upper surface of the 2nd electronic unit Cb being kept by the 2nd mounting head 10B.

Separate, kept by the 2nd mounting head 10B from supporting surface 3S in the 1st electronic unit Ca being kept by the 1st mounting head 10A The 2nd electronic unit Cb from supporting surface 3S separate after, mounting head control unit 74 to mobile system 4 export the 4th control signal, with So that in the state of the relative position between the 1st mounting head 10A maintaining Z-direction and the 2nd mounting head 10B, the 1st ministry of electronics industry Part Ca and the 2nd electronic unit Cb is from the position movement relative with supporting surface 3S to the position relative with the surface of substrate P.By defeated Go out the 4th control signal, thus maintain the suction nozzle 11B of the suction nozzle 11A of the 1st mounting head 10A and the 2nd mounting head 10B with respect to In the state of the relative position of support part part 12, the 1st electronic unit Ca and the 2nd electronic unit Cb are relative with supporting surface 3S from comprising Position is transported to, in interior electronic unit supply area, the installation region comprising the position relative with the surface of substrate P.

Figure 10 is to represent the 1st electronic unit Ca being kept by the 1st mounting head 10A and the by the 2nd mounting head 10B holding the 2nd The mobile figure to the state of position relative with the surface of substrate P of electronic unit Cb.

It is supported by part detection device 18 in support member 12.Relative between part detection device 18 and support member 12 Position is fixed.The surface of the substrate P of Z-direction and between detection light LB that the injection part 18A of part detection device 18 projects Distance be A.

Part detection device 18 by the 2nd mounting head 10B keep the 2nd electronic unit Cb separate with substrate P in the state of, To the 2nd electronic unit Cb irradiating and detecting light LB being kept by the 2nd mounting head 10B, the state of the 2nd electronic unit Cb is detected (step SP6).

Mounting head control unit 74, in the state of projecting detection light LB from injection part 18A, controls Z axis driving means 15, makes The 2nd electronic unit Cb being kept by the 2nd mounting head 10B moves along Z-direction with respect to detection light LB.In addition, mounting head controls Portion 74, in the state of projecting detection light LB from injection part 18A, controls θ Z driving means 16, makes by the 2nd mounting head 10B holding 2nd electronic unit Cb rotates along θ Z-direction.By make the 2nd electronic unit Cb along Z-direction and θ Z-direction mobile while to 2nd electronic unit Cb irradiating and detecting light LB, thus accurately detect to the state of the 2nd electronic unit Cb.

After the state of the 2nd electronic unit Cb being detected using detection light LB, mounting head control unit 74 controls shifting Dynamic system 4, makes the 2nd electronic unit Cb being kept by the 2nd mounting head 10B mobile (decline) along -Z direction.Thus, as Figure 11 institute Show, the 2nd electronic unit Cb is installed on substrate P.

As shown in figure 11, in the state of the 1st electronic unit Ca is separated with predetermined distance from the surface of substrate P, the 2nd electronics Part Cb is installed in substrate P.Predetermined distance comprises apart from A.Part detection device 18 with the 2nd electronic unit Cb is installed on base The action of plate P concurrently to from the surface of substrate P with the detached 1st electronic unit Ca irradiating and detecting light LB of predetermined distance, to the 1st The state of electronic unit Ca is detected.

Mounting head control unit 74, in the state of projecting detection light LB from injection part 18A, controls Z axis driving means 15, makes The 1st electronic unit Ca being kept by the 1st mounting head 10A moves along Z-direction with respect to detection light LB.In addition, mounting head controls Portion 74, in the state of projecting detection light LB from injection part 18A, controls θ Z driving means 16, makes by the 1st mounting head 10A holding 1st electronic unit Ca rotates along θ Z-direction.By make the 1st electronic unit Ca along Z-direction and θ Z-direction mobile while to 1st electronic unit Ca irradiating and detecting light LB, thus accurately detect to the state of the 1st electronic unit Ca.

