CN117524921A - Packaging processing equipment for integrated circuit - Google Patents
Packaging processing equipment for integrated circuit Download PDFInfo
- Publication number
- CN117524921A CN117524921A CN202311395528.9A CN202311395528A CN117524921A CN 117524921 A CN117524921 A CN 117524921A CN 202311395528 A CN202311395528 A CN 202311395528A CN 117524921 A CN117524921 A CN 117524921A
- Authority
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- China
- Prior art keywords
- frame
- dust collection
- plate
- integrated circuit
- collection bin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000428 dust Substances 0.000 claims abstract description 59
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 238000005498 polishing Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 20
- 239000010959 steel Substances 0.000 claims description 20
- 239000003550 marker Substances 0.000 abstract description 12
- 230000007306 turnover Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000003915 air pollution Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 230000036541 health Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses packaging processing equipment of an integrated circuit, which comprises a supporting plate, a first frame, a second frame, a third frame, a marker and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marker is arranged above the second frame, a wind nozzle is arranged on a baffle plate, a dust collection bin is arranged below the third frame, the dust collection bin is in through connection with the wind nozzle through a first wind pipe, a negative pressure fan is arranged in the dust collection bin, a dust collection plate is arranged below the third frame, a through hole is formed in the dust collection plate, the through hole is in through connection with the dust collection bin through a second wind pipe, support columns are connected below the first frame and the third frame, and the dust collection plate is arranged on the support columns below the third frame. The invention can automatically realize double-sided marking of the semiconductor device arranged in the moving block without manual intervention and turn-over, thereby improving the operation efficiency.
Description
Technical Field
The invention relates to the field of semiconductor device packaging, in particular to packaging processing equipment of an integrated circuit.
Background
A semiconductor refers to a material having conductivity between that of a conductor and an insulator at normal temperature. The importance of semiconductors is enormous, both from a technological and an economic point of view. Most electronic products today, such as computers, mobile phones or digital recorders, have very close association with semiconductors. In the process of manufacturing a semiconductor, the packaged semiconductor needs to be marked according to the type of the semiconductor.
The marking in the existing semiconductor device packaging process can only be carried out face by face, the semiconductor device still needs to be turned over manually after one face of the semiconductor device is marked, the operation is troublesome, and in the existing semiconductor device deburring process, plastic scraps are not collected intensively, so that scraps splash, harm is generated to the body of staff, and later cleaning is difficult.
Disclosure of Invention
The invention aims to provide packaging processing equipment of an integrated circuit, which can automatically realize double-sided marking of a semiconductor device mounted in a moving block without manual intervention and turn-over, and improve the operation efficiency.
In order to achieve the above purpose, the invention adopts the following technical scheme: the integrated circuit packaging and processing equipment comprises a supporting plate, a first frame, a second frame, a third frame, a marker and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marker is arranged above the second frame, and the polishing mechanism is arranged above the third frame;
two opposite inner walls of the first frame, the second frame and the third frame are respectively provided with an electromagnetic slide rail, the electromagnetic slide rails positioned on the inner walls of the same side of the first frame, the second frame and the third frame are communicated, a moving block is connected between the oppositely arranged electromagnetic slide rails, a plurality of through grooves are arranged on the moving block, and the through grooves are connected with the semiconductor device in a clamping way;
a motor is arranged on one side of the supporting plate, which is opposite to the second frame, the output shaft of the motor is connected with a first gear, a rotary table is rotatably arranged on the supporting plate, a second gear is arranged on one side surface of the rotary table opposite to the second frame, the second gear is meshed with the first gear, at least two connecting blocks are arranged on the other side surface of the rotary table, and the connecting blocks are fixedly connected with the second frame;
the supporting plate is provided with a circular chute, a plurality of steel balls are rotatably arranged in the chute along the circumferential direction, and the turntable is embedded in the chute and is rotatably connected with the supporting plate through the steel balls;
the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, a baffle is arranged on the other side of the top plate, and the baffle is arranged on the third frame;
the dust collection device comprises a dust collection bin, a dust collection plate, a dust collection bin, a first air pipe, a second air pipe and a support column, wherein the dust collection bin is arranged below the third frame and is in through connection with the wind nozzle, a negative pressure fan is arranged in the dust collection bin, the dust collection plate is arranged below the third frame and is provided with a through hole, the through hole is in through connection with the dust collection bin through the second air pipe, the support columns are connected below the first frame and the third frame, and the dust collection plate is arranged on the support column below the third frame.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the second frame and the third frame are rectangular frames formed by sequentially connecting four beam bodies end to end.
