CN213842990U

CN213842990U - Automatic change testing arrangement

Info

Publication number: CN213842990U
Application number: CN202022282225.4U
Authority: CN
Inventors: 赵智亮; 高开中; 王永平
Original assignee: Suzhou Yili Dingfeng Intelligent Technology Co ltd
Current assignee: Suzhou Yili Dingfeng Intelligent Technology Co ltd
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2021-07-30
Anticipated expiration: 2030-10-14

Abstract

The utility model discloses an automatic change testing arrangement, including the support that has the upper substrate, install test seat and the imaging module of movable mounting in the test seat top on the upper substrate, be located the test seat outside install one by the rotatory Y of motor drive to the lead screw on the upper surface of upper substrate, install one by the rotatory X of motor drive to the lead screw on the sliding seat, the test seat is including installing the base on the upper substrate and connecting in the circular support plate of base upper end, the ring channel that has the concentric setting of a plurality of is opened to circular support plate upper surface, imaging module includes the supporting seat of being connected to the lead screw connecting plate with X and installs camera lens, the light source on the supporting seat, the light source is installed in the below that the camera lens is close to test seat one end, the camera lens is kept away from one of test seat and is served and is installed a camera. The utility model discloses guarantee the definition and the precision of formation of image, and then guaranteed the precision to the wafer test.

Description

Automatic change testing arrangement

Technical Field

The utility model relates to a semiconductor test technical field especially relates to automatic testing arrangement.

Background

The semiconductor test includes cp (circuit probe) test, which is also called wafer test, and is the first step of the next packaging test of semiconductor devices, and aims to select out the bad chips in the wafer. Generally, a wafer refers to a silicon wafer used for manufacturing integrated circuits, and after all integrated circuits on the wafer are manufactured, the wafer includes a plurality of chips. Due to the nature of the production design or the material itself, the produced wafer may contain defective chips in addition to normal chips.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an automatic change testing arrangement, this automatic change testing arrangement has guaranteed the definition and the precision of formation of image, and then guarantees the precision to wafer test.

In order to achieve the above purpose, the utility model adopts the technical scheme that: an automatic testing device comprises a bracket with an upper substrate, a testing seat arranged on the upper substrate and an imaging module movably arranged above the testing seat, wherein the testing seat is arranged on the upper surface of the upper substrate;

a Y-direction screw rod driven by a motor to rotate is arranged on the upper surface of the upper base plate positioned outside the test seat, a Y-direction screw rod connecting plate is connected to a nut sleeved on the Y-direction screw rod, and a movable seat is arranged on the Y-direction screw rod connecting plate and can move along the Y direction along with the Y-direction screw rod connecting plate;

the movable seat is provided with an X-direction screw rod driven by a motor to rotate, and the imaging module is connected with a nut sleeved on the X-direction screw rod through an X-direction screw rod connecting plate, so that the imaging module can move along the X direction;

the test seat comprises a base arranged on the upper base plate and a circular carrier plate connected to the upper end of the base, wherein the upper surface of the circular carrier plate is provided with a plurality of concentrically arranged annular grooves, and the side end surface of the circular carrier plate is provided with a notch part which is inwards opened along the radial direction;

the imaging module comprises a supporting seat connected with the X-direction lead screw connecting plate, and a lens and a light source which are arranged on the supporting seat, wherein the light source is arranged below one end, close to the test seat, of the lens, and one end, far away from the test seat, of the lens is provided with a camera.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the support seat is an L-shaped support seat, the lower surface of the L-shaped support seat is connected with the X-direction lead screw connecting plate, and the lens and the light source are mounted on the side surface of the L-shaped support seat.

2. In the above scheme, the camera is a CCD camera, the lens is a telecentric lens, and the light source is an annular light source.

3. In the above scheme, 4 annular grooves are arranged at equal intervals.

4. In the above solution, the test socket is mounted on the upper substrate to be movable up and down.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

1. the utility model discloses automatic testing arrangement, it is through the mode of formation of image, can realize the multi-parameter test to different size wafers, and easy operation, the test accuracy is high, test stability is good; in addition, the upper surface of the circular carrier plate is provided with a plurality of concentric annular grooves, and the side end surface of the circular carrier plate is provided with a notch part which is inwards arranged along the radial direction, so that the position precision of the wafer to be tested on the carrier plate can be ensured, the deviation of the wafer can be avoided, the testing precision is ensured, and the damage to the wafer is avoided while the wafer is conveniently taken and placed.

2. The utility model discloses automatic change testing arrangement, its imaging module include with X to the supporting seat that the lead screw connecting plate is connected with install camera lens, the light source on the supporting seat, the light source is installed in the below that the camera lens is close to test seat one end, the camera lens is kept away from one of test seat and is served and install a camera, has guaranteed the definition and the precision of formation of image, and then guarantees the precision to the wafer test.

Drawings

FIG. 1 is a schematic structural view of the automatic testing device of the present invention;

FIG. 2 is a schematic diagram of an internal structure of the automatic testing device of the present invention;

FIG. 3 is a schematic diagram of the internal structure of the automatic testing device of the present invention;

FIG. 4 is a schematic view of a partial structure of the automatic testing device of the present invention;

fig. 5 is a schematic diagram of a local structure of the automatic testing device of the present invention.

