CN116544175B - Compatible clamping and wafer sweeping mechanism for multiple wafers - Google Patents
Compatible clamping and wafer sweeping mechanism for multiple wafers Download PDFInfo
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- CN116544175B CN116544175B CN202310828634.5A CN202310828634A CN116544175B CN 116544175 B CN116544175 B CN 116544175B CN 202310828634 A CN202310828634 A CN 202310828634A CN 116544175 B CN116544175 B CN 116544175B
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 128
- 230000007246 mechanism Effects 0.000 title claims abstract description 82
- 238000010408 sweeping Methods 0.000 title claims abstract description 44
- 230000000712 assembly Effects 0.000 claims description 16
- 238000000429 assembly Methods 0.000 claims description 16
- 210000000078 claw Anatomy 0.000 claims description 15
- 101000623895 Bos taurus Mucin-15 Proteins 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 claims 1
- 230000008520 organization Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 abstract 4
- 230000033001 locomotion Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of semiconductor manufacturing processes, and particularly relates to a clamping and wafer sweeping mechanism compatible with various wafers. The wafer cleaning device comprises a supporting frame, a wafer cleaning mechanism, a sucker lifting mechanism and a centering clamping mechanism, wherein the wafer cleaning mechanism is arranged on the supporting frame and used for cleaning wafers; the sucker lifting mechanism is used for sucking the wafer and can adjust the height position of the wafer; the centering clamping mechanism is used for centering and clamping the wafer on the sucker lifting mechanism. The centering clamping mechanism can realize centering clamping of wafers with various specifications and sizes, and has the advantages of simple structure and low production cost; meanwhile, the wafer sweeping mechanism moves independently, so that different wafers can be swept, the working efficiency is improved, and the production cost is reduced.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing processes, and particularly relates to a clamping and wafer sweeping mechanism compatible with various wafers.
Background
In the chip manufacturing process, various wafers are often used simultaneously due to different processing techniques. Different wafer external dimensions are different, but centering is needed, so that multiple centering clamping mechanisms are needed to exist in the same equipment at the same time, each middle clamping mechanism can only be applied to a certain fixed dimension, and if the processed wafer needs to be replaced, the corresponding clamping mechanism needs to be replaced, which definitely increases the production cost. Meanwhile, the heights of wafer boxes with different sizes are also different, so that the wafer sweeping mechanism is independent to be linked with the wafer box unit to ensure the wafer sweeping efficiency of the robot, but the wafer sweeping efficiency is low because the number of wafers in a plurality of wafer boxes cannot be detected in one movement. In sum, the existing wafer clamping and sweeping mechanism has single function, can not cope with the production of different wafers, and has low production efficiency and high cost.
Disclosure of Invention
The invention aims to provide a clamping and wafer sweeping mechanism compatible with various wafers, so as to solve the problems that the existing wafer clamping and wafer sweeping mechanism is single in function and poor in adaptability, and cannot cope with the production of different wafers.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the invention provides a compatible clamping and wafer sweeping mechanism for various wafers, which comprises the following steps:
a support frame;
the wafer scanning mechanism is arranged on the supporting frame and used for scanning and counting wafers;
the sucker lifting mechanism is arranged on the supporting frame and used for adsorbing the wafer and adjusting the height position of the wafer;
and the centering clamping mechanism is arranged on the supporting frame and used for centering and clamping the wafer on the sucker lifting mechanism.
In one possible implementation manner, the blade sweeping mechanism comprises an adjusting bracket, a moving bracket, a blade sweeping sensor and a lifting driving component I, wherein the lifting driving component I is arranged on a supporting frame and outputs power in the vertical direction; the motion support is connected with the output of lift drive component I, and the top of motion support sets up an at least regulation support, and the installation angle of adjusting the support is adjustable, sets up on the regulation support and sweeps the piece sensor.
In one possible implementation manner, the moving support comprises a movable seat, a positioning guide rail and an adjusting frame, wherein the movable seat is connected with the output end of the lifting driving component I, the top of the movable seat is provided with the positioning guide rail, the bottom of the adjusting frame is connected with the positioning guide rail through a sliding groove, and the top of the adjusting frame is provided with an angle adjusting structure for installing the adjusting support.
