CN113299585A - Z-Theta combined device for wafer detection - Google Patents
Z-Theta combined device for wafer detection Download PDFInfo
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- CN113299585A CN113299585A CN202110845560.7A CN202110845560A CN113299585A CN 113299585 A CN113299585 A CN 113299585A CN 202110845560 A CN202110845560 A CN 202110845560A CN 113299585 A CN113299585 A CN 113299585A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N2033/0095—Semiconductive materials
Abstract
The application relates to the technical field of wafer detection, in particular to a Z-Theta combined device for wafer detection. The application provides a Z-Theta composite set includes: a base plate; the Z-axis module comprises a Z-axis load plate and a wedge-shaped Z-axis sliding block, the Z-axis sliding block is placed on the bottom plate, and the Z-axis load plate is arranged on the top inclined plane of the Z-axis sliding block in a sliding manner; the first driving device is used for driving the Z-axis sliding block to move along the bottom plate in the horizontal direction, and the Z-axis sliding block drives the Z-axis load plate to move along the vertical direction after moving horizontally; the T-axis module comprises a T-axis load plate arranged above the Z-axis load plate; the second driving device is used for driving the T-axis load board to rotate; the sucking disc is arranged above the T-axis load plate and used for placing a wafer, and a plurality of small holes are formed in the sucking disc; and one end of the ejector rod group is connected to the bottom plate, the other end of the ejector rod group penetrates through the Z-axis load plate and then extends into the small hole of the sucker, and the ejector rod group jacks up the wafer after the position of the sucker descends.
Description
Technical Field
The application relates to the technical field of wafer detection, in particular to a Z-Theta combined device for wafer detection.
Background
Various electronic devices, such as mobile phones, computers, televisions, air conditioners, and the like, which are common in daily life, all rely on the logic computation, storage, and sensing capabilities provided by various chips. The core of each chip is a chip, which is cut from wafers of various specifications. In order to prevent the chips with defects from flowing into the subsequent packaging process, the defects on the surface of the wafer need to be identified, classified and marked by detection equipment, so as to assist in sorting the chips.
When the wafer is detected, the position of the wafer is usually adjusted by adopting a Z-Theta device so as to be accurately positioned, the currently used device is formed by stacking an independent Z-axis module and a Theta-axis module, the Z-axis module and the Theta-axis module are superposed and matched, the structure is complex, and the positioning accuracy of the device is lower in the high-speed movement process. Therefore, it is necessary to provide a Z-Theta apparatus with compact structure and high positioning accuracy.
Disclosure of Invention
The embodiment of the application provides a Z-Theta combined device for wafer detection, and aims to solve the problems that an existing device in the related art is complex in structure and low in positioning accuracy.
In a first aspect, the present application provides a Z-Theta cluster tool for wafer inspection, comprising:
a base plate;
the Z-axis module comprises a Z-axis load plate and a wedge-shaped Z-axis sliding block, the Z-axis sliding block is placed on the bottom plate, and the Z-axis load plate is arranged on the top end inclined plane of the Z-axis sliding block in a sliding mode;
the first driving device is used for driving the Z-axis sliding block to move along the bottom plate in the horizontal direction, and the Z-axis sliding block drives the Z-axis load plate to move along the vertical direction after moving horizontally;
the T-axis module comprises a T-axis load plate, and the T-axis load plate is arranged above the Z-axis load plate;
the second driving device is used for driving the T-axis load plate to rotate;
the sucking disc is arranged above the T-axis load plate and used for placing a wafer, and a plurality of small holes are formed in the sucking disc;
and one end of the ejector rod group is connected to the bottom plate, the other end of the ejector rod group penetrates through the Z-axis load plate and then extends into the small hole of the sucker, and the ejector rod group jacks up the wafer after the position of the sucker descends.
In some embodiments, a piezoelectric ceramic is arranged between the T-axis load plate and the suction cup, and the piezoelectric ceramic deforms under the action of an electric field to drive the position of the suction cup to change; the deformation amount of the piezoelectric ceramic generated under the action of an electric field is very small and is not more than one ten-million of the size of the piezoelectric ceramic at most, and the minimum stepping of 10-90 micrometers of the Z-direction height of the wafer can be realized by means of the deformation amount of the piezoelectric ceramic.
In some embodiments, the left end of the bottom plate is connected with a first supporting plate, the right end of the first supporting plate is slidably connected with the left end of the Z-axis load plate through a first crossed roller bearing, the right end of the bottom plate is connected with a second supporting plate, and the left end of the second supporting plate is slidably connected with the right end of the Z-axis load plate through a second crossed roller bearing; the first crossed roller bearing and the second crossed roller bearing can effectively guarantee the straightness of the Z-axis load plate in the vertical lifting process.