After the state of the 1st electronic unit Ca being detected using detection light LB, mounting head control unit 74 controls shifting Dynamic system 4, makes the 1st electronic unit Ca being kept by the 1st mounting head 10A mobile (decline) along -Z direction.Thus, as Figure 12 institute Show, the 1st electronic unit Ca is installed on substrate P.

As described above, mounting head control unit 74 is to mounting head 10 (the 1st mounting head 10A and the 2nd mounting head 10B) and mobile system System 4 output the 5th control signal, so that implementing, using the 2nd mounting head 10B, the 2nd electronic unit Cb is installed on the dynamic of substrate P After work, implement the 1st electronic unit Ca is installed on the action of substrate P using the 1st mounting head 10A.In the 1st electronic unit Ca and 2nd electronic unit Cb mobile to after the position relative with the surface of substrate P, using the 2nd mounting head 10B by the 2nd electronic unit Cb is installed on substrate P, after the 2nd electronic unit Cb being installed on substrate P using the 2nd mounting head 10B, by the 1st mounting head 1st electronic unit Ca is installed on substrate P by 10A.By exporting the 5th control signal, make by the suction nozzle 11B of the 2nd mounting head 10B After the 2nd big electronic unit Cb keeping declines and is installed on substrate P, make by the suction nozzle 11A holding of the 1st mounting head 10A The 1st little electronic unit Ca declines and is installed on substrate P (step SP7).

The suction nozzle 11 (suction nozzle 11A and suction nozzle 11B) of mounting head 10 (the 1st mounting head 10A and the 2nd mounting head 10B), from comprising The flange part 31 of the most external 30 of mounting head 10 protrudes towards substrate P.The overall dimensions of the suction nozzle 11 in X/Y plane are less than to be installed The overall dimensions (maximum overall dimensions) of 10 most external 30.

As shown in figure 11, in leading section (the 2nd electricity by the most external 30 of the 2nd mounting head 10B of Z-direction and suction nozzle 11B The upper surface of subassembly Cb) the distance between be set to L, the size (highly) of the 1st electronic unit Ca of Z-direction is set to Ha, The size of the 2nd electronic unit Cb of Z-direction is set to Hb, by between the surface of the substrate P of Z-direction and detection light LB away from From when being set to A, to meet

L >=A+Ha-Hb ... (1)

Condition mode determine suction nozzle 11B apart from L.By meeting the condition of (1) formula such that it is able to avoid by the 1st Interference between the 1st electronic unit Ca and the 2nd electronic unit Cb being installed on substrate P of the holding of mounting head 10A, and make The 1st electronic unit Ca being kept from the 1st mounting head 10A along Z-direction mobile, while to the 1st electronic unit Ca irradiating and detecting light LB, detects to the state of the 1st electronic unit Ca.

In step SP3, even if be judged to implement the 1st electronic unit Ca using the 1st mounting head 10A from support simultaneously The detached action of face 3S and using the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S, also can avoid In the case of interference between 1st electronic unit Ca and the 2nd electronic unit Cb, i.e. be judged to apart from Ra with apart from Rb sum Less than or equal to (step SP3 in the case of D：Yes), mounting head control unit 74 exports the 3rd control signal, so that simultaneously Implement using the 1st mounting head 10A by the 1st electronic unit Ca from the detached action of supporting surface 3S and using the 2nd mounting head 10B by the 2 electronic unit Cb are from the detached action of supporting surface 3S.By exporting the 3rd control signal, thus be implemented in by supporting surface 3S simultaneously The 1st electronic unit Ca supporting kept by the suction nozzle 11A of the 1st mounting head 10A in the state of from the detached action of supporting surface 3S and From supporting surface 3S in the state of the 2nd electronic unit Cb being supported by supporting surface 3S is kept by the suction nozzle 11B of the 2nd mounting head 10B Detached action (step SP9).

