CN101661875B - Equipment for de-encapsulation of BGA encapsulation - Google Patents
Equipment for de-encapsulation of BGA encapsulation Download PDFInfo
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- CN101661875B CN101661875B CN2009101710897A CN200910171089A CN101661875B CN 101661875 B CN101661875 B CN 101661875B CN 2009101710897 A CN2009101710897 A CN 2009101710897A CN 200910171089 A CN200910171089 A CN 200910171089A CN 101661875 B CN101661875 B CN 101661875B
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Abstract
The invention discloses equipment for the de-encapsulation of BGA encapsulation. The equipment comprises a supporting component provided with an open area and an adjustable device coupled with the supporting component, wherein the adjustable device comprises a first gripper and a second gripper, the first gripper is moveably arranged on the first part of the supporting component, and the second gripper is moveably arranged on the second part of the supporting component; the first metal gripper is arranged and slides on the first part of the supporting component, and the second metal gripper is arranged and slides on the second part of the supporting component; the first and the second grippers respectively comprise a gripping surface, and the gripping surfaces are used for contacting the lateral face of the BGA encapsulation perpendicular to a welding ball as well as the lateral face of the surface to be removed; and the equipment is provided with a de-encapsulation source which acts on one part of the surface area of the BGA encapsulation so that the part of the BGA encapsulation can be removed.
Description
The application is application number " 200610147452.8 ", the applying date " on December 15th, 2006 ", the dividing an application of denomination of invention " ball grid array type encapsulation multipurpose decapsulation clamper and method ".
Technical field
The present invention relates to be used for integrated circuit and the processing thereof that semiconductor device is made.Especially, the invention provides and a kind ofly be used for fixing BGA (BGA) encapsulation and make it can be by the method and apparatus of decapsulation.Only through example, the present invention can be used to the BGA encapsulation of different size, and needn't adopt independent decapsulation clamper to each package dimension.But should be realized that it is much extensive that the scope of application of the present invention is wanted.
Background technology
The interconnect devices that integrated circuit or " IC " will make on single silicon chip develops into millions of by several.At present, the performance that integrated circuit provided and complexity are considerably beyond imagining at first.In order to improve complexity and current densities (that is, on given chip area can packaged device quantity), minimum device feature size, just known device " geometry " is along with development of integrated circuits becomes littler.Nowadays making less than 1/4th microns wide semiconductor device.
Increase complexity and performance that current densities has not only improved integrated circuit, and lower cost is provided for the user.One cover IC processing equipment spends several hundred million even tens dollars possibly.Each production equipment all has certain wafer throughput, and on each wafer the integrated circuit of some will be arranged all.Therefore, through doing forr a short time, just can on each wafer, do more device, the output that so just can increase manufacturing facilities to each device on the integrated circuit.After in IC processing equipment, accomplishing the manufacturing of each device, these devices must pass through test and encapsulate the reliability with the circuit that guarantees manufacturing.Technology that can be used for encapsulating the circuit of manufacturing be with circuit package in BGA (BGA) encapsulation, wherein circuit package is come protective circuit in moulding material, make it avoid exposing or undesirable contact.Solder sphere is attached to the base portion of encapsulation, so that the reliable electrical connection from integrated circuit to be provided.
After carrying out encapsulation process on the integrated circuit, decapsulation or open encapsulation possibly so that the internal feature of integrated circuit or encapsulation is analyzed or electric-examination is looked into.For example, after decapsulation, may carry out the heat test, focus whether to occur on the chip after definite circuit cycles work to the circuit that exposes.The Another reason of encapsulation being carried out decapsulation is cross spider and pin hole in the inspection integrated circuit.Decapsulation process can comprise such as the pure mechanical process that prizes or excise encapsulated layer, maybe can utilize chemical etching, plasma etching or hot machinery to remove process and remove encapsulated layer.
Part in the decapsulation process is to guarantee that BGA encapsulation and decapsulation equipment are suitably fixing and directed, integrated circuit is not caused any damage so that can suitably remove operation.The decapsulation clamper can be used for this process.Yet the BGA encapsulation of making different size usually is to adapt to the integrated circuit of different size and shape.The BGA encapsulation of different size uses different decapsulation clampers can cause cost to increase, because in IC processing equipment, will maintain multiple decapsulation clamper.Have different decapsulation clampers and also possibly cause processing time lengthening, because must replace the decapsulation clamper according to the integrated circuit of different size before carrying out decapsulation process circuit.
