TW201327710A - Electronics equipment with a moving unit - Google Patents

Abstract

An electronics equipment with a moving unit is used in testing electronic elements and contains a base having a feeding device, a collecting device, a testing device, a central controlling device, and a carrying device, the carrying device including at least one moving unit capable of changing a distance to pick and place the electronic elements, wherein the moving unit includes a frame, a plurality of pickers and distance adjusting mechanisms, each picker includes two paws and a driver to drive at least one paw so that the picker picks and places the electronic elements, the distance changing mechanism includes a driving structure on the frame, a movable holder laterally connecting with the driving structure to displace horizontally and having a number of transmitting structures arranged at different angles, each transmitting structure includes a guiding portion and a sliding portion to match with the guiding portion, the guiding portion and the sliding portion are fixed on the moving holder, and the sliding portion is in connection with the picker to actuate the picker to displace and to adjust the distance; thereby the distance between each two pickers is adjusted by using the distance adjusting mechanism to pick and place the electronic elements on different objects and to decrease a size of the moving holder.

Description

Electronic component device with moving unit

The invention provides a variable distance adjusting mechanism for adjusting the distance between the grippers, so as to facilitate the pick-and-place of electronic components on different objects, and effectively reduce the volume of the moving unit, thereby facilitating the space configuration of the device, thereby improving the use efficiency. Electronic component equipment.

According to the fact that the volume of electronic components such as memory and IC is becoming lighter and more numerous, in order to facilitate the transfer of a plurality of electronic components between different devices, the industry is currently shipping trays to different devices by means of electronic components. For the purpose of performing the electronic component preset operation, for example, referring to FIG. 1 , the tray 11 has a plurality of receiving slots 111 for holding a plurality of memories 12 for detecting memory. The detecting device (not shown) is provided with a circuit board 13 having a plurality of sockets 131. The distance between the sockets 131 is different from the spacing of the receiving slots 111 of the tray 11, and the pluggable memory 12 is opened. The slot 132 of the slot 132 is provided with a clip 133 for fixing the memory 12; the worker can pull the clip 133 of the socket 131 outward and open it on the tray 11 to be tested. The memory 12 is inserted into the slot 132 of the socket 131, and the buckle 133 is fastened to the memory 12 for positioning. After that, the staff can insert a plurality of circuit boards with the memory 12 to be tested. 13 is inserted into the inspection machine for inspection work, after the detection is completed The worker can open the clip 133 of the socket 131 of the circuit board 13 to take out the memory 12 that has been tested, and then store the tested memory 12 in the receiving slot 111 of each tray 11 for storage; However, the staff member must take out the memory 12 to be tested one by one on the tray 11, and then insert them into the socket 131 of the circuit board 13 respectively. After the detection, the socket 131 of the circuit board 11 must be manually connected. The above-mentioned test memory 12 is unloaded one by one, and then placed on the tray 11 separately. Therefore, the manual operation of the memory is quite cumbersome and time consuming. When the number of the memory 12 is large, the memory is inevitably lowered. The production efficiency of the body needs to be improved.

An object of the present invention is to provide an electronic component device with a moving unit, which is applied to detecting electronic components, and is provided with a feeding device, a receiving device, a testing device, a central control device and a conveying device on the machine table. The conveying device is provided with at least one shifting unit for shifting the transfer and transfer electronic components, wherein the moving unit comprises a frame, a plurality of grippers and a variable pitch adjusting mechanism, and each of the gripping devices has a corresponding claw and a driving source for driving at least one of the jaws to move the electronic component to and from the gripper, the variable distance adjusting mechanism is provided with a driving structure on the frame, and a horizontal mounting connection The movable frame of the driving structure is driven by the driving structure for horizontal displacement, and is provided with a plurality of transmission structures arranged at different angles, and each transmission structure is provided with a guiding sliding portion and a sliding portion on the movable frame, and The gripper is connected by the sliding portion, and the gripper displacement is respectively driven to adjust the spacing; thereby, the distance adjustment mechanism can be used to adjust the distance between the grippers, so that the electronic components can be taken and placed on different objects, and the water is taken Mounting of the movable frame and can effectively reduce the volume, in order to facilitate the configuration space of the device, to enhance the effectiveness of the use of practical benefit.

The second object of the present invention is to provide an electronic component device with a moving unit, which is applied to an upper surface of an electronic component, and is provided with a feeding device, a plate feeding device, a central control device and a conveying device on the machine table. The conveying device is provided with at least one moving material for shifting and transferring electronic components, the moving unit is the same as the moving unit of the above equipment, and the moving unit can adjust each clamping by using a variable distance adjusting mechanism. The distance between the devices is such that the electronic components to be tested are taken out from the tray of the feeding device, and the sockets inserted into the circuit board of the board device are transferred, and the movable frame is horizontally mounted to effectively reduce the volume, thereby facilitating the volume reduction. The space configuration of the equipment, and thus consistently implement the operation of the electronic components on the board, in order to shorten the operation time and achieve the practical benefits of improving production efficiency.

