WO2024021226A1

WO2024021226A1 - Fully automatic soa-containing eml chip testing machine and testing method

Info

Publication number: WO2024021226A1
Application number: PCT/CN2022/117275
Authority: WO
Inventors: 张智峰; 牛超凡; 杜海洋; 赵莉娜; 梁书尧
Original assignee: 河北圣昊光电科技有限公司
Priority date: 2022-07-29
Filing date: 2022-09-06
Publication date: 2024-02-01
Also published as: CN115184777B; CN115184777A

Abstract

A fully automatic SOA-containing EML chip testing machine and a testing method. The fully automatic SOA-containing EML chip testing machine comprises a main body structure, an automatic supply device, a testing device, and a storage device which are sequentially arranged in the conveying direction of chips (64). The testing device comprises: a bottom plate (3); a testing platform; a first angle detection mechanism; and a second angle detection mechanism. During testing of the chips (64), it is only necessary to move the chips (64) on the automatic supply device to the testing device by means of a driving device, then the chips (64) can be quickly aligned and tested by means of cooperation of the first angle detection mechanism and the second angle detection mechanism, and the tested chips (64) are finally moved to the storage device by means of the driving device, so as to achieve the testing of the processed chips (64), thereby improving the testing efficiency.

Description

A fully automatic testing machine and testing method for EML chips containing SOA

Cross-references to related applications

This application requires the priority of the Chinese patent application submitted to the China Patent Office on July 29, 2022, with the application number 202210908613. The entire contents are incorporated herein by reference.

Technical field

This application relates to the field of wafer production technology, and specifically to a fully automatic testing machine and testing method for EML chips containing SOA.

Background technique

In the production process of EML chips containing SOA, the cleavage machine uses cleavage technology to split the wafer (Chinese name: wafer) into Bar bars, or split a single Bar bar into chips (Chinese name: wafer). chip). Specifically, a Bar bar can be viewed as a single bar formed by multiple chips side by side, called a Bar. (The EML chip containing SOA is referred to as a chip for short.) Among them, SOA is a semiconductor optical amplifier, and EML is an electroabsorption modulated laser.

The cleavage machine is mainly used to cleave Bar bars, while the chip testing machine is used to test the performance of individual chips arranged on the Bar bar before cleavage. Usually the luminous strips on traditional Bar bars run vertically through the front and rear ends of the chip. With the emergence of current high-speed/high-power chips, special chips with oblique angle optical waveguides have emerged (for example: turning optical waveguide chips with SOA amplification function). The angle of the optical signal emitted from both ends of the light strip will change. Changes have occurred (the backlight end is still a vertical optical waveguide, while the front light end is designed as an optical waveguide with a fixed angle). According to the different angles of the optical signal, the optical signal is often divided into linear and oblique types.

During the test, the probe on the test platform is powered on and connected to the bar bar to be tested. The two ends of the light bar emit light signals, which are then transmitted through the optical fiber (receiving light signals) or PD (receiving light signals) on the angle adjustment device. The optical signal is converted into an electrical signal) to receive the optical signal and determine whether it meets the standard based on the optical signal.

In the prior art, the receiver is adjustable and arranged at the front end of the bar to be tested through an angle adjustment device. During the test process, the receiver is adjusted repeatedly through the angle adjustment device according to whether the optical signal is linear or diagonal, ( Because changes in the position of the receiver and the position of the optical fiber will affect the test results. Therefore, whenever the position of the receiving device changes, a standard chip must be used for comparison. This comparison needs to be based on the results of the standard Yang comparison and needs to be repeated. While adjusting the position, test and compare the test data to ensure that the optical power data and spectral test curve are consistent with the data of the original standard sample. Because it requires repeated adjustments and test comparisons, it takes a lot of time). The steps when detecting optical signals are cumbersome and complicated, and the detection efficiency is low.

Contents of the invention

Therefore, the technical problem to be solved by this application is to overcome the cumbersome and complicated steps and low detection efficiency of optical signal detection in the prior art, thereby providing a fully automatic EML chip testing machine and testing method containing SOA.

A fully automatic testing machine for EML chips containing SOA, including a main structure, an automatic supply device, a testing device and a storage device sequentially arranged along the chip transmission direction;

The main structure is located on the workbench. The main structure includes a bracket and a slide rail slidingly connected to the bracket;

The test device includes:

The bottom plate is slidably set on the workbench;

A test platform is provided on one side of the base plate;

A first angle detection mechanism is provided on the bottom plate; the first angle detection mechanism includes a first base and a first receiving component; the first receiving component is provided on the first base through a first sliding component;

A second angle detection mechanism is provided on the bottom plate; the second angle detection mechanism includes a second base and a second receiving component; the second receiving component slides and rotates through a second sliding component and an angle adjustment component. on the second base.

As a preferred solution, the angle adjustment component includes:

An angle block assembly is provided on the second sliding assembly and includes at least a first angle block and a second angle block. The first angle block has a first inclined surface and the second angle block has a second inclined surface. The inclination angles of the first bevel and the second bevel are different;

A rotating block, which is rotated on the second sliding component. The rotating block includes a receiving surface and an adjusting surface located on opposite sides, and a receiver with an axis perpendicular to the receiving surface. The adjusting surface is suitable for Fitted with the first inclined surface of the first angle block or the second inclined surface of the second angle block to receive the force exerted by the first angle block or the second angle block to drive the rotating block to rotate and change the The angle of the receiving surface is such that the second receiving component receives the optical signal.

As a preferred solution, the automatic supply device includes:

A load-bearing mechanism has a load-bearing area for placing the Bar bar to be tested, the load-bearing area is made of transparent material, and the load-bearing mechanism is connected to a first driving mechanism;

The ejection mechanism is located below the load-bearing mechanism and includes a base body and an ejection pin located in the center of the base body. The end face of the base body facing the load-bearing mechanism is provided with a plurality of passages for adsorbing the load-bearing area. hole, the base body is connected to an air extraction mechanism, and the ejector pin is connected to a second driving mechanism;

The first adsorption mechanism and the positioning and alignment mechanism are arranged above the carrying mechanism in sequence, and the centers of the positioning and aligning mechanism, the first adsorbing mechanism, and the chip to be tested and the ejector pin on the carrying area of the carrying mechanism coincide with each other.

