CN220041825U - Positioning and edge inspection device suitable for wafer - Google Patents
Positioning and edge inspection device suitable for wafer Download PDFInfo
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- CN220041825U CN220041825U CN202321591327.1U CN202321591327U CN220041825U CN 220041825 U CN220041825 U CN 220041825U CN 202321591327 U CN202321591327 U CN 202321591327U CN 220041825 U CN220041825 U CN 220041825U
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- 238000007689 inspection Methods 0.000 title claims description 26
- 235000012431 wafers Nutrition 0.000 claims abstract description 35
- 230000001360 synchronised effect Effects 0.000 claims abstract description 18
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
Abstract
The utility model relates to a positioning and edge-patrol device suitable for wafers, which comprises a fixed plate, wherein the fixed plate is connected with a positioning fixed plate through a support column, a rotating shaft is connected to the center of the positioning fixed plate in a penetrating way, a sucker is connected above the rotating shaft, a rotating disk is connected to the lower part of the rotating shaft through a bearing, a driving gear is connected to a driving shaft of a first driving motor, the driving gear is meshed with a rack, positioning columns are connected to positioning sliding holes in a sliding way, the positioning columns are connected with the rotating disk through connecting pieces, a second driving motor is connected to the fixed plate, a driving wheel is connected to the driving shaft of the second driving motor, a driven wheel is connected to the lower part of the rotating shaft, a synchronous belt is connected between the driving wheel and the driven wheel, an edge-patrol bracket is connected to the fixed plate, an air cylinder is connected to a driving block of the air cylinder, and a first laser sensor and a second laser sensor are connected to the edge-patrol fixed plate. The utility model can realize quick and accurate positioning.
Description
Technical Field
The utility model relates to a positioning and edge inspection device suitable for a wafer.
Background
At present, the existing die bonder mainly comprises a die feeding mechanism, a grabbing welding mechanism and a wafer table, wherein the wafer table is used for bearing a wafer and can intermittently move the wafer, so that the grabbing welding mechanism can grab crystal grains on the wafer, the crystal grains on the wafer are adhered after grabbing, the wafer table is required to be positioned before the machine runs, the picking welding mechanism is aligned with protruding needles below the wafer table, and the effect of the wafer picking is affected.
The patent is searched: the utility model provides a wafer platform (CN 201921096747.6) of quick location, includes the bed plate of installing in the wafer platform body to and install the protruding needle mechanism on the bed plate, but slide on the bed plate and be connected with lateral shifting's first locating plate, slide on the first locating plate and be connected with vertical shifting's second locating plate, protruding needle mechanism fixes on the second locating plate, all install the drive assembly of drive first locating plate or second locating plate along predetermined direction horizontal migration on first locating plate and the second locating plate, install the locking piece that is used for restricting first locating plate and second locating plate and removes on the bed plate. When the utility model is used, the needle protruding mechanism on the wafer table can be positioned quickly, the working efficiency is improved, and the stability of the wafer table is improved. The precision of the structural positioning is not high and the angular positioning cannot be carried out on different sizes.
In view of the above-mentioned drawbacks, the present inventors have actively studied and innovated to create a new structure of positioning and edge inspection device suitable for wafers, which is more valuable in industry.