The third object of the present invention is to provide an electronic component device with a moving unit, which is applied to the lower part of the electronic component, and is provided with a plate feeding device, a receiving device, a central control device and a conveying device on the machine table. The conveying device is provided with at least one moving material for shifting and transferring electronic components, the moving unit is the same as the moving unit of the above equipment, and the moving unit can adjust each clamping by using a variable distance adjusting mechanism. The distance between the devices is such that the measured electronic components are taken out on the circuit board of the board device, and the loading is placed on the empty tray of the receiving device, and the horizontally mounted movable frame can effectively reduce the volume. In order to facilitate the space configuration of the equipment, and consistently implement the operation of the lower parts of the electronic components, in order to shorten the operation time and achieve the practical benefits of improving production efficiency.

In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail. The electronic component device of the present invention may be a detecting device, an upper device or a lower device, and each device. The conveying device is provided with at least one shifting unit 20 for shifting the transfer and transfer electronic components. Referring to Figures 2, 3 and 4, the moving unit 20 comprises a frame, a plurality of grippers and a variable pitch. The adjusting mechanism, each of the grippers has two corresponding jaws, and is provided with a driving source for driving at least one of the jaws to act, so that the gripper picks up and puts the electronic components, and the variable distance adjusting mechanism is arranged on the frame The movable structure has a movable frame which is horizontally mounted and connected to the driving structure, and is driven by the driving structure to be horizontally displaced, and is provided with a plurality of transmission structures arranged at different angles, and each transmission structure is matched with the movable frame. The sliding portion and the sliding portion are connected to the gripper by the sliding portion, and respectively move the gripper to adjust the spacing; further, the moving unit 20 is provided with a lifting mechanism on the frame for driving Multiple grippers and variable pitch The entire mechanism is Z-axis displacement, and the electronic components are taken out or placed on different objects, and the frame includes a first frame 211 and a second frame 212, and the first frame 211 can be fixed on a machine. The first frame 211 is mounted on a carrier mechanism and is interfitted with the second frame 212 in a Z-axis configuration. The sliding rail 213 and the sliding block 214, wherein the sliding rail 213 is fixedly mounted on the second frame 212, and the sliding seat 214 is fixedly mounted on the first frame 211, and the lifting mechanism is further connected to the first frame 211. The drive unit is equipped with a driving source for driving at least one of the transmission groups, and the second frame 212 is displaced by the transmission group to perform Z-axis displacement. In the embodiment, the lifting mechanism is assembled on the first frame 211. The driving source of the motor 221, the motor 221 is coupled to drive the transmission group including the pulley set 222 and the screw socket set 223, and drives the second frame 212 to perform Z-axis displacement by the screw screw seat set 223; The frame 212 is equipped with a plurality of grippers 23, and a clipper 23 is fixed on the second frame 212, and the plurality of clips are clamped. The device 23 can include a fixed jaw and a movable jaw, and the movable jaw is displaced relative to the fixed jaw, or includes two movable jaws for relative displacement. In this embodiment, the second jaw is attached to the second jaw. The frame 212 is provided with at least one bearing portion which is disposed in the Y-axis direction and is a supporting rod 215. Each of the clamping devices 23 is respectively provided with a body 231 having at least one sliding portion, and the sliding portion is a sleeve 232. And being disposed in the Y-axis direction, and sliding on the support rod 215 of the second frame 212, so that the body 231 is placed on the second frame 212, and at least two sides of the body 231 of each of the grippers 23 are respectively provided with at least A guiding portion of the shaft 233 is disposed for arranging the jaws 234, and each of the jaws 234 is provided with a sliding portion that can be a sleeve 235 and disposed in the X-axis direction, and is sleeved 235 Sliding on the shaft 233 of the body 231, the driving source of each of the grippers 23 is provided with a power structure for driving the swaying structure of a connecting jaw 234, and driving at least one jaw 234 with the swaying structure. In the present embodiment, the power structure may be a pressure cylinder 25, and the swaying structure is provided with a loadable cylinder 25 above the body 231. The bracket 24 is connected to the body 231 of the cylinder 25, and the two sides of the bracket 24 are respectively pivoted with a connecting rod 26, and the other end of each connecting rod 26 is pivotally connected to the clamping jaw 234. The electronic component is clamped or released by the X-axis displacement of the clamping jaw 234, and the plurality of guiding rods 236 are disposed on the body 231, and each of the brackets 24 is provided with a sleeve 241 which can be placed outside the guiding rod 236. The driving mechanism of the variable pitch adjusting mechanism is provided with a driving source for driving at least one transmission group, and the transmission group is coupled to drive a horizontal mounting. The displacement of the movable frame, the transmission group may be a screw screw set or a pulley set, etc., for connecting the displacement of the movable movable frame. In the embodiment, the driving structure is mounted on the second frame 212 to drive the motor 271. The source is driven by the motor 271 to be a transmission group of the pulley set 272. The pulley set 272 is coupled to drive a movable frame 28 for X-axis displacement, and is disposed between the movable frame 28 and the body 231 of a fixed clamp 23. There are X-axis slides 281 and X-axis slides 237 which cooperate with each other to assist the smooth displacement of the movable frame 28. And the variable pitch adjusting mechanism is provided on the movable frame 28 with a plurality of transmission structures arranged at different angles for driving the movable clamps 23 for Y-axis displacement, and further, each transmission structure is active. The frame 28 is provided with a matching sliding portion and a sliding portion, and the sliding portion is connected to the body 231 of each movable gripper 23, wherein the guiding portion can be a chute, a sliding rail or a sliding sleeve. The sliding portion can be a roller, a sliding seat or a sliding shaft. In the embodiment, four transmission structures are disposed on the movable frame 28, and each transmission structure is respectively provided on the movable frame 28 The sliding portion of the sliding slot 282 can be a fan-shaped arrangement of the plurality of sliding slots 282 on the movable frame 28 from the middle to the sides, and the angular arrangement of each sliding slot 282 is determined according to the movable clamp 23 The distance between the required moving distance and the moving distance of the movable frame 28 is obtained. Each sliding portion is a roller 283, one end of each roller 283 is slidably placed on the sliding slot 282, and the other end is coupled to the movable gripper 23 The body 231 enables the variable pitch adjustment mechanism to drive the movable clamps 23 for the Y-axis displacement adjustment interval .

