CN102221670A - Ball grid array test socket - Google Patents
Ball grid array test socket Download PDFInfo
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- CN102221670A CN102221670A CN2010101538564A CN201010153856A CN102221670A CN 102221670 A CN102221670 A CN 102221670A CN 2010101538564 A CN2010101538564 A CN 2010101538564A CN 201010153856 A CN201010153856 A CN 201010153856A CN 102221670 A CN102221670 A CN 102221670A
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Abstract
The invention provides a ball grid array test socket, which comprises a test socket cover and a base. A base opening is formed on the base. A raised chip fixing end is formed on the inner surface of the test socket cover, has a shape and a size adapted to those of the base opening, and comprises a through hole running through the test socket cover. The test socket provided by the invention can improve the test capability of a ball grid array (BGA) device.
Description
Technical field
The present invention relates to the semiconductor test field, particularly a kind of ball grid array test bench.
Background technology
At present, for SIC (semiconductor integrated circuit) (IC) chip of 90 nanometers and following high integration, (arrangement mode of I/O (I/O) pin is a grid array for Ball Grid Array, packing forms BGA) generally to adopt ball grid array.
The chip that adopts the BGA form to encapsulate is called the BGA device, in the prior art BGA device is placed the test bench cross-sectional view of testing on the BGA test bench as shown in Figure 1.The BGA test bench is as the carrier of test chip, comprise base 101 and test flap 102, during test, by pressing down test flap 102, each I/O pin on the feasible BGA device 103 that places between base 101 and the test flap 102 is by the testing needle (not shown) in the test bench, better with tester platform on the test board conducting, thereby realize test and programming to the BGA device.Corresponding position of placing BGA device 103 is provided with base openings 104 above the base 101, is the square groove of rule, is used for BGA device 103 is placed in it.Chip stiff end 105 on the test flap 102 is square raised plate, is located at the inside surface of test flap 102, and adaptive with base openings, is used for BGA device 103 is fixed in the base openings 104.
But, as can be seen from the figure, chip stiff end 105 be one with the adaptive square entity of base openings, do not have through hole.This set can't carry out radioactive source accelerated test (ASER), because when carrying out this class testing, radioactive source is placed the top of test flap 102, and as shown in Figure 2, Fig. 2 is the synoptic diagram when carrying out the ASER test.It is cylindric that radioactive source is, corresponding with the position of BGA device, penetrates alpha ray.Alpha-particle energy is limited, and a common thin paper just can block it, so the test flap blocks ray in the prior art, can't carry out suchlike special test.And in temperature cycling test, high temperature or low-temperature airflow can't directly contact with the BGA device, must from top to down temperature conduction be gone over by the test flap, so test is wasted time and energy.
For carrying out the ASER test, a kind of method of prior art is: adopt copper facing routing seat (sidebraze) to carry out routing, solder joint on the chip (pad) directly is connected with gold thread, carry out simplified package, promptly carry out dual inline type (DIP, Dual In-line) encapsulation, the chip of this packing forms exposes, because chip is exposed, so it is more to be subjected to the interference ratio of extraneous factor, for example the height between chip surface and the radioactive source is not easy to regulate factors such as control, causes temporary transient crash rate inaccurate.The ASER test places the different data of read-write in the radiation field with chip exactly, the crash rate of junior unit (cell) in the statistics chip, and this inefficacy is temporary transient, data will be recovered after chip leaves radiation field.On the other hand, gold thread directly is connected with solder joint, because solder joint is more, so the number of routing is just many, gold thread is easy to overlapping or fractures.And in temperature cycling test, high temperature or low-temperature airflow are bigger, and air-flow acts directly on the gold thread, causes between gold thread and the pad layering taking place.
Summary of the invention
In view of this, the technical matters of the present invention's solution is: the power of test that improves the BGA device.
