CN209561449U - A kind of novel transfer equipment towards Micro LED chip - Google Patents
A kind of novel transfer equipment towards Micro LED chip Download PDFInfo
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- CN209561449U CN209561449U CN201920181873.5U CN201920181873U CN209561449U CN 209561449 U CN209561449 U CN 209561449U CN 201920181873 U CN201920181873 U CN 201920181873U CN 209561449 U CN209561449 U CN 209561449U
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Abstract
The utility model discloses a kind of novel transfer equipments towards Micro LED chip, including buanch unit, laser lift-off unit, pick-up head switch unit, visual detection unit, repair unit and as the bracket of the above each unit installation foundation.The transfer equipment towards Micro LED chip, wherein buanch unit can realize the pickup and transfer of Micro LED chip；The removing of Micro LED chip and substrate may be implemented in laser lift-off unit；The size, quantity, position that need to shift Micro LED chip can be judged in advance by overlooking fixed camera, realize the coarse positioning to pick-up head；Pick-up head switch unit can automatically select and switch pick-up head, realize the pickup and transfer of different sizes, the Micro LED chip of quantity；Whether vision-based detection camera after detecting the transfer of Micro LED chip for working normally；Unit is repaired for repairing to irregular working Micro LED chip, the final transfer for realizing Micro LED chip is obtained to the quick accurate transfer effect of Micro LED chip.
Description
Technical field
The utility model relates to the transfer equipment technical fields of Micro LED chip, and specially one kind is towards Micro
The novel transfer equipment of LED chip.
Background technique
With the fast development of information industry, electronic product using more and more extensive.For mobile phone, tablet computer, pen
For remembering the electronic products such as sheet, TV, display technology is very crucial, and current most common display technology is light emitting diode.
Micro LED chip is display technology of new generation, and Micro LED chip has low-power consumption, high brightness, high efficiency, high reliability,
Response time is short, the service life is long, ultrahigh resolution and the advantages that color saturation.There is data to show, compared with LCD, OLED,
The 50% of 10%, the OLED that the power consumption of Micro LED chip is about LCD.It can be seen that Micro LED chip has ten
Divide apparent advantage, there is huge application prospect in future.Micro LED chip faces many in realizing industrialization process at present
Technological challenge, wherein flood tide transfer techniques are the key that one of current most difficult processing procedures.Flood tide transfer techniques require very high
Transfer efficiency, current many companies are all carrying out correlative study, and flood tide transfer techniques, which have become, restricts Micro LED chip
The technical bottleneck of development.
Some equipment for the transfer of Micro LED chip flood tide, such as CN have been proposed in the prior art
108461438 A of 107910413 A and CN.Further investigations have shown that this kind of existing flood tide transfer equipment is in transfer efficiency
It is still difficult to meet existing demand with yield etc. is shifted, correspondingly, this field needs to seek in view of the above technical problems more
For perfect solution, required with meeting increasing technique at present.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of novel transfer towards Micro LED chip and sets
It is standby, it solves existing flood tide transfer equipment and is still difficult to meet asking for existing demand in terms of transfer efficiency and transfer
Topic.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: a kind of towards the new of Micro LED chip
Type transfer equipment, including buanch unit, laser lift-off unit, pick-up head switch unit, visual detection unit, repairing unit and
As the bracket of the above each unit installation foundation, the buanch unit is flat to translation module, the first Y-direction including the first pick-up head, X
Dynamic model block and the first Z-direction translation module, three modules are respectively used to execute first pick-up head in X-axis and Y-axis and Z axis side
To linear movement, thus can realize the pickup and transfer of Micro LED chip, the laser lift-off unit, which is fixedly mounted on, to be turned
The lower section of unit is moved, the removing of Micro LED chip and substrate may be implemented in the laser lift-off unit.
