KR20100064189A - Combined apparatus of vision inspection and sorting for semiconductor die - Google Patents

Abstract

PURPOSE: A semiconductor die inspection and a classification combined device are provided to shorten an inspection time due to inspecting an upper surface and a lower surface simultaneously. CONSTITUTION: A wafer seating unit(110) leaves the wafer movable in every direction. A rotary plate(120) includes a plurality of safe seating recesses with positioning a die. A first pick up unit(130) picks up the die arranged on the wafer and locates on the rotary plate. A second pickup unit(150) picks up the die recorded by an inspection camera and locates on a good product tray or an inferior product tray.

Description

Combined apparatus of vision inspection and sorting for semiconductor die

The present invention is an automated semiconductor die inspection and sorting integration device, and more particularly, an automated semiconductor die which inspects a die picked up from a wafer by an optical device, classifies the inspected die as good or defective and places it on a tray. Relates to an apparatus for inspection and classification integration.

In general, a wafer refers to a disk-shaped silicon rod made by cutting a thin cylindrical silicon rod in order to manufacture silicon crystals into semiconductor chips. In such a wafer, a series of manufacturing processes form approximately hundreds of dies, which are unit devices.

The die as described above is picked up by an adsorption nozzle and the like, separated from the wafer, and then transferred to a subsequent process such as die bonding, thereby finally manufacturing a semiconductor chip.

In recent years, as the demand for discrete die separated from wafers (also called bare dies, hereinafter referred to as dies) increases, the appearance of the dies needs to be inspected, and the dies inspected are subsequently processed. It should be classified as good or defective.

1 is a block diagram schematically illustrating a inspection and classification process of a semiconductor die according to the prior art, and FIG. 2 is a plan view illustrating an example of a defective die in the inspection apparatus of the semiconductor die according to the prior art.

According to the prior art, the dies D arranged on the wafer 10 are picked up from the wafer 10 by a pickup device 20 equipped with suction arms and played on the transport tray 30.

The conveyance tray is moved to the inspection apparatus 40, and the die D placed on the conveyance tray 30 is moved to the inspection apparatus 40 to check whether there is a defect. That is, the inspection apparatus 40 is equipped with optical instruments, such as a microscope, and a tester examines the surface of the die D through the inspection apparatus 40, such as a microscope.

FIG. 2 is a plan view showing good and defective parts of the die D. FIG. 2 (a) shows a good die, and FIG. 2 (b) shows die chipping, that is, chip out. This generated defective die is shown. The die chipping means that the top, edge, or back side of the die is broken, as shown in part A shown in FIG.

The die D, which has been inspected by the inspector, is picked up by the sorting device 50 from the transport tray 30 and placed on the good tray GT or the bad tray BT depending on whether or not it is defective.

However, in the inspection and sorting apparatus of the semiconductor die according to the prior art, since the inspection apparatus 40 and the sorting apparatus 50 of the semiconductor die are provided separately, the die D is picked up from the wafer 10 and the transport tray is provided. The process of being placed on the 30 and the process of the die D picked up from the transport tray 30 are placed on the good tray GT or the defective tray BT are performed separately.

In detail, since the process of placing the die D on the tray is required twice, the process of inspecting and classifying the die D is complicated and requires a lot of time, resulting in low productivity. .

As a result, inspection is performed after the die D picked up from the wafer is placed on the transport tray 30, and the inspected die D is again returned from the transport tray 30 to the good tray GT or the defective tray ( BT), the work is complicated and the working time is long.

In addition, since the inspection device 40 and the classification device 50 of the die is provided separately, it is difficult to achieve the automation of the entire process.

In addition, since the inspection process of the die (D) is placed on the carrying tray 30, the upper surface and the lower surface of the die (D) must be inspected separately, and thus there is a problem in that productivity is lowered. .

The present invention was devised to solve the above problems, and the semiconductor die is picked up from the wafer and inspected, and the inspected die is classified as good or defective and placed on a tray, thereby reducing work time and improving productivity. An object of the present invention is to provide a device for inspecting and classifying a die.