Referring to FIGS. 5 and 6, the shifting unit 20 controls the motor 271 of the variable pitch adjusting mechanism to drive the pulley set 272 to adjust the Y-axis spacing of each movable gripper 23 to facilitate the discharging. The group 272 drives the movable frame 28 to perform X-axis horizontal displacement, and the movable frame 28 can slide along the X-axis slide rail 237 of the fixed gripper 23 to assist the smooth displacement by the X-axis slide 281, and also because of the movable frame 28 The upper system is provided with a plurality of sliding grooves 282 arranged at different angles, and the sliding rollers 283 can be pushed and displaced by the sliding grooves 282, so that the rollers 283 respectively drive the bodies 231 of the movable grippers 23 respectively. Displacement, since the body 231 is limited to the support rod 215, the rollers 283 can drive the body 231 for Y-axis displacement, thereby adjusting the Y-axis spacing of each movable gripper 23, so that the grippers are respectively The distance between the two can correspond to the spacing of the receiving slots of the tray or the spacing of the sockets of the circuit board; please refer to FIG. 7 , when the two jaws 234 of each gripper 23 are to be opened, the respective cylinders 25 can be controlled to drive separately. The piston rod 251 is outwardly convexly displaced, since each piston rod 251 is respectively coupled to each clamping rod The body 231 of the device 23 is further limited to the support rod 215, so that the pressure cylinders 25 can drive the bracket 24 to move upwards, and the brackets 24 respectively drive the clips of the gripper 23 by the connecting rods 26 on both sides. The claws 234 are axially displaced outward along the shaft 233, thereby opening the two jaws 234 of each of the grippers 23 for releasing electronic components; see Fig. 8, to close the two jaws of each of the grippers 23 At 234, each of the pressure cylinders 25 can be driven to drive the piston rods 251 to be inwardly contracted and displaced. Since the piston rods 251 are respectively coupled to the body 231 of each of the grippers 23, the body 231 is again limited to the support rods 215, so that the pressures are made. The cylinder 25 can drive the bracket 24 to be displaced downwards, and each of the brackets 24 drives the jaws 234 of the gripper 23 to be axially displaced inward along the shaft 233 by the connecting rods 26 on both sides, thereby closing the clips. The second jaw 234 of the picker 23 is used for clamping the electronic components; referring to FIG. 9, the motor 221 driving the pulley of the lifting mechanism can be controlled when the clamper 23 is displaced in the Z-axis direction to sandwich the electronic component. Group 222, the pulley set 222 drives the screw base set 223, so that the screw base set 223 drives the second frame 212 for Z-axis displacement. The second frame 212 can be used to assist the smooth displacement of the slide frame 213 along the slide 214 of the first frame 211, so that the second frame 212 drives the clamps 23 mounted thereon for Z-axis displacement, and Take and place electronic components on different objects such as trays or circuit boards.

