CN220548105U

CN220548105U - Wafer external diameter grinding device

Info

Publication number: CN220548105U
Application number: CN202322239963.4U
Authority: CN
Inventors: 黄嘉�
Original assignee: Jiaxing Jingxin Electronics Co ltd
Current assignee: Jiaxing Jingxin Electronics Co ltd
Priority date: 2023-08-18
Filing date: 2023-08-18
Publication date: 2024-03-01
Anticipated expiration: 2033-08-18

Abstract

The utility model provides a wafer outer diameter grinding device, and belongs to the technical field of semiconductors. The wafer outer diameter grinding device comprises a working box, wherein the working box comprises a placing mechanism, a chip removing mechanism and a grinding mechanism, the placing mechanism comprises a rotary placing table arranged on a bottom plate in the working box, the rotary placing table is provided with a plurality of vacuum chucks, and a wafer is placed on the vacuum chucks; the grinding mechanism comprises a frame, a first mounting plate and a sliding rail are arranged on the frame, a first driving motor is arranged on the first mounting plate, a first screw rod is connected with the first driving motor in a transmission mode, and a first sliding block is connected onto the sliding rail in a sliding mode. The utility model has the advantage of automatically cleaning the scraps.

Description

Wafer external diameter grinding device

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a wafer outer diameter grinding device.

Background

The wafer grinding is an important semiconductor processing technology, and the principle is that uneven parts on the surface of the wafer are ground flat in a mechanical grinding mode, so that the surface evenness of the uneven parts meets certain requirements, and in the wafer grinding process, the grinding treatment of the outer diameter of the wafer is also important, so that the quality of the surface of the outer diameter of the wafer can be effectively improved. The prior device can generate a large amount of scraps and sand grains in the process of grinding the outer diameter of the wafer, the scraps and the sand grains can stay on the surface of the wafer, the scraps and the sand grains are cleaned manually, and the scraps or the sand grains can be ejected during grinding, so that the body safety of operators can be influenced by the fact that the scraps or the sand grains are ejected to the operators.

Disclosure of Invention

The utility model aims at solving the problems in the prior art and provides a wafer outer diameter grinding device which has the advantage of automatically cleaning scraps.

The aim of the utility model can be achieved by the following technical scheme: the wafer outer diameter grinding device comprises a working box, wherein the working box comprises a placing mechanism, a chip removing mechanism and a grinding mechanism,

the placing mechanism comprises a rotary placing table arranged on the bottom plate in the working box, a plurality of vacuum chucks are arranged on the rotary placing table, and the wafer is placed on the vacuum chucks;

the grinding mechanism comprises a frame, wherein a first mounting plate and a sliding rail are arranged on the frame, a first driving motor is arranged on the first mounting plate, a first screw rod is connected with the first driving motor in a transmission manner, a first sliding block is connected to the sliding rail in a sliding manner, the first sliding block is connected with the first screw rod, a grinding frame is fixedly connected to the first sliding block, a second driving motor is arranged on the grinding frame, and a grinding wheel is connected with the second driving motor in a transmission manner;

the chip removing mechanism comprises two third driving motors symmetrically arranged on one side of the working box, each third driving motor is in transmission connection with a second screw rod, a second sliding block is connected to the second screw rod, a chip removing frame is fixedly connected to the second sliding block, a telescopic rod is fixedly connected to the chip removing frame, and a chip removing brush is arranged on the telescopic rod; the material placing box is arranged in the working box and is internally provided with a material placing groove.

Preferably, a material placing groove of the material placing box is positioned below the grinding wheel and used for collecting the fallen scraps of the brush.

Preferably, the first screw rod is higher than the second screw rod in the working box.

Preferably, the grinding wheel has a grinding portion capable of abutting against the outer diameter of the wafer, and is further provided with a chamfer.

Preferably, a first sliding groove is formed in the first sliding block, a first sliding part is arranged on the sliding rail, and the first sliding part is in sliding fit with the first sliding groove.

Preferably, the working box is further provided with an opening and closing door, the opening and closing door is provided with an observation window and an opening and closing handle, the material placing box is provided with a push-pull handle, and the working box is further provided with a box outlet for taking out the material placing box.

Compared with the prior art, the utility model has the advantages that: through setting up one from left to right automatic chip removing brush that can brush the wafer surface to brush the piece in putting the magazine, be favorable to automatic clearance piece, through setting up one and can be with operating personnel and the isolated work box of operation panel, piece or granule bullet to operating personnel that pops up when can preventing to grind play the guard action.

Drawings

Fig. 1 is a front cross-sectional view of the present utility model.

Fig. 2 is a front view of the present utility model.

