CN113074626A - Semiconductor wafer flatness detection equipment - Google Patents
Semiconductor wafer flatness detection equipment Download PDFInfo
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- CN113074626A CN113074626A CN202110370020.8A CN202110370020A CN113074626A CN 113074626 A CN113074626 A CN 113074626A CN 202110370020 A CN202110370020 A CN 202110370020A CN 113074626 A CN113074626 A CN 113074626A
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- 238000001514 detection method Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 32
- 238000009434 installation Methods 0.000 claims description 15
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 105
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/34—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
Abstract
The invention provides semiconductor wafer flatness detection equipment, which comprises a supporting assembly component, a wafer storage component, a transverse bearing component, a wafer transferring component, a centering adjustment component and a distance detection component, wherein the detection equipment is provided with a group of storage box bodies, corresponds to the position of a transverse carrier plate, enables a transferring gripper on the transverse carrier plate to respectively take and place wafers in each storage box body, and sends the wafers into the distance detection component for detection, and the flatness indexes of the wafers are calculated by converting the distance of the wafers into indexes such as thickness and height through a capacitance distance sensor.
Description
Technical Field
The invention relates to semiconductor production equipment, in particular to semiconductor wafer flatness detection equipment.
Background
In a wafer production process, flatness detection equipment is often required to detect whether a wafer has defects or not so as to ensure product quality. The conventional wafer flatness detection equipment has high cost and inconvenient use, and the detection efficiency of the equipment is still to be improved. Therefore, it is necessary to optimize the structure of the wafer inspection apparatus to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide semiconductor wafer flatness detection equipment, which is used for conveniently detecting the flatness of a wafer.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a semiconductor wafer flatness detection apparatus comprising:
a bearing assembly having an installation space therein;
the wafer storage component is arranged on the supporting assembly component, and a space for placing a wafer is formed in the wafer storage component;
the transverse bearing assembly is arranged on the support assembly and corresponds to the position of the wafer storage assembly;
the wafer transferring component is arranged on the transverse bearing component, can move on the transverse bearing component along the transverse direction, and is used for grabbing and transferring the wafer in the wafer storage component;
the centering adjusting assembly is arranged on the supporting assembly and matched with the wafer transferring assembly, and the centering adjusting assembly performs centering adjustment on the wafer carried by the wafer transferring assembly;
and the distance detection assembly is arranged on the supporting assembly and matched with the wafer transfer assembly, and the wafer transfer assembly transfers the wafer into the distance detection assembly for detection.
The bearing assembly includes:
the wafer storage component is arranged on the outer wall of the supporting frame, and the transverse bearing component, the wafer transferring component, the centering adjusting component and the distance detecting component are arranged on the assembly table board.
The wafer storage assembly comprises:
the storage box bodies are arranged in a group, each storage box body is respectively arranged on the outer wall of the supporting frame and is sequentially arranged along the transverse direction, each storage box body is internally provided with a wafer positioning structure, a wafer to be detected is placed in the storage box body, the supporting frame is internally provided with a group of taking and placing openings, and each taking and placing opening corresponds to the position of the storage box body;
and the unlocking device is matched with the storage box body, and the storage box body is unlocked by the unlocking device.
In one embodiment, the unlocking means comprises:
an unlocking frame having an installation space therein;
the assembly table top is arranged at the top of the unlocking frame;
the switching back plate is arranged on the back of the unlocking frame, the upper section of the switching back plate extends out of the upper part of the supporting frame, and a sheet taking through hole is formed in the switching back plate;
the lifting motor is arranged on the unlocking frame and is positioned below the assembly table board;
the transmission screw rod is positioned below the assembly table surface and is vertically arranged, and a power output shaft of the lifting motor is connected with the transmission screw rod;
the guide sliding rails are provided with a pair of guide sliding rails, and each guide sliding rail is respectively arranged on the unlocking frame and is parallel to the transmission screw rod;
the adapter frame body is positioned below the assembly table board, two ends of the adapter frame body are respectively arranged on the guide slide rails through the guide slide blocks, and the middle part of the adapter frame body is matched with the transmission screw rod through the transmission nut;
the vertical upright columns are provided with a group, and are respectively arranged on the adapter frame body and extend upwards through the assembly table board;
the supporting ring is arranged at the top of the vertical upright post;
the limiting side strips are provided with a pair of limiting side strips, and each limiting side strip is arranged on the supporting ring and is respectively arranged at two ends of the supporting ring;
the transverse moving motor is arranged on the assembly table-board;
and the supporting platform is arranged on the assembly table top through a transverse guide structure and is connected with a power output shaft of the transverse moving motor through a screw rod transmission structure.
