CN210272297U - Wafer auxiliary guiding equipment - Google Patents
Wafer auxiliary guiding equipment Download PDFInfo
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- CN210272297U CN210272297U CN201921656450.0U CN201921656450U CN210272297U CN 210272297 U CN210272297 U CN 210272297U CN 201921656450 U CN201921656450 U CN 201921656450U CN 210272297 U CN210272297 U CN 210272297U
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- wafer
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Abstract
The utility model provides a wafer auxiliary guide equipment for the semiconductor manufacturing board, equipment includes: the auxiliary ring body is provided with an opening for the wafer to enter and exit; the fixing frame is fixedly connected to the auxiliary ring body; and the auxiliary positioning pins are fixedly connected to the fixed frame and are in contact with the edge of the wafer to position the wafer at a standard position. The utility model discloses an auxiliary guiding equipment of wafer outside the board has replaced the locating pin of original fixed on the semiconductor manufacturing board as the appurtenance of wafer location and evacuation, after the counterpoint, will the auxiliary guiding equipment of wafer wholly removes, can avoid the wafer because of with locating pin contact heating time, because the thermal energy causes the locating pin to oppress the wafer, leads to the wafer to damage or cracked defect.
Description
Technical Field
The utility model relates to a semiconductor manufacturing equipment especially relates to a wafer auxiliary guide equipment.
Background
The manufacturing process of semiconductor devices can be generally divided into wafer processing, wafer testing, packaging and final testing. In the wafer process, electronic circuit components are fabricated on a silicon wafer, and after the fabrication is completed, chips (die) are formed on the wafer in a grid-like arrangement. In the wafer testing step, the electrical property of the chips is tested, and unqualified chips are eliminated. And then cutting the wafer into a plurality of chips. Packaging is to package a qualified chip into an integrated circuit. Finally, the quality of the integrated circuit is ensured through an electrical test.
In the above processes, the wafer needs to be aligned accurately to perform the above semiconductor process effectively. Therefore, it is very important for those skilled in the art to align the wafer.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages of the prior art, an object of the present invention is to provide a wafer auxiliary guiding apparatus for solving the problem that after the wafer is aligned in the prior art, the wafer is easily damaged or cracked due to expansion in the subsequent thermal process.
To achieve the above and other related objects, the present invention provides a wafer auxiliary guiding apparatus for a semiconductor manufacturing machine, the apparatus comprising: the auxiliary ring body is provided with an opening for the wafer to enter and exit; the fixing frame is fixedly connected to the auxiliary ring body; and the auxiliary positioning pins are fixedly connected to the fixed frame and are in contact with the edge of the wafer to position the wafer at a standard position.
Optionally, the auxiliary ring body has a flat bottom surface, and is stably placed on the semiconductor manufacturing machine when being matched with the semiconductor manufacturing machine.
Optionally, the auxiliary ring body has an outer diameter of 450 mm to 550 mm, an inner diameter of 400 mm to 500 mm, a thickness of 30 mm to 60 mm, and a width of 305 mm to 350 mm.
Optionally, the auxiliary ring body is made of one of heat-resistant metal, quartz and ceramic.
Optionally, the fixing frame includes a plurality of fixing rod sets, each fixing rod set includes three fixing rods connected at first end points, the auxiliary positioning pin is fixedly disposed at a joint of the first end points, and second end points of the fixing rods are fixed on the auxiliary ring body.
Optionally, the number of the auxiliary positioning pins is two, and an included angle between each of the two auxiliary positioning pins and two connecting lines of the center of the wafer circle is between 45 ° and 135 °.
Optionally, the auxiliary positioning pin is disposed in a semicircular area of the auxiliary ring body away from the opening to avoid blocking the wafer from entering.
Optionally, the semiconductor manufacturing machine has a wafer positioning point corresponding to the standard position, the wafer positioning pin on the wafer positioning point is removed, and when the wafer auxiliary guiding device is matched with the semiconductor manufacturing machine, the auxiliary positioning pin is aligned and faces the wafer positioning point of the semiconductor manufacturing machine.
Optionally, the semiconductor manufacturing machine has a wafer carrying surface, and when the wafer auxiliary guiding apparatus is matched with the semiconductor machine, the end surface of the auxiliary positioning pin is lower than the top surface of the wafer and higher than the wafer carrying surface of the semiconductor manufacturing machine.
