CN101097848A - Full-automatic wafer rear marking machine - Google Patents
Full-automatic wafer rear marking machine Download PDFInfo
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- CN101097848A CN101097848A CNA2007101306531A CN200710130653A CN101097848A CN 101097848 A CN101097848 A CN 101097848A CN A2007101306531 A CNA2007101306531 A CN A2007101306531A CN 200710130653 A CN200710130653 A CN 200710130653A CN 101097848 A CN101097848 A CN 101097848A
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Abstract
The invention relates to a novel device for marking IC crystal, in particular to a full-automatic crystal back marking machine, which uses a mechanical hand to take out crystal from a material feeding box to be sent to a crystal direction checker, a crystal marking platform or the like, to be marked and checked to be taken off by a mechanical hand to be put into a material outputting box. The invention is composed of a front area and a back area, wherein the front area is arranged with an electric controller and a PC, a baffle plate is arranged between the front and back areas, the baffle plate is arranged with a gate entrance, the outer side of the front area is arranged with a material feeding box and a material discharging device, the front area is arranged with a mechanical hand and a crystal direction checker inside, the back area is arranged with a crystal marking platform inside, the marking platform is respectively arranged with a before-marking checker and an after-marking checker above and under.
Description
Technical field
The present invention relates to the new equipment of a kind of IC wafer mark, more precisely, relate to manipulator wafer is taken out from feeding box, be sent to devices such as wafer direction detection device, wafer mark platform more one by one, after mark and detecting, take out a kind of full-automatic wafer rear marking machine of putting into lower feed box by manipulator.
Background technology
The mark machine is widely used in the surperficial mark of the integrated circuit of IC industry.According to the difference of instructions for use, the surface-mounted integrated circuit that the IC industry is used has material bar, i.e. combined chip; Chip, promptly the piece die clip below is also referred to as material, element; And three kinds of forms of wafer.The material bar is the plate that is combined by plurality of chips, during to each chip marking on the material bar, is directly to realize automatic mark by the material conveying bar.Chip is the less piece bulk goods of size, is to be placed in the track pallet, by the conveying of track pallet being realized the automatic mark of chip.Wafer is a very thin disk directly having made many chips thereon, and diameter is about 200～300mm, need carry out mark in the back side to each chip on it on monoblock wafer thin slice.
In the wafer mark machine that uses at present, there is very big defective in the structure of wafer mark platform, have only the sub-fraction periphery of wafer rear can be bearing on the supporting edge of wafer mark platform, the middle part major part of wafer is unsettled, cause the wafer bulk deformation bigger, bring considerable influence for precision, quality and the speed of mark.For this wafer mark machine, for guaranteeing mark precision and quality, just need carry out mark to the wafer burst, promptly the part that deflection is more or less the same is carried out mark one by one, simultaneously before to each part mark, also to detect, confirm just can carry out mark after this part deflection is more or less the same with the laser elevation measuring instrument.So not only influence mark speed, and use expensive laser elevation measuring instrument also to increase the cost of equipment.In addition, in order to have supported wafer, need take more wafer peripheral area, this part periphery can not be made chip, has just wasted material, has increased material cost.
Summary of the invention
It is slow to the objective of the invention is the mark speed that exists at existing wafer mark machine, and the high deficiency of equipment cost and Material Cost provides a kind of novel full-automatic wafer rear marking machine.
Technical scheme of the present invention is: a kind of full-automatic wafer rear marking machine, constitute by former and later two districts, wherein the proparea is provided with electrical control gear and PC, be provided with dividing plate between described proparea and the back zone, dividing plate is provided with the gate inlet and outlet device, the arranged outside in proparea has feeding box device and lower feed box device, and the inside in proparea is provided with manipulator and wafer direction detection device; The inside of back zone is provided with wafer mark stage apparatus, and the above and below of mark stage apparatus is respectively arranged with preceding checkout gear of mark and mark back checkout gear.