Can find out by the above, need a kind of improved method and apparatus that is used for the decapsulation of semiconductor packages.
Summary of the invention
The present invention relates to be used for the integrated circuit and the processing thereof of semiconductor device processing technology.Especially, the invention provides and a kind ofly be used for fixing BGA (BGA) encapsulation and make it can be by the method and apparatus of decapsulation.Only through example, the present invention is applicable to the BGA encapsulation of different size, and need not use independent decapsulation clamper for each package dimension.But should be realized that it is much extensive that the scope of application of the present invention is wanted.
In a concrete embodiment, a kind of equipment that is used for integrated circuit encapsulation decapsulation is provided.This equipment comprises support component, the tunable arrangement that said support component has the open zone and is coupled with support component.Tunable arrangement is used for fixing BGA encapsulation so that the surf zone of BGA encapsulation is spatially placed in the face of de-encapsulation source, and avoid in the BGA encapsulation a plurality of balls with can cause the de-encapsulation source of damage and thermal source to contact to one or more balls.A part that provides de-encapsulation source to act on BGA package surface zone is so that remove this part of BGA encapsulation.
Among another concrete embodiment, a kind of equipment that is used for integrated circuit encapsulation decapsulation is provided.This equipment comprises support component, and said support component has open zone and tunable arrangement.Tunable arrangement is used for fixing the integrated circuit encapsulation, so that the surf zone of integrated circuit encapsulation is spatially placed in the face of de-encapsulation source.In addition, tunable arrangement comprises and being configured at first clamper that moves in the first of said support component and second clamper that is configured to move on can the second portion at support component.Provide de-encapsulation source to act on the regional part of said integrated circuit package surface to remove this part of integrated circuit encapsulation.
Among another concrete embodiment, a kind of method that is used for BGA encapsulation decapsulation is provided.This method comprises the BGA encapsulation that provides to comprise surf zone and a plurality of solder sphere, provides support parts, and said support component has the open zone, and the tunable arrangement that is coupled with support component is provided.Utilize tunable arrangement that BGA encapsulation is fixed on the support component, make the BGA encapsulation point to de-encapsulation source, and a plurality of solder sphere does not have Mechanical Contact with the tunable arrangement maintenance.Then, the open zone through said support section is exposed to de-encapsulation source with the surf zone that BGA encapsulates.
The present invention compares with conventional art, can obtain many benefits.For example, present technique provides a kind of wieldy method that depends on conventional art.In certain embodiments, IC processing equipment does not need a plurality of decapsulation clampers, so just can reach the purpose of practicing thrift cost.In other embodiments, owing to need in each decapsulation process, not change the decapsulation clamper, the processing time can be reduced to adapt to the BGA encapsulation of different size.Preferably, the invention provides a kind of de-encapsulation method and equipment that is applicable to different size BGA encapsulation.Depend on embodiment, can obtain one or more in these benefits.To run through this specification below, these and other benefit will be done more detailed description.
In order to make the object of the invention, characteristic and advantage clearer, will combine detailed description and accompanying drawing that the present invention is done further description below.
Description of drawings
Fig. 1 is the rough schematic view of the integrated circuit that is coupled with BGA Package;
Fig. 2 for decapsulation after the simplified schematic top view of the integrated circuit that is coupled of BGA Package;
Fig. 3 is the rough schematic view of decapsulation equipment;
Fig. 4 is the simplified schematic flowchart according to the decapsulation process of the embodiment of the invention;
Fig. 5-6 is the rough schematic view according to the decapsulation clamper of the embodiment of the invention; And
Fig. 7-13 is the rough schematic view of decapsulation clamper and sample guider according to an embodiment of the invention.
Embodiment
The present invention relates to be used for integrated circuit and the processing thereof that semiconductor device is made.Especially, the invention provides and a kind ofly be used for fixing BGA (BGA) encapsulation and make it can be by the method and apparatus of decapsulation.Only through example, the present invention is applicable to the BGA encapsulation of different size, and need not use independent decapsulation clamper to each package dimension.But should be realized that it is much extensive that the scope of application of the present invention is wanted.
