CN110223948A - A kind of semiconductor manipulator - Google Patents
A kind of semiconductor manipulator Download PDFInfo
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- CN110223948A CN110223948A CN201910667858.6A CN201910667858A CN110223948A CN 110223948 A CN110223948 A CN 110223948A CN 201910667858 A CN201910667858 A CN 201910667858A CN 110223948 A CN110223948 A CN 110223948A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000033001 locomotion Effects 0.000 claims abstract description 20
- 238000009987 spinning Methods 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 41
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The embodiment of the invention discloses a kind of semiconductor manipulators, including for providing the Z axis mould group of Z-direction linear motion, for providing the θ Axle mould group of spinning movement, and for providing the X-axis mould group of X-direction linear motion, and V Axle mould group, two groups of X-axis driving devices are provided in X-axis mould group, V Axle mould group includes single finger mould group and more finger mould groups, single finger mould group and more finger Mo Zu are connected with one group of X-axis driving device respectively, more finger mould groups include finger actuation component, the output end of finger actuation component is connected with oblique guidance set, oblique guidance set is connected with slide block assembly, slide block assembly is connected with the more finger components being made of five wafer conveying robots, the five fingers can be achieved and singly refer to that finger is used alternatingly, it can also realize that the five fingers refer to the stepless variation of spacing, it uses more flexible, it is adapted in semicon industry not The process requirements carried with wafer.
Description
Technical field
The present embodiments relate to technical field of manufacturing semiconductors, and in particular to a kind of semiconductor manipulator.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC products for having specific electrical functionality.
In semiconductor processing equipment, it is often necessary to be transmitted wafer between each station, in the process of transmission
In, transmission precision is higher, and apparatus and process consistency is better, and speed is faster, and the production capacity of single device is bigger.With semiconductor
The technique of the development of technique, equipment processing becomes increasingly complex, and requires also increasingly automation degree of equipment, flexibility degree
Height, this just needs a kind of positioning accuracy high, fireballing multivariant manipulator.
The prior art of the same trade mostly singly refers to or refers to fixed wafer conveying robot more, use it is inflexible,
Disadvantage clearly, singly refers to that fixed wafer conveying robot can only once pick and place a Zhang Jingyuan in wafer transmit process, greatly
The efficiency of wafer transmission is reduced greatly；And refers to fixed wafer conveying robot more and do not adapt between different layers spacing film magazine
The carrying of wafer.
Summary of the invention
For this purpose, the embodiment of the present invention provides a kind of semiconductor manipulator, the five fingers may be implemented and singly refer to that finger alternately makes
With, can also by change wafer conveying robot vertical height, to adjust in more finger components between wafer conveying robot
Spacing, to solve and to refer to fixed wafer carrying implement in the prior art due to singly referring to that formula and more finger formulas can not be called flexibly more
Tool hand does not adapt to that various crystalline substances in semicon industry can not be adapted between different layers spacing film magazine caused by the carrying of wafer
The problem of process requirements that disk is carried.
To achieve the goals above, the embodiment of the present invention provides the following technical solutions:
A kind of semiconductor manipulator, including for provide Z-direction linear motion Z axis mould group, for providing spinning movement
θ Axle mould group and be provided with for providing the X-axis mould group and V Axle mould group of X-direction linear motion, in the X-axis mould group
Two groups of X-axis driving devices, the V Axle mould group include single finger mould group and more finger mould groups, the single finger mould group and more fingers
Mo Zu is connected with one group of X-axis driving device respectively；
The single finger mould group includes singlehanded finger assembly, and more finger mould groups include finger actuation component, the finger
The output end of driving assembly is connected with oblique guidance set, and the oblique guidance set is connected with slide block assembly, and the slide block assembly connects
It is connected to more finger components.
Further, the finger actuation component uses screw drive mechanism.
Further, the slide block assembly includes vertical sliding groove, set gradually up and down in the sliding groove there are five
Sliding block, the both ends of the sliding block are provided with bracket, and the both ends for rolling shaft are connected by the bracket with the sliding block, together
Wafer conveying robot described in five in the more finger components of Shi Suoshu is corresponding with sliding block described in five to be connected.
