CN2665917Y - Ball-type grid array movable testing seat - Google Patents
Ball-type grid array movable testing seat Download PDFInfo
- Publication number
- CN2665917Y CN2665917Y CN 200320117705 CN200320117705U CN2665917Y CN 2665917 Y CN2665917 Y CN 2665917Y CN 200320117705 CN200320117705 CN 200320117705 CN 200320117705 U CN200320117705 U CN 200320117705U CN 2665917 Y CN2665917 Y CN 2665917Y
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- testing needle
- bga
- testing
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Abstract
The utility model discloses a ball-shaped grid array activity test base, comprising a test pointer which fits the arrangement of a BGA component tin ball array. A BGA limit plate, an upper limit plate and a lower limit plate of the test pointer and a PCB wiring plate are fixedly connected by a limit screw from top to bottom and the BGA limit plate moves upwards and downwards through a limit plate spring. The BGA limit plate, the upper limit plate and the lower limit plate of the test pointer are all provided with a limit hole array corresponding to the test pointer while the wiring plate is provided with a welding disc array corresponding to the test pointer; the pointer head of the test pointer is arranged inside the limit hole array of the BGA limit plate and the base part of the test pointer at the welding disc array is communicated with a wiring socket through a printing circuit of the wiring plate. The utility model adopts the limit hole array limit test pointer, which can be manufactured without the mold, significantly reducing production cost, and has easy and simple maintenance and use and is applicable for the test of BGA sealed component and the writing of BGA sealed storage.
Description
Technical field
The utility model relates to a kind of test bench of electronic device, especially relates to a kind of ball-type grid array (BGA) movable testing stand.
Background technology
Ball-type grid array (BGA) movable testing stand is used in relevant industries already, for example test of production firm such as digital cell phone, PDA and programming FLASH etc.What present BGA movable testing stand generally adopted is the product that Japan, the U.S. etc. produce, characteristics such as the BGA movable testing stand that for example Japanese YAMACHI company produces has accurately, life-span length, price height, general elastic sheet metal and the high-precision plastics positioning framework with good resistance fatigue of adopting formed, it is produced and must adopt high-precision mould, so production cost height, manufacturing technique requirent is also high, only die cost just surpasses 1,000,000 RMB, therefore price is generally higher, and finished product can not keep in repair.In addition, the method that existing BGA movable testing stand generally adopts two elastic sheet metals to clamp the device tin sweat(ing) realizes conduction, the method is more convenient for new unit, just need repair tin sweat(ing) again for the device that old device or tin sweat(ing) come off, this process is referred to as to plant tin, and require the size of each tin sweat(ing) and highly all compare evenly, plant process of tin and have relatively high expectations.
Domestic once had a similar scheme, adopts testing needle to replace the elastic sheet metal conduction, but still adopt plastics posting fixing test pin, produce and will adopt high-precision mould, and manufacturing technique requirent is higher, is difficult to realize low-cost batch production.
The utility model content
The purpose of this utility model is to provide a kind of employing testing needle conduction, location hole array assignment test pin, the ball-type grid array movable testing stand of assembling the location and exempting from die production, so that reduce production costs significantly and production requirement, finished product can be keeped in repair and easy to use, satisfy domestic low cost, convenient and practical market demand.
The purpose of this utility model is achieved by the following technical programs:
A kind of ball-type grid array movable testing stand that the utility model provides comprises,
Be used to the testing needle that meets BGA device tin sweat(ing) arrayed that conducts electricity and test;
Be used to place the BGA location-plate moving up and down of BGA device;
Be used for fixing on the testing needle of described testing needle location-plate under the location-plate and testing needle;
Be used to draw the PCB lead plate that connects described testing needle electrically conductive signal;
Be used to connect testing equipment, be positioned at the lead socket of both sides below the described PCB lead plate;
On described BGA location-plate, the testing needle under location-plate, the testing needle location-plate and PCB lead plate be connected and fixed by set screw successively from top to bottom, wherein the BGA location-plate suppresses on location-plate on the testing needle by the location-plate spring that is enclosed within on its set screw, on described BGA location-plate, the testing needle under location-plate and the testing needle location-plate be equipped with and described testing needle corresponding positioning hole array, described PCB lead plate is provided with and the corresponding pad array of testing needle;
Described testing needle has syringe needle and needle body, and the syringe needle of testing needle is positioned at the location hole array of BGA location-plate, and testing needle syringe needle diameter is less than the aperture in the BGA location-plate location hole array; The needle body of testing needle runs through and is installed on the testing needle under the location-plate and testing needle in the location hole array of location-plate; The bottom of testing needle needle body is communicated with lead socket by the pad array and the printed wire of lead plate.
