CN208225844U - Automate wafer tester - Google Patents
Automate wafer tester Download PDFInfo
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- CN208225844U CN208225844U CN201820725073.0U CN201820725073U CN208225844U CN 208225844 U CN208225844 U CN 208225844U CN 201820725073 U CN201820725073 U CN 201820725073U CN 208225844 U CN208225844 U CN 208225844U
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Abstract
The utility model relates to a kind of automation wafer testers, including body, angle-adjusting mechanism, wafer test positioning device, test suite, safety door and locking member.Body has accommodating chamber, and the bottom wall of accommodating chamber forms mounting surface, is provided with test station on mounting surface.Angle-adjusting mechanism is installed on mounting surface, including rotary components and translation component.Wafer test positioning device is installed on surface of the angle-adjusting mechanism backwards to mounting surface.Test suite is set to mounting surface, and test suite is used to carry out performance detection to the chip for being located at test station.Safety door is set to the edge of installing port.Locking member operationally locking or unlock, so that safety door locks or opens.Automation wafer tester provided by the utility model safety with higher.
Description
Technical field
The utility model relates to wafer test technical field more particularly to a kind of automation wafer testers.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits.The various chips of production can be processed on wafer,
Wafer is set to become the product with specific function.In the process of wafer, wafer need to be usually fixed on to automation wafer
In test device, and the test of optics and electric property is carried out to the chip being set on wafer one by one.Existing automation is brilliant
Circle test device causes machine all standing often when picking and placing wafer due to misoperation, leads to the precision instrument inside device
Impaired, safety is lower.
Utility model content
Based on this, it is necessary to for the lower problem of traditional safety, provide a kind of with the automatic of higher-security
Change wafer tester.
A kind of automation wafer tester, for fixing and testing the chip on wafer, comprising:
Body, has accommodating chamber, and the bottom wall of the accommodating chamber forms mounting surface, is provided with test work on the mounting surface
Position, the side wall of the accommodating chamber offer installing port；
The angle-adjusting mechanism being contained in the accommodating chamber is installed on the mounting surface, including rotary components and translation
Component；
The wafer test positioning device being contained in the accommodating chamber, for adsorbing simultaneously fixed chip, the wafer test
Positioning device is installed on the angle-adjusting mechanism backwards to the surface of the mounting surface, and the angle-adjusting mechanism can drive described
The rotation of wafer test positioning device or translation, to drive the chip to be moved to the test station；
The test suite being contained in the accommodating chamber, is set to the mounting surface, and the test suite is used for being located at
The chip of the test station carries out performance detection；
Safety door is set to the edge of the installing port；And
Locking member, operationally locking or unlock, so that the safety door locks or opens.
The locking member is power lock in one of the embodiments,.
In one of the embodiments, further include protective cover plate, protective port, the protective cover are provided on the safety door
Plate is covered on the protective port.
In one of the embodiments, further include filter, the filter is provided with air inlet and gas outlet, it is described into
Port and the gas outlet are connected to the accommodating chamber respectively.
The translation component includes: in one of the embodiments,
First translating element, including the first sliding rail, first motor and the first sliding block extended in a first direction, described first is sliding
Rail is fixed on the mounting surface, and first sliding block is slidably disposed in first sliding rail, and the first motor is for driving
First sliding block is moved to slide along first sliding rail；And
Second translating element, including the second sliding rail, the second motor and the second sliding block extended in a second direction, described second is sliding
Rail is fixed on first sliding block backwards to the surface of first sliding rail, and second sliding block is slidably disposed in described second
Sliding rail, the rotary components and the wafer test positioning device are fixed on second sliding block backwards to the table of second sliding rail
Face, second motor is for driving second sliding block to slide along second sliding rail.
The rotary components include turntable and actuator in one of the embodiments, and the turntable can be rotatably set
In the surface of second sliding block, the actuator and the turntable are sequentially connected, and the wafer test positioning device is fixed on
The turntable is backwards to the surface of second sliding block.
The wafer test positioning device includes: in one of the embodiments,
The substrate to play a supportive role has loading end；
Multiple lifters are installed on the loading end；
Vacuum absorbing platform is set to the one end of the multiple lifters far from the loading end, the multiple lifters
The vacuum absorbing platform can be driven to go up and down along the first direction；The vacuum absorbing platform has vacuum chamber, the vacuum
The surface of absorption platform offers multiple vacuum absorption holes being connected to the vacuum chamber.
The test suite includes: in one of the embodiments,
Optical module, including launching fiber, receive light, optical drive part and along perpendicular to the first direction and described
The optics guide rail that the third direction of second direction extends, the optical drive part is for driving the launching fiber and the reception
Optical fiber is moved along the optics guide rail；
Electric components, the electric components include probe, electricity actuator and along perpendicular to the first direction and described
The electricity guide rail that the third direction of second direction extends, the electricity actuator is for driving the probe along the electricity guide rail
It is mobile.
It in one of the embodiments, further include camera positioning component, the camera positioning component is contained in the receiving
It is intracavitary and corresponding with the test station.
It in one of the embodiments, further include two Xelminators being contained in the accommodating chamber, it is described two
Xelminator is respectively arranged at the two sides of the mounting surface, the angle-adjusting mechanism, described to form static elimination region
Wafer test positioning device and the test suite are respectively positioned in the static elimination region.
