CN113725109B - Pin Hole wafer inspection machine - Google Patents
Pin Hole wafer inspection machine Download PDFInfo
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- CN113725109B CN113725109B CN202110986872.XA CN202110986872A CN113725109B CN 113725109 B CN113725109 B CN 113725109B CN 202110986872 A CN202110986872 A CN 202110986872A CN 113725109 B CN113725109 B CN 113725109B
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- 238000007689 inspection Methods 0.000 title claims abstract description 79
- 235000012431 wafers Nutrition 0.000 claims abstract description 145
- 238000012546 transfer Methods 0.000 claims description 12
- 230000003068 static effect Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 238000012552 review Methods 0.000 claims description 4
- 230000001174 ascending effect Effects 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims description 2
- 238000010926 purge Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000000746 purification Methods 0.000 abstract description 3
- 238000005192 partition Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a Pin Hole wafer inspection machine, which comprises: a frame having a calibration area and an inspection area which are communicated with each other, a gas purifying area disposed above the calibration area and the inspection area, and a mounting area disposed below the calibration area and the inspection area; a calibration device; an inspection device; a wafer loading device; wafer pick-and-place device. According to the invention, through the mutually matched calibration device, the checking device, the wafer loading device and the wafer taking and placing device, automatic material taking, automatic edge searching calibration, automatic checking and automatic material receiving of the wafers are realized, manual operation is not needed, the labor intensity is low, the structure is simple and compact, the use is convenient, the checking period is short, and the efficiency is high; meanwhile, through the calibration area, the inspection area and the gas purification area which are mutually communicated, the wafer is ensured to be in a closed environment during inspection, the external pollution is reduced, and the quality of the wafer is improved.
Description
Technical Field
The invention belongs to the field of wafer inspection equipment, and particularly relates to a Pin Hole wafer inspection machine.
Background
As is well known, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and is formed by grinding, polishing, slicing a silicon wafer rod, and in a semiconductor manufacturing process, in order to ensure that the wafer is defect-free and meets the design requirements of a product, after the wafer is produced and molded, the wafer product needs to be inspected.
However, in the actual use process, the existing inspection apparatus for wafer inspection is prone to the following technical problems:
1) The manual operation equipment calibrates and inspects the wafer, so that the labor intensity is high, the inspection efficiency is low, and errors are easy to occur;
2) When the wafer is inspected or transferred, the wafer is exposed to the air, so that the surface of the wafer is easily polluted by dust and damaged by charges, and the performance of the wafer is affected;
3) The structure is complex, the operation is complex and inconvenient, the inspection is long in time consumption, and the efficiency is low.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing an improved Pin Hole wafer inspection machine.
In order to solve the technical problems, the invention adopts the following technical scheme:
a Pin Hole wafer inspection machine, comprising:
a frame having a calibration area and an inspection area which are communicated with each other, a gas purifying area disposed above the calibration area and the inspection area, and a mounting area disposed below the calibration area and the inspection area;
the device comprises a calibration device, a calibration device and a control device, wherein the calibration device is arranged in a calibration area and comprises an edge type calibrator, the edge type calibrator comprises a calibration seat, a positioning unit and a calibration unit, the calibration seat, the positioning unit and the calibration unit are arranged in the calibration area, the positioning unit comprises a positioning component capable of ascending and descending and a clamping component capable of being simultaneously folded or unfolded along the radial direction of a wafer, the positioning component is provided with a wafer positioning area with a gradually-reduced caliber from top to bottom, and the clamping component comprises a plurality of clamping arms distributed around the center of the wafer positioning area and a driving piece used for driving the plurality of clamping arms to synchronously move;
the inspection device is arranged in the inspection area and comprises a carrying platform for placing the wafer, an inspection camera, a transfer unit for driving the carrying platform to move relative to the inspection camera and a static eliminating unit arranged above the carrying platform;
the wafer loading device comprises a feeding unit and a receiving unit which are respectively positioned at one side of the frame, wherein a feeding port of the feeding unit is communicated with the calibration area, and a receiving port of the receiving unit is communicated with the calibration area;
the wafer taking and placing device is arranged in the calibration area and can transfer the wafer among the feed port, the receiving port, the edge calibrator and the carrying platform.
