WO2024021227A1 - Straight-turning emlsoa chip bar test machine and inspection method - Google Patents
Straight-turning emlsoa chip bar test machine and inspection method Download PDFInfo
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- WO2024021227A1 WO2024021227A1 PCT/CN2022/117307 CN2022117307W WO2024021227A1 WO 2024021227 A1 WO2024021227 A1 WO 2024021227A1 CN 2022117307 W CN2022117307 W CN 2022117307W WO 2024021227 A1 WO2024021227 A1 WO 2024021227A1
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- 238000007689 inspection Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title abstract description 15
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- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- This application relates to the field of semiconductor testing technology, and specifically to a straight-turn EMLSOA chip bar testing machine and a testing method.
- the cleavage machine splits the wafer into bars through cleavage technology.
- a bar is a single bar formed by multiple chips side by side.
- the cleaver also needs to split the bar to form a Before splitting the bar bar, it is necessary to conduct a preliminary inspection of the bar bar to check the preliminary situation of each chip.
- SOA is an electrode on the chip, which is the semiconductor optical amplifier
- EML is the chip category, and is the electrical Absorption modulated laser.
- this application provides a straight-turn EMLSOA chip bar testing machine and detection method that facilitates marking of unqualified chips during the bar testing process.
- this application provides a straight-turn EMLSOA chip bar testing machine, including a loading mechanism, a test bench, a first moving mechanism, a positioning mechanism and a feeding mechanism, and also includes:
- the test bench is installed on the driving end of the first moving mechanism, and the first moving mechanism is suitable for driving the test bench to move between the loading position and the testing position;
- a detection mechanism includes a probe assembly and an optical signal receiving unit, the probe assembly has a punching needle suitable for punching holes in the chip on the bar bar and at least one detection needle suitable for powering the chip on the bar bar;
- the optical signal receiving unit is adapted to receive the optical signal emitted from the light-emitting point of the chip after the detection target is supplied to the chip.
- the hardness of the punching needle is higher than the hardness of the detection needle.
- a second moving mechanism is also included, the punching needle is installed on the driving end of the second moving mechanism, and the second moving mechanism is adapted to drive the punching needle to punch holes on the chip.
- the optical signal receiving unit includes a PD receiver and an optical fiber receiver, which are respectively adapted to receive optical signals emitted after the chip is powered on.
- the positioning mechanism includes: a push plate installed on a third moving mechanism, the push plate is adapted to be arranged corresponding to the test bench, and the third moving mechanism is adapted to drive the push plate where the test bench is located move along the first direction and/or the second direction above the plane, and the first direction and the second direction are perpendicular to each other;
- the end of the push plate that is suitable for contacting the bar bar has a pushing part and toggle parts located on both sides of the pushing part.
- the pushing part and the toggle parts on both sides form a " ⁇ "-shaped groove.
- the push plate is provided with an inclined surface between the two dialing parts, the inclined surface is inclined toward the end of the push plate, and the inclined surface forms the pushing part at the end of the push plate.
- the test platform is provided with a plurality of adsorption holes, the plurality of adsorption holes are arranged in a straight line, and the arrangement direction of the adsorption holes is perpendicular to the first direction of the push plate.
- the side of the test bench close to the adsorption hole is provided with chamfers.
- the loading mechanism transports the bars to the test bench
- the positioning mechanism adjusts the position of the bar bar on the test bench
- the picking mechanism places the inspected bar bars in the storage box to complete the bar bar inspection.
- the straight-turn EMLSOA chip bar testing machine provided by this application has a punching needle and a detection needle in the detection mechanism. After the detection is powered on the chip, the optical signal receiving unit receives the optical signal emitted by the chip and detects it. If If the detection chip fails, punch holes and mark the chip so that it can be picked out during the subsequent splitting process to avoid repeated testing of unqualified chips and increase the workload of the operator; the usual bar machine test is repeated. The reason is that after the Bar is adsorbed and placed on the test bench, its left and right positions are not accurate enough. Since the test bench is relatively wide, the flatness of the entire plane cannot be completely guaranteed, so the Bar is randomly placed on different The consistency of the position with the plane of the test bench is also unstable.
- the hardness of the punching needle is higher than the hardness of the detection needle, so as to facilitate the punching operation of the chip.
- the push plate is installed on the third moving mechanism.
- the third moving mechanism can control the pushing plate to move in the first direction and/or the second direction.
- the material mechanism places the bar bar on the test bench, it controls the third moving mechanism to drive the push plate to move forward, backward, left, and right in the first direction and/or the second direction.
- the push plate moves forward, backward, left, and right, the The pushing part and the toggle part drive the bar bar to move, thereby changing the position of the bar bar on the test bench.
- the detection method provided by this application by setting up a punching needle in the detection mechanism and marking unqualified chips during the bar detection process, can enable the bar to select problematic chips during the subsequent splitting process. Avoiding repeated testing of failed chips saves time.
- Figure 1 is a schematic structural diagram of a straight-turning EMLSOA chip bar testing machine provided in Embodiment 1 of the present application;
- FIG. 2 is a schematic structural diagram of the detection mechanism provided in Embodiment 1 of the present application.
- FIG. 3 is a schematic structural diagram of the positioning mechanism provided in Embodiment 1 of the present application.
- Figure 4 is a schematic structural diagram of the push plate provided in Embodiment 1 of the present application.
- Figure 5 is a top view of the push plate provided in Embodiment 1 of the present application.
- Figure 6 is a flow chart of the detection method provided in Embodiment 2 of the present application.
- connection should be understood in a broad sense.
- connection or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components.
- connection or integral connection
- connection or integral connection
- connection can be a mechanical connection or an electrical connection
- it can be a direct connection or an indirect connection through an intermediate medium
- it can be an internal connection between two components.
- specific meanings of the above terms in this application can be understood on a case-by-case basis.
- This embodiment provides a specific implementation of a straight-turn EMLSOA chip bar testing machine, including a loading mechanism, a test bench 2, a first moving mechanism 6, a positioning mechanism, a detection mechanism 8 and a feeding mechanism, such as As shown in Figures 1 and 2, the test bench 2 is installed on the driving end of the first moving mechanism 6.
- the test bench 2 can be controlled to move through the first moving mechanism, so that the test bench 2 drives the bar bar 3 at the loading position and Move between test positions, in which the bar 3 is repositioned through the positioning mechanism at the loading position.
- the detection mechanism 8 includes a probe assembly and an optical signal receiving unit 9.
- the probe assembly has a punching needle 15 suitable for punching holes in the chip on the bar 3 and a detection needle 13 suitable for powering the chip on the bar 3.
- the detection needle 13 After the chip is powered, the light-emitting points on the chip will emit light, and the optical signal receiving unit 9 can receive the light signals emitted by the chip's light-emitting points, and then detect some parameters of the chip. After the detection needle 13 supplies power to the chip, it receives the optical signal emitted by the chip through the optical signal receiving unit 9 and detects it. If the detection chip is unqualified, the punching needle 15 punches and marks the chip so that it can be removed during the subsequent splitting process. Pick out to avoid repeated testing of unqualified chips and increase the workload of operators.
- the detection needles 13 can detect a chip with dual electrodes.
- the detection pins 13 can also be set to one, three or other numbers, which can satisfy the number of electrodes on the chip. In this embodiment, two are preferred.
- Each detection pin 13 is installed on the driving end of the fourth moving mechanism 12, and the position of the detection pin 13 can be controlled by the fourth moving mechanism 12, so as to complete the power supply detection of the chip.
- the punching needle 15 is installed on the driving end of the second moving mechanism 14. After detecting that the chip is unqualified, the punching needle 15 is controlled by the second moving mechanism 14 to punch and mark the chip.