In one possible implementation, the angle adjusting structure comprises a positioning hole and an adjusting groove, wherein the positioning hole is in positioning connection with the adjusting bracket through a positioning pin, and the adjusting bracket can rotate around the positioning pin; the adjusting groove is an arc groove taking the positioning hole as the center of a circle, and the adjusting bracket is fixedly connected with the adjusting frame through a locking screw rod accommodated in the arc groove.
In one possible implementation, the lifting driving component i includes an electric cylinder i and a fixing frame, wherein the fixing frame is connected with the bottom of the supporting frame, the electric cylinder i is disposed on the fixing frame, and the output end is connected with the moving bracket.
In one possible implementation, the centering clamping mechanism comprises a centering driving component and two groups of jaw assemblies connected with the centering driving component, and the centering driving component drives the two groups of jaw assemblies to be close to or far away from each other, so that clamping or releasing of the wafers by the two groups of jaw assemblies is realized.
In one possible implementation, the jaw assembly includes a plurality of centering jaws sequentially connected from bottom to top, and lengths of the plurality of centering jaws sequentially decrease from bottom to top.
In one possible implementation manner, the installation position between two adjacent centering claws can be adjusted, the working end of the centering claw is provided with a V-shaped opening, and two sides of the V-shaped opening are provided with positioning rollers.
In one possible implementation manner, the sucker lifting mechanism comprises a lifting driving component II, a lifting plate and a sucker, wherein the lifting driving component II is arranged on the supporting frame and outputs power in the vertical direction; the lifting plate is horizontally arranged and connected with the output end of the lifting driving component II, and the sucker is arranged on the lifting plate and positioned between the two groups of claw assemblies; the sucker is used for sucking the wafer.
In one possible implementation manner, the supporting frame comprises a top plate and a centering bottom plate which are arranged up and down, and the top plate is connected with the centering bottom plate through a supporting rod; the sucker lifting mechanism, the centering clamping mechanism and the sheet sweeping mechanism are all arranged on the centering bottom plate.
The invention has the advantages and beneficial effects that: the wafer compatible clamping and sweeping mechanism provided by the invention can realize the centering clamping of wafers with various specifications and sizes through one centering clamping mechanism, and has the advantages of simple structure and low production cost; meanwhile, the wafer sweeping mechanism can sweep wafers of different wafers, improves working efficiency and reduces production cost.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of a multiple wafer compatible clamping and wafer sweeping mechanism according to the present invention;
FIG. 2 is a schematic view of the structure of the sweeping sheet mechanism in the invention;
FIG. 3 is an exploded view of the sweep mechanism of the present invention;
FIG. 4 is a schematic view of a clamping mechanism according to the present invention;
fig. 5 is an exploded view of the clamping mechanism of the present invention.
In the figure: the device comprises a 1-adjusting bracket, a 101-positioning hole, a 102-adjusting groove, a 2-electric cylinder I, a 3-moving bracket, a 301-movable seat, a 302-positioning guide rail, a 303-adjusting frame, a 4-sweeping sensor, a 5-centering base plate, a 6-centering clamping mechanism, a 601-claw cylinder, a 602-claw connecting block, a 603-centering claw I, a 604-centering claw II, a 605-centering claw III, a 606-positioning protrusion I, a 607-positioning groove, a 608-positioning protrusion II, a 609-positioning roller, a 7-sucker lifting mechanism, a 701-electric cylinder II, a 702-lifting plate, a 703-sucker, an 8-box, a 9-fixing frame, a 10-vacuum gauge, a 11-electromagnetic valve, a 12-supporting rod, a 13-top plate and a 14-wiring drag chain.
Detailed Description
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
The embodiment of the invention provides a clamping and wafer sweeping mechanism compatible with various wafers, which can finish centering clamping of wafers with various specifications and sizes and wafer sweeping of different wafers, realize the clamping and wafer sweeping compatible with various wafers, improve the working efficiency and reduce the production cost. Referring to fig. 1, the multiple wafer compatible clamping and wafer sweeping mechanisms comprise a supporting frame, a wafer sweeping mechanism, a sucker lifting mechanism 7 and a centering clamping mechanism 6, wherein the wafer sweeping mechanism is arranged on the supporting frame and is used for counting wafers; the sucker lifting mechanism 7 is used for sucking a wafer and can adjust the height position of the wafer; the centering clamping mechanism 6 is used for centering and clamping the wafer on the sucker lifting mechanism 7.