In another embodiment, the unlocking means comprises:
an unlocking frame body having an installation space therein;
the assembling panel is arranged at the front part of the unlocking frame body, and an access opening is formed in the assembling panel;
the assembling support plate is arranged at the top of the unlocking frame body and is positioned behind the assembling panel;
the positioning platform is arranged on the assembly carrier plate through a sliding structure and can move on the assembly carrier plate;
the adjusting push rod is arranged on the assembling support plate and is connected with the positioning platform, and the positioning platform is driven to move by the adjusting push rod so as to be close to or far away from the assembling panel;
the positioning tension spring is arranged between the positioning platform and the assembly support plate, and the positioning tension spring drives the positioning platform to move towards the assembly panel so as to enable the wafer box to be matched with the taking and placing through hole;
the vertical platform is arranged in the supporting frame body through a vertical guide rail, is connected with the driving structure and can move along the vertical guide rail;
the transverse platform is arranged on the vertical platform through a transverse guide rail, is connected with the driving structure and can move along the transverse guide rail;
the adapting carrier is arranged on the transverse platform, can move along with the transverse platform, is matched with the taking and placing opening in shape and can be jointed with the wafer box door body through the taking and placing opening;
the matching pin column is arranged on the matching carrier and is matched with the pin hole formed in the wafer box door body, and when the matching carrier is jointed with the wafer box door body, the matching pin column extends into the pin hole;
the adsorption disc is arranged on the matching and connecting carrier, and the adsorption disc adsorbs the wafer box door body when the matching and connecting carrier is jointed with the wafer box door body;
the unlocking key is arranged on the matched and connected carrier and is matched with the lock hole in the wafer box door body, and when the matched and connected carrier is connected with the wafer box door body, the unlocking key extends into the lock hole;
and the unlocking motor is arranged on the adapting and connecting carrier and is connected with the unlocking key, and the unlocking motor drives the unlocking key to operate to unlock the wafer box.
The transverse bearing assembly comprises:
the transverse rail rods are provided with a pair of transverse rail rods, and the transverse rail rods are respectively arranged on the assembly table board and are parallel to each other;
the transverse carrier plate is arranged on the transverse rail rod through a sliding block;
and the transverse motor is arranged on the assembly table surface and is connected with the transverse support plate through a transmission structure, and the transverse motor drives the transverse support plate to move along the transverse line rail rod.
The wafer transfer assembly comprises:
a support floor;
a top support plate located above the bottom support plate;
the supporting side plate is positioned between the supporting bottom plate and the supporting top plate, two ends of the supporting side plate are respectively connected with the supporting bottom plate and the supporting top plate, and an installation space is formed among the supporting bottom plate, the supporting top plate and the supporting side plate in an enclosing way;
the lifting guide rail is vertically arranged, and two ends of the lifting guide rail are respectively connected with the supporting bottom plate and the supporting top plate;
the lifting frame body is arranged on the lifting guide rail through a sliding structure and can lift along the lifting guide rail;
the lifting motor is arranged on the supporting bottom plate, a power output shaft of the lifting motor is connected with the lifting frame body through a transmission structure, and the lifting motor drives the lifting frame body to lift along the lifting guide rail;
the bottom of the deflection cylinder is arranged on the lifting frame body through a rotating structure, can lift along with the lifting frame body and deflect on the lifting frame body, and the top of the deflection cylinder extends out of the supporting top plate;
the deflection motor is arranged on the lifting frame body and can lift along with the lifting frame body, a power output shaft of the deflection motor is connected with the deflection cylinder body through a transmission structure, and the deflection motor drives the deflection cylinder body to deflect;
the grabbing arms are provided with a pair, and each grabbing arm is respectively arranged at the top of the deflection cylinder body and can lift and deflect along with the deflection cylinder body;
the wafer body grippers are arranged in a pair and are respectively installed at the tail ends of the grabbing arms, the wafer body grippers grab the wafer, and the grabbing arms drive the wafer body grippers carrying the wafer to move.