- the hardness of the punching pin 15 is higher than the hardness of the detection pin 13. Since the detection pin 13 is used to power the chip, its hardness is low. If the detection pin 13 is used to punch the chip, the detection pin 13 will The damage is greater and the service life of the detection needle 13 is shortened. A punching needle 15 with a higher hardness is used to facilitate the punching operation of the chip.
- the material of the punching needle 15 is preferably steel, and it can also be made of other materials with a higher hardness, such as Ceramic materials, etc.
- the optical signal receiving unit 9 includes a PD receiver and an optical fiber receiver, which are respectively adapted to receive optical signals emitted from the light-emitting point after the chip is powered on.
- the PD receiver converts the optical signal into an electrical signal and transmits it to the signal amplification acquisition board for data collection, calculates and processes the electrical characteristic data and classifies the electrical characteristic grade according to the judgment conditions;
- the optical fiber receiver sends the received spectral curve data into Perform spectral signal analysis in the spectrometer, determine whether the product quality requirements are met based on the results of the spectral test data, and classify the product grade.
- the PD receiver may be a photodiode
- the fiber optic receiver may be a collimating lens.
- the positioning mechanism includes a push plate 1.
- the push plate 1 is installed on the third moving mechanism 4.
- the third moving mechanism 4 can control the push plate 1 to move in the first direction. and/or movement in a second direction, wherein the first direction and the second direction are perpendicular to each other.
- the end of the push plate 1 that is in contact with the bar 3 has a pushing part 7 and toggle parts 17 located on both sides of the pushing part 7.
- the pushing part 7 and the toggle parts 17 on both sides form a " ⁇ "-shaped groove. 7 can push the bar 3 to the position of the adsorption hole, and the dialing part 17 can adjust the position of the bar 3 on the adsorption hole.
- the loading mechanism places the bar 3 on the test bench 2, it controls the third moving mechanism 4 to drive the push plate 1 to move forward, backward, left, and right in the first direction and/or the second direction.
- the pushing part 7 and the dialing part 17 on the push plate 1 drive the bar 3 to move, changing the position of the bar 3 on the test bench 2 .
- the position of the bar 3 in the first direction or the second direction is accurate after the bar 3 is placed on the test bench 2, you can only adjust the position of the bar 3 in one direction, or you can re-adjust the position of the bar 3 in both directions. adjustment in one direction.
- the push plate 1 is provided with an inclined surface between the two dialing parts 17 , the inclined surface is inclined toward the end of the push plate 1 , and the inclined surface forms a pushing part 7 at the end of the push plate 1 , and both sides of the pushing part 7
- the protruding length of the side toggle portion 17 is not less than the width of the bar 3 so that the bar 3 can be completely placed in the " ⁇ "-shaped groove.
- the optical signal receiving unit 9 has two groups with different angles. Each group of optical signal receiving units 9 can receive the optical signal emitted by the light-emitting point of the chip. Two groups of optical signal receiving units 9 with different angles can be set at the same time. Chips with different light emitting angles in the bar 3 are detected without the need to replace or adjust the angle of the optical signal receiving unit 9 .
- a number of adsorption holes are provided on the test bench 2 , and the adsorption holes are arranged in a straight line, and the arrangement direction of the adsorption holes is perpendicular to the first direction of the push plate 1 .
- the push plate 1 moves in a first direction and/or upward.
- the first direction is the direction in which the pushing part 7 on the push plate 1 pushes the bar bar 3 to move, that is, the direction in which the bar bar 3 moves laterally;
- the second direction is the push direction.
- the dialing part 17 on the plate 1 pushes the bar 3 in the direction in which it moves, that is, the direction in which the bar 3 moves longitudinally.
- the adsorption holes can also be opened on other sides or in other directions on the test bench 2.
- the pushing part 7 and the dialing part 17 on the push plate 1 are adjusted to be consistent with the arrangement direction of the adsorption holes.
- the push plate 1 can push the bar 3 and make the length direction of the bar 3 coincide with the arrangement direction of the adsorption holes.
- a first workbench 5 is also included.
- the first moving mechanism 6, the second moving mechanism 14, the third moving mechanism 4 and the fourth moving mechanism 12 are all arranged on the first workbench 5, where the first
- the moving mechanism 6 is an electric cylinder
- the test bench 2 is installed on the driving end of the electric cylinder through a mounting bracket and other structures. Through the telescopic movement of the electric cylinder, the reciprocating motion of the test bench 2 is realized.
- a temperature control platform 16 is also included.
- the test platform 2 is installed on the temperature control platform 16.
- the test platform 2 is installed on the driving end of the first moving mechanism 6 through the temperature control platform 16.
- the temperature control platform 16 is connected to a temperature controller.
- the control device namely the heating device and the temperature measurement device, can heat and temperature control the test bench 2 to ensure that the Bar bar is at a suitable detection temperature.
- the heating device can be an electric heating wire
- the temperature measuring device can be a temperature sensor.
- the second moving mechanism 14 includes a forward and backward moving device, a left and right moving device and an up and down moving device.
- the forward and backward moving device is slidably installed on the left and right moving device.
- the left and right moving device is slidably installed on the first workbench 5.
- the up and down moving device is slidably installed on the front and rear moving device.
- the punching needle 15 is installed on the up and down moving device. Through the movement of the front and rear moving device, the left and right moving device and the up and down moving device, the punching needle 15 can move forward and backward, left and right and up and down.
- the left and right moving device is installed on the first workbench 5
- the forward and backward moving device is installed on the driving end of the left and right moving device
- the up and down moving device is installed on the driving end of the forward and backward moving device;
- the left and right moving device can be the third
- a slide block is slidably installed on the first slide rail
- the first slide rail is installed on the first workbench 5.
- the forward and backward moving device may be a second slide rail installed on the first slide block, and a slide rail is slidably installed on the second slide rail.
- the second slide block, the up and down moving device may be a third slide rail installed on the second slide block, a third slide block is slidably installed on the third slide rail, and the punching needle 15 is installed on the third slide block.
- the first slide rail, the second slide rail and the third slide rail are perpendicular to each other.
- the left and right moving device can also be a first cylinder
- the forward and backward moving device can be a second cylinder
- the up and down moving device can be a third cylinder.
- the first cylinder is installed on the first workbench 5, and the second cylinder Installed on the driving end of the first cylinder
- the third cylinder is installed on the driving end of the second cylinder
- the punching needle 15 is installed on the driving end of the third cylinder
- the directions are perpendicular to each other.
- the position control of the punching needle 15 is accurately realized through the control of the second moving mechanism 14 .
- the structural settings of the third moving mechanism 4 and the fourth moving mechanism 12 are the same as the above-mentioned second moving mechanism 14 , except that the driving ends of the third moving mechanism 4 and the fourth moving mechanism 12 are respectively equipped with push plates. 1 and detection pin 13.
- a second workbench 10 is also included.
- the optical signal receiving unit 9 is installed on the second workbench 10 .
- the second workbench 10 is provided with two groups of optical signal receiving units 9 , each group of optical signal receiving units 9 It includes a PD receiver and an optical fiber receiver, in which the receiving angles of the receivers in the two sets of optical signal receiving units 9 are different. Chips with different light-emitting angles in the bar 3 can be tested at the same time. For example, in the bar 3 50 chips, of which 20 chips have a light-emitting angle at the first angle, and the other 30 chips have a light-emitting angle at the second angle, and the two sets of optical signal receiving units 9 can switch between the two angles to complete the comparison. To detect the chips in the entire bar 3, there is no need to adjust the receiving angle of the optical signal receiving unit 9 during the detection process.