Referring to fig. 1, in the embodiment of the present invention, the supporting frame includes a top plate 13 and a centering bottom plate 5 disposed up and down, and the top plate 13 and the centering bottom plate 5 are connected by a supporting rod 12; the sucker lifting mechanism 7, the centering clamping mechanism 6 and the sheet sweeping mechanism are arranged on the centering bottom plate 5, and enough wafer taking and placing space is reserved between the top plate 13 and the centering bottom plate 5. The wafer box 8 is placed on the top plate 13, and the wafer sweeping mechanism is used for counting wafers in the wafer box 8.
Referring to fig. 2, in the embodiment of the present invention, the blade sweeping mechanism includes an adjusting bracket 1, a moving bracket 3, a blade sweeping sensor 4, and a lifting driving part i, wherein the lifting driving part i is disposed on a centering base plate 5 of the supporting frame and outputs power in a vertical direction; the motion support 3 is connected with the output of lift drive component I, and the top of motion support 3 sets up at least one and adjusts support 1, adjusts and sets up on the support 1 and sweeps a sensor 4. Further, the installation angle of the adjusting bracket 1 can be adjusted so as to adjust the angle of the sweeping piece sensor 4, thereby realizing accurate sweeping piece. In this embodiment, two adjusting brackets 1 and two sweep sensors 4 are disposed on top of the moving bracket 3, and the two sweep sensors 4 count wafers in two cassettes 8 respectively.
In the embodiment of the invention, the lifting driving component I comprises an electric cylinder I2 and a fixing frame 9, wherein the fixing frame 9 is arranged below the supporting frame and is connected with the centering bottom plate 5 of the supporting frame, the electric cylinder I2 is vertically arranged on the fixing frame 9, and the output end of the electric cylinder I2 is connected with the moving bracket 3. When the device works, the electric cylinder I2 drives the moving support 3 and the upper scanning sheet sensor 4 to move up and down, so that the sheet scanning work is completed.
Further, a wire drag chain 14 is fixed on the fixing frame 9, and a cable connected with the scanning sensor 4 is arranged in the wire drag chain 14 to prevent the wire winding phenomenon.
Referring to fig. 3, in the embodiment of the present invention, the moving bracket 3 includes a movable seat 301, a positioning rail 302 and an adjusting frame 303, wherein the movable seat 301 is connected with the output end of the electric cylinder i 2, the top of the movable seat 301 is provided with the positioning rail 302, the positioning rail 302 is arranged along the direction approaching or separating from the cassette 8 placed on the top plate 13, the bottom of the adjusting frame 303 is connected with the positioning rail 302 through a chute, the front and rear positions of the sweep sensor 4 are adjusted by sliding the adjusting frame 303 relative to the positioning rail 302, and the adjusting frame 303 and the movable seat 301 are fixed by bolts after the position of the sweep sensor 4 is adjusted.
Further, the top of the adjustment frame 303 is provided with an angle adjustment structure for mounting the adjustment bracket 1, and the mounting position of the adjustment bracket 1 is adjusted by the angle adjustment structure, so that the position of the sweep sensor 4 on the adjustment bracket 1 is adjusted so as to correspond to the cartridge 8.
In the embodiment of the invention, the adjusting frame 303 is a square frame structure which is vertically arranged, the bottom of the adjusting frame 303 is provided with a chute which is in sliding fit with the positioning guide rail 302, and the top of the adjusting frame 303 is provided with two groups of angle adjusting structures so as to be convenient for installing two adjusting brackets 1.
Specifically, the angle adjusting structure comprises a positioning hole 101 and an adjusting groove 102 which are arranged at the top of an adjusting frame 303, wherein the adjusting groove 102 is an arc groove taking the positioning hole 101 as a circle center, the positioning hole 101 is in positioning connection with an adjusting bracket 1 through a positioning pin, and the adjusting bracket 1 can rotate around the positioning pin; the adjusting bracket 1 is fixedly connected with the adjusting frame 303 through a locking screw rod accommodated in the circular arc groove. When the angle of the sweep blade sensor 4 needs to be adjusted, the locking screw is firstly loosened, the adjusting bracket 1 is then rotated, the sweep blade sensor 4 is rotated to a proper angle, and finally the locking screw is screwed down, so that the adjusting bracket 1 is locked, and the sweep blade sensor 4 is fixed.
