CN110843394B - Processing equipment for QFN (quad Flat No lead) packaging device - Google Patents

Processing equipment for QFN (quad Flat No lead) packaging device Download PDF

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Publication number
CN110843394B
CN110843394B CN201911181293.7A CN201911181293A CN110843394B CN 110843394 B CN110843394 B CN 110843394B CN 201911181293 A CN201911181293 A CN 201911181293A CN 110843394 B CN110843394 B CN 110843394B
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CN
China
Prior art keywords
frame
sliding
supporting plate
plate
processing
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Application number
CN201911181293.7A
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Chinese (zh)
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CN110843394A (en
Inventor
马磊
党鹏
杨光
彭小虎
王新刚
庞朋涛
任斌
王妙妙
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Xi'an Hangsi Semiconductor Co ltd
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Xi'an Hangsi Semiconductor Co ltd
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Priority to CN201911181293.7A priority Critical patent/CN110843394B/en
Publication of CN110843394A publication Critical patent/CN110843394A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/022—Devices for holding or supporting work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B2700/00—Machines, apparatus, tools or accessories for artistic work
    • B44B2700/12—Accessories; Tool or work holders

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses processing equipment of a QFN (quad Flat No-lead) packaging device, which comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, the polishing mechanism is arranged above the third frame, the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, an air nozzle is arranged on the baffle plate, a dust suction bin is arranged below the third frame, a negative pressure fan is arranged in the dust suction bin, and a dust collecting plate is arranged below the third frame. The invention automatically marks the two sides of the semiconductor device arranged in the moving block without manual intervention of turning, thereby not only avoiding the error caused by manual turning from influencing the marking precision, but also improving the operation efficiency.