- the second workbench 10 is installed on the sliding plate 11, and the sliding plate 11 and the second workbench 10 are integrally installed on the driving end of the driving device.
- the driving device can be an electric cylinder, a pneumatic cylinder or a telescopic rod, etc., so as to facilitate
- the sliding plate 11 and the second workbench 10 drive the optical signal receiving unit 9 to reciprocate, so that different receivers in the optical signal receiving unit 9 are aligned with the emitting chips in the bar 3 .
- the moving direction of the slide plate 11 and the second workbench 10 is parallel to the driving direction of the first driving structure.
- the loading mechanism and the discharging mechanism are both conventional suction nozzle structures.
- the loading mechanism adsorbs the bar bar 3 to be detected from the bar placement box to the test bench 2 through the suction nozzle, and waits for the bar bar to be detected. After completion, the unloading mechanism will absorb and transfer the inspected Bar bars to the storage box through the suction nozzle, so no further details will be given.
- the unqualified chip will be punched and marked by the punching needle 15, the performance of the chip will not be affected.
- EML is the chip type
- SOA is one of the electrodes on the chip
- the straight direction is the emission angle of the chip's light-emitting point
- the straight-turn EMLSOA chip bar is the EML containing SOA electrodes with different light-emitting angles. Bar formed by chips.
- This embodiment provides a specific implementation of the bar 3 detection method. As shown in Figure 6, it is implemented using the straight-turn EMLSOA chip bar testing machine in Embodiment 1. It also includes the following steps: loading mechanism Transport the bar 3 to the test bench 2; the positioning mechanism adjusts the position of the bar 3 on the test bench 2; move the test bench 2 to the detection position, and the detection mechanism 8 detects individual chips in the bar 3 in sequence.
- the unqualified chip is controlled by the punching needle 15 to punch holes and mark the chip; the picking mechanism places the tested bar in the storage box to complete the detection of the bar bar 3.
- the punching needle 15 is controlled to punch and mark the chip. If the currently tested chip is qualified, the next chip will continue to be tested until all chips on the Bar are tested. Remove the inspected Bar strips and place them in the storage box
- the punching needle 15 in the detection mechanism 8 By setting the punching needle 15 in the detection mechanism 8 to mark the unqualified chips during the detection process of the bar 3, the bar 3 can select problematic chips in the subsequent splitting process to avoid unqualified chips. Repeated chip testing saves time.
- the unqualified chip will be punched and marked by the punching needle 15, the performance of the chip will not be affected.
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Abstract
A straight-turning EMLSOA chip bar test machine and an inspection method, which belong to the technical field of semiconductor inspection. The test machine comprises a feeding mechanism, a test table (2), a first moving mechanism (6), a positioning mechanism and a discharging mechanism, and further comprises an inspection mechanism (8), wherein the inspection mechanism (8) comprises a probe assembly and an optical signal receiving unit (9), the probe assembly is provided with a perforating probe (15) and an inspection probe (13), and the optical signal receiving unit (9) is suitable for receiving an optical signal, which is emitted from a light-emitting point of a chip after the inspection probe (13) supplies power to the chip. In the straight-turning EMLSOA chip bar test machine, an inspection mechanism (8) is provided with a perforating probe (15) and an inspection probe (13); after the inspection probe (13) supplies power to a chip, an optical signal emitted from the chip is received by an optical signal receiving unit (9) and inspection is performed; and if the chip is inspected to be unacceptable, the perforating probe (15) perforates and marks the chip, such that the chip can be picked out during a subsequent chip splitting process, thereby avoiding repeated inspection of unacceptable chips and an increase in the time for repeated inspection.
Description
相关申请的交叉引用Cross-references to related applications
本申请要求在2022年7月29日提交中国专利局、申请号为202210914529.9、发明名称为“直向拐向EMLSOA芯片Bar条测试机及检测方法”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application requires the priority of the Chinese patent application submitted to the China Patent Office on July 29, 2022, with the application number 202210914529.9 and the invention name "Straight Turning EMLSOA Chip Bar Testing Machine and Detection Method", and all its contents have been approved This reference is incorporated into this application.
本申请涉及半导体检测技术领域,具体涉及一种直向拐向EMLSOA芯片Bar条测试机及检测方法。This application relates to the field of semiconductor testing technology, and specifically to a straight-turn EMLSOA chip bar testing machine and a testing method.
含SOA的EML芯片生产过程中,裂片机通过解理技术将晶圆裂片为一根根bar条,bar条是由多个芯片并排形成的单条,裂片机还需要将bar条进行裂片,形成一个个的芯片,而在对bar条进行裂片之前,需要对bar条进行初步检测,查看各个芯片的初步情况,其中,SOA为芯片上的一个电极,为半导体光放大器,EML为芯片类别,为电吸收调制激光器。In the production process of EML chips containing SOA, the cleavage machine splits the wafer into bars through cleavage technology. A bar is a single bar formed by multiple chips side by side. The cleaver also needs to split the bar to form a Before splitting the bar bar, it is necessary to conduct a preliminary inspection of the bar bar to check the preliminary situation of each chip. Among them, SOA is an electrode on the chip, which is the semiconductor optical amplifier, EML is the chip category, and is the electrical Absorption modulated laser.
在对bar条进行检测时,若是检测到不合格的芯片,则需要对芯片进行标记,以便在后续裂片过程中将不合格的芯片挑出。When testing bar bars, if unqualified chips are detected, the chips need to be marked so that unqualified chips can be picked out during the subsequent splitting process.
发明内容Contents of the invention
因此,本申请提供了一种在bar条检测过程中,便于对不合格的芯片进行标记的直向拐向EMLSOA芯片Bar条测试机及检测方法。Therefore, this application provides a straight-turn EMLSOA chip bar testing machine and detection method that facilitates marking of unqualified chips during the bar testing process.
为解决上述技术问题,本申请提供了一种直向拐向EMLSOA芯片Bar条测试机,包括上料机构、测试台、第一移动机构、定位机构和放料机构,还包括:In order to solve the above technical problems, this application provides a straight-turn EMLSOA chip bar testing machine, including a loading mechanism, a test bench, a first moving mechanism, a positioning mechanism and a feeding mechanism, and also includes:
测试台安装在所述第一移动机构的驱动端上,所述第一移动 机构适于驱动所述测试台在上料位置及测试位置之间进行移动;The test bench is installed on the driving end of the first moving mechanism, and the first moving mechanism is suitable for driving the test bench to move between the loading position and the testing position;
检测机构,所述检测机构包括探针组件和光信号接收单元,所述探针组件具有适于对bar条上芯片打孔的打孔针及至少一个适于对bar条上芯片供电的检测针;A detection mechanism, the detection mechanism includes a probe assembly and an optical signal receiving unit, the probe assembly has a punching needle suitable for punching holes in the chip on the bar bar and at least one detection needle suitable for powering the chip on the bar bar;
所述光信号接收单元适于接收所述检测针对芯片供电后芯片发光点发出的光信号。The optical signal receiving unit is adapted to receive the optical signal emitted from the light-emitting point of the chip after the detection target is supplied to the chip.
可选地,所述检测针具有两个。Optionally, there are two detection needles.
可选地,所述打孔针的硬度高于所述检测针的硬度。Optionally, the hardness of the punching needle is higher than the hardness of the detection needle.
可选地,还包括第二移动机构,所述打孔针安装在所述第二移动机构的驱动端上,所述第二移动机构适于驱动所述打孔针对芯片进行打孔标记。Optionally, a second moving mechanism is also included, the punching needle is installed on the driving end of the second moving mechanism, and the second moving mechanism is adapted to drive the punching needle to punch holes on the chip.
