CN110867401A - Processing device for integrated circuit packaging device - Google Patents
Processing device for integrated circuit packaging device Download PDFInfo
- Publication number
- CN110867401A CN110867401A CN201911181316.4A CN201911181316A CN110867401A CN 110867401 A CN110867401 A CN 110867401A CN 201911181316 A CN201911181316 A CN 201911181316A CN 110867401 A CN110867401 A CN 110867401A
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- Prior art keywords
- frame
- integrated circuit
- plate
- supporting plate
- dust collection
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000428 dust Substances 0.000 claims abstract description 57
- 238000005498 polishing Methods 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 229910000831 Steel Inorganic materials 0.000 claims description 20
- 239000010959 steel Substances 0.000 claims description 20
- 238000003915 air pollution Methods 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 4
- 238000007517 polishing process Methods 0.000 abstract description 4
- 208000036829 Device dislocation Diseases 0.000 abstract description 3
- 230000036541 health Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 239000003550 marker Substances 0.000 description 4
- 230000003434 inspiratory effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses a processing device of an integrated circuit packaging device, which comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, the polishing mechanism is arranged above the third frame, the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, an air nozzle is arranged on the baffle plate, a dust suction bin is arranged below the third frame, and the dust suction bin is communicated and connected with the air nozzle through a first air pipe. The semiconductor device polishing device achieves polishing of the semiconductor device moved to the third frame, can absorb scraps generated in the polishing process to the interior of the dust collection bin, avoids influence on body health of workers due to air pollution caused by the scraps, and can avoid difficulty in cleaning by later-period cleaning personnel.
Description
Technical Field
The invention relates to the field of semiconductor device packaging, in particular to a processing device of an integrated circuit packaging device.
Background
The semiconductor device is an electronic device having a conductivity between a good conductor and an insulator and performing a specific function by utilizing the special electrical characteristics of a semiconductor material, and is used for generating, controlling, receiving, converting, amplifying a signal and performing energy conversion.
Beat the mark and can only go on one by one in the current semiconductor device packaging process, beat the mark with the semiconductor device one side and still need the manual work to carry out the turn-over, troublesome poeration, and current semiconductor device unhairing limit in-process, the plastics piece is not concentrated the collection, leads to the piece to splash, not only produces harm to staff's health, and the later stage clearance difficulty.
Disclosure of Invention
The invention aims to: in order to solve the problems that the existing semiconductor device packaging marking can not carry out double-sided marking and the existing semiconductor device removing burrs does not collect scraps, the processing device of the integrated circuit packaging device is provided.
In order to achieve the purpose, the invention adopts the technical scheme that: a processing device of an integrated circuit packaging device comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, and the polishing mechanism is arranged above the third frame;
the electromagnetic sliding rails positioned on the inner walls of the first frame, the second frame and the third frame on the same side are communicated, and a moving block is connected between the oppositely arranged electromagnetic sliding rails;
a motor is arranged on one side, opposite to the second frame, of the supporting plate, a first gear is connected to an output shaft of the motor, a rotary table is rotatably arranged on the supporting plate, a second gear is arranged on the surface, opposite to the second frame, of one side of the rotary table, the second gear is meshed with the first gear, at least two connecting blocks are arranged on the surface, opposite to the second frame, of the other side of the rotary table, and the connecting blocks are fixedly connected with the second frame;
the supporting plate is provided with an annular chute, a plurality of steel balls are arranged in the chute in a rotatable manner along the circumferential direction, and the turntable is embedded in the chute and is connected with the supporting plate in a rotatable manner through the steel balls;
the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, and the baffle plate is arranged on the third frame;
the dust collection device is characterized in that the baffle is provided with an air nozzle, a dust collection bin is arranged below the third frame and is communicated with the air nozzle through a first air pipe, a negative pressure fan is arranged in the dust collection bin, a dust collection plate is arranged below the third frame, a through hole is formed in the dust collection plate, and the through hole is communicated with the dust collection bin through a second air pipe.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the moving block is provided with a plurality of through grooves, and the through grooves are connected with the semiconductor device in a clamping manner.
2. In the scheme, the number of the steel balls is 10-20, and the 10-20 steel balls are arranged at equal intervals along the circumferential direction.