In this embodiment, the sweep mechanism adjusts the horizontal position of the sweep sensor 4 by adjusting the front and rear positions of the adjusting frame 303 and adjusting the angle of the adjusting bracket 1, thereby realizing accurate counting in the sweep process.
Referring to fig. 4, in the embodiment of the present invention, the centering and clamping mechanism 6 includes a centering driving member and two groups of jaw assemblies connected to the centering driving member, and the centering driving member drives the two groups of jaw assemblies toward or away from each other, so as to clamp or release the wafers by the two groups of jaw assemblies.
In this embodiment, the centering driving component includes a jaw cylinder 601 and two jaw connection blocks 602 connected to the jaw cylinder 601, the jaw cylinder 601 drives the two jaw connection blocks 602 to approach or separate from each other, and the two groups of jaw assemblies are respectively disposed on the two jaw connection blocks 602.
Referring to fig. 5, in an embodiment of the present invention, the jaw assembly includes a plurality of centering jaws sequentially connected from bottom to top, and lengths of the plurality of centering jaws sequentially decrease from bottom to top. That is, the diameters of the wafers clamped by the centering claws from bottom to top are sequentially increased.
Further, the mounting position between two adjacent centering jaws can be adjusted to accommodate wafers of different diameters. Specifically, the work end of centering jack catch is equipped with V type opening, and V type open-ended both sides all are equipped with positioning roller 609, through positioning roller 609 and wafer contact, avoid damaging the wafer in centre gripping centering in-process.
In this embodiment, the jack catch subassembly includes three centering jack catch, from bottom to top is centering jack catch I603, centering jack catch II 604 and centering jack catch III 605 in proper order, and wherein centering jack catch I603 is connected with jack catch connecting block 602, and the top rear end of centering jack catch I603 is equipped with location arch I606 along jack catch direction that opens and shuts, and the bottom rear end of centering jack catch III 605 is equipped with location arch II 608 along jack catch direction that opens and shuts. The top and bottom rear ends of the centering claw II 604 are respectively provided with a positioning groove 607, the centering claw II 604 is in positioning connection with the positioning protrusion I606 and the positioning protrusion II 608 through the positioning grooves 607, and the three centering claws are fixed together through bolts. The centering clamping jaw I603, the centering clamping jaw II 604 and the centering clamping jaw III 605 respectively correspond to wafers with different diameters, so that the wafers with various specifications and sizes can be clamped through the centering clamping mechanism 6, and the adaptability is improved. In this embodiment, three centering jack catch dismantles simple to operate, and assembly accuracy is high to improve centre gripping centering's precision.
Further, a vacuum gauge 10 and a solenoid valve 11 are arranged on the middle base plate 5, and an air pipeline connected with the jaw cylinder 601 is connected with the vacuum gauge 10 and the solenoid valve 11.
Referring to fig. 4, in the embodiment of the present invention, the suction cup lifting mechanism 7 includes a lifting driving part ii, a lifting plate 702 and a suction cup 703, wherein the lifting driving part ii is disposed on the centering base plate 5 of the support frame and outputs power in a vertical direction; the lifting plate 702 is horizontally arranged and connected with the output end of the lifting driving component II, and the sucker 703 is arranged on the lifting plate 702 and is positioned between the two groups of claw assemblies; the suction cup 703 is used for sucking and carrying a wafer, and the lifting driving component II is used for driving the suction cup 703 and the wafer thereon to move up and down between the two groups of jaw assemblies so as to adjust the height position of the wafer between the two groups of jaw assemblies.
In this embodiment, the lifting driving part ii includes an electric cylinder ii 701, the electric cylinder ii 701 is vertically disposed on the centering base plate 5, and the output end is connected with the lifting plate 702. The cylinder II 701 drives the suction cup 703 to lift, so that the suction cup 703 moves to the height of the clamping jaw corresponding to the wafer. Specifically, the lift driving member i and the lift driving member ii may be any other mechanism capable of achieving the lift function, and are not particularly limited herein.