2. In the scheme, the number of the steel balls is 10-20, and the 10-20 steel balls are arranged at equal intervals along the circumferential direction.
3. In the scheme, the supporting plate is provided with a circular through hole for the turntable to pass through.
4. In the scheme, the lower surface of the top plate of the polishing mechanism is provided with the transverse sliding rail and the longitudinal sliding rail.
5. In the scheme, the number of the polishing heads is 2-6.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the packaging and processing equipment of the integrated circuit realizes the rotation of the second frame, so that the moving block moving into the second frame can be overturned, the double-sided marking of the semiconductor device arranged in the moving block can be automatically realized without manual intervention for overturning, the marking precision can be prevented from being influenced by errors caused by manual overturning, the labor and the operation time can be saved, and the operation efficiency can be improved; further, a circular chute is arranged on the supporting plate, a plurality of steel balls are rotatably arranged in the chute along the circumferential direction, the turntable is embedded in the chute and is rotationally connected with the supporting plate through the steel balls, and on the basis that the second frame can be turned over, the resistance in the turning process of the second frame is reduced, so that the turning action of the second frame is smoother, the position accuracy of stopping in the turning process is better, and the quality and the accuracy of double-sided marking are ensured.
2. The packaging and processing equipment for the integrated circuit realizes polishing of the semiconductor device which is moved to the third frame, enriches the connotation of the device, improves the automation degree of processing the semiconductor device and can also avoid the splashing of scraps generated in the polishing process; the dust collection bin is connected with the air nozzle through a first air pipe, a negative pressure fan is arranged in the dust collection bin, and scraps generated in the polishing process can be absorbed into the dust collection bin through the negative pressure fan and the dust collection bin, so that the influence of air pollution caused by the scraps on the physical health of staff is avoided, and meanwhile, the cleaning difficulty of later cleaning staff can be avoided; further, a dust collecting plate is arranged below the third frame, a through hole is formed in the dust collecting plate and is in through connection with the dust collection bin through a second air pipe, and the dust collecting plate and the second air pipe are arranged on the basis of the first air pipe, so that the first air pipe can further miss the re-absorption of unincorporated scraps, the comprehensive absorption of scraps generated in the grinding process is ensured, and the situations that the physical health of workers is affected by the scraps and the later cleaning is difficult due to air pollution are avoided.
Drawings
FIG. 1 is a schematic diagram of an integrated circuit package processing apparatus according to the present invention;
FIG. 2 is a schematic diagram of a motor connection structure of the integrated circuit package processing apparatus of the present invention;
FIG. 3 is a cross-sectional view of a support plate of the integrated circuit package processing apparatus of the present invention;
FIG. 4 is a cross-sectional view of a dust collection bin of the integrated circuit package processing apparatus of the present invention;
FIG. 5 is a schematic diagram of a dust collection bin connection structure of the integrated circuit packaging and processing equipment of the invention;
fig. 6 is a schematic diagram of a partial structure of a packaging processing apparatus for an integrated circuit according to the present invention.
In the above figures: 1. a support plate; 2. a first frame; 3. a second frame; 4. a third frame; 5. an electromagnetic slide rail; 6. a moving block; 7. a marker; 8. a motor; 9. a first gear; 10. a turntable; 11. a second gear; 12. a connecting block; 13. steel balls; 14. a polishing mechanism; 141. a top plate; 15. a dust collection bin; 16. a first air duct; 17. a tuyere; 18. a second air duct; 19. a dust collecting plate; 20. a through hole; 23. a negative pressure fan; 25. a chute; 26. and a baffle.
Description of the embodiments
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: the packaging processing equipment of the integrated circuit comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marker 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marker 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4 are respectively provided with an electromagnetic slide rail 5, the electromagnetic slide rails 5 positioned on the same side of the inner walls of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic slide rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic slide rails 5;
a motor 8 is arranged on one side of the support plate 1, which is opposite to the second frame 3, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the support plate 1, a second gear 11 is arranged on one side surface of the rotary table 10, which is opposite to the second frame 3, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the other side surface of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate by the connecting blocks 12;
the supporting plate 1 is provided with a circular chute 25, a plurality of steel balls 13 are rotatably arranged in the chute 25 along the circumferential direction, and the turntable 10 is embedded in the chute 25 and is rotatably connected with the supporting plate 1 through the steel balls 13;
the polishing mechanism 14 comprises a top plate 141 and a polishing head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the supporting plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with a tuyere 17, a dust collection bin 15 is arranged below the third frame 4, the dust collection bin 15 is in through connection with the tuyere 17 through a first air pipe 16, a negative pressure fan 23 is arranged in the dust collection bin 15, a dust collection plate 19 is arranged below the third frame 4, a through hole 20 is arranged on the dust collection plate 19, and the through hole 20 is in through connection with the dust collection bin 15 through a second air pipe 18.
