CN215973905U - Adsorption device and chip detection equipment - Google Patents

Abstract

The utility model relates to an adsorption device and chip detection equipment, which comprise a fixed body, an adsorption module and an actuating mechanism, wherein the adsorption module comprises a first adsorption module and a second adsorption module; the adsorption module is fixed on two sides of the fixed body and comprises more than one adsorption component, each adsorption component comprises an adsorption part for adsorbing a chip and a vacuum gas path interface communicated with the adsorption part, and the vacuum gas path interface is used for connecting a vacuum gas path; the actuating mechanism is connected with the fixed body and used for driving the fixed body to lift along a first direction and driving the fixed body to rotate in a plane perpendicular to the first direction, so that the two adsorption modules move between the material loading station and the detection station alternately. Above-mentioned adsorption equipment drives two rotatory transposition of absorption module through setting up actuating mechanism, can realize synchronous material loading and unloading, has improved handling efficiency.

Description

Adsorption device and chip detection equipment

Technical Field

The utility model relates to the technical field of chip detection, in particular to an adsorption device and chip detection equipment.

Background

After the chip is manufactured, the performance of the chip is usually required to be detected, in the conventional technology, an adsorption device is generally adopted to pick up the chip and drive the chip to move to a detection station, and then the chip is placed on the detection station, so that the loading action is completed. After the chip is detected at the detection station, the adsorption device picks up the detected chip from the detection station and puts the chip back, and the blanking action is finished. And after the blanking action is finished, the adsorption device picks up another chip and then carries out the feeding and the blanking again.

However, the efficiency of loading and unloading is lower for the present adsorption device, and then the efficiency of chip detection is directly influenced.

SUMMERY OF THE UTILITY MODEL

Based on this, it is necessary to provide an adsorption device and chip detection equipment to carry out the problem that the efficiency of material loading and unloading is lower to the adsorption device, has directly influenced chip detection efficiency.

An adsorption device is used for carrying chips between a material loading station and a detection station and comprises a fixed body, an adsorption module and an actuating mechanism; the adsorption module is fixed on two sides of the fixed body and comprises more than one adsorption component, each adsorption component comprises an adsorption part for adsorbing the chip and a vacuum gas path interface communicated with the adsorption part, and the vacuum gas path interface is used for connecting a vacuum gas path; the actuating mechanism is connected with the fixed body and used for driving the fixed body to lift along a first direction and driving the fixed body to rotate in a plane perpendicular to the first direction, so that the two adsorption modules move between the material loading station and the detection station alternately.

Above-mentioned adsorption equipment fixes the both sides at fixed body respectively through adsorbing two modules to it is rotatory to set up two absorption modules of actuating mechanism drive fixed body drive, and rotatory in-process two adsorb the module and carry out material loading action and unloading action in step at year material station and detection station between alternate movement, in order to improve handling efficiency. In the course of the work, the absorption module of one side picks up the chip that awaits measuring by the material loading station, the absorption module of opposite side picks up the chip that has accomplished the detection by the detection station simultaneously, actuating mechanism drive fixed body drives two and adsorbs the module rotation, two adsorb module position interchange, it is rotatory to the detection station and place the chip at the detection station to adsorb the absorption module that has the chip that awaits measuring, the material loading action has been accomplished, the absorption module of opposite side is rotatory to the material loading station simultaneously, put back the material loading station with the chip that has accomplished the detection, the unloading action has been accomplished. Above-mentioned adsorption equipment drives two rotatory transposition of absorption module through setting up actuating mechanism, can realize synchronous material loading and unloading, has improved handling efficiency.

In one embodiment, the adsorption module comprises a bracket fixed on the fixing body, and the adsorption components are arranged on the bracket according to a preset interval and arrangement mode.

In one embodiment, the bracket is removably fixed with a leveling mechanism, and the leveling mechanism is provided with a calibration surface which is abutted against each adsorption part so as to enable each adsorption part to be coplanar.

In one embodiment, an air path control valve set is fixed on the fixing body and used for controlling the on-off of the vacuum air path.

In one embodiment, the adsorption component comprises an air cylinder and an adsorption piece, the air cylinder is fixed on the fixing body, and the driving end of the air cylinder ascends and descends along the first direction and is connected with the adsorption piece.

In one embodiment, the fixed body is provided with a cylinder control valve group; the cylinder control valve group is used for controlling the cylinder to act.