As a preferred solution, a Bar bar to be detected is placed on the test platform, as well as a probe structure corresponding to the Bar bar to be detected.

As a preferred solution, the storage device includes multiple holding structures.

As a preferred solution, the first sliding component includes:

A first height adjustment seat, a first height adjustment member is provided on the first height adjustment seat;

A first horizontal adjustment plate, the first horizontal adjustment plate is provided with a first horizontal adjustment member;

A second horizontal adjustment plate is provided with a second horizontal adjustment member, and the axis of the second horizontal adjustment member is perpendicular to the axis of the first horizontal adjustment member.

As a preferred solution, the second sliding component includes:

a second height adjustment seat, with a second height adjustment member provided on the second height adjustment seat;

a third horizontal adjustment plate, the third horizontal adjustment plate is provided with a third horizontal adjustment member;

A fourth horizontal adjustment plate is provided with a fourth horizontal adjustment member, and the axis of the fourth horizontal adjustment member is perpendicular to the axis of the third horizontal adjustment member.

As a preferred solution, the first receiving component includes a first fixed PD receiver and a first fixed fiber optic receiver; the first fixed PD receiver and the first fixed fiber optic receiver are respectively arranged on the first side through a first sliding component. on the base.

The second receiving component includes a second fixed PD receiver and a second fixed optical fiber receiver; the second fixed PD receiver and the second fixed optical fiber receiver are respectively arranged on the second base through a second sliding component.

As a preferred solution, the angle adjustment component includes:

Swing structure, the swing structure includes a first swing adjustment seat and a second swing adjustment seat. The first swing adjustment seat is provided with an arc guide rail or a guide groove, and the second swing adjustment seat is provided with a guide groove or an arc guide rail. , the first swing adjustment seat and the second swing adjustment seat are slidingly connected through an arc guide rail and a guide groove, a connecting block is provided between the first swing adjustment seat and the second swing adjustment seat, the first swing adjustment seat A first tightening piece is provided on the base, and the first tightening piece is in contact with the connecting block. A receiver is provided on the second swing adjustment base to drive the second swing adjustment base to adjust relative to the first swing adjustment. The base swings to a predetermined position, and the first tightening member is tightened to fix the first swing adjustment base and the second swing adjustment base so that the detection surface of the receiver is parallel to the cross-section of the positive end of the chip to be detected.

Rotating structure, the rotating structure is provided with a rotating base, a first rotating disc and a second rotating disc in sequence from bottom to top along the height direction, the first rotating disc and the second rotating disc are rotationally connected, the first rotating disc It is rotatably connected to the rotating base, the rotating base is fixedly connected to the second sliding component, and the receiving block is arranged on the second rotating disk.

A testing method, including the chip detection device described in any one of the above, including the following steps: moving the Bar bar to be tested to the test platform through an automatic supply device; when the light signal of the chip light-emitting bar is linear, passing through the bottom plate The first angle detection mechanism is brought close to the test platform. Driven by the first sliding component, the first angle detection mechanism accurately receives the optical signal emitted by the chip and detects it; when the optical signal of the chip's light-emitting strip is a diagonal shape, the first angle detection mechanism will pass through the bottom plate. The second angle detection mechanism is close to the test platform. Driven by the second sliding component and the angle adjustment component, the second angle detection mechanism accurately receives the optical signal emitted by the chip and detects it; after the detection is completed, the driving device places the detected chip onto On the storage device.

The technical solution of this application has the following advantages:

1. This application provides a fully automatic testing machine for EML chips containing SOA, which includes a driving device, an automatic supply device, a testing device and a storage device sequentially arranged along the chip transmission direction; the main structure is located on a workbench, and the The main structure includes a bracket and a slide rail that is slidingly connected to the bracket; the test device includes: a base plate, which is slidably arranged on the workbench; a test platform, which is arranged on one side of the base plate; a first angle detection mechanism, which is arranged on the on the bottom plate; the first angle detection mechanism includes a first base and a first receiving component; the first receiving component is provided on the first base through a first sliding component; a second angle detection mechanism is provided on the On the bottom plate; the second angle detection mechanism includes a second base and a second receiving component; the second receiving component is slidably and rotationally arranged on the second base through a second sliding component and an angle adjustment component. When this device detects the chip, it only needs the driving device to move the chip on the automatic supply device to the testing device. When the chip moves to the testing device, through the cooperative use of the first angle detection mechanism and the second angle detection mechanism, it can It facilitates the free switching of straight optical waveguide chips and optical waveguide chips with tilt angles, and can effectively avoid precise alignment adjustment errors caused by coupling alignment caused by frequent switching of straight waveguide chips/tilt angle waveguide chips for testing; avoiding Spend a lot of time on standard benchmarking. When using this device to switch between test varieties of straight optical waveguide chips and optical waveguide chips containing oblique angles, there is no need to adjust. The operator can directly select and complete the detection. The completed chips are finally passed through the driving device. Moving to the storage device, this solution enables simple and clear steps when testing the chip after the chip is processed, greatly improving the detection efficiency.

2. This application provides a fully automatic testing machine for EML chips containing SOA, in which the angle adjustment component includes an angle block component and a rotating block. The angle block assembly is provided on the second base and includes at least a first angle block and a second angle block. The first angle block has a first inclined surface and the second angle block has a second inclined surface. The first inclined surface and the second inclined surface The inclination angles are different; the rotating block is rotated on the second base, and the rotating block includes a receiving surface and an adjusting surface located on opposite sides, and a receiver with an axis perpendicular to the receiving surface. The adjustment surface is adapted to fit with the first inclined surface of the first angle block or the second inclined surface of the second angle block, so as to receive the force exerted by the first angle block or the second angle block, drive the rotating block to rotate, and change the desired angle. The angle of the receiving surface is such that the second receiving component receives the optical signal.