Fig. 1 is the rough schematic view of the integrated circuit that is coupled with BGA Package.BGA encapsulation 100 can be in the multiple concrete BGA encapsulation a kind of, include but not limited to PBGA, uBGA, complete matrix BGA, SBGA, TBGA, CBGA and FBGA encapsulation.At first, on silicon chip, form integrated circuit 2, ready for encapsulating.Surf zone at integrated circuit 2 forms pad 4, allows circuit to be electrically connected with distributing board 10 through distribution 6.For example, distribution 6 can comprise the metallic bond zygonema that extends to distributing board 10 from pad 4.The part of integrated circuit 2, bonding line 6 and distributing board 10 is covered on formation encapsulated layer 8 in the protective layer, avoid the influence of external environment condition, still will allow simultaneously to carry out conductivity and heat release through encapsulating material to protect integrated circuit 2 and distribution thereof.For example, encapsulated layer 8 can adopt epoxide resin material or plastic material to form.Distributing board 10 can be the high-performance multilayer distributing board structure that is formed by laminated material, and this structure comprises several layers conductor and insulator so that a plurality of different electrical connection from integrated circuit to be provided.Distributing board 10 has an area array like the outside terminal of solder sphere 12 that is arranged on package surface zone.Through the BGA encapsulation of solder sphere 12 being arranged to an array, can being formed have a large amount of high density of terminals 100.
Fig. 2 for decapsulation after the simplified schematic top view of the integrated circuit that is coupled of BGA encapsulation.The process of execution decapsulation removes the part of encapsulating material 8 from BGA encapsulation 100, be convenient to check or check the wafer and the internal feature of encapsulation.After decapsulation process, thereby integrated circuit 2 is exposed out and can further tests and analyze integrated circuit 2 and distribution thereof with distributing board 10.Pad area 4 on the integrated circuit 2 links to each other with distributing board 10 through bonding lead 6.After the decapsulation process, the part of encapsulated layer 8 still can exist.
Fig. 3 is for carrying out the rough schematic view that BGA encapsulates the decapsulation equipment of decapsulation process above that.For example, can combine Fig. 4 to understand Fig. 3 better, Fig. 4 is the simplified schematic flowchart according to the decapsulation process of the embodiment of the invention.Decapsulation process 400 comprises: the step 402 that provides the BGA encapsulation to conciliate sealed in unit, and in decapsulation equipment, fix the step 404 that encapsulates with directed BGA, and the BGA encapsulation is exposed to the step 406 of de-encapsulation source.This figure is merely an example, should too not limit the scope of claim.Those skilled in the art can make any variation, change and modification.
In step 400, provide to comprise a BGA encapsulation 306 that needs the integrated circuit and the de-encapsulating devices 300 of decapsulation.De-encapsulating devices can comprise a plurality of elements that are used for BGA is encapsulated 306 decapsulations.Sample guider 308 can be used to do the support component of BGA encapsulation 306.For example, the sample guider can have open zone 310, to avoid contacting the solder sphere side of BGA encapsulation 306, reduces because the possible damage that the disturbance of responsive solder sphere causes and the possible of electric problem taken place.Another example forms mating holes 314 on sample guider 308, be used for sample guider 308 is accurately aimed at decapsulation fixture 320.This alignment procedures can adopt near the guide pin 322 of decapsulation fixture 320 and accomplish.In a concrete embodiment, sample guider 308 is fixed on the decapsulation platform 326 with two guide pins 322.In another concrete embodiment, guider 308 can be formed by the aluminum that has nickel coating.Other variation, modification and change also can be arranged certainly.
Encapsulating material 316 is inserted between the end face and decapsulation fixture 320 of BGA encapsulation 306 as the intermediate layer.Directed BGA encapsulation 306 makes the encapsulating material in the BGA encapsulation 306 face decapsulation fixture 320, and the BGA side is in the face of sample guiding clamper 302 simultaneously.For example, can there be a hole at the center of packaging material 306, allows to contact and remove from the de-encapsulation source of decapsulation fixture 320 package surface of BGA encapsulation 306.In another example, packaging material 306 can comprise elastomeric material, and this material can resist any because the adverse effect that contacts and caused with de-encapsulation source from decapsulation fixture 320, as corroding or structural damage.Packing guider 318 can combine with packaging material 316, is used for packaging orientation material 316 between BGA encapsulation 306 and decapsulation fixture 320, so that carry out decapsulation process.In a concrete embodiment, packing guider 318 is frameworks that are coupled in decapsulation fixture 320, and packaging material 316 are accurately located.Other variation, modification and change also can be arranged certainly.