Mounting head control unit 74 makes the 1st electronic unit Ca being kept by the 1st mounting head 10A and is kept by the 2nd mounting head 10B The 2nd electronic unit Cb from the movement of electronic unit supply area to installation region.By part detection device 18 to mobile to peace The state of the 1st electronic unit Ca in dress region and the state of the 2nd electronic unit Cb are detected (step SP10).By part After the detection release that detection means 18 is carried out, the 1st electronic unit Ca and the 2nd electronic unit Cb is installed on substrate P (step Rapid SP11).

In step SP4, even if being judged to implementing the 1st electronic unit Ca using the 1st mounting head 10A from supporting surface After the detached action of 3S, implement the 2nd electronic unit Cb using the 2nd mounting head 10B from the detached action of supporting surface 3S, also not (step SP4 in the case of the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb can be avoided：Yes), change is using peace The plan of the installation process that dress head unit 100 is carried out, determines (step SP1) again.

In step SP4, it is being judged to avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb In the case of, again determining in the works, mounting head control unit 74 exports the 2nd control signal, so that implementing using the 1st peace Dress head 10A by the 1st electronic unit Ca after the detached action of supporting surface 3S, implement using compared with the 2nd mounting head 10B more Away from the 1st mounting head 10A the 3rd mounting head 10Bb by the 2nd electronic unit Cb from the detached action of supporting surface 3S.3rd mounting head 10Bb is for example arranged in the mounting head 10 of-X side of the 2nd mounting head 10B.By exporting the 3rd control signal, thus in electronics In assembly supply device 3, the 1st electronic unit Ca is installed by the 1st mounting head 10A, the 2nd electricity is installed by the 3rd mounting head 10Bb Subassembly Cb.

Even if additionally, with regard to implementing to utilize the 1st mounting head 10A that the 1st electronic unit Ca is detached dynamic from supporting surface 3S After work, implement the 2nd electronic unit Cb using the 2nd mounting head 10B from the detached action of supporting surface 3S, also will not avoid the 1st The state of the interference between electronic unit Ca and the 2nd electronic unit Cb, exemplifies following states, i.e. the height of the 2nd electronic unit Cb Hb is too high for degree, even if making the upper of the mobile movable range to Z-direction of the 1st mounting head 10A of holding the 1st electronic unit Ca Limit, also can make the 1st electronic unit Ca and the 2nd electronic unit Cb interfere, or the 2nd electronic unit Cb and the 1st mounting head 10A Interfere.In addition, with regard to the state that will not avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb, exemplifying Following states, i.e. the 1st electronic unit Ca apart from Ra and the 2nd electronic unit Cb, apart from one of Rb or both are excessive, even if Make the upper limit of the mobile movable range to Z-direction of the 1st mounting head 10A of holding the 1st electronic unit Ca, also can make the 1st electricity Subassembly Ca and the 2nd electronic unit Cb interferes.

After step SP7 or step SP11 terminate, judge complete by the supporting surface 3S support of electronic part feeder 3 Whether the installation of portion electronic unit C terminates (step SP8).In step SP8, do not have in the installation being judged to whole electronic unit C (step SP8 in the case of having end：No), the decision again (step SP1) of implementation plan, is being judged to whole electronic unit C Installation terminate in the case of (step SP8：Yes), installation process terminates.

As described above, according to present embodiment, big in the 1st little electronic unit Ca of overall dimensions and overall dimensions The 2nd electronic unit Cb from electronic part feeder 3 supply in the case of, based on part dimension data and install cephalic module According to, implement by the 1st electronic unit Ca utilize the 1st mounting head 10A after the detached action of supporting surface 3S, implement by the 2nd electricity Subassembly Cb utilize the 2nd mounting head 10B from the detached action of supporting surface 3S so that the 1st electronic unit Ca and supporting surface 3S it Between distance be more than the distance between the 2nd electronic unit Cb and supporting surface 3S, thus, even if the central shaft of the 1st electronic unit Ca In CXa and apart the distance between farthest most external of the 1st electronic unit Ca of this central shaft CXa Ra, the 2nd electronic unit Cb Heart axle CXb and apart the distance between farthest most external of the 2nd electronic unit Cb of this central shaft CXb Rb sum are more than the 1st peace The distance between the central shaft AX of the central shaft AX of dress head 10A and the 2nd mounting head 10B D is it is also possible to avoid the 1st electronic unit Ca With the 2nd interference between electronic unit Cb, and by the 1st electronic unit Ca supplying from electronic part feeder 3 and the 2nd electricity Subassembly Cb is kept together and is delivered to substrate P by mounting head unit 100.Therefore, suppression is from electronic part feeder 3 The situation that the quantity of the electronic unit C that can convey in 1 conveying action of the mounting head unit 100 to substrate P tails off, Convey electronic unit C as much as possible, the therefore reduction of the productivity ratio of suppression electronic component mounting apparatus 1.