Description

Processing equipment for QFN (quad Flat No lead) packaging device
Technical Field
The invention relates to the field of semiconductor device packaging, in particular to processing equipment of a QFN (quad Flat No lead) packaging device.
Background
The semiconductor device is an electronic device having a conductivity between a good conductor and an insulator and performing a specific function by utilizing the special electrical characteristics of a semiconductor material, and is used for generating, controlling, receiving, converting, amplifying a signal and performing energy conversion.
Beat the mark and can only go on one by one in the current semiconductor device packaging process, beat the mark with the semiconductor device one side and still need the manual work to carry out the turn-over, troublesome poeration, and current semiconductor device unhairing limit in-process, the plastics piece is not concentrated the collection, leads to the piece to splash, not only produces harm to staff's health, and the later stage clearance difficulty.
Disclosure of Invention
The invention aims to: in order to solve the problems that the existing semiconductor device packaging marking cannot carry out double-sided marking and burrs of the existing semiconductor device are removed and scraps are not collected, the processing equipment of the QFN packaging device is provided.
In order to achieve the purpose, the invention adopts the technical scheme that: the processing equipment of the QFN packaging device comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, and the polishing mechanism is arranged above the third frame;
the electromagnetic sliding rails positioned on the inner walls of the first frame, the second frame and the third frame on the same side are communicated, and a moving block is connected between the oppositely arranged electromagnetic sliding rails;
a motor is arranged on one side, opposite to the second frame, of the supporting plate, a first gear is connected to an output shaft of the motor, a rotary table is rotatably arranged on the supporting plate, a second gear is arranged on the surface, opposite to the second frame, of one side of the rotary table, the second gear is meshed with the first gear, at least two connecting blocks are arranged on the surface, opposite to the second frame, of the other side of the rotary table, and the connecting blocks are fixedly connected with the second frame;
the supporting plate is provided with an annular chute, a plurality of steel balls are arranged in the chute in a rotatable manner along the circumferential direction, and the turntable is embedded in the chute and is connected with the supporting plate in a rotatable manner through the steel balls;
the polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, the other side of the top plate is provided with a baffle plate, and the baffle plate is arranged on the third frame;
the baffle is provided with an air nozzle, a dust collection bin is arranged below the third frame, the dust collection bin is communicated with the air nozzle through a first air pipe, and a negative pressure fan is arranged in the dust collection bin;
a dust collecting plate is arranged below the third frame, a through hole is formed in the dust collecting plate, and the through hole is communicated with the dust collection bin through a second air pipe;
the dust collection box is characterized in that a drawer is arranged in the dust collection box, a sliding block is arranged at the bottom of the drawer, a sliding groove matched with the sliding block is arranged in the dust collection box, and the sliding groove in the dust collection box is embedded into the sliding block at the bottom of the drawer to connect the drawer in the dust collection box in a sliding mode.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, a plurality of sliding blocks corresponding to the electromagnetic sliding rails are arranged on two side surfaces of the moving block, and the sliding blocks are connected with the electromagnetic sliding rails in a sliding manner.
2. In the above scheme, the second frame and the third frame are both rectangular frames formed by sequentially connecting four beam bodies end to end.
3. In the above scheme, the through hole is formed in the lower surface of the dust collecting plate.
4. In the scheme, the outer side of the drawer is connected with a handle.
5. In the above scheme, the supporting columns are connected below the first frame and the third frame.
6. In the scheme, the lower surface of the top plate of the grinding mechanism is provided with the transverse sliding rail and the longitudinal sliding rail.
7. In the scheme, the number of the steel balls is 10-20, and the 10-20 steel balls are arranged at equal intervals along the circumferential direction.
8. In the above scheme, the supporting plate is provided with a circular through hole for the turntable to pass through, and the circular sliding groove is located on the outer side of the circumference of the circular through hole.
9. In the scheme, the middle part of the rotary disc penetrates out of the circular through hole, and the circumferential edge of the rotary disc is embedded into the sliding groove.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the processing equipment of the QFN packaging device realizes the rotation of the second frame, so that a moving block moved into the second frame can be turned, the marking of the double surfaces of the semiconductor device installed in the moving block is automatically realized without manual intervention for turning, the marking precision can be prevented from being influenced by errors caused by manual turning, the labor and the operation time can be saved, and the operation efficiency is improved; furthermore, an annular chute is arranged on the supporting plate, a plurality of steel balls are arranged in the chute in a rotating mode along the circumferential direction, the rotary table is embedded into the chute and is connected with the supporting plate in a rotating mode through the steel balls, resistance in the process of turning the second frame is reduced on the basis that the second frame can be turned, turning actions of the second frame are smooth, and position accuracy of stopping in the turning process is better, so that quality and accuracy of double-sided marking are guaranteed.