Referring to Figures 10, 11, and 12, the electronic component device of the present invention is configured with the above-mentioned mobile unit 20, which is a device capable of inserting a memory to be tested on a circuit board. The upper plate device is provided with a conveying device with a feeding unit 20, a feeding device 30, a plate feeding device 40 and a central control device, and further, the feeding device 30 is for accommodating at least one plural The tray of the memory is used for feeding the circuit board. The board device 40 is used for mounting a circuit board having a plurality of sockets. The material moving unit 20 of the conveying apparatus is the same as the material moving unit of the above embodiment. Controlling a plurality of grippers to adjust the Y-axis spacing and the clamping operation to take out the memory to be tested on the tray of the feeding device 30, and transfer the socket inserted into the circuit board of the board device 40, the central control device (not shown) is used to control the operation of each device, thereby consistently performing the memory upper board operation; in the present embodiment, the transport device is configured to have a carrying mechanism 29 as needed, and in the carrying mechanism 29 The loading unit 20 is assembled below (please refer to The second, third, and fourth figures are used to carry the XY axial displacement of the moving unit 20, so that the loading unit 20 can take out the memory to be tested at the feeding device 30, and move the memory to be tested. The feeding device 30 is provided with a plurality of retainers 31 in the feeding area for receiving at least one tray of the memory to be tested, and is provided with a top tray The first ejector 32 is a Z-axis displacement. In the embodiment, the first ejector 32 is driven by a driving source for Z-axis displacement, and the driving source drives the at least one transmission group 322 by the motor 321 . The transmission group 322 drives a yoke 323 having a slanting groove 324 for Y-axis displacement. The slanting groove 324 is inclined upward from the bottom, and a slidable arrangement is provided below the first ejector 32. When the ram 325 of the frame 323 chute 324 is used for the Y-axis displacement, the chute 324 can be used to push the 325 to be displaced along the slanting groove 324, thereby driving the first ejector 32 to be placed on the tray. The axial displacement is further provided with a first sliding rail 331 on both sides of the first ejector 32 for receiving the tray, and a Y-axis displacement is provided on one side of the first sliding rail 331 First a tray 341 for pushing the tray on the first slide rail 331 to the temporary area, wherein the temporary area is provided with at least one aligner 35 capable of X-axis displacement for positioning the tray, and The utility model is provided with at least one guide 36 for axial displacement of the YZ for guiding the push-pull memory for the Z-axis upward displacement and the correction position for convenient reclaiming, and the second under the temporary area. The slide rail 332 and a second ejector 37 capable of arranging the empty tray for Z-axis displacement, and the second ejector 37 can place the empty tray from the first slide rail 331 to the second slide rail On the 332, a second tray 342 disposed on the side of the second slide rail 332 and displaceable in the Y-axis is pushed to push the empty tray to the closing area, and the first tray is located in the closing area and can be used as the Z-axis. The displacement catcher 38 is disposed to receive the empty tray on the second slide rail 332; the plate supply device 40 is provided with at least one stage 41 for carrying a circuit board of the socket, the stage 41 can be used for Y-axis displacement to carry the circuit board with the socket to the feeding area, and the feeding area is provided with a top plate 42 and a guiding fixture 43 which can be used for Z-axis displacement, and the top plate 42 can be placed on the top The board is made up of Z axis Displaced below the guiding fixture 43 , the guiding fixture 43 is provided with a plurality of guiding slots 431 for assisting the guiding of the loading unit 20 to insert the memory to be tested into the socket of the circuit board, and One side of the guiding fixture 43 is provided with a depressor 44 for pressing the memory to be tested to be inserted into the socket of the circuit board, and the depressor 44 can be displaced by at least one Z-axis, in this embodiment. The pressure reducer 44 can be used for YZ axial displacement, and the following pressure memory is used.

Referring to Figures 11, 13, and 14, when performing the operation of the upper board of the memory to be tested, the feeding device 30 controls the first ejector 32 to move the Z-axis upwardly to the tray of the memory 60. 50. At this time, the plurality of tray holders 31 release the tray 50, so that the first ejector 32 can be displaced downward in the Z direction, and the tray 50 with the memory 60 is placed on the first rail 331. Then, the first pusher 341 is used for Y-axis displacement to push the tray 50 to the temporary area, and the fixed plate 35 at the temporary area is X-axis displacement to position the tray 50, and the tray 50 is positioned. After that, the first pusher 341 is reset in the Y-axis reverse displacement, and the guide 36 can be displaced in the Y-axis to the lower side of the tray 50, and is displaced in the Z-axis to lift the memory on the tray 50. The body 60 is for taking the material. At this time, the carrying mechanism 29 of the conveying device carries the loading unit 20 above the tray 50, and can view the Y-axis spacing of the respective memory bodies 60 on the tray 50. The Y-axis spacing of the plurality of grippers 23 is adjusted by the variable pitch adjusting mechanism, and the plurality of grippers 23 are driven to move the Z-axis to the upper side of the tray 50 by the lifting mechanism, and then the grippers 23 are controlled to be gripped. On tray 50 The memory 60; referring to the figures 12, 15, 16, and 17, after the gripper 23 of the transfer unit 20 grips the memory 60 to be tested, the transport device uses the transport mechanism 29 to move the unit. 20 is carried to the board supply device 40, and the Y-axis spacing of the sockets 71 of the circuit board 70 is visually observed, and the Y-axis spacing of the plurality of grippers 23 is adjusted by the variable pitch adjusting mechanism so that the grippers 23 are provided. Corresponding to each socket 71 of the circuit board 70, at this time, the board supply device 40 controls the stage 41 to perform Y-axis displacement to carry the circuit board 70 with the socket 71 to the feeding area, and the top board 42 is used as the Z-axis. The displacement jacking board 70 is guided to the lower side of the guiding fixture 43 so that the sockets 71 of the circuit board 70 are located opposite to the guiding groove 431 of the guiding fixture 43 and then guided by the guiding grooves 431 of the guiding fixture 43. Each of the grippers 23 of the transfer unit 20 inserts the memory 60 into the sockets 71 of the circuit board 70 first, and then controls the presser 44 to be axially displaced to the upper side of the circuit board 70, and then The Z-axis displacement depression memory 60 is indeed inserted into each socket 71 of the circuit board 70, and each socket 71 is positioned to hold the memory 60, and then the top plate 42 is inserted. The circuit board 70 of the memory 60 is displaced downward in the Z-axis direction, and the circuit board 70 is placed on the stage 41 to be loaded, thereby completing the consistent memory upper board operation.

