CN213842937U

CN213842937U - Wafer wettability testing mechanism

Info

Publication number: CN213842937U
Application number: CN202022281038.4U
Authority: CN
Inventors: 赵智亮; 高开中; 王永平
Original assignee: Suzhou Yili Dingfeng Intelligent Technology Co ltd
Current assignee: Suzhou Yili Dingfeng Intelligent Technology Co ltd
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2021-07-30
Anticipated expiration: 2030-10-14

Abstract

The utility model discloses a moist accredited testing organization of wafer, including the support that has the upper substrate, install test seat and movable mounting on the upper substrate in the imaging module of test seat top, be located the test seat outside install a Y by motor drive rotation to the lead screw on the upper surface of upper substrate, the suit is connected with a Y to the lead screw connecting plate on this Y to the nut on the lead screw, a movable seat install in Y is to on the lead screw connecting plate, the test seat including install the base on the upper substrate with connect in the circular support plate of base upper end, circular support plate upper surface is opened has the ring channel portion that a plurality of set up with one heart, has a notch portion along radially inwards seting up on the side end face of this circular support plate. The utility model discloses both can guarantee the position precision of the examination wafer that awaits measuring at the support plate, can avoid the skew of wafer again, guarantee the measuring accuracy, still be convenient for get the damage of avoiding the wafer when putting the wafer.

Description

Wafer wettability testing mechanism

Technical Field

The utility model relates to a semiconductor test technical field especially relates to wafer wettability accredited testing organization.

Background

The semiconductor test includes cp (circuit probe) test, which is also called wafer test, and is the first step of the next packaging test of semiconductor devices, and aims to select out the bad chips in the wafer. Generally, a wafer refers to a silicon wafer used for manufacturing integrated circuits, and after all integrated circuits on the wafer are manufactured, the wafer includes a plurality of chips. Due to the nature of the production design or the material itself, the produced wafer may contain defective chips in addition to normal chips.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a moist accredited testing organization of wafer, this moist accredited testing organization of wafer both can guarantee the position precision of the examination wafer of awaiting measuring at the support plate, can avoid the skew of wafer again, guarantee the measuring accuracy, still be convenient for get the damage of avoiding the wafer when putting the wafer.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a wafer wettability testing mechanism comprises a support with an upper substrate, a testing seat mounted on the upper substrate and an imaging module movably mounted above the testing seat, wherein the testing seat is mounted on the upper surface of the upper substrate;

a Y-direction screw rod driven by a motor to rotate is arranged on the upper surface of the upper base plate positioned outside the test seat, a Y-direction screw rod connecting plate is connected to a nut sleeved on the Y-direction screw rod, and a movable seat is arranged on the Y-direction screw rod connecting plate and can move along the Y direction along with the Y-direction screw rod connecting plate;

the movable seat is provided with an X-direction screw rod driven by a motor to rotate, and the imaging module is connected with a nut sleeved on the X-direction screw rod through an X-direction screw rod connecting plate, so that the imaging module can move along the X direction;

the test seat comprises a base arranged on the upper base plate and a circular carrier plate connected to the upper end of the base, wherein the upper surface of the circular carrier plate is provided with a plurality of annular grooves which are concentrically arranged, and the side end surface of the circular carrier plate is provided with a notch part which is inwards opened along the radial direction.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, 4 annular grooves are arranged at equal intervals.

2. In the above solution, the test socket is mounted on the upper substrate to be movable up and down.

3. In the above scheme, a casing is arranged outside the support.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses wafer wettability testing mechanism, it is through the mode of formation of image, can realize the multi-parameter test to different size wafers, and easy operation, the test accuracy is high, test stability is good; in addition, the upper surface of the circular carrier plate is provided with a plurality of concentric annular grooves, and the side end surface of the circular carrier plate is provided with a notch part which is inwards arranged along the radial direction, so that the position precision of the wafer to be tested on the carrier plate can be ensured, the deviation of the wafer can be avoided, the testing precision is ensured, and the damage to the wafer is avoided while the wafer is conveniently taken and placed.

Drawings

FIG. 1 is a schematic structural diagram of a wafer wettability testing mechanism according to the present invention;

FIG. 2 is a schematic diagram of an internal structure of the wafer wettability testing mechanism of the present invention;

fig. 3 is a schematic partial structural diagram of a wafer wettability testing mechanism according to the present invention;

fig. 4 is a schematic partial structural diagram of the wafer wettability testing mechanism of the present invention.