The second base is provided with a rotating block and a first angle block or a second angle block that fits the adjustment surface of the rotating block. When the angle of the optical signal deviates, it is necessary to adjust the angle of the receiver. It is only necessary to replace the first angle block with the second angle block (or replace the second angle block with the first angle block), so that the adjustment surface of the rotating block is in line with the first angle block. By fitting the inclined surface or the second inclined surface, the angle of the receiving surface can be changed, so that the receiver changes the angle along with the receiving surface to receive the optical signal. Compared with the continuous angle adjustment method, the angle adjustment method provided by this application only adjusts the angle by replacing the angle block, the adjustment time is short, and the slope of the angle block has the advantage of high precision.

3. This application provides a fully automatic testing machine for EML chips containing SOA. The first swing adjustment seat and the second swing adjustment seat are slidingly connected through arc-shaped guide rails and guide grooves to achieve relative movement between the two and drive the second swing adjustment seat. The second adjustment seat swings relative to the first adjustment seat to drive the receiving surface of the receiving block to swing. By swinging, the receiving surface of the receiving block is parallel to the cross-section of the positive end of the chip to be detected, so that the receiver with the axis perpendicular to the receiving surface can effectively receive the self-detection. The optical signal emitted by the positive optical end can reduce errors caused by processing and installation, and can also eliminate the adverse effects of other environmental factors such as temperature and improve the accuracy of detection results. The rotating structure is provided with rotating seats from bottom to top in the height direction, a first rotating disc and a second rotating disc, the first rotating disc and the second rotating disc are rotationally connected, the first rotating disc is rotationally connected with the rotating base, and the rotating base is connected with the rotating base. The second adjusting seat is fixedly connected, and the receiving block is provided on the second rotating disk. When the specifications and materials of the chip to be detected change, the angle of the positive end of the chip to be detected will change. It is necessary to adjust the angle of the receiving block by rotating the structure so that the angle of the receiving surface is consistent with the angle of the positive end.

4. This application provides a fully automatic testing machine for EML chips containing SOA. When the chip needs to be separated from the carrying mechanism, the air extraction mechanism evacuates the base body so that the end surface of the base body facing the bearing mechanism is adsorbed and fixed to the bearing mechanism. In this way, when the ejection pin rises and exerts an ejection force on the chip on the carrying mechanism, since most of the carrying mechanism is adsorbed and fixed to the base, even if the ejection force is large, it will not move, thus ensuring that the chip position will not change. Change, that is, the center of the chip and the center of the adsorption mechanism always coincide without readjustment, thus ensuring the accuracy of adsorption.

5. This application provides a fully automatic testing machine for EML chips containing SOA. The first sliding component includes a first height adjustment seat, a first horizontal adjustment plate, and a second horizontal adjustment plate. A first height adjustment member is provided on the first height adjustment base to adjust the overall height of the first height adjustment base through the first height adjustment member. A first horizontal adjustment member is provided on the first horizontal adjustment plate, and a second horizontal adjustment member is provided on the second horizontal adjustment member. The axis of the first horizontal adjustment member is perpendicular to the axis of the second horizontal adjustment member, so as to pass through the second horizontal adjustment member. A horizontal adjustment member and a second horizontal adjustment member adjust the positions in two vertical directions in the horizontal plane.

6. This application provides a fully automatic testing machine for EML chips containing SOA. The second sliding component includes a second height adjustment seat, a third horizontal adjustment plate, and a fourth horizontal adjustment plate. A second height adjustment member is provided on the second height adjustment base to adjust the overall height of the second height adjustment base through the second height adjustment member. A third horizontal adjustment member is provided on the third horizontal adjustment plate. A fourth horizontal adjustment member is provided on the fourth horizontal adjustment member. The axis of the third horizontal adjustment member is perpendicular to the axis of the fourth horizontal adjustment member so as to pass through the third horizontal adjustment member. The third horizontal adjustment piece and the fourth horizontal adjustment piece adjust the positions in two vertical directions in the horizontal plane.

7. This application provides a fully automatic testing machine for EML chips containing SOA. The first PD receiver and the second PD receiver convert optical signals into electrical signals and transmit them to the signal amplification acquisition board for data collection and electrical characteristic data. Calculate and process and classify the electrical characteristics according to the judgment conditions; the first optical fiber receiver and the second fixed optical fiber send the received spectral curve data to the spectrometer for spectral signal analysis, and determine whether the product meets the requirements of the product based on the results of the spectral test data Quality requirements, product grade classification.

Description of drawings

In order to more clearly explain the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description The drawings illustrate some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the overall mechanism of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 2 is a schematic diagram of the automatic supply device of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 3 is a schematic diagram of the test device structure of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 4 is a schematic diagram of the second angle detection mechanism of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 5 is a schematic diagram of the second sliding component of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 6 is a schematic diagram of the bar bar to be tested of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 7 is a schematic diagram of the rotating structure and swing structure of a fully automatic EML chip testing machine containing SOA provided by this application.

Figure 8 is an internal schematic diagram of the swing structure of a fully automatic EML chip testing machine containing SOA provided by this application.

Explanation of reference symbols:

1. Bracket; 2. Slide rail; 3. Bottom plate; 4. Carrying mechanism; 5. Ejection mechanism; 6. Carrying area; 7. Support plate; 8. First driving part; 9. Second driving part; 10. Ejector; 11. First adsorption mechanism; 12. Positioning and alignment mechanism; 13. Probe structure; 14. Front light end; 15. Backlight end; 16. First movable seat; 17. First support seat; 18. First Height adjustment member; 19. First fixed plate; 20. First movable plate; 21. Second fixed plate; 22. Second movable plate; 23. Second height adjustment member; 24. Second support base; 25. Three fixed plates; 26, third movable plate; 27, fourth fixed plate; 28, fourth movable plate; 29, fifth fastener; 30, sixth fastener; 31, first fastener; 32 , the second fastener; 33, the third fastener; 34, the fourth fastener; 35, the first limit rod; 36, the rotating rod; 37, the first adjustment seat; 38, the second adjustment seat; 39. Screw end; 40. Arc guide rail; 41. First tightening part; 42. First rotating disk; 43. Second rotating disk; 44. Second tightening part; 45. Holding structure; 46. Power supply end; 47. Rotating block; 48. Reference plane; 49. Second adsorption mechanism; 50. Workbench; 51. First angle block; 52. Second horizontal adjustment member; 53. First horizontal adjustment member; 54. Two movable seats; 55, third horizontal adjustment member; 56, fourth horizontal adjustment; 57, arc groove; 58, first slope; 59, receiving surface; 60, optical fiber receiver; 61, PD receiver; 62, Bar to be detected; 63. Luminous bar; 64. Chip; 65. Rotating handle; 66. Rotating base.