Referring to Figures 18, 19 and 20, the electronic component device of the present invention is provided with an embodiment of the above-mentioned transfer unit 20, which is a device capable of removing the test memory on the circuit board. The lower plate device is provided with a conveying device with a material moving unit 20, a plate feeding device 80, a receiving device 90 and a central control device. Further, the plate feeding device 80 is used to receive at least one The circuit board of the memory has been inserted, and each socket on the circuit board is opened for feeding. The receiving device 90 is used for accommodating at least one empty tray for receiving materials, and can be stored and stored. The material moving tray 20, the moving unit 20 of the conveying device can control a plurality of grippers to adjust the Y-axis spacing and the clamping operation to take out the memory on the circuit board at the board feeding device 80, and transfer the loading The central control device (not shown) is used to control the actuation of each device to consistently perform the operation of the memory lower plate. In this embodiment, the delivery device can be used visually. The carrier mechanism 29 is required to be disposed under the carrier mechanism 29 The square assembly moving unit 20 (please refer to the figures 2, 3 and 4) is used to carry the XY axial displacement of the moving unit 20, so that the loading unit 20 can take out the memory of the measurement at the plate feeding device 80. And transferring the completed memory to the receiving device 90; the feeding device 80 is provided with at least one carrier 81 capable of carrying a circuit board into which the memory has been inserted, and the loading table 81 can be used The Y-axis displacement carries the circuit board with the memory to the discharge area, and the discharge area is provided with at least one socket capable of opening the circuit board and pressing against the memory depressor 82, the depressor 82 is tied to A first pressing fixture 821 is disposed at a position corresponding to the memory, and the first pressing fixture 821 is driven by the cylinder and can be displaced in the Z-axis to press against the memory to prevent jumping out. The pressing device 82 And a second pressing fixture 822 is respectively disposed at a position of the buckle on each side of each socket of the corresponding circuit board, and each of the second pressing fixtures 822 is driven by another cylinder to be displaced in the Z-axis direction. The buckle for opening the sockets, in order to prevent the memory from being abnormal from the socket of the circuit board, causes the loading unit 20 to clamp the memory. The pull-up circuit board is displaced upward. Therefore, the plate feeding device 80 is disposed in the take-up area behind the presser 82. A platen 83 is provided. The platen 83 is provided with two pressing bars 831 which can be pressed against the circuit board. One end of each pressing rod 831 is pivotally connected to a swinging block 832, and the other end of the swinging block 832 has a tilting block 833, so that the swinging block 832 pushes the pressing rod 831 against the circuit board by the gravity of the tilting block 833. In order to prevent the circuit board from arbitrarily moving upward, a sensor 834 is further provided to sense whether the circuit board is abnormally displaced. If the sensor 834 senses that the circuit board is abnormally moved up, a warning signal is sent to notify the staff. In order to eliminate the obstacle, the receiving device 90 is provided with a plurality of retainers 91 for receiving at least one empty tray, and is provided with a top empty tray for the first top of the Z-axis displacement. In the embodiment, the first ejector 92 is driven by a driving source for Z-axis displacement. The driving source drives at least one transmission group 922 by a motor 921, and the transmission group 922 drives a slant. The ram 923 of the slot 924 is displaced in the Y direction, and the chute 924 is inclined upward from the bottom, and A ridge 925 slidably disposed on the slanting groove 924 of the swaying frame 923 is disposed under the first ejector 92. When the yoke 923 is displaced in the Y-axis direction, the slanting groove 924 can be used to push the ridge 925 along the ejector 925. Displacement, thereby driving the first susceptor 92 to place the tray for Z-axis displacement, and the first ejector 92 is provided with a first sliding rail 931 on both sides thereof for receiving the empty tray, and A first pusher 941 capable of Y-axis displacement is disposed on one side of the first slide rail 931 for pushing the empty tray on the first slide rail 931 to the temporary zone, and the temporary zone configuration There is at least one aligner 95 capable of X-axis displacement for positioning the empty tray, and at least one guide 96 for YZ axial displacement for assisting the insertion of the memory into the empty And a modified position on the tray, and a second slide rail 932 and a second top plate 97 capable of arranging the tray for holding the memory for Z-axis displacement under the temporary area, the second top The disk holder 97 can place the tray on which the memory is mounted on the second sliding rail 932, and then the second pusher 942 disposed on the side of the second sliding rail 932 and displaceable in the Y-axis. a tray that has been loaded with memory Push to receipt region, a region located in the receipt and can be used for Z axial displacement of the closing device 98, may be based on the overhead rail 932 has a second memory containing the tray accommodating.

