CN101900749B - Support for testing BGA packaged chips - Google Patents
Support for testing BGA packaged chips Download PDFInfo
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- CN101900749B CN101900749B CN201010218845XA CN201010218845A CN101900749B CN 101900749 B CN101900749 B CN 101900749B CN 201010218845X A CN201010218845X A CN 201010218845XA CN 201010218845 A CN201010218845 A CN 201010218845A CN 101900749 B CN101900749 B CN 101900749B
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- push pedal
- groove
- support
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Abstract
The invention provides a support for testing BGA packaged chips, belonging to the field of packaged chip testing. The support comprises a chip fixing frame, a probe fixing frame and test probes, wherein the chip fixing frame and the probe fixing frame are clamped; the test probes run through the probe fixing frame; one end of the test probes is connected with metal leads and the other end thereof is used for contacting welding spots of the chips; the chip fixing frame can not only fix the chips to be tested but also adjust the chip positions in the horizontal or upper and lower directions; and the probe fixing frame can adjust the area of a probe fixing block by adjusting push plates and further adjust the distance between the probes. Thus the support can not only conveniently realize testing the BGA packaged chips on a large scale but also carry out flexible adjustment and accurate matching and fixing according to the pin quantity and sizes of the chips to be tested and is suitable for the BGA packaged chips with various pin quantities and sizes.
Description
Technical field
The present invention relates to the packaged chip field tests, particularly a kind of BGA (Ball Grid Array, BGA) packaged chip support for testing.
Background technology
BGA be the nineties along with the progress of integrated technology, the improvement of equipment and the use of deep sub-micron technique, a kind of new encapsulation technology that the single-chip integrated level improves constantly with integrated circuit encapsulation is stricter, the I/O number of pins sharply increases, power consumption also produces thereupon increasing.Adopt the chip of BGA technology encapsulation, can make chip under the constant situation of function, have littler volume, better electrical property, faster speed and better heat dispersion, present increasing chip adopts the BGA encapsulation.The chip bga demand that has a wide range of applications at aspects such as embedded device, portable set and palm PCs.Yet; Chip bga pin number, the distance between the pin on the market are not quite similar, encapsulate shape and have nothing in common with each other; Make whether user's (especially doing the user or the small-scale production user of research) can't qualified through non-welding manner test chip when buying corresponding chip bga and before welding is used; When circuit board welding manufacturing engineering goes wrong, can't locate problem of chip own or Welding Problems (because BGA welded encapsulation quality adopts conventional equipment and method to be difficult to test); Do not see the proving installation that chip bga is relevant on the market, do not see distance that can be applicable between various pin numbers, the pin and the record that encapsulates the chip bga proving installation of shape in the prior art yet.
Summary of the invention
The technical matters that the present invention solved provides a kind of support for testing that is used for the test in enormous quantities of chip bga, and can carry out flexible and the accurate fixing chip bga support for testing of coupling according to the pin number of different B GA packaged chip, distance and encapsulation shape between the pin.