The number of the steel balls 13 is 16, and the 16 steel balls 13 are arranged at equal intervals along the circumferential direction; the lower surface of the top plate 141 of the polishing mechanism 14 is provided with a transverse sliding rail and a longitudinal sliding rail; the number of the grinding heads is 2;
the moving block 6 is provided with a plurality of through grooves which are in clamping connection with the semiconductor device; the through hole 20 is formed on the lower surface of the dust collecting plate 19; the second air pipe 18 is movably connected with a through hole 20 on the dust collecting plate 19.
Example 2: the packaging processing equipment of the integrated circuit comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marker 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marker 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4 are respectively provided with an electromagnetic slide rail 5, the electromagnetic slide rails 5 positioned on the same side of the inner walls of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic slide rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic slide rails 5;
a motor 8 is arranged on one side of the support plate 1, which is opposite to the second frame 3, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the support plate 1, a second gear 11 is arranged on one side surface of the rotary table 10, which is opposite to the second frame 3, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the other side surface of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate by the connecting blocks 12;
the supporting plate 1 is provided with a circular chute 25, a plurality of steel balls 13 are rotatably arranged in the chute 25 along the circumferential direction, and the turntable 10 is embedded in the chute 25 and is rotatably connected with the supporting plate 1 through the steel balls 13;
the polishing mechanism 14 comprises a top plate 141 and a polishing head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the supporting plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with a tuyere 17, a dust collection bin 15 is arranged below the third frame 4, the dust collection bin 15 is in through connection with the tuyere 17 through a first air pipe 16, a negative pressure fan 23 is arranged in the dust collection bin 15, a dust collection plate 19 is arranged below the third frame 4, a through hole 20 is arranged on the dust collection plate 19, and the through hole 20 is in through connection with the dust collection bin 15 through a second air pipe 18.
The number of the steel balls 13 is 14, and the 14 steel balls 13 are arranged at equal intervals along the circumferential direction; the lower surface of the top plate 141 of the polishing mechanism 14 is provided with a transverse sliding rail and a longitudinal sliding rail; the number of the grinding heads is 3;
the supporting plate 1 is provided with a circular through hole for the turntable 10 to pass through; the circular chute 25 is positioned outside the circumference of the circular through hole; the middle part of the turntable 10 passes through the circular through hole, and the circumferential edge of the turntable 10 is embedded into the chute 25;
the moving block 6 is provided with a plurality of through grooves which are in clamping connection with the semiconductor device, so that the semiconductor device is prevented from falling off when the second frame 3 is turned over; the through hole 20 is formed on the lower surface of the dust collecting plate 19; the second air pipe 18 is movably connected with a through hole 20 on the dust collecting plate 19;
the lower parts of the first frame 2 and the third frame 4 are respectively connected with a support column, the dust collecting plate 19 is arranged on the support column below the third frame 4, and the second frame 3 and the third frame 4 are respectively rectangular frames formed by connecting four beam bodies end to end in sequence;
the marker 7 is higher than the second frame 3 and is not connected to the second frame 3, and the second frame 3 is not affected by the marker 7 when being turned over.
Working principle: when in use, an external power supply is needed to be connected, the external power supply provides electric energy for the device, so that the device can normally operate, a semiconductor device is placed in a cavity inside the moving block 6, is clamped with the moving block 6, is not easy to fall off, then the electromagnetic sliding rail 5 is started, the moving block 6 slides inside the first frame 2, the second frame 3 and the third frame 4 under the action of the electromagnetic sliding rail 5, when the moving block 6 enters the second frame 3 from the first frame 2, the marker 7 marks one side of the semiconductor, after all marking is finished, the motor 8 is started, the motor 8 rotates to drive the first gear 9 to rotate, the first gear 9 rotates to drive the second gear 11 meshed with the first gear to rotate, the rotation of the second gear 11 can drive the rotary table 10 to rotate inside the supporting plate 1, the rotating process is smoother under the action of the sliding groove 25 and the steel balls 13, the rotating of the rotary table 10 can drive the second frame 3 fixedly connected with the rotary table to rotate, so that the second frame 3 overturns, the overturned second frame 3 overturns the other side of the semiconductor, the marking device 7 marks the other side of the semiconductor, the two sides of the semiconductor are marked, the process is simple, when the marking is finished, the moving block 6 moves forward, when moving to the inside of the third frame 4, the moving block is polished by the polishing mechanism 14, a part of chips generated by polishing can enter the inside of the dust collection bin 15 through the air nozzle 17 and the first air pipe 16 under the action of the negative pressure fan 23, and a part of chips can fall into the second air pipe 18 in the dust collection plate 19 to be transported to the inside of the dust collection bin 15.