Detailed ways

The technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limitations on this application.

In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.

In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

Example 1

As shown in Figure 1, this application provides a fully automatic testing machine for EML chips containing SOA, including a driving device, an automatic supply device, a testing device and a storage device sequentially arranged along the transmission direction of the chip 64; the main structure is located at the working On the workbench 50, the main structure includes a bracket 1, a driving part connected to the bracket 1 and a slide rail 2 slidingly connected to the bracket 1; the test device includes: a base plate 3, slidably arranged on the workbench 50; test A platform is provided on one side of the bottom plate 3; a first angle detection mechanism is provided on the bottom plate 3; the first angle detection mechanism includes a first base and a first receiving component; the first receiving component passes through a first A sliding component is provided on the first base; a second angle detection mechanism is provided on the bottom plate 3; the second angle detection mechanism includes a second base and a second receiving component; the second receiving component passes The second sliding component and the angle adjusting component are slidably and rotationally disposed on the second base. When this device detects the chip 64 (the EML chip containing SOA is referred to as the chip 64 in this article), it only needs the driving device to move the chip 64 on the automatic supply device to the test device. When the chip moves to the test device, it passes through the first The cooperative use of the angle detection mechanism and the second angle detection mechanism can facilitate the free switching of the straight waveguide chip 64 and the tilt-angle optical waveguide chip 64, and can effectively avoid frequent switching of the straight waveguide chip 64/tilt-angle waveguide chip 64. The precise alignment adjustment error caused by coupling alignment during testing avoids spending a lot of time on standard benchmarking. When using this device to switch between test varieties of straight optical waveguide chips 64 and tilt-angle optical waveguide chips 64, No adjustment is required. The operator can directly select the chip 64 that has been tested. The chip 64 is finally moved to the storage device through the driving device. This solution allows the chip 64 to be tested after the processing is completed. The steps are simple and clear. The detection efficiency is greatly improved.

As shown in Figures 2 to 6, the chip 64 must first be moved from the automatic supply device to the testing device. The automatic supply device includes: a carrying mechanism 4 and an ejection mechanism 5; the carrying mechanism 4 has a carrying capacity for placing the Bar bar to be tested. Area 6; the bearing area 6 on the bearing mechanism 4 is made of transparent material, specifically a blue film or a transparent film made of transparent material; the blue film is arranged on the horizontally arranged support plate 7, and the support plate 7 is arranged on the horizontally arranged first driving member 8, the first driving member 8 is slidably disposed on the second driving member 9, and the movement directions of the first driving member 8 and the second driving member 9 are perpendicular to each other. The blue film has a carrying area 6 for placing chips 64. Multiple chips 64 are placed on the blue film in rows. When a chip 64 is adsorbed and transferred, it is moved by the first driving member 8 and the second driving member 9. The next chip 64 moves to the position to be adsorbed and grasped.

The ejection mechanism 5 is located below the carrying mechanism 4 and includes a base body and an ejection pin 10 located in the center of the base body. As shown in FIG. 3 , the base body is a cylinder, and a plurality of through holes are provided on the end face facing the carrying mechanism 4 . The plurality of through holes are evenly distributed in the circumferential direction of the ejector pin 10 . The base is connected to an air extraction mechanism, and the ejector pin 10 is connected to a second driving mechanism. The second driving mechanism is a vertical driving member that moves in a direction perpendicular to the carrying mechanism 4 (ie, the vertical direction), such as a motor. Or a motor; the air extraction mechanism is a vacuum pump, and there is a cavity inside the base that is connected to the through hole and the vacuum pump at the same time, so that negative pressure is applied to the cavity through the vacuum pump, so that the top of the base and the blue film are firmly attached.

In order to capture the chip 64, a first adsorption mechanism 11 is provided. The first adsorption mechanism 11 is provided above the carrying mechanism 4. The first adsorption mechanism 11 includes a suction nozzle, an air extraction structure connected to the suction nozzle, and a suction structure connected to the main body mechanism. The base body slidably connected to the slide rail 2 reciprocates between the automatic supply station and the automatic alignment station through the linear guide rail installed on the workbench 50 to transport the chips 64 .

During the test, the positioning and alignment mechanism 12 is arranged above the first adsorption mechanism 11 through the frame, and is set higher than the first adsorption mechanism 11 to avoid interference during three-point and one-line alignment. The positioning and alignment mechanism 12 is a camera, and the center of the "cross" alignment line of the camera is the same as the center of the first adsorption mechanism 11, the chip to be tested 64 and the ejector pin 10 on the carrying area 6 of the carrying mechanism 4 Coincidence settings.

After the chip 64 is placed on the test platform, the Bar bar 62 to be detected and the probe structure 13 corresponding to the Bar bar 62 to be detected are placed on the test platform. The chip 64 needs to be powered on first, through the probe structure 13 above the test platform. The three probes of the probe structure 13 descend and contact the three powered terminals 46 of a chip 64 of the Bar bar 62 to be detected. When the probe is After the needle is connected to the power-on end 46, a light-emitting bar 63 will appear on the chip 64. The front-light end 14 and the backlight end 15 of the light-emitting bar 63 respectively emit light signals. The light signal of the front-light end 14 of the light-emitting bar 63 is linear. The light-emitting bar 63 The optical signal of the backlight end 15 is a diagonal type;

When detecting the positive light end 14 of the light strip 63, the first angle detection mechanism moves the first receiving component close to the positive light end 14 of the chip 64 under the driving of the base; the first angle detection mechanism detects through the first receiving component, and the first receiving component The assembly is slidably arranged on the base plate 3 through the first sliding assembly; the first sliding assembly includes a first height adjustment seat, a first horizontal adjustment plate, and a second horizontal adjustment plate;

The first height adjustment base includes a first movable base 16 , a first support base 17 and a first height adjustment member 18 . The first height adjustment member 18 is provided on the first support base 17, and the first height member abuts on the slope of the first movable seat 16. By rotating the first height adjustment member 18, the first height adjustment member 18 extends in or out to interact with the first height adjustment member 18. Different positions on the slope of the movable seat 16 are in contact to adjust the height of the first movable seat 16 to achieve height changes of the fixed receiving mechanism. The specific first height adjustment member 18 is a differential head.

