CN213813364U - Surface detection device for wafer - Google Patents
Surface detection device for wafer Download PDFInfo
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- CN213813364U CN213813364U CN202022281090.XU CN202022281090U CN213813364U CN 213813364 U CN213813364 U CN 213813364U CN 202022281090 U CN202022281090 U CN 202022281090U CN 213813364 U CN213813364 U CN 213813364U
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- screw rod
- direction screw
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Abstract
The utility model discloses a surface detection device for wafer, including the support that has the upper substrate, install test seat and the imaging module of movable mounting in the test seat top on the upper substrate, be located the test seat outside install one by the rotatory Y of motor drive to the lead screw on the upper surface of upper substrate, the suit is connected with a Y to the lead screw connecting plate on this Y to the nut on the lead screw, a sliding seat install in Y is to on the lead screw connecting plate, install one by the rotatory X of motor drive to the lead screw on the sliding seat, imaging module is connected with the suit in the X to the nut on the lead screw through a X to the lead screw connecting plate, the upper surface of upper substrate is located the test seat and is kept away from Y and installs one and Y to the guide rail of lead screw parallel arrangement to the outside of lead screw. The utility model discloses can realize the multi-parameter test to not unidimensional wafer, and easy operation, measuring accuracy height, test stability are good.
Description
Technical Field
The utility model relates to a semiconductor test technical field especially relates to a surface detection device for wafer.
Background
The semiconductor test includes cp (circuit probe) test, which is also called wafer test, and is the first step of the next packaging test of semiconductor devices, and aims to select out the bad chips in the wafer. Generally, a wafer refers to a silicon wafer used for manufacturing integrated circuits, and after all integrated circuits on the wafer are manufactured, the wafer includes a plurality of chips. Due to the nature of the production design or the material itself, the produced wafer may contain defective chips in addition to normal chips.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a surface detection device for wafer, this a surface detection device for wafer can realize the multi-parameter test to not unidimensional wafer, and easy operation, the measuring accuracy is high, test stability is good.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a surface detection device for a wafer comprises a support with an upper substrate, a test seat arranged on the upper substrate and an imaging module movably arranged above the test seat, wherein the test seat is arranged on the upper surface of the upper substrate;
a Y-direction screw rod driven by a motor to rotate is arranged on the upper surface of the upper base plate positioned outside the test seat, a Y-direction screw rod connecting plate is connected to a nut sleeved on the Y-direction screw rod, and a movable seat is arranged on the Y-direction screw rod connecting plate and can move along the Y direction along with the Y-direction screw rod connecting plate;
the movable seat is provided with an X-direction screw rod driven by a motor to rotate, and the imaging module is connected with a nut sleeved on the X-direction screw rod through an X-direction screw rod connecting plate, so that the imaging module can move along the X direction;
a guide rail parallel to the Y-direction screw rod is arranged on the upper surface of the upper base plate and on the outer side of the test seat far away from the Y-direction screw rod, the lower surface of one end of the movable seat is connected with a Y-direction screw rod connecting plate, and the lower surface of the other end of the movable seat is in sliding fit with the guide rail through a sliding block, so that the sliding block can move along the Y direction;
the Y-direction lead screw connecting plate comprises a base plate and side plates extending upwards from two ends of the base plate, the base plate is connected with a nut on the Y-direction lead screw, and the two side plates are fixed to the lower surface of the movable seat respectively.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the guide rail is a linear slide rail or a screw rod, and the slide block in sliding fit with the guide rail is a slide block embedded in the linear slide rail or a nut sleeved on the screw rod.
