CN212392219U - Device for detecting and calibrating position of semiconductor wafer - Google Patents
Device for detecting and calibrating position of semiconductor wafer Download PDFInfo
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- CN212392219U CN212392219U CN202021237375.7U CN202021237375U CN212392219U CN 212392219 U CN212392219 U CN 212392219U CN 202021237375 U CN202021237375 U CN 202021237375U CN 212392219 U CN212392219 U CN 212392219U
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- machine table
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Abstract
The utility model discloses a device for semiconductor wafer position detects calibration, including being used for supporting and driving the rotatory board of wafer and being used for placing the robot arm on the board with the wafer, still including the alignment structure that is used for detecting the watch-dog of the wafer offset condition and is used for adjusting the relative board position of wafer, the alignment structure includes the calibration board and is used for driving the drive structure that the relative board position of calibration board removed. The wafer positioning device can detect the position deviation of a wafer placed on a machine table, and adjust and calibrate the position of the wafer through the alignment structure, so that the wafer and a machine table sucker are concentric, and the uniformity of wafer photoresist is improved.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor chip technique and specifically relates to a device for semiconductor wafer position detects calibration is related to.
Background
The photolithography process is the most critical process link in the fabrication of semiconductor chips. The development of semiconductor chip manufacturing processes is determined by photolithography, and it is due to the great progress of photolithography that the integrated circuit manufacturing processes are brought from the micro era to the nano era. However, the spraying and developing of the photoresist plays a critical role in the overall photolithography process; the gluing uniformity is an important index for gluing and developing. If the wafer is not in the center of the machine table during the coating and developing processes, the uniformity is poor, and even the wafer is broken when the deviation is serious.
As shown in fig. 5, when a position error or deviation occurs when the robot places the wafer on the surface of the table, the wafer is not concentric with the table chuck; when the wafer is coated with glue and the glue is homogenized, the uniformity of the thickness of a film layer on the surface of the wafer is poor, and when exposure development and subsequent etching are carried out, the bottom material of a photoresist protection area is etched during etching due to the fact that the film layer in a part of the area is thin, so that quality abnormity is caused.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a device for semiconductor wafer position detection calibration, its detectable wafer is placed on the machine bench offset and is carried out the position calibration, guarantees that wafer and machine are concentric.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
the device for detecting and calibrating the position of the semiconductor wafer comprises a machine table for supporting and driving the wafer to rotate, a robot arm for placing the wafer on the machine table, a monitor for detecting the position deviation condition of the wafer and an alignment structure for adjusting the position of the wafer relative to the machine table, wherein the alignment structure comprises a calibration plate and a driving structure for driving the calibration plate to move relative to the machine table.
Furthermore, the calibration plate is a vertical plate, and the inner surface of the calibration plate is arranged opposite to the outer edge of the wafer.
The calibration plates are in a group, and the calibration plates are uniformly arranged around the top of the machine table along the circumference.
The top of the machine table is provided with a vacuum chuck for positioning the wafer, and the chuck is of a disc structure.
The monitor is positioned above the top of the machine table.
The driving structure is a cylinder or a pushing motor.
The device also comprises a controller, and the driving structure and the monitor are connected with the controller.
And a protective cover for preventing the photoresist from splashing on the machine table is arranged outside the machine table.
Compared with the prior art, the utility model, have following advantage:
the device for detecting and calibrating the position of the semiconductor wafer is reasonable in structural design, can detect the position offset of the wafer placed on the machine table, adjusts and calibrates the position of the wafer through the alignment structure, and ensures that the wafer and the machine table sucker are concentric, so that the uniformity of photoresist of the wafer is improved.
Drawings
The contents of the description and the references in the drawings are briefly described as follows:
fig. 1 is a schematic view of the structure of the device of the present invention.
Fig. 2 is a schematic top view of the device of the present invention.
Fig. 3 is a schematic view of the detection calibration of the present invention.
Fig. 4 is a schematic view of the standard placement before wafer coating.
FIG. 5 is a schematic diagram of a wafer being placed on a stage.
In the figure:
1. the system comprises an alignment structure, 2. a protective cover, 3. a machine table, 4. a robot arm, 5. a monitor and 6. a wafer.
Detailed Description
The following description of the embodiments of the present invention will be made in detail with reference to the accompanying drawings.
As shown in fig. 1 to 4, the apparatus for detecting and calibrating the position of a semiconductor wafer includes a machine table 3 for supporting and driving the wafer to rotate, a robot arm 4 for placing the wafer 6 on the machine table, a monitor 5 for detecting the position offset of the wafer, and an alignment structure 1 for adjusting the position of the wafer relative to the machine table.
The alignment structure 1 comprises a calibration plate and a driving structure for driving the calibration plate to move relative to the machine table; the driving structure is a cylinder or a pushing motor, the calibration plate is a vertical plate, the inner surface of the calibration plate is arranged opposite to the outer edge of the wafer, and the wafer is pushed to adjust the position through the calibration plate.
The calibration plates are in a group, and the calibration plates are uniformly arranged around the top of the machine table along the circumference; preferably, the number of the calibration plates is four, the four calibration plates are arranged in a cross manner, the calibration plates are matched with the wafer to rotate, the position of the wafer on the machine table is adjusted, and finally the wafer and the machine table are concentric.
A vacuum chuck for positioning the wafer is arranged at the top of the machine table 3, and the chuck is of a disc structure; the outside of the machine is provided with a protective cover 2 for preventing the photoresist from splashing on the machine.
The device also comprises a controller, wherein the driving structure and the monitor are connected with the controller, and the driving structure is controlled to automatically adjust by monitoring the deviation position of the wafer through the monitor.