可选地,所述光信号接收单元包括PD接收器和光纤接收器,分别适于接收芯片通电后发出的光信号。Optionally, the optical signal receiving unit includes a PD receiver and an optical fiber receiver, which are respectively adapted to receive optical signals emitted after the chip is powered on.
可选地,所述定位机构包括:推板,安装在第三移动机构上,所述推板适于与测试台对应设置,所述第三移动机构适于驱动所述推板在测试台所处的平面上方沿第一方向和/或第二方向进行移动,所述第一方向和第二方向互相垂直;Optionally, the positioning mechanism includes: a push plate installed on a third moving mechanism, the push plate is adapted to be arranged corresponding to the test bench, and the third moving mechanism is adapted to drive the push plate where the test bench is located move along the first direction and/or the second direction above the plane, and the first direction and the second direction are perpendicular to each other;
所述推板适于与bar条接触的端部具有推动部及位于推动部两侧的拨动部,所述推动部及两侧的拨动部形成“凵”形凹槽。The end of the push plate that is suitable for contacting the bar bar has a pushing part and toggle parts located on both sides of the pushing part. The pushing part and the toggle parts on both sides form a "凵"-shaped groove.
可选地,所述推板上在两个拨动部之间的位置开设有斜面,所述斜面朝向推板的端部倾斜,且所述斜面在推板的端部形成所述推动部。Optionally, the push plate is provided with an inclined surface between the two dialing parts, the inclined surface is inclined toward the end of the push plate, and the inclined surface forms the pushing part at the end of the push plate.
可选地,所述测试台上开设有若干吸附孔,若干吸附孔呈一字排列,且所述吸附孔的排布方向与所述推板的第一方向互相垂直。Optionally, the test platform is provided with a plurality of adsorption holes, the plurality of adsorption holes are arranged in a straight line, and the arrangement direction of the adsorption holes is perpendicular to the first direction of the push plate.
可选地,所述测试台上靠近吸附孔的侧边设有倒角。Optionally, the side of the test bench close to the adsorption hole is provided with chamfers.
还提供了检测方法,包括上述的直向拐向EMLSOA芯片Bar条测试机,还包括以下步骤:Testing methods are also provided, including the above-mentioned straight-turn EMLSOA chip bar testing machine, and also include the following steps:
上料机构将bar条输送至测试台上;The loading mechanism transports the bars to the test bench;
定位机构调整bar条在测试台上的位置;The positioning mechanism adjusts the position of the bar bar on the test bench;
移动测试台至检测位置,检测机构对bar条中单个芯片依次进行检测,其中,遇到不合格的芯片控制打孔针对该芯片进行打孔标记;Move the test bench to the detection position, and the detection mechanism will detect individual chips in the bar in sequence. If an unqualified chip is encountered, the control punching will be performed to mark the chip;
取料机构将检测完的bar条放置在收纳盒内,完成bar条的检测。The picking mechanism places the inspected bar bars in the storage box to complete the bar bar inspection.
本申请技术方案,具有如下优点:The technical solution of this application has the following advantages:
1.本申请提供的直向拐向EMLSOA芯片Bar条测试机,检测机构中具有打孔针和检测针,检测针对芯片供电后,经光信号接收单元接收芯片发出的光信号并进行检测,若是检测芯片不合格,则打孔针对该芯片进行打孔标记,以便后续裂片过程中将其挑出,避免对不合格的芯片进行重复检测,增加操作人员的工作量;通常的Bar条机测试重复性很差,原因是吸附起Bar条后,放置到测试台上时,其左右位置是不够精准的,由于测试台比较宽整个平面的平整度不能完全保证一致,所以Bar条随机放置在不同的位置与测试台的平面的接触的一致性也不稳定。这是Bar条机测试中的非常影响测试重复性的大问题。我们采用“凵”形推板结构后,可以准确的通过“凵”将Bar条的起始端准确的定位在预先确定下来的起始点。这样不论放置几次,都会使得Bar条的起始位置固定不偏移,与测试台面的接触效果不发生变化,确保了测试数据重复性的稳定。1. The straight-turn EMLSOA chip bar testing machine provided by this application has a punching needle and a detection needle in the detection mechanism. After the detection is powered on the chip, the optical signal receiving unit receives the optical signal emitted by the chip and detects it. If If the detection chip fails, punch holes and mark the chip so that it can be picked out during the subsequent splitting process to avoid repeated testing of unqualified chips and increase the workload of the operator; the usual bar machine test is repeated The reason is that after the Bar is adsorbed and placed on the test bench, its left and right positions are not accurate enough. Since the test bench is relatively wide, the flatness of the entire plane cannot be completely guaranteed, so the Bar is randomly placed on different The consistency of the position with the plane of the test bench is also unstable. This is a big problem in bar machine testing that greatly affects test repeatability. After we adopt the "凵" shaped push plate structure, we can accurately position the starting end of the Bar at the predetermined starting point through the "凵". In this way, no matter how many times it is placed, the starting position of the Bar will be fixed and will not shift, and the contact effect with the test bench will not change, ensuring the stability of test data repeatability.
2.本申请提供的直向拐向EMLSOA芯片Bar条测试机,打孔针的硬度高于检测针的硬度,以便于对芯片进行打孔操作。2. In the straight-turn EMLSOA chip bar testing machine provided by this application, the hardness of the punching needle is higher than the hardness of the detection needle, so as to facilitate the punching operation of the chip.
3.本申请提供的直向拐向EMLSOA芯片Bar条测试机,推板安装在第三移动机构上,第三移动机构可以控制推板进行第一方向和/第二方向上的移动,当上料机构将bar条放置在测试台上后,通过控制第三移动机构带动推板进行第一方向和/或第二方向上前后左右的移动,在推板进行前后左右移动时,推板上的推动部及拨动部带动bar条移动,从而改变bar条在测试台上的位置。3. For the straight-turning EMLSOA chip bar testing machine provided by this application, the push plate is installed on the third moving mechanism. The third moving mechanism can control the pushing plate to move in the first direction and/or the second direction. After the material mechanism places the bar bar on the test bench, it controls the third moving mechanism to drive the push plate to move forward, backward, left, and right in the first direction and/or the second direction. When the push plate moves forward, backward, left, and right, the The pushing part and the toggle part drive the bar bar to move, thereby changing the position of the bar bar on the test bench.
4.本申请提供的检测方法,通过在检测机构中设置打孔针,在bar条检测过程中对不合格的芯片进行标记,可以使bar条在后 续裂片过程中将有问题的芯片挑选出来,避免对不合格的芯片重复检测,这节省了时间。4. The detection method provided by this application, by setting up a punching needle in the detection mechanism and marking unqualified chips during the bar detection process, can enable the bar to select problematic chips during the subsequent splitting process. Avoiding repeated testing of failed chips saves time.
为了更清楚地说明本申请具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本申请的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly explain the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description The drawings illustrate some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.
图1为本申请实施例1提供的直向拐向EMLSOA芯片Bar条测试机的结构示意图;Figure 1 is a schematic structural diagram of a straight-turning EMLSOA chip bar testing machine provided in Embodiment 1 of the present application;
图2为本申请实施例1提供的检测机构的结构示意图;Figure 2 is a schematic structural diagram of the detection mechanism provided in Embodiment 1 of the present application;
图3为本申请实施例1提供的定位机构的结构示意图;Figure 3 is a schematic structural diagram of the positioning mechanism provided in Embodiment 1 of the present application;
图4为本申请实施例1提供的推板的结构示意图;Figure 4 is a schematic structural diagram of the push plate provided in Embodiment 1 of the present application;
图5为本申请实施例1提供的推板的俯视图;Figure 5 is a top view of the push plate provided in Embodiment 1 of the present application;
图6为本申请实施例2提供的检测方法的流程图。Figure 6 is a flow chart of the detection method provided in Embodiment 2 of the present application.