In the above drawings: 1. an upper substrate; 3. a support; 4. a test seat; 5. an imaging module; 61. a Y-direction screw rod; 62. a Y-direction lead screw connecting plate; 7. a movable seat; 81. an X-direction screw rod; 82. an X-direction lead screw connecting plate; 10. a base; 11. a circular carrier plate; 121. an annular groove; 122. a notch part; 13. a supporting seat; 14. a lens; 15. a light source; 16. a camera.

Detailed Description

Example 1: an automatic testing device comprises a bracket 3 with an upper substrate 1, a testing seat 4 arranged on the upper substrate 1 and an imaging module 5 movably arranged above the testing seat 4, wherein the testing seat 4 is arranged on the upper surface of the upper substrate 1;

a Y-direction screw rod 61 driven by a motor to rotate is arranged on the upper surface of the upper substrate 1 positioned outside the test seat 4, a Y-direction screw rod connecting plate 62 is connected to a nut sleeved on the Y-direction screw rod 61, and a movable seat 7 is arranged on the Y-direction screw rod connecting plate 62 and can move along the Y direction along with the Y-direction screw rod connecting plate 62;

an X-direction screw rod 81 driven by a motor to rotate is installed on the movable seat 7, and the imaging module 5 is connected with a nut sleeved on the X-direction screw rod 81 through an X-direction screw rod connecting plate 82, so that the imaging module 5 can move along the X direction;

the test socket 4 comprises a base 10 mounted on the upper substrate 1 and a circular carrier plate 11 connected to the upper end of the base 10, the upper surface of the circular carrier plate 11 is provided with a plurality of concentrically arranged annular grooves 121, and the side end surface of the circular carrier plate 11 is provided with a notch part 12 which is opened inwards along the radial direction;

the imaging module 5 comprises a supporting seat 13 connected with the X-direction lead screw connecting plate 82, and a lens 14 and a light source 15 which are installed on the supporting seat 13, wherein the light source 15 is installed below one end, close to the test seat 4, of the lens 14, and a camera 16 is installed at one end, far away from the test seat 4, of the lens 14.

The support base 13 is an L-shaped support base, the lower surface of which is connected to the X-direction lead screw connection plate 82, and the lens 14 and the light source 15 are mounted on the side surface of the L-shaped support base.

Example 2: an automatic testing device comprises a bracket 3 with an upper substrate 1, a testing seat 4 arranged on the upper substrate 1 and an imaging module 5 movably arranged above the testing seat 4, wherein the testing seat 4 is arranged on the upper surface of the upper substrate 1;

The camera 16 is a CCD camera, the lens 14 is a telecentric lens, and the light source 15 is an annular light source; 4 of the annular grooves 121 are arranged at equal intervals; the test socket 4 is mounted on the upper substrate 1 so as to be movable up and down.

When the automatic testing device is adopted, multi-parameter testing on wafers with different sizes can be realized in an imaging mode, and the automatic testing device is simple to operate, high in testing precision and good in testing stability; in addition, the position accuracy of the wafer to be tested on the carrier plate can be ensured, the wafer can be prevented from shifting, the testing accuracy is ensured, and the damage to the wafer is avoided while the wafer is convenient to take and place; in addition, the definition and the precision of imaging are ensured, and the precision of wafer testing is further ensured.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. An automatic change testing arrangement which characterized in that: the device comprises a bracket (3) with an upper substrate (1), a test seat (4) arranged on the upper substrate (1) and an imaging module (5) movably arranged above the test seat (4), wherein the test seat (4) is arranged on the upper surface of the upper substrate (1);

a Y-direction screw rod (61) driven by a motor to rotate is mounted on the upper surface of the upper base plate (1) positioned on the outer side of the test seat (4), a Y-direction screw rod connecting plate (62) is connected to a nut sleeved on the Y-direction screw rod (61), and a movable seat (7) is mounted on the Y-direction screw rod connecting plate (62) and can move along the Y direction along with the Y-direction screw rod connecting plate (62);

an X-direction screw rod (81) driven by a motor to rotate is mounted on the movable seat (7), and the imaging module (5) is connected with a nut sleeved on the X-direction screw rod (81) through an X-direction screw rod connecting plate (82) so that the imaging module (5) can move along the X direction;

the test seat (4) comprises a base (10) arranged on the upper base plate (1) and a circular carrier plate (11) connected to the upper end of the base (10), the upper surface of the circular carrier plate (11) is provided with a plurality of concentrically arranged annular grooves (121), and the side end surface of the circular carrier plate (11) is provided with a notch part (122) which is inwards opened along the radial direction;

imaging module (5) include with X to supporting seat (13) that lead screw connecting plate (82) are connected with install camera lens (14), light source (15) on supporting seat (13), light source (15) are installed in camera lens (14) and are close to the below of test seat (4) one end, camera (16) are installed to one of test seat (4) is kept away from in camera lens (14).

2. The automated testing apparatus of claim 1, wherein: the support seat (13) is an L-shaped support seat, the lower surface of the L-shaped support seat is connected with an X-direction screw rod connecting plate (82), and the lens (14) and the light source (15) are installed on the side surface of the L-shaped support seat.

3. The automated testing apparatus of claim 1, wherein: the camera (16) is a CCD camera, the lens (14) is a telecentric lens, and the light source (15) is an annular light source.

4. The automated testing apparatus of claim 1, wherein: 4 annular grooves (121) are arranged at equal intervals.

5. The automated testing apparatus of claim 1, wherein: the test seat (4) can be mounted on the upper substrate (1) in a vertically movable manner.