2. The processing equipment for the QFN packaging device realizes the polishing of the semiconductor device moved to the third frame, enriches the connotation of the device, improves the automation degree of the processing of the semiconductor device, and can also avoid the splashing of scraps generated in the polishing process; the air nozzle is arranged on the baffle, the dust collection bin is arranged below the third frame and is communicated with the air nozzle through a first air pipe, the negative pressure fan is arranged in the dust collection bin, and debris generated in the polishing process can be absorbed into the dust collection bin through the negative pressure fan and the dust collection bin, so that the influence of air pollution caused by the debris on the health of workers is avoided, and meanwhile, the difficulty in cleaning by later-stage cleaning personnel can be avoided; furthermore, a dust collecting plate is arranged below the third frame, a through hole is formed in the dust collecting plate, the through hole is communicated with the dust collection bin through a second air pipe, the dust collecting plate and the second air pipe are arranged on the basis of the first air pipe, the first air pipe can further miss re-absorption of the chips which are not sucked, comprehensive absorption of the chips generated in the polishing process is guaranteed, and the conditions that air pollution caused by the chips affects the body health of workers and the cleaning difficulty in the later period are avoided; in addition, a drawer is arranged in the dust collection bin, the arrangement of the drawer is convenient for cleaning up the chips absorbed into the dust collection bin, and the situation that the chips in the bin are accumulated too much to influence the efficiency of the fan is prevented.
Drawings
FIG. 1 is a schematic structural diagram of a processing device of a QFN package device of the present invention;
FIG. 2 is a schematic view of a motor connection structure of a processing device of the QFN package device of the present invention;
FIG. 3 is a cross-sectional view of a support plate of the QFN package device processing equipment;
FIG. 4 is a cross-sectional view of a dust collection bin of the processing equipment of the QFN package device of the invention;
FIG. 5 is a schematic view of a dust collection bin connection structure of a processing device of the QFN package device of the present invention;
fig. 6 is a schematic partial structure diagram of processing equipment of the QFN packaged device of the invention.
In the above drawings: 1. a support plate; 2. a first frame; 3. a second frame; 4. a third frame; 5. an electromagnetic slide rail; 6. a moving block; 7. a marker; 8. a motor; 9. a first gear; 10. a turntable; 11. a second gear; 12. connecting blocks; 13. steel balls; 14. a polishing mechanism; 141. a top plate; 15. a dust collection bin; 16. a first air duct; 17. a tuyere; 18. a second air duct; 19. a dust collecting plate; 20. a through hole; 21. a drawer; 23. a negative pressure fan; 25. a chute; 26. and a baffle plate.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: the processing equipment of the QFN packaging device comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
the electromagnetic sliding rails 5 are respectively arranged on two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4, the electromagnetic sliding rails 5 on the inner walls of the same side of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic sliding rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic sliding rails 5;
a motor 8 is arranged on one side, opposite to the second frame 3, of the supporting plate 1, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the supporting plate 1, a second gear 11 is arranged on the surface, opposite to the second frame 3, of one side of the rotary table 10, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the surface, opposite to the second frame 3, of the other side of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate through the connecting blocks 12;
the supporting plate 1 is provided with an annular sliding chute 25, a plurality of steel balls 13 are arranged in the sliding chute 25 in a rotatable manner along the circumferential direction, and the rotating disc 10 is embedded in the sliding chute 25 and is connected with the supporting plate 1 in a rotatable manner through the steel balls 13;
the grinding mechanism 14 comprises a top plate 141 and a grinding head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the support plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with an air nozzle 17, a dust suction bin 15 is arranged below the third frame 4, the dust suction bin 15 is communicated with the air nozzle 17 through a first air pipe 16, and a negative pressure fan 23 is arranged in the dust suction bin 15;
a dust collecting plate 19 is arranged below the third frame 4, a through hole 20 is arranged on the dust collecting plate 19, and the through hole 20 is communicated with the dust collection bin 15 through a second air duct 18;
a drawer 21 is arranged in the dust collection bin 15, a sliding block is arranged at the bottom of the drawer 21, a sliding groove matched with the sliding block is arranged in the dust collection bin 15, and the sliding groove in the dust collection bin 15 is embedded into the sliding block at the bottom of the drawer 21 to connect the drawer 21 in the dust collection bin 15 in a sliding mode.
A plurality of sliding blocks corresponding to the electromagnetic slide rails 5 are arranged on two side surfaces of the moving block 6, the sliding blocks are connected with the electromagnetic slide rails 5 in a sliding manner, and a plurality of through grooves are arranged on the moving block 6 and are connected with the semiconductor device in a clamping manner; the second frame 3 and the third frame 4 are both rectangular frames formed by sequentially connecting four beam bodies end to end; the number of the steel balls 13 is 15, and the 15 steel balls 13 are arranged at equal intervals along the circumferential direction;
the through hole 20 is arranged on the lower surface of the dust collecting plate 19; a handle is connected to the outer side of the drawer 21; support columns are connected below the first frame 2 and the third frame 4; the lower surface of the top plate 141 of the grinding mechanism 14 is provided with a transverse slide rail and a longitudinal slide rail.
Example 2: the processing equipment of the QFN packaging device comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
the electromagnetic sliding rails 5 are respectively arranged on two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4, the electromagnetic sliding rails 5 on the inner walls of the same side of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic sliding rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic sliding rails 5;
a motor 8 is arranged on one side, opposite to the second frame 3, of the supporting plate 1, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the supporting plate 1, a second gear 11 is arranged on the surface, opposite to the second frame 3, of one side of the rotary table 10, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the surface, opposite to the second frame 3, of the other side of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate through the connecting blocks 12;
the supporting plate 1 is provided with an annular sliding chute 25, a plurality of steel balls 13 are arranged in the sliding chute 25 in a rotatable manner along the circumferential direction, and the rotating disc 10 is embedded in the sliding chute 25 and is connected with the supporting plate 1 in a rotatable manner through the steel balls 13;
