CN220253215U - Wafer center positioning device - Google Patents
Wafer center positioning device Download PDFInfo
- Publication number
- CN220253215U CN220253215U CN202321764773.8U CN202321764773U CN220253215U CN 220253215 U CN220253215 U CN 220253215U CN 202321764773 U CN202321764773 U CN 202321764773U CN 220253215 U CN220253215 U CN 220253215U
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- wafer
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- center
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- 238000006073 displacement reaction Methods 0.000 claims abstract description 32
- 238000001514 detection method Methods 0.000 claims abstract description 14
- 238000001179 sorption measurement Methods 0.000 claims description 25
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 61
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a device for positioning the center of a wafer, which is used for centering the wafer and comprises the following components: the positioning module is used for placing and positioning the wafer; the detection module is used for detecting the position of the wafer on the positioning module; the displacement module is connected with the positioning module and is electrically connected with the detection module, and the displacement module can drive the positioning module to move. The utility model can accurately and adjust the circle center position of the wafer in a mode of not contacting the wafer, ensure the correctness of the circle center of the wafer, and greatly improve the working efficiency in a non-mechanical positioning mode, and ensure other working procedures.
Description
Technical Field
The utility model relates to the technical field of automatic production of semiconductor wafers, in particular to a device for positioning a wafer center.
Background
With the development of the technology industry, the semiconductor industry plays an increasingly important role, and particularly, the positioning of the wafer center is important in the wafer production process. The mechanical positioning mode is to directly contact the wafer by using a complex mechanical device, and the mechanical device is very easy to pollute the wafer due to the direct contact between the mechanical device and the edge of the wafer, and the positioning precision is completely influenced by the precision of the mechanical device.
Disclosure of Invention
According to an embodiment of the present utility model, there is provided a wafer center positioning apparatus for centering a wafer, including:
the positioning module is used for placing and positioning the wafer;
the detection module is used for detecting the position of the wafer on the positioning module;
the displacement module is connected with the positioning module and is electrically connected with the detection module, and the displacement module can drive the positioning module to move.
Further, the positioning module includes: the wafer comprises a wafer platform, a rotating shaft and a driving device;
the wafer platform is used for placing a wafer, the rotating shafts are respectively connected with the wafer platform and the driving device, and the driving device drives the rotating shafts and drives the wafer platform to rotate.
Further, the positioning module further comprises: an adsorption table and an air pipe joint;
the adsorption platform is arranged on the wafer platform, the area of the adsorption platform is smaller than that of the wafer platform, the plane of the adsorption platform is higher than that of the wafer platform, and the air pipe connector is connected with the adsorption platform.
Further, the adsorption stage includes: a plurality of suction holes, a plurality of first grooves and a plurality of second grooves;
the first grooves are distributed on the adsorption table, the second grooves are connected with the first grooves, the suction holes are respectively formed in the connection positions of the first grooves and the second grooves, and the first grooves, the second grooves and the suction holes are mutually communicated.
Further, the first grooves are round, a plurality of first grooves form a concentric round structure, the second grooves are in a cross shape, and the centers of the cross shapes of the first grooves and the second grooves are overlapped.
Further, the driving device is a servo motor.
Further, the detection module is an optical detection sensor for detecting the position of the wafer.
Further, the displacement module comprises: an X-axis displacement module and a Y-axis displacement module;
the X-axis displacement module drives the positioning module to move in the X-axis direction;
the Y-axis displacement module drives the positioning module to move in the Y-axis direction.
Further, the displacement module comprises: the sliding rail and the air cylinder;
the cylinder drives the positioning module to move on the sliding rail.
According to the wafer center positioning device provided by the embodiment of the utility model, the center position of the wafer can be accurately and adjusted in a mode of not contacting the wafer, the correctness of the center of the wafer is ensured, the working efficiency is greatly improved in a non-mechanical positioning mode, and other working procedures are ensured.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the technology claimed.
Drawings
FIG. 1 is a schematic view of an overall structure of a wafer center positioning apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a positioning module for positioning a wafer center apparatus according to an embodiment of the utility model;
FIG. 3 is a schematic diagram of an adsorption stage for positioning a wafer center apparatus according to an embodiment of the present utility model.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings, which further illustrate the present utility model.