The inner wall of above-mentioned automation wafer tester, accommodating chamber can be by angle-adjusting mechanism, wafer test positioning device
And test suite is isolated with external environment, to play a good protective effect.When wafer completion test, wafer need to be replaced
When, angle-adjusting mechanism, wafer test positioning device and the stop motion of test suite elder generation, and then locking member unlocks, to open peace
Air cock, and then can realize the replacement of wafer；If restarting automation wafer tester, locking member locking, safety door are sealed
Later, angle-adjusting mechanism, wafer test positioning device and test suite move again, are tested with the performance to wafer.Cause
This, angle-adjusting mechanism, wafer test positioning device and test suite are contained in accommodating chamber, and pass through control locking member lock
It closes or unlocks, the phenomenon that can effectively avoid machine all standing when throwing open and throwing open of safety door and cause instrument impaired is sent out
It is raw, thus safety with higher.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that wafer tester is automated during the utility model is preferably implemented；
Fig. 2 is the schematic diagram of internal structure of accommodating chamber in automation wafer tester shown in Fig. 1；
Fig. 3 is the structural schematic diagram of the angle-adjusting mechanism in automation wafer tester shown in Fig. 1；
Fig. 4 is that the structural schematic diagram after safety door is removed in automation wafer tester shown in Fig. 1；
Fig. 5 is the structural schematic diagram of the wafer test positioning device in automation wafer tester shown in Fig. 1；
Fig. 6 is the explosive view of wafer test positioning device shown in Fig. 5.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes to the utility model
The understanding of disclosure is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
Also referring to Fig. 1, Fig. 2 and Fig. 3, the automation wafer tester 10 in the utility model preferred embodiment is wrapped
Include body 200, angle-adjusting mechanism 300, wafer test positioning device 100, test suite 400, safety door 800 and locking member
810.Automation wafer tester 10 is for fixing and testing the chip on wafer.
Referring to Figure 4 together, body 200 has accommodating chamber 230.Generally, body 200 need to be by with larger mechanical strength
Alloy, plastic-steel or other high molecular materials be made, to prevent body 200 from deforming and being broken at work.Accommodating chamber
230 bottom wall forms mounting surface 210, is provided with test station 220 on mounting surface 210.Wafer can be placed in test station 220, with
Conveniently it is tested for the property.Specifically, the internal environment of accommodating chamber 230 can be set as needed for high temperature, sterile, vacuum or
Other environment, to meet the needs of wafer test.
The side wall of accommodating chamber 230 offers installing port 240.Therefore, wafer can also be placed in accommodating chamber from installing port 240
In 230.When being completed, wafer can take out from installing port 240.
Angle-adjusting mechanism 300 is contained in accommodating chamber 230, and is installed on mounting surface 210.Angle-adjusting mechanism 300 wraps
Include rotary components 310 and translation component 320.Angle-adjusting mechanism 300 is rotatable or translates, and chip is moved to test station
220。
Wafer test positioning device 100 is contained in accommodating chamber 230, for adsorbing simultaneously fixed chip.Wafer test positioning
Device 100 is installed on surface of the angle-adjusting mechanism 300 backwards to mounting surface 210.Angle-adjusting mechanism 300 can drive wafer test
The rotation of positioning device 100 or translation, to drive chip to be moved to test station 220.
In the present embodiment, translation component 320 includes the first translating element 322 and the second translating element 324.
First translating element 322 includes the first sliding rail 3223 extended in a first direction, first motor (figure is not marked) and first
Sliding block 3224.First sliding rail 3223 is fixed on mounting surface 210, and the first sliding block 3224 is slidably disposed in the first sliding rail 3223.
First motor is for driving the first sliding block 3224 to slide along the first sliding rail 3223.
Second translating element 324 includes the second sliding rail 3243 extended in a second direction, the second motor (figure is not marked) and second
Sliding block 3244.Second sliding rail 3243 is fixed on the first sliding block 3244 backwards to the surface of the first sliding rail 3243.Second sliding block 3244 can
It is slidingly arranged at the second sliding rail 3243, rotary components 310 and wafer test positioning device 100 are fixed on the second sliding block 3244 back
To the surface of the second sliding rail 3243.Second motor is for driving the second sliding block 3244 to slide along the second sliding rail 3243.
When first motor drives the first sliding block 3224 to slide along the first sliding rail 3223, the first sliding block 3224 can drive second
Translating element 324 and wafer test positioning device 100 are moved along first direction.When second motor driven the second sliding block 3244 is along second
When sliding rail 3243 slides, the second sliding block 3244 can drive wafer test positioning device 100 to move in a second direction.Therefore, when solid
When the position of the chip in wafer test positioning device 100 and test station 220 are deviateed, pass through the first translating element
322 and second translating element 324 drive wafer test positioning device 100 mobile, coarse adjustment can be carried out to the position of chip.
Further, in the present embodiment, rotary components 310 include turntable 312 and actuator (not shown).Turntable 312
It is rotatablely arranged at the surface of the second sliding block 3244, actuator and turntable 312 are sequentially connected.Wafer test positioning device 100
It is fixed on surface of the turntable 312 backwards to the second sliding block 3244.