the grinding mechanism 14 comprises a top plate 141 and a grinding head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the support plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
the baffle 26 is provided with an air nozzle 17, a dust suction bin 15 is arranged below the third frame 4, the dust suction bin 15 is communicated with the air nozzle 17 through a first air pipe 16, and a negative pressure fan 23 is arranged in the dust suction bin 15;
a dust collecting plate 19 is arranged below the third frame 4, a through hole 20 is arranged on the dust collecting plate 19, and the through hole 20 is communicated with the dust collection bin 15 through a second air duct 18;
a drawer 21 is arranged in the dust collection bin 15, a sliding block is arranged at the bottom of the drawer 21, a sliding groove matched with the sliding block is arranged in the dust collection bin 15, and the sliding groove in the dust collection bin 15 is embedded into the sliding block at the bottom of the drawer 21 to connect the drawer 21 in the dust collection bin 15 in a sliding mode.
A plurality of sliding blocks corresponding to the electromagnetic slide rails 5 are arranged on two side surfaces of the moving block 6, the sliding blocks are connected with the electromagnetic slide rails 5 in a sliding manner, a plurality of through grooves are arranged on the moving block 6, and the through grooves are connected with the semiconductor device in a clamping manner, so that the semiconductor device is prevented from falling off when the second frame 3 is turned over; the second frame 3 and the third frame 4 are both rectangular frames formed by sequentially connecting four beam bodies end to end; the number of the steel balls 13 is 12, and the 12 steel balls 13 are arranged at equal intervals along the circumferential direction;
the through hole 20 is arranged on the lower surface of the dust collecting plate 19; a handle is connected to the outer side of the drawer 21; support columns are connected below the first frame 2 and the third frame 4; a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of the top plate 141 of the polishing mechanism 14;
a circular through hole for the turntable 10 to pass through is formed in the support plate 1, and the annular sliding groove 25 is positioned on the outer side of the circumference of the circular through hole; the middle part of the rotary table 10 penetrates out of the circular through hole, and the circumferential edge of the rotary table 10 is embedded into the sliding groove 25;
the marker 7 is higher than the second frame 3 and is not connected with the second frame 3, and the second frame 3 is not influenced by the marker 7 when being overturned.
The working principle is as follows: when the device is used, an external power supply is required to be connected and supplies electric energy to the device, so that the device can normally run, a semiconductor device is placed in a cavity inside the moving block 6, the semiconductor device is clamped with the moving block 6 and cannot easily fall off, then the electromagnetic slide rail 5 is started, the moving block 6 can slide inside the first frame 2, the second frame 3 and the third frame 4 under the action of the electromagnetic slide rail 5, when the moving block 6 enters the second frame 3 from the first frame 2, the marking device 7 can mark one surface of a semiconductor, after all marking is finished, the motor 8 is started, the motor 8 rotates to drive the first gear 9 to rotate, the first gear 9 rotates to drive the second gear 11 to be meshed with the first gear 9 to rotate, the rotation of the second gear 11 can drive the turntable 10 to rotate inside the supporting plate 1, and the rotation process is smoother under the action of the sliding groove 25 and the steel balls 13, the rotation of carousel 10 can drive rather than fixed connection second frame 3 and rotate, thereby make second frame 3 overturn, the second frame 3 of upset turns over the another side of semiconductor, thereby make marker 7 beat the another side of semiconductor, make the semiconductor both sides all by the sign, and the process is simple, after beating the mark completion, movable block 6 continues to advance, when removing to the inside of third frame 4, polish it by grinding mechanism 14 earlier, the piece that produces partly of polishing can get into the inside in dust absorption storehouse 15 through tuyere 17 and first tuber pipe 16 under negative pressure fan 23's effect, partly piece can drop in the inside of dust collection board 19 inside second tuber pipe 18 transportation to dust absorption storehouse 15, can clear up the piece in dust absorption storehouse 15 through pulling drawer 21, and is convenient and simple.
When the processing equipment of the QFN packaging device is adopted, the second frame is rotated, so that the moving block moved into the second frame can be turned, the double-sided marking of the semiconductor device installed in the moving block can be automatically realized without manual intervention and turning, the marking precision can be prevented from being influenced by errors caused by manual turning, the labor and the operation time can be saved, and the operation efficiency can be improved; furthermore, on the basis that the second frame can be overturned, the resistance of the second frame in the overturning process is reduced, so that the overturning action of the second frame is smoother, and the position precision of stopping in the overturning process is better, thereby ensuring the quality and precision of double-sided marking;
in addition, the polishing of the semiconductor device moved to the third frame is realized, the connotation of the device is enriched, the automation degree of the processing of the semiconductor device is improved, and the splashing of chips generated in the polishing process can be avoided;
in addition, the debris generated in the polishing process can be absorbed into the dust collection bin through the negative pressure fan and the dust collection bin, so that the influence of air pollution caused by the debris on the body health of workers is avoided, and meanwhile, the difficulty in cleaning by later-period cleaning personnel can be avoided; furthermore, the dust collecting plate and the second air pipe are arranged on the basis of the first air pipe, so that the first air pipe can further absorb chips which are missed and not sucked again, the comprehensive absorption of the chips generated in the grinding process is ensured, and the conditions that the air pollution caused by the chips influences the body health of workers and the cleaning difficulty in the later period are avoided;
in addition, the setting of drawer is convenient for clear up the piece that absorbs to in the dust absorption storehouse, prevents that the piece from piling up too much and influencing the efficiency of fan in the storehouse.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (10)