For overcoming the above problems, BGA chip bga support for testing of the present invention mainly comprises: chip fixed mount 1, probe fixing frame 2 and test probe 3, chip fixed mount 1 and probe fixing frame 2 clampings; Test probe 3 passes probe fixing frame 2, one ends and links to each other with metal lead wire 4, and the other end is used for contacting with the phase of solder joint of chip;
Said probe fixing frame 2 is enclosed by four fixed panels 205 and is connect; The anchor post 204 of four band hole clippings 208 welds with adjacent fixed panel 205 respectively; At least have and the corresponding tapped screw 207 in movable draw-in groove 206 positions of push pedal 202 in the middle of adjacent two fixed panels 205; Being with externally threaded screw 203 to pass this hole also is connected with push pedal 202 through movable draw-in groove 206; Push pedal 202 is bonding with probe stationary piece 201, has a plurality of equally distributed apertures on the probe stationary piece 201, and test probe 3 passes from aperture;
Said chip fixed mount 1 is enclosed by four fixed panels 105 and connects; Four anchor posts 102 weld with adjacent fixed panel 105 respectively; At least adjacent two fixed panel 105 middle parts have tapped screw; Be with externally threaded screw 101 to pass this hole and 103 welding of chip clamp, chip back up pad 104 is weldingly fixed on chip clamp 103 belows; Said chip clamp 103 is square;
Preferably, said chip fixed mount 1 comprises chip draw-in groove 11, draw-in groove adjusting support 12 and connecting link 13;
Said chip draw-in groove mainly comprises spring 111, depression bar 112, and shaft collar 113 and nut 114, shaft collar 113 has strut kong 115 in the middle of the adjacent at least both sides, and the depression bar 112 that is with spring 111 passes and nut 114 sockets from strut kong 115;
Preferably, all have strut kong in the middle of shaft collar 113 four sides;
Said draw-in groove is regulated support and mainly comprised: fixedly outrigger 121, both ends of the spring compressing tablet 122, rotation push rod 123; Spring 123, pickup groove 125 and centre frame 126, both ends of the spring compressing tablet 122 lateral surfaces contact one-sided smooth with pickup groove 125 inboards with the both ends of the spring compressing tablet; Rotation push rod 123 is connected with fixing outrigger 121 through screw thread, and centre frame 126 is the cross type, and the centre has aperture 127; Connecting link 13 is connected with chip draw-in groove 11 through this hole; Fixedly outrigger has anchor post fixed orifice 128 for 121 4 jiaos, and anchor post one end passes this hole, the other end and 208 clampings of probe fixing frame hole clipping;
Said connecting link 13 is made up of axostylus axostyle 131, nut 132; Axostylus axostyle 131 Lower Half bottoms slightly and 11 welding of chip draw-in groove, axostylus axostyle 131 is greater than the first half, first half band external thread; Pass draw-in groove and regulate support 12 centre frames 126 tapped apertures 127, with nut 132 sockets;
Preferably, said connecting link also comprises spring 133, is socketed in axostylus axostyle 131 first halves, regulates between support 12 inboards and axostylus axostyle 131 Lower Halves between draw-in groove;
Preferably, the connected mode with externally threaded screw 203 and push pedal 202 is the rolling socket; Said rolling socket is meant that push pedal 202 can and then not rotated when screw 203 rotates, and is inwardly outwards moved by the spinning in and out promotion push pedal 202 of screw 203;
Preferably, be meshing with the connected mode of externally threaded screw 203 and push pedal 202, push pedal 202 is the scalable push pedal;
Said scalable push pedal comprises through the A push pedal 253 of concaveconvex structure 257 meshing connections, B push pedal 254; Have slide opening 255 in the push pedal; Fixedly tightening latch 252 1 ends be fixed in the A push pedal 253 or B push pedal 254 on, the slide opening 255, two that the other end passes B push pedal 254 or A push pedal 253 is the center section toothed 256 of tightening latch opposite side fixedly; And meshing through these sawtooth 256 and gear 251, gear 251 be welded on screw 203 with push pedal 202 links.
Preferably, as a kind of improved procedure, also comprise external probe 5, the one of which end is connected with metal lead wire 4, and an end is used for linking to each other with test circuit.
The invention provides a kind of chip bga support for testing; The chip fixed mount not only can be fixed chip to be measured; And can adjust chip position in the horizontal or up and down direction, can realize the test in enormous quantities of chip bga easily, further; Probe fixing frame is through regulating the area of push pedal adjustment probe stationary piece; Thereby the distance between the adjustment probe aperture makes that the present invention can according to chip pin quantity to be measured and size carries out flexible and accurately coupling is fixing, is applicable to the chip bga of various pin numbers and size.