Preferably, the visual detection unit includes overlooking fixed camera and overlooking moving camera, and the vertical view moves phase
Machine is movably arranged on the left of the buanch unit, and the vertical view moving camera is movably arranged on the upper of first pick-up head
Side, the accurate positioning overlooked moving camera and be used to cooperate the first pick-up head, the pick-up head switch unit is mounted on described
The lower section of moving camera is overlooked, matched vision-based detection camera, the translation of the second Y-direction are respectively arranged in the visual detection unit
Module and the second Z-direction translation module, the vision-based detection camera, the second Y-direction translation module and the second Z-direction translation module are respectively positioned on
The right of buanch unit.
Preferably, the laser lift-off unit includes heating the substrate, and there is laser irradiation in the lower section heated the substrate, described
The top heated the substrate is fitted with contact glue-line, and the top heated the substrate is placed with Micro LED chip, the Micro
LED chip is in the lower section of the second pick-up head.
Preferably, the first pick-up head of the buanch unit can switch over, and the pick-up head switch unit can be real
The switching of existing different pick-up heads, realizes the pickup and transfer of different sizes, the Micro LED chip of quantity, the vision-based detection
The left of unit is provided with repairing unit, and the bottom of the repairing unit is fixedly mounted on the bottom of basic bracket.
(3) beneficial effect
The utility model provides a kind of novel transfer equipment towards Micro LED chip.Have it is following the utility model has the advantages that
(1), it is somebody's turn to do the novel transfer equipment towards Micro LED chip, passes through the technique for combining the transfer of Micro LED chip
Feature carries out targeted design, and the overall construction for mutually coping with the equipment in the utility model re-starts layout designs, and proposes
A set of new process flow, significantly improves production efficiency compared with existing equipment.
(2), it is somebody's turn to do the novel transfer equipment towards Micro LED chip, passes through the specific composition structure to its key component
And its set-up mode carries out Improvement, in particular by visual detection unit, can realize high efficiency Micro LED chip
While transfer, high position precision and operation ease are also assured；In addition, also to pick-up head switch unit, laser lift-off unit
Corresponding design is carried out, the equipment overall structure is compact, layout is ingenious and easy to operate to pass through, and modules unit
Between connect each other, it is common to cooperate, be therefore particularly suitable for the high-volume large-scale production occasion of Micro LED chip.
Detailed description of the invention
Fig. 1 is vertical according to the transfer equipment towards Micro LED chip constructed by the preferred embodiments of the present invention
Body structural schematic diagram；
Fig. 2 is buanch unit floor map；
Fig. 3 is laser lift-off unit floor map；
Fig. 4 is the Zone switched floor map of different pick-up heads；
Fig. 5 is detection unit floor map；
Fig. 6 is the process flow chart of Micro LED chip transfer.
In figure: 100, buanch unit；101, the first pick-up head；102, X to translation module；103, the first Y-direction translation module；
104, the first Z-direction translation module；200, laser lift-off unit；201, it heats the substrate；202, glue-line is contacted；203, it second picks up
Head；204, Micro LED chip；205, laser；300, pick-up head switch unit；400, visual detection unit；401, it overlooks solid
Determine camera；402, moving camera is overlooked；403, vision-based detection camera；404, the second Y-direction translation module；405, the second Z-direction is translatable
Module；500, unit is repaired.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in figures 1 to 6, the utility model provides a kind of technical solution: a kind of novel turn towards Micro LED chip
Moving device, including buanch unit 100, laser lift-off unit 200, pick-up head switch unit 300, visual detection unit 400, repair
Mend unit 500 and the bracket as the above each unit installation foundation, buanch unit 100 includes the first pick-up head 101, X to flat
Dynamic model block 102, the first Y-direction translation module 103 and the first Z-direction translation module 104, three modules are respectively used to execution first
Thus pick-up head 101 can realize the pickup and transfer of Micro LED chip in the linear movement of X-axis and Y-axis and Z-direction,
Laser lift-off unit 200 is fixedly mounted on the lower section of buanch unit 100, and Micro LED may be implemented in laser lift-off unit 200
The removing of chip and substrate, visual detection unit 400 include overlooking fixed camera 401 and overlooking moving camera 402, overlook movement