For solving the problems of the technologies described above, technical scheme of the present invention specifically is achieved in that
The invention discloses a kind of ball grid array test bench, comprise test bench lid and bottom seat, described base is provided with base openings, lobed chip stiff end on the described test bench interior surface, its shape and size and described base openings are suitable, it is characterized in that this chip stiff end has through hole, and this through hole runs through the test flap.
Being shaped as of described chip stiff end is square.
What described shape of through holes was the length of side smaller or equal to the chip stiff end length of side is square.
The outside surface of described test flap is provided with the radioactive source put area of depression, and its shape and size and radioactive source are complementary, and is used for radioactive source is fixed in it.
The chip stiff end symmetria bilateralis of described test flap is provided with the orientation stiff end of projection, is being provided with base groove on the base with on the corresponding position of orientation stiff end, and described orientation stiff end and base groove are suitable.
The edge of described test flap is provided with L shaped fixedly card, in chassis outer side and fixedly be provided with the base buckle of projection on the corresponding position of card, one end of described fixedly card is connected with the test flap by stirring shell fragment, when the other end contacts with base at the test flap, stir downwards and block the base buckle.
The described shell fragment of stirring is an elastic metallic, is used for fixing card around its axis rotation.
Described base buckle is symmetricly set on chassis outer side.
As seen from the above technical solutions, the present invention covers at the BGA test bench chip stiff end that has through hole is set, and test bench cover with the corresponding position of the through hole of chip stiff end on through hole also is set.Not only can carry out various special tests easily, but also can be used for observing and ventilating.When for example carrying out the ASER test, alpha ray is mapped on the BGA device by through hole, accurately records temporary transient crash rate; When carrying out temperature cycling test, high temperature or low-temperature airflow directly contact with the BGA device, make BGA device shell temperature take place sharply to change, thereby arrive the purpose of quick lifting/lowering temperature.
Description of drawings
Fig. 1 is the cross-sectional view of test bench in the prior art.
Fig. 2 is the synoptic diagram when carrying out the ASER test.
Fig. 3 is the cross-sectional view of embodiment of the invention test bench.
Fig. 4 is the elevational schematic view of embodiment of the invention test flap.
Embodiment
For make purpose of the present invention, technical scheme, and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
Core concept of the present invention is: cover at the BGA test bench chip stiff end that has through hole be set, and test bench cover with the corresponding position of the through hole of chip stiff end on through hole also is set.Not only can carry out various special tests easily, but also can be used for observing and ventilating.When for example carrying out the ASER test, alpha ray is mapped on the BGA device by through hole, accurately records temporary transient crash rate; When carrying out temperature cycling test, high temperature or low-temperature airflow directly contact with the BGA device, make BGA device shell temperature take place sharply to change, thereby arrive the purpose of quick lifting/lowering temperature.
BGA test bench of the present invention comprises base and test flap, and the cross-sectional view of embodiment of the invention test bench as shown in Figure 3.The elevational schematic view of testing flap below in conjunction with the embodiment of the invention of Fig. 4 is elaborated.This test flap 301 comprises chip stiff end 302, orientation stiff end 303, fixing card 304; The base 305 suitable with this test flap comprises base openings 104, also comprises base buckle 306 and base groove 307.During test, by pressing down test flap 301, each I/O pin on the feasible BGA device 103 that places between base 305 and the test flap 301 is by the testing needle (not shown) in the test bench, better with tester platform on the test board conducting, thereby realize test and programming to the BGA device.
