CN210925974U

CN210925974U - Wafer transfer device

Info

Publication number: CN210925974U
Application number: CN202020059001.4U
Authority: CN
Inventors: 陈雅德
Original assignee: Wuxi Bailinde Machinery Equipment Co ltd
Current assignee: Wuxi Bailinde Machinery Equipment Co ltd
Priority date: 2020-01-10
Filing date: 2020-01-10
Publication date: 2020-07-03
Anticipated expiration: 2030-01-10

Abstract

The utility model provides a device is put in wafer transposition, comprising a base plate, install first transposition box on the bottom plate, place the wafer that remains the transposition in the first transposition box, be close to one side of first transposition box on the bottom plate and install second transposition box, first transposition box and second transposition box interconnect are in the same place, sliding assembly is installed to the bottom of bottom plate, and sliding assembly can make a round trip to slide along length direction in the bottom of bottom plate, and the last installation of sliding assembly pushes away the handle, pushes away and installs adjustable fender on the handle, and adjustable fender's one end articulates and pushes away on the handle, and adjustable fender can stand and be pushing away on the handle, also can the level and fall. Through the utility model discloses, poor to the accuracy that traditional wafer transfer device wafer that solves prior art existence shifted, push away partial problem easily.

Description

Wafer transfer device

Technical Field

The utility model relates to a wafer transfer frock, concretely relates to wafer transfer device.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. During wafer processing, various processing operations are required to be performed on the wafer. Wafers need to be converted in different loading boxes for many times in the production process, one box of wafers needs to be orderly transferred to the other loading box, and the process is complicated; the traditional transfer method is difficult to accurately and effectively assemble the wafer to the target position, has the condition of deviation pushing and is low in efficiency; in addition, because the sizes of the wafers with different specifications are different, the specifications of the wafer loading boxes are different, and the traditional wafer transposition device can only correspond to the transposition box with one specification, cannot adapt to the loading boxes with different specifications, and is poor in practicability.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer transfer device to the accuracy that traditional wafer transfer device wafer that solves prior art existence shifted is poor, pushes away partial problem easily.

In order to solve the technical problem, the utility model provides a device is put in wafer transposition, comprising a base plate, install first transposition box on the bottom plate, place the wafer that remains the transposition in the first transposition box, one side that is close to first transposition box on the bottom plate installs the second transposition box, and first transposition box and second transposition box interconnect are in the same place, sliding assembly is installed to the bottom of bottom plate, and sliding assembly can make a round trip to slide along length direction in the bottom of bottom plate, and the last installation of sliding assembly pushes away the handle, pushes away and installs adjustable fender on the handle, and adjustable fender's one end articulates on pushing away the handle, and adjustable fender can stand and push away on the handle, also can the level fall.

Further, the first transposing box and the second transposing box are fixed on the bottom plate through the positioning plate.

Furthermore, one end of the upper edge of the push handle is of a groove structure.

Furthermore, the sliding assembly comprises a sliding block, a sliding groove is formed in the bottom of the bottom plate, a part of the sliding block is clamped in the sliding groove, and one end of the pushing handle is fixedly connected with the sliding block.

Furthermore, a supporting plate is hinged to the middle position of the movable baffle plate, one end of the supporting plate is hinged to the movable baffle plate, and the other end of the supporting plate can abut against the groove of the pushing handle.

Furthermore, the bottom plate is provided with a mounting hole.

The utility model discloses the beneficial effect who brings: the wafer transposition device of the utility model has the advantages that the pushing handle is driven by the sliding component to regularly move on the bottom plate, the movable baffle is arranged on the pushing handle, and the wafer can be transferred from one transposition box to another transposition box, so that the accuracy of wafer transfer is greatly improved, the thrust deviation is effectively prevented, and the efficiency is greatly improved; the movable baffle plate can be conveniently switched between standing and falling, the same device can adapt to wafer loading boxes with two specifications, and the adaptability is high.

Drawings

Fig. 1 is a schematic structural diagram of a wafer transposing apparatus according to the present invention.