Camera 402 is movably arranged on the left of buanch unit 100, overlooks moving camera 402 and is movably arranged on the upper of the first pick-up head 101
Side, overlooks the accurate positioning that moving camera 402 is used to cooperate the first pick-up head 101, and pick-up head switch unit 300 is mounted on vertical view
It is flat to be respectively arranged with matched vision-based detection camera 403, the second Y-direction in visual detection unit 400 for the lower section of moving camera 402
Dynamic model block 404 and the second Z-direction translation module 405, vision-based detection camera 403, the second Y-direction translation module 404 and the translation of the second Z-direction
Module 405 is respectively positioned on the right of buanch unit 100, and the left of visual detection unit 400 is provided with repairing unit 500, and repairing is single
The bottom of member 500 is fixedly mounted on the bottom of the bracket on basis, and laser lift-off unit 200 includes heating the substrate 201, heats base
There is the irradiation of laser 205 in the lower section of plate 201, and the top for heating the substrate 201 is fitted with contact glue-line 202, heats the substrate 201 top
Portion is placed with Micro LED chip 204, and Micro LED chip 204 is located at the lower section of the second pick-up head 203, and the of buanch unit
One pick-up head 101 can switch over, and the switching of different pick-up heads may be implemented in pick-up head switch unit 300, realize different rulers
The pickup and transfer of very little, quantity Micro LED chip.
In use, overlooking fixed camera 401 first detects the quantity for the Micro LED chip for needing transfer on workbench, ruler
Very little, position, then pick-up head switch unit selects corresponding pick-up head, overlooks moving camera and observes Micro LED core to be picked up
The position of piece provides benchmark, later on laser lift-off device, Micro LED chip and base after heating for the movement of pick-up head
Plate separation, buanch unit is opened at this time, is picked up and is lighted Micro LED with transfer Micro LED chip, workbench setting in motion
Chip opens vision-based detection camera, judges whether Micro LED chip works normally by vision-based detection phase machine testing, repairs
Device is opened, and is repaired to the Micro LED chip of irregular working, and Micro LED chip is lighted, and detects Micro LED
Chip light emitting quantity repeats step S-S up to the percentage of the total Micro LED chip of amount of luminescence Zhan of Micro LED chip
Higher than %, wherein laser lift-off unit is heated the substrate rapidly and the contact of Micro LED chip by the short irradiation of laser
Glue-line brings it about laser ablation reaction, loses viscosity, be achieved in the removing of Micro LED chip, to utilize pick-up head
Absorption migration is given to Micro LED chip, the pick-up head of buanch unit can switch over, and the pick-up head switch unit can
To realize the switching of different pick-up heads, the pickup and transfer of different sizes, the Micro LED chip of quantity are realized, according to vertical view
Fixed camera automatically selects and switches pick-up head, Micro to the pre- judgement of the size, quantity that need to shift Micro LED chip
LED chip transfer equipment also has visual detection unit, which includes overlooking fixed camera, overlooking movement phase
Machine, vision-based detection camera, wherein the vertical view fixed camera is used to observe on workbench the ruler for the Micro LED chip for needing transfer
Very little, quantity, position provide data for the selection of pick-up head and the coarse positioning of pick-up head；Moving camera is overlooked for observing wait pick up
The exact position of Micro LED chip is taken, provides smart benchmark for the movement of pick-up head；Vision-based detection camera is for detecting Micro
The content for whether working normally after LED chip transfer, while being not described in detail in this specification belongs to this field profession skill
The prior art well known to art personnel.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of novel transfer equipment towards Micro LED chip, including buanch unit (100), laser lift-off unit
(200), pick-up head switch unit (300), visual detection unit (400), repairing unit (500) and as the above each unit pacify
Fill basis bracket, it is characterised in that: the buanch unit (100) include the first pick-up head (101), X to translation module
(102), the first Y-direction translation module (103) and the first Z-direction are translatable module (104), which is respectively used to execute described the
Thus one pick-up head (101) can realize the pickup of Micro LED chip and turn in the linear movement of X-axis and Y-axis and Z-direction
It moves, the laser lift-off unit (200) is fixedly mounted on the lower section of buanch unit (100), and the laser lift-off unit (200) can
To realize the removing of Micro LED chip and substrate.