When turntable 312 works, actuator drives turntable 312 that wafer test positioning device 100 is driven to rotate.Since wafer is surveyed
Multiple wafers are fixed in examination positioning device 100, when test, by rotation, chip can be aligned with test station 220, are convenient for
Accurately chip is tested for the property.After the completion of test, turntable 312 is rotated, the chip for completing performance test leaves test work
Position 220, next chip to be measured are moved to test station 220, carry out loop test.
Test suite 400 is contained in accommodating chamber 230, and is installed on mounting surface 210.Test suite 400 is used for being located at
The chip of test station 220 carries out performance detection.
It for the precision for promoting wafer performance test, need to carry out under certain circumstances, and angle-adjusting mechanism 300, crystalline substance
Circle test fixture 100 and test suite 400 are not allow for any damage.Therefore, angle-adjusting mechanism 300, wafer are surveyed
Examination positioning device 100 and test suite 400 are set in accommodating chamber 230, can not only be needed to control accommodating chamber 230 according to test
Internal environment, damage of the extraneous factor to instrument can also be stopped, convenient for promoted wafer test precision, thus have compared with
Good test effect.Wherein, test suite 400 can optical property to chip, electric property, thermodynamic property, characterization performance
And other performances are tested.The test performance project of test suite 400 can be set as needed.
Specifically in the present embodiment, test suite 400 includes optical module 410 and electric components 420.
Optical module 410 includes launching fiber 414, reception optical fiber 416, optical drive part 418 and edge perpendicular to first party
To and second direction third direction extend optics guide rail 412.Optical drive part 418 is for driving launching fiber 414 and connecing
Optical fiber 416 is received to move along optics guide rail 412.Optical module 410 is used to test the optical property of chip.
Launching fiber 414 is used for the surface emitting light to chip, and reception optical fiber 416 is reflected for receiving from chip surface
Light.By the energy difference between the light of comparison transmitting and the light of reflection, to obtain the optical property ginseng of chip surface
Number.When work, optical drive part 418 drives launching fiber 414 and reception optical fiber 416 to move along optics guide rail 412, so that transmitting
Optical fiber 414 is moved to the position that can emit light to chip surface, and reception optical fiber 416 is moved to receivable chip surface reflected light
The position of line.
Electric components 420 include probe 422, electricity actuator 426 and along the perpendicular to first direction and second direction
The electricity guide rail 424 that three directions extend.Electricity actuator 426 is for driving probe 422 to move along electricity guide rail 424.Electricity group
Part 420 can be used for testing the electric property of chip.
Probe 422 sends electrical signal for contacting with chip, and to chip, with the electric property of detection chip.Specifically
Ground, when electric components work, electricity actuator 426 drives probe 422 to move along third direction, so that probe 422 and chip
Surface contact.In turn, probe 422 sends electrical signal with the electric property of detection chip.
Safety door 800 is set to the edge of installing port 240.Safety door 800 can cover installing port 240.
Operationally locking or the unlock of locking member 810, so that safety door 800 locks or opens.Specifically, wafer is automated
When test device 10 works, 810 locking of locking member, safety door 800 is locked on the edge of installing port 240, in accommodating chamber 230
Closed working environment is formed, prevents external environment from generating interference to the element in accommodating chamber 230.When crystalline substance is installed or retracted to needs
Bowlder, locking member 810 unlock, and safety door 800 is opened with respect to installing port 240, and operator can operate.
The inner wall of above-mentioned automation wafer tester 10, accommodating chamber 230 can be by angle-adjusting mechanism 300, wafer test
Positioning device 100 and test suite 400 are isolated with external environment, to play a good protective effect.When wafer completion test, need
When being replaced to wafer, angle-adjusting mechanism 300, wafer test positioning device 100 and the first stop motion of test suite 400,
And then locking member 810 unlocks, and with opening safety door 800, and then can realize the replacement of wafer；If restarting automation wafer is surveyed
Try 10 devices, 810 locking of locking member, after safety door 800 is sealed, angle-adjusting mechanism 300, wafer test positioning device 100
And test suite 400 moves again, to test wafer performance.Therefore, angle-adjusting mechanism 300, wafer test are positioned
Device 100 and test suite 400 are contained in accommodating chamber 230, and by setting control 810 locking of locking member or unlock, can be had
The phenomenon that effect avoids machine all standing when throwing open and throwing open of safety door 800 and causes instrument impaired occurs, thus has
There is higher safety.
Specifically, angle-adjusting mechanism 300, wafer test positioning device 100, test suite 400 and locking member 810 can lead to
It crosses manual control to work, work can also be controlled by controller (not shown).Specifically in the present embodiment, angle adjustment
Mechanism 300, wafer test positioning device 100, test suite 400 and locking member 810 can be controlled by controller, automatic to improve
The working efficiency for changing wafer tester 10, realizes the automation of wafer test.
In the present embodiment, controller and 810 communication connection of angle-adjusting mechanism 300, test suite 400 and locking member.
Controller controls signal for receiving, and according to control signal trigger angle adjustment mechanism 300, test suite 400 and locking member
810.Automation wafer tester 10 is operated for convenience of operator, the outer wall of body 200 is additionally provided with and controls
Display, keyboard and the button of device connection.Operator can send control signal to controller by operation button and keyboard.It is aobvious
Show that device can show the operational data of automation 10 internal element of wafer tester, to facilitate operation personnel intuitively to testing
Journey is monitored.
