CN215680615U

CN215680615U - Automatic inspection device of PinHole wafer detection machine

Info

Publication number: CN215680615U
Application number: CN202122420401.0U
Authority: CN
Inventors: 颜博
Original assignee: Suzhou Xinshangsi Automation Equipment Co ltd
Current assignee: Suzhou Xinshangsi Automation Equipment Co ltd
Priority date: 2021-10-08
Filing date: 2021-10-08
Publication date: 2022-01-28
Anticipated expiration: 2031-10-08

Abstract

The utility model provides an automatic checking device of a PinHole wafer detector, which comprises: a stage; the positioning unit comprises a positioning component and a clamping component, wherein the positioning component is provided with a wafer positioning area matched with the wafer, and the clamping component comprises a plurality of clamping modules distributed around the center of the wafer positioning area and a power part for driving the clamping modules to relatively fold or unfold along the radial direction of the wafer; the inspection camera is arranged above the wafer positioning area; and the driving unit is connected with the positioning unit or the inspection camera and is used for driving one of the wafer positioning area and the inspection camera to move relative to the other. On one hand, the utility model realizes that the inspection range covers the whole wafer, avoids the omission problem caused by manual inspection, effectively improves the inspection accuracy, and has high inspection efficiency and low labor intensity; on the other hand, the stability of the wafer can be ensured, so that the inspection of the camera is convenient, the structure is simple and reliable, and the operation is convenient.

Description

Automatic inspection device of PinHole wafer detection machine

Technical Field

The utility model belongs to the technical field of wafer inspection, and particularly relates to an automatic inspection device of a PinHole wafer inspection machine.

Background

As is well known, a wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, and is a silicon wafer formed by grinding, polishing, and slicing a silicon ingot.

However, in the actual use process, the existing inspection equipment for wafer inspection is easy to have the following technical problems:

1) the manual operation equipment is used for inspecting the wafer, so that the labor intensity is high, the inspection efficiency is low, and errors are easy to occur;

2) the structure is complex, the operation is complex and inconvenient, the examination is long in time consumption, and the efficiency is low.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide an improved automatic inspection device of a PinHole wafer inspection machine.

In order to solve the technical problems, the utility model adopts the following technical scheme:

an automatic inspection device of a PinHole wafer inspection machine, comprising:

a stage;

the positioning unit comprises a positioning component and a clamping component which are respectively arranged on the carrying platform, wherein the positioning component is provided with a wafer positioning area matched with the wafer, and the clamping component comprises a plurality of clamping modules distributed around the center of the wafer positioning area and a power part for driving the clamping modules to relatively fold or unfold along the radial direction of the wafer;

the inspection camera is arranged above the wafer positioning area;

and the driving unit is connected with the positioning unit or the inspection camera and is used for driving one of the wafer positioning area and the inspection camera to move relative to the other.

Preferably, the positioning assembly includes a plurality of positioning supports fixedly disposed on the carrier, wherein a wafer positioning region is formed between the plurality of positioning supports. The device is simple in structure and convenient to install and implement.

Specifically, each positioning support seat is provided with a first support surface which is attached to the bottom of the wafer and a second support surface which extends upwards from the first support surface and is attached to the side edge of the wafer. The arrangement improves the supporting stability of the positioning supporting seat for the wafer, and ensures the inspection precision.

Further, the second supporting surface is arranged to extend obliquely upward and outward from the first supporting surface. By the arrangement, when the wafer is transferred, the wafer can fall into the wafer positioning area accurately.

Preferably, the positioning assembly further comprises a support ring, wherein the support ring is movably arranged below the wafer positioning area up and down. Set up like this, improve equipment security, prevent that the wafer from dropping down the location supporting seat and damaging, simultaneously, after pressing from both sides tight wafer, support the ring downstream and keep away from the wafer, so, can avoid supporting the ring and cause the influence to the light beam of inspection camera, guarantee that the testing result is accurate.