Preferably, the cross section of the calibration area is square, the wafer loading device and the wafer receiving device are correspondingly arranged on two adjacent sides of the square, and the wafer taking and placing device is correspondingly arranged between the wafer loading device and the edge type calibrator. The device has compact structure and high operation efficiency.
Specifically, each clamping arm is provided with a clamping groove contacted with the edge point or the line of the wafer; the calibration unit includes a calibration assembly capable of calibrating an edge of a wafer, and a driving assembly.
Further, the positioning assembly comprises a positioning platform and a plurality of positioning supporting seats which are arranged on the positioning platform and form a wafer positioning area, wherein the positioning supporting seats are uniformly distributed around the center of the positioning platform, a first supporting surface and a second supporting surface are formed on each positioning supporting seat, the first supporting surface is outwards inclined from the upper end surface of the positioning supporting seat from top to bottom, and the second supporting surface is outwards extended from the bottom of the first supporting surface. By the arrangement, when the wafer is placed on the positioning support seat, the wafer is conveniently positioned at the center of the wafer positioning area.
Preferably, the wafer taking and placing device comprises two groups of taking and placing arms, a taking and placing chuck and a power taking and placing device for driving the taking and placing arms to move, wherein one end part of each group of taking and placing arms is correspondingly provided with one taking and placing chuck, and the power taking and placing device respectively drives the two groups of taking and placing arms to work or reset; each picking and placing chuck comprises a fixed clamping arm and a movable clamping arm, the movable clamping arm moves relative to the fixed clamping arm, and a wafer placed on the fixed clamping arm moves along with the movable clamping arm and is clamped between the movable clamping arm and the fixed clamping arm from the side edge.
Specifically, the picking and placing chucks respectively positioned on one end parts of the two groups of picking and placing arms are arranged up and down at intervals, and after one group of picking and placing arms drive the picking and placing chucks at one end of the picking and placing chucks to work and reset, the other group of picking and placing arms drive the picking and placing chucks at one end of the picking and placing chucks to work and reset. The device is arranged in such a way, realizes sequential picking and placing, works orderly and has high efficiency.
Preferably, the carrier comprises a holder disposed within the inspection region and having a wafer clamping region, a plurality of positioning blocks disposed on the holder and distributed around a center of the wafer clamping region, and a plurality of pressing blocks disposed at one side of the holder for clamping the wafer.
Specifically, the transfer unit comprises a transverse moving part for driving the carrier to transversely move, a longitudinal moving part for driving the carrier to longitudinally move and a lifting part for driving the carrier to vertically move. The arrangement can flexibly adjust the position of the wafer relative to the inspection camera, so that the inspection camera can comprehensively inspect the wafer; meanwhile, through the arrangement of the lifting component, the wafer can approach the inspection camera, so that the light beam of the inspection camera is fully covered on the wafer, and the accuracy of an inspection result is improved.
Preferably, the feeding unit and the receiving unit have the same structure, wherein the feeding unit comprises a mounting platform positioned below the feeding port, a bearing platform arranged on the mounting platform, a movable door arranged at the feeding port and moving up and down, and an unlocking piece arranged on the movable door and used for opening a box cover of the wafer conveying box.
Preferably, the inspection device further comprises a review camera disposed in the inspection area.
Due to the implementation of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the invention, through the mutually matched calibration device, the checking device, the wafer loading device and the wafer taking and placing device, automatic material taking, automatic edge searching calibration, automatic checking and automatic material receiving of the wafers are realized, manual operation is not needed, the labor intensity is low, the structure is simple and compact, the use is convenient, the checking period is short, and the efficiency is high; meanwhile, through the calibration area, the inspection area and the gas purification area which are mutually communicated, the wafer is ensured to be in a closed environment during inspection, the external pollution is reduced, and the quality of the wafer is improved.