In addition, according to present embodiment, mounting head control unit 74 exports the 1st control signal, so that the 1st of Z-direction the The distance between the most external 30 of mounting head 10A and supporting surface 3S are more than the 2nd mounting head 10B keeping the 2nd electronic unit Cb The distance between the leading section of suction nozzle 11B and supporting surface 3S.Thus, even if the height Hb of the 2nd electronic unit Cb is high, also can be kept away Exempt from the interference between the 1st mounting head 10A and the 2nd electronic unit Cb, and the 1st electronic unit Ca and the 2nd electronic unit Cb is passed through Mounting head unit 100 keeps together.

In addition, according to present embodiment, detection unit 73 is interfered in setting, it is based on part dimension data and installs cephalic module According to judging to the description below, i.e. by implementing the 1st electronic unit Ca using the 1st mounting head 10A from supporting surface 3S After detached action, implement the 2nd electronic unit Cb using the 2nd mounting head 10B from the detached action of supporting surface 3S, if meeting Avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb.It is judged to avoid the 1st electronics interfering detection unit 73 In the case of interference between part Ca and the 2nd electronic unit Cb, mounting head control unit 74 exports the 1st control signal.Interfering In the case that detection unit 73 is judged to avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb, mounting head control Portion 74 processed exports the 2nd control signal, so that implementing to divide the 1st electronic unit Ca from supporting surface 3S using the 1st mounting head 10A From action after, implement using compared with the 2nd mounting head 10B farther away from the 1st mounting head 10A the 3rd mounting head 10C by the 2 electronic unit Cb are from the detached action of supporting surface 3S.Even if implement using the 1st mounting head 10A by the 1st electronic unit Ca from After the detached action of support face 3S, implement the 2nd electronic unit Cb using the 2nd mounting head 10B from the detached action of supporting surface 3S, According to part dimension data and mounting head sized data it is also possible to the 1st electronic unit Ca and the 2nd electronic unit Cb cannot be avoided Between interference.Based on part dimension data and mounting head sized data, it is being judged to avoid the 1st electronic unit Ca and In the case of interference between 2 electronic unit Cb, the 1st electronic unit Ca is utilized the 1st mounting head 10A to keep, by the 2nd ministry of electronics industry Part Cb utilizes the 3rd mounting head 10Bb to keep, thus, it is possible to avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb, And the 1st electronic unit Ca and the 2nd electronic unit Cb is conveyed together by mounting head unit 100.

In addition, according to present embodiment, even if be judged to implement using the 1st mounting head 10A by the 1st electronic unit simultaneously Ca from the detached action of supporting surface 3S and utilizes the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S, Also in the case of the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb can be avoided, mounting head control unit 74 output the 3rd Control signal so that implement simultaneously using the 1st mounting head 10A by the 1st electronic unit Ca from the detached action of supporting surface 3S and Using the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S.According to part dimension data and mounting head Sized data, even if sometimes implement the 1st electronic unit Ca using the 1st mounting head 10A from the detached action of supporting surface 3S simultaneously With using the 2nd mounting head 10B by the 2nd electronic unit Cb from the detached action of supporting surface 3S it is also possible to avoid the 1st electronic unit Ca And the 2nd interference between electronic unit Cb.Based on part dimension data and mounting head sized data, it is being judged to avoid the 1st In the case of interference between electronic unit Ca and the 2nd electronic unit Cb, implement the 1st electronics using the 1st mounting head 10A simultaneously Part Ca from the detached action of supporting surface 3S and utilizes the 2nd mounting head 10B that the 2nd electronic unit Cb is detached dynamic from supporting surface 3S Make, thus shorten the multiple electronic unit C supplying from electronic part feeder 3 by moving that mounting head unit 100 keeps The time made, the therefore reduction of the productivity ratio of suppression electronic component mounting apparatus 1.