Centering adjusting part includes:
the adjusting seat body is arranged on the assembly table board;
the longitudinal rail rod is arranged on the adjusting seat body and is perpendicular to the transverse rail rod;
the rotating motor is arranged on the longitudinal rail rod through a sliding block and can move along the longitudinal rail rod;
the longitudinal motor is arranged on the adjusting seat body, is connected with the rotating motor through a transmission structure, and drives the rotating motor to move along the longitudinal rail rod;
and the centering sucker is arranged at the tail end of a power output shaft of the rotating motor, is driven to rotate by the rotating motor, and adsorbs and positions the wafer and rotates along with the wafer by the centering sucker.
The distance detection assembly includes:
the detection frame is provided with an installation space, the top of the detection frame is provided with a working table surface for placing a wafer, and a position avoiding through hole is formed in the working table surface;
a linear motor, which is disposed in a transverse direction and whose stator part is installed in the inspection frame;
a lifting motor mounted on a mover member of the linear motor;
the rotary motor is connected with the lifting motor through a transmission structure;
the rotary sucker is arranged on the rotary motor, is driven by the rotary motor to rotate and is communicated with the air exhaust system through an air passage;
and the capacitive distance sensor is arranged on the supporting frame and corresponds to the position of the rotary sucker.
The invention has the advantages that:
this check out test set has set up a set of storage box body, and correspond with horizontal support plate position, make the tongs of transferring on the horizontal support plate can get respectively in each storage box body and put the wafer, detect in sending into apart from the detection subassembly, convert the distance of wafer into the roughness index that index such as thickness height from calculating the wafer through electric capacity distance sensor, it is high to have a detection precision, good stability, advantages such as detection efficiency height, can improve wafer detection speed and precision, reduce the cost of labor, prevent to detect the erroneous judgement, thereby promote product quality.
Drawings
FIG. 1 is a schematic diagram of an external structure of a semiconductor wafer flatness detecting apparatus according to the present invention;
FIG. 2 is a schematic view of the internal structure of the detecting apparatus;
FIG. 3 is a schematic structural diagram of an unlocking device of the 8-inch wafer storage cassette;
FIG. 4 is a schematic structural diagram of an unlocking device of the 12-inch wafer storage cassette;
FIG. 5 is a schematic structural view of a transverse load bearing assembly;
FIG. 6 is a schematic view of a wafer transfer assembly;
FIG. 7 is a schematic structural view of a centering adjustment assembly;
fig. 8 is a schematic structural view of the distance detection assembly.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 8, the semiconductor wafer flatness detecting apparatus according to the present invention includes a supporting assembly 100, a wafer storage assembly 200, a lateral bearing assembly 300, a wafer transfer assembly 400, a centering adjustment assembly 500 and a distance detecting assembly 600, wherein the supporting assembly has an installation space therein, the wafer storage assembly is installed on the supporting assembly and has a space for placing a wafer therein, the lateral bearing assembly is installed on the supporting assembly and corresponds to the wafer storage assembly in position, the wafer transfer assembly is installed on the lateral bearing assembly and can move laterally on the lateral bearing assembly, the wafer transfer assembly picks up and transfers the wafer in the wafer storage assembly, the centering adjustment assembly is installed on the supporting assembly and cooperates with the wafer transfer assembly, the centering adjustment assembly performs centering adjustment on the wafer carried by the wafer transfer assembly, the distance detection assembly is arranged on the supporting assembly and matched with the wafer transfer assembly, and the wafer transfer assembly transfers the wafer to the distance detection assembly for detection.
The bearing assembly includes:
and a support frame 110 having an assembly table 120 therein, the wafer storage assembly being mounted on an outer wall of the support frame, and the lateral load bearing assembly, the wafer transfer assembly, the centering adjustment assembly and the distance detection assembly being mounted on the assembly table.