The first horizontal adjustment plate includes a first fixed plate 19 and a first movable plate 20 that are slidably connected. The first fixed plate 19 is provided with an "L"-shaped extending end, and the extending end is provided with a first horizontal adjustment plate. The first horizontal adjustment member 53 is in contact with the side of the first movable plate 20 , and rotating the adjustment rod of the first horizontal adjustment member 53 promotes the movement of the first movable plate 20 relative to the first fixed plate 19 . Specifically, the first level adjustment member 53 is a differential head. In order to adjust the fixed first movable plate 20 and the first fixed plate 19, a third fastener 33 is also provided on the first horizontal adjustment plate, and the third fastener 33 is rotated to fix it with the first movable plate 20.

The second horizontal adjustment plate includes a second fixed plate 21 and a second movable plate 22 that are slidably connected. The second fixed plate 21 is provided with an "L"-shaped extending end, and the extended end is provided with a second horizontal adjustment plate. 52, the axis of the second horizontal adjustment member 52 is perpendicular to the axis of the first horizontal adjustment member 53, the second horizontal adjustment member 52 is in contact with the side of the second movable plate 22, and the adjustment rod of the second horizontal adjustment member 52 is rotated. The second movable plate 22 is pushed to move relative to the second fixed plate 21 . Specifically, the second level adjustment member 52 is a differential head. In order to fix the adjusted second movable plate 22 and the second fixed plate 21, a fourth fastener 34 is also provided on the second horizontal adjustment plate, and the fourth fastener 34 is rotated to fix it with the second movable plate 22.

When detecting the backlight end 15 of the light strip 63, the second receiving component of the second angle detection mechanism is close to the light emitting chip 64 under the action of the bottom plate 3, and the second receiving component is slid and rotated on the second base through the second sliding component. ;The second sliding assembly includes, a second height adjustment seat, a third horizontal adjustment plate, and a fourth horizontal adjustment 56 plate;

The second height adjustment base includes a second movable base 54 , a second support base 24 and a second height adjustment member 23 . The second height adjustment member 23 is disposed on the second support base 24, and the second height adjustment member 23 is in contact with the slope of the second movable seat 54. By rotating the second height adjustment member 23, the extension or extension of the second height adjustment member 23 is in contact with the first height adjustment member 23. Different positions of the inclined surface of the movable seat 16 are in contact to adjust the height of the first movable seat 16 to realize the height change of the fixed receiving mechanism. The specific first height adjustment member 18 is a differential head.

The third horizontal adjustment plate includes a third fixed plate 25 and a third movable plate 26 that are slidably connected. The third fixed plate 25 is provided with an “L”-shaped extending end, and the extended end is provided with a third horizontal adjustment plate. The third horizontal adjustment member 55 is in contact with the side surface of the third movable plate 26 , and the adjusting rod of the third horizontal adjustment member 55 is rotated to push the third movable plate 26 to move relative to the third fixed plate 25 . Specifically, the third horizontal adjustment member 55 is a differential head. In order to adjust the fixed third movable plate 26 and the third fixed plate 25, a fifth fastener 29 is also provided on the third horizontal adjustment plate, and the fifth fastener 29 is rotated to fix it with the third movable plate 26.

The fourth horizontal adjustment plate 56 includes a slidingly connected fourth fixed plate 27 and a fourth movable plate 28, wherein the fourth fixed plate 27 is provided with an "L"-shaped extending end, and the extending end is provided with a fourth horizontal Adjust 56 pieces. The axis of the fourth horizontal adjustment piece 56 is arranged perpendicularly to the axis of the third horizontal adjustment piece 55. The fourth horizontal adjustment piece 56 is in contact with the side of the fourth movable plate 28. The adjustment of the fourth horizontal adjustment piece 56 is rotated. The rod promotes the movement of the fourth movable plate 28 relative to the fourth fixed plate 27 . Specifically, the fourth level adjustment piece 56 is a differential head. In order to fix the adjusted fourth movable plate 28 and the fourth fixed plate 27, a sixth fastener 30 is also provided on the fourth horizontal adjustment plate 56, and the sixth fastener 30 is rotated to fix it with the fourth movable plate 28.

The angle adjustment assembly includes an angle block assembly and a rotating block 47 . The angle block assembly includes at least a first angle block 51 and a second angle block and the rotating block 47 . Both the angle block assembly and the rotation block 47 are provided on the second sliding assembly.

The first angle block 51 has a first inclined surface 58 and a reference surface 48 respectively provided on both sides. The second angle block has a second inclined surface 58 and a reference surface 48 provided on both sides. The inclination angles of the first inclined surface 58 and the second inclined surface are different. , the first angle block 51 and the rotating block 47 are provided on the base.

The rotating block 47 includes a receiving surface 59 and an adjusting surface located on opposite sides, and a receiver with an axis perpendicular to the receiving surface 59 . Specifically, the receiver is the PD receiver 61.