In addition, according to present embodiment, mounting head control unit 74 exports the 4th control signal, so that maintaining Z-direction The 1st mounting head 10A and the 2nd mounting head 10B between relative position in the state of, make the 1st electronic unit Ca and the 2nd ministry of electronics industry Part Cb is from the electronic unit supply area movement comprising the position relative with supporting surface 3S to the surface phase comprising with substrate P To position in interior installation region.Thereby, it is possible to avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb, and The 1st electronic unit Ca being kept together by mounting head unit 100 and the 2nd electronic unit Cb is delivered to substrate P.

In addition, according to present embodiment, mounting head control unit 74 exports the 5th control signal, so that implementing to utilize the 2nd After 2nd electronic unit Cb is installed on the action of substrate P by mounting head 10B, implement the 1st ministry of electronics industry using the 1st mounting head 10A Part Ca is installed on the action of substrate P.Thereby, it is possible to avoid the interference between the 1st electronic unit Ca and the 2nd electronic unit Cb, and 1st electronic unit Ca and the 2nd electronic unit Cb is installed on substrate P.

In addition, according to present embodiment, in the 1st electronic unit Ca from the surface of substrate P with the detached state of predetermined distance Lower 2nd electronic unit Cb is installed on substrate P, with by the 2nd electronic unit Cb be installed on substrate P action in parallel through part examine Survey the 1st electronic unit Ca irradiating and detecting light LB to the surface separation predetermined distance from substrate P for the device 18.With by the 2nd ministry of electronics industry Part Cb is installed on substrate P action and concurrently implements the detection action to the 1st electronic unit Ca by part detection device 18, thus The reduction of the productivity ratio of suppression electronic component mounting apparatus 1.

In addition, according to present embodiment, keeping the suction nozzle 11B of big the 2nd mounting head 10B of the 2nd electronic unit Cb to be set It is calculated as meeting the condition of (1) formula.Thereby, it is possible to the interference avoiding and be installed between the 2nd electronic unit Cb of substrate P, and one While making the 1st electronic unit Ca being kept from the 1st mounting head 10A move along Z-direction, while irradiating inspection to the 1st electronic unit Ca Light-metering LB and the state of the 1st electronic unit Ca is detected.

＜ the 2nd embodiment ＞

2nd embodiment is illustrated.In the following description, to the structure identical or equivalent with above-mentioned embodiment Become key element mark identical label, and simplify or the description thereof will be omitted.

Figure 13 is to represent showing of an example of the 1st mounting head 10C and the 2nd mounting head 10D involved by present embodiment It is intended to.1st mounting head 10C and the 2nd mounting head 10D configure along X-direction.

1st mounting head 10C has：Flange part 31, it comprises most external 30；And suction nozzle 11C, it is from flange part 31 direction Substrate P is protruded.2nd mounting head 10D has：Flange part 31, it comprises most external 30；And suction nozzle 11D, it is from flange part 31 court Protrude to substrate P.

In the present embodiment, it is configured without helical spring around suction nozzle 11 (suction nozzle 11C and suction nozzle 11D).XY puts down The overall dimensions of the suction nozzle 11C in face are less than the overall dimensions (maximum overall dimensions) of the most external 30 of the 1st mounting head 10C.XY The overall dimensions of the suction nozzle 11D in plane are less than the overall dimensions (maximum overall dimensions) of the most external 30 of the 2nd mounting head 10D.