3. In the above scheme, the supporting plate is provided with a circular through hole for the turntable to pass through.
4. In the above scheme, the circular sliding groove is located on the outer side of the circumference of the circular through hole.
5. In the scheme, the middle part of the rotary disc penetrates out of the circular through hole, and the circumferential edge of the rotary disc is embedded into the sliding groove.
6. In the above scheme, the through hole is formed in the lower surface of the dust collecting plate.
7. In the above scheme, the second air pipe is movably connected with the through hole on the dust collecting plate.
8. In the scheme, the lower surface of the top plate of the grinding mechanism is provided with the transverse sliding rail and the longitudinal sliding rail.
9. In the scheme, the number of the polishing heads is 2-6.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the processing device of the integrated circuit packaging device realizes the rotation of the second frame, thereby overturning the moving block moved into the second frame, automatically marking the double surfaces of the semiconductor device installed in the moving block without manual intervention and overturning, avoiding the error caused by manual overturning to influence the marking precision, saving the labor and the operation time and improving the operation efficiency; furthermore, an annular chute is arranged on the supporting plate, a plurality of steel balls are arranged in the chute in a rotating mode along the circumferential direction, the rotary table is embedded into the chute and is connected with the supporting plate in a rotating mode through the steel balls, resistance in the process of turning the second frame is reduced on the basis that the second frame can be turned, turning actions of the second frame are smooth, and position accuracy of stopping in the turning process is better, so that quality and accuracy of double-sided marking are guaranteed.
2. The processing device of the integrated circuit packaging device realizes the polishing of the semiconductor device moved to the third frame, enriches the connotation of the device, improves the automation degree of the processing of the semiconductor device, and can also avoid the splash of scraps generated in the polishing process; the air nozzle is arranged on the baffle, the dust collection bin is arranged below the third frame and is communicated with the air nozzle through a first air pipe, the negative pressure fan is arranged in the dust collection bin, and debris generated in the polishing process can be absorbed into the dust collection bin through the negative pressure fan and the dust collection bin, so that the influence of air pollution caused by the debris on the health of workers is avoided, and meanwhile, the difficulty in cleaning by later-stage cleaning personnel can be avoided; further, third frame below is provided with a dust collecting plate, is provided with a through-hole on this dust collecting plate, and this through-hole sets up dust collecting plate and second tuber pipe through a second tuber pipe and dust absorption storehouse through-connection on the basis of first tuber pipe, can further miss not inspiratory clastic absorption again to first tuber pipe, guarantees to the clastic comprehensive absorption that grinds the in-process and produce, avoids the piece to cause the circumstances such as clearance difficulty that air pollution influences that the staff is healthy and later stage.
Drawings
FIG. 1 is a schematic diagram of a processing apparatus for an integrated circuit package device according to the present invention;
FIG. 2 is a schematic view of a motor connection structure of a processing apparatus for an integrated circuit package device according to the present invention;
FIG. 3 is a cross-sectional view of a support plate of an apparatus for processing an integrated circuit package device in accordance with the present invention;
FIG. 4 is a cross-sectional view of a dust collection chamber of the apparatus for processing an IC package device according to the present invention;
FIG. 5 is a schematic view of a dust collection chamber of the apparatus for processing the IC package device according to the present invention;
fig. 6 is a schematic view of a part of the structure of a processing apparatus for an integrated circuit package device according to the present invention.