In step 404, decapsulation clamper 500 and 600 is used to BGA encapsulation 306 is fixed in and carries out decapsulation on the sample guider 308.In addition, regulate the decapsulation clamper and come clamping BGA encapsulation 306, so that the surf zone of BGA encapsulation is spatially placed in the face of de-encapsulation source.In a concrete embodiment, a plurality of balls in the BGA encapsulation do not contact with de-encapsulation source.In another embodiment, a plurality of balls in the BGA encapsulation not with can cause the thermal source of damage to contact to one or more balls.The additional detail relevant with decapsulation clamper 500 and 600 will combine Fig. 5-10 to discuss.Decapsulation equipment comprises sample guiding clamper 302 in addition, and itself and sample guider 308 and decapsulation clamper 500 and 600 are coupled.For example, sample guiding clamper 302 can be a mechanical device, is convenient to removing automatically and decapsulation of BGA encapsulation.Other variation, modification and change also can be arranged certainly.
In decapsulation equipment 300 after the step 404 of fixing and directed BGA encapsulation 306, the surf zone that de-encapsulation source is put on BGA encapsulation 306 is used for removing in step 406 at least a portion of BGA encapsulation 306.Can BGA be encapsulated 306 then and remove from decapsulation equipment 300, and the wafer and the bulk properties of inspection encapsulation.
Fig. 5 and Fig. 6 are the rough schematic view of decapsulation clamper according to an embodiment of the invention.These figure should too not limit the scope of claim only as an example.Those skilled in the art can make various changes, change and modification.Decapsulation clamper 500 and 600 can be coupled in sample guider 308, and together is used for clamping BGA encapsulation 306 and carries out decapsulation.In specific embodiment, decapsulation clamper 500 and 600 is mutually identical.For example, the characteristic that identical function had on the characteristic that shown of decapsulation clamper 500 and the decapsulation clamper 600 is similar.Other variation, modification and change also can be arranged certainly.
Fig. 5 is the inverted view of decapsulation clamper 500.Decapsulation clamper 500 has a clamping area 504, and in decapsulation process, this clamping area and BGA encapsulation 306 is perpendicular to the contacts side surfaces on the side of solder sphere and the surface that will remove.For example, clamping area 504 can have the height higher than plane 510, so that in the process of fixedly BGA encapsulation 306, increases the surface area that contacts between the side of clamping area 504 and BGA encapsulation 306.The length of clamping area 504 is greater than the length of typical BGA encapsulation, to be adapted to multiple BGA package dimension.Relative with clamping area 504 is outer surface 502, and the position of it and BGA encapsulation 306 is relative.Another example is made groove 506 to reduce the being applied to pressure on the wafer in the fixation procedure.In another example, the decapsulation clamper comprises that further two are raised end 508, and it highly is higher than plane 510.Decapsulation clamper 500 can be positioned on the sample guider 310, raises end 508 in the face of decapsulation platform 346.Raise end 508 and extend manyly, thereby can prevent that decapsulation clamper 500 from moving to undesirable direction than the height of sample guider 310.This point can more be clear that from Fig. 7-10.Other variation, modification and change also can be arranged certainly.
Fixture 512 is positioned at raising on the part 508 of decapsulation clamper 500, and allows decapsulation clamper 500 before decapsulation, to be temporarily fixed on the sample guider 310, and cancellation is fixing after decapsulation is accomplished.Through the position of the encapsulation clamper 500 of fixed solution on sample guider 310 and 600, the position that BGA encapsulation 306 can be set between decapsulation clamper 500 and 600 is used for decapsulation process.In a specific embodiment, fixture can be included in raises the screw of tightening through screw in the part 508, with the offside of contact sample guider 310 and fixedly BGA encapsulate 306 position.Although two fixtures 512 are shown on the side of decapsulation clamper 500, and a fixture 512 is shown on the offside of decapsulation clamper 500, also can carries out other configurations fixture.Other variation, modification and change also can be arranged certainly.