Optionally, a screw hole is formed in the fixing frame, and the auxiliary positioning pin is connected to the screw hole through threads.
Optionally, a handle is further disposed on the auxiliary ring body.
The utility model also provides a wafer auxiliary guide equipment's application method, application method includes the step: 1) the wafer auxiliary guiding equipment in any scheme is stably placed on the semiconductor manufacturing machine table based on the standard position of a wafer; 2) Putting a wafer on a wafer bearing surface of the semiconductor manufacturing machine table through the opening, and enabling the edge of the wafer to be in contact with the auxiliary positioning pin so as to position the wafer at the standard position; 3) removing the wafer auxiliary guide equipment from the semiconductor manufacturing machine.
Optionally, before the step 3), a step of evacuating a chamber in which a wafer in the semiconductor manufacturing machine is located is further included.
As above, the utility model discloses a wafer auxiliary guide equipment has following beneficial effect:
the utility model discloses an auxiliary guiding equipment of wafer outside the board has replaced the locating pin of original fixed on the semiconductor manufacturing board as the appurtenance of wafer location and evacuation, after the counterpoint, will the auxiliary guiding equipment of wafer wholly removes, can avoid the wafer because of with locating pin contact heating time, because the thermal energy causes the locating pin to oppress the wafer, leads to the wafer to damage or cracked defect.
The utility model discloses supplementary direction equipment of wafer removes before technology carries out, can effectively improve technology operation environment, avoids the influence that external environment caused the technology to optimize process flow, promote the man-hour productivity UPH of technology unit.
Drawings
Fig. 1 to 2 are schematic structural views of the wafer auxiliary guiding apparatus of the present invention, wherein fig. 2 is a schematic cross-sectional structure view of fig. 1 at a-a'.
Fig. 3 is a schematic structural diagram of steps of a method for using the wafer auxiliary guiding apparatus according to the present invention.
Description of the element reference numerals
101 auxiliary ring body
1011 opening
102 first fixed rod group
103 second set of fixation bars
104 first auxiliary positioning pin
105 second auxiliary positioning pin
106 wafer
107 screw
108 handle
S11-S14 steps 1) -4)
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structure are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
A wafer alignment device is characterized in that a hole groove is formed in a wafer bearing table, a positioning pin is inserted into the hole groove in a threaded mode, and alignment of a wafer is achieved through contact between the positioning pin and the edge of the wafer. However, during the subsequent semiconductor manufacturing process, the wafer may be pressed by the positioning pins due to thermal expansion, and the wafer may be damaged or cracked.
To solve the above problem, as shown in fig. 1-2, the present embodiment provides a wafer auxiliary guiding apparatus, which is used in a semiconductor manufacturing machine, for example, a wafer level processing machine, such as a wafer level packaging machine, and the like, the semiconductor manufacturing machine has a wafer carrying surface, which may be provided by a wafer carrier or a wafer chuck, and the semiconductor manufacturing machine may originally include a wafer positioning pin, and the wafer positioning pin is removed, or the semiconductor manufacturing machine is directly configured not to include a wafer positioning pin, and in this embodiment, the semiconductor manufacturing machine has a wafer positioning point corresponding to the standard position, and the wafer positioning pin on the wafer positioning point is removed. Since the semiconductor manufacturing machine does not have a wafer alignment function, the embodiment provides a wafer auxiliary guiding device used in cooperation with the semiconductor manufacturing machine, and the wafer auxiliary guiding device mainly includes an auxiliary ring body, a fixing frame, and at least two auxiliary positioning pins.
As shown in fig. 1, the auxiliary ring has an opening 1011 for accessing the wafer 106. Illustratively, the auxiliary ring body has an outer diameter of 450 mm to 550 mm, an inner diameter of 400 mm to 500 mm, a thickness of 30 mm to 60 mm, and a width of the opening 1011 of 305 mm to 350 mm. In a specific implementation, the outer diameter of the auxiliary ring is 500 mm, the inner diameter is 450 mm, the thickness is 50 mm, the width of the opening 1011 is 305 mm, and the wafer 106 is a wafer with a diameter of 300 mm. It should be noted that, for the manufacturing machines of wafers with different sizes, the auxiliary ring body may select different size parameters to achieve better space utilization.
The auxiliary ring body is made of one of heat-resistant metal, quartz and ceramic. For example, in the present embodiment, the material of the auxiliary ring body is selected from high temperature resistant metals, such as stainless steel.