Corresponding position of placing BGA device 103 is provided with base openings 104 above the base 305, is the square groove of rule, is used for BGA device 103 is placed in it.Chip stiff end 302 on the test flap 301 is square raised plate, is located at the inside surface of test flap 301, and adaptive with base openings, is used for BGA device 103 is fixed in the base openings 104.Unlike the prior art be, chip stiff end 302 of the present invention has through hole, and the test flap 301 on the corresponding position of the through hole of chip stiff end 302 on also be provided with through hole, that is to say that these two through hole correspondences are overlapping.The shape of through hole is preferably the square of rule, and the length of side of this square through hole is generally less than the surperficial length of side that equals chip stiff end 302.In addition, for carrying out the ASER test, radioactive source stably is fixed on the test flap 301, the present invention is at the outside surface of test flap, with the corresponding zone of cylindric radioactive source, a circular depressed is set, as radioactive source put area 309, be used for the cup dolly of cylindric radioactive source suitablely, radioactive source is stable in the circular depressed.Wherein, the square configuration of base openings 104 is a specific embodiment of the present invention, as long as the BGA device can be placed in it, can also be other multiple shape and size, the chip stiff end of projection is suitable with base openings, so the shape and the size of the chip stiff end of projection can be adjusted accordingly according to base openings.Equally, the circular depressed of radioactive source put area 309 also is with the form fit of radioactive source, can do to adjust flexibly accordingly according to the shape of radioactive source and size.
Can observe directly BGA device 103 by through hole, so can pass through the state of instrument Real Time Observation test products such as microscope, spectrometer.For example, adopt spectrometer to observe, obtain the spectrum change of chip, thereby chip is carried out failure analysis, obtain physical location of chip failure or the like by through hole.Cover at test bench through hole is set, the more important thing is, can be used for carrying out smoothly special tests such as temperature cycling test, ASER test.In temperature cycling test, high temperature or low-temperature airflow directly contact with the BGA device by through hole, make BGA device shell temperature take place sharply to change, thereby arrive the purpose of quick lifting/lowering temperature, have overcome the shortcoming that prior art wastes time and energy.In the ASER test, still place test bench to cover radioactive source, because test bench covers the setting of through hole, so alpha ray can be mapped on the BGA device, and radioactive source places test bench to cover, height between chip surface and the radioactive source is in controlled range, and therefore the temporary transient crash rate that records just relatively accurately.
In addition, test flap 301 has certain mechanical strength, so material is preferably metals such as gold, copper, tin, lead, silver, tungsten, nickel, tantalum, chromium, the perhaps alloy of above-mentioned metal.
Orientation stiff end 303, for being symmetricly set on two protrusions of chip stiff end 302 both sides, press down when contacting at the test flap with base, described protrusion extend in the base groove 307 on the base, suitable with base groove 307, be used to guarantee to test flap and place on the base and do not rotate.
Fixedly card 304, and for L shaped, an end is by stirring the edge that shell fragment 308 is fixedly installed in the test flap, and fixedly card 304 can rotate to an angle around the axis of stirring shell fragment 308.Press down when contacting at the test flap with base, fixedly the other end of card is stirred downwards and is blocked base buckle 306, to test flap closely contacts with test bench, thereby make each I/O pin on the BGA device 103 by the testing needle in the test bench, better with tester platform on the test board conducting.Wherein, stir shell fragment 308 and can have elastically-deformable metal for spring etc.Base buckle 306 is for being located at the protrusion of chassis outer side, with fixedly card 304 is adaptive, is used for fixing card is blocked.Obviously, can a base buckle be set, also can two base buckles be set, as long as can realize testing the purpose that flap and test bench closely contact in the base symmetria bilateralis in chassis outer side.
For orientation stiff end 303, fixedly card 304 and base buckle 306, for can the adaptive testing state, also all need to have certain mechanical strength, so material is preferably metals such as gold, copper, tin, lead, silver, tungsten, nickel, tantalum, chromium, the perhaps alloy of above-mentioned metal.
In sum, the present invention covers at test bench through hole is set, and has realized various special tests, and can carry out Real Time Observation to product by through hole.Further, the present invention covers at test bench orientation stiff end and fixing card is set, and base groove and base buckle are set on testing base respectively with the orientation stiff end with fixedly card is adaptive, when test, further strengthened the contact between the test bench lid and bottom seat, thereby make each I/O pin on the BGA device by the testing needle in the test bench, better with tester platform on the test board conducting.
