CN2727746Y - Ball-type grating array movable testing stand - Google Patents
Ball-type grating array movable testing stand Download PDFInfo
- Publication number
- CN2727746Y CN2727746Y CN 200420088524 CN200420088524U CN2727746Y CN 2727746 Y CN2727746 Y CN 2727746Y CN 200420088524 CN200420088524 CN 200420088524 CN 200420088524 U CN200420088524 U CN 200420088524U CN 2727746 Y CN2727746 Y CN 2727746Y
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- plate
- array
- testing
- needle
- location
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Abstract
The utility model discloses a ball-type grating array movable testing stand which comprises a test prod array conforming to the arrangement of the BGA device tin sweat array. A BGA positioning plate and a PCB lead wire plate are orderly connected and fixed from top to bottom by a positioning pin used for supporting the BGA device positioning plate, and the BGA positioning plate can move up and down via a spring in the positioning pin. The BGA positioning plate is provided with a positioning hole array corresponding to the test prod, and the lead wire plate is provided with a welding bore corresponding to the test prod. The back end of the test prod is positioned in the positioning hole array of the BGA positioning plate, and the pinhead of the test prod is welded in the welding hole of the lead wire plate and is connected with a leading wire socket via a printed wiring of the lead wire plate. The utility model adopts the positioning hole array to position the test prod, which has advantages of good contact conductance, reduced production cost, easy maintenance and use without mould. The utility model is suitable to the testing of the BGA packaging device as well as the burn writing of the reservoir packaged by the BGA.
Description
Technical field
The utility model relates to a kind of test bench of electron device, especially relates to a kind of ball-type grid array (BGA) movable testing stand.
Background technology
Ball-type grid array (BGA) movable testing stand is used in relevant industries already, for example test of production firm such as digital cell phone, PDA and programming FLASH etc.What present BGA movable testing stand generally adopted is the product that Japan, the U.S. etc. produce, characteristics such as the BGA movable testing stand that for example Japanese YAMACHI company produces has accurately, life-span length, price height, general elastic sheet metal and the high-precision plastics positioning framework with good resistance fatigue of adopting formed, it is produced and must adopt high-precision mould, so production cost height, manufacturing technique requirent is also high, only die cost just surpasses 1,000,000 Renminbi, therefore price is generally higher, and finished product can not keep in repair.In addition, the method that existing BGA movable testing stand generally adopts two elastic sheet metals to clamp the device tin sweat(ing) realizes conduction, the method is more convenient for new unit, just need repair tin sweat(ing) again for the device that old device or tin sweat(ing) come off, this process is referred to as to plant tin, and require the size of each tin sweat(ing) and highly all compare evenly, plant process of tin and have relatively high expectations.
Domestic once had a similar scheme, adopts the testing needle array to replace the elastic sheet metal conduction, but still adopt plastics posting fixing test pin array, produce and will adopt high-precision mould, and manufacturing technique requirent is higher, is difficult to realize low-cost batch production.
The utility model content
The purpose of this utility model is to provide a kind of employing testing needle conduction, pilot hole array assignment test pin array, assemble the location and exempt from the ball-type grid array movable testing stand that mould is produced, so that reduce production costs significantly and production requirement, finished product can be keeped in repair and easy to use, satisfy domestic low cost, convenient and practical market demand.
The purpose of this utility model is achieved by the following technical programs:
Be used to the testing needle array that meets BGA device tin sweat(ing) arrayed that conducts electricity and test;
Be used to place the BGA device location-plate moving up and down of BGA device;
Be used to support the pilot pin of BGA device location-plate;
Be used to draw the PCB lead plate that connects described testing needle arrays of conductive signal;
Be used to connect testing apparatus, be positioned at the lead socket of both sides below the described PCB lead plate;
Described pilot pin is positioning section and location needle tubing from top to bottom, positioning section can be in the needle tubing of location resilient movement up and down, the top of positioning section has the boss that is used to place BGA device location-plate, the lower end of location needle tubing is fixed on the PCB lead plate; Described BGA device location-plate is provided with corresponding with pilot pin boss and testing needle array respectively adaptive BGA device location-plate pilot hole and array hole; Described PCB lead plate is provided with and the corresponding welding hole array of testing needle array;
The tail end of described testing needle array is positioned at the pilot hole array of BGA device location-plate, and the tail end diameter is less than the aperture in the BGA device location-plate array hole; Its syringe needle is welded in the welding hole array of lead plate and is communicated with lead socket through printed wire.