The wafer storage assembly comprises:
the storage box bodies 210 are provided with a group, each storage box body is respectively arranged on the outer wall of the supporting frame and is sequentially arranged along the transverse direction, each storage box body is internally provided with a wafer positioning structure, a wafer to be detected is placed in the storage box body, the supporting frame is internally provided with a group of taking and placing openings, and each taking and placing opening corresponds to the position of the storage box body;
and the unlocking device 220 is matched with the storage box body, and is used for unlocking the storage box body.
In the embodiment shown in fig. 3, the storage box is an 8-inch wafer storage box, and the corresponding unlocking device includes:
an unlocking frame 221 having an installation space therein;
a mounting table 222 mounted on top of the unlocking frame;
the switching back plate 223 is arranged on the back of the unlocking frame, the upper section of the switching back plate extends out of the upper part of the supporting frame, and a sheet taking through hole is formed in the switching back plate;
a lift motor 224 mounted on the unlocking frame and located below the assembly table;
the transmission screw rod 225 is positioned below the assembly table board and is vertically placed, and a power output shaft of the lifting motor is connected with the transmission screw rod;
a pair of guide rails 226, each of which is installed on the unlocking frame and parallel to the driving screw, respectively;
the adapter frame body 227 is positioned below the assembly table board, two ends of the adapter frame body are respectively arranged on the guide slide rails through the guide slide blocks, and the middle part of the adapter frame body is matched with the transmission screw rod through the transmission nut;
a group of vertical columns 228, which are respectively mounted on the adapter frame body and extend upwards through the assembly table;
a support collar 229 mounted on top of the vertical upright;
the limiting side strips 2210 are arranged in pairs, and are arranged on the supporting ring and are respectively arranged at the two ends of the supporting ring;
the transverse moving motor is arranged on the assembly table-board;
and the supporting platform 2211 is arranged on the assembly table top through a transverse guide structure and is connected with a power output shaft of the transverse moving motor through a screw rod transmission structure.
In the embodiment shown in fig. 4, the storage cassette is a 12-inch wafer storage cassette, and the corresponding unlocking device includes:
an unlocking frame body 231 having an installation space therein;
the assembling panel 232 is arranged at the front part of the unlocking frame body, and an access opening is formed in the assembling panel;
an assembly carrier plate 233 installed on the top of the unlocking frame body and located behind the assembly panel;
a positioning platform 234, which is mounted on the mounting carrier plate through a sliding structure and can move on the mounting carrier plate;
the adjusting push rod is arranged on the assembling support plate and is connected with the positioning platform, and the positioning platform is driven to move by the adjusting push rod so as to be close to or far away from the assembling panel;
a positioning tension spring 235 which is arranged between the positioning platform and the assembly support plate, and the positioning tension spring drives the positioning platform to move towards the assembly panel so as to enable the wafer box to be matched with the taking and placing through hole;
a vertical platform 236 mounted in the support frame via vertical guide rails, engaged with the driving structure, and movable along the vertical guide rails;
a transverse platform 237 mounted to the vertical platform by transverse rails, coupled to the drive structure, and movable along the transverse rails;
an adapter 238 mounted on the transverse platen, movable with the transverse platen, shaped to fit the pick-and-place port, and engageable with the wafer pod door body through the pick-and-place port;
a matching pin 239 mounted on the matching frame and matching with the pin hole opened in the wafer box door, the matching pin extending into the pin hole when the matching frame is engaged with the wafer box door;
an adsorption disc 2310 mounted on the mating carrier, the adsorption disc attracting the wafer cassette door when the mating carrier is engaged with the wafer cassette door;
an unlocking key 2311, which is arranged on the adapting carrier and is adapted to the lock hole in the wafer box door body, and when the adapting carrier is jointed with the wafer box door body, the unlocking key extends into the lock hole;
and an unlocking motor 2312, which is mounted on the adapting carrier and is connected with the unlocking key, and the unlocking motor drives the unlocking key to operate to unlock the wafer box.
The transverse bearing assembly comprises:
a pair of transverse rail rods 310, each of which is installed on the assembly table and parallel to each other;
a transverse carrier plate 320 mounted on the transverse rail bar by a slider;
and the transverse motor 330 is arranged on the assembly table board, is connected with the transverse support plate through a transmission structure, and drives the transverse support plate to move along the transverse line rail rod.