Specifically, the call button of starting and stopping is provided on the surface of automation wafer tester 10.Work as needs
Safety door 800 is opened, when being placed or taken out wafer, presses stop button, controller controls angle-adjusting mechanism 300 and test group
400 stop motion of part, and then control locking member 810 and unlock, safety door 800 is i.e. openable；It is brilliant when needing to restart automation
When circle test device 10, safety door 800 is shut, start button is pressed, controller controls 810 locking of locking member, safety door first
800 can firmly be locked on the edge of installing port 240, and then controller angle-adjusting mechanism 300 and test suite 400 work.
Therefore, 810 locking of locking member or unlock are controlled by setting controller, can effectively avoid throwing open and dashing forward for safety door 800
Machine all standing when so opening and the phenomenon for causing instrument impaired occurs, thus safety with higher.
Further, in the present embodiment, locking member 810 is power lock.
By the way that power lock is arranged, it is easy to implement the automation of automation 10 course of work of wafer tester.In addition, power
Safety door 800 can be firmly locked on the edge of installing port 240 in locking by lock, and safety door 800 can be effectively prevent unexpected
The phenomenon that opening and leading to machine all standing generation.
Specifically, power lock includes key and lock body.Key is installed on safety door 800.The surface of key offers through slot.
Lock body is installed on the edge of installing port 240.The lock body position opposite with power lock offers slot.The inside of lock body is additionally provided with
Resilient pin.Start button and stop button are provided on the outer wall of body.When pressing start button, key is inserted into slot
It is interior.Controller controls power lock and is powered, and generates magnetic field.Resilient pin is arranged in slot under the influence of a magnetic field, and key is consolidated
Due in slot, safety door 800 can be locked on the edge of installing port 240 securely, and then controller control angle adjusts machine
Structure 300 and test suite 400 move.When needing to open safety door 800, stop button, controller pilot angle first are pressed
Adjustment mechanism 300 and 400 stop motion of test suite are spent, and then controller control power lock power-off, magnetic field disappear, resilient pin
It is popped up from slot, the opening of safety door can be realized in power lock unlock.
In the present embodiment, automating wafer tester 10 further includes protective cover plate 820.Protective port is provided on safety door
830, protective cover plate 820 is covered on protective port 830.
Protective cover plate 820 is the transparent organic glass component with preferable protective action.By the way that protective cover plate 820 is arranged,
Injury of wafer when carrying out optical performance test to eyes can be prevented, there is preferable protective action.Meanwhile operator can be with
The working condition of element in accommodating chamber 230 is observed, by protective cover plate 820 so as to the operation to automation wafer tester 10
It is monitored in real time.
In the present embodiment, automation wafer tester 10 further includes filter 900.Filter 900 is provided with air inlet
Mouth and gas outlet, air inlet and gas outlet are connected to accommodating chamber 230 respectively.
For the precision for improving wafer test, wafer need to be placed in clean environment and be tested.Filter 900 works
When, the air inside accommodating chamber 230 enters in filter 900 from air inlet, and the air after filtering is discharged into receipts from gas outlet
In cavity 230.Therefore, by setting filter 900, a more clean working environment can be provided for wafer test, thus
With preferable test effect.
It should be pointed out that in other embodiments, filter 900 also could alternatively be other filter devices, only need true
Guarantor can play a role in filtering to the air in accommodating chamber 230.Further, it is also possible to which sterilizer, heater is set as needed
Or other function device, to provide suitable working environment for wafer test.
Wafer test positioning device 100 can fix the fixed form of chip by fastener, open up limiting groove and fix,
It can also be fixed by way of vacuum suction.
Specifically in the present embodiment, wafer test positioning device 100 fixes chip by the way of vacuum suction.Vacuum
Chip can be stably fixed in wafer test positioning device 100 by the mode of absorption.In addition, vacuum suction mode without using
Damage of the external fastening to chip surface can be effectively prevented in external fastening, to improve the precision of chip.
Also referring to Fig. 5 and Fig. 6, further, in the present embodiment, wafer test positioning device 100 includes substrate
110, multiple lifters 120 and vacuum absorbing platform 130.
Substrate 110 plays a supportive role, and has loading end 112.
Multiple lifters 120 are installed on loading end 112.
Vacuum absorbing platform 130 is set to the multiple one end of lifters 120 far from loading end 112.Multiple lifters 120 can
Vacuum absorbing platform 130 is driven to go up and down along first direction.Vacuum absorbing platform 130 has vacuum chamber 132, vacuum absorbing platform
130 surface offers multiple vacuum absorption holes 134 being connected to vacuum chamber 132.
Substrate 110 is generally made of alloy, plastic-steel or other high molecular materials with larger mechanical strength, to prevent
Substrate 110 deforms and is broken during the work time.Vacuum absorbing platform 130 is for adsorbing and fixing wafer and chip.It rises
Drop part 120 is used to adjust the gradient of height and vacuum absorbing platform 130 of the vacuum absorbing platform 130 apart from loading end 112.