In accordance with an aspect of the present invention, an apparatus for inspecting and classifying a semiconductor die includes: a wafer seating unit configured to mount a wafer on which a plurality of semiconductor dies are aligned and to move the wafer forward, backward, left, and right; A rotating plate provided to rotate intermittently and having a plurality of seating grooves on which the die may be placed; A first pickup part intermittently rotatable between the wafer seating portion and the rotating plate so as to pick up the die aligned on the wafer and place the die on the seating groove of the rotating plate; An inspection camera which photographs a die placed on a seating groove of the rotating plate and transmits the photographed image to a controller; And a second pickup configured to intermittently rotate and pick up a die photographed by the inspection camera and place the same on a good or bad tray.

The wafer seating portion and the rotation plate are disposed to be symmetrical with respect to the rotation center of the first pick-up portion, and the first pick-up portion includes a first suction arm and a second suction arm that are movable up and down, and the first suction arm is movable upward and downward. The suction arm and the second suction arm may be used to place the die picked up on the other side of the rotary plate while the die picked up on one side of the first suction arm or the second suction arm is picked up. To this end, it may be provided symmetrically with respect to the rotation center of the first pickup.

Four mounting grooves are formed in the rotation plate at intervals of 90 degrees with respect to the rotation center of the rotation plate, and the rotation plate may be intermittently rotated by 90 degrees.

The seating groove of the rotatable plate is open at the top and the bottom surface is made of quartz glass, and the inspection camera rotates the upper side of the rotatable plate to photograph the upper surface of the die placed on the seating groove of the rotatable plate. An upper inspection camera provided spaced apart from the plate; And a lower inspection camera provided to be spaced apart from the rotating plate on the lower side of the rotating plate in order to photograph the lower surface of the die placed in the seating groove of the rotating plate.

A vacuum hole for adsorbing the placed die may be formed at one side of the seating groove.

The second pick-up unit includes a third suction arm, a fourth suction arm, a fifth suction arm, and a sixth suction arm, which are movable up and down, wherein the third suction arm, the fourth suction arm, the fifth suction arm, The sixth suction arm includes one of the third suction arm, the fourth suction arm, the fifth suction arm, the sixth suction arm, or the die picked up on the other side of the non-defective tray or the defective tray, while the other side picks up the die. At least one may be provided at intervals of 90 degrees with respect to the rotation center of the second pick-up unit so as to be placed on at least one of them.

Alternatively, the inspection camera, the upper inspection camera provided spaced apart from the rotating plate on the upper side of the rotating plate for photographing the upper surface of the die placed in the seating groove of the rotating plate; And a lower inspection camera provided at one side of the third suction arm, the fourth suction arm, the fifth suction arm, or the sixth suction arm of the second pick-up unit, picked up the die from the rotation plate and rotated 90 degrees. Can be done.

An upper portion of the rotating plate, the air knife for injecting air into the seating groove of the rotating plate may be provided.

The inspection and sorting integration apparatus of the semiconductor die according to the present invention is automated by picking up the semiconductor die from the wafer and inspecting for defects, and classifying the inspected die as good or defective and placing it on a separate tray to automate the entire process. And, the inspection and sorting time of the semiconductor die is shortened, there is an advantage that the productivity is increased. That is, since the die picked up from the wafer is inspected by the inspection camera and then placed on a good or defective tray, the operation is simple and the working time is reduced.

In addition, since the inspection camera inspects the upper surface and the lower surface of the die at the same time, the inspection time is shortened.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in this specification and claims should not be interpreted in a conventional or dictionary sense, and the inventors will appropriately define the concept of terms in order to best explain their invention in the best way possible. Based on the principle that it can be, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various equivalents may be substituted for them at the time of the present application. It should be understood that there may be water and variations.