In the above drawings: 1. a support plate; 2. a first frame; 3. a second frame; 4. a third frame; 5. an electromagnetic slide rail; 6. a moving block; 7. a marker; 8. a motor; 9. a first gear; 10. a turntable; 11. a second gear; 12. connecting blocks; 13. steel balls; 14. a polishing mechanism; 141. a top plate; 15. a dust collection bin; 16. a first air duct; 17. a tuyere; 18. a second air duct; 19. a dust collecting plate; 20. a through hole; 23. a negative pressure fan; 25. a chute; 26. and a baffle plate.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a processing device of an integrated circuit packaging device comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
the electromagnetic sliding rails 5 are respectively arranged on two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4, the electromagnetic sliding rails 5 on the inner walls of the same side of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic sliding rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic sliding rails 5;
a motor 8 is arranged on one side, opposite to the second frame 3, of the supporting plate 1, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the supporting plate 1, a second gear 11 is arranged on the surface, opposite to the second frame 3, of one side of the rotary table 10, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the surface, opposite to the second frame 3, of the other side of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate through the connecting blocks 12;
the supporting plate 1 is provided with an annular sliding chute 25, a plurality of steel balls 13 are arranged in the sliding chute 25 in a rotatable manner along the circumferential direction, and the rotating disc 10 is embedded in the sliding chute 25 and is connected with the supporting plate 1 in a rotatable manner through the steel balls 13;
the grinding mechanism 14 comprises a top plate 141 and a grinding head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the support plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with an air nozzle 17, a dust collection bin 15 is arranged below the third frame 4, the dust collection bin 15 is communicated with the air nozzle 17 through a first air pipe 16, a negative pressure fan 23 is arranged in the dust collection bin 15, a dust collection plate 19 is arranged below the third frame 4, a through hole 20 is arranged on the dust collection plate 19, and the through hole 20 is communicated with the dust collection bin 15 through a second air pipe 18.
The number of the steel balls 13 is 16, and the 16 steel balls 13 are arranged at equal intervals along the circumferential direction; a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of the top plate 141 of the polishing mechanism 14; the number of the polishing heads is 2;
the moving block 6 is provided with a plurality of through grooves which are connected with the semiconductor device in a clamping way; the through hole 20 is arranged on the lower surface of the dust collecting plate 19; the second air duct 18 is movably connected to a through hole 20 formed in the dust collecting plate 19.
Example 2: a processing device of an integrated circuit packaging device comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
the electromagnetic sliding rails 5 are respectively arranged on two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4, the electromagnetic sliding rails 5 on the inner walls of the same side of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic sliding rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic sliding rails 5;
a motor 8 is arranged on one side, opposite to the second frame 3, of the supporting plate 1, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the supporting plate 1, a second gear 11 is arranged on the surface, opposite to the second frame 3, of one side of the rotary table 10, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the surface, opposite to the second frame 3, of the other side of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate through the connecting blocks 12;
the supporting plate 1 is provided with an annular sliding chute 25, a plurality of steel balls 13 are arranged in the sliding chute 25 in a rotatable manner along the circumferential direction, and the rotating disc 10 is embedded in the sliding chute 25 and is connected with the supporting plate 1 in a rotatable manner through the steel balls 13;
the grinding mechanism 14 comprises a top plate 141 and a grinding head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the support plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with an air nozzle 17, a dust collection bin 15 is arranged below the third frame 4, the dust collection bin 15 is communicated with the air nozzle 17 through a first air pipe 16, a negative pressure fan 23 is arranged in the dust collection bin 15, a dust collection plate 19 is arranged below the third frame 4, a through hole 20 is arranged on the dust collection plate 19, and the through hole 20 is communicated with the dust collection bin 15 through a second air pipe 18.
The number of the steel balls 13 is 14, and the 14 steel balls 13 are arranged at equal intervals along the circumferential direction; a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of the top plate 141 of the polishing mechanism 14; the number of the polishing heads is 3;
a circular through hole for the turntable 10 to pass through is formed in the supporting plate 1; the circular sliding groove 25 is positioned outside the circumference of the circular through hole; the middle part of the rotary table 10 penetrates out of the circular through hole, and the circumferential edge of the rotary table 10 is embedded into the sliding groove 25;
the moving block 6 is provided with a plurality of through grooves which are connected with the semiconductor device in a clamping manner, so that the semiconductor device is prevented from falling off when the second frame 3 is turned over; the through hole 20 is arranged on the lower surface of the dust collecting plate 19; the second air pipe 18 is movably connected with the through hole 20 on the dust collecting plate 19;
the lower parts of the first frame 2 and the third frame 4 are both connected with supporting columns, the dust collecting plate 19 is arranged on the supporting columns below the third frame 4, and the second frame 3 and the third frame 4 are both rectangular frames formed by sequentially connecting four beam bodies end to end;
the marker 7 is higher than the second frame 3 and is not connected with the second frame 3, and the second frame 3 is not influenced by the marker 7 when being overturned.