For wafer when carrying out optical property and electrical performance testing, wafer need to be angled with test suite 400, to reach
To good test effect.When wafer test positioning device 100 works, part lifters 120 can drive vacuum absorbing platform 130
Part lifting.In turn, difference in height is formed between fixed lifters 120 and the lifters 120 for carrying out elevating movement, very
Empty 130 run-off the straight of absorption platform, so that the angle between wafer and test suite 400 is adjusted, to reach good
Test effect.Alternatively, if the position of wafer test positioning device 100 and test suite 400 there are when gap, can also be to complete
The lifters 120 in portion carry out lifting, to adjust the distance between vacuum absorbing platform 130 and loading end 112, to realize vacuum
The adjusting of the distance between absorption platform 130 and test suite 400.
Specifically, lifters 120 can be hydraulic stem, screw rod or screw element.Specifically in the present embodiment, multiple liftings
Mounting portion 122 is provided on part 120, the side of vacuum absorbing platform 130 towards loading end 112 is provided with multiple auxiliary sections
136.Mounting portion 122 is internal thread structure, and auxiliary section 136 is external thread structure.Multiple auxiliary sections 136 respectively with multiple mounting portions
122 cooperations, so as to form threads turn connection between lifters 120 and vacuum absorbing platform 130.
When lifters 120 work, the mounting portion 122 of part lifters 120 is fixed, rotates rest part lifters
120 mounting portion 122, rest part mounting portion 122 are further screwed togather with corresponding auxiliary section 136.In turn, fixed
Lifters 120 and rotation lifters 120 between form difference in height, 130 run-off the straight of vacuum absorbing platform, so that brilliant
Angle between round and test suite 400 is adjusted.It therefore, is internal thread structure, auxiliary section by setting mounting portion 122
136 be external thread structure so that lifters 120 installation and adjust it is easy to operate, convenient for improve working efficiency.
It should be pointed out that in other embodiments, mounting portion 122 or external thread structure, auxiliary section 136 is interior
Helicitic texture.
Further, in the present embodiment, wafer test positioning device 100 further includes bolt 140.Lifters 120 include
Base portion 124 and the riffled tube 126 for protruding from base portion 124.The surface of vacuum absorbing platform 130 towards loading end 112 is provided with
Threaded post, riffled tube 126 are screwed togather with threaded post.Base portion 124 is detachably secured to substrate 110 by bolt 140.
When work, rotating part lifters 120, partial internal thread pipe 126 is further screwed togather with partial threads column.Therefore,
In the case where rest part lifters 120 remain stationary, the vacuum absorbing platform 130 of rotation portion and substrate 110 it
Between distance reduce and lead to 130 run-off the straight of vacuum absorbing platform, and then adjustable vacuum absorbing platform 130 and test suite
Angle between 400, to meet test needs.If be pointed out that excessive height of the vacuum absorbing platform 130 away from substrate or
When person is too low, all lifters 120 can also be rotated simultaneously, so that riffled tube 126 is screwed togather with multiple threaded posts, and then are made
It obtains the whole opposing substrate 110 of vacuum absorbing platform 130 to rise or fall, to meet the need of 130 test height of vacuum absorbing platform
It asks.After the height or Slope angle adjustment of vacuum absorbing platform 130, base portion 124 can be fixed on substrate 110 by bolt 140, with
Lifters 120 are avoided to occur to slide and influence test effect during the work time.Specifically, base portion 124 is opposite with substrate 110
Position offers threaded hole 128, and bolt 140 and the threaded hole 128 of base portion 124 and substrate 110 screw togather, can be by lifters
120 and vacuum absorbing platform 130 be stably fixed to substrate 110.Therefore, by the way that bolt 140 is arranged, lifters can be effectively prevent
120 move, and are tested for the property in the angle adjusted convenient for wafer, thus have preferable test effect.
Further, threaded post can be integrally formed with vacuum absorbing platform 130, can also be with vacuum absorbing platform 130
Separately molding, and vacuum absorbing platform 130 is fixed on towards the surface of substrate 110 by fastener.
Further, in the present embodiment, multiple threaded posts are along the equally circumferentially spaced of vacuum absorbing platform 130.
I.e. lifters 120 are also arranged along the axial direction of substrate 110 at equal intervals.Therefore, flat along vacuum suction convenient for lifters 120
The stress that the equally spaced distribution vacuum absorbing platform 130 of the circumferential direction of platform 130 applies, to avoid wafer test positioning device 100
Stress is concentrated and deforms or be broken, convenient for extending the service life of wafer test positioning device 100.Moreover, lifters
120 are set to the edge of substrate 110, are also convenient for when On-Wafer Measurement positioning device 100 needs to carry out angle adjustment to lifters
120 are operated.
In the present embodiment, wafer test positioning device 100 further includes locking nut 150.Locking nut 150 is sheathed on spiral shell
On line column, and screwed togather with threaded post.
By the way that locking nut 150 is arranged, the mounting portion 122 and vacuum absorbing platform 130 of lifters 120 can effectively avoid
The opposite sliding of position occurs after angle adjustment for auxiliary section 136, and then the gradient of vacuum absorbing platform 130 is kept to fix
It is constant, thus there is preferable test effect.
In the present embodiment, wafer test positioning device 100 further includes heating rod 160 and temperature controller.Vacuum suction
The side wall of platform 130 offers the mounting hole being connected to vacuum chamber 132.Heating rod 160 is arranged in mounting hole, and with mounting hole
Inner wall is closely sealed.Temperature controller is electrically connected with heating rod 160.