In one embodiment, the cylinder control valve set and the gas circuit control valve set are respectively disposed on different sides of the fixing body and are both located between the two adsorption modules.

In one embodiment, the housing of the cylinder is provided with an accommodating through hole, the adsorbing member is at least partially accommodated in the accommodating through hole and can move relative to the housing, one end of the adsorbing member along the length direction thereof is provided with the vacuum air path interface, and the other end thereof is provided with the adsorbing portion.

In one embodiment, the adsorption piece comprises an adsorption rod, a limiting piece fixed on the adsorption rod, and a suction nozzle movably arranged at the end part of the adsorption rod; the locating part includes the elastic part that can outwards expand and sets up in the butt portion of elastic part, the butt portion can with the suction nozzle is spacing in the tip of inhaling the pole, the suction nozzle makes through promoting butt portion the elastic part expands, with can with the suction nozzle from the tip of inhaling the pole is removed.

The utility model also provides chip detection equipment which comprises the adsorption device in any technical scheme.

Drawings

FIG. 1 is a schematic structural diagram of an adsorption apparatus according to an embodiment of the present invention;

FIG. 2 is a partial enlarged view of the structure of portion I of FIG. 1;

FIG. 3 is a schematic view of the adsorption device of FIG. 1 from another perspective;

FIG. 4 is a partial enlarged view of the structure of section II in FIG. 3;

FIG. 5 is a top view of the structure of the adsorption device of FIG. 1;

FIG. 6 is a schematic structural diagram of an adsorption module according to an embodiment of the present invention;

FIG. 7 is a schematic structural view illustrating a leveling mechanism fixed to an adsorption module according to another embodiment of the present invention;

FIG. 8 is a schematic structural view of a bracket with a leveling mechanism secured thereto according to an embodiment of the present invention;

FIG. 9 is a schematic diagram of the structure of FIG. 8 from another perspective;

fig. 10 is a partially enlarged view of the structure of the portion III in fig. 2.

Reference numerals:

10. an adsorption device; 100. a fixed body; 110. a gas circuit control valve group; 120. a cylinder control valve group; 130. a terminal block protection sheet metal; 200. an adsorption module; 210. an adsorption component; 211. a cylinder; 212. an adsorbing member; 2121. a vacuum gas path interface; 2122. an adsorption part; 2123. a suction rod; 2124. a limiting member; 2125. an elastic portion; 2126. an abutting portion; 2127. a suction nozzle; 220. a support; 221. a top mounting plate; 222. a side mounting plate; 223. positioning a pin; 230. a leveling mechanism; 231. a calibration surface; 232. positioning holes; 300. an actuator; 310. a cable protection sheet metal; 20. and (3) a chip.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1, fig. 1 shows a schematic structural diagram of an adsorption apparatus 10 according to an embodiment of the present invention, and the adsorption apparatus 10 according to an embodiment of the present invention is used for transporting a chip 20 between a loading station and a detection station when detecting the manufactured semiconductor chip 20, and includes a fixing body 100, two adsorption modules 200, and an actuator 300. Referring to fig. 2, two adsorption modules 200 are respectively fixed to two sides of the fixing body 100, and each adsorption module 200 includes more than one adsorption assembly 210. The suction assembly 210 includes a suction portion 2122 for sucking the chip 20 and a vacuum air path interface 2121 communicated with the suction portion 2122, wherein the vacuum air path interface 2121 is used for connecting a vacuum air path (not shown). The actuator 300 is connected to the fixing body 100, and the actuator 300 is configured to drive the fixing body 100 to move up and down along a first direction (direction a shown in fig. 2) and drive the fixing body 100 to rotate in a plane perpendicular to the first direction, so that the two adsorption modules 200 move between the loading station and the inspection station alternately.

Above-mentioned adsorption equipment 10 fixes the both sides at fixed body 100 respectively through adsorbing two modules 200 to set up actuating mechanism 300 drive fixed body 100 and drive two and adsorb module 200 rotatoryly, two adsorb module 200 and carry out material loading action and unloading action in step between material loading station and the detection station alternating movement in rotatory in-process, in order to improve handling efficiency. In the course of the work, the absorption module 200 of one side picks up the chip 20 that awaits measuring by the material loading station, the absorption module 200 of the opposite side picks up the chip 20 that has accomplished the detection by detecting the station simultaneously, actuating mechanism 300 drive fixed body 100 drives two and adsorbs module 200 rotatory, two adsorb module 200 position interchanges, it is rotatory to detecting the station and placing chip 20 at detecting the station to adsorb the absorption module 200 that has the chip 20 that awaits measuring, the material loading action has been accomplished, meanwhile, the absorption module 200 of the opposite side rotates to the material loading station, the chip 20 that will accomplish the detection is put back the material loading station, the unloading action has been accomplished. The adsorption device 10 drives the two adsorption modules 200 to rotate and change positions by arranging the actuating mechanism 300, so that synchronous feeding and discharging can be realized, and the carrying efficiency is improved.