Drawings
FIG. 1 is a schematic view of a wafer inspection machine according to the present invention;
FIG. 2 is a schematic view of the internal structure of the wafer inspection machine according to the present invention;
FIG. 3 is a schematic view of the internal structure of the wafer inspection machine according to the present invention (second view);
FIG. 4 is an enlarged schematic view of the calibration device of FIG. 2;
FIG. 5 is a left side schematic view of FIG. 4;
FIG. 6 is a schematic view of the structure of the inspection apparatus according to the present invention;
wherein: 1. a frame; 10. a frame body; t0, calibration zone; t1, an inspection area; t2, a purifying area; t3, an installation area; 11. a partition plate; 11a, through holes; b. a baffle; k0, a material guiding port; y, purifying an air filter;
2. a calibration device; 20. a calibration seat; 21. a positioning unit; 210. a positioning assembly; 2100. positioning a platform; 2101. positioning a supporting seat; a1, a first supporting surface; a2, a second supporting surface; q1, a wafer positioning area; b. a connection part; 211. a clamping assembly; 2110. a tray; 2111. a clamp arm; g0, lower arm; g1, an extension arm; g2, upper arm lever; c. a clamping groove; q2, active area; 22. a calibration unit; 220. a first calibration head; 221. a second calibration head; q3, a beam calibration area; d. a bracket; d0, a first supporting rod; d1, a second supporting rod; d2, a third supporting rod; q4, an avoidance region;
3. an inspection device; 30. a carrier; 300. a clamping seat; 301. a positioning block; 302. briquetting; 31. checking a camera; 32. rechecking the camera; 33. a transfer unit; 330. a traversing member; 331. a longitudinally moving member; 332. a lifting member; 34. a static electricity removing unit; 35. an ultrasonic sensor;
4. a wafer loading device; 40. a feeding unit; 400. a mounting platform; 401. a load-bearing platform; 402. a movable door; 403. an unlocking member; 41. a material receiving unit; k1, a feed port; k2, a receiving port;
5. a wafer taking and placing device; 50. a pick-and-place arm; 500. a drive arm; 501. a driven arm; 51. taking and placing a chuck; 510. fixing the clamping arm; 511. a movable clamping arm; 512. a driving arm; 52. a power pick-and-place device;
6. and a terminal control device.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature. It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As shown in fig. 1 and 2, the Pin Hole of the present embodiment refers to a wafer Hole inspection machine, and includes a frame 1, a calibration device 2, an inspection device 3, a wafer loading device 4, and a wafer pick-and-place device 5.
As shown in fig. 3, the rack 1 includes a rack body 10 enclosing a rectangular parallelepiped shape, and partition plates 11 horizontally disposed on the rack body 10, wherein the partition plates 11 have four partition plates 11, and the four partition plates 11 are uniformly spaced apart in a vertical direction, and divide the rectangular parallelepiped enclosed by the rack body 10 into a calibration area t0 and an inspection area t1 located in the middle, a gas purifying area t2 located above the calibration area t0 and the inspection area t1, and an installation area t3 located below the calibration area t0 and the inspection area t 1.
Each partition 11 is further formed with a plurality of through holes 11a penetrating the alignment area t0, the purge area t1, and the mounting area t 2.
The calibration area t0 and the inspection area t1 are separated by a baffle b with a material guiding opening k 0.
In this example, the cross section of the calibration area t0 is square.
A purified air filter y is arranged in the gas purifying zone t 2. The arrangement can ensure that the calibration area is in a dust-free environment, avoid the surface pollution of the wafer and improve the yield of the wafer.
Referring to fig. 4, the calibration device 2 includes an edge calibrator disposed in a calibration area t0, and the edge calibrator includes a calibration stand 20, a positioning unit 21, and a calibration unit 22.
In this example, the calibration stand 20 is fixedly disposed on the partition 11 at the lower end of the calibration area t0 and is close to the right side of the calibration area t0, and the positioning unit 21 and the calibration unit 22 are disposed on the calibration stand 20 and perform calibration on the calibration stand 20.
The positioning unit 21 includes a positioning assembly 210 and a clamping assembly 211.
The positioning assembly 210 includes a positioning platform 2100, and a positioning support 2101 vertically disposed on the positioning platform 2100.