In some embodiments, the first driving device comprises a servo motor and a first lead screw, the servo motor is arranged at the right end of the second supporting plate, the servo motor drives the first lead screw to move horizontally, and the first lead screw is connected with the right end of the Z-axis sliding block; the precision of the servo motor is high, the first lead screw is driven by the servo motor to move horizontally, and the wedge-shaped Z-axis sliding block converts the horizontal movement into vertical lifting, so that the positioning precision of the wafer with the Z-direction height of 0-15 mm can be realized.
In some embodiments, the second driving device includes a stepping motor and a second lead screw, the stepping motor is disposed at the left end of the first support plate, and the stepping motor drives the second lead screw to move horizontally.
In some embodiments, the second lead screw is connected with the left end of the T-axis load plate through a flexible hinge; the flexible hinge works by means of limited deformation of elastic sheets uniformly distributed in the radial direction of the circumference, and the linear motion of the second lead screw is converted into small-angle rotary motion of the T-axis load plate by the flexible hinge, so that complex structural combination is avoided.
In some embodiments, a mounting groove is formed in the top end of the Z-axis load plate, a third crossed roller bearing is mounted in the mounting groove, and the T-axis load plate is centrally mounted on the third crossed roller bearing; the third crossed roller bearing is directly installed in the Z-axis load plate, so that the height of the whole device is saved, and installation errors caused by assembly are eliminated; and the T-shaft load plate is directly arranged on the third crossed roller bearing, so that the T-shaft load plate has better axial run-out and end run-out.
In some embodiments, the bottom end of the Z-axis slider is mounted with a fourth cross roller bearing, the Z-axis slider is slidably connected with the bottom plate through the fourth cross roller bearing, the top end inclined surface of the Z-axis slider is mounted with a fifth cross roller bearing, and the Z-axis slider is slidably connected with the Z-axis load plate through the fifth cross roller bearing.
In some embodiments, the top bar group comprises three top bars, and the three top bars are uniformly distributed on the bottom plate.
In some embodiments, the bottom end of the suction cup is provided with a vacuum connection through which the suction cup is connected to a vacuum generator.
The beneficial effect that technical scheme that this application provided brought includes:
1. the Z-Theta combined device is compact in structure and high in positioning accuracy, horizontal displacement is converted into Z-direction lifting by the aid of the wedge-shaped Z-axis sliding block, and positioning accuracy of a wafer in the Z direction by 0-15 mm can be achieved;
2. the Z-Theta combined device integrates the Z-axis module and the T-axis module, so that the height of the whole device is saved, and the precision of the device in the high-speed movement process is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a front view of a Z-Theta cluster tool for wafer inspection according to an embodiment of the present disclosure;
fig. 2 is a top view of a Z-Theta cluster tool for wafer inspection according to an embodiment of the present disclosure.
In the figure: a bottom plate-1, a first supporting plate-11, a second supporting plate-12, a Z-axis module-2, a Z-axis load plate-21, a mounting groove-211, a Z-axis slide block-22, a first crossed roller bearing-23, a second crossed roller bearing-24, a third crossed roller bearing-212, a fourth crossed roller bearing-25, a fifth crossed roller bearing-26, a first driving device-3, a servo motor-31, a first lead screw-32, a T-axis module-4, a T-axis load plate-41, a second driving device-5, a stepping motor-51, a second lead screw-52, a flexible hinge-53, a suction cup-6, a wafer-61, a small hole-62, a vacuum joint-63, a push rod group-7, a push rod-71, piezoelectric ceramic-8 and a wafer manipulator fork-9.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a Z-Theta combined device for wafer detection, which can solve the problems of complex structure and low positioning accuracy of the existing device in the related art.
Fig. 1 is a front view of a Z-Theta integrated apparatus for wafer inspection according to an embodiment of the present disclosure, and referring to fig. 1 and 2, the Z-Theta integrated apparatus includes a base plate 1, a Z-axis module 2, a first driving device 3, a T-axis module 4, a second driving device 5, a chuck 6, a set of lift pins 7, and a piezoelectric ceramic 8.