During work, the utility model directly connects by lead socket or connects the test burn writing equipment by the conversion base plate with conversion row pin, and the BGA device is placed on the BGA device location-plate described in the utility model.BGA device location-plate also can be moved up and down with positioning section by the pilot pin location, the BGA device is put thereon and down on time, BGA device location-plate moves down, the tail end of testing needle array passes the array hole of BGA device location-plate and the tin sweat(ing) of BGA device contacts, conduction, lead plate printed wire and lead socket by the testing needle array be connected conducting, be connected on the test burn writing equipment, the test burn writing equipment just can be realized test and the programming to the BGA device.
The utility model also comprises the testing needle location-plate, this testing needle location-plate is provided with respectively positioning section and testing needle array corresponding adaptive testing needle location-plate pilot hole and the array hole with pilot pin, this testing needle location-plate pilot hole is enclosed within on the positioning section of pilot pin and is bearing on the positioning pipe, and described testing needle array passes the array hole of this testing needle location-plate.Can strengthen the location and the steadiness of testing needle array like this.
Testing needle described in the utility model is made of testing needle needle tubing, testing needle syringe needle and testing needle welding section, and the testing needle needle tubing is enclosed within on the testing needle syringe needle and resilient movement up and down, so that contact better with BGA device tin sweat(ing).
Because the BGA device is less, be placed on the BGA device location-plate down inconvenient on time, therefore the utility model also comprises the gland that is used to depress BGA device location-plate, described gland comprises base, cover plate, pressing plate and snap close, on the PCB lead plate, the position of the top corresponding BGA device location-plate of base is provided with opening to base by clip; Cover plate and base at one end are hinged, and are provided with described snap close at the other end; Described pressing plate is located at the inside surface of cover plate and corresponding with base openings.During use the BGA device is placed on the BGA of base openings place device location-plate above, turn down cover plate, pin snap close, the pressing plate on the cover plate is then depressed BGA device and BGA device location-plate, thereby realizes test and programming to the BGA device.
Pilot hole array on the BGA device location-plate described in the utility model is other also to be provided with position line, to make things convenient for the positioning BGA device.
Lead socket described in the utility model is an Europlug.The lead socket that the architectural characteristic of Europlug can make the utility model scheme easily with other conversion base plates on row's pin be used the problems such as loose contact that effectively avoid arranging because of repeatedly plug makes that pin is crooked, flexural deformation etc. causes.
BGA device location-plate described in the utility model and testing needle array location-plate are PCB material or other material such as organic glass, bakelite and glass mats etc. roughly the same, and when adopting the PCB material, the cladding thickness of its pilot hole array solder resist is zero.If cover solder resist on the pilot hole next door, solder resist might flow to the inside, hole and go, and can influence the homogeneity in aperture like this, even cause the testing needle array not move up and down, so the pilot hole array does not cover solder resist in the utility model.
The utlity model has following beneficial effect: the utility model all adopts ready-made material, exempt from mould production, cost is low, simple in structure, easy to assembly, detachable maintenance, particularly with PCB or other material such as organic glass, bakelite and glass mats etc. roughly the same, replace plastics posting fixing test pin array, not only avoided the product in the past must be with high-precision mold production, manufacturing technique requirent height, problem that cost is high, and use more convenient, easily maintenance.The syringe needle of testing needle array is welded in the welding hole array of lead plate in addition, and the tin sweat(ing) of the tail end of testing needle array and BGA device contacts, and can guarantee to contact intact like this.
Description of drawings
Below in conjunction with embodiment and accompanying drawing the utility model is described in further detail:
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the synoptic diagram of BGA device location-plate among the utility model embodiment;
Fig. 3 is the synoptic diagram of testing needle location-plate among the utility model embodiment;
Fig. 4 is the synoptic diagram of lead plate among the utility model embodiment;
Fig. 5 is the synoptic diagram of testing needle among the utility model embodiment;
Fig. 6 is the synoptic diagram of the pilot pin among the utility model embodiment;
Fig. 7 is the synoptic diagram of the gland among the utility model embodiment;
Fig. 8 is the assembling synoptic diagram of the gland among the utility model embodiment;
Embodiment
Fig. 1～Figure 8 shows that embodiment of the present utility model, comprise BGA device location-plate 1, testing needle location-plate 2, testing needle array 3, pilot pin 4, lead plate 5, lead socket 6 and gland 7, testing needle array 3 is used to test and conducts electricity and meet the arrangement of BGA device tin sweat(ing) array, its arrayed is 7 * 8, corresponding with the BGA tin sweat(ing) array of device, testing needle array 3 is made of testing needle needle tubing 3-1, testing needle syringe needle 3-2 and testing needle welding section 3-3 as shown in Figure 5, and testing needle needle tubing 3-1 is enclosed within testing needle syringe needle 3-2 and goes up also resilient movement up and down.Make that testing needle array 3 can be smooth and easy up and down flexible, have the springing stroke of 2mm up and down, so that contact better with BGA device tin sweat(ing).Pilot pin 4 is positioning section 4-2 and location needle tubing 4-1 from top to bottom as shown in Figure 6, positioning section 4-2 can be in the needle tubing 4-1 of location resilient movement up and down, the top of positioning section 4-2 has the boss 4-3 that is used to place BGA device location-plate 1, and the lower end of location needle tubing 4-1 is fixed on the PCB lead plate 5.Be fixed with four pilot pins 4 on the PCB lead plate 5.