During work, the utility model connects the test burn writing equipment by the change-over panel with conversion row pin on described lead socket, and the BGA device is placed on the BGA location-plate described in the utility model.The BGA location-plate also can be moved up and down by the set screw location that is with retainer spring, the BGA device is put thereon and down on time, the BGA location-plate moves down, the test syringe needle passes the location hole array of BGA location-plate and the tin sweat(ing) of BGA device contacts, conduction, lead plate printed wire and lead socket by testing needle and have conversion row pin change-over panel be connected conducting, be connected on the test burn writing equipment, the test burn writing equipment just can be realized test and the programming to the BGA device.
Testing needle needle body described in the utility model is provided with the testing needle sleeve outward, is provided with spring between the bottom in the bottom of needle body and the testing needle sleeve; The diameter of testing needle sleeve is less than the aperture of the location hole array of location-plate under location-plate on the testing needle and the testing needle, but greater than the aperture in the BGA location-plate location hole array.Testing needle can smooth and easyly up and down move like this, so that contact better with BGA device tin sweat(ing), can prevent that testing needle from coming off simultaneously.
For location-plate and lead plate under location-plate, the testing needle on the fixing test pin better, on the testing needle described in the utility model under location-plate and the testing needle both sides between the location-plate be provided with fixing double pin.
Because the BGA device is less, be placed on the BGA location-plate down inconvenient on time, therefore the utility model also has the fixedly pressing plate of BGA device above described BGA location-plate, and pressing plate is provided with and the corresponding circular hole of set screw, and Circularhole diameter is greater than the diameter of set screw head; The two ends of location-plate are respectively arranged with spacing short column and by the screens short column of spring tractive, the through hole that is positioned at pressing plate one end is enclosed within on the spacing short column on the described testing needle, and the other end of pressing plate is provided with the bayonet socket that is used for clamping screens short column.Elder generation is with the top of pressing plate whiz BGA location-plate during use, the BGA device is placed on the BGA location-plate, then the pressing plate cycle is pressed in the BGA device above, and make circular hole on it and bayonet socket aim at the screens short column on the location-plate on set screw head on the BGA location-plate and the testing needle respectively, just can make tin sweat(ing) that in-migration under BGA device and the BGA location-plate finishes the BGA device easily and test contacting of syringe needle by pressing plate down.
Location-plate is made up of testing needle position limitation protection plate and the spring supporting plate that is positioned at below it on the testing needle described in the utility model, and the lower end of described location-plate spring is installed in the location hole of testing needle position limitation protection plate, by the spring supporting plate fixed bearing.Such one is to protect the sleeve of testing needle not damaged by the pressure that the BGA location-plate moves down; The 2nd, make retainer spring can keep certain springing stroke, and the installation of location-plate spring is stable, is convenient to operation.
Location hole array on the BGA location-plate described in the utility model is other also to be provided with position line, to make things convenient for the positioning BGA device.
The cladding thickness of lead plate pad described in the utility model next door solder resist is zero.If it is in uneven thickness to cover solder resist, can cause the bottom and the loose contact of lead plate BGA pad array of testing needle, so the utility model trace layer pad does not cover solder resist.
Lead socket described in the utility model is an Europlug.The lead socket that the architectural characteristic of Europlug can make the utility model scheme easily with other change-over panels on row's pin be used, effectively avoid the problems such as loose contact that cause because of repeatedly plug makes that row's pin is crooked, flexural deformation etc.
On BGA location-plate described in the utility model, the testing needle under location-plate and the testing needle location-plate be the PCB material, the cladding thickness of its location hole array solder resist is zero.If cover solder resist on the location hole next door, solder resist might flow to the inside, hole and go, and can influence the uniformity in aperture like this, even cause testing needle not move up and down, so the location hole array does not cover solder resist in the utility model.
The utlity model has following beneficial effect: the utility model all adopts ready-made material, exempt from die production, cost is low, simple in structure, easy to assembly, detachable maintenance, particularly with PCB or other material such as organic glass roughly the same, replace plastics posting fixing test pin, not only avoided the product in the past must be with high-precision mold production, manufacturing technique requirent height, problem that cost is high, and use more convenient, easily maintenance.
