CN211045381U - Automatic packaging device for semiconductor device - Google Patents
Automatic packaging device for semiconductor device Download PDFInfo
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- CN211045381U CN211045381U CN201922076070.6U CN201922076070U CN211045381U CN 211045381 U CN211045381 U CN 211045381U CN 201922076070 U CN201922076070 U CN 201922076070U CN 211045381 U CN211045381 U CN 211045381U
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Abstract
The utility model discloses an automatic packaging hardware for semiconductor device, including backup pad, first frame, second frame, third frame, marking device and grinding machanism, first frame, second frame, third frame connect gradually and set up in the same side of backup pad, marking device sets up in the second frame top, grinding machanism installs in the third frame top; the electromagnetic sliding rails positioned on the inner walls of the first frame, the second frame and the third frame on the same side are communicated, and a moving block is connected between the oppositely arranged electromagnetic sliding rails; the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, and one side of the top plate is fixedly connected with the supporting plate; the utility model discloses can absorb the piece that the in-process of polishing produced to the inside in dust absorption storehouse, avoid the piece to cause air pollution to influence that the staff is healthy, can also avoid later stage cleaning personnel to clear up the difficulty simultaneously.
Description
Technical Field
The utility model relates to a semiconductor device encapsulates the field, specifically is an automatic packaging hardware for semiconductor device.
Background
The semiconductor device is an electronic device having a conductivity between a good conductor and an insulator and performing a specific function by utilizing the special electrical characteristics of a semiconductor material, and is used for generating, controlling, receiving, converting, amplifying a signal and performing energy conversion.
Beat the mark and can only go on one by one in the current semiconductor device packaging process, beat the mark with the semiconductor device one side and still need the manual work to carry out the turn-over, troublesome poeration, and current semiconductor device unhairing limit in-process, the plastics piece is not concentrated the collection, leads to the piece to splash, not only produces harm to staff's health, and the later stage clearance difficulty.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the problems that the existing semiconductor device packaging marking cannot carry out double-sided marking and burrs of the existing semiconductor device are removed without collecting scraps, the automatic packaging device for the semiconductor device is provided.
In order to achieve the above purpose, the utility model adopts the technical scheme that: an automatic packaging device for a semiconductor device comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, and the polishing mechanism is arranged above the third frame;
the electromagnetic sliding rails positioned on the inner walls of the first frame, the second frame and the third frame on the same side are communicated, and a moving block is connected between the oppositely arranged electromagnetic sliding rails;
a motor is arranged on one side, opposite to the second frame, of the supporting plate, a first gear is connected to an output shaft of the motor, a rotary table is rotatably arranged on the supporting plate, a second gear is arranged on the surface, opposite to the second frame, of one side of the rotary table, the second gear is meshed with the first gear, at least two connecting blocks are arranged on the surface, opposite to the second frame, of the other side of the rotary table, and the connecting blocks are fixedly connected with the second frame;
the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, and the baffle plate is arranged on the third frame;
the baffle is provided with an air nozzle, a dust collection bin is arranged below the third frame and is communicated with the air nozzle through a first air pipe, and a negative pressure fan is arranged in the dust collection bin.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the second frame and the third frame are both rectangular frames formed by sequentially connecting four beam bodies end to end.
2. In the above scheme, a plurality of sliding blocks corresponding to the electromagnetic sliding rails are arranged on two side surfaces of the moving block, and the sliding blocks are connected with the electromagnetic sliding rails in a sliding manner.
3. In the above scheme, the moving block is provided with a plurality of through grooves, and the through grooves are connected with the semiconductor device in a clamping manner.
4. In the above scheme, the supporting columns are connected below the first frame and the third frame.
5. In the scheme, the lower surface of the top plate of the grinding mechanism is provided with the transverse sliding rail and the longitudinal sliding rail.
6. In the scheme, the number of the polishing heads is 2-6.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model discloses an automatic packaging hardware for semiconductor device, its backup pad is carried on one side of the second frame and is installed a motor, is connected with a first gear on the output shaft of this motor, rotationally install a carousel in the backup pad, install a second gear on the surface of one side of carousel back on the second frame, this second gear meshes with first gear, install at least two connecting blocks on the surface of the other side of carousel, this connecting block all is connected with the second frame fixedly, has realized the rotation of second frame, thereby can overturn the movable block that moves to the second frame, realizes marking the two-sided of semiconductor device installed in the movable block automatically and need not artificial intervention turn-over, both can avoid the error that the manual turn-over brought and influence the precision of marking, can practice thrift manpower and operating time again, the efficiency of the operation is improved.
2. The utility model discloses an automatic packaging hardware for semiconductor device, its grinding machanism include roof and movable mounting in the head of polishing of roof below, roof one side and backup pad fixed connection, the opposite side of this roof is provided with a baffle, and this baffle mounting has realized removing the polishing to the semiconductor device on the third frame, has richened the connotation of device, has improved the degree of automation to semiconductor device processing, can also avoid polishing the piece that the in-process produced and splash.