The embodiment of the invention provides a compatible clamping and wafer sweeping mechanism for various wafers, which has the following working principle:
when the wafer box is placed on the rear top plate 13, the adjusting bracket 1 is manually rotated to adjust, so that the wafer scanning sensor 4 corresponds to the wafer of the wafer box, and the adjusting bracket 1 is locked; then, the electric cylinder I2 drives the moving bracket 3 to move up and down, and the sweep sensor 4 starts to sweep the sheet. After the wafer sweeping sensor 4 finishes the wafer sweeping, the wafer is transmitted to the centering clamping unit by the robot. The robot first places the wafer on the chuck 703, and the chuck 703 adsorbs the carrier wafer. The customer can freely select what kind of claw is used for clamping, and when the claw is selected, the electric cylinder II 701 drives the suction cup 703 to lift, so that the suction cup 703 stops at the corresponding claw height. At this time, the jaw cylinder 601 drives the two groups of jaw assemblies to start to close toward the center, and finally clamping centering of the wafer is completed. The working efficiency of the robot is enhanced by the aid of the sleeve structure, the robot can be omitted when the wafer is scanned, the wafer can be transported by using the wafer scanning time as a process unit, and the sucking disc 703 is driven to lift by the electric cylinder II 701, so that the requirement that a plurality of wafers are used by a customer at the same time is met.
According to the compatible clamping and wafer sweeping mechanism for various wafers, provided by the invention, the centering clamping of wafers with various specifications and sizes can be realized through one centering clamping mechanism, the adaptability of the centering clamping mechanism is improved, and the replacement cost is reduced; meanwhile, the wafer scanning mechanism completes statistics of the number of wafers in the plurality of wafer boxes in one movement, so that the wafer scanning efficiency is improved, and the production cost is reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (8)
1. A kind of compatible centre gripping of multiple wafer and sweep the piece organization, characterized by, include:
a support frame;
the wafer scanning mechanism is arranged on the supporting frame and used for scanning and counting wafers;
the sucker lifting mechanism (7) is arranged on the supporting frame and used for adsorbing the wafer and adjusting the height position of the wafer;
the centering clamping mechanism (6) is arranged on the supporting frame and used for centering and clamping the wafer on the sucker lifting mechanism (7);
the scanning mechanism comprises an adjusting bracket (1), a moving bracket (3), a scanning sensor (4) and a lifting driving component I, wherein the lifting driving component I is arranged on a supporting frame and outputs power in the vertical direction; the moving support (3) is connected with the output end of the lifting driving component I, at least one adjusting support (1) is arranged at the top of the moving support (3), the installation angle of the adjusting support (1) is adjustable, and a scanning sensor (4) is arranged on the adjusting support (1);
the movable support (3) comprises a movable seat (301), a positioning guide rail (302) and an adjusting frame (303), wherein the movable seat (301) is connected with the output end of the lifting driving component I, the top of the movable seat (301) is provided with the positioning guide rail (302), the bottom of the adjusting frame (303) is connected with the positioning guide rail (302) through a sliding groove, and the top of the adjusting frame (303) is provided with an angle adjusting structure for installing the adjusting support (1).
2. The multiple wafer compatible clamping and wafer sweeping mechanism according to claim 1, wherein the angle adjusting structure comprises a positioning hole (101) and an adjusting groove (102), wherein the positioning hole (101) is in positioning connection with the adjusting bracket (1) through a positioning pin, and the adjusting bracket (1) can rotate around the positioning pin; the adjusting groove (102) is an arc groove taking the positioning hole (101) as a circle center, and the adjusting bracket (1) is fixedly connected with the adjusting frame (303) through a locking screw rod accommodated in the arc groove.
3. The multiple wafer compatible clamping and wafer sweeping mechanism according to claim 1, wherein the lifting driving component I comprises an electric cylinder I (2) and a fixing frame (9), wherein the fixing frame (9) is connected with the bottom of the supporting frame, the electric cylinder I (2) is arranged on the fixing frame (9), and the output end of the electric cylinder I is connected with the moving support (3).