The positioning platform 2100 is vertically liftable.
In this example, there are four positioning supports 2101, and the four positioning supports 2101 are uniformly distributed around the center of the positioning platform 2100 and form a wafer positioning area q1 with matched wafer edges, wherein the wafer positioning area q1 is gradually smaller from top to bottom.
Each positioning support base 2101 is formed with a first support surface a1 and a second support surface a2, wherein the first support surface a1 is inclined outwards from top to bottom from the upper end surface of the positioning support base 2101, and the second support surface a2 extends outwards from the bottom of the first support surface a1 and is inclined outwards from top to bottom. The wafer is placed on the positioning support seat, so that the wafer is conveniently positioned at the center of the wafer positioning area, and meanwhile, when the wafer is abutted against the second support surface of the positioning support seat from the edge, the contact area between the wafer and the second support surface is reduced.
Meanwhile, a connecting portion b is formed to extend outwards from one side of each positioning support base 2101, each positioning support base 2101 is fixedly connected to the positioning platform 2100 through the connecting portion b, wherein the height between the top end of the connecting portion b and the positioning platform 2100 is h1, and the height between the bottom of the second support surface a2 and the positioning platform 2100 is h2, and h1 is smaller than h2. This arrangement prevents the connection from interfering with the wafer located in the wafer positioning area.
The clamp assembly 211 includes a tray 2110 and clamp arms 2111.
The tray 2110 is cylindrical and is connected to the upper end surface of the alignment pedestal 20 from the bottom end, and the center line of the tray 2110 coincides with the center line of the wafer positioning area q 1.
In this example, there are six clamp arms 2111, and six clamp arms 2111 are attached to the sidewall of the frame plate 2110 and distributed around the center of the wafer positioning area q1, and the frame plate 2110 drives the six clamp arms 2111 to retract or expand along the radial direction of the wafer at the same time.
Each clamp arm 2111 includes a lower arm bar g0, an extension arm bar g1, and an upper arm bar g2.
The lower arm g0 is connected to the side wall of the tray 2110 at an inner end and emerges from the outer end around the perimeter of the positioning platform 2100.
The extension arm g1 extends upward from the outer end of the lower arm g 0.
The upper arm g2 extends inward from the upper end of the extension arm g1, and a clamping groove c in line contact with the edge of the wafer is formed on the end surface of the extension arm g1 on the principle of the upper arm g2.
Referring to fig. 5, a lower arm g0, an extension arm g1, and an upper arm g2 are integrally formed, and the lower arm g0, the extension arm g1, and the upper arm g2 form an active area q2 of the avoidance positioning platform 2100. The setting is convenient for process and implementation like this, and avoids the arm lock to interfere the positioning unit, guarantees the precision of calibration.
Specifically, the calibration unit 22 includes a first calibration head 220, and a second calibration head 221 located directly above the first calibration head 220, where the first calibration head 220 is a beam emitter, the second calibration head 221 is a beam receiver, a beam calibration area q3 is formed between the first calibration head 220 and the second calibration head 221, and a wafer clamped on the clamping arm 2111 is located in the beam calibration area q3 from the edge.
In this example, there are two first calibration heads 220, wherein each first calibration head 220 is fixedly disposed on the positioning stage 2100, and the two first calibration heads 220 are uniformly spaced around the center of the wafer positioning area q 1. Thus, the calibration is more accurate.
There are also two second calibration heads 221, and each second calibration head 221 is disposed directly above the corresponding first calibration head 220 by a bracket d, wherein the bracket d comprises a first support rod d0 extending outwards from the calibration seat 20, a second support rod d1 extending upwards from the outer end of the first support rod d0, and a third support rod d2 extending inwards from the upper end of the second support rod d1, an avoidance area q4 is formed among the first support rod d0, the second support rod d1 and the third support rod d2, and the second calibration head 221 is disposed at the end of the third support rod d2 far from the second support rod d 1.
Meanwhile, the calibration unit 22 further includes a power unit disposed in the calibration seat 20, and the power unit is used to drive the clamping assembly 211 to rotate around the center of the wafer positioning zone q1 during calibration.