2. In the above scheme, a casing is arranged outside the support.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model is used for the surface detection device of wafer, it is through the mode of formation of image, can realize the multi-parameter test to different size wafers, and easy operation, the measuring accuracy is high, the test stability is good; in addition, a guide rail which is parallel to the Y-direction screw rod is arranged on the upper surface of the upper substrate and is positioned on the outer side of the test seat far away from the Y-direction screw rod, the lower surface of one end of the movable seat is connected with a connecting plate of the Y-direction screw rod, the lower surface of the other end of the movable seat is in sliding fit with the guide rail through a sliding block, so that the sliding block can move along the Y direction, and through the arrangement of the guide rail which is parallel to the Y-direction screw rod, the stability of the movable seat in the moving process along the Y direction is ensured, the test precision is ensured, and the service life of the device can be effectively prolonged; further, its Y includes the base plate to the feed screw connecting plate and from the curb plate that base plate both ends upwards extended, the base plate is connected with Y to the nut on the lead screw, two the curb plate respectively with the lower fixed surface of sliding seat, through the setting of two curb plates, further improved the stability of being connected between sliding seat and the driver part, and then guarantee the precision and the test stability of test.
Drawings
FIG. 1 is a schematic structural view of a surface inspection apparatus for a wafer according to the present invention;
fig. 2 is a schematic view of the internal structure of the surface inspection apparatus for wafer according to the present invention;
fig. 3 is a schematic partial structural view of a surface inspection apparatus for a wafer according to the present invention;
fig. 4 is a schematic partial structural diagram of the surface inspection apparatus for wafer according to the present invention.
In the above drawings: 1. an upper substrate; 3. a support; 4. a test seat; 5. an imaging module; 61. a Y-direction screw rod; 62. a Y-direction lead screw connecting plate; 621. a substrate; 622. a side plate; 7. a movable seat; 81. an X-direction screw rod; 82. an X-direction lead screw connecting plate; 9. a slide block.
Detailed Description
Example 1: a surface detection device for a wafer comprises a bracket 3 with an upper substrate 1, a test seat 4 arranged on the upper substrate 1 and an imaging module 5 movably arranged above the test seat 4, wherein the test seat 4 is arranged on the upper surface of the upper substrate 1;
a Y-direction screw rod 61 driven by a motor to rotate is arranged on the upper surface of the upper substrate 1 positioned outside the test seat 4, a Y-direction screw rod connecting plate 62 is connected to a nut sleeved on the Y-direction screw rod 61, and a movable seat 7 is arranged on the Y-direction screw rod connecting plate 62 and can move along the Y direction along with the Y-direction screw rod connecting plate 62;
an X-direction screw rod 81 driven by a motor to rotate is installed on the movable seat 7, and the imaging module 5 is connected with a nut sleeved on the X-direction screw rod 81 through an X-direction screw rod connecting plate 82, so that the imaging module 5 can move along the X direction;
a guide rail parallel to the Y-direction screw rod 61 is installed on the upper surface of the upper substrate 1 and on the outer side of the test seat 4 far away from the Y-direction screw rod 61, the lower surface of one end of the movable seat 7 is connected with a Y-direction screw rod connecting plate 62, and the lower surface of the other end of the movable seat 7 is in sliding fit with the guide rail through a sliding block 9, so that the sliding block 9 can move along the Y direction;
the Y-direction screw rod connecting plate 62 comprises a base plate 621 and side plates 622 extending upwards from two ends of the base plate 621, the base plate 621 is connected with nuts on the Y-direction screw rod 61, and the two side plates 622 are respectively fixed with the lower surface of the movable seat 7.
The guide rail is a linear slide rail, and the slide block 9 which is in slide fit with the guide rail is a slide block embedded in the linear slide rail.
Example 2: a surface detection device for a wafer comprises a bracket 3 with an upper substrate 1, a test seat 4 arranged on the upper substrate 1 and an imaging module 5 movably arranged above the test seat 4, wherein the test seat 4 is arranged on the upper surface of the upper substrate 1;
a Y-direction screw rod 61 driven by a motor to rotate is arranged on the upper surface of the upper substrate 1 positioned outside the test seat 4, a Y-direction screw rod connecting plate 62 is connected to a nut sleeved on the Y-direction screw rod 61, and a movable seat 7 is arranged on the Y-direction screw rod connecting plate 62 and can move along the Y direction along with the Y-direction screw rod connecting plate 62;
an X-direction screw rod 81 driven by a motor to rotate is installed on the movable seat 7, and the imaging module 5 is connected with a nut sleeved on the X-direction screw rod 81 through an X-direction screw rod connecting plate 82, so that the imaging module 5 can move along the X direction;
a guide rail parallel to the Y-direction screw rod 61 is installed on the upper surface of the upper substrate 1 and on the outer side of the test seat 4 far away from the Y-direction screw rod 61, the lower surface of one end of the movable seat 7 is connected with a Y-direction screw rod connecting plate 62, and the lower surface of the other end of the movable seat 7 is in sliding fit with the guide rail through a sliding block 9, so that the sliding block 9 can move along the Y direction;
the Y-direction screw rod connecting plate 62 comprises a base plate 621 and side plates 622 extending upwards from two ends of the base plate 621, the base plate 621 is connected with nuts on the Y-direction screw rod 61, and the two side plates 622 are respectively fixed with the lower surface of the movable seat 7.