附图标记说明:Explanation of reference symbols:
1、推板;2、测试台;3、bar条;4、第三移动机构;5、第一工作台;6、第一移动机构;7、推动部;8、检测机构;9、光信号接收单元;10、第二工作台;11、滑板;12、第四移动机构;13、检测针;14、第二移动机构;15、打孔针;16、温控台;17、拨动部。1. Push plate; 2. Test bench; 3. Bar; 4. Third moving mechanism; 5. First workbench; 6. First moving mechanism; 7. Pushing part; 8. Detection mechanism; 9. Optical signal Receiving unit; 10. Second workbench; 11. Slide plate; 12. Fourth moving mechanism; 13. Detection needle; 14. Second moving mechanism; 15. Punching needle; 16. Temperature control table; 17. Toggle part .
下面将结合附图对本申请的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
在本申请的描述中,需要说明的是,术语“中心”、“上”、 “下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”、“第三”、“第四”仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limitations on this application. Furthermore, the terms “first,” “second,” “third,” and “fourth” are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.
此外,下面所描述的本申请不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
实施例1Example 1
本实施例提供了直向拐向EMLSOA芯片Bar条测试机的一种具体的实施方式,包括上料机构、测试台2、第一移动机构6、定位机构、检测机构8和放料机构,如图1和图2所示,测试台2安装在第一移动机构6的驱动端上,通过第一移动机构可以控制测试台2进行移动,以使测试台2带动bar条3在上料位置及测试位置之间进行移动,其中,bar条3在上料位置处通过定位机构进行重新定位。检测机构8包括探针组件和光信号接收单元9,探针组件具有适于对bar条3上芯片打孔的打孔针15及适于对bar条3上芯片供电的检测针13,检测针13对芯片进行供电后,芯片上的发光点会进行发光,光信号接收单元9可以接收芯片发光点发出的光信号,进而对芯片的一些参数进行检测。检测针13对芯片供电后,经光信号接收单元9接收芯片发出的光信号并进行检测,若是检测芯片不合格,则打孔针15对该芯片进行打孔标记,以便 后续裂片过程中将其挑出,避免对不合格的芯片进行重复检测,增加操作人员的工作量。This embodiment provides a specific implementation of a straight-turn EMLSOA chip bar testing machine, including a loading mechanism, a test bench 2, a first moving mechanism 6, a positioning mechanism, a detection mechanism 8 and a feeding mechanism, such as As shown in Figures 1 and 2, the test bench 2 is installed on the driving end of the first moving mechanism 6. The test bench 2 can be controlled to move through the first moving mechanism, so that the test bench 2 drives the bar bar 3 at the loading position and Move between test positions, in which the bar 3 is repositioned through the positioning mechanism at the loading position. The detection mechanism 8 includes a probe assembly and an optical signal receiving unit 9. The probe assembly has a punching needle 15 suitable for punching holes in the chip on the bar 3 and a detection needle 13 suitable for powering the chip on the bar 3. The detection needle 13 After the chip is powered, the light-emitting points on the chip will emit light, and the optical signal receiving unit 9 can receive the light signals emitted by the chip's light-emitting points, and then detect some parameters of the chip. After the detection needle 13 supplies power to the chip, it receives the optical signal emitted by the chip through the optical signal receiving unit 9 and detects it. If the detection chip is unqualified, the punching needle 15 punches and marks the chip so that it can be removed during the subsequent splitting process. Pick out to avoid repeated testing of unqualified chips and increase the workload of operators.
具体地,检测针13具有两个,可以对具有双电极的芯片进行检测。作为一种可替换的实施方式,检测针13也可以设置为一个、三个或其他数量,满足芯片上电极数量即可。本实施例中优选为两个。Specifically, there are two detection needles 13, which can detect a chip with dual electrodes. As an alternative implementation, the detection pins 13 can also be set to one, three or other numbers, which can satisfy the number of electrodes on the chip. In this embodiment, two are preferred.
每个检测针13都安装在第四移动机构12的驱动端上,通过第四移动机构12可以控制检测针13的位置,以便对芯片完成供电检测。Each detection pin 13 is installed on the driving end of the fourth moving mechanism 12, and the position of the detection pin 13 can be controlled by the fourth moving mechanism 12, so as to complete the power supply detection of the chip.
本实施例中,打孔针15安装在第二移动机构14的驱动端上,在检测到芯片不合格后,通过第二移动机构14控制打孔针15对芯片进行打孔标记。In this embodiment, the punching needle 15 is installed on the driving end of the second moving mechanism 14. After detecting that the chip is unqualified, the punching needle 15 is controlled by the second moving mechanism 14 to punch and mark the chip.
具体地,打孔针15的硬度高于检测针13的硬度,由于检测针13用于对芯片进行供电,其硬度较低,若是采用检测针13对芯片进行打孔,则对检测针13的损伤较大,缩短检测针13的使用寿命,采用硬度较高的打孔针15便于对芯片进行打孔操作,打孔针15的材质优选为钢,也可以是其他硬度较高的材质,如陶瓷材质等。Specifically, the hardness of the punching pin 15 is higher than the hardness of the detection pin 13. Since the detection pin 13 is used to power the chip, its hardness is low. If the detection pin 13 is used to punch the chip, the detection pin 13 will The damage is greater and the service life of the detection needle 13 is shortened. A punching needle 15 with a higher hardness is used to facilitate the punching operation of the chip. The material of the punching needle 15 is preferably steel, and it can also be made of other materials with a higher hardness, such as Ceramic materials, etc.
本实施例中,光信号接收单元9包括PD接收器和光纤接收器,分别适于接收芯片通电后发光点发出的光信号。其中,PD接收器将光信号转换为电信号传送到信号放大采集板进行数据采集,进行电特性数据计算处理并根据判定条件进行电特性等级分类;光纤接收器将接收到的光谱曲线数据送入到光谱仪中进行光谱信号分析,根据光谱测试数据的结果判定是否满足产品的品质要求,进行产品等级分类。具体地,PD接收器可以是光电二极管,光纤接收器可以是准直透镜。In this embodiment, the optical signal receiving unit 9 includes a PD receiver and an optical fiber receiver, which are respectively adapted to receive optical signals emitted from the light-emitting point after the chip is powered on. Among them, the PD receiver converts the optical signal into an electrical signal and transmits it to the signal amplification acquisition board for data collection, calculates and processes the electrical characteristic data and classifies the electrical characteristic grade according to the judgment conditions; the optical fiber receiver sends the received spectral curve data into Perform spectral signal analysis in the spectrometer, determine whether the product quality requirements are met based on the results of the spectral test data, and classify the product grade. Specifically, the PD receiver may be a photodiode, and the fiber optic receiver may be a collimating lens.