Preferably, described feeding box device, comprise a hopper bracing frame, be installed in the block on the hopper bracing frame, and be placed on case cover on the block, the inside of block is provided with a location pallet supporting frame, on the pallet supporting frame of location the location supporting plate is installed, described location supporting plate is provided with three positioning components, each is arranged in these three positioning components on the circumference with being separated by 120 degree, the below in the centre of described location supporting plate is provided with displacement detecting sensor, and the top of displacement detecting sensor is connected with disk, and the right angle block that described positioning component is a rectangle by a short cylindrical and two sectional areas is formed.The below in the centre of described location supporting plate is provided with displacement detecting sensor, and the top of displacement detecting sensor is connected with disk.
Preferably, described wafer direction detection device comprises wafer rotating-table apparatus, direction detection sensor and direction detection system composition, has a rotating disk on the wafer rotating-table apparatus, direction detection sensor also is installed on the wafer rotating-table apparatus, and is positioned at the edge of rotating disk; The direction detection system comprises a stepping motor and one and the joining camera of stepping motor, and rotating disk is positioned at the below of camera; Described direction detection system comprises a base, be equipped with on the base by two cradling pieces and the support that the cradling piece connecting plate constitutes, the head of support is connected with mounting panel, stepping motor and the ball screw transmission that is attached thereto are arranged on the mounting panel, the ball body part of ball screw transmission, be the nut on the ball screw, link to each other that video camera links to each other with the ball screw transmission by video camera mounting panel, adjustment plate, right-angle connecting plate, ball body connecting plate with the ball body connecting plate.Described right-angle connecting plate is provided with a lifting plate, and the lifting plate is curved a right angle, and an end is installed on the right-angle connecting plate, and the other end links to each other with an end of the holder chain on frame top.
Preferably, described gate inlet and outlet device comprises the pneumatic slide unit that is installed on the dividing plate gate opening both sides, and pneumatic slide unit is connected with gate; Front and back separate and also are provided with an electromagnetic locking device that is used to control the slide unit switching on the plate; Dividing plate gate opening part is provided with gate aperture position transducer; Gate aperture position transducer and electromagnetic locking device all are electrically connected with the PC device of wafer rear marking machine.Fixedly chute and a movable slide rail constitute described pneumatic slide unit by one, fixedly chute 38 separates on the plate before and after being packed in, movable slide rail is fixedly sliding up and down on the chute, described electromagnetic locking device comprises a safety electromagnetic lock and a safety electromagnetic lock key, and the top of safety electromagnetic lock key is provided with a key connecting plate.
Preferably, described wafer mark stage apparatus comprises the transmission device of mark platform floor, mark platform floor top, and is arranged on the crystal wafer platform supporting plate on the transmission device, the central authorities of crystal wafer platform supporting plate are wafer mark position, and transmission device is electrically connected with the PC device of mark machine; Described wafer mark position is provided with an optical glass plectane, treats that the wafer rear of mark is bearing on the optical glass plectane.Described wafer mark position is a circle, and this circular inner edge is provided with the supporting table of two protrusions from the bottom to top, and lower floor is that optical glass bearing-surface, upper strata are the wafer bearing-surface; The edge of wafer mark position is provided with a wafer centring ring, and the inner edge of wafer centring ring is provided with four groups of pore grooves that communicate; The top of the pore groove of described wafer centring ring is provided with the wafer bearing-surface, and the wafer bearing-surface of this wafer bearing-surface and mark position inner edge is in the sustained height plane.
Preferably, be provided with a camera on checkout gear and the mark back checkout gear before the described mark, checkout gear is positioned at the top of mark platform before the mark, and camera is aimed at the front of wafer downwards, mark back checkout gear is positioned at the below of mark platform, and camera is upwards aimed at the back side of wafer.