The wafer transfer assembly comprises:
a support base plate 410;
a top support plate 420 located above the bottom support plate;
a supporting side plate 430, which is positioned between the supporting bottom plate and the supporting top plate, and has two ends connected with the supporting bottom plate and the supporting top plate respectively, and forms an installation space between the supporting bottom plate, the supporting top plate and the supporting side plate;
a lifting guide rail 440, which is vertically disposed and both ends of which are respectively connected with the supporting bottom plate and the supporting top plate;
a lifting frame body 450 which is installed on the lifting guide rail through a sliding structure and can be lifted along the lifting guide rail;
the lifting motor 460 is arranged on the supporting bottom plate, a power output shaft of the lifting motor is connected with the lifting frame body through a transmission structure, and the lifting motor drives the lifting frame body to lift along the lifting guide rail;
a deflection cylinder 470, the bottom of which is mounted on the elevator body through a rotation structure, can be lifted together with the elevator body, and can be deflected on the elevator body, and the top of which extends from the supporting top plate;
the deflection motor is arranged on the lifting frame body and can lift along with the lifting frame body, a power output shaft of the deflection motor is connected with the deflection cylinder body through a transmission structure, and the deflection motor drives the deflection cylinder body to deflect;
a pair of grabbing arms 480, each grabbing arm being mounted on the top of the deflection cylinder and capable of lifting and deflecting together with the deflection cylinder;
and the wafer body grippers 490 are provided with a pair of wafer body grippers and are respectively installed at the tail ends of the grabbing arms, the wafers are grabbed by the wafer body grippers, and the grabbing arms drive the wafer body grippers carrying the wafers to move.
Centering adjusting part includes:
an adjustment seat 510 mounted on the assembly table;
a longitudinal rail 520 installed on the adjusting seat body and perpendicular to the transverse rail;
a rotating motor 530 which is installed on the longitudinal rail rod through a slider and can move along the longitudinal rail rod;
the longitudinal motor 540 is arranged on the adjusting seat body, is connected with the rotating motor through a transmission structure, and drives the rotating motor to move along the longitudinal rail rod;
and a centering chuck 550, which is mounted at the end of the power output shaft of the rotating motor, is driven by the rotating motor to rotate, and is used for adsorbing, positioning and carrying the wafer to rotate.
The distance detection assembly includes:
the detection frame 610 is provided with an installation space, the top of the detection frame is provided with a working table surface 611 for placing a wafer, and the working table surface is provided with a position avoiding through hole 612;
a linear motor 620 disposed in a lateral direction, a stator part of which is installed in the inspection frame;
a lifting motor 630 mounted on the mover member of the linear motor;
a rotation motor 640 coupled to the lifting motor through a transmission structure;
a rotary suction cup 650 which is mounted on the rotary motor, is driven by the rotary motor to rotate, and is communicated with the air exhaust system through an air passage;
a capacitive distance sensor 660 mounted on the support frame and corresponding to the position of the rotating chuck.
This check out test set has set up a set of storage box body, and correspond with horizontal support plate position, make the tongs of transferring on the horizontal support plate can get respectively in each storage box body and put the wafer, detect in sending into apart from the detection subassembly, convert the distance of wafer into the roughness index that index such as thickness height from calculating the wafer through electric capacity distance sensor, it is high to have a detection precision, good stability, advantages such as detection efficiency height, can improve wafer detection speed and precision, reduce the cost of labor, prevent to detect the erroneous judgement, thereby promote product quality.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, or orientations or positional relationships that the products of the present invention are usually placed in when used, or orientations or positional relationships that are usually understood by those skilled in the art, and are used only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the equipment or the elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is also to be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" are to be interpreted broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Claims (9)
1. A semiconductor wafer flatness detecting apparatus, comprising:
a bearing assembly having an installation space therein;
the wafer storage component is arranged on the supporting assembly component, and a space for placing a wafer is formed in the wafer storage component;
the transverse bearing assembly is arranged on the support assembly and corresponds to the position of the wafer storage assembly;
the wafer transferring component is arranged on the transverse bearing component, can move on the transverse bearing component along the transverse direction, and is used for grabbing and transferring the wafer in the wafer storage component;
the centering adjusting assembly is arranged on the supporting assembly and matched with the wafer transferring assembly, and the centering adjusting assembly performs centering adjustment on the wafer carried by the wafer transferring assembly;
and the distance detection assembly is arranged on the supporting assembly and matched with the wafer transfer assembly, and the wafer transfer assembly transfers the wafer into the distance detection assembly for detection.