3 is a perspective view schematically showing an apparatus for inspecting and classifying a semiconductor die according to the present invention, and FIG. 4 is a perspective view schematically showing a semiconductor wafer and a first pick-up unit of the apparatus for inspecting and classifying a semiconductor die according to the present invention. 5 is a front view of a first pick-up unit of the inspection and classification integration device of a semiconductor die according to the present invention, and FIG. 6 is a top view of the first pickup portion of the inspection and classification integration device of a semiconductor die according to the present invention, and FIG. 8 is a side view of a first pick-up section of a semiconductor die inspection and sorting integration apparatus, FIG. 8 is a perspective view showing a rotating plate of the semiconductor die inspection and sorting integration apparatus, and FIG. Figure 10 is a side view showing a rotating plate of the integration device, Figure 10 is a top view showing a rotating plate of the inspection and sorting integration device of the semiconductor die in the present invention, Figure 11 is a foot Fig. 12 is a perspective view showing a rotating plate and an air knife of the semiconductor die inspection and sorting integration device, Fig. 12 is a perspective view showing a cross section taken along line BB of Fig. 11, and Fig. 13 is a testing and sorting integration device for a semiconductor die according to the present invention. 14 is a perspective view showing another embodiment of the lower inspection camera of the inspection and sorting integration device of the semiconductor die in the present invention.

According to the present invention, a device for inspecting and classifying a semiconductor die (D) includes mounting a wafer (W) having a plurality of semiconductor dies (D) arranged in alignment, and allowing the wafer (W) to move forward, backward, left, and right. On the wafer W and the rotating plate 120 provided with a wafer seating portion 110, and intermittently rotated, a plurality of seating grooves 121 on which the die D can be placed. It is intermittently rotatably provided between the wafer seating portion 110 and the rotation plate 120 to pick up the aligned die (D) to be placed in the mounting groove 121 of the rotation plate 120 An inspection camera for photographing the first pick-up unit 130, the die D placed on the seating groove 121 of the rotating plate 120, and transmitting the photographed image to the control unit; Pick up the die (D) photographed by the inspection camera And a second pick-up unit 150 that is placed on the ray GT or the defective tray BT.

The control unit is provided to determine the failure of the die (D) based on the image photographed by the inspection camera, and preferably provided to control the operation of the entire inspection and classification integration device of the semiconductor die.

The wafer seating part 110 is provided with a bracket 111 on which the wafer W is mounted. The wafer seating unit 110 mounts the wafer W through the bracket 111, and the brackets are horizontally moved back, front, left, and right so that each die D on the mounted wafer W is placed on the wafer W. It is provided to be picked up by the first pickup unit 130. That is, the first pick-up unit 130 may rotate, but the first pick-up unit 130 may move horizontally to pick up the die D, and thus the wafer seating unit 110 may not be picked up. Bracket 111 is provided to be moved horizontally.

The wafer seating unit 110 and the rotating plate 120 are disposed to be symmetrical with respect to the rotation center of the first pick-up unit 130, and the first pick-up unit 130 may move up and down first. An arm 131 and a second suction arm 133 are provided, and the first suction arm 131 and the second suction arm 133 are the first suction arm 131 or the second suction arm 133. While the die D arranged on one side of the wafer W is picked up, the other side can place the picked up die D on the seating groove 121 of the rotating plate 120. It is provided symmetrically with respect to the rotation center of the first pickup 130.

In addition, one side of the first pickup 130 is provided with a wafer camera 135 for detecting the position of each die (D) on the wafer (W) to transmit a signal to the controller. That is, the wafer camera 135 of the die (D) on the wafer (W) so that the controller can operate the first pick-up unit 130 to pick up the die (D) from the wafer (W) It is provided to transmit the information on the position and quantity to the control unit.

The first pick-up arm 130 has a first suction arm 131 and a second suction arm 133 formed with a vacuum suction hole for adsorbing the die D, and the first suction arm 131 or The second suction arm 133 is rotatably provided to pick up the die D from the wafer W and to place the picked up die D on the rotating plate 120. Of course, the vacuum suction hole is connected by a pump and a vacuum line to provide a suction force.

Here, when the first suction arm 131 picks up the die D of the wafer W, the picked-up die D of the second suction arm 133 is seated on the rotation plate 120. The first suction arm 131 and the second suction arm 133 are provided in a symmetrical form at 180 degrees with respect to the center of rotation so as to be placed in the groove 121. Of course, since the first pick-up unit 130 is intermittently rotated by 180 degrees, the process of simultaneously picking up and placing as described above may occur repeatedly.

On the other hand, the rotating plate 120, four seating grooves 121 are formed at intervals of 90 degrees with respect to the center of rotation of the rotation plate 120, the rotation plate 120 to rotate intermittently by 90 degrees Is formed.