Beneficial effect of the present invention is: because the location supporting plate of feeding box device is provided with three groups of positioning components, cooperate the bottom to be provided with the wafer grid hopper of corresponding slotted eye again, just can realize both accurate cooperations, accurate location; By displacement detecting sensor is set, can detect case does not still have case, and for PC and manipulator provide material information, automaticity is guaranteed; Secondly, before the mark since successively the dual direction by direction detection sensor and direction detection system detect, can guarantee that therefore manipulator delivers to wafer side on the wafer mark platform to accurate, the mark quality improves greatly; Once more, import and export valve system because the switching of adopting pneumatic slide unit to come regulating gate, so the opening speed of gate accelerates greatly, improved production efficiency, and utilized transducer that the opening degree of gate is monitored, the turnover precision of manipulator improves greatly; In addition, can guarantee fail safe in the middle of the mark process effectively by electromagnetic locking device; In addition, because wafer mark platform is provided with the special optical glass in order to the supporting wafer, therefore the back side of monoblock wafer is supported in that this is on glass, guaranteed that wafer can not be out of shape, and has improved mark speed and quality, simultaneously, the transmission device of the horizontal vertical both direction that utilization is provided with on the mark stage apparatus, make under PC control, can automatically wafer be moved to the position of any needs, satisfy the various detections of wafer and the requirement of mark; And, utilize pore groove on the wafer centring ring can be in the mark process fixing wafer firmly, obtain better mark effect; At last, carry out double check by can fight each other cursor position and mark quality of mark back checkout gear before marking, structural design novelty, Installation and Debugging are convenient, message transmission quick reliable, detection speed is fast, detect the quality height.
Description of drawings
Fig. 1 is a process chart of the present invention;
Fig. 2 is a main device pie graph of the present invention;
Fig. 3 a is the stereogram of full-automatic wafer rear marking machine of the present invention;
Fig. 3 b is the plane rearview of full-automatic wafer rear marking machine of the present invention;
Fig. 3 c is the rearview in full-automatic wafer rear marking machine of the present invention proparea;
Fig. 3 d is the front view of full-automatic wafer rear marking machine of the present invention;
Fig. 4 a is the surface structure schematic diagram of feeding box device of the present invention;
Fig. 4 b is the decomposition texture schematic diagram of feeding box device of the present invention;
Fig. 4 c is the decomposition texture schematic diagram of the displacement detecting sensor of feeding box device of the present invention;
Fig. 4 d is the support location structure schematic diagram of feeding box device of the present invention;
Fig. 5 a is the location diagram of direction detection device of the present invention and manipulator;
Fig. 5 b is the structural representation of direction detection device of the present invention;
Fig. 5 c is the decomposition texture schematic diagram of direction detection device of the present invention.。
Fig. 6 a imports and exports the structural representation of valve system for the present invention;
Fig. 6 b imports and exports the decomposition texture schematic diagram of valve system for the present invention;
Fig. 7 a is the structural representation of mark stage apparatus of the present invention;
Fig. 7 b is the structural representation of mark platform of the present invention;
Fig. 7 c is the structural representation of mark stage apparatus wafer centring ring of the present invention;
Fig. 8 a marks the structural representation of preceding checkout gear for the present invention;
Fig. 8 b marks the decomposition texture schematic diagram of preceding checkout gear for the present invention;
Fig. 8 c is the structural representation of checkout gear behind the present invention;
Fig. 8 d marks the decomposition texture schematic diagram of back checkout gear for the present invention.
Embodiment
The specific embodiment of the basis shown in Fig. 3 a to Fig. 3 d, a kind of full-automatic wafer rear marking machine, constitute by former and later two districts, wherein the proparea is provided with electrical control gear 510 and PC 511, be provided with dividing plate between described proparea A and the back zone B, dividing plate is provided with gate inlet and outlet device 54, and the arranged outside of proparea A has feeding box device 51 and lower feed box device 59, and the inside of proparea A is provided with manipulator 52 and wafer direction detection device 53; The inside of back zone is provided with wafer mark stage apparatus 55, and the above and below of mark stage apparatus 55 is respectively arranged with preceding checkout gear 56 of mark and mark back checkout gear 58.
Shown in Fig. 4 a to Fig. 4 d, described feeding box device, comprise a hopper bracing frame 7, be installed on the hopper bracing frame 7 block 6, and be placed on case cover 1 on the block 6, the inside of block 6 is provided with a location pallet supporting frame 4, location supporting plate 2 is installed on the location pallet supporting frame 4, described location supporting plate 2 is provided with three positioning components 3, each is arranged in this three positioning components 3 on the circumference with being separated by 120 degree, and the right angle block that described positioning component 3 is a rectangle by a short cylindrical and two sectional areas is formed.The below in the centre of described location supporting plate 2 is provided with displacement detecting sensor 5, and the top of displacement detecting sensor 5 is connected with disk 8.