本实施例中,如图3、图4和图5所示,定位机构包括推板1,推板1安装在第三移动机构4上,第三移动机构4可以控制推板1进行第一方向和/或第二方向上的移动,其中,第一方向和第二方向互相垂直。推板1上与bar条3接触的端部具有推动部7及位于 推动部7两侧的拨动部17,推动部7和两侧的拨动部17形成“凵”形凹槽,推动部7可以将bar条3推至吸附孔位置处,拨动部17可以调节bar条3在吸附孔上所处的位置。当上料机构将bar条3放置在测试台2上后,通过控制第三移动机构4带动推板1进行第一方向和/或第二方向上前后左右的移动,在推板1进行前后左右移动时,推板1上的推动部7及拨动部17带动bar条3移动,改变bar条3在测试台2上的位置。In this embodiment, as shown in Figures 3, 4 and 5, the positioning mechanism includes a push plate 1. The push plate 1 is installed on the third moving mechanism 4. The third moving mechanism 4 can control the push plate 1 to move in the first direction. and/or movement in a second direction, wherein the first direction and the second direction are perpendicular to each other. The end of the push plate 1 that is in contact with the bar 3 has a pushing part 7 and toggle parts 17 located on both sides of the pushing part 7. The pushing part 7 and the toggle parts 17 on both sides form a "凵"-shaped groove. 7 can push the bar 3 to the position of the adsorption hole, and the dialing part 17 can adjust the position of the bar 3 on the adsorption hole. When the loading mechanism places the bar 3 on the test bench 2, it controls the third moving mechanism 4 to drive the push plate 1 to move forward, backward, left, and right in the first direction and/or the second direction. When moving, the pushing part 7 and the dialing part 17 on the push plate 1 drive the bar 3 to move, changing the position of the bar 3 on the test bench 2 .
具体地,若是bar条3放置在测试台2上后,第一方向或第二方向的位置准确,则可以只调节bar条3其中一个方向的位置,也可重新对bar条3的位置进行两个方向的调整。Specifically, if the position of the bar 3 in the first direction or the second direction is accurate after the bar 3 is placed on the test bench 2, you can only adjust the position of the bar 3 in one direction, or you can re-adjust the position of the bar 3 in both directions. adjustment in one direction.
具体地,推板1上在两个拨动部17之间的位置开设有斜面,斜面朝向推板1的端部倾斜,且斜面在推板1的端部形成推动部7,推动部7两侧的拨动部17的伸出长度不小于bar条3的宽度,以便使bar条3能够完全处于“凵”形凹槽内。Specifically, the push plate 1 is provided with an inclined surface between the two dialing parts 17 , the inclined surface is inclined toward the end of the push plate 1 , and the inclined surface forms a pushing part 7 at the end of the push plate 1 , and both sides of the pushing part 7 The protruding length of the side toggle portion 17 is not less than the width of the bar 3 so that the bar 3 can be completely placed in the "凵"-shaped groove.
如图1所示,光信号接收单元9具有角度不同的两组,每组光信号接收单元9都可以接收芯片发光点发出的光信号,设置两组不同角度的光信号接收单元9,可以同时检测bar条3内存在不同发光角度的芯片,而无需对光信号接收单元9进行更换或角度调整。As shown in Figure 1, the optical signal receiving unit 9 has two groups with different angles. Each group of optical signal receiving units 9 can receive the optical signal emitted by the light-emitting point of the chip. Two groups of optical signal receiving units 9 with different angles can be set at the same time. Chips with different light emitting angles in the bar 3 are detected without the need to replace or adjust the angle of the optical signal receiving unit 9 .
本实施例中,测试台2上开设有若干吸附孔,若干吸附孔呈一字排列,并且吸附孔的排布方向与推板1的第一方向互相垂直。具体地,推板1进行第一方向和/或上的移动,第一方向为推板1上推动部7推动bar条3移动的方向,即bar条3横向移动的方向;第二方向为推板1上拨动部17推动bar条3移动的方向,即bar条3纵向移动的方向。In this embodiment, a number of adsorption holes are provided on the test bench 2 , and the adsorption holes are arranged in a straight line, and the arrangement direction of the adsorption holes is perpendicular to the first direction of the push plate 1 . Specifically, the push plate 1 moves in a first direction and/or upward. The first direction is the direction in which the pushing part 7 on the push plate 1 pushes the bar bar 3 to move, that is, the direction in which the bar bar 3 moves laterally; the second direction is the push direction. The dialing part 17 on the plate 1 pushes the bar 3 in the direction in which it moves, that is, the direction in which the bar 3 moves longitudinally.
作为一种可替换的实施方式,吸附孔还可以开设在测试台2上其他侧边或其他方向,此时推板1上的推动部7及拨动部17调整为与吸附孔排布方向相对应的方向,以使推板1能够推动bar条3并使bar条3的长度方向与吸附孔的排布方向重合。As an alternative implementation, the adsorption holes can also be opened on other sides or in other directions on the test bench 2. At this time, the pushing part 7 and the dialing part 17 on the push plate 1 are adjusted to be consistent with the arrangement direction of the adsorption holes. Corresponding direction, so that the push plate 1 can push the bar 3 and make the length direction of the bar 3 coincide with the arrangement direction of the adsorption holes.
本实施例中,还包括第一工作台5,第一移动机构6、第二移 动机构14、第三移动机构4及第四移动机构12均设置在第一工作台5上,其中,第一移动机构6为电缸,测试台2通过安装支架等结构安装在电缸的驱动端上通过电缸的伸缩运动,实现测试台2的往复运动。In this embodiment, a first workbench 5 is also included. The first moving mechanism 6, the second moving mechanism 14, the third moving mechanism 4 and the fourth moving mechanism 12 are all arranged on the first workbench 5, where the first The moving mechanism 6 is an electric cylinder, and the test bench 2 is installed on the driving end of the electric cylinder through a mounting bracket and other structures. Through the telescopic movement of the electric cylinder, the reciprocating motion of the test bench 2 is realized.
本实施例中,还包括温控台16,测试台2安装在温控台16上,测试台2通过温控台16安装在第一移动机构6的驱动端上,温控台16连接有温度控制装置,即加温装置和测温装置,可以对测试台2进行加热和温度控制,以保证Bar条处于合适的检测温度。具体地,加温装置可以电热丝,测温装置可以温度传感器。In this embodiment, a temperature control platform 16 is also included. The test platform 2 is installed on the temperature control platform 16. The test platform 2 is installed on the driving end of the first moving mechanism 6 through the temperature control platform 16. The temperature control platform 16 is connected to a temperature controller. The control device, namely the heating device and the temperature measurement device, can heat and temperature control the test bench 2 to ensure that the Bar bar is at a suitable detection temperature. Specifically, the heating device can be an electric heating wire, and the temperature measuring device can be a temperature sensor.
第二移动机构14包括前后移动装置、左右移动装置和上下移动装置,前后移动装置滑动安装在左右移动装置上,左右移动装置滑动安装在第一工作台5上,上下移动装置滑动安装在前后移动装置上,打孔针15安装在上下移动装置上,通过前后移动装置、左右移动装置和上下移动装置的移动,实现打孔针15的前后、左右和上下方向的移动。具体地,左右移动装置安装在第一工作台5上,前后移动装置安装在左右移动装置的驱动端上,上下移动装置安装在前后移动装置的驱动端上;具体地,左右移动装置可以是第一滑块滑动安装在第一滑轨上,第一滑轨安装在第一工作台5上,前后移动装置可以是第二滑轨安装在第一滑块上,第二滑轨上滑动安装有第二滑块,上下移动装置可以是第三滑轨安装在第二滑块上,第三滑轨上滑动安装有第三滑块,打孔针15安装在第三滑块上。第一滑轨、第二滑轨和第三滑轨两两互相垂直。The second moving mechanism 14 includes a forward and backward moving device, a left and right moving device and an up and down moving device. The forward and backward moving device is slidably installed on the left and right moving device. The left and right moving device is slidably installed on the first workbench 5. The up and down moving device is slidably installed on the front and rear moving device. On the device, the punching needle 15 is installed on the up and down moving device. Through the movement of the front and rear moving device, the left and right moving device and the up and down moving device, the punching needle 15 can move forward and backward, left and right and up and down. Specifically, the left and right moving device is installed on the first workbench 5, the forward and backward moving device is installed on the driving end of the left and right moving device, and the up and down moving device is installed on the driving end of the forward and backward moving device; specifically, the left and right moving device can be the third A slide block is slidably installed on the first slide rail, and the first slide rail is installed on the first workbench 5. The forward and backward moving device may be a second slide rail installed on the first slide block, and a slide rail is slidably installed on the second slide rail. The second slide block, the up and down moving device may be a third slide rail installed on the second slide block, a third slide block is slidably installed on the third slide rail, and the punching needle 15 is installed on the third slide block. The first slide rail, the second slide rail and the third slide rail are perpendicular to each other.