The mounting groove 121 of the rotating plate 120 has an upper opening so that the die D can be placed thereon, and a bottom surface of the seating groove 121 can observe the lower surface of the placed die D from below. It is preferable that 121a consists of quartz glass which is excellent in the light transmittance.

In this embodiment, four seating grooves 121 are formed in the rotating plate 120 and are formed to rotate intermittently by 90 degrees, but the number and the rotation angle of the seating grooves 121 may be variously modified. Of course. For convenience of description, it is defined as four zones in which the four seating grooves 121 are positioned when the rotation of the rotating plate 120 is stopped.

The first pickup unit 130, the second pickup unit 150, and the inspection camera are disposed in three zones of the four zones of the rotating plate 120, respectively. In the present embodiment, the position where the first pick-up unit 130 is disposed is called a first zone, and a position 90 degrees clockwise from the first zone in a buffer zone and a position 90 degrees clockwise from a buffer zone, that is, an inspection camera. The position where is placed in the third zone, the position of the 90 degrees in the clockwise direction from the third zone, that is, the arrangement position of the second pickup portion 150 is referred to as the fourth zone.

On the upper side of the rotating plate 120, an air knife (AN) for injecting air into the mounting groove 121 of the rotating plate 120 is provided. Preferably, the air knife (AN) is provided above the buffer zone. That is, the discharge port of the air knife (AN) is provided on the upper side of the buffer zone to remove foreign matters that may accumulate in the seating groove 121.

One side surface of the seating groove 121 is formed with a vacuum hole 121b for sucking the placed die (D). Of course, the vacuum hole 121b is connected to the pump providing the suction force by the vacuum line 123. That is, the vacuum line 123 communicates the seating groove 121 and the pump through the vacuum hole 121b.

The second pickup unit 150 includes a third suction arm 151, a fourth suction arm 153, a fifth suction arm 155, and a sixth suction arm 157 that are movable up and down.

The third suction arm 151, the fourth suction arm 153, the fifth suction arm 155, and the sixth suction arm 157 are the third suction arm 151 and the fourth suction arm 153. At least one of the fifth suction arm 155 and the sixth suction arm 157 picks up the photographed die D, and the other side of the die D picks up at least one of the non-defective tray GT or the defective tray. In order to be placed on any one of them, the second pickup unit 150 is provided at intervals of 90 degrees with respect to the rotation center.

The second pick-up unit 150 has a third suction arm 151, a fourth suction arm 153, a fifth suction arm 155, and a sixth suction arm having a vacuum suction hole for adsorbing the die D. The pick-up die 157 picks up the die D from the seating groove 121 of the rotating plate 120 by the inspection camera and rotates the die D by 90 degrees so that the picked-up die is placed on the good tray GT or the defective tray. (D) is provided to be able to place. Of course, the vacuum suction hole is connected to the vacuum line and the vacuum line is connected to the pump.

That is, any one of the third suction arm 151, the fourth suction arm 153, the fifth suction arm 155, or the sixth suction arm 157 of the second pick-up part 150 is the rotary plate ( After picking up the die (D) from 120, the stock tray GT is disposed at a position rotated twice by 90 degrees, that is, rotated 180 degrees, and the defective tray is disposed at a position rotated 90 degrees again. do. Of course, the position of the non-defective tray (GT) and the defective tray may be interchanged.

When the good tray GT and the defective tray are provided in plural, and the die D is placed by the loading capacity of the good tray GT or the defective tray, the trays placed by the loading capacity are automatically collected and packed. It is provided to be. Here, the non-defective tray GT and the defective tray are provided to be separately packed.

The inspection camera is provided to be spaced apart from the rotating plate 120 on the upper side of the rotating plate 120 to photograph the upper surface of the die (D) placed in the seating groove 121 of the rotating plate (120). The upper inspection camera 141 and the lower plate of the rotating plate 120 to photograph the lower surface of the die D placed on the seating groove 121 of the rotating plate 120. The lower inspection camera 143 is provided spaced apart from the 120.

That is, the upper inspection camera and the lower inspection camera 143 are provided to simultaneously inspect the upper surface and the lower surface of the die D located in the third zone. In this case, the lower camera inspects the lower surface of the die D through the quartz glass forming the bottom surface 121a of the seating groove 121.