Description of drawings
Fig. 1 is a chip bga support for testing preferred implementation structural drawing of the present invention;
Fig. 2 is a chip bga support for testing probe fixing frame preferred embodiment structural drawing of the present invention;
Fig. 3 is a chip bga support for testing chip fixed mount preferred embodiment structural drawing of the present invention;
Fig. 4 is another preferred embodiment structural drawing of chip bga support for testing chip fixed mount of the present invention;
Fig. 5 is a chip bga support for testing chip fixed mount chip draw-in groove structural drawing of the present invention;
Fig. 6 regulates rack assumption diagram for chip bga support for testing chip fixed mount draw-in groove of the present invention;
Fig. 7 is a chip bga support for testing probe fixing frame scalable push pedal structural drawing of the present invention;
Fig. 8 is another preferred implementation structural drawing of chip bga support for testing of the present invention;
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, chip bga support for testing of the present invention is done further explain below in conjunction with accompanying drawing and embodiment.
Like Fig. 1, Fig. 2 and shown in Figure 3, as a kind of preferred implementation, chip bga support for testing of the present invention mainly comprises:
Chip fixed mount 1, probe fixing frame 2 and test probe 3, chip fixed mount 1 and probe fixing frame 2 clampings also are that chip fixed mount 1 is two parts of separating with probe fixing frame 2, are connected together through anchor post; Test probe 3 passes probe fixing frame 2; One end links to each other with metal lead wire 4; The other end is used for contacting with the phase of solder joint of chip, and after chip fixed mount 1 and probe fixing frame 2 clampings, test probe 3 other ends will contact with the phase of solder joint of chip; Test signal passes to test circuit then through test probe, metal lead wire;
Said probe fixing frame 2 is enclosed by four fixed panels 205 and is connect, the anchor post 204 of four band hole clippings 208 respectively with adjacent fixed panel 205 welding, the hollow tetrahedron that is surrounded by anchor post 204 and fixed panel 205 forms the supporting construction of probe fixing frame 2; At least have and the corresponding tapped screw 207 in movable draw-in groove 206 positions of push pedal 202 in the middle of adjacent two fixed panels 205; Be with externally threaded screw 203 to pass this hole through movable draw-in groove 206 and push pedal 202 rolling sockets; Said rolling socket is meant that push pedal 202 can and then not rotated when screw 203 rotates, and is inwardly outwards moved by the spinning in and out promotion push pedal 202 of screw 203; Push pedal 202 is bonding with probe stationary piece 201, and probe stationary piece 201 is the resilient materials (like polyfoam or rubber etc.) with certain degree of hardness, and it is installed with a plurality of equally distributed apertures, and test probe 3 passes from aperture; Push pedal 202 is processed by rigid plastic;
Preferably, all have screw in the middle of four fixed panels 205;
Said chip fixed mount 1 is enclosed by four fixed panels 105 and connects, four anchor posts 102 respectively with 105 welding of adjacent fixed panel, the hollow tetrahedron that is surrounded by anchor post 102 and fixed panel 105 forms the supporting construction of chip fixed mount 1; The middle part of adjacent at least two fixed panels 105 has tapped screw, is with externally threaded screw 101 to pass this hole and 103 welding of chip clamp, and chip back up pad 104 is weldingly fixed on chip clamp 103 belows; Said chip clamp 103 is square;
Preferably, the middle part of four fixed panels 105 all has screw;
Further, as another kind of preferred implementation, like Fig. 4, Fig. 5, shown in Figure 6, said chip fixed mount 1 comprises chip draw-in groove 11, draw-in groove adjusting support 12 and connecting link 13;
Said chip draw-in groove mainly comprises spring 111, depression bar 112, and shaft collar 113 and nut 114, shaft collar 113 has strut kong 115 in the middle of the adjacent at least both sides, and the depression bar 112 that is with spring 111 passes and nut 114 sockets from strut kong 115; When nut 114 spinning in and out, depression bar 112 inwardly outwards moves, thereby chip is blocked, and through the adjusting of different directions, can adjust chip position in the horizontal direction, and under the elastic force effect of spring 111, chip will be blocked tightlyer in addition;
Preferably, all have strut kong in the middle of shaft collar 113 four sides;
