CN116805609B - Multi-finger wafer carrying manipulator - Google Patents
Multi-finger wafer carrying manipulator Download PDFInfo
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- CN116805609B CN116805609B CN202311050315.2A CN202311050315A CN116805609B CN 116805609 B CN116805609 B CN 116805609B CN 202311050315 A CN202311050315 A CN 202311050315A CN 116805609 B CN116805609 B CN 116805609B
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- finger
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- 235000012431 wafers Nutrition 0.000 claims abstract description 76
- 238000009434 installation Methods 0.000 abstract description 11
- 239000011295 pitch Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 101100014158 Caenorhabditis elegans rack-1 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Abstract
The application provides a multi-finger wafer carrying manipulator, which comprises: the device comprises a mounting frame, a finger connecting piece and a joint connecting piece; the mounting bracket includes: a base and a side plate; the base and the side plates enclose a box-shaped space; the finger connector is arranged in the mounting frame; a plurality of finger connecting positions are arranged on one side of the finger connecting piece; the distance between the finger connection positions in the vertical direction is a first preset distance; the joint connector is arranged at the bottom of the mounting frame and used for connecting the mounting frame and the mechanical arm. The multi-finger wafer carrying manipulator provided by the application can be connected with a plurality of wafer fingers to clamp wafers, so that the working efficiency is improved; the finger connecting positions are directly arranged on the finger connecting pieces, so that the distance between the finger connecting positions is fixed, and the stability of clamping the wafer at the fixed station is improved; the finger connection position is provided with a positioning flange and a finger positioning hole, so that the wafer finger installation accuracy is improved.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing equipment, in particular to a multi-finger wafer carrying manipulator.
Background
A wafer handling robot is a device for handling wafers in a semiconductor manufacturing process. Since the wafer is required to be transferred between stations in the semiconductor manufacturing process, the transfer accuracy and the number of single transfers during the transfer process may affect the yield of the wafer.
In the prior art, there has been a technical solution that uses a combination of a plurality of robots, and combines stepless pitch variation between the robots to achieve the effects of improving the number of single transfers of wafers and flexible use, such as a robot for semiconductor described in the prior patent CN 110223948A.
However, for the above prior art solution, although the solution has the advantage of being able to adapt to the process requirements of carrying different wafers in the semiconductor industry, because the distance between the manipulators is variable, when the wafers are transported, the distance between the manipulators must be adjusted in advance to correspond to the distance between the wafers on the station, so that the precision requirement is extremely high, otherwise, the wafers are damaged during the transportation process; at the same time, since the spacing between the manipulators is adjusted by the relevant mechanical structure, the maintenance requirements for the equipment are extremely high with such high precision requirements.
Disclosure of Invention
The multi-finger wafer carrying manipulator provided by the application can be used for arranging a plurality of finger connecting positions on the finger connecting piece, and the operation of adjusting the spacing of wafer fingers in the wafer transferring process is avoided by utilizing the multi-finger connecting piece with the fixed structure, so that the technical problem in the prior art can be solved.
The technical scheme for solving the technical problems is as follows:
the application provides a multi-finger wafer carrying manipulator, which comprises: the device comprises a mounting frame, a finger connecting piece and a joint connecting piece;
the mounting bracket includes: a base and a side plate; the base and the side plates enclose a box-shaped space;
the finger connector is arranged in the mounting frame; a plurality of finger connecting positions are arranged on one side of the finger connecting piece; the distance between the finger connection positions in the vertical direction is a first preset distance;
the joint connector is arranged at the bottom of the mounting frame and used for connecting the mounting frame and the mechanical arm.
In some embodiments, the base comprises: a side plate positioning groove;
the side plate positioning grooves are formed in two sides of the base; the side plate can be fixed with the base along the side plate positioning groove.
In some embodiments, the base further comprises: a joint positioning hole; the joint locating hole is arranged at the bottom of the base and is used for connecting the joint connecting piece.
In some embodiments, positioning blocks are arranged on two sides of the finger connecting piece, and finger connecting piece positioning grooves are formed in the inner wall of the side plate; the finger connecting piece can be fixed on the inner wall of the side plate through the matching of the positioning block and the finger connecting piece positioning groove.
In some embodiments, the finger attachment site is open on a side of the finger attachment member perpendicular to the side plate.
In some embodiments, positioning flanges are arranged on two sides of the finger connection position and used for positioning the mounting position of the wafer finger when the wafer finger is mounted; the interval between the positioning flanges is a second preset interval.