As shown in Figure 2, the thickness of BGA device location-plate 1 is 1mm, 4 corresponding adaptive BGA device location-plate pilot hole 1-3 with pilot pin boss 4-3 are arranged all around, and the middle part is provided with and testing needle array 3 corresponding adaptive BGA location-plate array hole 1-1, and the next door also has some position line 1-2.
As shown in Figure 3, testing needle location-plate 2 is provided with respectively positioning section 4-2 and testing needle array 3 corresponding adaptive testing needle location-plate pilot hole 2-2 and the array hole 2-1 with pilot pin, the positioning section 4-2 that this testing needle location-plate pilot hole 2-2 is enclosed within pilot pin goes up and is bearing on the positioning pipe 4-1, and testing needle array 3 passes the array hole 2-1 of this testing needle location-plate.
As shown in Figure 4, last corresponding pilot pin 4, testing needle array 3 and the gland 7 of lead plate 5 is respectively equipped with pilot pin welding hole 5-2, testing needle welding hole 5-3 and gland mounting hole 5-4, and the both sides below it also are provided with lead socket welding hole 5-1.Lead socket 6 is an Europlug, is installed in lead socket welding hole 5-1 place.
As shown in Figure 1, the testing needle welding section 3-3 of testing needle array 3 is welded in the testing needle welding hole 5-3 of lead plate 5, and connects with lead socket 6 by the printed wire on the lead plate 5.Testing needle array 3 passes testing needle location-plate array hole 2-1, and tail end is positioned at the BGA array hole 1-1 of BGA device location-plate 1, and its tail end diameter is less than the aperture in the BGA location-plate pilot hole array.During use the BGA device be placed into BGA device location-plate 1 above, with operating personnel's feel, according to BGA array hole 1-1 and the position line 1-2 BGA device of just can having good positioning easily.
Because the BGA device is less, be placed on the BGA device location-plate 1 down inconveniently on time, on lead plate 5, also be provided with the gland 7 that is used to depress BGA device location-plate as shown in Figure 7 for this reason.As shown in Figure 8, gland 7 comprises base 7-1, cover plate 7-2, pressing plate 7-5 and snap close 7-3, base 7-1 is fixedly mounted on gland mounting hole 5-4 place on the lead plate 5 by screw 7-4 is installed, and the position of the top corresponding BGA device location-plate 1 of base 7-1 is provided with opening 7-6; Cover plate 7-2 and base 7-1 at one end are hinged, and are provided with described snap close 7-3 at the other end; Pressing plate 7-5 is located at the inside surface of cover plate 7-2 and corresponding with base openings 7-6.During use the BGA device is placed on the base openings 7-6 BGA of place device location-plate 1 above, turn down cover plate 7-2, pin snap close 7-3, pressing plate 7-5 on the cover plate then depresses BGA device and BGA device location-plate, make the tin sweat(ing) of BGA device contact conducting, thereby realize test and programming the BGA device with the testing needle array.
When BGA device location-plate 1, when testing needle array location-plate 3 adopts the PCB material, the pilot hole array is other not to cover solder resist, causes the aperture inhomogeneous in order to avoid solder resist penetrates in the pilot hole array.Simultaneously, for the phenomenon in uneven thickness of avoiding the solder resist that the next door of PCB pad in the general technology covers causes the phenomenon of testing needle array syringe needle 3 and lead plate 5 welding hole array loose contacts, the technology that does not cover solder resist is adopted on the next door of welding hole array.
Claims (7)
1, a kind of ball-type grid array movable testing stand is characterized in that: comprises,
Be used to the testing needle array that meets BGA device tin sweat(ing) arrayed that conducts electricity and test;
Be used to place the BGA device location-plate moving up and down of BGA device;
Be used to support the pilot pin of BGA device location-plate;
Be used to draw the PCB lead plate that connects described testing needle arrays of conductive signal;
Be used to connect testing apparatus, be positioned at the lead socket of both sides below the described PCB lead plate;
Described pilot pin is positioning section and location needle tubing from top to bottom, positioning section can be in the needle tubing of location resilient movement up and down, the top of positioning section has the boss that is used to place BGA device location-plate, the lower end of location needle tubing is fixed on the PCB lead plate; Described BGA device location-plate is provided with respectively and corresponding adaptive pilot hole of pilot pin boss and testing needle array and array hole; Described PCB lead plate is provided with and the corresponding welding hole array of testing needle array;
The tail end of described testing needle array is positioned at the pilot hole array of BGA device location-plate; Its syringe needle is welded in the welding hole array of lead plate and is communicated with lead socket through printed wire.