Since wafer performance test need to carry out at high temperature, it can quickly be inhaled heating, vacuum by setting heating rod 160
Attached platform 130.Temperature controller can control heating rod 160 to be heated, and the temperature of vacuum absorbing platform 130 is maintained and is set
It sets in range, thus accurate testing degree with higher.
Further, heating rod 160 is multiple.Multiple heating rods 160 are arranged at equal intervals.
The heating rod 160 being arranged at equal intervals heats up uniformly and rapidly convenient for vacuum absorbing platform 130, so that vacuum
The temperature difference of 130 surface of absorption platform everywhere is smaller, convenient for reducing test error, promotes measuring accuracy.
In the present embodiment, wafer test positioning device 100 further includes thermocouple 170.Thermocouple 170 and temperature controller
Electrical connection.Thermocouple 170 is used to measure the temperature value of vacuum absorbing platform 130 and feeds back to temperature controller.
Thermocouple 170 has the function of detecting 130 temperature of vacuum absorbing platform.Thermocouple 170 is electrically connected with temperature controller
It connects, the temperature value for the vacuum absorbing platform 130 that can be will test feeds back to temperature controller.If the temperature value of feedback is higher than default temperature
Angle value, temperature controller will control heating rod 160 and stop heating, to realize cooling.If the temperature value of feedback is lower than preset temperature
Value, then temperature controller is heated heating rod 160 is controlled, to realize heating.Therefore, it by the way that thermocouple 170 is arranged, is easy to implement
The temperature controlled automation of wafer test positioning device 100.
In the present embodiment, wafer test positioning device 100 further includes vacuum generator 180 and vacuum exhaust pipe.Vacuum
Generator 180 is connected to by vacuum exhaust pipe with vacuum chamber 132.
By setting vacuum generator 180 and vacuum exhaust pipe, the air entered in vacuum chamber can be taken away in time, then
The good vacuum degree of vacuum chamber 132 is maintained, wafer stabilizing is fixed on vacuum absorbing platform
130.And be evacuated by vacuum generator 180 and the vacuum chamber 132 that is formed, vacuum environment are stablized, it is convenient for wafer test
Positioning device 100 efficiently works.
In the present embodiment, wafer test positioning device 100 further includes vacuum induction device 190.Vacuum induction device 190 is used for
Detect the vacuum values of vacuum chamber 132.
Vacuum induction device 190 can be measured and be shown to the vacuum values of vacuum chamber 132.Under normal circumstances, vacuum values are
Stable numerical value, when vacuum values change, it is possible to which there are mechanical breakdowns.Therefore, the setting of vacuum induction device 190, just
The vacuum environment of vacuum chamber can be monitored in real time in operator, when mechanical breakdown occurs, can in time to failure into
Row investigation, improves the production efficiency of wafer test positioning device 100.
In the present embodiment, automation wafer tester 10 further includes airborne laser range finder 500.Airborne laser range finder 500 is received
It is dissolved in accommodating chamber 230.Airborne laser range finder 500 is movably arranged at mounting surface 210, and connect with controller communication.Laser
Range finder 500 feeds back to controller for obtaining chip in the thickness parameter of third direction, is existed with calibration test component 400
On third direction at a distance from chip surface.
Due between mechanically actuated there are inevitable error, the thickness of chip after molding can not be able to maintain
Unanimously.And in optical property and electrical performance testing, need the position to probe 422, launching fiber 414 and reception optical fiber 416
It sets and is moved, to reach good test effect.When test, probe 422 need to be contacted with the surface of chip, and probe 422 is displaced
It is excessive, it is possible to excessive rigid contact occur with the surface of chip and damage chip.Launching fiber 414 and reception optical fiber 416
Also the effect that within the scope of pre-determined distance, can be only achieved good transmitting and reception light with the surface of chip is needed.Therefore, pass through
Thickness parameter on the acquisition chip third direction of airborne laser range finder 500 is set, and feeds back to controller.Controller can be according to reception
The thickness parameter signal of airborne laser range finder 500 be compared with preset thickness value, and control probe 422, launching fiber 414 and
The position along third direction of reception optical fiber 416 is moved, to avoid probe 422, launching fiber 414 and reception optical fiber 416 and core
Rigid contact between piece surface, to reach good test effect.
In the present embodiment, automation wafer tester 10 further includes camera positioning component 700.Camera positioning component
700 are contained in the accommodating chamber, and corresponding with test station 220.
Camera positioning component 700 is connect with controller communication.Camera positioning component 700 is used to take pictures towards test station 220,
And controller is fed back to after being compared with default photo.By the way that camera positioning component 700 is arranged, the position of chip can be carried out
It accurately positions, to reach good test effect.
Specifically, camera positioning component 700 includes camera 710, Locating driver part (not shown) and positioning slide 720.It is fixed
Position sliding rail 720 extends along third direction.Camera 710 is slidably disposed in positioning slide 720, Locating driver part and camera 710
Transmission connection.Before test, Locating driver part drives camera 710 to slide along third direction, so that camera 710 is moved to suitable bat
According to position.When test, Locating driver part does not work, and 710 position of camera is fixed.Camera 710 is taken pictures towards test station 220, and will
The photo of shooting is compared with default photo.If the photo and default photo of shooting are inconsistent, camera 710 will be sent out to controller
Send feedback signal.Controller controls angle-adjusting mechanism 300 and drives the translation of wafer test positioning device 100 or rotation, with adjustment
The position of chip is until corresponding with test station 220.In addition, after the completion of the performance test of chip, when wafer is removed, in order to
Convenient for operation, Locating driver part drives camera 710 to move along backwards to the direction of mounting surface 210, to facilitate operation personnel by wafer
It removes.