Shown in Fig. 5 a to Fig. 5 c, described wafer direction detection device, comprise wafer rotating-table apparatus 215, direction detection sensor 216 and direction detection system composition 214, have a rotating disk on the wafer rotating-table apparatus 215, direction detection sensor 216 also is installed on the wafer rotating-table apparatus 215, and is positioned at the edge of rotating disk; Direction detection system 214 comprises a stepping motor 23 and one and stepping motor 23 joining cameras 29, and rotating disk is positioned at the below of camera 29.Described direction detection system 214 comprises a base 24, be equipped with on the base 24 by two cradling pieces 21 and the support that cradling piece connecting plate 22 constitutes, the head of support is connected with mounting panel 211, stepping motor 23 and the ball screw transmission 210 that is attached thereto are arranged on the mounting panel 211, the ball body part of ball screw transmission 210, it is the nut on the ball screw, link to each other with ball body connecting plate 217, video camera 29 links to each other with ball screw transmission 210 by video camera mounting panel 28, adjustment plate 27, right-angle connecting plate 26, ball body connecting plate 217.Described right-angle connecting plate 26 is provided with a lifting plate 25, lifting plate 25 is curved a right angle, one end is installed on the right-angle connecting plate 26, the other end links to each other with an end of the holder chain 212 on frame top, when video camera moves around, the associated lead on it will realize following the tracks of with the holder chain and move by the lifting plate.
Shown in Fig. 6 a to Fig. 6 b, described gate inlet and outlet device, the front and back that are installed in wafer rear marking machine separate on the plate 313, described gate inlet and outlet device comprises the pneumatic slide unit that is installed in respectively on dividing plate gate opening 314 both sides, and pneumatic slide unit is connected by gate contiguous block 35 with gate 31; Also be provided with one on the dividing plate 313 and be used to control the electromagnetic locking device that slide unit opens and closes, the electromagnetic lock key of electromagnetic locking device is installed between two pneumatic slide units by connecting plate 36; Dividing plate gate opening 314 places are provided with gate aperture position transducer 37; Gate aperture position transducer 37 and electromagnetic locking device all are electrically connected with the PC device of wafer rear marking machine.Fixedly chute 38 and a movable slide rail 39 constitute described pneumatic slide unit by one, fixedly chute 38 is packed on the dividing plate 313, movable slide rail 39 fixedly can slide up and down on the chute 38, movable slide rail 39 suitable sliding cylinders of pneumatic slide unit, the piston rod of sliding cylinder just is packed in fixedly installing on the plate of chute 38 of pneumatic slide unit.Electromagnetic locking device comprises a safety electromagnetic lock 312 and a safety electromagnetic lock key 310, and the top of safety electromagnetic lock key 310 is provided with a key connecting plate 311.Dividing plate gate opening part also is disposed with back brake gate seat 32, front brake gate seat 33 and outer cover 34.
Shown in Fig. 7 a to Fig. 7 c, described wafer mark stage apparatus, the transmission device that comprises mark platform floor 44, mark platform floor 44 tops, and be arranged on crystal wafer platform supporting plate 413 on the transmission device, the central authorities of crystal wafer platform supporting plate 413 are wafer mark position, transmission device is electrically connected with the PC 11 of mark machine, and described wafer mark position is provided with an optical glass plectane 41, treats that the wafer rear of mark is bearing on the optical glass plectane 41.Described transmission device comprises a vertical transmission device of cover and a cover traverse gear, and horizontal and vertical transmission all is to be made of a sliding rail, a stepping motor and a ball screw transmission and a holder chain.Vertically the sliding rail 43 of transmission device, stepping motor 410, ball screw transmission 45 and holder chain 47 are arranged on the mark platform floor 44, and the sliding rail 46 of traverse gear, stepping motor 49, ball screw transmission 412 and holder chain 411 are arranged on vertical transmission device.Described wafer mark position is a circle, and this circular inner edge is provided with the supporting table of two protrusions from the bottom to top, and lower floor is that optical glass bearing-surface 415, upper strata are wafer bearing-surface 416.The ring edge is provided with a wafer centring ring 42 in the wafer mark position, have a breach 414 that supplies manipulator to enter on the wafer centring ring 42, the inner edge of wafer centring ring 42 is provided with four groups of pore grooves 48 that communicate, the top of pore groove 48 is provided with wafer bearing-surface 416, and this wafer bearing-surface 416 is in the sustained height plane with the wafer bearing-surface 416 of mark position inner edge.