Watch-dog 5 is located the top at board top, and the watch-dog is fixed to be set up through a support, and the counterpoint structure also sets up on the support, compact structure.
The utility model has the advantages of reasonable design, its detectable wafer is placed at the offset of machine bench to adjust the calibration through the counterpoint structure to the wafer position, guarantee that wafer and board sucking disc are concentric, thereby improve wafer photoresist homogeneity.
When the wafer is positioned at the center of the mechanical arm and the wafer is placed on the machine table and is also at the center, the concentricity of the wafer and the machine table sucker can be realized; when wafer gluing is carried out, a photoresist film layer with better uniformity can be obtained; if there is deviation, accessible in the wafer of placing and the board decentraction the utility model discloses the device high efficiency adjustment.
After the robot arm is placed on the machine table, the machine table starts to rotate at a low speed and simultaneously starts the monitor after the vacuum adsorption wafer is started, and whether the wafer deviates or not is detected. When the wafer is detected to be subjected to position deviation, the machine stops rotating and releases vacuum, then the alignment structure is started, the position of the wafer is adjusted, vacuum adsorption is performed again after the position adjustment is completed, then low-speed rotation is performed, the wafer deviation condition is detected, and finally the wafer and the machine are concentric through multiple times of adjustment. After the wafer and the machine are concentric, the machine starts to descend to a glue coating standby position, and then starts to rotate and perform photoresist spraying.
The above-mentioned is only for the description of the preferred embodiments of the present invention, and the above-mentioned technical features can be combined at will to form a plurality of embodiments of the present invention.
The present invention has been described in detail with reference to the accompanying drawings, and it is apparent that the present invention is not limited by the above embodiments, and various insubstantial improvements can be made without modification to the present invention.
Claims (8)
1. The utility model provides a device for semiconductor wafer position detects calibration, is including being used for supporting and driving the rotatory board of wafer and being used for placing the robot arm on the board, its characterized in that: the wafer aligning device further comprises a monitor for detecting the wafer position deviation condition and an aligning structure for adjusting the position of the wafer relative to the machine table, wherein the aligning structure comprises a calibration plate and a driving structure for driving the calibration plate to move relative to the machine table.
2. An apparatus for semiconductor wafer position sensing calibration as recited in claim 1, wherein: the calibration plate is a vertical plate, and the inner surface of the calibration plate is arranged opposite to the outer edge of the wafer.
3. An apparatus for semiconductor wafer position sensing calibration as defined in claim 1 or 2, wherein: the calibration plates are in a group, and the calibration plates are uniformly arranged around the top of the machine table along the circumference.
4. An apparatus for semiconductor wafer position sensing calibration as recited in claim 1, wherein: the top of the machine table is provided with a vacuum chuck for positioning the wafer, and the chuck is of a disc structure.
5. An apparatus for semiconductor wafer position sensing calibration as recited in claim 1, wherein: the monitor is positioned above the top of the machine table.
6. An apparatus for semiconductor wafer position sensing calibration as recited in claim 1, wherein: the driving structure is a cylinder or a pushing motor.
7. An apparatus for semiconductor wafer position sensing calibration as recited in claim 1, wherein: the device also comprises a controller, and the driving structure and the monitor are connected with the controller.
8. An apparatus for semiconductor wafer position sensing calibration as defined in claim 4, wherein: and a protective cover for preventing the photoresist from splashing on the machine table is arranged outside the machine table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021237375.7U CN212392219U (en) | 2020-06-29 | 2020-06-29 | Device for detecting and calibrating position of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021237375.7U CN212392219U (en) | 2020-06-29 | 2020-06-29 | Device for detecting and calibrating position of semiconductor wafer |
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| Publication Number | Publication Date |
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| CN212392219U true CN212392219U (en) | 2021-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021237375.7U Active CN212392219U (en) | 2020-06-29 | 2020-06-29 | Device for detecting and calibrating position of semiconductor wafer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725136A (en) * | 2021-08-30 | 2021-11-30 | 长江存储科技有限责任公司 | Wafer alignment method, system, computer readable storage medium and processor |
| CN113725109A (en) * | 2021-08-26 | 2021-11-30 | 苏州新尚思自动化设备有限公司 | Pin Hole wafer inspection machine |
| CN114474440A (en) * | 2022-03-16 | 2022-05-13 | 江苏京创先进电子科技有限公司 | Method for controlling adjustment precision of fine adjustment device |
-
2020
- 2020-06-29 CN CN202021237375.7U patent/CN212392219U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113725109A (en) * | 2021-08-26 | 2021-11-30 | 苏州新尚思自动化设备有限公司 | Pin Hole wafer inspection machine |
| CN113725109B (en) * | 2021-08-26 | 2024-01-05 | 苏州新尚思自动化设备有限公司 | Pin Hole wafer inspection machine |
| CN113725136A (en) * | 2021-08-30 | 2021-11-30 | 长江存储科技有限责任公司 | Wafer alignment method, system, computer readable storage medium and processor |
| CN113725136B (en) * | 2021-08-30 | 2024-05-24 | 长江存储科技有限责任公司 | Wafer alignment method, system, computer readable storage medium and processor |
| CN114474440A (en) * | 2022-03-16 | 2022-05-13 | 江苏京创先进电子科技有限公司 | Method for controlling adjustment precision of fine adjustment device |
| CN114474440B (en) * | 2022-03-16 | 2023-03-10 | 江苏京创先进电子科技有限公司 | Method for controlling adjustment precision of fine adjustment device |
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