The form of the actuator 300 may be varied, see fig. 1 and 5 in combination, and in some embodiments, the actuator 300 comprises a four-axis robot. It should be noted that, besides the four-axis robot, the actuator 300 may be configured as another type of robot or other driving device as long as the requirements of the fixed body 100 for lifting and rotating can be satisfied. For example, the actuator 300 may be provided as a gantry arm provided with a lifting drive device and a rotation drive device. In addition, when the actuator 300 is configured as a four-axis robot, as shown in fig. 1, a cable protective plate 310 may be provided on an upper portion of the actuator 300 to protect the cable.

Referring to fig. 3 and 4, in some embodiments, an air path control valve assembly 110 is fixed on the fixing body 100, and the air path control valve assembly 110 is used for controlling the on/off of a vacuum air path. The adsorption device 10 fixes the gas circuit control valve set 110 on the fixing body 100, so that the distance between the gas circuit control valve set 110 and the adsorption module 200 is shortened, the gas circuit control valve set 110 is conveniently connected with the vacuum gas circuit interface 2121 of the adsorption assembly 210, and the assembly difficulty is reduced. In addition, the gas circuit control valve set 110 can rotate synchronously with the two adsorption modules 200, so that the possibility that a connecting pipeline between the gas circuit control valve set 110 and the vacuum gas circuit interface 2121 is wound due to the rotation of the adsorption modules 200 is reduced, and the difficulty in arranging the wire harness is further reduced. Specifically, air path control valve block 110 includes a vacuum valve block having a plurality of ports. When the vacuum chip adsorption device is used, the vacuum valve group is connected to external vacuum equipment, the plurality of interfaces are respectively communicated to the corresponding vacuum air channel interfaces 2121 of the adsorption assembly 210, and the on-off of the vacuum air channel is controlled through the vacuum valve group, so that the adsorption assembly 210 is controlled to adsorb or release the chip 20.

Referring to fig. 4 and 6, in some embodiments, the adsorption module 200 includes a bracket 220 fixed to the fixing body 100, and the plurality of adsorption elements 210 are disposed on the bracket 220 according to a predetermined interval and arrangement. The suction device 10 can pick up and transport a plurality of chips 20 at one time by arranging a plurality of suction components 210, thereby improving the working efficiency and shortening the transport time. In addition, the distance (distance d shown in fig. 6) between adjacent adsorption assemblies 210 is fixed, so that the position deviation in the processes of multiple feeding and discharging is reduced. It should be noted that the preset intervals and the arrangement mode may depend on the feeding requirement of the detection station, that is, the intervals and the arrangement mode of the adsorption components 210 are preset according to the feeding requirement of the detection station, and the adsorption components 210 are fixed to the bracket 220 according to the preset intervals and the arrangement mode. A plurality of adsorption component 210 among the above-mentioned adsorption equipment 10 are fixed through solitary support 220, are about to be fixed in fixed body 100 again after a plurality of adsorption component 210 are integrated as a whole, so when the material loading demand of detecting the station changes, can change a plurality of adsorption component 210 in the lump, and need not to change fixed body 100, and then practiced thrift the cost. As an example, with continued reference to fig. 6, the bracket 220 includes a top mounting plate 221 and two side mounting plates 222 respectively fixed to two sides of the top mounting plate, two suction assemblies 210 are respectively fixed to each side mounting plate 222, and four suction assemblies 210 are arranged in a rectangle.