Preferably, the clamping assembly further comprises a plurality of clamping seats circumferentially arranged around the wafer positioning area, and the plurality of clamping modules are movably arranged on the clamping seats in a one-to-one correspondence manner.

Specifically, each clamping seat comprises a first split body extending upwards from the carrying platform and a second split body extending inwards from the top of the first split body, wherein an active area for supporting the circular ring to move is formed between the second split body and the carrying platform. Set up like this, play limiting displacement to supporting the ring, avoid supporting the ring and bumping with top spare part, improve equipment's reliability and security.

Preferably, the inner side of each clamping module is formed with a clamping surface tangential to the side of the wafer. The arrangement effectively reduces the contact area between the clamping module and the wafer, and improves the accuracy of the detection result.

Preferably, the driving unit comprises a transfer platform, a traverse member and a longitudinal member, wherein the traverse member is fixedly arranged on the transfer platform, the traverse member is connected with the carrier and drives the carrier to move transversely, and the longitudinal member is connected with the transfer platform and drives the transfer platform to move longitudinally. By the arrangement, the carrying platform can synchronously move transversely and longitudinally, the flexibility is high, the structure is simple, the size is small, and the internal space of the equipment is greatly saved.

In addition, the automatic inspection device also comprises a rechecking camera and a static elimination component which are arranged above the wafer positioning area.

Due to the implementation of the technical scheme, compared with the prior art, the utility model has the following advantages:

on one hand, the carrying platform and the inspection camera can move relatively under the driving of the driving unit, so that the whole wafer is covered by the inspection range, the omission problem caused by manual inspection is avoided, the inspection accuracy is effectively improved, the inspection efficiency is high, and the labor intensity is low; on the other hand, through the cooperation of locating component and centre gripping subassembly, during the inspection, can guarantee the stability of wafer to the inspection of inspection camera, simple structure, reliable, convenient operation.

Drawings

FIG. 1 is a schematic structural diagram of an automatic inspection apparatus of a PinHole wafer inspection machine according to the present invention;

FIG. 2 is an enlarged view of the structure of the stage and the positioning unit shown in FIG. 1;

wherein: 1. a stage;

2. a positioning unit; 20. a positioning assembly; 200. Positioning a supporting seat; q, a wafer positioning area; m1, a first supporting surface; m2, a second support surface; 201. a support ring; h. a sliding table cylinder; 21. a clamping assembly; 210. a holder; a1, a first split; a2, a second body; 211. a clamping module; 212. a power member;

3. checking the camera;

4. a drive unit; 40. a transfer platform; 41. a traverse member; 410. a transverse guide rail; 411. a traverse driving member; 42. a longitudinally moving member; 420. a longitudinal guide rail; 421. a longitudinal movement driving member;

5. rechecking the camera;

6. a static electricity removing unit;

7. an ultrasonic sensor.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature. It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the automatic inspection apparatus of the pinpole wafer inspection machine according to the present embodiment includes a stage 1, a positioning unit 2, an inspection camera 3, and a driving unit 4.

Specifically, the carrier 1 is horizontally disposed, and a through hole having a diameter equal to that of the wafer is formed on the carrier 1. The arrangement effectively avoids the influence of the carrier on the wafer and ensures the inspection accuracy.

As shown in fig. 2, the positioning unit 2 includes a positioning unit 20 and a clamping unit 21, which are respectively disposed on the stage 1.

In this embodiment, the positioning assembly 20 includes four positioning supports 200 and a supporting ring 201, wherein the four positioning supports 200 are fixedly disposed on the carrier 1, and a wafer positioning region q matched with the wafer is formed between the four positioning supports 200. The device is simple in structure and convenient to install and implement.

Specifically, each positioning support base 200 is formed with a first support surface m1 attached to the bottom of the wafer, and a second support surface m2 extending upward from the first support surface m2 and attached to the side edge of the wafer. The arrangement improves the supporting stability of the positioning supporting seat for the wafer, and ensures the inspection precision.