Alternatively, as shown in FIG. 14, the inspection camera is positioned on the upper side of the rotating plate 120 to photograph the upper surface of the die D placed in the seating groove 121 of the rotating plate 120. The upper inspection camera 141 provided to be spaced apart from the rotating plate 120, the third suction arm 151, the fourth suction arm 153, and the fifth suction arm 155 of the second pickup unit 150. Alternatively, one side of the sixth suction arm 157 may include a lower inspection camera 243 provided at a position rotated by 90 degrees after picking up the die D from the rotation plate 120.

That is, the upper inspection camera 141 first inspects the upper surface of the die D positioned in the third zone, and then the lower inspection camera 243 is a third suction of the second pick-up unit 150. The lower surface of the die D picked up by any one of the arm 151, the fourth suction arm 153, the fifth suction arm 155, or the sixth suction arm 157 is configured to be inspected.

Referring to the operation and effect of the inspection and classification integration device of the semiconductor die according to the present invention configured as described above are as follows.

In the present embodiment, the rotating plate 120, the first pick-up unit 130 and the second pick-up unit 150 may be rotated in a clockwise or counterclockwise direction, the rotational movement in the clockwise direction for convenience of description. Shall be made.

When the wafer W is mounted on the wafer seating unit 110, the wafer camera 135 detects a position of each die D on the wafer W and transmits a signal to the controller. According to the transmitted information, the bracket 111 of the wafer seating unit 110 is moved back, front, left, and right so that each die D of the wafer W is picked up by the first pick-up unit 130. That is, since the first pick-up part 130 is capable of rotating and vertical movement only and cannot be horizontally moved, the bracket 111 of the wafer seating part 110 is moved horizontally so that the first pick-up part 130 is moved. Each of the dies D is moved to the pick-up positions of the first and second suction arms 131 and 133.

Next, the first suction arm 131 of the first pick-up unit 130 picks up the die D of the wafer W, rotates 180 degrees, and then rotates the mounting groove 121 of the rotating plate 120. Place the picked up die D. In this case, since the first suction arm 131 and the second suction arm 133 are formed to be symmetrical by 180 degrees, when the first suction arm 131 is rotated and positioned above the rotating plate 120, the first suction arm 131 and the second suction arm 131 are formed to be symmetrical. The second suction arm 133 is positioned above the wafer (W). When the first suction arm 131 places the die D on the seating groove 121 of the rotating plate 120, the second suction arm 133 is the die D of the wafer W. Pick up. On the other hand, after the first suction arm 131 picks up the die D of the wafer W, the wafer seating part 110 is moved back, front, left, and right to the pickup position of the second suction arm 133. Of course, the die (D) is supplied.

As described above, the first pick-up unit 130 is provided with two suction arms symmetrical with each other by 180 degrees, thereby picking up the die D from the wafer W and rotating the picked die D by the rotating plate 120. There is an advantage that the work time is shortened because the process of placing on the seating groove 121 of the) is performed at the same time.

Next, when the die D is placed in the seating groove 121 of the rotating plate 120 by the first pick-up unit 130, the vacuum hole 121b formed in one side of the seating groove 121. The die (D) is adsorbed to the mounting groove 121 by. That is, since the pump is connected to the vacuum hole 121b through the vacuum line 123, when the pump is operated, the die D is sucked by the suction force of the pump.

After the die D is placed in the seating groove 121 of the rotation plate 120 by the first pickup unit 130, the rotation plate 120 rotates 90 degrees. The die D placed by the first pickup unit 130 is moved from the first zone to the buffer zone. The air knife (AN) provided in the buffer zone has an advantage of increasing inspection accuracy to the inspection camera by spraying air into the seating groove 121 to remove foreign substances that may be present in the seating groove 121. have.

After the rotation plate 120 is rotated 90 degrees again, the die (D) is moved from the buffer zone to the third zone where the inspection camera is disposed. At this time, the upper inspection camera 141 and the lower inspection camera 143 inspects the upper surface and the lower surface of the die (D). In this case, since the bottom 121a of the seating groove 121 is formed of quartz glass having high light transmittance, the inspection accuracy of the lower surface of the die D by the lower inspection camera 143 is increased.