Description of drawings
Below in conjunction with embodiment and accompanying drawing the utility model is described in further detail:
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the end view of Fig. 1;
Fig. 2-the 1st, the testing needle of the utility model embodiment and testing needle tube-in-tube structure figure;
Fig. 3 is the BGA location-plate schematic diagram among the utility model embodiment;
Fig. 4 is the pressing plate schematic diagram among the utility model embodiment;
Fig. 5 is the test syringe needle position limitation protection plate schematic diagram among the utility model embodiment;
Fig. 6 is the spring supporting plate schematic diagram among the utility model embodiment;
Fig. 7 is a location-plate schematic diagram under the testing needle among the utility model embodiment;
Fig. 8 is the lead plate schematic diagram among the utility model embodiment;
Fig. 9 is the change-over panel schematic diagram;
Figure 10 is the connection diagram of the utility model embodiment and change-over panel;
Figure 11 is the end view of Figure 10.
Embodiment
Fig. 1～Fig. 8 is the embodiment of a kind of ball-type grid array movable testing stand of the present utility model.As depicted in figs. 1 and 2; present embodiment is provided with and is used to the testing needle 30 that meets BGA device tin sweat(ing) arrayed testing and conduct electricity, is followed successively by location-plate 7, PCB lead plate 8 and lead socket 12 under pressing plate 17, BGA device location-plate 1, testing needle position limitation protection plate 5, spring supporting plate 6, fixing double pin 9, the testing needle from top to bottom.
The arrayed of testing needle 30 is 8 * 10, and corresponding with the BGA tin sweat(ing) array of device, the syringe needle 2 of testing needle 30 has elasticity, and diameter is 0.4mm; Shown in Fig. 2-1, the testing needle needle body 31 outer testing needle sleeves 11 that are provided with, be provided with spring 32 between the bottom in the bottom of needle body 31 and the testing needle sleeve 11, the diameter of testing needle sleeve 11 is 0.58mm, and testing needle syringe needle 2 has the springing stroke of 2mm up and down in testing needle sleeve 11.
The set screw 3 that location-plate 7 and PCB lead plate 8 are 1.9mm by 4 diameters under BGA device location-plate 1, testing needle position limitation protection plate 5, spring supporting plate 6, the testing needle is connected and fixed.The thickness of BGA location-plate 1 shown in Figure 3 is 1mm; the set screw hole 22 that 4 2mm apertures are arranged all around; also can move up and down by 4 set screw 3 location that are with retainer spring 4; the lower end of retainer spring 4 be placed on respectively retainer spring hole 22 on the testing needle position limitation protection plate 5 ' in, and by spring supporting plate 6 fixed bearings.8 * 10 location hole arrays 25 corresponding with the tin sweat(ing) array of BGA device are arranged above the BGA location-plate 1, the aperture is 0.55mm, the center distance in hole is that 0.8mm is (for being fit to the BGA device of different encapsulation, quantity, arrangement mode and the aperture of BGA location hole array can suitably be changed), location hole array 25 next doors also have some position lines 25 '.The BGA device is placed into above the BGA location-plate 1 during use, with operating personnel's feel, according to location hole array 25 and the position line 25 ' BGA device of just can having good positioning easily.The pressing plate that is used for fixing the BGA device 17 shown in Figure 4, be connected on the spacing short column 18 by the spacing short column of pressing plate hole 20, also can move up and down and left rotation and right rotation by spacing short column 18 location, pressing plate circular hole 26 on it is corresponding with set screw 3, and Circularhole diameter is greater than the diameter of set screw head, bayonet socket 26 ' and with corresponding by the screens short column 19 of spring tractive.Pressing plate moves down and blocks the screens short column during use, can make 1 time in-migration of BGA device and BGA location-plate finish the tin sweat(ing) of BGA device and contacting of test syringe needle.When needing to take out the BGA device, only need push aside and can remove pressing plate with handgrip screens short column.