Further, the Z axis mould group includes vertical Z axis fixed plate, is provided with vertical Z in the Z axis fixed plate
Axis rail is slidably provided with Z axis slide in the Z axis guide rail, is provided with linear motor on the Z axis slide.
Further, the θ Axle mould group includes horizontal θ axis fixing plate, and the θ axis fixing plate is connected to Z axis slide
Upper end, the θ axis fixing plate are rotationally equipped with θ axis rotary cylinder, are provided with θ axial brake device on the θ axis fixing plate.
Further, the X-axis mould group includes horizontal X-axis fixed plate, and the X-axis fixed plate is set to θ axis rotary cylinder
Top, X-axis driving device described in two groups be arranged in X-axis fixed plate, the X-axis driving device includes X-axis guide rail, described
It is slidably provided with X-axis slide in X-axis guide rail, is provided with linear motor on the X-axis slide.
Further, the singlehanded finger assembly includes single wafer conveying robot, and more finger components include five
Single wafer conveying robot.
Further, the screw drive mechanism includes two lead screw brackets, is worn between lead screw bracket described in two
There are five horizontal driving lead screws, one end of the driving lead screw is connected with spindle motor, is provided with silk on the driving lead screw
Thick stick nut seat, the oblique guidance set includes the ramp down block being connected with feed screw nut seat, before the front of the ramp down block is provided with
Perforative oblique guide groove afterwards is inserted with rolling shaft in the oblique guide groove.
The embodiment of the present invention has the advantages that
(1) in the present embodiment, the wafer needed in semiconductor fabrication is placed on wafer handling machinery on hand,
By Z axis mould group be the Z-direction linear motion that provides of manipulator, θ Axle mould group is spinning movement and X-axis mould that manipulator provides
Group is that the X-direction that manipulator provides moves along a straight line to realize the carrying to wafer, and according to actual production demand, wafer can be by having
The single finger mould group of standby single wafer conveying robot is carried, can also be by having more finger moulds of five wafer conveying robots
Group is carried, and is realized the five fingers and is singly referred to that finger is used alternatingly, uses more flexible；
(2) in the more finger mould groups of present embodiment, change the vertical height of wafer conveying robot, adjust more fingers
Spacing in component between wafer conveying robot realizes the stepless variable for referring to spacing, has adapted to significantly each in semicon industry
The process requirements that kind wafer is carried, and more finger mould groups refer to that spacing changes using the driving of oblique guidance set, because of the letter of its structure
It is single, to substantially reduce product cost and simplify later period debugging maintenance.
Detailed description of the invention
It, below will be to embodiment party in order to illustrate more clearly of embodiments of the present invention or technical solution in the prior art
Formula or attached drawing needed to be used in the description of the prior art are briefly described.It should be evident that the accompanying drawings in the following description is only
It is merely exemplary, it for those of ordinary skill in the art, without creative efforts, can also basis
The attached drawing of offer, which is extended, obtains other implementation attached drawings.
Structure depicted in this specification, ratio, size etc., only to cooperate the revealed content of specification, for
Those skilled in the art understands and reads, and is not intended to limit the invention enforceable qualifications, therefore does not have technical
Essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the function of the invention that can be generated
Under effect and the purpose that can reach, should all still it fall in the range of disclosed technology contents obtain and can cover.
Fig. 1 is the overall structure diagram of the embodiment of the present invention；
Fig. 2 is the detailed construction schematic diagram of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of V of embodiment of the present invention Axle mould group；
Fig. 4 is the structural schematic diagram of the oblique guidance set of the embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the more finger mould groups of the embodiment of the present invention.