The first angle block 51 is fixed by the first fastener 31 , and the first inclined surface 58 of the first angle block 51 is in contact with the adjustment surface of the rotating block 47 to receive the force exerted by the first angle block 51 . Specifically, the first fastener 31 is a bolt. In order to limit the rotation of the first angle block 51, the first angle block 51 is also provided with two first limiting rods 35. In order to facilitate on-site personnel to calculate the angle of the receiver, the adjustment surface and the receiving surface 59 are arranged in parallel. In order to limit the movement of the rotating block 47, the rotating block 47 is provided with two symmetrically arranged arc-shaped grooves 57, and a second limiting rod is provided on the base. The second limiting rod penetrates into the arc-shaped grooves 57 and is rotationally connected to the base. , when the second limiting rod is tightened, it will limit the movement of the rotation groove. Specifically, the second limiting rod is a screw rod. A through hole is provided at the symmetrical center position of the two arc-shaped grooves 57, and the second fastener 32 passes through the through hole to firmly connect the rotating block 47 with the base. The rotating block 47 is provided with two symmetrically arranged arc-shaped grooves 57. The second sliding component is provided with a rotating rod 36. The rotating rod 36 penetrates into the arc-shaped grooves 57 to be rotationally connected with the second sliding component. After replacing the angle block, insert the rotating rod 36 into the arc-shaped groove 57 to limit the movement of the rotating block 47. The rotating rod 36 is rotated on the base and then fixed to limit the rotation of the arc-shaped groove 57. In order to facilitate the analysis of whether the optical signal meets the requirements, the PD receiver 61 is connected to a signal amplification collection board, and the optical fiber receiver 60 is connected to a spectrometer to analyze and judge the collected electrical characteristic curves and spectral curves. The cross-section of the rotating block 47 is " L" shape.

As shown in Figures 7-8, as an alternative embodiment, the angle adjustment assembly includes a swing structure and a rotation structure; the swing structure includes a first adjustment seat 37 and a second adjustment seat 38, and the first adjustment seat 37 is provided with an arc guide rail 40. And an adjusting rod that penetrates the arc-shaped guide rail 40. The adjusting rod is provided with a rotating handle 65 and a screw end 39. The screw end 39 is exposed on the surface of the arc-shaped guide rail 40; the second adjusting seat 38 is provided with a guide groove. , and an adjusting end is provided on the end face facing the first adjusting seat 37. The adjusting end is an arc-shaped structure and is provided with teeth. The first adjusting seat 37 and the second adjusting seat 38 are slidingly connected through the arc-shaped guide rail 40 and the guide groove. The screw end 39 is meshed with the adjusting end to form a worm gear structure. In order to facilitate the fixation of the adjusted first adjustment seat 37 and the second adjustment seat 38, as shown in the figure and the figure, an arc-shaped connecting block is provided between the first adjustment seat 37 and the second adjustment seat 38. The seat 37 is also provided with a first tightening piece 41. The axis direction of the first tightening piece 41 is perpendicular to the length direction of the connecting block, and the first tightening piece 41 is in contact with the connecting block. The first tightening piece 41 is rotated toward the direction of the connecting block. A tightening piece 41 is used to fix the first adjustment seat 37 and the second adjustment seat 38 through the connecting block. Specifically, the first tightening member 41 is a bolt.

The rotating structure is provided with a rotating base 66, a first rotating disc 42 and a second rotating disc 43 from bottom to top in the height direction. The rotating base 66 is fixedly connected to the second adjusting seat 38. The first rotating disc 42 and the second rotating disc are 43 is rotatably connected, and the first rotary disk 42 is rotatably connected with the rotary base 66, wherein the rotary base 66 is fixedly connected with the second adjustment base 38, and the second rotary disk 43 is fixedly connected with the height adjustment base. In order to facilitate the rotation of the first rotating disk 42 and the second rotating disk 43, a bearing is provided between the first rotating disk 42 and the second rotating disk 43. Through the rotation of the bearing, the relative movement between the first rotating disk 42 and the second rotating disk 43 is realized. Turn. In order to fix the second rotating disk 43, a second tightening part 44 is rotatably provided on the fixed end of the first rotating disk 42. The second tightening part 44 is in contact with the second rotating disk 43, and the second tightening part 44 is rotated to The second rotating disk 43 is fixed. Specifically, the second tightening member 44 is a bolt.

After the chip 64 is detected, the tested chip 64 is transferred to the storage device through the second adsorption mechanism 49 . The second adsorption mechanism 49 is slidably disposed on the slide rail 2 on the main structure. The storage device includes a plurality of holding structures 45 . The holding structure 45 is a blue film or card box arranged in a row. Multiple blue film or card boxes can be provided according to needs, such as product grade requirements.

The first receiving component includes a first PD receiver 61 and a first optical fiber receiver 60; the first PD receiver 61 and the first optical fiber receiver 60 are respectively arranged on the first base through a first sliding component.

The second receiving component is the second PD receiver 61 and the second optical fiber receiver 60; the second PD receiver 61 and the second optical fiber receiver 60 are respectively arranged on the second base through the second sliding component.

Example 2

A detection method includes the above-mentioned chip detection device, and also includes the following steps:

Move the bar bar to be tested to the test platform through the automatic supply device; first adjust the center of the "cross" alignment line of the ejection pin 10 and the positioning and alignment mechanism 12 to be coaxial. In order to facilitate the first adsorption mechanism 11 and the load-bearing mechanism 4, the distance between the positioning and alignment mechanism 12 and the ejector pin 10 is larger, and the positioning and alignment mechanism 12 will no longer move after its position is fixed. The first adsorption mechanism 11 is driven to move toward the bearing area 6 until the center of the first adsorption mechanism 11 coincides with the center of the "cross" alignment line of the positioning and alignment mechanism 12, thereby connecting the positioning and alignment mechanism 12 and the first adsorption mechanism. Adjust the centers of ejector pin 11 and ejector pin 10 to coincide with each other. A plurality of chips 64 are arranged in order on the blue film placed on the bearing area 6 of the bearing mechanism 4, and the air extraction mechanism sucks air into the base body so that the base body and the bearing mechanism 4 are adsorbed and fixed. Taking the center of the positioning and alignment mechanism 12 as a reference, the first driving member 8 and the second driving member 9 drive the center of a chip 64 in the carrying area 6 to coincide with the center of the "cross" alignment line of the positioning and aligning mechanism 12, which is equivalent to The center of the positioning and alignment mechanism 12 , the center of the first adsorption mechanism 11 , the center of the chip 64 and the top of the ejector pin 10 are overlapped. The first adsorption mechanism 11 descends to the second predetermined position above the chip 64 . The second predetermined position is the position where the first adsorption mechanism 11 and the chip 64 are almost in contact. The second driving mechanism drives the ejector pin 10 to move toward the carrying area 6 to lift the chip 64 and rise to a first predetermined position, and the first predetermined position is higher than the second predetermined position. At this time, the first adsorption mechanism 11 pumps air to the rising chip 64 . The chip 64 continues to exert an adsorption force, and the adsorbed chip 64 rises simultaneously. The second driving mechanism drives the ejection pin 10 to separate from the lifted point of the carrying mechanism 4. At the same time, the first adsorption mechanism 11 exerts a continuous adsorption force on the chip 64, and the adsorption chip 64 continues to rise. When it reaches the third predetermined position (ie, the safety height) , move the chip 64 laterally to the automatic alignment device through the linear slide rail 2 . The first adsorption mechanism 11 moves to the top of the bearing mechanism 4 again, and coincides with the center of the "cross" alignment line of the positioning and alignment mechanism 12 . At the same time, the first driving member 8 and the second driving member 9 are controlled according to the program to drive the next chip 64 on the blue film to coincide with the center of the "cross" alignment line of the positioning and alignment mechanism 12 (that is, the center of the chip 64 and the ejection pin 10 center is also neutralized), repeat the above steps until all the chips 64 in the carrying area 6 are transferred to the test platform.