In the present embodiment, automation wafer tester 10 further includes two Xelminators 600.Two static eliminations
Device 600 is contained in accommodating chamber 230, and is respectively arranged at the two sides of mounting surface 210, to form static elimination region.Angle tune
Complete machine structure 300, wafer test positioning device 100 and test suite 400 are respectively positioned in static elimination region.
Automation wafer tester 10 needs to be powered when working, and the engineering goods of energization can generate electrostatic at work.
And electrostatic will affect the test of the electric property of chip, to reduce the measuring accuracy of chip.Therefore, by the way that static elimination is arranged
Device 600 can eliminate the electrostatic in automation 10 course of work of wafer tester, to improve the measuring accuracy of chip.
For convenience of the placement of automation wafer tester 10, it is additionally provided in the bottom of automation wafer tester 10
Support leg and universal wheel.
The course of work of automation wafer tester 10 is sketched by being described below:
Controller controls 810 locking of locking member, and safety door 800 is sealed, and then controller control angle-adjusting mechanism 300 is transported
It is dynamic, to drive wafer test positioning device 100 and chip to be moved to test station 220.Camera 710 is taken pictures towards test station 220,
And the photo of shooting is compared with default photo, comparison result is fed back into controller.Controller according to feedback result into
Row judgement, if chip is not at test station 220, controller continues to control the movement of angle-adjusting mechanism 300, until chip moves
It moves to test station 220.In turn, thickness parameter of the controller control airborne laser range finder 500 to chip in third direction is surveyed
Amount, and the thickness parameter of measurement is compared with preset parameter value, and test suite 400 is controlled according to comparison result and is moved to
Test position with preferable test effect, test suite 400 are tested for the property chip, and test result is fed back to control
Device processed.After the completion of test, controller controls turntable 312 and rotates, and next chip to be measured on wafer is moved to test station 220
It is tested for the property.When all wafer tests are completed, controller controls angle-adjusting mechanism 300 and test suite 400 stops
Work, and then controller control locking member 810 unlocks, safety door 800 is opened, and can be taken out wafer, test process terminates.
The inner wall of above-mentioned automation wafer tester 10, accommodating chamber 230 can be by angle-adjusting mechanism 300, wafer test
Positioning device 100 and test suite 400 are isolated with external environment, to play a good protective effect.When wafer completion test, need
When being replaced to wafer, angle-adjusting mechanism 300, wafer test positioning device 100 and the first stop motion of test suite 400,
And then locking member 810 unlocks, and with opening safety door 800, and then can realize the replacement of wafer；If restarting automation wafer is surveyed
Try 10 devices, 810 locking of locking member, after safety door 800 is sealed, angle-adjusting mechanism 300, wafer test positioning device 100
And test suite 400 moves again, to test wafer performance.Therefore, angle-adjusting mechanism 300, wafer test are positioned
Device 100 and test suite 400 are contained in accommodating chamber 230, and by control 810 locking of locking member or unlock, can effectively be kept away
The phenomenon exempted from machine all standing when throwing open and throwing open of safety door 800 and cause instrument impaired occurs, thus have compared with
High safety.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of automation wafer tester, for fixing and testing the chip on wafer characterized by comprising
Body, has accommodating chamber, and the bottom wall of the accommodating chamber forms mounting surface, is provided with test station on the mounting surface, institute
The side wall for stating accommodating chamber offers installing port；
The angle-adjusting mechanism being contained in the accommodating chamber is installed on the mounting surface, including rotary components and translation component；
The wafer test positioning device being contained in the accommodating chamber, for adsorbing simultaneously fixed chip, the wafer test positioning
Device is installed on the angle-adjusting mechanism backwards to the surface of the mounting surface, and the angle-adjusting mechanism can drive the wafer
Test fixture rotation or translation, to drive the chip to be moved to the test station；
The test suite being contained in the accommodating chamber, is set to the mounting surface, and the test suite is used for described to being located at
The chip of test station carries out performance detection；
Safety door is set to the edge of the installing port；And
Locking member, operationally locking or unlock, so that the safety door locks or opens.
2. automation wafer tester according to claim 1, which is characterized in that the locking member is power lock.
3. automation wafer tester according to claim 1, which is characterized in that it further include protective cover plate, the peace
Protective port is provided on air cock, the protective cover plate is covered on the protective port.
4. automation wafer tester according to claim 1, which is characterized in that it further include filter, the filtering
Device is provided with air inlet and gas outlet, and the air inlet and the gas outlet are connected to the accommodating chamber respectively.
5. automation wafer tester according to claim 1, which is characterized in that the translation component includes:
First translating element, including the first sliding rail, first motor and the first sliding block extended in a first direction, first sliding rail is solid
Due to the mounting surface, first sliding block is slidably disposed in first sliding rail, and the first motor is for driving institute
The first sliding block is stated to slide along first sliding rail；And
Second translating element, including the second sliding rail, the second motor and the second sliding block extended in a second direction, second sliding rail is solid
Due to first sliding block backwards to the surface of first sliding rail, it is sliding that second sliding block is slidably disposed in described second
Rail, the rotary components and the wafer test positioning device are fixed on second sliding block backwards to the table of second sliding rail
Face, second motor is for driving second sliding block to slide along second sliding rail.