In the present embodiment, install by the overall dimensions of the 1st electronic unit Cc of the 1st mounting head 10C holding with by the 2nd The overall dimensions of the 2nd electronic unit Cd that head 10D keeps are substantially the same.The height Hc of the 1st electronic unit Cc and the 2nd ministry of electronics industry The height Hd of part Cd is substantially the same.

In the same manner as above-mentioned embodiment, the action of the 1st mounting head 10C and the 2nd mounting head 10D is by mounting head control unit 74 controls.Mounting head control unit 74 is based on part dimension data and mounting head sized data, exports the 1st control signal, so that Implement by by electronic part feeder 3 supporting surface 3S support the 1st electronic unit Cc utilize the 1st mounting head 10C from After the detached action of support face 3S, implement by the 2nd electronic unit Cd being supported by supporting surface 3S utilize the 2nd mounting head 10D from The detached action of support face 3S.Mounting head control unit 74 export the 1st control signal so that the 1st electronic unit Cc of Z-direction and The distance between supporting surface 3S is more than the distance between the 2nd electronic unit Cd and supporting surface 3S.

The distance between leading section of the most external 30 of the 2nd mounting head 10D of Z-direction and suction nozzle 11D is set to L, The size (highly) of the 1st electronic unit Cc of Z-direction is set to Hc, the size of the 2nd electronic unit Cd of Z-direction is set to Hd, when the distance between detection light LB of the surface of the substrate P of Z-direction and part detection device 18 is set to A, meets

L >=A+Hc-Hd ... (2)

Condition.

As described above, even if the overall dimensions phase of the overall dimensions of the 1st electronic unit Cc and the 2nd electronic unit Cd With, by with meet (2) formula condition by way of determine suction nozzle 11 apart from L, thus also it can be avoided that by the 1st mounting head 10C Interference between the 1st electronic unit Cc keeping and the 2nd electronic unit Cd being installed on substrate P, and make by the 1st mounting head The 1st electronic unit Cc that 10C keeps along Z-direction mobile, while to the 1st electronic unit Cc irradiating and detecting light LB, to the 1st electronics The state of part Cc is detected.

Additionally, in the 1st above-mentioned embodiment and the 2nd embodiment, predetermined surface (X/Y plane) is set to and horizontal plane Parallel.But predetermined surface can also be inclined relative to horizontal.

Claims (10)

1. a kind of electronic component mounting apparatus, electronic unit is installed on substrate by it,

This electronic component mounting apparatus possesses：

Mounting head unit, it has support member and multiple mounting head, and the plurality of mounting head is respectively provided with releasably holding institute State the suction nozzle of electronic unit, along the 1st direction of principal axis configuration in predetermined surface, this support member carries out to multiple described mounting heads propping up Support；

Mobile system, it has installation head driving apparatus and suction nozzle driving means, and this installation head driving apparatus can be along the described 1st 2nd direction of principal axis orthogonal with described 1st direction of principal axis in direction of principal axis and described predetermined surface makes described support member move, this suction nozzle Driving means can make described mounting head move along the 3rd direction of principal axis orthogonal with described predetermined surface with respect to described support member；

Part dimension data acquisition, its obtaining parts sized data, this part dimension data represents from electronic unit supply dress Put the overall dimensions of the described electronic unit of supply；

Mounting head sized data obtaining section, it obtains mounting head sized data, and this mounting head sized data represents described mounting head Central shaft and at a distance of the distance between farthest most external of described mounting head of the described central shaft i.e. maximum of described mounting head Overall dimensions and along the distance between the 1st adjacent mounting head of described 1st direction of principal axis and the 2nd mounting head；And

Mounting head control unit, it is based on described part dimension data and described mounting head sized data, exports the 1st control signal, To implement to be propped up by the supporting surface of the described electronic part feeder parallel with described predetermined surface using described 1st mounting head , after the detached action of described supporting surface, implementing will be by described supporting surface using described 2nd mounting head for 1st electronic unit of support Overall dimensions 2nd electronic unit bigger than described 1st electronic unit supporting is from the detached action of described supporting surface, and makes institute State the distance between the 3rd axial described 1st electronic unit and described supporting surface and be more than described 2nd electronic unit and described The distance between support face.