First, a wafer center positioning device according to an embodiment of the present utility model will be described with reference to fig. 1 to 3, and the application scenario for positioning a wafer center is wide.
As shown in fig. 1-2, the wafer center positioning device in the embodiment of the utility model is used for performing center positioning on a wafer, and is provided with a positioning module 1, a detecting module 2 and a displacement module 3.
Specifically, as shown in fig. 1-2, in this embodiment, the positioning module 1 is used for placing and positioning a wafer to ensure that the wafer cannot shift in the displacement process, the detecting module 2 is used for detecting the position of the wafer on the positioning module 1, calculating the shift amount of the circle center, facilitating the subsequent adjustment of the position of the wafer center, ensuring the correctness of the circle center of the wafer, the displacement module 3 is connected with the positioning module 1 and electrically connected with the detecting module 2, and the displacement module 3 drives the positioning module 1 to move to the position where the wafer can be detected and adjusts the position of the circle center.
Further, as shown in fig. 2, in the present embodiment, the positioning module 1 includes: the wafer platform 11, axis of rotation 12 and drive arrangement 13, the wafer platform 11 is used for placing the wafer, the axis of rotation 12 is connected with wafer platform 11 and drive arrangement 13 respectively, drive arrangement 13 drives axis of rotation 12 and drives the wafer platform 11 rotation, preferably, drive arrangement 13 is servo motor, drive the rotation of drive shaft through servo motor, thereby wafer platform 11 is rotatory, every 90 degrees angles of rotation, detection module 2 just can measure the displacement of once wafer centre of a circle, finally when rotatory 360 degrees, calculate the offset of wafer centre of a circle, cooperate displacement module 3 again, adjust the centre of a circle position, until guaranteeing that the centre of a circle is at the assigned position.
Further, as shown in fig. 2, in the present embodiment, the positioning module 1 further includes: the wafer clamping device comprises an adsorption table 14 and an air pipe joint 15, wherein the adsorption table 14 is arranged on a wafer platform 11, the area of the adsorption table 14 is smaller than that of the wafer platform 11, the plane of the adsorption table 14 is higher than that of the wafer platform 11, the air pipe joint 15 is connected with the adsorption table 14, vacuum is conducted to the adsorption table 14 through the air pipe joint 15, when a wafer is arranged on the adsorption table 14, a vacuum cavity is generated to adsorb the wafer, the wafer is effectively positioned, an additional mechanical device is not needed for positioning, the wafer is prevented from being damaged, the adsorption table 14 is higher than the design of the wafer platform 11, and an external grabbing mechanism only stretches between the wafer platform 11 and the wafer and then lifts up, so that the wafer can be taken and placed without clamping the wafer to damage the wafer.
Further, as shown in fig. 3, in the present embodiment, the adsorption stage 14 includes: the plurality of suction holes 141, the plurality of first grooves 142 and the plurality of second grooves 143, the plurality of first grooves 142 are distributed on the suction table 14, the plurality of first grooves 142 are connected with the plurality of second grooves 143, the plurality of suction holes 141 are respectively formed in the connection positions of the first grooves 142 and the second grooves 143, the plurality of first grooves 142, the plurality of second grooves 143 and the plurality of suction holes 141 are mutually communicated, the suction area of a wafer is greatly enlarged by the first grooves 142 and the second grooves 143, the suction is avoided, the first grooves 142 are preferably circular, the plurality of first grooves 142 form a concentric circular structure, the second grooves 143 are in a cross shape, the cross centers of the first grooves 142 and the second grooves 143 coincide, and the wafer is uniformly and effectively sucked.
Further, as shown in fig. 1, in the present embodiment, the detection module 2 is an optical detection sensor for detecting the position of the wafer, and the optical detection sensor may be any device with correlation photoelectric technology, such as a photoelectric switch, an edge finder, etc.