Shown in Fig. 8 a to Fig. 8 d, described mark checkout gear, comprise before the mark checkout gear behind checkout gear and the mark, be provided with a camera on checkout gear and the mark back checkout gear before the mark, checkout gear is positioned at the top of mark platform before the mark, camera is aimed at the front of wafer downwards, and mark back checkout gear is positioned at the below of mark platform, and camera is upwards aimed at the back side of wafer.Checkout gear comprises the high rigid beam 66 that is fixed on the mark machine frame, is installed in lifting plate 65, the adjustment plate 64 that is connected with lifting plate 65 on the high rigid beam 66, is installed in the video camera mounting panel 63 on the adjustment plate 64 and is installed in video camera 62 and outer cover 61 on the video camera mounting panel 63 before the described mark.Described mark back checkout gear comprises the lifting plate 64 ' that is installed on the mark machine frame, the adjustment plate 63 ' affixed with lifting plate 64 ', is arranged on to adjust the video camera mounting panel 62 ' on the plate 63 ' and be installed in camera 61 ' on the video camera mounting panel 62 '.
Process chart of the present invention as shown in Figure 1 during the work of mark machine, is taken off by artificial case cover 1 with feeding box, and the wafer grid hopper that the wafer grid hopper that wafer is housed is put into the wafer feeding device is located location on the supporting plate 2, case cover 1 is covered again.When wafer grid hopper is put on the supporting plate 2 of wafer grid hopper location the location, be in the centre and the disk 8 that link to each other with displacement transducer of wafer grid hopper location supporting plate, under the action of gravity of wafer grid hopper, move down, the bar that is in the light of the displacement detecting sensor 5 that drive is attached thereto moves down and blocks the breach or the certification mark of photoelectric sensor, send the information that hopper puts in place to PC 511 and manipulator 52, manipulator 52 is carried out the preparation of grasping silicon wafer.
When manipulator 52 obtain can the order of grasping silicon wafer after, manipulator 52 removes to take out in the wafer grid hopper of feeding box device a wafer immediately, the part that manipulator 52 contacts with wafer is provided with partial vacuum and inhales the hole, wafer steadily can be held, deliver on the rotating disk 215 of the wafer rotating-table apparatus relevant with the wafer direction detection device, rotating disk 215 drives wafer and rotates, after the direction of wafer detects detecting sensor 216 that breach is set at wafer rotating-table apparatus one side and detects, can allow rotating disk slow down immediately and notify party is started working to detection system 214.
The stepping motor 23 of direction detection system drives video cameras 29 scanning that moves around by ball screw transmission 210, with the accurate direction of definite wafer.After direction was determined, rotating disk stopped operating, and wafer turnover valve system starts opens gate 31 risings.The direction that manipulator is determined according to direction detection device grasping silicon wafer from the rotating disk is put on the wafer mark platform by the gate mouth, returns the original place afterwards and awaits orders.