2. electronic component mounting apparatus according to claim 1, wherein,

Described mounting head control unit exports described 1st control signal, so that described 3rd axial described 1st mounting head The distance between described most external and described supporting surface are more than the described of described 2nd mounting head keeping described 2nd electronic unit The distance between suction nozzle and described supporting surface.

3. electronic component mounting apparatus according to claim 1 and 2, wherein,

There is interference detection unit, this interference detection unit be based on described part dimension data and described mounting head sized data, under State content to be judged, i.e. by implementing to divide described 1st electronic unit from described supporting surface using described 1st mounting head From action after using described 2nd mounting head by described 2nd electronic unit from the detached action of described supporting surface whether implement The interference between described 1st electronic unit and described 2nd electronic unit can be avoided,

In the case of being judged to avoid described the interference, described mounting head control unit exports described 1st control signal,

In the case of being judged to avoid described the interference, described mounting head control unit exports the 2nd control signal, to implement Using described 1st mounting head by described 1st electronic unit after the detached action of described supporting surface, implement using with described the Described 2nd electronic unit is separated by the 3rd mounting head that 2 mounting heads are compared farther away from described 1st mounting head from described supporting surface Action.

4. electronic component mounting apparatus according to claim 3, wherein,

Based on described part dimension data and described mounting head sized data, even if being judged to simultaneously by described interference detection unit Implement described 1st electronic unit using described 1st mounting head from the detached action of described supporting surface with using described 2nd installation Described 2nd electronic unit from the detached action of described supporting surface, also can be avoided described 1st electronic unit and described 2nd electricity by head In the case of interference between subassembly, described mounting head control unit exports the 3rd control signal, to implement using described the simultaneously Described 1st electronic unit from the detached action of described supporting surface and is utilized described 2nd mounting head electric by the described 2nd by 1 mounting head Subassembly is from the detached action of described supporting surface.

5. electronic component mounting apparatus according to any one of claim 1 to 4, wherein,

Described mounting head control unit exports the 4th control signal, so that maintaining the described 3rd axial described 1st mounting head In the state of relative position and described 2nd mounting head between, make described 1st electronic unit and described 2nd electronic unit from Mobile extremely relative with the surface of the described substrate position in the relative position of described supporting surface.

6. electronic component mounting apparatus according to any one of claim 1 to 5, wherein,

Described mounting head control unit exports the 5th control signal, to implement described 2nd ministry of electronics industry using described 2nd mounting head After part is installed on the action of described substrate, implement, using described 1st mounting head, described 1st electronic unit is installed on described base The action of plate.

7. electronic component mounting apparatus according to claim 6, wherein,

In described 1st electronic unit in the state of the surface separation predetermined distance of described substrate, by described 2nd electronic unit peace It is loaded on described substrate,

Described electronic component mounting apparatus possess part detection device, and this part detection device is pacified with by described 2nd electronic unit It is loaded on the action of described substrate concurrently, to described 1st electronic unit separating described predetermined distance from the surface of described substrate Irradiating and detecting light, detects to described 1st electronic unit.

8. electronic component mounting apparatus according to any one of claim 1 to 7, wherein,

The described suction nozzle of described 2nd mounting head comprises described outermost flange part towards described base from described 2nd mounting head Plate protrudes, and the overall dimensions of the described suction nozzle in described predetermined surface are less than the described maximum overall dimensions of described 2nd mounting head,

The distance between leading section of the most external of the described 3rd axial described 2nd mounting head and described suction nozzle is being set to L, the size of the described 3rd axial described 1st electronic unit is set to Ha, by the described 3rd axial described 2nd ministry of electronics industry The size of part is set to Hb, when the distance between the surface of the described 3rd axial described substrate and described detection light are set to A, Meet the condition of L >=A+Ha-Hb.