Further, as shown in fig. 1, in the present embodiment, the displacement module 3 includes: x-axis displacement module 31 and Y-axis displacement module 32, X-axis displacement module 31 drive positioning module 1 and remove in X-axis direction, and Y-axis displacement module 32 drive positioning module 1 and remove in Y-axis direction, and wherein, the displacement module contains: the sliding rail and the air cylinder; the cylinder drives the positioning module 1 to move on the sliding rail.
Working principle: the outside snatchs mechanism and places the wafer on the adsorption platform, the vacuum is conducted to the adsorption platform through air pipe joint 15, adsorb the wafer, Y axle displacement module 32 drives positioning module 1 and is close to detection module 2, until detection module 2 can sense the wafer, and record Y axle movement data, then servo motor drive pivot drive whole wafer rotate 90 degrees in proper order, and the displacement when the photoelectric position is sensed is recorded, afterwards calculate the offset of whole wafer, X/Y axle removes compensation position, ensure that the wafer centre of a circle is in the assigned position, guarantee for subsequent work.
In the above, the wafer center positioning device according to the embodiment of the utility model is described with reference to fig. 1 to 3, which can accurately position the center of a wafer, and can be used for placing and taking the wafer without contacting the edge of the wafer by matching with an external grabbing mechanism, thereby greatly improving the working efficiency and ensuring other procedures.
It should be noted that in this specification the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.
Claims (9)
1. A wafer centering device for centering a wafer, comprising:
the positioning module is used for placing and positioning the wafer;
the detection module is used for detecting the position of the wafer on the positioning module;
the displacement module is connected with the positioning module and is electrically connected with the detection module, and the displacement module can drive the positioning module to move.
2. The apparatus for positioning a wafer center of claim 1, wherein the positioning module comprises: the wafer comprises a wafer platform, a rotating shaft and a driving device;
the wafer platform is used for placing the wafer, the rotating shaft is respectively connected with the wafer platform and the driving device, and the driving device drives the rotating shaft and drives the wafer platform to rotate.
3. The positioning wafer center apparatus of claim 2, wherein the positioning module further comprises: an adsorption table and an air pipe joint;
the adsorption table is arranged on the wafer platform, the area of the adsorption table is smaller than that of the wafer platform, the plane of the adsorption table is higher than that of the wafer platform, and the air pipe connector is connected with the adsorption table.
4. The apparatus for positioning a wafer center as recited in claim 3, wherein the chuck table comprises: a plurality of suction holes, a plurality of first grooves and a plurality of second grooves;
the first grooves are distributed on the adsorption table, the second grooves are connected with the first grooves, the suction holes are respectively formed in the connection positions of the first grooves and the second grooves, and the first grooves, the second grooves and the suction holes are mutually communicated.
5. The apparatus for positioning a center of a wafer according to claim 4, wherein the first grooves are circular, the plurality of first grooves form a concentric circular structure, the second grooves are cross-shaped, and centers of the first grooves and the cross-shaped second grooves coincide.
6. The apparatus for positioning a wafer center as recited in claim 2, wherein the drive means is a servo motor.
7. The apparatus for positioning a center of a wafer according to claim 1, wherein the inspection module is an optical inspection sensor for inspecting a position of the wafer.
8. The apparatus for positioning a wafer center as recited in claim 1, wherein the displacement module comprises: an X-axis displacement module and a Y-axis displacement module;
the X-axis displacement module drives the positioning module to move in the X-axis direction;
and the Y-axis displacement module drives the positioning module to move in the Y-axis direction.
9. The apparatus for positioning a wafer center as recited in claim 8, wherein the displacement module comprises: the sliding rail and the air cylinder;
the cylinder drives the positioning module to move on the sliding rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321764773.8U CN220253215U (en) | 2023-07-06 | 2023-07-06 | Wafer center positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321764773.8U CN220253215U (en) | 2023-07-06 | 2023-07-06 | Wafer center positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220253215U true CN220253215U (en) | 2023-12-26 |
Family
ID=89267827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321764773.8U Active CN220253215U (en) | 2023-07-06 | 2023-07-06 | Wafer center positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220253215U (en) |
-
2023
- 2023-07-06 CN CN202321764773.8U patent/CN220253215U/en active Active
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