Referring to fig. 7, in some embodiments, the bracket 220 removably secures a leveling mechanism 230, the leveling mechanism 230 having an alignment surface 231, the alignment surface 231 abutting each of the suction portions 2122 such that each of the suction portions 2122 is coplanar. The leveling mechanism 230 in the suction device 10 is removably fixed on the bracket 220, and is integrated and fixed with a plurality of suction components 210 to be debugged, so that the space can be saved. Before feeding and discharging, the leveling mechanism 230 is fixed to the bracket 220, and the adsorption parts 2122 of the adsorption assemblies 210 are debugged through the calibration surface 231, so that the position accuracy of the adsorption parts 2122 is improved, chips 20 on a material loading station and/or a detection station can be picked up later, and after debugging is completed, the leveling mechanism 230 is detached and then feeding and discharging are performed. Further, referring to fig. 8 and 9, in an embodiment, the bracket 220 is detachably connected with a positioning pin 223, and the leveling mechanism 230 is provided with a positioning hole 232 matching with the positioning pin 223. When the leveling mechanism 230 is installed, the positioning hole 232 is engaged with the positioning pin 223 to position the position of the calibration surface 231.

When it is necessary to pick up a plurality of chips 20 at a time, the height difference between different chips 20 may be caused by the difference in thickness between different chips 20 or the difference in height between different areas carrying different chips 20. In order to accommodate the height difference between different chips 20, referring to fig. 6, in some embodiments, the suction assembly 210 includes a cylinder 211 and a suction member 212, the cylinder 211 is fixed to the fixing body 100, and a driving end of the cylinder 211 is lifted along the first direction and connected to the suction member 212 to drive the suction member 212 to lift along the first direction. The suction unit 210 of the suction device 10 can be independently adjusted to be lifted and lowered by the cylinder 211, in addition to being lifted and lowered in the first direction by the actuator 300. In the picking process, the actuator 300 may first drive the plurality of suction assemblies 210 to synchronously descend along the first direction and approach the chip 20 until all the suction assemblies 210 are adjacent to the chip 20, and then drive the suction members 212 to descend through the air cylinders 211 to pick up the corresponding chips 20, so that the chips 20 with different heights can be compatible.

Referring to fig. 6, in some embodiments, a housing of the cylinder 211 is provided with a receiving through hole (not shown), the suction element 212 is at least partially received in the receiving through hole and can move relative to the housing, one end of the suction element 212 along a length direction thereof is provided with the vacuum air path interface 2121, and the other end thereof is provided with the suction portion 2122. In the adsorption device 10, the housing of the cylinder 211 is provided with the accommodating through hole, and a part of the adsorption piece 212 is accommodated in the accommodating through hole, so that the space utilization rate can be improved, and the adsorption piece 212 can play a certain limiting role when being lifted and displaced, so as to improve the movement stability of the adsorption piece 212. Preferably, in an embodiment, the cylinder 211 is a double-acting cylinder 211, the reciprocating motion can reach a predetermined position, the deflection of the suction part 2122 can be controlled within 0.1mm, and the repeated positioning accuracy can be controlled within 0.02 mm. The suction part 2122 may be a suction end/end surface of a suction nozzle, a suction cup, or other components.

Further, referring to fig. 2 and 6 in combination, in an embodiment, the fixing body 100 is provided with a cylinder control valve set 120; the cylinder control valve group 120 is used for controlling the action of the cylinder 211. When the air cylinder control valve group 120 works, the air cylinders 211 are connected, the air cylinders 211 are controlled respectively, and then the suction fittings 212 are adjusted to ascend and descend respectively. The cylinder control valve group 120 in the adsorption device 10 is arranged on the fixing body 100, so that the distance between the cylinder control valve group 120 and the cylinder 211 is shortened, the connection is facilitated, and the assembly difficulty is reduced.

Referring to fig. 2 and 4, in some embodiments, the cylinder control valve set 120 and the air path control valve set 110 are respectively disposed on different sides of the fixing body 100 and are located between two adsorption modules 200. Above-mentioned adsorption equipment 10 structure is compacter, has improved space utilization, more is favorable to the miniaturization of device to cylinder valve unit 120 and gas circuit valve unit 110 all are located between two absorption modules 200, and the cylinder valve unit 120 and gas circuit valve unit 110 of being convenient for are connected with the absorption module 200 of both sides respectively. The cylinder control valve group 120 may include a plurality of solenoid valves arranged in parallel. Further, in one embodiment, terminal block protection sheet metals 130 are respectively covered on the outer sides of the cylinder control valve group 120 and the air path control valve group 110 to protect the terminal blocks.