As Fig. 5, Fig. 6 and shown in Figure 7; be equipped with 8 * 10 location hole arrays 25 corresponding under testing needle position limitation protection plate 5, spring supporting plate 6 and the testing needle on the location-plate 7 with the tin sweat(ing) array of BGA device; the aperture is 0.6mm; the center distance in hole is 0.8mm (for being fit to the BGA device of different encapsulation, quantity, arrangement mode and the aperture of BGA location hole array can suitably be changed).At the fixing double pin 9 between the location-plate 7 under spring supporting plate 6 and the testing needle; insert the spacing backplate 5 of testing needle; spring supporting plate 6; in the fixing double pin installing hole 24 under the testing needle on location-plate 7 and the lead plate 8; can play fixing test pin position limitation protection plate 5; spring supporting plate 6; the effect of location-plate 7 and lead plate 8 under the testing needle; and can guarantee testing needle position limitation protection plate 5; total height after location-plate 7 installs and fixes under spring supporting plate 6 and the testing needle is 13.1mm; height 13mm than testing needle sleeve 11 exceeds 0.1mm; can not directly oppress testing needle sleeve 11 when BGA location-plate 1 is pressed down, play the effect of protection testing needle sleeve 11.
In addition, because the diameter of testing needle sleeve 11 is littler than the aperture of the location hole array in the middle of the location-plate under testing needle position limitation protection plate 5, spring supporting plate 6 and the testing needle 7, make testing needle sleeve 11 to move up and down therein; Have the tin sweat(ing) array corresponding bonding pad array 27 with the BGA device on the lead plate 8 shown in Figure 8, pad array 27 is more much smaller than the diameter of testing needle sleeve 11 for the via diameter of the pad that do not have via hole or pad, plays the effect of fixing whole testing needle 30.The two acting in conjunction can allow testing needle 30 form certain pressure between the pad array 27 of the tin sweat(ing) of BGA device and lead plate 8, guarantees that their contacts are good.Freely suitable for guarantee that testing needle sleeve 11 can move up and down in the location hole array; when location-plate under BGA location-plate 1, testing needle position limitation protection plate 5, spring supporting plate 6 and the testing needle 7 adopts the PCB material; the location hole array is other not to cover solder resist, causes the aperture inhomogeneous in order to avoid solder resist penetrates in the location hole array.Simultaneously, for the phenomenon in uneven thickness of avoiding the solder resist that PCB pad next door covers in the general technology causes the bottom of testing needle sleeve 11 and the phenomenon of pad array 27 loose contacts, the technology that does not cover solder resist is adopted on the next door of pad array 27.
Europlug 12 be installed in the Europlug installing hole 24 of both sides below the lead plate 8 ' in, the bottom of testing needle sleeve 11 contacts with pad array 27, connects with Europlug 12 by the printed wire on the lead plate 8.
Figure 9 shows that change-over panel 13, arrange in the pin installing hole 28 on row's pin 14 insertion change-over panels on the change-over panel that row's pin 15 inserts under the change-over panel and arranges in the pin installing hole 29 under the change-over panel.Present embodiment needs when using row's pin 14 on the change-over panel of Fig. 9, change-over panel 13 shown in Figure 10 is inserted in the Europlugs 12, and it connects combination as shown in Figure 10 and Figure 11.Testing equipment is connected the change-over panel of change-over panel 13 and arranges on the pin 15 down, elder generation is with the top of pressing plate 17 whiz BGA location-plates 1 during test, the BGA device is placed on the BGA location-plate 1, then pressing plate 17 cycles are pressed in the top of BGA device and, BGA device and BGA location-plate 1 are moved down by following pressing plate 17 to good position.Test syringe needle 2 contacts with the tin sweat(ing) of BGA device, conduction by testing needle and and the conducting that is connected of contact, lead plate 8 printed wires and the Europlug 12 and the change-over panel 13 of the pad array 27 of lead plate 8, test burn writing equipment and just can realize test and programming the BGA device.
Claims (9)
1, a kind of ball-type grid array movable testing stand is characterized in that: comprises,
Be used to the testing needle that meets BGA device tin sweat(ing) arrayed that conducts electricity and test;
Be used to place the BGA location-plate moving up and down of BGA device;
Be used for fixing on the testing needle of described testing needle location-plate under the location-plate and testing needle;
Be used to draw the PCB lead plate that connects described testing needle electrically conductive signal;
Be used to connect testing equipment, be positioned at the lead socket of both sides below the described PCB lead plate;
On described BGA location-plate, the testing needle under location-plate, the testing needle location-plate and PCB lead plate be connected and fixed by set screw successively from top to bottom, wherein the BGA location-plate suppresses on location-plate on the testing needle by the location-plate spring that is enclosed within on its set screw, on described BGA location-plate, the testing needle under location-plate and the testing needle location-plate be equipped with and described testing needle corresponding positioning hole array, described PCB lead plate is provided with and the corresponding pad array of testing needle;
Described testing needle has syringe needle and needle body, and the syringe needle of testing needle is positioned at the location hole array of BGA location-plate, and testing needle syringe needle diameter is less than the aperture in the BGA location-plate location hole array; The needle body of testing needle runs through and is installed on the testing needle under the location-plate and testing needle in the location hole array of location-plate; The bottom of testing needle needle body is communicated with lead socket by the pad array and the printed wire of lead plate.