Draw-in groove is regulated support and mainly comprised: fixedly outrigger 121, both ends of the spring compressing tablet 122, rotation push rod 123; Spring 123, pickup groove 125 and centre frame 126, both ends of the spring compressing tablet 122 lateral surfaces contact one-sided smooth with pickup groove 125 inboards with the both ends of the spring compressing tablet; Rotation push rod 123 is connected with fixing outrigger 121 through screw thread; Centre frame 126 is the cross type, and the centre has aperture 127, and connecting link 13 is connected with chip draw-in groove 11 through this hole.Fixedly outrigger has anchor post fixed orifice 128 for 121 4 jiaos, and anchor post one end passes this hole, the other end and 208 clampings of probe fixing frame card;
Said connecting link 13 is made up of axostylus axostyle 131, nut 132, and slightly weld with chip draw-in groove 11 axostylus axostyle 131 Lower Half bottoms, and axostylus axostyle 131 is greater than the first half; First half band external thread; Pass draw-in groove and regulate support 12 centre frames 126 tapped apertures 127, with nut 132 sockets, when nut 132 spinning in and out; Promote axostylus axostyle 131 and inwardly move up down, thus adjusting chip draw-in groove 11 upper-lower positions;
Preferably, said connecting link also comprises spring 133, is socketed in axostylus axostyle 131 first halves, regulates between support 12 inboards and axostylus axostyle 131 Lower Halves between draw-in groove; Under spring force, can make chip card groove 11 fixing more firmly;
Said connected mode with externally threaded screw 203 and push pedal 202 is the rolling socket; Said rolling socket is meant that push pedal 202 can and then not rotated when screw 203 rotates, and is inwardly outwards moved by the spinning in and out promotion push pedal 202 of screw 203
Further, as shown in Figure 7 as another kind of advantageous embodiment embodiment, be meshing with the connected mode of externally threaded screw 203 and push pedal 202, push pedal 202 is the scalable push pedal;
Said scalable push pedal comprises through the A push pedal 253 of concaveconvex structure 257 meshing connections, B push pedal 254; Have slide opening 255 in the push pedal; Fixedly tightening latch 252 1 ends be fixed in the A push pedal 253 or B push pedal 254 on, the slide opening 255, two that the other end passes B push pedal 254 or A push pedal 253 is the center section toothed 256 of tightening latch opposite side fixedly; And meshing through these sawtooth 256 and gear 251, gear 251 be welded on screw 203 with push pedal 202 links; The rotation of screw 203 rotating band moving gears 252, and the fixedly tightening latch 252 of gear 252 through A push pedal 253 and B push pedal 254 is close to A push pedal 253 and B push pedal 254 or away from, thereby reach the effect of regulating the push pedal width.
Preferably, as another kind of advantageous embodiment embodiment, as shown in Figure 8; Also comprise external probe 5, the one of which end is connected with metal lead wire 4, and an end is used for linking to each other with test circuit; In use; For being connected with external test circuitry is more convenient, can external probe 5 directly be plugged on the external test circuitry, also can be with itself and external test circuitry and pad welding.
Though through reference some preferred implementation of the present invention or embodiment; The present invention is illustrated and describes; But those skilled in the art should be understood that; Can make various corresponding changes or distortion according to the present invention, under the situation that does not deviate from spirit of the present invention and essence thereof, these change accordingly or are out of shape and all belong to protection scope of the present invention.
Claims (8)
1. a BGA chip bga support for testing is characterized in that, mainly comprises: chip fixed mount (1), probe fixing frame (2) and test probe (3), chip fixed mount (1) and probe fixing frame (2) clamping; Test probe (3) passes probe fixing frame (2), and an end links to each other with metal lead wire (4), and the other end is used for contacting with the phase of solder joint of chip;
Said probe fixing frame (2) is enclosed by four second fixed panels (205) and is connect; Second anchor post (204) of four band hole clippings (208) welds with adjacent second fixed panel (205) respectively; At least have movable draw-in groove (206) the corresponding tapped screw in position (207) in the middle of adjacent two second fixed panels (205) with push pedal (202); Being with externally threaded second screw (203) to pass tapped screw (207) also is connected with push pedal (202) through movable draw-in groove (206); Push pedal (202) is bonding with probe stationary piece (201), has a plurality of equally distributed apertures on the probe stationary piece (201), and test probe (3) passes from said aperture;
Said chip fixed mount (1) is enclosed by four first fixed panels (105) and connects; Four first anchor posts (102) weld with adjacent first fixed panel (105) respectively; At least adjacent two first fixed panels (105) middle part has tapped screw (207); Be with externally threaded first screw (101) to pass tapped screw (207) and chip clamp (103) welding, chip back up pad (104) is weldingly fixed on chip clamp (103) below; Said chip clamp (103) is square.