Specifically, referring to fig. 10, in an embodiment, the suction member 212 includes a suction rod 2123, a limiting member 2124 fixed to the suction rod 2123, and a suction nozzle 2127 movably disposed at an end of the suction rod 2123; the stopper 2124 includes an elastic portion 2125 capable of expanding outward and an abutting portion 2126 provided on the elastic portion 2125, the abutting portion 2126 can limit the suction nozzle 2127 at an end of the suction rod 2123, and the suction nozzle 2127 can push the abutting portion 2126 to expand the elastic portion 2125, so that the suction nozzle 2127 can be removed from the end of the suction rod 2123. When chips 20 of different sizes are to be sucked, the operator only needs to pull the suction nozzle 2127 outward, and then the suction nozzle 2127 pushes the abutting portion 2126 to expand the elastic portion 2125, so that the suction nozzle 2127 can be removed. The suction nozzle 2127 of the adsorption device 10 is a quick-release structure, so that the chips 20 with different sizes can be replaced by the suction nozzles 2127 with different sizes, and the detachment is convenient and fast, so as to improve the replacement efficiency. In addition, in some embodiments, the suction member 212 includes a suction rod 2123 and a suction nozzle 2127 movably disposed on the suction rod 2123, and a buffer mechanism (not shown) is disposed between the suction rod 2123 and the suction nozzle 2127 to prevent the chip 20 from being crushed and to more easily suck the chip 20.

The utility model also provides a chip detection device which comprises the adsorption device 10 in any one of the embodiments. Above-mentioned chip check out test set carries out the transport of chip 20 between year material station and detection station through setting up adsorption equipment 10, adsorption equipment 10 fixes two absorption modules 200 respectively in the both sides of fixed body 100, and it is rotatory to set up actuating mechanism 300 drive fixed body 100 and drive two absorption modules 200, two absorption modules 200 alternate migration between year material station and detection station in the rotatory process, carry out material loading action and unloading action in step, with the improvement handling efficiency, and then improved detection efficiency.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The utility model provides an adsorption equipment for the chip is at the transport between year material station and detection station, its characterized in that, adsorption equipment includes:

a fixed body;

the adsorption module is fixed on two sides of the fixed body and comprises more than one adsorption component, each adsorption component comprises an adsorption part for adsorbing the chip and a vacuum gas path interface communicated with the adsorption part, and the vacuum gas path interface is used for connecting a vacuum gas path;

and the actuating mechanism is connected with the fixed body and is used for driving the fixed body to lift along a first direction and driving the fixed body to rotate in a plane vertical to the first direction, so that the two adsorption modules move between the material loading station and the detection station alternately.

2. The suction device as claimed in claim 1, wherein the suction module includes a holder fixed to the fixing body, and the plurality of suction modules are disposed on the holder at predetermined intervals and in a predetermined arrangement.

3. The suction device as claimed in claim 2, wherein the holder removably holds a leveling mechanism having a calibration surface that abuts against each of the suction portions to make the suction portions coplanar.

4. The adsorption device according to claim 1, wherein a gas circuit control valve set is fixed on the fixing body and used for controlling the on-off of the vacuum gas circuit.

5. The adsorption device of claim 4, wherein the adsorption assembly comprises a cylinder and an adsorption member, the cylinder is fixed to the fixing body, and the driving end of the cylinder ascends and descends along the first direction and is connected with the adsorption member.

6. The adsorption device of claim 5, wherein the fixed body is provided with a cylinder control valve set; the cylinder control valve group is used for controlling the cylinder to act.

7. The adsorption device of claim 6, wherein the cylinder control valve set and the gas circuit control valve set are respectively disposed on different sides of the fixed body and are both located between the two adsorption modules.

8. The suction device according to claim 5, wherein the housing of the cylinder has a receiving hole, the suction member is at least partially received in the receiving hole and is movable relative to the housing, the suction member has the vacuum air passage port at one end along a length direction thereof, and the suction portion is at the other end.

9. The suction device according to claim 5, wherein the suction member comprises a suction rod, a limiting member fixed to the suction rod, and a suction nozzle movably disposed at an end of the suction rod; the locating part includes the elastic part that can outwards expand and sets up in the butt portion of elastic part, the butt portion can with the suction nozzle is spacing in the tip of inhaling the pole, the suction nozzle makes through promoting butt portion the elastic part expands, with can with the suction nozzle from the tip of inhaling the pole is removed.

10. A chip detection apparatus comprising the adsorption device according to any one of claims 1 to 9.

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