The Z-axis module 2 comprises a Z-axis load plate 21 and a wedge-shaped Z-axis slide block 22, the Z-axis slide block 22 is placed on the bottom plate 1, the Z-axis load plate 21 is arranged on the top end slope of the Z-axis slide block 22 in a sliding manner, the end face of the matched connection of the Z-axis load plate 21 and the Z-axis slide block 22 is inclined, the length of the Z-axis load plate 21 is larger than that of the Z-axis slide block 22, so that the Z-axis slide block 22 can move in a gap formed between the Z-axis load plate 21 and the Z-axis slide block 22, the left end of the Z-axis load plate 21 is connected with the right end of the first supporting plate 11 in a sliding manner through a first crossed roller bearing 23, the right end of the Z-axis load plate 21 is connected with the left end of the second supporting plate 12 in a sliding manner through a second crossed roller bearing 24, the first crossed roller bearing 23 and the second crossed roller bearing 24 effectively ensure the straightness of the Z-axis load plate 21 during the vertical lifting, the top end of the Z-axis load plate 21 is provided with a mounting groove 211, a third crossed roller bearing 212 is arranged in the mounting groove 211; the bottom end of the Z-axis slider 22 is provided with a fourth crossed roller bearing 25, the Z-axis slider 22 is connected with the bottom plate 1 in a sliding way through the fourth crossed roller bearing 25, the top end inclined plane of the Z-axis slider 22 is provided with a fifth crossed roller bearing 26, and the Z-axis slider 22 is connected with the Z-axis load plate 21 in a sliding way through the fifth crossed roller bearing 26.
The first driving device 3 comprises a servo motor 31 and a first lead screw 32, the servo motor 31 is arranged at the right end of the second supporting plate 12, the servo motor 31 drives the first lead screw 32 to horizontally move after being started, and the first lead screw 32 is fixedly connected with the right end of the Z-axis sliding block 22.
The T-axis module 4 comprises a T-axis load plate 41, the T-axis load plate 41 is installed on the third cross roller bearing 212 in a centering mode, and the T-axis load plate 41 is directly installed on the third cross roller bearing 212, so that the T-axis load plate 41 has good axial run-out and end face run-out.
The second driving device 5 comprises a stepping motor 51 and a second lead screw 52, the stepping motor 51 is arranged at the left end of the first supporting plate 11, the stepping motor 51 drives the second lead screw 52 to move horizontally after being started, the second lead screw 52 is connected with the left end of the T-axis load plate 41 through a flexible hinge 53, the linear motion of the second lead screw 52 can be converted into the small-angle rotation motion of the T-axis load plate 41 through the flexible hinge 53, and the complex structural combination is avoided.
The sucking disc 6 is placed above the T-axis load plate 41 and used for placing a wafer 61, three small holes 62 are formed in the sucking disc 6, a vacuum joint 63 is arranged at the bottom end of the sucking disc 6, the sucking disc 6 is connected with a vacuum generator through the vacuum joint 63, and under the action of the vacuum generator, the sucking disc 6 generates suction or loses suction.
The ejector rod group 7 comprises three ejector rods 71, the three ejector rods 71 are uniformly distributed on the bottom plate 1, one end of each ejector rod 71 is fixedly connected with the bottom plate 1, the other end of each ejector rod 71 penetrates through the Z-axis load plate 21 and then extends into the small hole 62 in the suction cup 6, and the height of each ejector rod 71 meets the following requirements: when the Z-axis load board 21 descends to the lowest height, the mandril 71 can jack up the wafer 61; when the Z-axis load plate 21 rises to a certain height, the lift pins 71 do not protrude from the small holes 62, thereby avoiding the influence on the detection of the wafer 61.
The piezoelectric ceramic 8 is arranged between the T-axis load plate 41 and the sucker 6, the piezoelectric ceramic 8 can deform under the action of an external electric field, so that the position of the sucker 6 is driven to change, the deformation quantity generated by the piezoelectric ceramic 8 under the action of the electric field is very small, and the minimum stepping of the wafer 61Z with the height of 10-90 micrometers can be realized.
The working principle of the Z-Theta combined device provided by the application is as follows:
starting a servo motor 31 to drive a first lead screw 32 to horizontally move rightwards, driving a Z-axis slide block 22 to horizontally slide rightwards along a bottom plate 1 by driving the first lead screw 32 to move rightwards, driving a Z-axis load plate 21 to vertically slide downwards after the Z-axis slide block 22 slides rightwards, further driving a sucker 6 to move downwards, enabling the sucker 6 to lose suction by using a vacuum generator, and enabling an ejector rod 71 to jack up a wafer 61 upwards to deviate from the sucker 6 so as to enable a wafer manipulator tooth fork 9 to take and place the wafer; start servo motor 31 and drive first lead screw 32 level and remove left, first lead screw 32 removes left and drives Z axle slider 22 and slide left along bottom plate 1 level, Z axle slider 22 drives the vertical upwards slip of Z axle load board 21 after sliding left, and then drives sucking disc 6 rebound, utilize vacuum generator to make sucking disc 6 produce suction, under the effect of suction, wafer 61 adsorbs and detects on sucking disc 6, if the height of wafer 61 needs to finely tune, can start electric field and make piezoceramics 8 produce deformation and drive sucking disc 6 and take place less deformation.