3. The utility model discloses an automatic packaging hardware for semiconductor device, it has a tuyere to open on its baffle, third frame below is provided with a dust absorption storehouse, this dust absorption storehouse through a first tuber pipe with tuyere through connection, be provided with a negative-pressure air fan in the dust absorption storehouse, through negative-pressure air fan and dust absorption storehouse, can absorb the piece that the in-process of polishing produced to the inside in dust absorption storehouse, avoid the piece to cause air pollution to influence the staff healthy, can also avoid later stage cleanup crew to clear up the difficulty simultaneously.
Drawings
FIG. 1 is a schematic structural diagram of an automated packaging apparatus for semiconductor devices according to the present invention;
FIG. 2 is a schematic view of a motor connection structure of the automatic packaging apparatus for semiconductor devices according to the present invention;
FIG. 3 is a cross-sectional view of a dust collection chamber of the automatic packaging device for semiconductor devices of the present invention;
fig. 4 is a schematic partial structure diagram of an automatic packaging apparatus for semiconductor devices according to the present invention.
In the above drawings: 1. a support plate; 2. a first frame; 3. a second frame; 4. a third frame; 5. an electromagnetic slide rail; 6. a moving block; 7. a marker; 8. a motor; 9. a first gear; 10. a turntable; 11. a second gear; 12. connecting blocks; 14. a polishing mechanism; 141. a top plate; 15. a dust collection bin; 16. a first air duct; 17. a tuyere; 23. a negative pressure fan; 26. and a baffle plate.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: an automatic packaging device for a semiconductor device comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
the electromagnetic sliding rails 5 are respectively arranged on two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4, the electromagnetic sliding rails 5 on the inner walls of the same side of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic sliding rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic sliding rails 5;
a motor 8 is arranged on one side, opposite to the second frame 3, of the supporting plate 1, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the supporting plate 1, a second gear 11 is arranged on the surface, opposite to the second frame 3, of one side of the rotary table 10, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the surface, opposite to the second frame 3, of the other side of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate through the connecting blocks 12;
the grinding mechanism 14 comprises a top plate 141 and a grinding head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the support plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with an air nozzle 17, a dust suction bin 15 is arranged below the third frame 4, the dust suction bin 15 is communicated with the air nozzle 17 through a first air pipe 16, and a negative pressure fan 23 is arranged in the dust suction bin 15.
The second frame 3 and the third frame 4 are both rectangular frames formed by sequentially connecting four beam bodies end to end; a plurality of sliding blocks corresponding to the electromagnetic slide rails 5 are arranged on two side surfaces of the moving block 6, and the sliding blocks are connected with the electromagnetic slide rails 5 in a sliding manner; the number of the polishing heads is 2.
Example 2: an automatic packaging device for a semiconductor device comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
the electromagnetic sliding rails 5 are respectively arranged on two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4, the electromagnetic sliding rails 5 on the inner walls of the same side of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic sliding rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic sliding rails 5;
a motor 8 is arranged on one side, opposite to the second frame 3, of the supporting plate 1, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the supporting plate 1, a second gear 11 is arranged on the surface, opposite to the second frame 3, of one side of the rotary table 10, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the surface, opposite to the second frame 3, of the other side of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate through the connecting blocks 12;
the grinding mechanism 14 comprises a top plate 141 and a grinding head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the support plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with an air nozzle 17, a dust suction bin 15 is arranged below the third frame 4, the dust suction bin 15 is communicated with the air nozzle 17 through a first air pipe 16, and a negative pressure fan 23 is arranged in the dust suction bin 15.
The moving block 6 is provided with a plurality of through grooves which are connected with the semiconductor device in a clamping manner, so that the semiconductor device is prevented from falling off when the second frame 3 is turned over; support columns are connected below the first frame 2 and the third frame 4; a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of the top plate 141 of the polishing mechanism 14; the number of the polishing heads is 6.
The marker 7 is higher than the second frame 3 and is not connected with the second frame 3, and the second frame 3 is not influenced by the marker 7 when being overturned.
The working principle is as follows: when the device is used, an external power supply is required to be connected and supplies electric energy to the device, so that the device can normally run, a semiconductor device is placed in a cavity inside the moving block 6, the semiconductor device is clamped with the moving block 6 and cannot easily fall off, then the electromagnetic slide rail 5 is started, the moving block 6 can slide inside the first frame 2, the second frame 3 and the third frame 4 under the action of the electromagnetic slide rail 5, when the moving block 6 enters the second frame 3 from the first frame 2, the marking device 7 can mark one surface of a semiconductor, after all marking is finished, the motor 8 is started, the motor 8 rotates to drive the first gear 9 to rotate, the first gear 9 rotates to drive the second gear 11 which is meshed with the first gear to rotate, the rotation of the second gear 11 can drive the turntable 10 to rotate inside the supporting plate 1, the rotation of the turntable 10 can drive the second frame 3 which is fixedly connected with the turntable to rotate, thereby make second frame 3 overturn, the second frame 3 of upset turns out the another side of semiconductor, thereby make marker 7 beat the mark to the another side of semiconductor, make the semiconductor two sides all by the sign, and the process is simple, after beating the mark and accomplishing, the movable block 6 continues to advance, when moving to the inside of third frame 4, polish it by grinding machanism 14 earlier, the piece that produces partly of polishing can get into the inside in dust absorption storehouse 15 through tuyere 17 and first tuber pipe 16 under negative-pressure air fan 23's effect.