2. The apparatus of claim 1, wherein the support assembly comprises:
the wafer storage component is arranged on the outer wall of the supporting frame, and the transverse bearing component, the wafer transferring component, the centering adjusting component and the distance detecting component are arranged on the assembly table board.
3. The apparatus of claim 1, wherein the wafer storage assembly comprises:
the storage box bodies are arranged in a group, each storage box body is respectively arranged on the outer wall of the supporting frame and is sequentially arranged along the transverse direction, each storage box body is internally provided with a wafer positioning structure, a wafer to be detected is placed in the storage box body, the supporting frame is internally provided with a group of taking and placing openings, and each taking and placing opening corresponds to the position of the storage box body;
and the unlocking device is matched with the storage box body, and the storage box body is unlocked by the unlocking device.
4. The apparatus of claim 3, wherein the unlocking device comprises:
an unlocking frame having an installation space therein;
the assembly table top is arranged at the top of the unlocking frame;
the switching back plate is arranged on the back of the unlocking frame, the upper section of the switching back plate extends out of the upper part of the supporting frame, and a sheet taking through hole is formed in the switching back plate;
the lifting motor is arranged on the unlocking frame and is positioned below the assembly table board;
the transmission screw rod is positioned below the assembly table surface and is vertically arranged, and a power output shaft of the lifting motor is connected with the transmission screw rod;
the guide sliding rails are provided with a pair of guide sliding rails, and each guide sliding rail is respectively arranged on the unlocking frame and is parallel to the transmission screw rod;
the adapter frame body is positioned below the assembly table board, two ends of the adapter frame body are respectively arranged on the guide slide rails through the guide slide blocks, and the middle part of the adapter frame body is matched with the transmission screw rod through the transmission nut;
the vertical upright columns are provided with a group, and are respectively arranged on the adapter frame body and extend upwards through the assembly table board;
the supporting ring is arranged at the top of the vertical upright post;
the limiting side strips are provided with a pair of limiting side strips, and each limiting side strip is arranged on the supporting ring and is respectively arranged at two ends of the supporting ring;
the transverse moving motor is arranged on the assembly table-board;
and the supporting platform is arranged on the assembly table top through a transverse guide structure and is connected with a power output shaft of the transverse moving motor through a screw rod transmission structure.
5. The apparatus of claim 3, wherein the unlocking device comprises:
an unlocking frame body having an installation space therein;
the assembling panel is arranged at the front part of the unlocking frame body, and an access opening is formed in the assembling panel;
the assembling support plate is arranged at the top of the unlocking frame body and is positioned behind the assembling panel;
the positioning platform is arranged on the assembly carrier plate through a sliding structure and can move on the assembly carrier plate;
the adjusting push rod is arranged on the assembling support plate and is connected with the positioning platform, and the positioning platform is driven to move by the adjusting push rod so as to be close to or far away from the assembling panel;
the positioning tension spring is arranged between the positioning platform and the assembly support plate, and the positioning tension spring drives the positioning platform to move towards the assembly panel so as to enable the wafer box to be matched with the taking and placing through hole;
the vertical platform is arranged in the supporting frame body through a vertical guide rail, is connected with the driving structure and can move along the vertical guide rail;
the transverse platform is arranged on the vertical platform through a transverse guide rail, is connected with the driving structure and can move along the transverse guide rail;
the adapting carrier is arranged on the transverse platform, can move along with the transverse platform, is matched with the taking and placing opening in shape and can be jointed with the wafer box door body through the taking and placing opening;
the matching pin column is arranged on the matching carrier and is matched with the pin hole formed in the wafer box door body, and when the matching carrier is jointed with the wafer box door body, the matching pin column extends into the pin hole;
the adsorption disc is arranged on the matching and connecting carrier, and the adsorption disc adsorbs the wafer box door body when the matching and connecting carrier is jointed with the wafer box door body;
the unlocking key is arranged on the matched and connected carrier and is matched with the lock hole in the wafer box door body, and when the matched and connected carrier is connected with the wafer box door body, the unlocking key extends into the lock hole;
and the unlocking motor is arranged on the adapting and connecting carrier and is connected with the unlocking key, and the unlocking motor drives the unlocking key to operate to unlock the wafer box.