When the position of the wafer 61 on the chuck 6 needs to be adjusted, the stepping motor 51 can be started to drive the second lead screw 52 to move horizontally, and under the action of the flexible hinge 53, the second lead screw 52 moves horizontally to drive the T-axis load plate 41 to rotate along the third crossed roller bearing 212, and the T-axis load plate 41 rotates to drive the chuck 6 to rotate.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A Z-Theta cluster tool for wafer inspection, comprising:
a base plate (1);
the Z-axis module (2) comprises a Z-axis load plate (21) and a wedge-shaped Z-axis slide block (22), the Z-axis slide block (22) is placed on the bottom plate (1), and the Z-axis load plate (21) is arranged on the top end inclined plane of the Z-axis slide block (22) in a sliding mode;
the first driving device (3) is used for driving the Z-axis sliding block (22) to move in the horizontal direction along the bottom plate (1), and the Z-axis sliding block (22) drives the Z-axis load plate (21) to move in the vertical direction after moving horizontally;
a T-axis module (4) comprising a T-axis load plate (41), the T-axis load plate (41) being disposed above the Z-axis load plate (21);
the second driving device (5) is used for driving the T-axis load plate (41) to rotate;
the sucking disc (6) is arranged above the T-axis load plate (41) and used for placing a wafer (61), and a plurality of small holes (62) are formed in the sucking disc (6);
and one end of the ejector rod group (7) is connected to the bottom plate (1), the other end of the ejector rod group penetrates through the Z-axis load plate (21) and then extends into the small hole (62) of the sucker (6), and the ejector rod group (7) jacks up the wafer (61) after the position of the sucker (6) is lowered.
2. The Z-Theta assembly apparatus for wafer inspection according to claim 1, wherein a piezoelectric ceramic (8) is disposed between the T-axis load plate (41) and the chuck (6), and the piezoelectric ceramic (8) deforms under the action of an electric field to drive the chuck (6) to change its position.
3. The Z-Theta combined device for wafer detection according to claim 1, wherein the left end of the base plate (1) is connected with a first supporting plate (11), the right end of the first supporting plate (11) is slidably connected with the left end of the Z-axis load plate (21) through a first crossed roller bearing (23), the right end of the base plate (1) is connected with a second supporting plate (12), and the left end of the second supporting plate (12) is slidably connected with the right end of the Z-axis load plate (21) through a second crossed roller bearing (24).
4. The Z-Theta combined device for wafer detection according to claim 3, wherein the first driving device (3) comprises a servo motor (31) and a first lead screw (32), the servo motor (31) is arranged at the right end of the second supporting plate (12), the servo motor (31) drives the first lead screw (32) to move horizontally, and the first lead screw (32) is connected with the right end of the Z-axis sliding block (22).
5. The Z-Theta combined device for wafer detection according to claim 3, wherein the second driving device (5) comprises a stepping motor (51) and a second lead screw (52), the stepping motor (51) is disposed at the left end of the first supporting plate (11), and the stepping motor (51) drives the second lead screw (52) to move horizontally.
6. The Z-Theta cluster tool for wafer inspection as set forth in claim 5, wherein the second lead screw (52) is connected to the left end of the T-axis load plate (41) through a flexible hinge (53).
7. The Z-Theta assembly apparatus for wafer inspection according to claim 1, wherein a mounting groove (211) is formed at the top end of the Z-axis load plate (21), a third cross roller bearing (212) is mounted in the mounting groove (211), and the T-axis load plate (41) is mounted on the third cross roller bearing (212).
8. The Z-Theta assembly apparatus for wafer inspection as claimed in claim 1, wherein the bottom end of the Z-axis slider (22) is mounted with a fourth crossed roller bearing (25), the Z-axis slider (22) is slidably connected with the base plate (1) through the fourth crossed roller bearing (25), the top end of the Z-axis slider (22) is mounted with a fifth crossed roller bearing (26), and the Z-axis slider (22) is slidably connected with the Z-axis load plate (21) through the fifth crossed roller bearing (26).
9. The Z-Theta assembly for wafer inspection according to claim 1, wherein the ejector rod set (7) includes three ejector rods (71), and the three ejector rods (71) are uniformly arranged on the bottom plate (1).
10. The Z-Theta combination apparatus for wafer inspection according to claim 1, wherein a vacuum connector (63) is provided at the bottom end of the suction cup (6), and the suction cup (6) is connected to a vacuum generator through the vacuum connector (63).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110845560.7A CN113299585B (en) | 2021-07-26 | 2021-07-26 | Z-Theta combined device for wafer detection |
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| CN202110845560.7A CN113299585B (en) | 2021-07-26 | 2021-07-26 | Z-Theta combined device for wafer detection |
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| US6244569B1 (en) * | 1998-12-21 | 2001-06-12 | Micron Electronics, Inc. | Controlled motion lift mechanism |
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| Publication number | Publication date |
|---|---|
| CN113299585B (en) | 2021-11-12 |
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