Fig. 3 is a top cross-sectional view of the present utility model.

Fig. 4 is a component view of the polishing mechanism in the present utility model.

Fig. 5 is a connection diagram of the chip removing mechanism in the present utility model.

In the figure, 2, a working box; 31. rotating the placement table; 32. a vacuum chuck; 41. a frame; 42. a first mounting plate; 43. a slide rail; 431. a first sliding portion; 44. a first driving motor; 45. a first screw rod; 46. a first slider; 461. a first sliding groove; 47. a grinding frame; 48. grinding the grinding wheel; 481. a polishing section; 482. chamfering; 49. a second driving motor; 51. a third driving motor; 52. a second screw rod; 53. a second slider; 54. a chip removing frame; 55. a telescopic rod; 56. a chip removing brush; 57. a material box is arranged; 571. push-pull handle; 58. a material placing groove; 6. an opening/closing door; 7. an observation window; 8. an opening and closing handle; 9. and a box outlet.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 5, the wafer outer diameter grinding device comprises a working box 2, wherein the working box 2 comprises a placing mechanism, a chip removing mechanism and a grinding mechanism, the placing mechanism comprises a rotary placing table 31 arranged on the inner bottom plate of the working box 2, the rotary placing table 31 is provided with a plurality of vacuum chucks 32, and the wafer is placed on the vacuum chucks 32; the grinding mechanism comprises a frame 41, a first mounting plate 42 and a sliding rail 43 are arranged on the frame 41, a first driving motor 44 is mounted on the first mounting plate 42, a first screw rod 45 is connected to the first driving motor 44 in a transmission manner, a first sliding block 46 is connected to the sliding rail 43 in a sliding manner, the first sliding block 46 is connected with the first screw rod 45, a grinding frame 47 is fixedly connected to the first sliding block 46, a second driving motor 49 is mounted on the grinding frame 47, and a grinding wheel 48 is connected to the second driving motor 49 in a transmission manner; the chip removing mechanism comprises two second driving motors 49 symmetrically arranged on one side of the working box 2, a second screw rod 52 is connected to each second driving motor 49 in a transmission way, a second sliding block 53 is connected to the second screw rod 52, a chip removing frame 54 is fixedly connected to the second sliding block 53, a telescopic rod 55 is fixedly connected to the chip removing frame 54, and a chip removing brush 56 is arranged on the telescopic rod 55; the work box 2 is also provided with a material box 57, and the material box 57 is provided with a material groove 58.

In the present utility model, the rotary placing table 31 and the vacuum chuck 32 are in the prior art, and the rotary placing table 31 is used for rotating the wafer at a high speed.

With the above structure, an operator places a wafer on the vacuum chuck 32 of the rotary placing table 31, and when grinding is performed, the first driving motor 44 is started to drive the first screw rod 45 to rotate, the first screw rod 45 can convert rotary motion into linear motion, and the first sliding block 46 can horizontally displace left or right on the first screw rod 45; the first sliding block 46 is moved leftwards until the grinding wheel 48 on the first sliding block 46 can be abutted against the outer diameter edge of the wafer, then the second driving motor 49 is started to rotate the grinding wheel 48, and the rotation direction of the grinding wheel 48 is opposite to the rotation direction of the rotary placing table 31, so that the outer diameter of the wafer is ground; after grinding, the first screw rod 45 drives the grinding wheel 48 on the first sliding block 46 to translate rightwards, then the third driving motor 51 is started to drive the second screw rod 52 to rotate, the second screw rod 52 can also convert rotary motion into linear motion, the second sliding block 53 can be driven to translate rightwards, the telescopic rod 55 arranged on the second sliding block 53 is used for adjusting the height position of the chip removing brush 56, the chip removing brush 56 moves leftwards and rightwards, surface chips can be brushed or removed when passing through the upper surface of a wafer, the chips are brought to the right side of the wafer and brushed out, the material placing box 57 is placed under the rightmost side of the wafer, and the chips brushed out from the right side of the wafer drop into the material placing box 57 of the working box 2, so that the operations of removing and collecting the chips are completed.

The chip removing brush 56 capable of automatically brushing the surface of the wafer from left to right is arranged, and the chip is cleaned into the material placing box 57, so that the chip can be cleaned automatically, and the chip or particles ejected during grinding can be prevented from being ejected to the operator by arranging the working box 2 capable of isolating the operator from the operating platform, so that a protection effect is achieved.

Specifically, as shown in fig. 1 to 5, a chute 58 of the magazine 57 is located below the grinding wheel 48 for collecting the brush-falling debris.

With the above structure, the placement box 57 prevents the lower side of the grinding wheel 48, and the collection of the chips can be more conveniently performed.