6. The apparatus of claim 2, wherein the lateral support assembly comprises:
the transverse rail rods are provided with a pair of transverse rail rods, and the transverse rail rods are respectively arranged on the assembly table board and are parallel to each other;
the transverse carrier plate is arranged on the transverse rail rod through a sliding block;
and the transverse motor is arranged on the assembly table surface and is connected with the transverse support plate through a transmission structure, and the transverse motor drives the transverse support plate to move along the transverse line rail rod.
7. The apparatus of claim 5, wherein the wafer transfer assembly comprises:
a support floor;
a top support plate located above the bottom support plate;
the supporting side plate is positioned between the supporting bottom plate and the supporting top plate, two ends of the supporting side plate are respectively connected with the supporting bottom plate and the supporting top plate, and an installation space is formed among the supporting bottom plate, the supporting top plate and the supporting side plate in an enclosing way;
the lifting guide rail is vertically arranged, and two ends of the lifting guide rail are respectively connected with the supporting bottom plate and the supporting top plate;
the lifting frame body is arranged on the lifting guide rail through a sliding structure and can lift along the lifting guide rail;
the lifting motor is arranged on the supporting bottom plate, a power output shaft of the lifting motor is connected with the lifting frame body through a transmission structure, and the lifting motor drives the lifting frame body to lift along the lifting guide rail;
the bottom of the deflection cylinder is arranged on the lifting frame body through a rotating structure, can lift along with the lifting frame body and deflect on the lifting frame body, and the top of the deflection cylinder extends out of the supporting top plate;
the deflection motor is arranged on the lifting frame body and can lift along with the lifting frame body, a power output shaft of the deflection motor is connected with the deflection cylinder body through a transmission structure, and the deflection motor drives the deflection cylinder body to deflect;
the grabbing arms are provided with a pair, and each grabbing arm is respectively arranged at the top of the deflection cylinder body and can lift and deflect along with the deflection cylinder body;
the wafer body grippers are arranged in a pair and are respectively installed at the tail ends of the grabbing arms, the wafer body grippers grab the wafer, and the grabbing arms drive the wafer body grippers carrying the wafer to move.
8. The apparatus of claim 5, wherein the centering adjustment assembly comprises:
the adjusting seat body is arranged on the assembly table board;
the longitudinal rail rod is arranged on the adjusting seat body and is perpendicular to the transverse rail rod;
the rotating motor is arranged on the longitudinal rail rod through a sliding block and can move along the longitudinal rail rod;
the longitudinal motor is arranged on the adjusting seat body, is connected with the rotating motor through a transmission structure, and drives the rotating motor to move along the longitudinal rail rod;
and the centering sucker is arranged at the tail end of a power output shaft of the rotating motor, is driven to rotate by the rotating motor, and adsorbs and positions the wafer and rotates along with the wafer by the centering sucker.
9. The apparatus of claim 2, wherein the distance detection module comprises:
the detection frame is provided with an installation space, the top of the detection frame is provided with a working table surface for placing a wafer, and a position avoiding through hole is formed in the working table surface;
a linear motor, which is disposed in a transverse direction and whose stator part is installed in the inspection frame;
a lifting motor mounted on a mover member of the linear motor;
the rotary motor is connected with the lifting motor through a transmission structure;
the rotary sucker is arranged on the rotary motor, is driven by the rotary motor to rotate and is communicated with the air exhaust system through an air passage;
and the capacitive distance sensor is arranged on the supporting frame and corresponds to the position of the rotary sucker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN114427831A (en) * | 2022-01-27 | 2022-05-03 | 苏州浪潮智能科技有限公司 | Metal product flatness detection method and device and electronic equipment |
| CN114798478A (en) * | 2021-12-24 | 2022-07-29 | 嘉兴微拓电子科技股份有限公司 | Wafer detecting and sorting system and method |
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Application publication date: 20210706 |