BGA test bench of the present invention, can be applied to various multi-form bga structures, comprise: plastics welded ball array (PBGA, Plasric Ball Grid Array) encapsulation, thin space ball grid array (FBGA, Fine-Pitch Ball Grid Array) various encapsulating structures such as encapsulation or plane thin space ball grid array (LFBGA, Low-Profile Fine Pitch Ball Grid Array) encapsulation.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. ball grid array test bench, comprise test bench lid and bottom seat, described base is provided with base openings, lobed chip stiff end on the described test bench interior surface, its shape and size and described base openings are suitable, it is characterized in that this chip stiff end has through hole, and this through hole runs through the test flap.
2. test bench according to claim 1 is characterized in that being shaped as of described chip stiff end is square.
3. test bench according to claim 2 is characterized in that, what described shape of through holes was the length of side smaller or equal to the chip stiff end length of side is square.
4. test bench according to claim 1 is characterized in that, the outside surface of described test flap is provided with the radioactive source put area of depression, and its shape and size and radioactive source are complementary, and are used for radioactive source is fixed in it.
5. test bench according to claim 4, it is characterized in that, the chip stiff end symmetria bilateralis of described test flap is provided with the orientation stiff end of projection, is being provided with base groove on the base with on the corresponding position of orientation stiff end, and described orientation stiff end and base groove are suitable.
6. according to claim 3,4 or 5 described test benches, it is characterized in that, the edge of described test flap is provided with L shaped fixedly card, in chassis outer side and fixedly be provided with the base buckle of projection on the corresponding position of card, one end of described fixedly card is connected with the test flap by stirring shell fragment, when the other end contacts with base at the test flap, stir downwards and block the base buckle.
7. test bench according to claim 6 is characterized in that, the described shell fragment of stirring is an elastic metallic, is used for fixing card around its axis rotation.
8. test bench according to claim 7 is characterized in that, described base buckle is symmetricly set on chassis outer side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101538564A CN102221670A (en) | 2010-04-13 | 2010-04-13 | Ball grid array test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101538564A CN102221670A (en) | 2010-04-13 | 2010-04-13 | Ball grid array test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102221670A true CN102221670A (en) | 2011-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101538564A Pending CN102221670A (en) | 2010-04-13 | 2010-04-13 | Ball grid array test socket |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6335629B1 (en) * | 1997-08-12 | 2002-01-01 | Samsung Electronics Co., Ltd. | Test fixture having an opening for exposing the back of a semiconductor chip and testing module comprising the same |
| CN1588636A (en) * | 2004-09-21 | 2005-03-02 | 威盛电子股份有限公司 | Detecting clamp and its top cover |
| CN2727746Y (en) * | 2004-09-23 | 2005-09-21 | 白锦添 | Ball-type grating array movable testing stand |
| CN101233415A (en) * | 2005-07-12 | 2008-07-30 | 斯班逊有限公司 | Integrated circuit test socket |
| CN101283283A (en) * | 2005-10-13 | 2008-10-08 | 爱德万测试株式会社 | Plug-in piece, test bracket as well as semiconductor test device |
-
2010
- 2010-04-13 CN CN2010101538564A patent/CN102221670A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6335629B1 (en) * | 1997-08-12 | 2002-01-01 | Samsung Electronics Co., Ltd. | Test fixture having an opening for exposing the back of a semiconductor chip and testing module comprising the same |
| CN1588636A (en) * | 2004-09-21 | 2005-03-02 | 威盛电子股份有限公司 | Detecting clamp and its top cover |
| CN2727746Y (en) * | 2004-09-23 | 2005-09-21 | 白锦添 | Ball-type grating array movable testing stand |
| CN101233415A (en) * | 2005-07-12 | 2008-07-30 | 斯班逊有限公司 | Integrated circuit test socket |
| CN101283283A (en) * | 2005-10-13 | 2008-10-08 | 爱德万测试株式会社 | Plug-in piece, test bracket as well as semiconductor test device |
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| C10 | Entry into substantive examination | ||
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| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121119 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20121119 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| C12 | Rejection of a patent application after its publication | ||
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Application publication date: 20111019 |