In some embodiments, a finger positioning hole is formed at the top of the finger connection position for installing a wafer finger; the spacing and the number of the finger positioning holes correspond to those of the mounting holes arranged on the wafer finger mounting part.
In some embodiments, the first predetermined pitch is equal to a pitch of the wafer at the station.
The beneficial effects of the application are as follows:
the multi-finger wafer carrying manipulator provided by the application has the advantages that 1, a plurality of wafer fingers can be connected to clamp the wafer, so that the working efficiency is improved; 2. the finger connecting positions are directly arranged on the finger connecting pieces, so that the distance between the finger connecting positions is fixed, and the stability of clamping the wafer at the fixed station is improved; 3. the finger connection position is provided with a positioning flange and a finger positioning hole, so that the accuracy of the wafer during finger installation is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present application;
FIG. 2 is a front view of the present application;
FIG. 3 is a side view of the present application;
FIG. 4 is a cross-sectional view taken along the direction A-A in FIG. 3;
FIG. 5 is a schematic view of the finger attachment of the present application.
Reference numerals illustrate:
a mounting rack-1; a base-11; joint positioning hole-111; a side plate-12; finger connector-2; finger connection site-21; positioning a flange-211; finger positioning holes-212; a positioning block-22; an articulation joint-3; wafer finger-4.
Detailed Description
The principles and features of the present application are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the application and are not to be construed as limiting the scope of the application.
In order that the above-recited objects, features and advantages of the present application can be more clearly understood, a more particular description of the application will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be understood that the depicted embodiments are some, but not all, embodiments of the present application. The specific embodiments described herein are to be considered in an illustrative rather than a restrictive sense. All other embodiments, which are obtained by a person skilled in the art based on the described embodiments of the application, fall within the scope of protection of the application.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Fig. 1 is a schematic structural view of the present application.
Referring to fig. 1, a multi-finger wafer handling robot includes: a mounting frame 1, a finger connector 2 and a joint connector 3;
the mounting frame 1 comprises: a base 11 and a side plate 12; the base 11 and the side plates 12 enclose a box-shaped space;
the finger connection piece 2 is arranged in the mounting frame 1; a plurality of finger connecting positions 21 are formed on one side of the finger connecting piece 2; the distance between the finger connection positions 21 in the vertical direction is a first preset distance;
the joint connector 3 is installed at the bottom of the installation frame 1 and is used for connecting the installation frame 1 and the mechanical arm.
Specifically, the multi-finger wafer handling manipulator of the present embodiment includes a mounting frame 1, a finger connecting piece 2 and a joint connecting piece 3, wherein the finger connecting piece 2 is used as a connecting piece for mounting a wafer finger 4, and can be fixed in a box space surrounded by a base 11 and a side plate 12 of the mounting frame 1, and the wafer finger 4 can be fixedly mounted on a plurality of finger connecting positions 21 formed on one side of the finger connecting piece 2. The articulation link 3 can then be mounted on the bottom of the base 11, thereby connecting the mechanical arm to power the mounting 1 and the finger link 2 via the mechanical arm. It should be noted that, the distance between the adjacent finger connection positions 21 in the vertical direction is a first preset distance set according to actual needs, and the positions of the finger connection positions 21 may be staggered or may be in-line arranged, where the finger connection positions 21 are more convenient for mounting or adjusting the wafer fingers 4 when the lateral surfaces of the finger connection members 2 are staggered.
In some embodiments, the base 11 comprises: a side plate positioning groove;
the side plate positioning grooves are formed in two sides of the base 11; the side plate 12 can be fixed to the base 11 along the side plate positioning groove.
Specifically, in order to be convenient for this scheme dismouting on overall structure, design mounting bracket 1 into split type dismouting structure, including base 11 and curb plate 12, wherein the curb plate constant head tank has been seted up to the both sides of base 11 for the location is installed curb plate 12.
In some embodiments, the base 11 further comprises: a joint positioning hole 111; the joint positioning hole 111 is disposed at the bottom of the base 11, and is used for connecting the joint connector 3.
Specifically, the joint connector 3 is an intermediate connector for connecting the mounting frame 1 and the mechanical arm, and in order to facilitate the installation between the mounting frame 1 and the mechanical arm, a joint positioning hole 111 is formed at the bottom of the base 11 for positioning and installing the joint connector 3.