9. a kind of electronic component mounting apparatus, electronic unit is installed on substrate by it,

This electronic component mounting apparatus possesses：

Mounting head unit, it has support member and multiple mounting head, and the plurality of mounting head is respectively provided with releasably holding institute State the suction nozzle of electronic unit, along the 1st direction of principal axis configuration in predetermined surface, this support member carries out to multiple described mounting heads propping up Support；

Mobile system, it has installation head driving apparatus and suction nozzle driving means, and this installation head driving apparatus can be along the described 1st 2nd direction of principal axis orthogonal with described 1st direction of principal axis in direction of principal axis and described predetermined surface makes described support member move, this suction nozzle Driving means can make described mounting head move along the 3rd direction of principal axis orthogonal with described predetermined surface with respect to described support member；

Part dimension data acquisition, its obtaining parts sized data, this part dimension data represents from electronic unit supply dress Put the overall dimensions of the described electronic unit of supply；

Mounting head sized data obtaining section, it obtains mounting head sized data, and this mounting head sized data represents described mounting head Central shaft and at a distance of the distance between farthest most external of described mounting head of the described central shaft i.e. maximum of described mounting head Overall dimensions and along the distance between the 1st adjacent mounting head of described 1st direction of principal axis and the 2nd mounting head；And

Mounting head control unit, it is based on described part dimension data and described mounting head sized data, exports the 1st control signal, To implement to be propped up by the supporting surface of the described electronic part feeder parallel with described predetermined surface using described 1st mounting head , after the detached action of described supporting surface, implementing will be by described supporting surface using described 2nd mounting head for 1st electronic unit of support The 2nd electronic unit supporting is from the detached action of described supporting surface, and makes the described 3rd axial described 1st electronic unit It is more than the distance between described 2nd electronic unit and described supporting surface with the distance between described supporting surface,

The described suction nozzle of described 2nd mounting head comprises described outermost flange part towards described base from described 2nd mounting head Plate protrudes, and the overall dimensions of the described suction nozzle in described predetermined surface are less than the described maximum overall dimensions of described 2nd mounting head,

The distance between leading section of the most external of the described 3rd axial described 2nd mounting head and described suction nozzle is being set to L, the size of the described 3rd axial described 1st electronic unit is set to Hc, by the described 3rd axial described 2nd ministry of electronics industry The size of part is set to Hd, when the distance between the surface of the described 3rd axial described substrate and described detection light are set to A, Meet the condition of L >=A+Hc-Hd.

10. a kind of electronic component mounting method, electronic unit is installed on substrate by it,

This electronic component mounting method comprises following step：

Obtaining parts sized data, this part dimension data represents the described electronic unit from electronic part feeder supply Overall dimensions；

Obtain mounting head sized data, this mounting head sized data represents the central shaft of the mounting head with suction nozzle and at a distance of described The distance between farthest most external of described mounting head of central shaft is maximum overall dimensions of described mounting head and by supporting Member supporting, along the distance between the 1st adjacent mounting head of the 1st direction of principal axis in predetermined surface and the 2nd mounting head, wherein, this suction Mouth releasably keeps described electronic unit；

Based on described part dimension data and described mounting head sized data, using described 1st mounting head will by with described regulation The 1st electronic unit that the supporting surface of the parallel described electronic part feeder in face supports separates the 1st distance from described supporting surface；

Using described 1st mounting head by described 1st electronic unit from described supporting surface separate after, using the described 2nd installation Head by the 2nd bigger than described 1st electronic unit for the profile being supported by described supporting surface electronic unit, from described supporting surface segregation ratio Described 1st apart from the 2nd short distance；

In the state of maintaining the described 1st mounting head and described 2nd mounting head relative position with respect to described support member, make Described 1st electronic unit and described 2nd electronic unit are from the position movement relative with described supporting surface to the table with described substrate The relative position in face；

After making described 1st electronic unit and mobile extremely relative with the surface of the described substrate position of described 2nd electronic unit, Using described 2nd mounting head, described 2nd electronic unit is installed on described substrate；And

After described 2nd electronic unit being installed on described substrate using described 2nd mounting head, using described 1st mounting head Described 1st electronic unit is installed on described substrate.