The wafer that is put on the wafer mark platform is supported on the optical glass plectane 41, by wafer centring ring 42 location, for guaranteeing that wafer can not have any moving in the mark process that moves around in the wafer centring ring, the periphery of wafer has 4 places to be inhaled 48 every groups of suctions of hole group hole group has 10 suction holes firmly to hold.Afterwards, order according to PC,, carry out position probing by 42 pairs of wafers of video camera of marking preceding checkout gear in horizontal ball screw transmission 412 with under vertically ball screw transmission 45 drives, promptly the wafer on the mark platform is carried out position deviation and detect, for the rear marking of wafer provides accurate position.After position probing is finished, according to PC 511 orders, under laterally ball screw transmission 412 and vertical ball screw transmission 45 drive, make a chip on the wafer, generally be the labelling head that the laser mark printing device 57 be arranged at wafer mark platform below is aimed at the back side of the upper left chip of wafer, labelling head is at once to its mark.After mark is finished,, under laterally ball screw transmission 412 and vertical ball screw transmission 45 drive,, it is carried out the mark quality testing with beating the camera lens place that chip of target moves to the video camera of mark back checkout gear according to the PC order.If it is qualified to detect, then continue to have beaten the whole chips on the wafer, gate is opened afterwards, and manipulator takes out the wafer grid hopper of putting into blanking device with wafer from the mark platform; If detection is defective, gate is also opened, and the wafer taking-up is put back to the wafer grid hopper of feeding box from the mark platform by manipulator, waits for and sending outside the machine simultaneously with feeding box at last.
When the wafer in the wafer feeding box device fetch and deliver finish after, wafer picks and places counter and sends signal by signal system, notice is manually taken off the case cover, take out negative crystal circle grid hopper, put into the wafer grid hopper that wafer is housed again, cover the case cover, wait for the extracting of manipulator, repeat last working procedure again.
After the wafer in the wafer grid hopper in the wafer lower feed box device is piled, wafer picks and places counter and sends signal by signal system, notice is manually taken off the case cover, the wafer grid hopper of mark wafer is filled in taking-up, put into negative crystal circle grid hopper again, cover the case cover, the wait manipulator is put into the wafer of new mark.
Claims (10)
1. full-automatic wafer rear marking machine, constitute by former and later two districts, wherein the proparea is provided with electrical control gear (510) and PC (511), it is characterized in that: be provided with dividing plate between described proparea (A) and back zone (B), dividing plate is provided with gate inlet and outlet device (54), the arranged outside in proparea (A) has feeding box device (1) and lower feed box device (9), and the inside of proparea (A) is provided with manipulator (52) and wafer direction detection device (53); The inside of back zone (B) is provided with wafer mark stage apparatus (55), and the above and below of mark stage apparatus (55) is respectively arranged with preceding checkout gear (56) of mark and mark back checkout gear (58).
2. full-automatic wafer rear marking machine as claimed in claim 1, it is characterized in that: described feeding box device, comprise a hopper bracing frame (7), be installed in the block (6) on the hopper bracing frame (7), and be placed on case cover (1) on the block (6), the inside of block (4) is provided with a location pallet supporting frame (4), location supporting plate (2) is installed on the location pallet supporting frame (4), described location supporting plate (2) is provided with three positioning components (3), each is arranged in these three positioning components (3) on the circumference with being separated by 120 degree, the below in the centre of described location supporting plate (2) is provided with displacement detecting sensor (5), the top of displacement detecting sensor (5) is connected with disk (8), and the right angle block that described positioning component (3) is a rectangle by a short cylindrical and two sectional areas is formed.
3. full-automatic wafer rear marking machine as claimed in claim 2 is characterized in that: the below in the centre of described location supporting plate (2) is provided with displacement detecting sensor (5), and the top of displacement detecting sensor (5) is connected with disk (8).
4. full-automatic wafer rear marking machine as claimed in claim 1, it is characterized in that: described wafer direction detection device, comprise wafer rotating-table apparatus (215), direction detection sensor (216) and direction detection system (214), have a rotating disk on the wafer rotating-table apparatus (215), direction detection sensor (216) also is installed on the wafer rotating-table apparatus (215), and is positioned at the edge of rotating disk; Direction detection system (214) comprises a stepping motor (23) and one and the joining camera of stepping motor (23) (29), and rotating disk is positioned at the below of camera (29); Described direction detection system (214) comprises a base (24), the support that is made of two cradling pieces (21) and a cradling piece connecting plate (22) is installed on the base (24), the head of support is connected with mounting panel (211), stepping motor (23) and the ball screw transmission (210) that is attached thereto are arranged on the mounting panel (211), the ball body part of ball screw transmission (210), it is the nut on the ball screw, link to each other with ball body connecting plate (217), video camera (29) is by video camera mounting panel (28), adjust plate (27), right-angle connecting plate (26), ball body connecting plate (217) links to each other with ball screw transmission (210).