作为一种可替换的实施方式,左右移动装置还可以是第一气缸,前后移动装置是第二气缸,上下移动装置是第三气缸,第一气缸安装在第一工作台5上,第二气缸安装在第一气缸的驱动端上,第三气缸安装在第二气缸的驱动端上,打孔针15安装在第三气缸的驱动端上,第一气缸、第二气缸和第三气缸的驱动方向两两互相垂直。通过第二移动机构14的控制精准实现打孔针15的位置控制。As an alternative embodiment, the left and right moving device can also be a first cylinder, the forward and backward moving device can be a second cylinder, and the up and down moving device can be a third cylinder. The first cylinder is installed on the first workbench 5, and the second cylinder Installed on the driving end of the first cylinder, the third cylinder is installed on the driving end of the second cylinder, the punching needle 15 is installed on the driving end of the third cylinder, the driving of the first cylinder, the second cylinder and the third cylinder The directions are perpendicular to each other. The position control of the punching needle 15 is accurately realized through the control of the second moving mechanism 14 .
本实施例中,第三移动机构4和第四移动机构12的结构设置 与上述第二移动机构14相同,仅是第三移动机构4和第四移动机构12的驱动端安装的分别是推板1和检测针13。In this embodiment, the structural settings of the third moving mechanism 4 and the fourth moving mechanism 12 are the same as the above-mentioned second moving mechanism 14 , except that the driving ends of the third moving mechanism 4 and the fourth moving mechanism 12 are respectively equipped with push plates. 1 and detection pin 13.
本实施例中,还包括第二工作台10,光信号接收单元9安装在第二工作台10上,第二工作台10上设有两组光信号接收单元9,每组光信号接收单元9包括一个PD接收器和一个光纤接收器,其中,两组光信号接收单元9中接收器的接收角度不同,可以同时对bar条3内具有不同发光角度的芯片进行测试,如bar条3内具有50个芯片,其中,20个芯片的发光角度呈第一角度,另外30个芯片的发光角度呈第二角度,两组光信号接收单元9则可以在这两种角度之间进行切换,完成对整个bar条3中芯片的检测,无需再检测过程中调整光信号接收单元9的接收角度。In this embodiment, a second workbench 10 is also included. The optical signal receiving unit 9 is installed on the second workbench 10 . The second workbench 10 is provided with two groups of optical signal receiving units 9 , each group of optical signal receiving units 9 It includes a PD receiver and an optical fiber receiver, in which the receiving angles of the receivers in the two sets of optical signal receiving units 9 are different. Chips with different light-emitting angles in the bar 3 can be tested at the same time. For example, in the bar 3 50 chips, of which 20 chips have a light-emitting angle at the first angle, and the other 30 chips have a light-emitting angle at the second angle, and the two sets of optical signal receiving units 9 can switch between the two angles to complete the comparison. To detect the chips in the entire bar 3, there is no need to adjust the receiving angle of the optical signal receiving unit 9 during the detection process.
具体地,第二工作台10安装在滑板11上,滑板11及第二工作台10整体安装在驱动装置的驱动端上,驱动装置可以是电缸,也可以是气缸或伸缩杆等,以便于使滑板11和第二工作台10带动光信号接收单元9进行往复运动,使光信号接收单元9中不同的接收器对准bar条3中正在发光的芯片。本实施例中,滑板11和第二工作台10的移动方向与第一驱动结构的驱动方向平行。Specifically, the second workbench 10 is installed on the sliding plate 11, and the sliding plate 11 and the second workbench 10 are integrally installed on the driving end of the driving device. The driving device can be an electric cylinder, a pneumatic cylinder or a telescopic rod, etc., so as to facilitate The sliding plate 11 and the second workbench 10 drive the optical signal receiving unit 9 to reciprocate, so that different receivers in the optical signal receiving unit 9 are aligned with the emitting chips in the bar 3 . In this embodiment, the moving direction of the slide plate 11 and the second workbench 10 is parallel to the driving direction of the first driving structure.
本实施例中,上料机构和放料机构均为常规的吸嘴结构,上料机构通过吸嘴将待检测的bar条3从bar条放置盒内吸附至测试台2上,待Bar条检测完毕后,放料机构在通过吸嘴将检测完毕的Bar条吸附并移送至收纳盒内,故不再进行过多赘述。In this embodiment, the loading mechanism and the discharging mechanism are both conventional suction nozzle structures. The loading mechanism adsorbs the bar bar 3 to be detected from the bar placement box to the test bench 2 through the suction nozzle, and waits for the bar bar to be detected. After completion, the unloading mechanism will absorb and transfer the inspected Bar bars to the storage box through the suction nozzle, so no further details will be given.
本实施例中,虽然会通过打孔针15对不合格的芯片进行打孔标记,但并不会影响芯片的性能。In this embodiment, although the unqualified chip will be punched and marked by the punching needle 15, the performance of the chip will not be affected.
本实施例中,EML为芯片类别,SOA为芯片上其一电极,直向拐向为芯片发光点的发射角度,直向拐向EMLSOA芯片bar条即为具有不同发光角度的含有SOA电极的EML芯片形成的bar条。In this embodiment, EML is the chip type, SOA is one of the electrodes on the chip, the straight direction is the emission angle of the chip's light-emitting point, and the straight-turn EMLSOA chip bar is the EML containing SOA electrodes with different light-emitting angles. Bar formed by chips.
实施例2Example 2
本实施例提供了bar条3检测方法的一种具体的实施方式,如图6所示,采用实施例1中的直向拐向EMLSOA芯片Bar条测试 机实施,还包括以下步骤:上料机构将bar条3输送至测试台2上;定位机构调整bar条3在测试台2上的位置;移动测试台2至检测位置,检测机构8对bar条3中单个芯片依次进行检测,其中,遇到不合格的芯片控制打孔针15对该芯片进行打孔标记;取料机构将检测完的bar放置在储物盒内,完成bar条3的检测。This embodiment provides a specific implementation of the bar 3 detection method. As shown in Figure 6, it is implemented using the straight-turn EMLSOA chip bar testing machine in Embodiment 1. It also includes the following steps: loading mechanism Transport the bar 3 to the test bench 2; the positioning mechanism adjusts the position of the bar 3 on the test bench 2; move the test bench 2 to the detection position, and the detection mechanism 8 detects individual chips in the bar 3 in sequence. The unqualified chip is controlled by the punching needle 15 to punch holes and mark the chip; the picking mechanism places the tested bar in the storage box to complete the detection of the bar bar 3.