2, ball-type grid array movable testing stand according to claim 1, it is characterized in that: also comprise the testing needle location-plate, this testing needle location-plate is provided with respectively positioning section and testing needle array corresponding adaptive testing needle location-plate pilot hole and the array hole with pilot pin, this testing needle location-plate pilot hole is enclosed within on the positioning section of pilot pin and is bearing on the positioning pipe, and described testing needle array passes the array hole of this testing needle location-plate.
3, ball-type grid array movable testing stand according to claim 1, it is characterized in that: described testing needle is made of testing needle needle tubing, testing needle syringe needle and testing needle welding section, and the testing needle needle tubing is enclosed within on the testing needle syringe needle and resilient movement up and down.
4, ball-type grid array movable testing stand according to claim 1, it is characterized in that: also comprise the gland that is used to depress BGA device location-plate, described gland comprises base, cover plate, pressing plate and snap close, on the PCB lead plate, the position of the top corresponding BGA device location-plate of base is provided with opening to base by clip; Cover plate and base at one end are hinged, and described snap close is located at the other end; Described pressing plate is located at the inside surface of cover plate and corresponding with base openings.
5, according to claim 1 or 4 described ball-type grid array movable testing stands, it is characterized in that: the other position line that also is provided with of the pilot hole array on the described BGA device location-plate.
6, ball-type grid array movable testing stand according to claim 1, it is characterized in that: described lead socket is an Europlug.
7, ball-type grid array movable testing stand according to claim 1 is characterized in that: described BGA device location-plate and testing needle array location-plate are the PCB material, and the cladding thickness of its pilot hole array solder resist is zero.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420088524 CN2727746Y (en) | 2004-09-23 | 2004-09-23 | Ball-type grating array movable testing stand |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420088524 CN2727746Y (en) | 2004-09-23 | 2004-09-23 | Ball-type grating array movable testing stand |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2727746Y true CN2727746Y (en) | 2005-09-21 |
Family
ID=35043759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420088524 Expired - Lifetime CN2727746Y (en) | 2004-09-23 | 2004-09-23 | Ball-type grating array movable testing stand |
Country Status (1)
| Country | Link |
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| CN (1) | CN2727746Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063625B (en) * | 2006-04-30 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | BGA packaging retainer apparatus and method for testing BGA packaging |
| CN101900749A (en) * | 2010-07-07 | 2010-12-01 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN101201372B (en) * | 2006-12-13 | 2011-06-29 | 英业达股份有限公司 | Testing tool for circuit board |
| CN102221670A (en) * | 2010-04-13 | 2011-10-19 | 中芯国际集成电路制造(上海)有限公司 | Ball grid array test socket |
| CN102539846A (en) * | 2012-02-13 | 2012-07-04 | 广东中晶电子有限公司 | Crystal oscillator test clamp with circuit switching plate |
| CN110672120A (en) * | 2019-09-09 | 2020-01-10 | 武汉元生创新科技有限公司 | Device calibration device |
-
2004
- 2004-09-23 CN CN 200420088524 patent/CN2727746Y/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063625B (en) * | 2006-04-30 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | BGA packaging retainer apparatus and method for testing BGA packaging |
| US7932739B2 (en) | 2006-04-30 | 2011-04-26 | Semiconductor Manufacturing International (Shanghai) Corporation | BGA package holder device and method for testing of BGA packages |
| CN101201372B (en) * | 2006-12-13 | 2011-06-29 | 英业达股份有限公司 | Testing tool for circuit board |
| CN102221670A (en) * | 2010-04-13 | 2011-10-19 | 中芯国际集成电路制造(上海)有限公司 | Ball grid array test socket |
| CN101900749A (en) * | 2010-07-07 | 2010-12-01 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN101900749B (en) * | 2010-07-07 | 2012-07-25 | 重庆邮电大学 | Support for testing BGA packaged chips |
| CN102539846A (en) * | 2012-02-13 | 2012-07-04 | 广东中晶电子有限公司 | Crystal oscillator test clamp with circuit switching plate |
| CN102539846B (en) * | 2012-02-13 | 2014-11-19 | 广东中晶电子有限公司 | Crystal oscillator test clamp with circuit switching plate |
| CN110672120A (en) * | 2019-09-09 | 2020-01-10 | 武汉元生创新科技有限公司 | Device calibration device |
| CN110672120B (en) * | 2019-09-09 | 2021-04-27 | 武汉元生创新科技有限公司 | Device calibration device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140923 Granted publication date: 20050921 |