When the automatic packaging device for the semiconductor device is adopted, the rotation of the second frame is realized, so that the moving block moved into the second frame can be turned, the double-sided marking of the semiconductor device installed in the moving block is automatically realized without manual intervention and turning, the marking precision is prevented from being influenced by errors caused by manual turning, the labor and the operation time are saved, and the operation efficiency is improved;
in addition, the polishing of the semiconductor device moved to the third frame is realized, the connotation of the device is enriched, the automation degree of processing of the semiconductor device is improved, and the splash of chips generated in the polishing process can be avoided; in addition, it passes through negative-pressure air fan and dust absorption storehouse, can absorb the piece that the in-process of polishing produced to the inside in dust absorption storehouse, avoids the piece to cause air pollution to influence that the staff is healthy, can also avoid later stage cleaning personnel to clear up the difficulty simultaneously.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (7)
1. An automated packaging apparatus for semiconductor devices, characterized by: the automatic marking device comprises a supporting plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7) and a polishing mechanism (14), wherein the first frame (2), the second frame (3) and the third frame (4) are sequentially connected and arranged on the same side of the supporting plate (1), the marking device (7) is arranged above the second frame (3), and the polishing mechanism (14) is arranged above the third frame (4);
the electromagnetic sliding rails (5) are respectively arranged on two opposite inner walls of the first frame (2), the second frame (3) and the third frame (4), the electromagnetic sliding rails (5) positioned on the inner walls of the same side of the first frame (2), the second frame (3) and the third frame (4) are communicated, and a moving block (6) is connected between the oppositely arranged electromagnetic sliding rails (5);
a motor (8) is arranged on one side, opposite to the second frame (3), of the supporting plate (1), a first gear (9) is connected to an output shaft of the motor (8), a rotary table (10) is rotatably arranged on the supporting plate (1), a second gear (11) is arranged on the surface of one side, opposite to the second frame (3), of the rotary table (10), the second gear (11) is meshed with the first gear (9), at least two connecting blocks (12) are arranged on the surface of the other side of the rotary table (10), and the connecting blocks (12) are fixedly connected with the second frame (3);
the polishing mechanism (14) comprises a top plate (141) and a polishing head movably arranged below the top plate (141), one side of the top plate (141) is fixedly connected with the supporting plate (1), the other side of the top plate (141) is provided with a baffle plate (26), and the baffle plate (26) is arranged on the third frame (4);
the dust collection device is characterized in that an air nozzle (17) is arranged on the baffle (26), a dust collection bin (15) is arranged below the third frame (4), the dust collection bin (15) is communicated with the air nozzle (17) through a first air pipe (16), and a negative pressure fan (23) is arranged in the dust collection bin (15).
2. The automated packaging apparatus for semiconductor devices of claim 1, wherein: the second frame (3) and the third frame (4) are rectangular frames formed by sequentially connecting four beam bodies end to end.
3. The automated packaging apparatus for semiconductor devices of claim 1, wherein: and a plurality of sliding blocks corresponding to the electromagnetic sliding rails (5) are arranged on two side surfaces of the moving block (6), and the sliding blocks are connected with the electromagnetic sliding rails (5) in a sliding manner.
4. The automated packaging apparatus for semiconductor devices of claim 1, wherein: the moving block (6) is provided with a plurality of through grooves which are connected with the semiconductor device in a clamping mode.
5. The automated packaging apparatus for semiconductor devices of claim 1, wherein: and supporting columns are connected below the first frame (2) and the third frame (4).
6. The automated packaging apparatus for semiconductor devices of claim 1, wherein: and a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of a top plate (141) of the grinding mechanism (14).
7. The automated packaging apparatus for semiconductor devices of claim 1, wherein: the number of the polishing heads is 2-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922076070.6U CN211045381U (en) | 2019-11-27 | 2019-11-27 | Automatic packaging device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922076070.6U CN211045381U (en) | 2019-11-27 | 2019-11-27 | Automatic packaging device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211045381U true CN211045381U (en) | 2020-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922076070.6U Active CN211045381U (en) | 2019-11-27 | 2019-11-27 | Automatic packaging device for semiconductor device |
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| CN (1) | CN211045381U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116960036A (en) * | 2023-09-21 | 2023-10-27 | 深圳市曜通科技有限公司 | Efficient semiconductor packaging equipment |
-
2019
- 2019-11-27 CN CN201922076070.6U patent/CN211045381U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116960036A (en) * | 2023-09-21 | 2023-10-27 | 深圳市曜通科技有限公司 | Efficient semiconductor packaging equipment |
| CN116960036B (en) * | 2023-09-21 | 2023-11-21 | 深圳市曜通科技有限公司 | Efficient semiconductor packaging equipment |
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