The guide rail is a screw rod, and the sliding block 9 which is in sliding fit with the guide rail is a nut sleeved on the screw rod; the bracket 3 is externally provided with a casing.
When the surface detection device for the wafer is adopted, the multi-parameter test on the wafers with different sizes can be realized in an imaging mode, and the device is simple to operate, high in test precision and good in test stability; in addition, through the arrangement of the guide rail parallel to the Y-direction screw rod, the stability of the movable seat in the moving process along the Y direction and the testing precision are ensured, and the service life of the device can be effectively prolonged; furthermore, through the arrangement of the two side plates, the stability of connection between the movable seat and the driving part is further improved, and the testing precision and the testing stability are further ensured.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (3)
1. A surface detection device for a wafer is characterized in that: the device comprises a bracket (3) with an upper substrate (1), a test seat (4) arranged on the upper substrate (1) and an imaging module (5) movably arranged above the test seat (4), wherein the test seat (4) is arranged on the upper surface of the upper substrate (1);
a Y-direction screw rod (61) driven by a motor to rotate is mounted on the upper surface of the upper base plate (1) positioned on the outer side of the test seat (4), a Y-direction screw rod connecting plate (62) is connected to a nut sleeved on the Y-direction screw rod (61), and a movable seat (7) is mounted on the Y-direction screw rod connecting plate (62) and can move along the Y direction along with the Y-direction screw rod connecting plate (62);
an X-direction screw rod (81) driven by a motor to rotate is mounted on the movable seat (7), and the imaging module (5) is connected with a nut sleeved on the X-direction screw rod (81) through an X-direction screw rod connecting plate (82) so that the imaging module (5) can move along the X direction;
a guide rail parallel to the Y-direction screw rod (61) is installed on the outer side, away from the Y-direction screw rod (61), of the upper surface of the upper substrate (1) and located on the test seat (4), the lower surface of one end of the movable seat (7) is connected with the Y-direction screw rod connecting plate (62), and the lower surface of the other end of the movable seat (7) is in sliding fit with the guide rail through a sliding block (9), so that the sliding block (9) can move along the Y direction;
y is to lead screw connecting plate (62) including base plate (621) and from base plate (621) both ends curb plate (622) that upwards extends, base plate (621) are connected to the nut on Y to lead screw (61), two curb plate (622) are fixed with the lower surface of sliding seat (7) respectively.
2. The surface inspection apparatus for wafers as claimed in claim 1, wherein: the guide rail is a linear slide rail or a screw rod, and the sliding block (9) in sliding fit with the guide rail is a sliding block embedded into the linear slide rail or a nut sleeved on the screw rod.
3. The surface inspection apparatus for wafers as claimed in claim 1, wherein: and a shell is arranged outside the bracket (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022281090.XU CN213813364U (en) | 2020-10-14 | 2020-10-14 | Surface detection device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022281090.XU CN213813364U (en) | 2020-10-14 | 2020-10-14 | Surface detection device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213813364U true CN213813364U (en) | 2021-07-27 |
Family
ID=76957954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022281090.XU Active CN213813364U (en) | 2020-10-14 | 2020-10-14 | Surface detection device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213813364U (en) |
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2020
- 2020-10-14 CN CN202022281090.XU patent/CN213813364U/en active Active
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