2. a kind of novel transfer equipment towards Micro LED chip according to claim 1, it is characterised in that: described
Visual detection unit (400) includes overlooking fixed camera (401) and overlooking moving camera (402), the vertical view moving camera
(402) it is movably arranged on the left of the buanch unit (100), the vertical view moving camera (402) is movably arranged on described
The top of one pick-up head (101), the accurate positioning overlooked moving camera (402) and be used to cooperate the first pick-up head (101), institute
It states pick-up head switch unit (300) and is mounted on the lower section for overlooking moving camera (402), the visual detection unit (400)
On be respectively arranged with matched vision-based detection camera (403), the second Y-direction translation module (404) and the second Z-direction be translatable module
(405), the vision-based detection camera (403), the second Y-direction translation module (404) and the second Z-direction translation module (405) are respectively positioned on
The right of buanch unit (100).
3. a kind of novel transfer equipment towards Micro LED chip according to claim 1, it is characterised in that: described
Laser lift-off unit (200) includes heating the substrate (201), and described heat the substrate has laser (205) irradiation, institute below (201)
It states to heat the substrate and is fitted with contact glue-line (202) at the top of (201), described heat the substrate is placed with Micro at the top of (201)
LED chip (204), the Micro LED chip (204) are located at the lower section of the second pick-up head (203).
4. a kind of novel transfer equipment towards Micro LED chip according to claim 1, it is characterised in that: described
The first pick-up head (101) of buanch unit can switch over, and different pickups may be implemented in the pick-up head switch unit (300)
The switching of head, realizes the pickup and transfer of the Micro LED chip of different sizes, quantity, the visual detection unit (400)
Left be provided with repairing unit (500), it is described repairing unit (500) bottom be fixedly mounted on basis bracket bottom
On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920181873.5U CN209561449U (en) | 2019-02-01 | 2019-02-01 | A kind of novel transfer equipment towards Micro LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920181873.5U CN209561449U (en) | 2019-02-01 | 2019-02-01 | A kind of novel transfer equipment towards Micro LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209561449U true CN209561449U (en) | 2019-10-29 |
Family
ID=68310498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920181873.5U Expired - Fee Related CN209561449U (en) | 2019-02-01 | 2019-02-01 | A kind of novel transfer equipment towards Micro LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209561449U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768129A (en) * | 2019-02-01 | 2019-05-17 | 南昌大学 | A kind of transfer equipment towards Micro LED chip |
| CN111217140A (en) * | 2020-01-08 | 2020-06-02 | 歌尔股份有限公司 | Induction material taking device and material taking method thereof |
| CN111463230A (en) * | 2020-04-13 | 2020-07-28 | 深圳市华星光电半导体显示技术有限公司 | Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate |
-
2019
- 2019-02-01 CN CN201920181873.5U patent/CN209561449U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768129A (en) * | 2019-02-01 | 2019-05-17 | 南昌大学 | A kind of transfer equipment towards Micro LED chip |
| CN109768129B (en) * | 2019-02-01 | 2023-10-03 | 南昌大学 | Transfer equipment for Micro LED chip |
| CN111217140A (en) * | 2020-01-08 | 2020-06-02 | 歌尔股份有限公司 | Induction material taking device and material taking method thereof |
| CN111463230A (en) * | 2020-04-13 | 2020-07-28 | 深圳市华星光电半导体显示技术有限公司 | Repairing device for Micro L ED array substrate and repairing method for Micro L ED array substrate |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191029 Termination date: 20200201 |
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| CF01 | Termination of patent right due to non-payment of annual fee |