5. full-automatic wafer rear marking machine as claimed in claim 4, it is characterized in that: described right-angle connecting plate (26) is provided with a lifting plate (25), lifting plate (25) is curved a right angle, one end is installed on the right-angle connecting plate (26), and the other end links to each other with an end of the holder chain (212) on frame top.
6. full-automatic wafer rear marking machine as claimed in claim 1 is characterized in that: described gate inlet and outlet device comprises the pneumatic slide unit that is installed on dividing plate gate opening (314) both sides, and pneumatic slide unit is connected with gate (31); Front and back separate and also are provided with an electromagnetic locking device that is used to control the slide unit switching on the plate (313); Dividing plate gate opening (314) locates to be provided with gate aperture position transducer (37); Gate aperture position transducer (37) and electromagnetic locking device all are electrically connected with the PC device of wafer rear marking machine.
7. full-automatic wafer rear marking machine as claimed in claim 6, it is characterized in that: fixedly chute (38) and a movable slide rail (39) constitute described pneumatic slide unit by one, fixedly chute (38) separates on the plate (313) before and after being packed in, movable slide rail (39) fixedly can slide up and down on the chute (38), described electromagnetic locking device comprises a safety electromagnetic lock (312) and a safety electromagnetic lock key (310), and the top of safety electromagnetic lock key (310) is provided with a key connecting plate (311).
8. full-automatic wafer rear marking machine as claimed in claim 1, it is characterized in that: described wafer mark stage apparatus, the transmission device that comprises mark platform floor (44), mark platform floor (44) top, and be arranged on crystal wafer platform supporting plate (413) on the transmission device, the central authorities of crystal wafer platform supporting plate (413) are wafer mark position, and transmission device is electrically connected with the PC device of mark machine; Described wafer mark position is provided with an optical glass plectane (41), treats that the wafer rear of mark is bearing on the optical glass plectane (41).
9. full-automatic wafer rear marking machine as claimed in claim 8, it is characterized in that: described wafer mark position is a circle, this circular inner edge is provided with the supporting table of two protrusions from the bottom to top, and lower floor is that optical glass bearing-surface (415), upper strata are wafer bearing-surface (416); The edge of wafer mark position is provided with a wafer centring ring (42), and the inner edge of wafer centring ring (42) is provided with the four groups of pore grooves (48) that communicate; The top of the pore groove (48) of described wafer centring ring (42) is provided with wafer bearing-surface (416), and this wafer bearing-surface (416) is in the sustained height plane with the wafer bearing-surface (416) of mark position inner edge.
10. full-automatic wafer rear marking machine as claimed in claim 1, it is characterized in that: be provided with a camera on checkout gear and the mark back checkout gear before the described mark, checkout gear is positioned at the top of mark platform before the mark, camera is aimed at the front of wafer downwards, mark back checkout gear is positioned at the below of mark platform, and camera is upwards aimed at the back side of wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101306531A CN100459034C (en) | 2007-07-12 | 2007-07-12 | Full-automatic wafer rear marking machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101306531A CN100459034C (en) | 2007-07-12 | 2007-07-12 | Full-automatic wafer rear marking machine |
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| Publication Number | Publication Date |
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| CN101097848A true CN101097848A (en) | 2008-01-02 |
| CN100459034C CN100459034C (en) | 2009-02-04 |
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| CNB2007101306531A Expired - Fee Related CN100459034C (en) | 2007-07-12 | 2007-07-12 | Full-automatic wafer rear marking machine |
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| DE4022904C2 (en) * | 1990-07-16 | 2001-05-23 | Siemens Ag | Method for applying a marking indicating the orientation of the crystal lattice of a crystal wafer |
| JPH11156566A (en) * | 1997-11-28 | 1999-06-15 | Mitsubishi Electric Corp | Laser marking device and controlling method therefor |
| US7119351B2 (en) * | 2002-05-17 | 2006-10-10 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
| KR100584840B1 (en) * | 2002-12-24 | 2006-05-30 | 주식회사 이오테크닉스 | Chip scale marker and method of calibrating the marking position therewith |
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