When the packaging processing equipment of the integrated circuit is adopted, the second frame is rotated, so that the moving block which moves into the second frame can be overturned, double-sided marking of the semiconductor device which is arranged in the moving block is automatically realized without manual intervention for overturning, the marking precision can be prevented from being influenced by errors caused by manual overturning, the labor and the operation time can be saved, and the operation efficiency can be improved; furthermore, on the basis that the second frame can be overturned, the resistance in the overturning process of the second frame is reduced, so that the overturning action of the second frame is smoother, the position accuracy of stopping in the overturning process is better, and the quality and the accuracy of double-sided marking are ensured;
in addition, the polishing of the semiconductor device moving to the third frame is realized, the connotation of the device is enriched, the degree of automation of the processing of the semiconductor device is improved, and the splashing of scraps generated in the polishing process can be avoided; the negative pressure fan and the dust collection bin can absorb scraps generated in the polishing process into the dust collection bin, so that the influence of air pollution caused by the scraps on the health of staff is avoided, and meanwhile, the difficulty in cleaning of later-stage cleaning staff can be avoided; further, set up dust collecting plate and second tuber pipe on the basis of first tuber pipe, can further miss the absorption once more of the not inhaled piece of first tuber pipe, guarantee the comprehensive absorption to the piece that grinds the in-process produced, avoid the piece to cause the circumstances such as the healthy and later stage clearance difficulty of air pollution influence staff.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (6)
1. An integrated circuit package processing apparatus, characterized in that: the automatic marking device comprises a supporting plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7) and a polishing mechanism (14), wherein the first frame (2), the second frame (3) and the third frame (4) are sequentially connected and arranged on the same side of the supporting plate (1), the marking device (7) is arranged above the second frame (3), and the polishing mechanism (14) is arranged above the third frame (4);
an electromagnetic slide rail (5) is arranged on two opposite inner walls of the first frame (2), the second frame (3) and the third frame (4), the electromagnetic slide rails (5) on the same side inner wall of the first frame (2), the second frame (3) and the third frame (4) are communicated, a moving block (6) is connected between the oppositely arranged electromagnetic slide rails (5), and a plurality of through grooves are formed in the moving block (6) and are connected with the semiconductor device in a clamping mode;
a motor (8) is arranged on one side of the support plate (1) opposite to the second frame (3), a first gear (9) is connected to an output shaft of the motor (8), a rotary table (10) is rotatably arranged on the support plate (1), a second gear (11) is arranged on one side surface of the rotary table (10) opposite to the second frame (3), the second gear (11) is meshed with the first gear (9), at least two connecting blocks (12) are arranged on the other side surface of the rotary table (10), and the connecting blocks (12) are fixedly connected with the second frame (3);
the support plate (1) is provided with a circular chute (25), a plurality of steel balls (13) are rotatably arranged in the chute (25) along the circumferential direction, and the turntable (10) is embedded in the chute (25) and is in rotary connection with the support plate (1) through the steel balls (13);
the polishing mechanism (14) comprises a top plate (141) and a polishing head movably arranged below the top plate (141), one side of the top plate (141) is fixedly connected with the supporting plate (1), the other side of the top plate (141) is provided with a baffle plate (26), and the baffle plate (26) is arranged on the third frame (4);
the dust collection device is characterized in that a tuyere (17) is arranged on the baffle (26), a dust collection bin (15) is arranged below the third frame (4), the dust collection bin (15) is in through connection with the tuyere (17) through a first air pipe (16), a negative pressure fan (23) is arranged in the dust collection bin (15), a dust collection plate (19) is arranged below the third frame (4), a through hole (20) is formed in the dust collection plate (19), the through hole (20) is in through connection with the dust collection bin (15) through a second air pipe (18), support columns are connected below the first frame (2) and the third frame (4), and the dust collection plate (19) is arranged on the support columns below the third frame (4).