In figure:
1-Z Axle mould group；2- θ Axle mould group；3-X Axle mould group；4-V Axle mould group；
11-Z axis fixing plate；12-Z axis rail；13-Z axis slide；
21- θ axis fixing plate；22- θ axis rotary cylinder；
31-X axis fixing plate；32-X axis rail；33-X axis slide；
41- single finger mould group；The more finger mould groups of 42-；
411- one hand finger assembly；
421- finger actuation component；The oblique guidance set of 422-；423- slide block assembly；The more finger components of 424-；
4211- lead screw bracket；4212- drives lead screw；4213- spindle motor；4214- feed screw nut seat；
4221- ramp down block；The oblique guide groove of 4222-；4223- rolls shaft；
4231- sliding groove；4232- sliding block；4233- bracket.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book is understood other advantages and efficacy of the present invention easily, it is clear that described embodiment is the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
As shown in Figures 1 to 5, the present invention provides a kind of semiconductor manipulators, including for providing Z-direction linear motion
Z axis mould group 1, the θ Axle mould group 2 for providing spinning movement and for provide X-direction linear motion X-axis mould group 3, with
And V Axle mould group 4, two groups of X-axis driving devices are provided in the X-axis mould group 3, the V Axle mould group 4 includes 41 He of single finger mould group
More finger mould groups 42, the single finger mould group 41 and more finger mould groups 42 are connected with one group of X-axis driving device respectively, the one hand
Refer to that mould group 41 includes the singlehanded finger assembly 411 being made of single wafer conveying robot, more finger mould groups 42 include finger
Driving assembly 421, the output end of the finger actuation component 421 are connected with oblique guidance set 422, the oblique guidance set 422
It is connected with slide block assembly 423, the slide block assembly 423 is connected with the more finger components being made of five wafer conveying robots
424。
In the present embodiment, the Z axis mould group 1 includes vertical Z axis fixed plate 11, is set in the Z axis fixed plate 11
It is equipped with vertical Z axis guide rail 12, Z axis slide 13 is slidably provided in the Z axis guide rail 12, is arranged on the Z axis slide 13
There is linear motor, the θ Axle mould group 2 includes horizontal θ axis fixing plate 21, and the θ axis fixing plate 21 is connected to Z axis slide 13
Upper end, the θ axis fixing plate 21 are rotationally equipped with θ axis rotary cylinder 22, and the driving of θ axis is provided on the θ axis fixing plate 21
Device, the θ axial brake device include the θ spindle motor for being set to θ axis fixing plate lower end surface and the θ being set on θ axis rotary cylinder
Axis drives gear, and motor gear is provided on the output shaft of the θ axis driving motor, and the motor gear and θ axis drive gear
Engagement, the X-axis mould group 3 include horizontal X-axis fixed plate 31, and the X-axis fixed plate 31 is set to the top of θ axis rotary cylinder 22
Portion, X-axis driving device described in two groups are arranged in X-axis fixed plate 31, and the X-axis driving device includes X-axis guide rail 32, described
It is slidably provided with X-axis slide 33 in X-axis guide rail 32, is provided with linear motor on the X-axis slide 33.
In above-mentioned setting, Z axis mould group 1 drives Z axis slide 13 to move up in Z axis guide rail 12 by the linear motor in it
It is dynamic, it is utilized for providing Z-direction linear motion, θ Axle mould group 2 by the θ spindle motor driving motor gear rotation in it for manipulator
Motor gear θ axis drives the engaged transmission relation between gear to drive θ axis driving gear and the rotation of θ axis rotary cylinder, is manipulator
Spinning movement is provided, X-axis mould group 3 drives X-axis slide 33 to move in X-axis guide rail 32 by the linear motor in it, for machinery
Hand is for providing X-axis linear motion.