Referring to Figures 18, 21 and 22, when the memory lower panel operation is performed, the circuit board 70 into which the memory 60 has been inserted can be placed on the stage 81 of the board supply unit 80, which is referred to as Y. The axial displacement carries the circuit board 70 with the memory 60 below the depressor 82, and the depressor 82 can first control the first pressure resisting fixture 821 for the Z-axis downward displacement to properly press against the memory. 60, the second pressure resisting tool 822 is used as the Z-axis downward displacement to press the buckle 72 on both sides of each socket 71. At this time, the first pressing fixture 821 is displaced axially upward from the memory. 60. After the buckle 72 of the socket 71 is opened, the first pressing fixture 821 and the second pressing fixture 822 of the pressure reducing device 82 are reset in the Z-axis upward displacement, and the loading platform 81 is displaced in the Y-axis. The circuit board 70 with the memory 60 is carried to the reclaiming area, and the second pressing rod 831 of the pressing plate 83 is positioned above the circuit board 70 to prevent the circuit board 70 from being arbitrarily displaced upward, and the conveying device is carried. The mechanism 29 carries the feeding unit 20 to the plate feeding device 80, and can adjust the plurality of grippers by using the variable distance adjusting mechanism, depending on the Y-axis spacing of the respective memory bodies 60 on the circuit board 70. 23 Y-axis spacing, and the lifting mechanism drives the plurality of grippers 23 for Z-axis displacement to the upper side of the circuit board 70, and then controls each of the grippers 23 to clamp the memory 60 on the circuit board 70; In the 20th, 23rd, and 24th diagrams, after the loading unit 20 grips the memory 60, the carrying mechanism 29 of the conveying device carries the moving unit 20 to the receiving device 90, and can view the contents of the tray 50. The Y-axis spacing of the slots is set, and the Y-axis spacing of the plurality of grippers 23 is adjusted by the variable pitch adjusting mechanism, so that the grippers 23 correspond to the receiving slots of the tray 50. At this time, the receiving material is received. The device 90 controls the first susceptor 92 to axially displace the top-mounted tray 50. At this time, the plurality of trays 91 release the empty tray 50, so that the first ejector 92 can be used. The Z axial downward displacement places the empty tray 50 on the first slide rail 931, and then the first pusher 941 performs the Y axial displacement to move the empty tray 50 to the temporary zone, and the temporary zone The fixed plater 95 positions the empty tray 50 by X-axis displacement. After the empty tray 50 is positioned, the first pusher 941 is reset in the Y-axis reverse displacement, and the guide 96 is used as the YZ. Axial displacement projection In the tray 50, the guiding memory 60 is inserted into the tray 50, and each of the grippers 23 of the loading unit 20 inserts the memory 60 into the guiding fixture 96 to guide the fixture. 96 further Z-axis displacement, the memory 60 is placed in the receiving groove of the tray 50, after the tray 50 is filled with the memory 60, the second ejector 97 can be used as the Z-axis upward displacement of the top material. The tray 50 is placed on the second slide rail 932, and the tray 50 containing the memory 60 is pushed to the close by the second pusher 942 for Y-axis displacement. Above the device 98, the winder 98 is axially displaced upwardly on the second slide rail 932 to top the tray 50 that has been loaded with the memory 60. At this time, the second pusher 942 is reset by the Y-axis displacement. The winder 98 is further reset by Z-axis downward displacement, and the tray 50 containing the memory 60 is housed, thereby completing the consistent memory lower plate operation.

Referring to FIG. 25, the electronic component device of the present invention is configured with the above-mentioned mobile unit 20, which is a detecting and sorting machine for detecting electronic components, and the detecting and sorting machine is configured on the machine. There are a feeding device 100, a receiving device 110, a testing device 120, a conveying device 130, an empty device 140 and a central control device. Further, the feeding device 100 is disposed on the machine to accommodate at least one to be tested. In the present embodiment, the feeding device 100 is provided with at least one tray 1001 for housing a plurality of electronic components to be tested; the receiving device 110 is disposed on the machine to accommodate In the embodiment, the receiving device 110 is provided with at least one tray 1101 for holding a plurality of completed electronic components; the testing device 120 is provided with at least one test. a test circuit board 1201 of the socket 1202 for testing electronic components, and transmitting the test results to a central control device (not shown) by a tester (not shown), wherein the central control device controls the operation of each device; Device 130 The shifting unit is provided with at least one variable-pick pick-and-place electronic component, and the moving unit 20 is the above-mentioned moving unit for transferring electronic components. In the embodiment, the conveying device 130 is provided. There is a moving material unit 20 similar to the above-mentioned moving material unit (please refer to the figures 2, 3 and 4), and the moving material unit 20 is axially displaced by a carrier mechanism 29 to drive the device 100, The electronic component to be tested/completed is transferred between the receiving device 110 and the testing device 120, and the empty device 140 is used to receive the empty tray of the feeding device 100, and the empty tray is replenished to the receiving device 110. Used to hold the finished electronic components.

Please refer to FIG. 26 (please refer to FIG. 2, FIG. 3 and FIG. 4). When performing the detecting operation, the conveying device 130 drives the loading unit 20 to move the XY axial direction to the feeding device 100 by the carrying mechanism 29. And adjusting the Y-axis spacing of each of the grippers 23 by using the variable pitch adjusting mechanism to respectively correspond to the electronic components to be tested 150 on the tray 1001, and then taking out the to-be-tested in the tray 1001 of the feeding device 100. The electronic component 150; referring to FIG. 27, after the reclaiming, the carrying mechanism 29 of the conveying device 130 drives the moving unit 20 to axially displace the XY unit to the testing device 120, and the gripper 23 of the loading unit 20 Then, the Y-axis spacing is adjusted to respectively correspond to the test socket 1202 of the testing device 120, and then the electronic component 150 to be tested is placed in the test socket 1202 of the testing device 120 to perform a testing operation, and the testing device 120 is tested. The circuit board 1201 transmits the test signal to the tester, and the tester transmits the test result to the central control device. Referring to FIG. 28, the carrier mechanism 29 of the transport device 130 drives the mobile unit 20 to perform XY axial displacement. And in the feeding device 100 and each testing device 120 The electronic component 150 to be tested is transferred, so that each testing device 120 performs the detecting operation of the electronic component 150 to be tested. After the testing operation is completed, the carrying mechanism 29 of the conveying device 130 drives the loading unit 20 to perform XY axial displacement. The electronic component 150 is taken out at the testing device 120; referring to FIG. 29, the carrying mechanism 29 of the conveying device 130 drives the loading unit 20 to axially displace the XY unit to the receiving device 110, and moves Each of the grippers 23 of the material unit 20 adjusts the Y-axis spacing to correspond to the spacing of the receiving slots of the tray 1101, and then inserts the completed electronic component 150 into the tray of the receiving device 110 according to the test result. In 1101, the classification and collection operation is completed.