As shown in fig. 6, the inspection apparatus 3 is located in the inspection area t1, and includes a stage 30 disposed in the inspection area t1 for placing a wafer, an inspection camera 31, a review camera 32, a transfer unit 33 for driving the stage 30 to move relative to the inspection camera 31, an electrostatic removing unit 34, and an ultrasonic sensor 35.
The carrier 30 is located below the material guiding opening k0, and comprises a clamping seat 300 with a wafer clamping area q5, four positioning blocks 301 arranged on the clamping seat and distributed around the center of the wafer clamping area q5, and two pressing blocks 302 arranged on the side edge of the clamping seat 300 and used for clamping a wafer.
The inspection camera 31 is disposed above the stage 30.
The review camera 32 is provided on the side of the inspection camera 31.
The transfer unit 33 includes a traverse member 330 for driving the cartridge 300 to move laterally, a longitudinal member 331 for driving the stage 30 to move longitudinally, and a lifting member 332 for driving the cartridge 300 to move up and down. The arrangement can flexibly adjust the position of the wafer relative to the inspection camera, so that the inspection camera can comprehensively inspect the wafer; meanwhile, through the arrangement of the lifting component, the wafer can approach the inspection camera, so that the light beam of the inspection camera is fully covered on the wafer, and the accuracy of an inspection result is improved.
Specifically, the traversing element 330 is a traversing platform driven by a transmission chain to move transversely, and the clamping seat 300 is mounted on the traversing platform; the longitudinal moving part 331 is a longitudinal moving platform driven by a transmission chain to longitudinally move, the transverse moving platform is arranged on the longitudinal moving platform, and when the longitudinal moving platform drives the transverse moving platform to longitudinally move, the clamping seat 300 longitudinally moves along with the longitudinal moving platform; the lifting member 332 is a lifting cylinder connected to the holder 300, and drives the holder 300 to move up and down.
Meanwhile, when the lifting member 332 drives the holder 300 to move upward, the pressing block 302 can be clamped on the upper surface of the wafer.
Specifically, the static electricity removing unit 34 is a plasma air bar fixedly disposed above the holder 300. In such a setting, during inspection, the plasma wind bar eliminates static electricity on the surface of the wafer, thereby avoiding influencing the inspection camera to inspect the wafer and improving the accuracy of the inspection result.
Specifically, the ultrasonic sensor 35 is fixedly disposed above the holder 300.
Specifically, the wafer loading apparatus 4 includes a supply unit 40 and a receiving unit 41, wherein the supply unit 40 communicates with the supply port k1, and the receiving unit 41 communicates with the receiving port k 2.
The feeding unit 40 and the receiving unit 41 have the same structure, wherein the feeding unit 40 comprises a mounting platform 400 positioned below a feeding port k1, a bearing platform 401 arranged on the mounting platform, a movable door 402 arranged at the feeding port k1 and moving up and down, and an unlocking member 403 arranged on the movable door 402 and used for opening a box cover of the wafer transfer box.
The wafer pick-and-place device 5 is disposed between the wafer loading device 4 and the alignment device 2. The device has compact structure, reduces the transfer travel of the wafer between the feed inlet, the receiving inlet and the edge type calibrator by the wafer taking and placing device, and improves the working efficiency of the equipment.
The wafer pick-and-place apparatus 5 includes a pick-and-place arm 50, a pick-and-place chuck 51, and a power pick-and-place 52.
The pick-and-place arms 50 have two groups, and the two groups of pick-and-place arms 50 are arranged flush in the horizontal direction. Is convenient to install and implement.
Each set of picking and placing arms 50 comprises a driving arm 500 and a driven arm 501, wherein the driving arm 500 is rotatably arranged around one end, and the driven arm 501 is rotatably connected to the other end of the driving arm 500.
Specifically, two pick-and-place chucks 51 are respectively disposed on the two sets of pick-and-place arms 50, and the two pick-and-place chucks 51 are disposed at a vertical interval.