In the present embodiment, the wafer needed in semiconductor fabrication is placed on wafer handling machinery on hand, led to
Cross that Z axis mould group 1 is the Z-direction linear motion that provides of manipulator, θ Axle mould group 2 is spinning movement and X-axis mould that manipulator provides
Group 3 moves along a straight line for the X-direction that manipulator provides to realize the carrying to wafer.According to actual production demand, wafer can be put
It sets and is carried on the singlehanded finger assembly 411 being made of single wafer conveying robot, can also be placed on and be carried by five wafers
It is carried on more finger components 424 that manipulator is constituted, when carrying wafer using single finger mould group 41, corresponding X-axis driving dress
It is mobile to set driving single finger mould group 41, when carrying wafer using more finger mould groups 42, is then driven using another group of X-axis driving device
It is mobile to move more finger mould groups 42, realize the five fingers and singly refers to that finger is used alternatingly, uses more flexible.
In the present embodiment, the finger actuation component 421 uses screw drive mechanism, and screw drive mechanism includes two
A lead screw bracket 4211 is equipped with five horizontal driving lead screws 4212, the drive between lead screw bracket 4211 described in two
One end of dynamic lead screw 4212 is connected with spindle motor 4213, is provided with feed screw nut seat 4214, institute on the driving lead screw 4212
Stating oblique guidance set 422 includes the ramp down block 4221 being connected with feed screw nut seat 4214, the front setting of the ramp down block 4221
There is pre-and post perforative oblique guide groove 4222, is inserted in the oblique guide groove 4222 and rolls shaft 4223, the slide block assembly 423
Sliding block 4232 there are five being set gradually up and down including vertical sliding groove 4231, in the sliding groove 4231, the sliding block 4232
Both ends be provided with bracket 4233, the both ends for rolling shaft 4223 pass through the bracket 4233 and 4232 phase of sliding block
Even, while wafer conveying robot described in five in more finger components 424 is corresponding with sliding block 4232 described in five
It is connected.
In the present embodiment, spindle motor 4213 can drive driving lead screw 4212 to rotate, and make feed screw nut seat 4214
Along the axial movement of driving lead screw 4212, ramp down block 4221 is promoted to translate, since oblique guide groove 4222 is inclined, and rolled
The axial plane of shaft 4223 is contacted with oblique guide groove 4222, when ramp down block 4221 translates, can be changed and be rolled the vertical of shaft 4223
Highly, it slides up and down sliding block 4232 in sliding groove 4231, and then changes the vertical height of wafer conveying robot, adjust more
Spacing in finger component 424 between wafer conveying robot realizes the stepless variable for referring to spacing, has adapted to semiconductor row significantly
The process requirements that various wafers are carried in the industry.
Present embodiment can realize the five fingers and singly refer to that finger is used alternatingly, and use more flexible, and mobility is stronger, can also
It realizes that the five fingers refer to the stepless variation of spacing, has adapted to the process requirements of various wafer film magazines in semicon industry, and this reality significantly
It applies mode and refers to that spacing changes using the driving of oblique guidance set 422, because its structure is simple, to substantially reduce product cost and make
Later period debugging maintenance simplifies.
Although above having used general explanation and specific embodiment, the present invention is described in detail, at this
On the basis of invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Therefore,
These modifications or improvements without departing from theon the basis of the spirit of the present invention are fallen within the scope of the claimed invention.
Claims (8)
1. a kind of semiconductor manipulator, it is characterised in that: including for provide Z-direction linear motion Z axis mould group (1), be used for
There is provided the θ Axle mould group (2) of spinning movement and for providing the X-axis mould group (3) and V Axle mould group of X-direction linear motion
(4), be provided with two groups of X-axis driving devices on the X-axis mould group (3), the V Axle mould group (4) include single finger mould group (41) and
More finger mould groups (42), the single finger mould group (41) and more finger mould groups (42) are connected with one group of X-axis driving device respectively；
The single finger mould group (41) includes singlehanded finger assembly (411), and more finger mould groups (42) include finger actuation component
(421), the output end of the finger actuation component (421) is connected with oblique guidance set (422), the oblique guidance set (422)
It is connected with slide block assembly (423), the slide block assembly (423) is connected with more finger components (424).
2. a kind of semiconductor manipulator according to claim 1, it is characterised in that: the finger actuation component (421)
Using screw drive mechanism.