Fig. 7 is according to the decapsulation clamper of the embodiment of the invention and the rough schematic view of sample guider.This figure is merely example, should too not limit the scope of claim.Those skilled in the art can make various changes, change and modification.Shown in Figure 7 is the decapsulation clamper 500 and 600 that is coupled with sample holder 308. Decapsulation clamper 500 and 600 is placed on the sample holder 308, raise part 508 and extend on the sample holder 308.Clamping area 508 (Fig. 7 is not shown) extends in the open zone 310 of sample holder 308.Flat region on the decapsulation clamper 500 and 600 510 and decapsulation clamper 500 and 600 end face are changed to parallel, make decapsulation clamper 500 and 600 on the direction of appointment, to move horizontally.In a concrete embodiment, decapsulation clamper 500 and 600 is along the longer side lengthwise movement of sample holder 308.In another concrete embodiment, the material that is used for decapsulation clamper 500 and 600 can be for having the aluminium of nickel coating.In case between decapsulation clamper 500 and 600, be provided with the appropriate location of BGA encapsulation 306 with respect to de-encapsulation source, fixture 512 just can be used for decapsulation clamper 500 and 600 and BGA encapsulate and be fixed on the sample holder 308.In case the completion decapsulation process just can be unclamped fixture 512, move decapsulation clamper 500 and 600, remove from decapsulation equipment 300 to allow BGA to encapsulate 306.Other variation, modification and change also can be arranged certainly.
Fig. 8-10 is the rough schematic view of decapsulation clamper, sample guider and BGA encapsulation according to an embodiment of the invention.These figure should too not limit the scope of claim only as an example.Those skilled in the art can make various changes, change and modification.Fig. 8 is used for the BGA encapsulation 800 fixing decapsulation clamper 500 of decapsulation and 600 the top views of carrying out in position.BGA encapsulation 800 has the large scale that can be held by decapsulation clamper 500 and 600.In Fig. 9, decapsulation clamper 500 and 600 fixed dimensions are much little that decapsulation is carried out in BGA encapsulation 900.For fixedly BGA encapsulation 900 fully, slip decapsulation clamper 500 and 600 on sample holder 308 touches up to the stationary plane 504 and the flanked of BGA encapsulation 900, has enough power and fixes BGA encapsulation 900.Figure 10 fixes the bottom views that carry out decapsulation in place for decapsulation clamper 500 and 600 with BGA encapsulation 900.Stationary plane 504 with raise the thickness that part 508 extends beyond sample holder at least in part, with guarantee decapsulation clamper 500 with 600 and 900 of BGA encapsulation mobile in the horizontal direction.Like this, adjustable decapsulation clamper 500 and 600 just can adapt to the BGA encapsulation of different size, and need not adopt a kind of decapsulation clamper to the BGA encapsulation of every kind of size.Other variation, modification and change also can be arranged certainly.
Figure 11 is according to the decapsulation clamper of the embodiment of the invention and the rough schematic view of sample guider.This figure should too not limit the scope of claim only as an example.Those skilled in the art can make various changes, change and modification.Decapsulation clamper 1102 and 1104 and the end face of sample holder 308 be coupled.Pivoting point 1106 and 1108 allows the direction rotation of decapsulation clamper along appointment, thus the BGA encapsulation in the middle of contact is placed on securely.For example, contact-making surface 1110 and 1112 can be the plane, thereby provides bigger surface area to contact the side of BGA encapsulation.In another example, the contact-making surface 1110 and 1112 that is arranged in decapsulation clamper 1102 and 1104 ends can extend to open zone 310, contacts the side of BGA encapsulation so that bigger surface area to be provided.Pivoting point 1106 and 1108 can have mechanical device spring load or locking, thereby the size of the position of decapsulation clamper 1102 and 1104 with suitable BGA encapsulation is set.In case decapsulation process is accomplished, just can unclamp mechanical device this spring load or locking, the BGA encapsulation is taken off from decapsulation equipment 300.In another example, in the decapsulation clamper 1102 and 1104 one can stride across the open zone and become diagonal to place with another, and this moment, two decapsulation clampers can rotate the encapsulation with contact BGA towards the center of sample holder 308.Other variation, modification and change also can be arranged certainly.