It should be noted that, the two sets of pick-and-place arms 50 move independently, one set of pick-and-place arms 50 drives the pick-and-place chuck 51 at one end thereof to take down and reset the wafer calibrated on the calibration device 2, and the other set of pick-and-place arms 50 drives the pick-and-place chuck 51 at one end thereof to place and reset the wafer to be calibrated in the calibration device 1. The device is orderly and efficiently and continuously fetched and placed in sequence.
Each pick-and-place chuck 51 includes a fixed clamp arm 510, a movable clamp arm 511, and a drive arm 512.
Specifically, the fixing clip arm 510 is in a fork shape horizontally arranged, and one end is closed, and the other end forms an opening.
Specifically, the movable clamp arm 511 moves relative to the fixed clamp arm 510, and the wafer placed on the fixed clamp arm 510 is clamped between the movable clamp arm 511 and the fixed clamp arm 510 from the side along with the movement of the movable clamp arm 511.
Specifically, the driving arm 512 drives the corresponding movable clamping arm 511 to move relative to the fixed clamping arm 510.
Specifically, the power taking and placing device 52 is columnar, is fixedly connected to the partition 11 at the lower end of the installation area t2 from the bottom end, passes through the partition 11 at the lower end of the calibration area t0 from the top end, is connected to the driving arm 500 at one end far away from the driven arm 501, and drives the driving arm 500 to rotate, and meanwhile, the power taking and placing device 3 can be lifted in the vertical direction and can rotate around the central line of the vertical direction. Thus, the pick-and-place arm can be driven to transfer the wafer among the feed port, the receiving port and the edge aligner.
In addition, the present embodiment further includes a terminal control device 6 disposed at one side of the wafer loading device 4, which includes a display, a keyboard, and a mouse, and is a conventional device, and will not be described herein. The setting is convenient for the staff to set and monitor the running parameters of the equipment.
Therefore, the present embodiment has the following advantages:
1. through the calibrating device, the checking device, the wafer loading device and the wafer taking and placing device which are matched with each other, the automatic taking, the automatic edge searching calibration, the automatic checking and the automatic material receiving of the wafer are realized, the manual operation is not needed, the labor intensity is low, the structure is simple and compact, the use is convenient, the checking period is short, and the efficiency is high;
2. through the calibration area, the inspection area and the gas purification area which are communicated with each other, the wafer is ensured to be in a closed environment during inspection, the external pollution is reduced, and the quality of the wafer is improved;
3. the plurality of clamping arms distributed around the center of the wafer positioning area ensure that the placement center and the rotation center of the wafer are overlapped during calibration, and the clamping arms are clamped at the edge of the wafer in a line contact mode, so that the contact area of the wafer is greatly reduced, the contact abrasion of the surface of the wafer is avoided, and the calibration accuracy is high;
4. the two groups of picking and placing arms respectively connected with the picking and placing chucks realize sequential and continuous picking and placing of wafers, so that the movement amplitude of the chucks is small, the working cycle period is short, and the production efficiency is improved.