Alternatively, the lower inspection camera may include a third suction arm 151, a fourth suction arm 153, a fifth suction arm 155, and a sixth suction arm 157 of the second pickup unit 150, which will be described below. It may be provided at a position where the rotation of the) stops.

The upper surface and the lower surface of the die D photographed by the inspection camera are transmitted to the controller to determine whether there is a defect.

Thereafter, the rotation plate 120 is rotated by 90 degrees to move the die D to the position to be picked up by the second pickup unit 150. That is, the die D is moved from the third zone where the inspection camera is disposed to the fourth zone where the second pickup unit 150 is disposed.

Next, any one of the third suction arm 151, the fourth suction arm 153, the fifth suction arm 155, or the sixth suction arm 157 of the second pick-up part 150 is the rotating plate. 90 degrees after the pick-up of the die D from the seating groove 121 of 120. Hereinafter, for convenience of explanation, the third suction arm 151 picks up the die D from the seating groove 121 of the rotation plate 120.

That is, the third suction arm 151 picking up the die D from the seating groove 121 of the rotating plate 120 is rotated by 90 degrees. On the other hand, the lower surface of the die (D) can be inspected by the lower inspection camera 243 as provided in the position where the third suction arm 151 is rotated 90 degrees. That is, the lower inspection camera 243 inspects the lower surface of the sucked die D while the third suction arm 151 sucks the upper surface of the die D.

Next, the rotating plate 120 is continuously rotated by 90 degrees to place the die D picked up by the third suction arm 151 on the good or thin tray GT or the bad tray BT. Of course, the controller determines whether the die D is defective based on the information photographed by the upper inspection camera 141 and the lower inspection camera 143 and 243, and sends a control signal to the second pickup unit 150. The die D is classified as good or bad.

That is, when the die D picked up by the third suction arm 151 from the seating groove 121 of the rotating plate 120 is a good die D, the third suction arm 151 is 2 by 90 degrees. Rotates once to place the die D on a good tray GT.

On the other hand, when the die D picked up by the third suction arm 151 from the seating groove 121 of the rotating plate 120 is the defective die D, the third suction arm 151 is rotated by 90 degrees. Rotate three times to place the die D on the defective tray.

If the third suction arm 151 is rotated 90 degrees after picking up the die D from the seating groove 121 of the rotation plate 120, the fourth suction arm 153 is rotated by the rotation plate 120. A new die (D) can be picked up at the upper side of the seating groove (121). Of course, when the second pick-up unit 150 is rotated, the rotating plate 120 is also rotated so that a new die D is continuously supplied.

When the die D is placed as much as the loading capacity of the non-defective tray GT or the defective tray BT, the non-defective tray GT or the defective tray BT that is placed by the loaded capacity may be collected separately. Packed in quantity.

The present invention picks up the die (D) from the wafer (W) as described above, and inspects whether the die (D) is classified as good or bad, separate good tray (GT) or defective tray ( Since it is a method of placing on BT, the pick-up, inspection and sorting on the wafer W may be performed in a continuous process in one device to automate the entire process, and the inspection and sorting time of the die D may be This has the advantage of shortening the productivity.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

1 is a configuration diagram schematically showing the inspection and classification process of a semiconductor die according to the prior art,

2 is a plan view showing an example of a defective die in the inspection apparatus of a semiconductor die according to the prior art,

3 is a perspective view schematically showing an apparatus for inspecting and classifying semiconductor die according to the present invention;

4 is a perspective view schematically showing a semiconductor wafer and a first pickup portion of a semiconductor die inspection and classification integration device according to the present invention;

5 is a front view of a first pickup portion of a semiconductor die inspection and classification integration device according to the present invention;

6 is a top view of the first pickup portion of the semiconductor die inspection and sorting integration apparatus according to the present invention;

7 is a side view of a first pickup portion of the semiconductor die inspection and sorting integration device according to the present invention;

8 is a perspective view showing a rotating plate of the semiconductor die inspection and classification integration device according to the present invention;

9 is a side view showing a rotating plate of the semiconductor die inspection and sorting integration device according to the present invention;

Figure 10 is a top view showing a rotating plate of the inspection and sorting integration device of the semiconductor die in the present invention,

11 is a perspective view showing a rotating plate and an air knife of the semiconductor die inspection and classification integration device according to the present invention;

12 is a perspective view illustrating a cross section taken along line B-B of FIG. 11;

FIG. 13 is a bottom view showing a seating groove of a device for inspecting and classifying a semiconductor die according to the present invention; FIG.