[知知]

11. . . Trays

111. . . Locating slot

12. . . Memory

13. . . Circuit board

131. . . socket

132. . . Slot

133. . . Buckle

[this invention]

20. . . Transfer unit

211. . . First rack

212. . . Second rack

213. . . Slide rail

214. . . Slide

215. . . Support rod

221. . . motor

222. . . Pulley set

223. . . Screw screw set

twenty three. . . Clamp

231. . . Ontology

232. . . Bushing

233. . . Shaft

234. . . Jaws

235. . . Bushing

236. . . Guide rod

237. . . X axial slide

twenty four. . . Shelf

241. . . Bushing

25. . . Pressure cylinder

251. . . Piston rod

26. . . link

271. . . motor

272. . . Pulley set

28. . . Activity frame

281. . . X axial slide

282. . . Chute

283. . . Wheel

29. . . Carrier mechanism

30. . . Feeding device

31. . . Disk holder

32. . . First platter

321. . . motor

322. . . Drive set

323. . . Swing frame

324. . . Chute

325. . . Convex

331. . . First rail

332. . . Second slide

341. . . First pusher

342. . . Second pusher

35. . . Fixer

36. . . Introducer

37. . . Second top plate

38. . . Closing device

40. . . Plate supply device

41. . . Loading platform

42. . . Top plate

43. . . Guide jig

431. . . Guide slot

44. . . Presser

50. . . Trays

60. . . Memory

70. . . Circuit board

71. . . socket

72. . . Buckle

80. . . Plate supply device

81. . . Loading platform

82. . . Presser

821. . . First pressure fixture

822. . . Second pressure fixture

83. . . Platen

831. . . Pressure bar

832. . . Swing block

833. . . Turbulent block

834. . . Sensor

90. . . Receiving device

91. . . Disk holder

92. . . First platter

921. . . motor

922. . . Drive set

923. . . Swing frame

924. . . Chute

925. . . Convex

931. . . First rail

932. . . Second slide

941. . . First pusher

942. . . Second pusher

95. . . Fixer

96. . . Introducer

97. . . Second top plate

98. . . Closing device

100. . . Feeding device

1001. . . Trays

110. . . Receiving device

1101. . . Trays

120. . . Test device

1201. . . Test board

1202. . . Test stand

130. . . Conveyor

140. . . Open device

150. . . Electronic component

Figure 1: Schematic diagram of a conventional memory, tray and circuit board with sockets.

Fig. 2 is a schematic view (1) of a material moving unit of the electronic component device of the present invention.

Figure 3: Schematic diagram of the material moving unit of the electronic component device of the present invention (2).

Figure 4: Schematic diagram (3) of the material transfer unit of the electronic component device of the present invention.

Figure 5: Schematic diagram of the use of adjusting the Y-axis spacing of each gripper (1).

Figure 6: Schematic diagram of the use of adjusting the Y-axis spacing of each gripper (2).

Figure 7: Schematic diagram of controlling the use of each gripper to activate.

Fig. 8 is a schematic view showing the use of controlling the gripping action of each gripper.

Figure 9: Schematic diagram of the use of driving the gripper to move up and down.

Figure 10: It is a board device with a moving unit.

Figure 11: Schematic diagram of the feeding device for the upper plate equipment.

Figure 12: Schematic diagram of the board supply device for the upper board equipment.

Figure 13: Schematic diagram of the use of the upper board equipment (1).

Figure 14: Schematic diagram of the use of the upper board equipment (2).

Figure 15: Schematic diagram of the use of the upper board equipment (3).

Figure 16: Schematic diagram of the use of the upper board equipment (4).

Figure 17: Schematic diagram of the use of the upper board equipment (5).

Figure 18: The device is a lower unit with a moving unit.

Figure 19: Schematic diagram of the board supply device for the lower board equipment.

Figure 20: Schematic diagram of the receiving device of the lower plate equipment.

Figure 21: Schematic diagram of the use of the lower board equipment (1).

Figure 22: Schematic diagram of the use of the lower board equipment (2).

Figure 23: Schematic diagram of the use of the lower board equipment (3).

Figure 24: Schematic diagram of the use of the lower board equipment (4).

Figure 25: It is a detection sorting machine with a moving unit.

Figure 26: Schematic diagram of the use of the detection sorting machine of the present invention (1).

Figure 27: Schematic diagram of the use of the detection sorter of the present invention (2).

Figure 28: Schematic diagram of the use of the detection sorter of the present invention (3).

Figure 29: Schematic diagram of the use of the detection sorter of the present invention (4).