The auxiliary ring body is provided with a flat bottom surface and is stably placed on the semiconductor manufacturing machine when being matched with the semiconductor manufacturing machine. Certainly, the auxiliary ring body can be directly placed on the semiconductor manufacturing machine, a bolt can be arranged on the semiconductor manufacturing machine, meanwhile, a jack is arranged at the bottom of the auxiliary ring body, the auxiliary ring body is positioned and connected with the semiconductor manufacturing machine through the connection of the bolt and the jack, the number of the jacks and the number of the bolts can be between 2 and 5, the auxiliary ring body and the semiconductor manufacturing machine can be positioned more accurately through the configuration, and the connection stability between the auxiliary ring body and the semiconductor manufacturing machine is improved.
As shown in fig. 1, the auxiliary ring body is further provided with a handle 108. The handles 108 are respectively disposed on two side surfaces of the auxiliary ring body, so as to facilitate placement and removal of the wafer auxiliary guide device.
As shown in fig. 1, the fixing frame is fixedly connected to the auxiliary ring body, the fixing frame includes a plurality of fixing rod groups, each fixing rod group includes three fixing rods with first end points connected to each other, the auxiliary positioning pin is fixedly disposed at a joint of the first end points, and second end points of the fixing rods are fixed to the auxiliary ring body. The second end of the fixing rod may be connected or welded to the auxiliary ring body by a screw 107, and in this embodiment, the second end of the fixing rod may be connected to the auxiliary ring body 101 by a screw 107.
The auxiliary positioning pins are fixedly connected to the fixing frame, and the auxiliary positioning pins are used for positioning the wafer 106 at a standard position by contacting with the edge of the wafer 106. For example, the fixing frame is provided with a screw hole, and the auxiliary positioning pin is connected to the screw hole through threads.
In this embodiment, the fixing frame includes a first fixing rod group 102 and a second fixing rod group 103, the number of the auxiliary positioning pins is two, and the two auxiliary positioning pins include a first auxiliary positioning pin 104 and a second auxiliary positioning pin 105, which are respectively fixed on the first fixing rod group 102 and the second fixing rod group 103, and an included angle between the two auxiliary positioning pins and two connecting lines of the center of the wafer 106 is between 45 ° and 135 °, for example, an included angle between the two connecting lines of the centers of the first auxiliary positioning pin 104 and the wafer 106 and the two connecting lines of the center of the second auxiliary positioning pin 105 are 90 °. Specifically, the auxiliary positioning pins are disposed in a semicircular area of the auxiliary ring 101 away from the opening 1011 to avoid blocking the wafer 106.
As shown in fig. 1 and 2, the semiconductor manufacturing machine has a wafer positioning point corresponding to the standard position, the wafer positioning pin on the wafer positioning point is removed, when the wafer auxiliary guiding apparatus is engaged with the semiconductor manufacturing machine, the auxiliary positioning pin is aligned and faces the wafer positioning point of the semiconductor manufacturing machine, and an end surface of the auxiliary positioning pin is lower than a top surface of the wafer and higher than a wafer carrying surface of the semiconductor manufacturing machine.
As shown in fig. 3, this embodiment further provides a method for using a wafer auxiliary guiding apparatus, where the method includes:
as shown in fig. 3, step 1) S11 is performed first, and the wafer auxiliary guiding apparatus is placed on the semiconductor manufacturing machine based on the standard position of the wafer.
As shown in fig. 3, step 2) S12 is then performed to place the wafer 106 on the wafer carrying surface of the semiconductor manufacturing machine through the opening 1011, and to make the edge of the wafer 106 contact with the auxiliary positioning pin to position the wafer 106 at the standard position.
As shown in fig. 3, step 3) S13 is performed to evacuate the chamber in which the wafer 106 is located in the semiconductor manufacturing tool.
As shown in fig. 3, step 4) S14 is finally performed to remove the wafer auxiliary guiding apparatus from the semiconductor manufacturing machine.
As above, the utility model discloses a wafer auxiliary guide equipment has following beneficial effect:
the utility model discloses an auxiliary guiding equipment of wafer outside the board has replaced the locating pin of original fixed on the semiconductor manufacturing board as the appurtenance of wafer location and evacuation, after the counterpoint, will the auxiliary guiding equipment of wafer wholly removes, can avoid the wafer because of with locating pin contact heating time, because the thermal energy causes the locating pin to oppress the wafer, leads to the wafer to damage or cracked defect.