When the chip 64 is transferred to the test platform, the chip 64 is first powered on through the probe structure 13 above the test platform. The three probes of the probe structure 13 are lowered and connected with the three probes of a chip 64 of the Bar bar 62 to be detected. When the probe is connected to the power-on terminal 46, a light-emitting bar 63 will appear on the chip 64. The front-light end 14 and the back-light end 15 of the light-emitting bar 63 respectively emit light signals. The signal is linear, and the optical signal at the backlight end 15 of the light strip 63 is oblique;

When the light signal of the light-emitting strip 63 of the chip 64 is linear, the first angle detection mechanism is brought close to the test platform through the base plate 3. The first angle detection mechanism, driven by the first sliding component, accurately receives the light signal emitted by the chip 64 and detects it. ; Make the first angle detection mechanism on the base plate 3 close to the light strip 63; the first receiving component also needs to be accurately aligned through the first sliding component, and the on-site staff adjusts the height through the first height adjustment member 18, and through the first level The adjusting member 53 and the second horizontal adjusting member 52 are adjusted in two vertical directions in the horizontal plane, so that the first receiving mechanism can receive the light signal emitted by the positive end 14 of the light-emitting strip 63 .

When the light signal of the light-emitting strip 63 of the chip 64 is oblique, the second angle detection mechanism is brought close to the test platform through the base plate 3, and the second angle detection mechanism accurately receives the light emitted by the chip 64 driven by the second sliding component and the angle adjustment component. optical signal and detect it; the second receiving component also needs to be accurately positioned through the second sliding component and the angle adjustment component; the on-site staff adjusts the height through the second height adjustment member 23, and through the third horizontal adjustment member 55 and the fourth horizontal adjustment member The 56 pieces are adjusted in two vertical directions in the horizontal plane, and angle blocks with different angles are selected according to the actual situation, so that the second receiving mechanism can receive the light signal emitted by the backlight end 15 of the light strip 63.

After the detection is completed, the driving device places the detected chip 64 onto the storage device. It is transferred to the storage device through the second adsorption mechanism 49, which is slidably disposed on the slide rail 2 on the main structure.

As an alternative implementation, the angle block assembly may also be provided with angle blocks such as a third angle block, a fourth angle block, a fifth angle block, etc., and the inclined surface of each angle block has a different inclination angle, so as to adjust the angle according to the light strip 63 Different tilt angles can be selected as needed.

As an alternative embodiment, the first height adjustment member 18 , the first horizontal adjustment member 53 , the second horizontal adjustment member 52 , the second height adjustment member 23 , the third horizontal adjustment member 55 and the fourth horizontal adjustment member 56 may also be Bolts etc.

As an alternative implementation, when the light signal of the light strip 63 of the chip 64 is oblique, the second angle detection mechanism is moved close to the test platform through the base plate 3 , and the second angle detection mechanism is driven by the second sliding component and the angle adjustment component. Accurately receive the optical signal emitted by the chip 64 and detect it; set the rotation angle of the second rotating disk 43 according to the inclination angle of the backlight end 15 so that the axis of the receiver perpendicular to the receiving surface 59 of the receiving block is parallel to the axis of the backlight end 15 , and then, the second adjustment seat 38 is driven to swing relative to the first adjustment seat 37 so that the receiving surface 59 is parallel to the cross-section of the positive end 14 of the chip 64 to be detected. When it is found that the axis of the bright end 14 of the chip to be detected 64 is offset from the central axis of the receiver, the on-site personnel will fine-tune the height through the height adjustment member. The first horizontal adjustment member 53 and the second horizontal adjustment member 52 are on the horizontal plane. Fine adjustments are made in two directions set vertically.

Obviously, the above-mentioned embodiments are only examples for clear explanation and are not intended to limit the implementation. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. An exhaustive list of all implementations is neither necessary nor possible. However, obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims

A fully automatic testing machine for EML chips containing SOA, which is characterized by including a main structure, an automatic supply device, a testing device and a storage device sequentially arranged along the transmission direction of the chip (64);

The main structure is located on the workbench (50). The main structure includes a bracket (1) and a slide rail (2) slidingly connected to the bracket (1);

The test device includes:

The bottom plate (3) is slidably installed on the workbench (50);

A test platform is provided on one side of the base plate (3);

A first angle detection mechanism is arranged on the bottom plate (3); the first angle detection mechanism includes a first base and a first receiving component; the first receiving component is arranged on the first sliding component through a first sliding component. on the base;

A second angle detection mechanism is provided on the bottom plate (3); the second angle detection mechanism includes a second base and a second receiving component; the second receiving component slides through a second sliding component and an angle adjustment component. Rotation is provided on the second base.
The fully automatic testing machine for EML chips containing SOA according to claim 1, wherein the angle adjustment component includes:

An angle block assembly is provided on the second sliding assembly and includes at least one first angle block (51) and a second angle block. The first angle block (51) has a first inclined surface (58), a second The angle block has a second inclined surface, and the first inclined surface (58) and the second inclined surface have different inclination angles;

The rotating block (47) is rotatably mounted on the second sliding component. The rotating block (47) includes a receiving surface (59) and an adjusting surface located on opposite sides, and an axis perpendicular to the receiving surface (59). ), the adjustment surface is adapted to fit with the first inclined surface (58) of the first angle block (51) or the second inclined surface of the second angle block to receive the first angle block ( 51) or the force exerted by the second angle block drives the rotating block (47) to rotate and changes the angle of the receiving surface (59) so that the second receiving component can receive the optical signal.
The fully automatic testing machine for EML chips containing SOA according to claim 1, wherein the automatic supply device includes:

The load-bearing mechanism (4) has a load-bearing area (6) for placing the Bar bar to be tested. The load-bearing area (6) is made of transparent material, and the load-bearing mechanism (4) is connected to a first driving mechanism;

The ejection mechanism (5) is located below the load-bearing mechanism (4) and includes a base body and an ejection pin (10) located in the center of the base body. The base body faces the end surface of the load-bearing mechanism (4). There are a plurality of through holes for adsorbing the bearing area (6), the base is connected to an air extraction mechanism, and the ejector pin (10) is connected to a second driving mechanism;

The first adsorption mechanism (11) and the positioning and alignment mechanism (12) are sequentially arranged above the carrying mechanism (4), and the positioning and aligning mechanism (12), the first adsorption mechanism (11), the carrying mechanism (4) 4) The center of the chip to be tested (64) on the carrying area (6) coincides with the center of the ejector pin (10).
The fully automatic testing machine for EML chips containing SOA according to claim 1, characterized in that a Bar bar (62) to be detected is placed on the test platform, and a detector is provided corresponding to the Bar bar (62) to be detected. Needle structure (13).
The fully automatic testing machine for EML chips containing SOA according to claim 1, characterized in that the storage device includes a plurality of holding structures (45).
The fully automatic testing machine for EML chips containing SOA according to claim 1, wherein the first sliding component includes:

A first height adjustment seat, with a first height adjustment member (18) provided on the first height adjustment seat;

A first horizontal adjustment plate, the first horizontal adjustment plate is provided with a first horizontal adjustment member (53);

A second horizontal adjustment plate. A second horizontal adjustment member (52) is provided on the second horizontal adjustment plate. The axis of the second horizontal adjustment member (52) is consistent with the axis of the first horizontal adjustment member (53). Vertical setting.
The fully automatic testing machine for EML chips containing SOA according to claim 1, wherein the second sliding component includes:

a second height adjustment seat, with a second height adjustment member (23) provided on the second height adjustment seat;

A third horizontal adjustment plate, the third horizontal adjustment plate is provided with a third horizontal adjustment member (55);

The fourth horizontal adjustment (56) plate is provided with a fourth horizontal adjustment (56) member, and the axis of the fourth horizontal adjustment (56) member is in contact with the third horizontal adjustment member. The axis of the piece (55) is arranged vertically.
The fully automatic testing machine for EML chips containing SOA according to claim 1, wherein the first receiving component includes a first fixed PD receiver (61) and a first fixed optical fiber receiver (60); The fixed PD receiver (61) and the first fixed optical fiber receiver (60) are respectively arranged on the first base through a first sliding assembly;

The second receiving component includes a second fixed PD receiver (61) and a second fixed optical fiber receiver (60); the second fixed PD receiver (61) and the second fixed optical fiber receiver (60) respectively pass through the second fixed PD receiver (61) and the second fixed optical fiber receiver (60). The sliding assembly is arranged on the second base.
The fully automatic testing machine for EML chips containing SOA according to claim 1, wherein the angle adjustment component includes:

Swing structure, the swing structure includes a first swing adjustment seat and a second swing adjustment seat. The first swing adjustment seat is provided with an arc guide rail (40) or a guide groove, and the second swing adjustment seat is provided with a guide groove or Arc guide rail (40), the first swing adjustment seat and the second swing adjustment seat are slidingly connected through the arc guide rail (40) and the guide groove, and there is an arc guide rail (40) between the first swing adjustment seat and the second swing adjustment seat. Connecting block, the first swing adjustment seat is provided with a first tightening piece (41), the first tightening piece (41) is arranged in contact with the connecting block, the second swing adjustment base is provided with a receiver, The second swing adjustment seat is driven to swing to a predetermined position relative to the first swing adjustment seat, and the first tightening member (41) is tightened to fix the first swing adjustment seat and the second swing adjustment seat so that the receiving The detection surface of the device is parallel to the cross-section of the positive end (14) of the chip (64) to be detected;

Rotating structure, the rotating structure is provided with a rotating base (66), a first rotating disc (42) and a second rotating disc (43) from bottom to top in the height direction. The first rotating disc (42) and the second rotating disc (42) are The two rotating disks (43) are rotationally connected, the first rotating disk (42) is rotationally connected to the rotating base (66), the rotating base (66) is fixedly connected to the second sliding component, and the receiving block is located on the on the second rotating disk (43).
A testing method, characterized in that it includes the SOA-containing EML chip fully automatic testing machine described in any one of claims 1-9, including the following steps: moving the Bar bar to be tested to the test platform through an automatic supply device; When the light signal of the light strip (63) of the chip (64) is linear, the first angle detection mechanism is brought close to the test platform through the base plate (3), and the first angle detection mechanism accurately receives the chip (64) driven by the first sliding component. ) and detect the light signal emitted by the chip (64); when the light signal of the light strip (63) of the chip (64) is diagonal, move the second angle detection mechanism close to the test platform through the bottom plate (3), and the second angle detection mechanism is on the third Driven by the two sliding components and the angle adjustment component, the optical signal emitted by the chip (64) is accurately received and detected; after the detection is completed, the driving device places the detected chip (64) on the storage device.