6. automation wafer tester according to claim 5, which is characterized in that the rotary components include turntable and
Actuator, the turntable are rotatablely arranged at the surface of second sliding block, and the actuator and the turntable are sequentially connected,
The wafer test positioning device is fixed on the turntable backwards to the surface of second sliding block.
7. automation wafer tester according to claim 5, which is characterized in that the wafer test positioning device packet
It includes:
The substrate to play a supportive role has loading end；
Multiple lifters are installed on the loading end；
Vacuum absorbing platform, is set to the one end of the multiple lifters far from the loading end, and the multiple lifters can band
The vacuum absorbing platform is moved to go up and down along the first direction；The vacuum absorbing platform has vacuum chamber, the vacuum suction
The surface of platform offers multiple vacuum absorption holes being connected to the vacuum chamber.
8. automation wafer tester according to claim 5, which is characterized in that the test suite includes:
Optical module, including launching fiber, reception light, optical drive part and edge are perpendicular to the first direction and described second
The optics guide rail that the third direction in direction extends, the optical drive part is for driving the launching fiber and the reception optical fiber
It is moved along the optics guide rail；
Electric components, the electric components include probe, electricity actuator and edge perpendicular to the first direction and described second
The electricity guide rail that the third direction in direction extends, the electricity actuator is for driving the probe to move along the electricity guide rail
It is dynamic.
9. automation wafer tester according to claim 1, which is characterized in that further include camera positioning component, institute
It states camera positioning component to be contained in the accommodating chamber, and corresponding with the test station.
10. automation wafer tester according to claim 1, which is characterized in that further include being contained in the receiving
Two intracavitary Xelminators, described two Xelminators are respectively arranged at the two sides of the mounting surface, to form electrostatic
Region is eliminated, the angle-adjusting mechanism, the wafer test positioning device and the test suite are respectively positioned on the electrostatic and disappear
Except in region.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820725073.0U CN208225844U (en) | 2018-05-16 | 2018-05-16 | Automate wafer tester |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820725073.0U CN208225844U (en) | 2018-05-16 | 2018-05-16 | Automate wafer tester |
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| CN208225844U true CN208225844U (en) | 2018-12-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108493124A (en) * | 2018-05-16 | 2018-09-04 | 深圳市杰普特光电股份有限公司 | Automate wafer test board |
| CN109946579A (en) * | 2019-04-04 | 2019-06-28 | 杭州载力科技有限公司 | A kind of semiconductor wafer detecting device |
| CN110702526A (en) * | 2019-10-14 | 2020-01-17 | 中芯集成电路制造(绍兴)有限公司 | Wafer air pressure resistance reliability testing equipment and testing method thereof |
| CN111307058A (en) * | 2020-03-20 | 2020-06-19 | 华天慧创科技（西安）有限公司 | Non-contact warping degree measuring jig and measuring method |
| CN111896857A (en) * | 2019-05-05 | 2020-11-06 | 长鑫存储技术有限公司 | Wafer testing equipment and wafer position adjusting method during electrical testing |
| CN113074626A (en) * | 2021-04-07 | 2021-07-06 | 嘉兴微拓电子科技股份有限公司 | Semiconductor wafer flatness detection equipment |
| CN114089150A (en) * | 2020-07-03 | 2022-02-25 | 富士电机株式会社 | Semiconductor chip testing device and testing method |
| CN116344395A (en) * | 2023-03-07 | 2023-06-27 | 东莞市智赢智能装备有限公司 | Edge finder |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493124A (en) * | 2018-05-16 | 2018-09-04 | 深圳市杰普特光电股份有限公司 | Automate wafer test board |
| CN108493124B (en) * | 2018-05-16 | 2024-07-12 | 深圳市杰普特光电股份有限公司 | Automatic wafer test machine |
| CN109946579A (en) * | 2019-04-04 | 2019-06-28 | 杭州载力科技有限公司 | A kind of semiconductor wafer detecting device |
| CN111896857A (en) * | 2019-05-05 | 2020-11-06 | 长鑫存储技术有限公司 | Wafer testing equipment and wafer position adjusting method during electrical testing |
| CN110702526A (en) * | 2019-10-14 | 2020-01-17 | 中芯集成电路制造(绍兴)有限公司 | Wafer air pressure resistance reliability testing equipment and testing method thereof |
| CN111307058A (en) * | 2020-03-20 | 2020-06-19 | 华天慧创科技（西安）有限公司 | Non-contact warping degree measuring jig and measuring method |
| CN114089150A (en) * | 2020-07-03 | 2022-02-25 | 富士电机株式会社 | Semiconductor chip testing device and testing method |
| CN113074626A (en) * | 2021-04-07 | 2021-07-06 | 嘉兴微拓电子科技股份有限公司 | Semiconductor wafer flatness detection equipment |
| CN116344395A (en) * | 2023-03-07 | 2023-06-27 | 东莞市智赢智能装备有限公司 | Edge finder |
| CN116344395B (en) * | 2023-03-07 | 2023-10-20 | 东莞市智赢智能装备有限公司 | Edge finder |
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