2. chip bga support for testing according to claim 1 is characterized in that, all there is tapped screw (207) at four second fixed panels (205) or first fixed panel (105) middle part.
3. chip bga support for testing according to claim 1 is characterized in that, said chip fixed mount (1) comprises that chip draw-in groove (11), draw-in groove regulate support (12) and connecting link (13);
Said chip draw-in groove mainly comprises first spring (111), depression bar (112), shaft collar (113) and first nut (114); Shaft collar (113) has strut kong (115) in the middle of the adjacent at least both sides, and the depression bar (112) that is with first spring (111) passes and first nut (114) socket from strut kong (115);
Said draw-in groove is regulated support and is mainly comprised fixedly outrigger (121), both ends of the spring compressing tablet (122), rotation push rod (123), second spring (124), pickup groove (125) and centre frame (126); Both ends of the spring compressing tablet (122) lateral surface is smooth; Pickup groove (125) is inboard to contact one-sided smooth with the both ends of the spring compressing tablet; Rotation push rod (123) is connected with fixing outrigger (121) through screw thread, and centre frame (126) is the cross type, and the centre has connecting hole (127); Connecting link (13) is connected with chip draw-in groove (11) through this connecting hole; Fixedly outrigger has first anchor post (102) fixed orifice (128) for (121) four jiaos, and first anchor post (102) one ends pass fixed orifice (128), said hole clipping (208) clamping of the other end and probe fixing frame;
Said connecting link (13) is made up of axostylus axostyle (131) and second nut (132); Slightly weld with chip draw-in groove (11) axostylus axostyle (131) Lower Half bottom; The Lower Half of axostylus axostyle (131) is greater than the first half; The first half band external thread of said axostylus axostyle passes draw-in groove and regulates the tapped connecting hole of support (12) centre frame (126) (127), with second nut (132) socket.
4. like the said chip bga support for testing of claim 3, it is characterized in that said connecting link (13) also comprises the 3rd spring (133), be socketed in axostylus axostyle (131) first half, regulate between support (12) inboard and axostylus axostyle (131) Lower Half between draw-in groove.
5. like the said chip bga support for testing of claim 3, it is characterized in that said shaft collar (113) all has strut kong in the middle of the four sides.
6. chip bga support for testing according to claim 1 is characterized in that, said connected mode with externally threaded second screw (203) and push pedal (202) is for through movable draw-in groove (206) rolling socket; Said rolling socket is meant that push pedal (202) can and then not rotated when second screw (203) rotates, and is inwardly outwards moved by the spinning in and out promotion push pedals (202) of second screw (203).
7. chip bga support for testing according to claim 1 is characterized in that, said connected mode with externally threaded second screw (203) and push pedal (202) is meshing, and push pedal (202) is the scalable push pedal;
Said scalable push pedal comprises through the A push pedal (253) of the meshing connection of concaveconvex structure (257), B push pedal (254); Have slide opening (255) in the push pedal; Fixedly tightening latch (252) one ends are fixed in the last perhaps B push pedal (254) of A push pedal (253); The other end passes the slide opening (255) of B push pedal (254) or A push pedal (253); Two fixing center section toothed (256) of tightening latch opposite side, and meshing, gear (251) through these sawtooth (256) and gear (251) be welded on second screw (203) with push pedal (202) link.