14 is a perspective view showing another embodiment of the lower inspection camera of the inspection and sorting integration apparatus of the semiconductor die in the present invention.

<Explanation of symbols on main parts of the drawings>

110: wafer mounting portion 111: bracket

120: rotating plate 121: seating groove

121a: Bottom 121b: Vacuum hole

123: vacuum line 125: wafer camera

130: first pick-up unit 131: first suction arm

133: second suction arm 141: upper inspection camera

143 and 243: lower inspection camera 150: second pickup

151: third suction arm 153: fourth suction arm

155: fifth suction arm 157: sixth suction arm

W: Wafer D: Die

GT: Good quality tray BT: Bad quality tray

Claims (8)

A wafer seating portion in which a plurality of semiconductor dies are arranged to be mounted, wherein the wafer is mounted to be movable back, front, left, and right; A rotating plate provided to rotate intermittently and having a plurality of seating grooves on which the die may be placed;  A first pickup part intermittently rotatable between the wafer seating portion and the rotating plate so as to pick up the die aligned on the wafer and place the die on the seating groove of the rotating plate; An inspection camera which photographs a die placed on a seating groove of the rotating plate and transmits the photographed image to a controller; And And a second pick-up unit provided to rotate intermittently and picking up the die photographed by the inspection camera and placing the picked die on a good or defective tray. The method according to claim 1, The wafer seating portion and the rotation plate are arranged to be symmetrical with respect to the rotation center of the first pickup portion, The first pick-up unit is provided with a first suction arm and a second suction arm that are movable up and down, The first suction arm and the second suction arm, The center of rotation of the first pick-up part so that one side of the first suction arm or the second suction arm picks up the die picked up on the seating groove of the rotating plate while the die aligned on the wafer is picked up. Inspection and classification integrated device of the semiconductor die, characterized in that provided symmetrically based on. The method according to claim 1, The rotating plate, Four seating grooves are formed at intervals of 90 degrees with respect to the rotation center of the rotating plate, And the rotating plate is intermittently rotated by 90 degrees. The method according to claim 1, The seating groove of the rotatable plate is open at the top and the bottom is made of quartz glass, The inspection camera, An upper inspection camera provided on the upper side of the rotating plate to be spaced apart from the rotating plate in order to photograph the upper surface of the die placed in the seating groove of the rotating plate; And  And a lower inspection camera spaced apart from the rotating plate on the lower side of the rotating plate to photograph the lower surface of the die placed in the seating groove of the rotating plate. The method according to claim 4, And a vacuum hole for adsorbing the placed die is formed at one side of the seating groove. The method according to claim 1, In the second pickup unit, A third suction arm, a fourth suction arm, a fifth suction arm and a sixth suction arm, which are movable up and down, are provided. The third suction arm, the fourth suction arm, the fifth suction arm and the sixth suction arm, While one side of the third suction arm, the fourth suction arm, the fifth suction arm, or the sixth suction arm picks up the photographed die, the die picked up on the other side is placed on at least one of the good quality tray or the defective tray. Inspecting and sorting integration device for a semiconductor die, characterized in that provided at intervals of 90 degrees with respect to the center of rotation of the second pickup portion to be raced. The method according to claim 6, The inspection camera, An upper inspection camera provided on the upper side of the rotating plate to be spaced apart from the rotating plate in order to photograph the upper surface of the die placed in the seating groove of the rotating plate; And One side of the third suction arm, the fourth suction arm, the fifth suction arm, or the sixth suction arm of the second pick-up portion includes a lower inspection camera provided at a position rotated 90 degrees after picking up the die from the rotation plate. An inspection and classification integration device for semiconductor dies, characterized in that the. The method according to claim 1, On the upper side of the rotating plate, And an air knife for injecting air into the seating groove of the rotatable plate.

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