The device comprises a base plate 1, a first transposing box 2, a wafer 3, a push handle 4, a movable baffle 5, a sliding assembly 6, a positioning plate 7, a second transposing box 8 and a supporting plate 9.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1, the utility model provides a device is put to wafer transposition, including bottom plate 1, install first transposition box 2 on the bottom plate 1, place the wafer 3 of treating the transposition in the first transposition box 2, be close to one side of first transposition box on the bottom plate and install second transposition box 8, first transposition box and second transposition box interconnect are in the same place, sliding assembly 6 is installed to the bottom of bottom plate 1, and sliding assembly can make a round trip to slide along length direction in the bottom of bottom plate, and the last installation of sliding assembly pushes away 4, pushes away and installs adjustable fender 5 on the handle, and adjustable fender 5's one end articulates on pushing away the handle, and adjustable fender can stand and be pushing away on the handle, also can the level and fall.

Further, the first transposing box 2 and the second transposing box 8 are fixed on the bottom plate through the positioning plate 7, hole sites in different positions are arranged on the bottom plate, the positioning plate 7 is matched with the hole sites to fix the device box on the bottom plate, and the loading boxes in different specifications can be conveniently positioned through the plurality of hole sites arranged on the bottom plate.

The upper edge one end of the push handle 4 is of a groove structure, and the push handle 4 can slide back and forth along the length direction at the bottom of the bottom plate under the driving of the sliding assembly.

The sliding assembly 6 comprises a sliding block, a sliding groove is formed in the bottom of the bottom plate, a part of the sliding block is clamped in the sliding groove, and one end of the push handle 4 is fixedly connected with the sliding block.

The middle position of the movable baffle plate 5 is hinged with a supporting plate 9, one end of the supporting plate is hinged on the movable baffle plate, the other end of the supporting plate can be propped against the groove of the pushing handle, when the other end of the supporting plate is propped against the pushing handle, the movable baffle plate can be upright, and when the supporting plate is folded, the movable baffle plate can be horizontally laid. The movable baffle is horizontally placed and laid down, so that the transshipment requirements of loading boxes with different specifications are met.

The bottom plate is provided with mounting holes so as to be convenient for mounting the bottom plate at different stations.

In the utility model, the pushing handle is fixed on the slideway component, and the slideway component can slide back and forth along the length direction at the bottom of the bottom plate; when the movable baffle is upright, the wafer with larger specification can be transferred; when the movable baffle is laid down, the smaller wafers can be transferred; the positioning plate is used for positioning the loading boxes, and a plurality of hole sites are arranged on the bottom plate so as to adapt to the loading boxes with two specifications.

To sum up, the wafer transposing device of the present invention, driven by the sliding assembly, can move regularly on the bottom plate, and the movable baffle is installed on the pushing handle, so that the wafer can be transferred from one transposing box to another transposing box, the accuracy of wafer transfer is greatly improved, the deviation of thrust is effectively prevented, and the efficiency is greatly improved; the movable baffle plate can be conveniently switched between standing and falling, the same device can adapt to wafer loading boxes with two specifications, and the adaptability is high.

The above description is only an example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The wafer transferring device is characterized by comprising a bottom plate (1), wherein a first transferring box (2) is installed on the bottom plate (1), a wafer (3) to be transferred is placed in the first transferring box (2), a second transferring box (8) is installed on one side, close to the first transferring box, of the bottom plate, the first transferring box and the second transferring box are connected together, a sliding assembly (6) is installed at the bottom of the bottom plate (1), the sliding assembly can slide back and forth along the length direction at the bottom of the bottom plate, a pushing handle (4) is installed on the sliding assembly, a movable baffle (5) is installed on the pushing handle, one end of the movable baffle (5) is hinged to the pushing handle, and the movable baffle can be vertically arranged on the pushing handle and also can be horizontally placed.

2. The wafer transposing apparatus according to claim 1, wherein the first transposing cassette (2) and the second transposing cassette (8) are fixed to the base plate by a positioning plate (7).

3. The wafer transposing apparatus of claim 1, wherein an end of the upper edge of the pushing handle (4) is a groove structure.

4. The wafer transposing apparatus according to claim 1, wherein the slide assembly (6) includes a slide block, a slide groove is formed in a bottom of the base plate, a portion of the slide block is engaged with the slide groove, and one end of the handle (4) is fixedly connected to the slide block.

5. A wafer transposing apparatus as claimed in claim 3 wherein the movable plate (5) is hinged at its middle position to a support plate (9), one end of the support plate is hinged to the movable plate, and the other end can abut against the recess of the pushing handle.

6. The apparatus of claim 1, wherein the base plate has mounting holes.