Meanwhile, the second supporting surface m2 is provided extending obliquely upward and outward from the first supporting surface m 2. By the arrangement, when the wafer is transferred, the wafer can fall into the wafer positioning area accurately.

Specifically, the supporting ring 201 is disposed below the wafer positioning region q in a vertically movable manner, and a sliding groove matched with the corresponding positioning support 200 is formed on the supporting ring 201. Set up like this, improve equipment security, prevent that the wafer from dropping down the location supporting seat and damaging, simultaneously, after pressing from both sides tight wafer, support the ring downstream and keep away from the wafer, so, can avoid supporting the ring and cause the influence to the light beam of inspection camera, guarantee that the testing result is accurate.

For convenience of implementation, the supporting rings 201 are respectively connected to the carrier 1 through sliding table cylinders h from two opposite sides. That is to say, under the drive of slip table cylinder, support the ring and realize the up-and-down motion, the operation is reliable and stable.

In this embodiment, the clamping assembly 21 includes two clamping bases 210 circumferentially disposed around the wafer positioning region q, two clamping modules 211 movably disposed on the two clamping bases 210 in a one-to-one correspondence manner, and a power member 212 driving the two clamping modules 211 to relatively close or open along the radial direction of the wafer.

Specifically, each of the holders 210 includes a first section a1 extending upward from the carrier 1, and a second section a2 extending inward from the top of the first section a1, wherein an active area for supporting the ring 201 is formed between the second section a2 and the carrier 1. Set up like this, play limiting displacement to supporting the ring, avoid supporting the ring and bumping with top spare part, improve equipment's reliability and security.

Specifically, the inner side of each clamping module 211 is formed with a clamping surface tangential to the wafer side. The arrangement effectively reduces the contact area between the clamping module and the wafer, and improves the accuracy of the detection result.

Specifically, the power element 212 is an air cylinder fixedly arranged on the second partition a2, each clamping module 211 is fixedly connected to an output end of the corresponding air cylinder, and under the pushing of the power element 212, the two clamping modules 211 are relatively folded or unfolded along the radial direction of the wafer.

In this example, the inspection camera 3 is disposed above the stage 30.

In this example, the driving unit 4 includes a transfer platform 40, a lateral moving member 41, and a longitudinal moving member 42, wherein the transfer platform 40 is disposed below the stage 1 in parallel, the lateral moving member 41 is fixedly disposed on the transfer platform 40, the lateral moving member 41 is connected to the stage 1 and drives the stage 1 to move laterally, and the longitudinal moving member 42 is connected to the transfer platform 40 and drives the transfer platform 40 to move longitudinally. By the arrangement, the carrying platform can synchronously move transversely and longitudinally, the flexibility is high, the structure is simple, the size is small, and the internal space of the equipment is greatly saved.

Specifically, the traverse member 41 includes a traverse guide 410 fixedly provided on the transfer platform 40, and a traverse driving member 411 connected to the stage 1 and driving the stage 1 to move along the traverse guide 410; the longitudinal moving component 42 comprises a longitudinal guide rail 420 fixedly arranged below the transferring platform 40, and a longitudinal moving driving member 421 connected to the transferring platform 40 and driving the transferring platform 40 to move along the longitudinal guide rail 420, wherein the transverse moving driving member 411 and the longitudinal moving driving member 421 are both driven by a transmission chain. The transmission is reliable and stable, the wafer translation stability is ensured, and the inspection precision of the inspection camera is improved.

Both the traverse driving member 411 and the traverse driving member 421 are driven by a driving chain. The transmission is reliable and stable, the wafer translation stability is ensured, and the inspection precision of the inspection camera is improved.

The automatic inspection apparatus further includes a review camera 5, a static elimination unit 6, and an ultrasonic sensor 7.

Specifically, the review camera 5 is disposed above the wafer positioning region q and on one side of the inspection camera 3.