4. The multiple wafer compatible clamping and wafer sweeping mechanism of claim 1 wherein the centering clamping mechanism (6) comprises a centering drive member and two sets of jaw assemblies connected to the centering drive member, the centering drive member driving the two sets of jaw assemblies toward or away from each other to effect clamping or release of a wafer by the two sets of jaw assemblies.
5. The multiple wafer compatible clamping and wafer sweeping mechanism of claim 4, wherein the jaw assembly comprises a plurality of centering jaws connected in sequence from bottom to top, the lengths of the plurality of centering jaws decreasing in sequence from bottom to top.
6. The multiple wafer compatible clamping and wafer sweeping mechanism according to claim 5, wherein the mounting position between two adjacent centering jaws can be adjusted, the working end of each centering jaw is provided with a V-shaped opening, and positioning rollers (609) are arranged on two sides of each V-shaped opening.
7. The multiple wafer compatible clamping and wafer sweeping mechanism according to claim 4, wherein the suction cup lifting mechanism (7) comprises a lifting driving component ii, a lifting plate (702) and a suction cup (703), wherein the lifting driving component ii is arranged on the supporting frame and outputs power in a vertical direction; the lifting plate (702) is horizontally arranged and connected with the output end of the lifting driving component II, and the sucker (703) is arranged on the lifting plate (702) and is positioned between the two groups of claw assemblies; the suction cup (703) is used for sucking the wafer.
8. The multiple wafer compatible clamping and wafer sweeping mechanism according to claim 1, wherein the supporting frame comprises a top plate (13) and a centering bottom plate (5) which are arranged up and down, and the top plate (13) and the centering bottom plate (5) are connected through a supporting rod (12); the sucker lifting mechanism (7), the centering clamping mechanism (6) and the sheet sweeping mechanism are all arranged on the centering bottom plate (5).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310828634.5A CN116544175B (en) | 2023-07-07 | 2023-07-07 | Compatible clamping and wafer sweeping mechanism for multiple wafers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310828634.5A CN116544175B (en) | 2023-07-07 | 2023-07-07 | Compatible clamping and wafer sweeping mechanism for multiple wafers |
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| CN116544175A CN116544175A (en) | 2023-08-04 |
| CN116544175B true CN116544175B (en) | 2023-09-12 |
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| CN117293073B (en) * | 2023-09-22 | 2024-05-07 | 上海图双精密装备有限公司 | Multi-size wafer transmission detection device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| CN109434719A (en) * | 2018-12-26 | 2019-03-08 | 沈阳芯达科技有限公司 | A kind of more wafer size rotation clamping devices |
| CN210129497U (en) * | 2019-09-25 | 2020-03-06 | 沈阳芯达半导体设备有限公司 | Automatic wafer conveying mechanism for semiconductor industry |
| CN210897231U (en) * | 2019-12-31 | 2020-06-30 | 无锡光诺自动化科技有限公司 | Wafer aligning device |
| CN211088237U (en) * | 2020-01-09 | 2020-07-24 | 深圳市新顺鑫科技有限公司 | Multi-size wafer centering device |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN113972158A (en) * | 2021-10-26 | 2022-01-25 | 上海广川科技有限公司 | Wafer transmission system |
| CN116053186A (en) * | 2023-02-21 | 2023-05-02 | 苏州德龙激光股份有限公司 | Compatible wafer carrying platform device |
-
2023
- 2023-07-07 CN CN202310828634.5A patent/CN116544175B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| CN109434719A (en) * | 2018-12-26 | 2019-03-08 | 沈阳芯达科技有限公司 | A kind of more wafer size rotation clamping devices |
| CN210129497U (en) * | 2019-09-25 | 2020-03-06 | 沈阳芯达半导体设备有限公司 | Automatic wafer conveying mechanism for semiconductor industry |
| CN210897231U (en) * | 2019-12-31 | 2020-06-30 | 无锡光诺自动化科技有限公司 | Wafer aligning device |
| CN211088237U (en) * | 2020-01-09 | 2020-07-24 | 深圳市新顺鑫科技有限公司 | Multi-size wafer centering device |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN113972158A (en) * | 2021-10-26 | 2022-01-25 | 上海广川科技有限公司 | Wafer transmission system |
| CN116053186A (en) * | 2023-02-21 | 2023-05-02 | 苏州德龙激光股份有限公司 | Compatible wafer carrying platform device |
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