The working principle is as follows: when the device is used, an external power supply is required to be connected and supplies electric energy to the device, so that the device can normally run, a semiconductor device is placed in a cavity inside the moving block 6, the semiconductor device is clamped with the moving block 6 and cannot easily fall off, then the electromagnetic slide rail 5 is started, the moving block 6 can slide inside the first frame 2, the second frame 3 and the third frame 4 under the action of the electromagnetic slide rail 5, when the moving block 6 enters the second frame 3 from the first frame 2, the marking device 7 can mark one surface of a semiconductor, after all marking is finished, the motor 8 is started, the motor 8 rotates to drive the first gear 9 to rotate, the first gear 9 rotates to drive the second gear 11 to be meshed with the first gear 9 to rotate, the rotation of the second gear 11 can drive the turntable 10 to rotate inside the supporting plate 1, and the rotation process is smoother under the action of the sliding groove 25 and the steel balls 13, the rotation of carousel 10 can drive rather than fixed connection second frame 3 and rotate, thereby make second frame 3 overturn, the second frame 3 of upset turns over the another side of semiconductor, thereby make marker 7 mark the another side of semiconductor, make the semiconductor both sides all by the sign, and the process is simple, after marking the completion, movable block 6 continues to advance, when removing to the inside of third frame 4, polish it by grinding mechanism 14 earlier, the piece that produces partly of polishing can get into the inside of dust absorption storehouse 15 through tuyere 17 and first tuber pipe 16 under negative pressure fan 23's effect, partly piece can drop in the inside second tuber pipe 18 of dust collection board 19 and transport to the inside of dust absorption storehouse 15.
When the processing device of the integrated circuit packaging device is adopted, the rotation of the second frame is realized, so that the moving block moved into the second frame can be turned, the double-sided marking of the semiconductor device installed in the moving block is automatically realized without manual intervention and turning, the marking precision can be prevented from being influenced by errors caused by manual turning, the labor and the operation time can be saved, and the operation efficiency is improved; furthermore, on the basis that the second frame can be overturned, the resistance of the second frame in the overturning process is reduced, so that the overturning action of the second frame is smoother, and the position precision of stopping in the overturning process is better, thereby ensuring the quality and precision of double-sided marking;
in addition, the polishing of the semiconductor device moved to the third frame is realized, the connotation of the device is enriched, the automation degree of the processing of the semiconductor device is improved, and the splashing of chips generated in the polishing process can be avoided; the dust collection bin is connected with the negative pressure fan, the negative pressure fan is connected with the dust collection bin, and the dust collection bin is connected with the dust collection bin; further, set up dust collecting plate and second tuber pipe on the basis of first tuber pipe, can further miss not inspiratory clastic resorption again to first tuber pipe, guarantee to polish the clastic comprehensive absorption that the in-process produced, avoid the piece to cause air pollution to influence the circumstances such as the clearance difficulty in staff healthy and later stage.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. A processing device of an integrated circuit packaging device is characterized in that: the automatic marking device comprises a supporting plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7) and a polishing mechanism (14), wherein the first frame (2), the second frame (3) and the third frame (4) are sequentially connected and arranged on the same side of the supporting plate (1), the marking device (7) is arranged above the second frame (3), and the polishing mechanism (14) is arranged above the third frame (4);
the electromagnetic sliding rails (5) are respectively arranged on two opposite inner walls of the first frame (2), the second frame (3) and the third frame (4), the electromagnetic sliding rails (5) positioned on the inner walls of the same side of the first frame (2), the second frame (3) and the third frame (4) are communicated, and a moving block (6) is connected between the oppositely arranged electromagnetic sliding rails (5);
a motor (8) is arranged on one side, opposite to the second frame (3), of the supporting plate (1), a first gear (9) is connected to an output shaft of the motor (8), a rotary table (10) is rotatably arranged on the supporting plate (1), a second gear (11) is arranged on the surface of one side, opposite to the second frame (3), of the rotary table (10), the second gear (11) is meshed with the first gear (9), at least two connecting blocks (12) are arranged on the surface of the other side of the rotary table (10), and the connecting blocks (12) are fixedly connected with the second frame (3);
the supporting plate (1) is provided with an annular sliding chute (25), a plurality of steel balls (13) are arranged in the sliding chute (25) in a rotating mode along the circumferential direction, and the rotating disc (10) is embedded into the sliding chute (25) and is connected with the supporting plate (1) in a rotating mode through the steel balls (13);
the polishing mechanism (14) comprises a top plate (141) and a polishing head movably arranged below the top plate (141), one side of the top plate (141) is fixedly connected with the supporting plate (1), the other side of the top plate (141) is provided with a baffle plate (26), and the baffle plate (26) is arranged on the third frame (4);
the dust collection device is characterized in that an air nozzle (17) is arranged on the baffle (26), a dust collection bin (15) is arranged below the third frame (4), the dust collection bin (15) is communicated with the air nozzle (17) through a first air pipe (16), a negative pressure fan (23) is arranged in the dust collection bin (15), a dust collection plate (19) is arranged below the third frame (4), a through hole (20) is formed in the dust collection plate (19), and the through hole (20) is communicated with the dust collection bin (15) through a second air pipe (18).