3. a kind of semiconductor manipulator according to claim 1, it is characterised in that: the slide block assembly (423) includes
Vertical sliding groove (4231), sets gradually that there are five sliding block (4232), the sliding blocks in the sliding groove (4231) up and down
(4232) both ends are provided with bracket (4233), it is described roll shaft (4223) both ends by the bracket (4233) with it is described
Sliding block (4232) is connected, while described in wafer conveying robot described in five in more finger components (424) and five
Sliding block (4232) correspond be connected.
4. a kind of semiconductor manipulator according to claim 1, it is characterised in that: the Z axis mould group (1) includes vertical
Z axis fixed plate (11), be provided with vertical Z axis guide rail (12) on the Z axis fixed plate (11), on the Z axis guide rail (12)
It is slidably provided with Z axis slide (13), is provided with linear motor on the Z axis slide (13).
5. a kind of semiconductor manipulator according to claim 4, it is characterised in that: the θ Axle mould group (2) includes level
θ axis fixing plate (21), the θ axis fixing plate (21) is connected to the upper end of Z axis slide (13), and the θ axis fixing plate (21) can
It is rotationally equipped with θ axis rotary cylinder (22), is provided with θ axial brake device on the θ axis fixing plate (21).
6. a kind of semiconductor manipulator according to claim 5, it is characterised in that: the X-axis mould group (3) includes level
X-axis fixed plate (31), the X-axis fixed plate (31) is set to the top of θ axis rotary cylinder (22), the driving of X-axis described in two groups
Device is arranged on X-axis fixed plate (31), and the X-axis driving device includes X-axis guide rail (32), can on the X-axis guide rail (32)
It is slidably provided with X-axis slide (33), is provided with linear motor on the X-axis slide (33).
7. a kind of semiconductor manipulator according to claim 1, it is characterised in that: the one hand finger assembly (411) is wrapped
Single wafer conveying robot is included, more finger components (424) include five single wafer conveying robots.
8. a kind of semiconductor manipulator according to claim 2, it is characterised in that: the screw drive mechanism includes two
A lead screw bracket (4211) is equipped with five horizontal driving lead screws (4212) between lead screw bracket (4211) described in two,
One end of driving lead screw (4212) is connected with spindle motor (4213), is provided with lead screw spiral shell on the driving lead screw (4212)
Base (4214), the oblique guidance set (422) include the ramp down block (4221) being connected with feed screw nut seat (4214), described oblique
The front of block (4221) is provided with pre-and post perforative oblique guide groove (4222), is inserted with rolling in the oblique guide groove (4222)
Shaft (4223).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910667858.6A CN110223948A (en) | 2019-07-23 | 2019-07-23 | A kind of semiconductor manipulator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910667858.6A CN110223948A (en) | 2019-07-23 | 2019-07-23 | A kind of semiconductor manipulator |
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| CN110223948A true CN110223948A (en) | 2019-09-10 |
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| CN201910667858.6A Pending CN110223948A (en) | 2019-07-23 | 2019-07-23 | A kind of semiconductor manipulator |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524845A (en) * | 2020-04-28 | 2020-08-11 | 北京北方华创微电子装备有限公司 | Wafer transfer method of semiconductor processing equipment and semiconductor processing equipment |
| CN112151432A (en) * | 2020-11-26 | 2020-12-29 | 西安奕斯伟硅片技术有限公司 | Device and method for clamping silicon wafers stored in silicon wafer box and silicon wafer conveying equipment |
| CN113752284A (en) * | 2021-08-30 | 2021-12-07 | 上海广川科技有限公司 | Multi-layer equal-spacing changeable wafer conveying manipulator structure on semiconductor robot |
| CN116110836A (en) * | 2023-04-13 | 2023-05-12 | 北京锐洁机器人科技有限公司 | Semiconductor single-chip-to-multi-chip wafer carrying executing mechanism, manipulator and operating method |
| CN116805609A (en) * | 2023-08-21 | 2023-09-26 | 北京锐洁机器人科技有限公司 | Multi-finger wafer carrying manipulator |
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