Specifically, the static removing unit 6 is a plasma air bar fixedly disposed above the wafer positioning region q. By the arrangement, during inspection, the plasma air bar eliminates static electricity on the surface of the wafer, the wafer is prevented from being inspected by the inspection camera, and the accuracy of an inspection result is improved.

Specifically, the ultrasonic sensor 7 is fixedly disposed above the wafer positioning region q.

Therefore, the present embodiment has the following advantages:

1. under the driving of the driving unit, the carrying platform and the inspection camera can move relatively, so that the inspection range covers the whole wafer, the omission problem caused by manual inspection is avoided, the inspection accuracy is effectively improved, the inspection efficiency is high, and the labor intensity is low;

2. through the matching of the positioning assembly and the clamping assembly, the stability of the wafer can be ensured during inspection so as to facilitate the inspection of the inspection camera, and the device has a simple and reliable structure and is convenient to operate;

3. the supporting ring capable of ascending and descending vertically improves the safety of equipment, prevents the wafer from falling off the positioning support seat and being damaged, and meanwhile, after the wafer is clamped, the supporting ring moves downwards and is far away from the wafer, so that the influence of the supporting ring on the light beam of the inspection camera can be avoided, and the accuracy of a detection result is ensured;

4. static electricity on the surface of the wafer is eliminated through the plasma air bar, the wafer is prevented from being inspected by the inspection camera, and the accuracy of an inspection result is improved.

The present invention has been described in detail in order to enable those skilled in the art to understand the utility model and to practice it, and it is not intended to limit the scope of the utility model, and all equivalent changes and modifications made according to the spirit of the present invention should be covered by the present invention.

Claims

1. An automatic inspection device of a PinHole wafer detection machine is characterized in that: it includes:

a stage;

the positioning unit comprises a positioning component and a clamping component which are respectively arranged on the carrying platform, wherein a wafer positioning area matched with the wafer is formed on the positioning component, the clamping component comprises a plurality of clamping modules distributed around the center of the wafer positioning area, and a power piece for driving the clamping modules to relatively close or open along the radial direction of the wafer;

the inspection camera is arranged above the wafer positioning area;

2. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 1, wherein: the positioning assembly comprises a plurality of positioning supporting seats fixedly arranged on the carrying platform, wherein the wafer positioning area is formed among the plurality of positioning supporting seats.

3. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 2, wherein: and a first supporting surface which is attached to the bottom of the wafer and a second supporting surface which extends upwards from the first supporting surface and is attached to the side edge of the wafer are formed on each positioning supporting seat.

4. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 3, wherein: the second supporting surface extends upwards and outwards obliquely from the first supporting surface.

5. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 2, wherein: the positioning assembly further comprises a supporting ring, wherein the supporting ring is movably arranged below the wafer positioning area up and down.

6. The automatic inspection apparatus of a PinHole wafer inspection machine according to claim 5, wherein: the clamping assembly further comprises a plurality of clamping seats arranged around the circumferential direction of the wafer positioning area, and the clamping modules are movably arranged on the clamping seats in a one-to-one correspondence mode.

7. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 6, wherein: each clamping seat comprises a first split body extending upwards from the carrier and a second split body extending inwards from the top of the first split body, wherein an active area for the support ring to move is formed between the second split body and the carrier.

8. The automatic inspection apparatus of a PinHole wafer inspection machine according to claim 5, wherein: and a clamping surface tangent to the side edge of the wafer is formed on the inner side of each clamping module.

9. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 1, wherein: the driving unit comprises a transfer platform, a transverse moving component and a longitudinal moving component, wherein the transverse moving component is fixedly arranged on the transfer platform, the transverse moving component is connected with the carrying platform and drives the carrying platform to move transversely, and the longitudinal moving component is connected with the transfer platform and drives the transfer platform to move longitudinally.

10. The automatic inspection apparatus of a pinpole wafer inspection machine as claimed in claim 1, wherein: the automatic inspection device also comprises a rechecking camera and a static elimination component which are arranged above the wafer positioning area.