在检测过程中,遇到不合格的芯片,则控制打孔针15对该芯片进行打孔标记,若是当前检测的芯片合格,则继续检测下一个芯片,直至Bar条上全部芯片检测完毕,将检测完的Bar条移出放置到收纳盒内During the testing process, if an unqualified chip is encountered, the punching needle 15 is controlled to punch and mark the chip. If the currently tested chip is qualified, the next chip will continue to be tested until all chips on the Bar are tested. Remove the inspected Bar strips and place them in the storage box
通过在检测机构8中设置打孔针15,在bar条3检测过程中对不合格的芯片进行标记,可以使bar条3在后续裂片过程中将有问题的芯片挑选出来,避免对不合格的芯片重复检测,节省时间。By setting the punching needle 15 in the detection mechanism 8 to mark the unqualified chips during the detection process of the bar 3, the bar 3 can select problematic chips in the subsequent splitting process to avoid unqualified chips. Repeated chip testing saves time.
本实施例中,虽然会通过打孔针15对不合格的芯片进行打孔标记,但并不会影响芯片的性能。In this embodiment, although the unqualified chip will be punched and marked by the punching needle 15, the performance of the chip will not be affected.
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本发明创造的保护范围中。Obviously, the above-mentioned embodiments are only examples for clear explanation and are not intended to limit the implementation. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. An exhaustive list of all implementations is neither necessary nor possible. However, obvious changes or modifications derived therefrom are still within the protection scope of the present invention.
Claims (9)
- 一种直向拐向EMLSOA芯片Bar条测试机,包括上料机构、测试台(2)、第一移动机构(6)、定位机构和放料机构,其特征在于,还包括:A straight turning EMLSOA chip bar testing machine includes a loading mechanism, a test bench (2), a first moving mechanism (6), a positioning mechanism and a feeding mechanism, and is characterized by:测试台(2)安装在所述第一移动机构(6)的驱动端上,所述第一移动机构(6)适于驱动所述测试台(2)在上料位置及测试位置之间进行移动;The test bench (2) is installed on the driving end of the first moving mechanism (6). The first moving mechanism (6) is suitable for driving the test bench (2) between the loading position and the testing position. move;检测机构(8),所述检测机构(8)包括探针组件和光信号接收单元(9),所述探针组件具有适于对bar条(3)上芯片打孔的打孔针(15)及至少一个适于对bar条(3)上芯片供电的检测针(13);Detection mechanism (8), the detection mechanism (8) includes a probe assembly and a light signal receiving unit (9), the probe assembly has a punching needle (15) suitable for punching holes in the chip on the bar bar (3) And at least one detection pin (13) suitable for supplying power to the chip on the bar bar (3);所述光信号接收单元(9)具有角度不同的两组,且每组所述光信号接收单元(9)适于接收所述检测针(13)对芯片供电后芯片发光点发出的光信号;The optical signal receiving unit (9) has two groups with different angles, and each group of the optical signal receiving unit (9) is adapted to receive the optical signal emitted by the chip's luminous point after the detection needle (13) supplies power to the chip;所述定位机构包括:推板(1),安装在第三移动机构(4)上,所述推板(1)适于与测试台(2)对应设置,所述第三移动机构(4)适于驱动所述推板(1)在测试台(2)所处的平面上方沿第一方向和/或第二方向进行移动,所述第一方向和第二方向互相垂直;The positioning mechanism includes: a push plate (1), which is installed on a third moving mechanism (4). The push plate (1) is suitable for being arranged corresponding to the test bench (2). The third moving mechanism (4) Suitable to drive the push plate (1) to move in the first direction and/or the second direction above the plane where the test bench (2) is located, and the first direction and the second direction are perpendicular to each other;所述推板(1)适于与bar条(3)接触的端部具有推动部(7)及位于推动部(7)两侧的拨动部(17),所述推动部(7)及两侧的拨动部(17)形成“凵”形凹槽。The end of the push plate (1) suitable for contact with the bar bar (3) has a pushing part (7) and a dialing part (17) located on both sides of the pushing part (7). The pushing part (7) and The dialing parts (17) on both sides form a "凵"-shaped groove.
- 根据权利要求1所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,所述检测针(13)具有两个。The straight-turn EMLSOA chip bar testing machine according to claim 1, characterized in that the detection needle (13) has two.
- 根据权利要求1所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,所述打孔针(15)的硬度高于所述检测针(13)的硬度。The straight-turn EMLSOA chip bar testing machine according to claim 1, characterized in that the hardness of the punching needle (15) is higher than the hardness of the detection needle (13).
- 根据权利要求1所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,还包括第二移动机构(14),所述打孔针(15)安装在所述第二移动机构(14)的驱动端上,所述第二移动机构(14)适于 驱动所述打孔针(15)对芯片进行打孔标记。The straight-turn EMLSOA chip bar testing machine according to claim 1, further comprising a second moving mechanism (14), and the punching needle (15) is installed on the second moving mechanism (14). ), the second moving mechanism (14) is adapted to drive the punching needle (15) to punch holes in the chip.
- 根据权利要求1所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,所述光信号接收单元(9)包括PD接收器和光纤接收器,分别适于接收芯片通电后发出的光信号。The straight-turn EMLSOA chip bar testing machine according to claim 1, characterized in that the optical signal receiving unit (9) includes a PD receiver and an optical fiber receiver, respectively adapted to receive the light emitted after the chip is powered on. Signal.
- 根据权利要求1所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,所述推板(1)上在两个拨动部(17)之间的位置开设有斜面,所述斜面朝向推板(1)的端部倾斜,且所述斜面在推板(1)的端部形成所述推动部(7)。The straight-turn EMLSOA chip bar testing machine according to claim 1, characterized in that the push plate (1) is provided with a slope between the two toggle parts (17), and the slope is It is inclined toward the end of the push plate (1), and the inclined surface forms the pushing portion (7) at the end of the push plate (1).
- 根据权利要求1所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,所述测试台(2)上开设有若干吸附孔,若干吸附孔呈一字排列,且所述吸附孔的排布方向与所述推板(1)的第一方向互相垂直。The straight-turning EMLSOA chip bar testing machine according to claim 1, characterized in that the test bench (2) is provided with a number of adsorption holes, and the plurality of adsorption holes are arranged in a straight line, and the adsorption holes are The arrangement direction is perpendicular to the first direction of the push plate (1).
- 根据权利要求7所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,所述测试台(2)上靠近吸附孔的侧边设有倒角。The straight-turn EMLSOA chip bar testing machine according to claim 7, characterized in that the side of the test bench (2) close to the adsorption hole is provided with chamfers.
- bar条检测方法,包括权利要求1-8中任一项所述的直向拐向EMLSOA芯片Bar条测试机,其特征在于,还包括以下步骤:The bar detection method includes the straight turning EMLSOA chip bar testing machine according to any one of claims 1 to 8, characterized in that it also includes the following steps:上料机构将bar条(3)输送至测试台(2)上;The loading mechanism transports the bar bar (3) to the test bench (2);定位机构调整bar条(3)在测试台(2)上的位置;The positioning mechanism adjusts the position of the bar bar (3) on the test bench (2);移动测试台(2)至检测位置,检测机构(8)对bar条(3)中单个芯片依次进行检测,其中,遇到不合格的芯片控制打孔针(15)对该芯片进行打孔标记;Move the test bench (2) to the detection position, and the detection mechanism (8) detects individual chips in the bar (3) in sequence. If an unqualified chip is encountered, the punching needle (15) controls the punching needle (15) to punch and mark the chip. ;取料机构将检测完的bar条(3)放置在收纳盒内,完成bar条(3)的检测。The picking mechanism places the inspected bar (3) in the storage box to complete the inspection of the bar (3).
Applications Claiming Priority (2)
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CN202210914529.9 | 2022-07-29 |
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CN110487513A (en) * | 2019-08-22 | 2019-11-22 | 福州中科光芯科技有限公司 | Bar item detection mechanism and its working method |
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