The present invention has been described in detail with the purpose of enabling those skilled in the art to understand the contents of the present invention and to implement the same, but not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (7)
1. A Pin Hole wafer inspection machine, comprising: a frame having a calibration zone and an inspection zone disposed in communication with each other, a gas purging zone disposed above the calibration zone and the inspection zone, and a mounting zone below the calibration zone and the inspection zone; the calibrating device is arranged in the calibrating area and comprises an edge calibrator, the edge calibrator comprises a calibrating seat, a positioning unit and a calibrating unit, the calibrating seat, the positioning unit and the calibrating unit are arranged in the calibrating area, the positioning unit comprises a positioning component capable of ascending and descending and a clamping component capable of being simultaneously folded or unfolded along the radial direction of a wafer, the positioning component is provided with a wafer positioning area with a gradually reduced caliber from top to bottom, the clamping component comprises a plurality of clamping arms distributed around the center of the wafer positioning area and a driving piece used for driving the clamping arms to synchronously move, and each clamping arm is provided with a clamping groove contacted with the edge point or the line of the wafer; the calibration unit comprises a calibration assembly and a driving assembly, wherein the calibration assembly can calibrate the edge of the wafer; the positioning assembly comprises a positioning platform and a plurality of positioning supporting seats which are arranged on the positioning platform and form the wafer positioning area, wherein the positioning supporting seats are uniformly distributed around the center of the positioning platform, a first supporting surface and a second supporting surface are formed on each positioning supporting seat, the first supporting surface is obliquely arranged outwards from top to bottom of the positioning supporting seat, and the second supporting surface extends outwards from the bottom of the first supporting surface; the inspection device is arranged in the inspection area and comprises a carrying platform for placing the wafer, an inspection camera, a transfer unit for driving the carrying platform to move relative to the inspection camera and a static eliminating unit arranged above the carrying platform; the wafer loading device comprises a feeding unit and a receiving unit which are respectively positioned at one side of the frame, wherein a feeding port of the feeding unit is communicated with the calibration area, and a receiving port of the receiving unit is communicated with the calibration area; the wafer taking and placing device is arranged in the calibration area and can transfer wafers among the feed port, the receiving port, the edge calibrator and the carrying platform, wherein the wafer taking and placing device comprises two groups of taking and placing arms, a taking and placing chuck and a power taking and placing device for driving the taking and placing arms to move, one end part of each group of taking and placing arms is correspondingly provided with one taking and placing chuck, and the power taking and placing device respectively drives the two groups of taking and placing arms to work or reset; each picking and placing chuck comprises a fixed clamping arm and a movable clamping arm, the movable clamping arm moves relative to the fixed clamping arm, and a wafer placed on the fixed clamping arm moves along with the movable clamping arm and is clamped between the movable clamping arm and the fixed clamping arm from the side edge.
2. The Pin Hole wafer inspection machine of claim 1, wherein: the cross section of the calibration area is square, the wafer loading device and the wafer receiving device are correspondingly arranged on two adjacent sides of the square, and the wafer taking and placing device is correspondingly arranged between the wafer loading device and the edge type calibrator.
3. The Pin Hole wafer inspection machine of claim 1, wherein: the picking and placing chucks are arranged at the upper and lower parts of one end part of each picking and placing arm, and after one group of picking and placing arms drive the picking and placing chucks at one end of each picking and placing arm to work and reset, the other group of picking and placing arms drive the picking and placing chucks at one end of each picking and placing arm to work and reset.
4. The Pin Hole wafer inspection machine of claim 1, wherein: the carrier comprises a clamping seat which is arranged in the checking area and provided with a wafer clamping area, a plurality of positioning blocks which are arranged on the clamping seat and distributed around the center of the wafer clamping area, and a plurality of pressing blocks which are arranged on one side of the clamping seat and used for clamping the wafer.
5. The Pin Hole wafer inspection machine according to claim 4, wherein: the transfer unit comprises a transverse moving part for driving the carrier to transversely move, a longitudinal moving part for driving the carrier to longitudinally move and a lifting part for driving the carrier to vertically move.
6. The Pin Hole wafer inspection machine of claim 1, wherein: the feeding unit and the receiving unit have the same structure, wherein the feeding unit comprises a mounting platform positioned below the feeding port, a bearing platform arranged on the mounting platform, a movable door arranged at the feeding port and moving up and down, and an unlocking piece arranged on the movable door and used for opening a box cover of the wafer conveying box.
7. The Pin Hole wafer inspection machine of claim 1, wherein: the inspection device further comprises a review camera arranged in the inspection area.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5022793B2 (en) * | 2007-07-02 | 2012-09-12 | 日東電工株式会社 | Method for detecting defect position of semiconductor wafer |
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| US4618938A (en) * | 1984-02-22 | 1986-10-21 | Kla Instruments Corporation | Method and apparatus for automatic wafer inspection |
| JP2009141027A (en) * | 2007-12-04 | 2009-06-25 | Hirata Corp | Aligner and edge clamp detecting method using the same |
| CN104681475A (en) * | 2014-12-31 | 2015-06-03 | 上海新阳半导体材料股份有限公司 | Wafer location calibrating device |
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