Figure 12 is the simplified schematic model figure according to the decapsulation clamper of the embodiment of the invention and sample guider.This figure should too not limit the scope of claim only as an example.Those skilled in the art can make various changes, change and modification.Decapsulation clamper 1202 and 1204 and the end face of sample holder 308 be coupled. Pivoting point 1206 and 1208 allows decapsulation clamper 1202 and the 1204 direction rotations along appointment, thus the BGA encapsulation 306 in the middle of contact is placed on securely.Decapsulation axle 1218 links to each other with 1216 with 1208 and 1214 with pivoting point 1206 respectively with 1220 two ends, allows that two range of movement and BGA encapsulation 306 contacts.Decapsulation clamper 1202 and 1204 also comprises contact-making surface 1210 and 1212, and they can rotate on pivoting point 1214 and 1216.Two range of movement that provided by two pairs of pivoting points allow contact-making surface 1210 and 1212 major part to encapsulate with BGA to contact.For example, can rotating hinge point 1206 and 1208 preliminary fixedly BGA encapsulation, rotating hinge point 1214 and 1216 then, permission contact-making surface 1210 and 1212 provides additional artis, thereby more fully fixedly BGA encapsulate.For example, contact-making surface 1210 and 1212 can be the plane, thereby provides bigger surface area to contact the side of BGA encapsulation.In another example, the contact-making surface 1210 and 1212 that is arranged in decapsulation clamper 1202 and 1204 ends can extend to open zone 310, thereby provides bigger surface area to contact the side of BGA encapsulation.Pivoting point 1206 and 1208 can have mechanical device spring load or locking, thereby the size of the position of decapsulation clamper 1202 and 1204 with suitable BGA encapsulation is set.In case decapsulation process is accomplished, just can unclamp mechanical device this spring load or locking, the BGA encapsulation is taken off from decapsulation equipment.In another example, in the decapsulation clamper one can stride across the open zone and become diagonal to place with another, and this moment, two decapsulation clampers can rotate the encapsulation with contact BGA towards the center of sample holder 308.Other variation, modification and change also can be arranged certainly.
Figure 13 is according to the decapsulation clamper of the embodiment of the invention and the rough schematic view of sample guider.This figure should too not limit the scope of claim only as an example.Those skilled in the art can make various changes, change and modification.Decapsulation clamper 1302 and 1304 is coupled in the end face of sample holder 308 movably.Base portion 1322 contacts with the periphery of sample holder 308 with a side of 1324, and second side contacts with open zone 310, allows decapsulation clamper 1302 and 1304 along sample holder 308 horizontal slips.Pivoting point 1306 and 1308 allows decapsulation clamper 1302 and the 1304 direction rotations along appointment, thus the BGA encapsulation in the middle of contact is placed on securely.Decapsulation axle 1318 links to each other with 1316 with 1308 and 1314 with pivoting point 1306 respectively with 1320 two ends, allows two range of movement to contact with the BGA encapsulation.Decapsulation clamper 1302 and 1304 also comprises contact-making surface 1310 and 1312, and they can rotate on pivoting point 1314 and 1316.Two range of movement that provided by two pairs of fulcrums allow contact-making surface 1310 and 1312 major part to encapsulate with BGA to contact.For example, can rotating hinge 1306 and 1308 preliminary fixedly BGA encapsulation, rotating hinge 1314 and 1316 then, permission contact-making surface 1310 and 1312 provides additional artis, thereby more fully fixedly BGA encapsulate.For example, contact-making surface 1310 and 1312 can be the plane, thereby provides bigger surface area to contact the side of BGA encapsulation.In another example, the contact-making surface 1310 and 1312 that is arranged in decapsulation clamper 1302 and 1304 ends can extend to open zone 310, thereby provides bigger surface area to contact the side of BGA encapsulation.Pivoting point 1306 and 1308 can have mechanical device spring load or locking, thereby the size of the position of decapsulation clamper 1302 and 1304 with suitable BGA encapsulation is set.In case decapsulation process is accomplished, just can unclamp mechanical device this spring load or locking, the BGA encapsulation is taken off from decapsulation equipment.Other variation, modification and change also can be arranged certainly.In another example, in the decapsulation clamper one can stride across the open zone and become diagonal to place with another, and this moment, two decapsulation clampers can rotate the encapsulation with contact BGA towards the center of sample holder 308.Other variation, modification and change also can be arranged certainly.