1. The processing equipment of the QFN packaging device comprises a supporting plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7) and a polishing mechanism (14), wherein the first frame (2), the second frame (3) and the third frame (4) are sequentially connected and arranged on the same side of the supporting plate (1), the marking device (7) is arranged above the second frame (3), and the polishing mechanism (14) is arranged above the third frame (4);
the method is characterized in that: the electromagnetic sliding rails (5) are respectively arranged on two opposite inner walls of the first frame (2), the second frame (3) and the third frame (4), the electromagnetic sliding rails (5) positioned on the inner walls of the same side of the first frame (2), the second frame (3) and the third frame (4) are communicated, and a moving block (6) is connected between the oppositely arranged electromagnetic sliding rails (5);
a motor (8) is arranged on one side, opposite to the second frame (3), of the supporting plate (1), a first gear (9) is connected to an output shaft of the motor (8), a rotary table (10) is rotatably arranged on the supporting plate (1), a second gear (11) is arranged on the surface of one side, opposite to the second frame (3), of the rotary table (10), the second gear (11) is meshed with the first gear (9), at least two connecting blocks (12) are arranged on the surface of the other side of the rotary table (10), and the connecting blocks (12) are fixedly connected with the second frame (3);
the supporting plate (1) is provided with an annular sliding chute (25), a plurality of steel balls (13) are arranged in the sliding chute (25) in a rotating mode along the circumferential direction, and the rotating disc (10) is embedded into the sliding chute (25) and is connected with the supporting plate (1) in a rotating mode through the steel balls (13);
the polishing mechanism (14) comprises a top plate (141) and a polishing head movably arranged below the top plate (141), one side of the top plate (141) is fixedly connected with the supporting plate (1), the other side of the top plate (141) is provided with a baffle plate (26), and the baffle plate (26) is arranged on the third frame (4);
the baffle (26) is provided with an air nozzle (17), a dust suction bin (15) is arranged below the third frame (4), the dust suction bin (15) is communicated with the air nozzle (17) through a first air pipe (16), and a negative pressure fan (23) is arranged in the dust suction bin (15);
a dust collecting plate (19) is arranged below the third frame (4), a through hole (20) is formed in the dust collecting plate (19), and the through hole (20) is communicated with the dust collection bin (15) through a second air pipe (18);
a drawer (21) is arranged in the dust collection bin (15), a sliding block is arranged at the bottom of the drawer (21), a sliding groove matched with the sliding block is arranged in the dust collection bin (15), the sliding groove in the dust collection bin (15) is embedded into the sliding block at the bottom of the drawer (21), and the drawer (21) is connected with the dust collection bin (15) in a sliding mode.
2. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: and a plurality of sliding blocks corresponding to the electromagnetic sliding rails (5) are arranged on two side surfaces of the moving block (6), and the sliding blocks are connected with the electromagnetic sliding rails (5) in a sliding manner.
3. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the second frame (3) and the third frame (4) are rectangular frames formed by sequentially connecting four beam bodies end to end.
4. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the through hole (20) is arranged on the lower surface of the dust collecting plate (19).
5. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the outer side of the drawer (21) is connected with a handle.
6. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: and supporting columns are connected below the first frame (2) and the third frame (4).
7. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: and a transverse slide rail and a longitudinal slide rail are arranged on the lower surface of a top plate (141) of the grinding mechanism (14).
8. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the number of the steel balls (13) is 10-20, and the 10-20 steel balls (13) are arranged at equal intervals along the circumferential direction.
9. The apparatus for processing QFN packaged devices as claimed in claim 1, wherein: the supporting plate (1) is provided with a circular through hole for the turntable (10) to pass through, and the circular sliding groove (25) is located on the outer side of the circumference of the circular through hole.
10. The apparatus for processing QFN packaged devices as claimed in claim 9, wherein: the middle part of the rotary table (10) penetrates out of the circular through hole, and the circumferential edge of the rotary table (10) is embedded into the sliding groove (25).
CN201911181293.7A 2019-11-27 2019-11-27 Processing equipment for QFN (quad Flat No lead) packaging device Active CN110843394B (en)

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CN104201156A (en) * 2014-08-08 2014-12-10 天水华天科技股份有限公司 Substrate based bumped flip chip CSP (Chip Scale Package) package part, substrate and manufacturing method
CN206732740U (en) * 2017-06-02 2017-12-12 刘月琴 A kind of sanding apparatus of electronic heat sink fin
US10403580B2 (en) * 2017-12-29 2019-09-03 Intel IP Corporation Molded substrate package in fan-out wafer level package

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Denomination of invention: QFN packaging device processing equipment

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