In some embodiments, in combination with fig. 4, which is a sectional view of the present application in the direction A-A in fig. 3, positioning blocks 22 are disposed on two sides of the finger connector 2, and finger connector positioning grooves are disposed on the inner wall of the side plate 12; the finger connecting piece 2 can be fixed on the inner wall of the side plate 12 through the matching of the positioning block 22 and the finger connecting piece positioning groove.
Specifically, in order to facilitate the installation of the finger connecting piece 2 on the installation frame 1, the two opposite sides of the finger connecting piece 2 are provided with the positioning blocks 22, and the inner walls of the side plates 12 opposite to the two sides of the side plates 12 provided with the positioning blocks 22 with the finger connecting piece 2 are provided with finger connecting piece positioning grooves, so that the positioning blocks 22 and the finger connecting piece positioning grooves can be matched, and the positioning installation of the finger connecting piece 2 on the installation frame 1 is facilitated.
In some embodiments, the finger-connecting portion 21 is provided on a side of the finger-connecting member 2 perpendicular to the side plate 12.
Specifically, in order to facilitate the installation of the wafer finger 4, in this embodiment, the finger connection position 21 is located on one side of the finger connection member 2 and two sides provided with the positioning blocks 22 are different.
In some embodiments, positioning flanges 211 are disposed on two sides of the finger connection location 21, for positioning the mounting position of the wafer finger 4 when the wafer finger 4 is mounted; the spacing between the positioning ribs 211 is a second preset spacing.
Specifically, since the wafer is required to be clamped stably during the transferring process of the wafer, an accurate positioning is required for the mounting position of the wafer finger 4, and in this aspect, positioning flanges 211 are disposed on two sides of the finger connection position 21, and the distance between the positioning flanges 211 disposed on two sides is a second predetermined distance determined in advance. By the positioning rib 211, the mounting portion of the wafer finger 4 can be directly attached to the positioning rib 211 when the wafer finger 4 is mounted.
In some embodiments, a finger positioning hole 212 is formed at the top of the finger connection site 21 for installing the wafer finger 4; the spacing and the number of the finger positioning holes 212 correspond to the mounting holes on the mounting portion of the wafer finger 4.
Specifically, in order to ensure accurate installation of the wafer fingers 4, the top of each finger connection site 21 is provided with a finger positioning hole 212 for installing the wafer fingers 4. The wafer finger 4 includes a wafer clamping portion and a mounting portion, and the mounting portion of the wafer finger 4 is also provided with a mounting hole corresponding to the finger positioning hole 212, so that the wafer finger 4 can be accurately mounted in the finger positioning hole 212. Therefore, by the cooperation of the baffle 21 and the finger positioning hole 212, the wafer finger 4 can be accurately mounted.
In some embodiments, the first predetermined pitch is equal to a pitch of the wafer at the station.
In some embodiments, the second preset spacing is equal to the width of the mounting portion of the wafer finger 4.
Specifically, in this embodiment, two pitches are preset, where the first preset pitch is equal to the pitch of the wafer on the station, and since the wafer finger 4 in this embodiment is installed in the finger connection position 21 formed on the finger connector 2, if the wafer on a certain station is to be transferred, the pitch between the finger connection positions 21 is required to be the same as the pitch of the wafer to be transferred on a certain station. The second preset distance is equal to the width of the mounting portion of the wafer finger 4, and since the wafer finger 4 includes the wafer clamping portion and the mounting portion, in order to further ensure the mounting accuracy of the wafer finger 4, the distance between the positioning ribs 211 may be preset, that is, the second preset distance is set to be the same as the width of the mounting portion of the wafer finger 4, so that when the wafer finger 4 is mounted, the mounting portion of the wafer finger 4 is directly placed into the positioning ribs 211, and the mounting hole provided on the mounting portion of the wafer finger 4 is aligned with the finger positioning hole 212. It should be noted that, in this embodiment, the first preset distance and the second preset distance are both obtained by pre-measurement, and the finger connector 2 is obtained by performing finish machining according to the measured first preset distance and second preset distance.
Those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
Those skilled in the art will appreciate that the descriptions of the various embodiments are each focused on, and that portions of one embodiment that are not described in detail may be referred to as related descriptions of other embodiments.
Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present application, and such modifications and alterations fall within the scope of the appended claims, which are to be construed as merely illustrative of the present application, but the scope of the application is not limited thereto, and various equivalent modifications and substitutions will be readily apparent to those skilled in the art within the scope of the present application, and are intended to be included within the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
The present application is not limited to the above embodiments, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the present application, and these modifications and substitutions are intended to be included in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (2)
1. A multi-finger wafer handling robot, comprising: the device comprises a mounting frame, a finger connecting piece and a joint connecting piece;
the mounting bracket includes: a base and a side plate; the base and the side plates enclose a box-shaped space;
the finger connector is arranged in the mounting frame; a plurality of finger connecting positions are arranged on one side of the finger connecting piece; the distance between the finger connection positions in the vertical direction is a first preset distance;
the joint connecting piece is arranged at the bottom of the mounting frame and used for connecting the mounting frame and the mechanical arm;
the base includes: a side plate positioning groove;
the side plate positioning grooves are formed in two sides of the base; the side plate can be fixed with the base along the side plate positioning groove;
the base also includes: a joint positioning hole; the joint positioning hole is arranged at the bottom of the base and is used for connecting the joint connecting piece;
positioning blocks are arranged on two sides of the finger connecting piece, and finger connecting piece positioning grooves are formed in the inner wall of the side plate; the finger connecting piece can be fixed on the inner wall of the side plate through the matching of the positioning block and the finger connecting piece positioning groove;
the finger connecting position is arranged on one side of the finger connecting piece, which is vertical to the side plate;
positioning flanges are arranged on two sides of the finger connection position and used for positioning the mounting position of the wafer finger when the wafer finger is mounted; the interval between the positioning flanges is a second preset interval; the top of the finger connecting position is provided with a finger positioning hole for installing a wafer finger; the spacing and the number of the finger positioning holes correspond to those of the mounting holes arranged on the wafer finger mounting part;
the second preset distance is equal to the width of the wafer finger mounting portion.
2. The multi-finger wafer handling robot of claim 1, wherein the first predetermined pitch is equal to a pitch of the wafers at the stations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311050315.2A CN116805609B (en) | 2023-08-21 | 2023-08-21 | Multi-finger wafer carrying manipulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311050315.2A CN116805609B (en) | 2023-08-21 | 2023-08-21 | Multi-finger wafer carrying manipulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116805609A CN116805609A (en) | 2023-09-26 |
| CN116805609B true CN116805609B (en) | 2023-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311050315.2A Active CN116805609B (en) | 2023-08-21 | 2023-08-21 | Multi-finger wafer carrying manipulator |
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| Country | Link |
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| CN (1) | CN116805609B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007273731A (en) * | 2006-03-31 | 2007-10-18 | Komatsu Machinery Corp | Wafer carrying hand |
| CN107206588A (en) * | 2015-02-04 | 2017-09-26 | 川崎重工业株式会社 | The skew automatic regulating apparatus and the skew automatic adjusting method of manipulator of manipulator |
| CN110223948A (en) * | 2019-07-23 | 2019-09-10 | 北京锐洁机器人科技有限公司 | A kind of semiconductor manipulator |
| CN115513108A (en) * | 2021-12-31 | 2022-12-23 | 上海果纳半导体技术有限公司武汉分公司 | Wafer taking and placing device and carrying manipulator |
| CN115706034A (en) * | 2021-08-06 | 2023-02-17 | 沈阳富创精密设备股份有限公司 | Wafer carrying mechanism with adjustable finger spacing |
-
2023
- 2023-08-21 CN CN202311050315.2A patent/CN116805609B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007273731A (en) * | 2006-03-31 | 2007-10-18 | Komatsu Machinery Corp | Wafer carrying hand |
| CN107206588A (en) * | 2015-02-04 | 2017-09-26 | 川崎重工业株式会社 | The skew automatic regulating apparatus and the skew automatic adjusting method of manipulator of manipulator |
| CN110223948A (en) * | 2019-07-23 | 2019-09-10 | 北京锐洁机器人科技有限公司 | A kind of semiconductor manipulator |
| CN115706034A (en) * | 2021-08-06 | 2023-02-17 | 沈阳富创精密设备股份有限公司 | Wafer carrying mechanism with adjustable finger spacing |
| CN115513108A (en) * | 2021-12-31 | 2022-12-23 | 上海果纳半导体技术有限公司武汉分公司 | Wafer taking and placing device and carrying manipulator |
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| Publication number | Publication date |
|---|---|
| CN116805609A (en) | 2023-09-26 |
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