8. like the arbitrary said chip bga support for testing of claim 1-5, it is characterized in that also comprise external probe (5), the one of which end is connected with metal lead wire (4), an end is used for linking to each other with test circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010218845XA CN101900749B (en) | 2010-07-07 | 2010-07-07 | Support for testing BGA packaged chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010218845XA CN101900749B (en) | 2010-07-07 | 2010-07-07 | Support for testing BGA packaged chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101900749A CN101900749A (en) | 2010-12-01 |
| CN101900749B true CN101900749B (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010218845XA Expired - Fee Related CN101900749B (en) | 2010-07-07 | 2010-07-07 | Support for testing BGA packaged chips |
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Families Citing this family (9)
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| CN102621731B (en) * | 2012-04-17 | 2014-11-19 | 深圳市华星光电技术有限公司 | Voltage application device of liquid crystal substrate |
| CN103344796B (en) * | 2013-06-28 | 2015-10-28 | 国家电网公司 | The test unit of a kind of short circuit ac terminal row |
| KR101678845B1 (en) * | 2015-02-05 | 2016-11-24 | 리노공업주식회사 | A test device |
| CN106093483B (en) * | 2016-07-27 | 2020-01-10 | 深圳市华讯方舟微电子科技有限公司 | Chip test fixture and chip test system |
| CN108761143A (en) * | 2018-05-20 | 2018-11-06 | 苏州沃森优金电子科技有限公司 | A kind of stationary fixture of large test circuit board |
| CN111624465A (en) * | 2020-05-19 | 2020-09-04 | 彩迅工业(中山)有限公司 | Synchronous rectification detection system |
| CN113433352A (en) * | 2021-06-22 | 2021-09-24 | 合肥维信诺科技有限公司 | Screen performance testing device and screen performance testing method |
| CN116500423B (en) * | 2023-06-25 | 2023-09-26 | 深圳市微特精密科技股份有限公司 | Chip pin open-short circuit test system and open-short circuit test method |
| CN117289115B (en) * | 2023-11-24 | 2024-02-20 | 北京国科天迅科技股份有限公司 | Chip test base generation method and device and computer equipment |
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| US6462533B1 (en) * | 1999-11-30 | 2002-10-08 | Nec Machinery Corporation | IC test system for testing BGA packages |
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| CN2727746Y (en) * | 2004-09-23 | 2005-09-21 | 白锦添 | Ball-type grating array movable testing stand |
| CN101089643A (en) * | 2006-06-13 | 2007-12-19 | 镭德科技股份有限公司 | Ball grid array package element investigating method and socket set of true system |
| CN101103451A (en) * | 2005-01-15 | 2008-01-09 | 黄东源 | A BGA-type test and burn-in socket for integrated circuits(ICS) |
| KR100831167B1 (en) * | 2008-03-20 | 2008-05-26 | 배관수 | Solder ball reballing device for bga type sub-strate |
| CN101661875A (en) * | 2006-12-15 | 2010-03-03 | 中芯国际集成电路制造(上海)有限公司 | Equipment for de-encapsulation of BGA encapsulation |
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2010
- 2010-07-07 CN CN201010218845XA patent/CN101900749B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6462533B1 (en) * | 1999-11-30 | 2002-10-08 | Nec Machinery Corporation | IC test system for testing BGA packages |
| CN2665917Y (en) * | 2003-11-04 | 2004-12-22 | 白锦添 | Ball-type grid array movable testing seat |
| CN2727746Y (en) * | 2004-09-23 | 2005-09-21 | 白锦添 | Ball-type grating array movable testing stand |
| CN101103451A (en) * | 2005-01-15 | 2008-01-09 | 黄东源 | A BGA-type test and burn-in socket for integrated circuits(ICS) |
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| KR100831167B1 (en) * | 2008-03-20 | 2008-05-26 | 배관수 | Solder ball reballing device for bga type sub-strate |
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| Publication number | Publication date |
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| CN101900749A (en) | 2010-12-01 |
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Granted publication date: 20120725 Termination date: 20180707 |