2, ball-type grid array movable testing stand according to claim 1, it is characterized in that: described testing needle needle body is provided with the testing needle sleeve outward, is provided with spring between the bottom in the bottom of needle body and the testing needle sleeve; The diameter of testing needle sleeve is less than the aperture of the location hole array of location-plate under location-plate on the testing needle and the testing needle, but greater than the aperture in the BGA location-plate location hole array.
3, ball-type grid array movable testing stand according to claim 1 is characterized in that: on the described testing needle under location-plate and the testing needle both sides between the location-plate be provided with fixing double pin.
4, ball-type grid array movable testing stand according to claim 1, it is characterized in that: above described BGA location-plate, also have the fixedly pressing plate of BGA device, pressing plate is provided with and the corresponding circular hole of set screw, and Circularhole diameter is greater than the diameter of set screw head; The two ends of location-plate are respectively arranged with spacing short column and by the screens short column of spring tractive, the through hole that is positioned at pressing plate one end is enclosed within on the spacing short column on the described testing needle, and the other end of pressing plate is provided with the bayonet socket that is used for clamping screens short column.
5, according to each described ball-type grid array movable testing stand of claim 1-4; it is characterized in that: location-plate is made up of testing needle position limitation protection plate and the spring supporting plate that is positioned at below it on the described testing needle; the lower end of described location-plate spring is installed in the location hole of testing needle position limitation protection plate, by the spring supporting plate fixed bearing.
6, according to claim 1 or 4 described ball-type grid array movable testing stands, it is characterized in that: the other position line that also is provided with of the location hole array on the described BGA location-plate.
7, ball-type grid array movable testing stand according to claim 1 is characterized in that: the cladding thickness of described lead plate pad next door solder resist is zero.
8, ball-type grid array movable testing stand according to claim 1, it is characterized in that: described lead socket is an Europlug.
9, ball-type grid array movable testing stand according to claim 1 is characterized in that: on described BGA location-plate, the testing needle under location-plate and the testing needle location-plate be the PCB material, the cladding thickness of its location hole array solder resist is zero.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320117705 CN2665917Y (en) | 2003-11-04 | 2003-11-04 | Ball-type grid array movable testing seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320117705 CN2665917Y (en) | 2003-11-04 | 2003-11-04 | Ball-type grid array movable testing seat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2665917Y true CN2665917Y (en) | 2004-12-22 |
Family
ID=34346904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320117705 Expired - Lifetime CN2665917Y (en) | 2003-11-04 | 2003-11-04 | Ball-type grid array movable testing seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2665917Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900749A (en) * | 2010-07-07 | 2010-12-01 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN103814301A (en) * | 2011-09-23 | 2014-05-21 | 惠康有限公司 | Socket device for IC test |
| CN105246269A (en) * | 2015-10-30 | 2016-01-13 | 程啸 | Quick connection device and method for spring needle and circuit board |
| CN105589025A (en) * | 2016-03-08 | 2016-05-18 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA package testing socket |
-
2003
- 2003-11-04 CN CN 200320117705 patent/CN2665917Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101900749A (en) * | 2010-07-07 | 2010-12-01 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN101900749B (en) * | 2010-07-07 | 2012-07-25 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN103814301A (en) * | 2011-09-23 | 2014-05-21 | 惠康有限公司 | Socket device for IC test |
| CN103814301B (en) * | 2011-09-23 | 2016-08-17 | 惠康有限公司 | IC socket for inspection device |
| CN105246269A (en) * | 2015-10-30 | 2016-01-13 | 程啸 | Quick connection device and method for spring needle and circuit board |
| CN105589025A (en) * | 2016-03-08 | 2016-05-18 | 浙江乔兴建设集团湖州智能科技有限公司 | BGA package testing socket |
| CN107976618A (en) * | 2016-03-08 | 2018-05-01 | 赵令臣 | A kind of method of work of BGA package test jack |
| CN105589025B (en) * | 2016-03-08 | 2018-06-12 | 江苏福田电气有限公司 | A kind of BGA package test jack |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20131104 Granted publication date: 20041222 |