2. The packaging and processing apparatus of an integrated circuit according to claim 1, wherein: the second frame (3) and the third frame (4) are rectangular frames formed by sequentially connecting four beam bodies end to end.
3. The packaging and processing apparatus of an integrated circuit according to claim 1, wherein: the number of the steel balls (13) is 10-20, and the 10-20 steel balls (13) are arranged at equal intervals along the circumferential direction.
4. The packaging and processing apparatus of an integrated circuit according to claim 1, wherein: the supporting plate (1) is provided with a circular through hole for the rotary disc (10) to pass through.
5. The packaging and processing apparatus of an integrated circuit according to claim 1, wherein: the lower surface of a top plate (141) of the polishing mechanism (14) is provided with a transverse sliding rail and a longitudinal sliding rail.
6. The packaging and processing apparatus of an integrated circuit according to claim 1, wherein: the number of the polishing heads is 2-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311395528.9A CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311395528.9A CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
| CN201911181316.4A CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911181316.4A Division CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117524921A true CN117524921A (en) | 2024-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911181316.4A Active CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
| CN202311374710.6A Pending CN117381598A (en) | 2019-11-27 | 2019-11-27 | Semiconductor device processing apparatus |
| CN202311395528.9A Pending CN117524921A (en) | 2019-11-27 | 2019-11-27 | Packaging processing equipment for integrated circuit |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911181316.4A Active CN110867401B (en) | 2019-11-27 | 2019-11-27 | Processing device for integrated circuit packaging device |
| CN202311374710.6A Pending CN117381598A (en) | 2019-11-27 | 2019-11-27 | Semiconductor device processing apparatus |
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| CN (3) | CN110867401B (en) |
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| CN114273946A (en) * | 2021-12-30 | 2022-04-05 | 苏州创隆自动化科技有限公司 | Efficient turning device is used in work piece processing |
| CN116921877B (en) * | 2023-09-14 | 2023-12-01 | 四川富乐华半导体科技有限公司 | Copper-clad ceramic carrier plate cutting and coding device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3818368B2 (en) * | 2000-09-07 | 2006-09-06 | セイコーエプソン株式会社 | Duplex printing device |
| JP4234935B2 (en) * | 2002-02-15 | 2009-03-04 | 東京エレクトロン株式会社 | Automated guided vehicle |
| CN100459034C (en) * | 2007-07-12 | 2009-02-04 | 格兰达技术（深圳）有限公司 | Full-automatic wafer rear marking machine |
| CN101901738A (en) * | 2009-05-26 | 2010-12-01 | 上海功源电子科技有限公司 | Double-guide rail semiconductor chip laser marking method |
| CN201717250U (en) * | 2010-06-29 | 2011-01-19 | 吴华 | Track module for integrated circuit package chip marking machine |
| TWM435051U (en) * | 2012-01-09 | 2012-08-01 | Mas Automation Corp | Solar cell string A cutting device cuts the conductive strip |
| CN202556930U (en) * | 2012-03-20 | 2012-11-28 | 杭州长川科技有限公司 | Integrated circuit marking dedusting device |
| CN108237324B (en) * | 2016-12-24 | 2019-09-20 | 鸿准精密模具（昆山）有限公司 | Marking system |
| JP6858452B2 (en) * | 2017-06-23 | 2021-04-14 | 株式会社ディスコ | Wafer jig with identification mark |
| CN107876991A (en) * | 2017-11-08 | 2018-04-06 | 无锡百禾工业机器人有限公司 | A kind of high efficient two-sided marking machine |
| CN208142143U (en) * | 2018-05-25 | 2018-11-23 | 重庆市嘉凌新科技有限公司 | A kind of semiconductor packages device |
| CN217416989U (en) * | 2022-03-15 | 2022-09-13 | 浙江嘉辰半导体有限公司 | Efficient encapsulation module surface marking device |
-
2019
- 2019-11-27 CN CN201911181316.4A patent/CN110867401B/en active Active
- 2019-11-27 CN CN202311374710.6A patent/CN117381598A/en active Pending
- 2019-11-27 CN CN202311395528.9A patent/CN117524921A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN110867401A (en) | 2020-03-06 |
| CN110867401B (en) | 2023-09-08 |
| CN117381598A (en) | 2024-01-12 |
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