The utility model discloses supplementary direction equipment of wafer removes before technology carries out, can effectively improve technology operation environment, avoids the influence that external environment caused the technology to optimize process flow, promote the man-hour productivity UPH of technology unit.
Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (11)
1. A wafer auxiliary guiding apparatus for a semiconductor manufacturing machine, the apparatus comprising:
the auxiliary ring body is provided with an opening for the wafer to enter and exit;
the fixing frame is fixedly connected to the auxiliary ring body;
and the auxiliary positioning pins are fixedly connected to the fixed frame and are in contact with the edge of the wafer to position the wafer at a standard position.
2. The wafer auxiliary guide apparatus of claim 1, wherein: the auxiliary ring body is provided with a flat bottom surface and is stably placed on the semiconductor manufacturing machine when being matched with the semiconductor manufacturing machine.
3. The wafer auxiliary guide apparatus of claim 1, wherein: the outer diameter of the auxiliary ring body is 450-550 mm, the inner diameter is 400-500 mm, the thickness is 30-60 mm, and the width of the opening is 305-350 mm.
4. The wafer auxiliary guide apparatus of claim 1, wherein: the auxiliary ring body is made of one of heat-resistant metal, quartz and ceramic.
5. The wafer auxiliary guide apparatus of claim 1, wherein: the fixing frame comprises a plurality of fixing rod groups, each fixing rod group comprises three fixing rods connected with first end points, the auxiliary positioning pins are fixedly arranged at the joints of the first end points, and second end points of the fixing rods are fixedly arranged on the auxiliary ring body.
6. The wafer auxiliary guide apparatus of claim 1, wherein: the number of the auxiliary positioning pins is two, and the included angle between the two auxiliary positioning pins and two connecting lines of the circle center of the wafer is 45-135 degrees.
7. The wafer auxiliary guide apparatus of claim 1, wherein: the auxiliary positioning pin is arranged in a semicircular area of the auxiliary ring body far away from the opening so as to avoid blocking the wafer from entering.
8. The wafer auxiliary guide apparatus of claim 1, wherein: the wafer positioning point corresponding to the standard position is arranged on the semiconductor manufacturing machine table, the wafer positioning pin on the wafer positioning point is removed, and when the wafer auxiliary guiding equipment is matched with the semiconductor manufacturing machine table, the auxiliary positioning pin is aligned and faces the wafer positioning point of the semiconductor manufacturing machine table.
9. The wafer auxiliary guide apparatus of claim 1, wherein: the semiconductor manufacturing machine table is provided with a wafer bearing surface, and when the wafer auxiliary guide equipment is matched with the semiconductor manufacturing machine table, the end surface of the auxiliary positioning pin is lower than the top surface of the wafer and higher than the wafer bearing surface of the semiconductor manufacturing machine table.
10. The wafer auxiliary guide apparatus of claim 1, wherein: the fixing frame is provided with a screw hole, and the auxiliary positioning pin is connected to the screw hole through threads.
11. The wafer auxiliary guide apparatus of claim 1, wherein: the auxiliary ring body is also provided with a handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921656450.0U CN210272297U (en) | 2019-09-30 | 2019-09-30 | Wafer auxiliary guiding equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921656450.0U CN210272297U (en) | 2019-09-30 | 2019-09-30 | Wafer auxiliary guiding equipment |
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| Publication Number | Publication Date |
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| CN210272297U true CN210272297U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921656450.0U Active CN210272297U (en) | 2019-09-30 | 2019-09-30 | Wafer auxiliary guiding equipment |
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| CN (1) | CN210272297U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582325A (en) * | 2019-09-30 | 2021-03-30 | 中芯长电半导体（江阴）有限公司 | Wafer auxiliary guiding equipment |
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2019
- 2019-09-30 CN CN201921656450.0U patent/CN210272297U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582325A (en) * | 2019-09-30 | 2021-03-30 | 中芯长电半导体（江阴）有限公司 | Wafer auxiliary guiding equipment |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province (place of business: No.9 Dongsheng West Road, Jiangyin City) Patentee after: Shenghejing micro semiconductor (Jiangyin) Co.,Ltd. Address before: No.78 Changshan Avenue, Jiangyin City, Wuxi City, Jiangsu Province Patentee before: SJ Semiconductor (Jiangyin) Corp. |
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| CP03 | Change of name, title or address |