In the above drawings: 1. an upper substrate; 3. a support; 4. a test seat; 5. an imaging module; 61. a Y-direction screw rod; 62. a Y-direction lead screw connecting plate; 7. a movable seat; 81. an X-direction screw rod; 82. an X-direction lead screw connecting plate; 10. a base; 11. a circular carrier plate; 121. an annular groove; 122. a notch part.

Detailed Description

Example 1: a wafer wettability testing mechanism comprises a bracket 3 with an upper substrate 1, a testing seat 4 arranged on the upper substrate 1 and an imaging module 5 movably arranged above the testing seat 4, wherein the testing seat 4 is arranged on the upper surface of the upper substrate 1;

a Y-direction screw rod 61 driven by a motor to rotate is arranged on the upper surface of the upper substrate 1 positioned outside the test seat 4, a Y-direction screw rod connecting plate 62 is connected to a nut sleeved on the Y-direction screw rod 61, and a movable seat 7 is arranged on the Y-direction screw rod connecting plate 62 and can move along the Y direction along with the Y-direction screw rod connecting plate 62;

an X-direction screw rod 81 driven by a motor to rotate is installed on the movable seat 7, and the imaging module 5 is connected with a nut sleeved on the X-direction screw rod 81 through an X-direction screw rod connecting plate 82, so that the imaging module 5 can move along the X direction;

the test socket 4 includes a base 10 mounted on the upper substrate 1 and a circular carrier 11 connected to the upper end of the base 10, the upper surface of the circular carrier 11 is provided with a plurality of concentric annular grooves 121, and a side end surface of the circular carrier 11 is provided with a notch 122 opened inward in the radial direction.

4 of the annular grooves 121 are arranged at equal intervals; the test socket 4 is mounted on the upper substrate 1 so as to be movable up and down.

Example 2: a wafer wettability testing mechanism comprises a bracket 3 with an upper substrate 1, a testing seat 4 arranged on the upper substrate 1 and an imaging module 5 movably arranged above the testing seat 4, wherein the testing seat 4 is arranged on the upper surface of the upper substrate 1;

4 of the annular grooves 121 are arranged at equal intervals; the bracket 3 is externally provided with a casing.

When the wafer wettability testing mechanism is adopted, multi-parameter testing on wafers of different sizes can be realized in an imaging mode, and the wafer wettability testing mechanism is simple to operate, high in testing precision and good in testing stability;

in addition, the position accuracy of the wafer to be tested on the carrier plate can be ensured, the wafer can be prevented from shifting, the testing accuracy is ensured, and the wafer is prevented from being damaged while the wafer is conveniently taken and placed.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A wafer wettability testing mechanism is characterized in that: the device comprises a bracket (3) with an upper substrate (1), a test seat (4) arranged on the upper substrate (1) and an imaging module (5) movably arranged above the test seat (4), wherein the test seat (4) is arranged on the upper surface of the upper substrate (1);

a Y-direction screw rod (61) driven by a motor to rotate is mounted on the upper surface of the upper base plate (1) positioned on the outer side of the test seat (4), a Y-direction screw rod connecting plate (62) is connected to a nut sleeved on the Y-direction screw rod (61), and a movable seat (7) is mounted on the Y-direction screw rod connecting plate (62) and can move along the Y direction along with the Y-direction screw rod connecting plate (62);

an X-direction screw rod (81) driven by a motor to rotate is mounted on the movable seat (7), and the imaging module (5) is connected with a nut sleeved on the X-direction screw rod (81) through an X-direction screw rod connecting plate (82) so that the imaging module (5) can move along the X direction;

the test seat (4) comprises a base (10) arranged on the upper base plate (1) and a circular carrier plate (11) connected to the upper end of the base (10), wherein the upper surface of the circular carrier plate (11) is provided with a plurality of concentric annular grooves (121), and the side end surface of the circular carrier plate (11) is provided with a notch part (122) which is inwards opened along the radial direction.

2. The wafer wettability testing mechanism according to claim 1, wherein: 4 annular grooves (121) are arranged at equal intervals.

3. The wafer wettability testing mechanism according to claim 1, wherein: the test seat (4) can be mounted on the upper substrate (1) in a vertically movable manner.

4. The wafer wettability testing mechanism according to claim 1, wherein: and a shell is arranged outside the bracket (3).