CN101901738A

CN101901738A - Double-guide rail semiconductor chip laser marking method

Info

Publication number: CN101901738A
Application number: CN2009100519953A
Authority: CN
Inventors: 卢冬青
Original assignee: GOWEAL ELECTRONIC TECHNOLOGIES (SHANGHAI) Co Ltd
Current assignee: GOWEAL ELECTRONIC TECHNOLOGIES (SHANGHAI) Co Ltd
Priority date: 2009-05-26
Filing date: 2009-05-26
Publication date: 2010-12-01

Abstract

The invention mainly provides a double-guide rail semiconductor chip laser marking method in semiconductor package, belonging to the technical field of the advanced manufacture in optical, mechanical and electronic integration and the design of novel mechanical products. By making full use of and playing the effective marking work range of the laser, the method divides a marking region into a front marking region and a back marking region and alternately charges a material strip and discharges the material strip to realize double-rail material transportation. Therefore, the double-guide rail semiconductor chip laser marking method can realize the laser uninterrupted marking, reduces the laser waiting waste caused by the interval (INDEX) time of the single-rail discharging and charging of the material strip, and can improve the capacity by 15-30%, reduce the investment by 10-25%, shorten the recovery period of the investment, improve the use ratio of the laser, realize the high efficiency, the energy saving and the environment protection, and improve the semiconductor packing technology in China and the international competitiveness.

Description

Double-guide rail semiconductor chip laser marking

Technical field

The present invention mainly is double-guide rail semiconductor chip laser printing in the semiconductor packages, belongs to the design field of advanced manufacturing technology and novel mechanical product in the optical, mechanical and electronic integration.

Background technology

The single-rail fully-automatic equipment is mainly used in the international market at present, the ubiquity production capacity is low, the laser marking area is in the waste of material bar Width, after laser can only be finished one mark, wait for the in place of next bar. because the mechanism of single-rail has determined, the inevitable laser stand-by period of charging between material bar and the material bar. problem is that production capacity is low, and laser work efficient is lower.

Summary of the invention

Make full use of and bring into play effective mark working range of laser, former and later two mark zones are divided in mark, alternate feed bar and discharging bar are realized double track (carrying) feeding.Thereby reach the uninterrupted mark of laser, reduce the waste of waiting for because of the laser of interval (INDEX) time of the material bar discharging of single-rail and charging.Production capacity can improve 15%～35% like this, and investment can reduce by 10%～25%, shortens the return period of investment, improves the utilance of laser, realizes efficient, energy-saving and environmental protection, strengthens Chinese semiconductor packaging and international competitiveness.

Description of drawings

Fig. 1 is double-guide rail semiconductor chip laser marking of the present invention and the contrast of traditional single-rail laser marking machine;

Fig. 2 is the product technology route map of double-guide rail semiconductor chip laser marking of the present invention;

Fig. 3 is the realization schematic diagram of double-guide rail semiconductor chip laser marking of the present invention.

Embodiment (illustrative accompanying drawing)

The project organization compactness, and satisfy processing and simplify matching requirements; Be convenient to and guarantee that the debugging of complete machine reaches required precision; Be convenient to regular maintenance and distribute dust discharge effectively; The control variation, the selection that requires the compatible single track of while energy to produce; To installation adjustment and the software and the control of laser, have higher requirement simultaneously, arriving of rail expected and corresponding mark file before and after requiring to distinguish.As Fig. 1

On structural design, guarantee that the motion of two guide rails is consistent with design, and assurance product and laser marking face is consistent, make full use of the depth of focus face of laser, be that various semiconductor device can be in quick replacing, the center symmetric design of exempting to adjust.As Fig. 1

Aspect the high efficiency requirement of dust discharge, it is another main core of double track difference and single track, effectively dedusting is the basic demand of laser marking, two guide rails are because the mark area is wide, compact conformation, how reasonable Arrangement is effectively taken out the dirt device, how to give full play to double track, the advantage that laser and dust discharge are various.As Fig. 1

The fast and flexible of laser and compensation convenient by reasonable structural design and control system planning, just can be given full play to its effect, could guarantee the economy and the practicality of system.As Fig. 1

Adopting stepper motor is core controller by PLC, add the bilingual man-machine viewfinder operation interface of IPC. with the standardization part serves as main, software development is a core, mechanical structure based on integral body, give full play to the advantage of laser, and mechanical positioner is used for the product quality demand more than 90%, auxiliary product with vision positioning system reply high request.As Fig. 2.

The realization of double track (Dual Carrier) continuous laser mark is as Fig. 3.

The design of double track system, quick characteristic------the zero-waiting time of having given full play to laser marking.As Fig. 1

Claims

1. a double-guide rail semiconductor chip laser marking is characterized in that the two simultaneously retainers that carry of two guide rails, and the effective mark working range that makes full use of and bring into play laser reaches the uninterrupted mark of laser.

2. the feeding of according to claim 1 pair of guide rail intersection, it is characterized in that product can enter the service area, front and back of two guide rails respectively, on structural design, the two guide rails of energy assurance are consistent with the laser marking face, make full use of the depth of focus face of laser, various semiconductor device can be changed fast, the center symmetric design of exempting to adjust.

3. the according to claim 1 pair of guide rail intersects mark, it is characterized in that product enters two guide rails after, replace into before and after the service area, no queue waiting time, the stand-by period that makes laser marking is zero, has improved the laser utilance.

4. according to claim 1 pair of guide rail retainer delivery; it is characterized in that semiconductor chip material bar thickness general; and be retainer delivery; protected the material bar not to be damaged; and traditional single track is to be fixed on PIN with pilot pin to carry out material drag; not general to material bar thickness, the machinery equipment versatility is poor.