20. . . Transfer unit

211. . . First rack

212. . . Second rack

213. . . Slide rail

214. . . Slide

215. . . Support rod

222. . . Pulley set

223. . . Screw screw set

twenty three. . . Clamp

231. . . Ontology

232. . . Bushing

234. . . Jaws

236. . . Guide rod

twenty four. . . Shelf

25. . . Pressure cylinder

251. . . Piston rod

26. . . link

28. . . Activity frame

282. . . Chute

283. . . Wheel

Claims (10)

An electronic component device with a moving unit is applied to an upper surface of an electronic component, comprising: a machine; a feeding device, which is mounted on the machine, and is used for accommodating at least one tray of a plurality of memories; a board-providing device, which is mounted on a machine board for receiving at least one circuit board of a plurality of sockets; a conveying device disposed on the machine table and provided with at least one variable-pick pick-and-place transfer electronic component a moving unit comprising a frame, a plurality of grippers and a variable pitch adjusting mechanism, each of the grippers having two corresponding jaws, and a driving source for driving at least one of the jaws to actuate The clipper is adapted to take and place electronic components. The variable pitch adjusting mechanism is provided with a driving structure on the frame, and a movable frame connected to the driving structure is horizontally mounted, and is driven by the driving structure to be horizontally displaced, and is provided with a plurality of The transmission structure is arranged at different angles, and each transmission structure is provided with a guiding sliding portion and a sliding portion on the movable frame, and the clamping device is connected by the sliding portion, and the displacement of the clamping device is respectively driven to adjust the spacing; Central control unit And integration control means of each actuator to perform automatic operation. An electronic component device with a moving unit is applied to an electronic component lower plate operation, comprising: a machine table; a plate supply device, which is mounted on the machine table and is used for receiving at least one circuit board of a plurality of memories. a receiving device, which is mounted on the machine table, and is provided with at least one empty tray for accommodating a plurality of memory bodies; and the electronic component device with the moving unit according to the first application of the patent scope is transported The moving unit of the device is provided with a plurality of grippers for picking and placing electronic components, and the distance between the grippers is adjusted by a variable pitch adjusting mechanism; the central control device is used for controlling and integrating the operations of the devices to perform automation. operation. An electronic component device with a moving unit for detecting electronic components, comprising: a machine; a feeding device disposed on the machine for accommodating at least one electronic component to be tested; a receiving device, configured And a test device disposed on the machine, and having a test circuit board having at least one test socket for detecting electronic components; In the electronic component device of the above-mentioned moving unit, the moving unit of the conveying device is provided with a plurality of grippers for picking and placing electronic components, and the distance between the grippers is adjusted by the variable pitch adjusting mechanism; Control devices are used to control and integrate the various devices to perform automated operations. The electronic component device with the moving unit according to the first, second or third aspect of the patent application, wherein the moving unit of the conveying device is provided on the frame with at least one bearing portion arranged in the Y-axis direction The gripper is provided with a body having at least one sliding portion, and is slidably placed on the sliding portion of the frame by the sliding portion, so that the body is erected on the frame and is displaceably movable, and is also used for each gripper. At least one guiding portion disposed in the X-axis direction is disposed on the side of the main body for assembling the clamping jaw, and the clamping jaw is provided with a sliding portion disposed in the X-axis direction, and is slidably disposed on the guiding portion of the main body by the sliding portion. The electronic component device with the moving unit according to the fourth aspect of the patent application, wherein the sliding portion of the frame is a support rod, and the sliding portion of the clamp is a sleeve and is slipped by the sleeve The guide rods are placed on the support rods of the frame, and the guiding portions of the other grippers are shaft rods, and the sliding portion of the jaws is a sleeve, and the sleeve is slid on the shaft of the body. The electronic component device with a moving unit according to the first, second or third aspect of the patent application, wherein each of the gripping units of the moving unit of the conveying device is respectively provided with a body placed on the frame. The driving source is provided with a power structure for driving the swaying structure of a connecting jaw, and driving the at least one jaw to sandwich the electronic component with the swaying structure. The electronic component device with a moving unit according to the sixth aspect of the patent application, wherein the power structure may be a pressure cylinder, and the turbulent structure is provided with a frame for holding the pressure cylinder above the body, and The piston rod of the pressure cylinder is coupled to the body, and the support frame is pivotally provided with a connecting rod on at least one side, and the other end of the connecting rod is pivotally connected to the clamping claw for driving the clamping jaw to perform X-axis displacement and sandwiching the electronic component. The components, the other grippers are provided with at least one guiding rod above the body, and each of the brackets is provided with a sleeve sleeve disposed outside the guiding rod. The electronic component device with the moving unit according to the first, second or third aspect of the patent application, wherein the driving structure of the variable pitch adjusting mechanism of the conveying device is provided with a driving source of the motor on the frame, and The motor drive can be a drive set of the pulley set, and the pulley set is coupled to drive a movable frame of the horizontally mounted drive structure for X-axis displacement, and the other transmission structures are disposed on the movable frame at least at different angles and The sliding portion is a sliding portion of the sliding slot, and the sliding portion is at least one roller that is placed in the sliding slot, and the roller is connected to the gripper, and the angle configuration of each sliding slot is required to move according to the variable distance of the gripper. The relationship between the distance and the moving distance of the movable frame is obtained. The electronic component device with the moving unit according to the first, second or third aspect of the patent application, wherein the moving unit of the conveying device is matched with the movable frame and a fixed type of gripper. X-axis slide and X-axis slide rails are used to assist the smooth displacement of the movable frame. The electronic component device with the moving unit according to Item 1, 2 or 3 of the patent application scope is further provided with a lifting mechanism on the frame for driving a plurality of grippers and a variable pitch adjusting mechanism for the Z axis. Displacement.