Should be appreciated that example here and embodiment only are exemplary, those skilled in the art can make various modifications and change under the situation of the spirit and scope of the present invention that do not deviate from the application and accompanying claims and limited.
Claims (5)
1. equipment that is used for BGA encapsulation decapsulation, said equipment comprises:
Support component, said support component has the open zone;
Tunable arrangement with said support component coupling; Said tunable arrangement is used for clamping BGA encapsulation; Make the surf zone of BGA encapsulation spatially place in the face of de-encapsulation source, and a plurality of solder sphere maintenances in the BGA encapsulation not with can cause the de-encapsulation source of damage or thermal source to contact to one or more said solder sphere; And
Said tunable arrangement comprises the first metal clamper and the second metal clamper, and the first metal clamper is configured in the first of said support component movably, and the second metal clamper is configured on the second portion of said support component movably; The said first metal clamper is configured in the first of said support component, slide, and the said second metal clamper is configured on the second portion of said support component, slide; The said first metal clamping and the second metal clamper comprise and step up face, and the said face that steps up is used for and the contacts side surfaces of BGA encapsulation perpendicular to the side of solder sphere and the surface that will remove;
Said de-encapsulation source wherein is provided, and a part that acts on said BGA package surface zone is to remove this part of said BGA encapsulation.
2. equipment as claimed in claim 1 is characterized in that said support component comprises the aluminum that has nickel coating.
3. equipment as claimed in claim 1 is characterized in that, said de-encapsulation source is a chemical source.
4. equipment as claimed in claim 3 is characterized in that, said chemical source comprises from the group of being made up of the mixture of fuming nitric aicd, sulfuric acid or fuming nitric aicd and sulfuric acid, select a kind of.
5. equipment as claimed in claim 1 is characterized in that, said de-encapsulation source is a plasma source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101710897A CN101661875B (en) | 2006-12-15 | 2006-12-15 | Equipment for de-encapsulation of BGA encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101710897A CN101661875B (en) | 2006-12-15 | 2006-12-15 | Equipment for de-encapsulation of BGA encapsulation |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610147452A Division CN100576431C (en) | 2006-12-15 | 2006-12-15 | The multipurpose decapsulation clamper and the method for ball grid array type encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101661875A CN101661875A (en) | 2010-03-03 |
| CN101661875B true CN101661875B (en) | 2012-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101710897A Expired - Fee Related CN101661875B (en) | 2006-12-15 | 2006-12-15 | Equipment for de-encapsulation of BGA encapsulation |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900749B (en) * | 2010-07-07 | 2012-07-25 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN104810240B (en) * | 2014-01-23 | 2017-08-25 | 北大方正集团有限公司 | A kind of solution encapsulation method of TO types packaging |
| CN105564009B (en) * | 2016-03-03 | 2017-11-14 | 刘荣立 | A kind of clamping device of BGA substrates |
| CN106024693B (en) * | 2016-05-20 | 2019-06-25 | 武汉理工大学 | Teflon fixture and its application for semiconductor microactuator nano parts wet processing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5792305A (en) * | 1996-07-12 | 1998-08-11 | Nisene Technology Group | Fixture for decapsulating plastic encapsulated electronic device packages |
| CN1190256A (en) * | 1997-02-07 | 1998-08-12 | 三菱电机株式会社 | Assembling and disassembling device and head for integrated circuit |
| US6395129B1 (en) * | 2000-11-27 | 2002-05-28 | Advanced Micro Devices, Inc. | Process to decapsulate a FBGA package |
-
2006
- 2006-12-15 CN CN2009101710897A patent/CN101661875B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5792305A (en) * | 1996-07-12 | 1998-08-11 | Nisene Technology Group | Fixture for decapsulating plastic encapsulated electronic device packages |
| CN1190256A (en) * | 1997-02-07 | 1998-08-12 | 三菱电机株式会社 | Assembling and disassembling device and head for integrated circuit |
| US6395129B1 (en) * | 2000-11-27 | 2002-05-28 | Advanced Micro Devices, Inc. | Process to decapsulate a FBGA package |
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| Publication number | Publication date |
|---|---|
| CN101661875A (en) | 2010-03-03 |
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