As shown in fig. 1 to 5, the height of the first screw 45 in the work box 2 is higher than the height of the second screw 52 in the work box 2.

With the above structure, the dust removing brush 56 on the second slider 53 can be prevented from colliding with the device structure on the grinding mechanism when translating from left to right, and the service life can be prolonged.

As shown in fig. 1 to 5, the polishing wheel 48 has a polishing portion 481, the polishing portion 481 can be abutted against the outer diameter of the wafer, and the polishing wheel 48 is further provided with a chamfer 482.

With the above structure, the grinding wheel 48 is ground by the grinding part 481 and the chamfers 482 provided on the upper and lower sides of the grinding wheel 48, so that the grinding efficiency is improved, the processing time is shortened, and the precision is high

As shown in fig. 1 to 5, the first sliding block 46 is provided with a first sliding groove 461, the sliding rail 43 is provided with a first sliding portion 431, and the first sliding portion 431 is slidably engaged with the first sliding groove 461.

With the above structure, the displacement of the grinding wheel 48 to the left or right on the first slider 46 is facilitated.

As shown in fig. 1 to 5, the working box 2 is further provided with an opening and closing door 6, the opening and closing door 6 is provided with an observation window 7 and an opening and closing handle 8, the material placing box 57 is provided with a push-pull handle 571, and the working box 2 is further provided with a box outlet 9 for taking out the material placing box 57.

With the adoption of the structure, the material placing box 57 can be taken out through the box outlet 9 of the working box 2, so that the material placing box 57 is more convenient to take out, and the scraps in the material placing box 57 are convenient to carry out subsequent treatment.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. Meanwhile, the meaning of "and/or" appearing throughout the text is to include three schemes, taking "a and/or B" as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

All the components are general standard components or components known to the person skilled in the art, and the structures and principles of the components are known to the person skilled in the art through technical manuals or through routine experimental methods.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.

Claims

1. The wafer outer diameter grinding device comprises a working box (2), and is characterized in that the working box (2) comprises a placing mechanism, a chip removing mechanism and a grinding mechanism,

the placing mechanism comprises a rotary placing table (31) arranged on the bottom plate in the working box (2), the rotary placing table (31) is provided with a plurality of vacuum chucks (32), and the wafer is placed on the vacuum chucks (32);

the grinding mechanism comprises a frame (41), a first mounting plate (42) and a sliding rail (43) are arranged on the frame (41), a first driving motor (44) is arranged on the first mounting plate (42), a first screw rod (45) is connected with the first driving motor (44) in a transmission mode, a first sliding block (46) is connected to the sliding rail (43) in a sliding mode, the first sliding block (46) is connected with the first screw rod (45), a grinding frame (47) is fixedly connected to the first sliding block (46), a second driving motor (51) is arranged on the grinding frame (47), and a grinding wheel (48) is connected to the second driving motor (51) in a transmission mode.

The chip removing mechanism comprises two second driving motors (51) symmetrically arranged on one side of the working box (2), a second screw rod (52) is connected to each second driving motor (51) in a transmission manner, a second sliding block (53) is connected to each second screw rod (52), a chip removing frame (54) is fixedly connected to each second sliding block (53), a telescopic rod (55) is fixedly connected to each chip removing frame (54), and a chip removing brush (56) is arranged on each telescopic rod (55); a material placing box (57) is further arranged in the working box (2), and a material placing groove (58) is formed in the material placing box (57).

2. A wafer outside diameter grinding apparatus according to claim 1, wherein a chute (58) of the magazine (57) is located below the grinding wheel (48) for collecting brush-off debris.

3. A wafer outer diameter grinding apparatus according to claim 1, wherein the first screw (45) has a higher height in the working chamber (2) than the second screw (52) has in the working chamber (2).

4. The apparatus according to claim 1, wherein the grinding wheel (48) has a grinding portion (481), the grinding portion (481) being capable of abutting against the outer diameter of the wafer, and the grinding wheel (48) is further provided with a chamfer (482).

5. The wafer outer diameter polishing apparatus as set forth in claim 1, wherein the first slider (46) is provided with a first sliding groove (461), the slide rail (43) is provided with a first sliding portion (431), and the first sliding portion (431) is slidably engaged with the first sliding groove (461).

6. The wafer outer diameter grinding device according to claim 1, wherein the working box (2) is further provided with an opening and closing door (6), the opening and closing door (6) is provided with an observation window (7) and an opening and closing handle (8), the material placing box (57) is provided with a push-pull handle (571), and the working box (2) is further provided with a box outlet (9) for taking out the material placing box (57).