2. The integrated circuit package device processing apparatus of claim 1, wherein: the moving block (6) is provided with a plurality of through grooves which are connected with the semiconductor device in a clamping mode.
3. The integrated circuit package device processing apparatus of claim 1, wherein: the number of the steel balls (13) is 10-20, and the 10-20 steel balls (13) are arranged at equal intervals along the circumferential direction.
4. The integrated circuit package device processing apparatus of claim 1, wherein: and a circular through hole for the turntable (10) to pass through is formed in the supporting plate (1).
5. The integrated circuit package device processing apparatus of claim 4, wherein: the circular ring-shaped sliding groove (25) is positioned on the outer side of the circumference of the circular through hole.
6. The integrated circuit package device processing apparatus of claim 5, wherein: the middle part of the rotary table (10) penetrates out of the circular through hole, and the circumferential edge of the rotary table (10) is embedded into the sliding groove (25).
7. The integrated circuit package device processing apparatus of claim 1, wherein: the through hole (20) is arranged on the lower surface of the dust collecting plate (19).
8. The integrated circuit package device processing apparatus of claim 1, wherein: the second air pipe (18) is movably connected with a through hole (20) on the dust collecting plate (19).
9. The integrated circuit package device processing apparatus of claim 1, wherein: and a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of a top plate (141) of the grinding mechanism (14).
10. The integrated circuit package device processing apparatus of claim 1, wherein: the number of the polishing heads is 2-6.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911181316.4A CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
| CN202311395528.9A CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
| CN202311374710.6A CN117381598A (en) | 2019-11-27 | 2019-11-27 | Semiconductor device processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911181316.4A CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311395528.9A Division CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
| CN202311374710.6A Division CN117381598A (en) | 2019-11-27 | 2019-11-27 | Semiconductor device processing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110867401A true CN110867401A (en) | 2020-03-06 |
| CN110867401B CN110867401B (en) | 2023-09-08 |
Family
ID=69656288
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911181316.4A Active CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
| CN202311374710.6A Pending CN117381598A (en) | 2019-11-27 | 2019-11-27 | Semiconductor device processing apparatus |
| CN202311395528.9A Pending CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
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| CN202311374710.6A Pending CN117381598A (en) | 2019-11-27 | 2019-11-27 | Semiconductor device processing apparatus |
| CN202311395528.9A Pending CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
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| CN114273946A (en) * | 2021-12-30 | 2022-04-05 | 苏州创隆自动化科技有限公司 | Efficient turning device is used in work piece processing |
| CN116921877A (en) * | 2023-09-14 | 2023-10-24 | 四川富乐华半导体科技有限公司 | Copper-clad ceramic carrier plate cutting and coding device |
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| CN116921877A (en) * | 2023-09-14 | 2023-10-24 | 四川富乐华半导体科技有限公司 | Copper-clad ceramic carrier plate cutting and coding device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN117524921A (en) | 2024-02-06 |
| CN117381598A (en) | 2024-01-12 |
| CN110867401B (en) | 2023-09-08 |
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