Disclosure of Invention
In order to solve the technical problems, the utility model aims to provide a positioning and edge inspection device suitable for a wafer.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the positioning and edge-patrol device suitable for the wafer comprises a fixed plate, wherein the fixed plate is connected with a positioning fixed plate through a support column, a rotating shaft is connected to the center of the positioning fixed plate in a penetrating way, a sucking disc is connected to the upper part of the rotating shaft above the positioning fixed plate, a rotating disc is connected to the lower part of the rotating shaft below the positioning fixed plate through a bearing, a semicircular rack is connected to one half edge of the rotating disc, a first driving motor is connected to the fixed plate, a driving gear is connected to a driving shaft of the first driving motor, the driving gear is meshed with the rack, at least 6 positioning sliding holes which take the rotating shaft as the center and are equal in length are formed in the positioning fixed plate along the periphery of the rotating shaft, a positioning column is connected to one end of a connecting sheet in a sliding way, the other end of the connecting sheet is connected with the rotating disc through the rotating shaft, the positioning column in the positioning sliding holes is in a shrinkage or expansion way, the upper part of the positioning column protrudes out of the top surface of the positioning fixed plate and contacts with a product, a driven wheel is connected to a second driving wheel in a hollow structure, and a driven wheel is connected to the second driving wheel, and a hollow driving wheel is connected to the driven wheel;
the automatic inspection device is characterized in that an edge inspection support is connected to the fixed plate, an air cylinder is connected to the edge inspection support, an edge inspection fixed plate is connected to a driving block of the air cylinder, a first laser sensor and a second laser sensor for detecting products of different sizes are connected to the edge inspection fixed plate, and the second laser sensor is located the inner side of the first laser sensor and is parallel to the inner side of the first laser sensor.
Preferably, the positioning and edge inspection device is suitable for wafers, and the height of the positioning column is higher than that of the product on the sucker.
Preferably, the positioning and edge inspection device is suitable for wafers, and the first driving motor and the second driving motor are stepping motors.
Preferably, the positioning and edge inspection device is suitable for wafers, and the positioning column is sleeved with a guide retainer ring.
Preferably, the positioning and edge inspection device for the wafer is characterized in that the distance between the inner side end of each positioning sliding hole and the rotating shaft is equal.
Preferably, the said one kind is suitable for the locating and patrolling the limit device of the chip, the said suction interface connects to the suction device.
By means of the scheme, the utility model has at least the following advantages:
the utility model can rapidly position products (6 and 8 inches) with different sizes, so that the precision error of the positioning center is +/-0.5 mm, and meanwhile, the flat edges of lenses with different sizes and the wafer notch can be realized through the first laser sensor and the second laser sensor, so that the angle error is less than 0.1 degrees.
The foregoing description is only an overview of the present utility model, and is intended to provide a better understanding of the present utility model, as it is embodied in the following description, with reference to the preferred embodiments of the present utility model and the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the wafer positioning of the present utility model;
fig. 3 is a schematic view of the structure of the inspection positioning of the present utility model.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
As shown in fig. 1 and 2, a positioning and edge-inspection device suitable for wafers comprises a fixed plate 1, wherein a positioning fixed plate 2 is connected to the fixed plate 1 through a support column, a rotating shaft 3 is connected to the center of the positioning fixed plate 2 in a penetrating way, a sucking disc 4 is connected to the upper part of the rotating shaft 3 above the positioning fixed plate, a rotating disc 5 is connected to the lower part of the rotating shaft 3 below the positioning fixed plate through a bearing, a semicircular rack 6 is connected to one half of the rotating disc 5, a first driving motor 7 is connected to the fixed plate 1, a driving gear 8 is connected to a driving shaft of the first driving motor 7, the driving gear 8 is meshed with the rack 6, at least 6 positioning sliding holes 9 which take the rotating shaft as the center and are equal in length are formed in the positioning fixed plate 2 along the periphery of the rotating shaft 3, a positioning post 10 is connected in a sliding way in each positioning sliding hole 9, the lower end of the positioning post 10 is connected with one end of a connecting piece 11, the other end of the connecting piece 11 is connected with the rotating disc 5 through a bearing, a semicircular rack 6 is connected to one half of the rotating disc 5, a driving wheel is connected to a driving wheel 13 in a rotating way, a driving wheel is connected to a driving wheel 13 in a synchronous way, and is connected to a synchronous pulley 13 in a synchronous way, and is connected to a synchronous driving wheel 13, which is connected to a synchronous driving wheel 13 and a synchronous pulley 13, and a synchronous drive shaft 13 is connected to a synchronous shaft 13 and a synchronous shaft 13, and a synchronous expansion part is connected to the synchronous drive shaft 13 and a synchronous drive shaft is arranged on the synchronous shaft and a synchronous drive shaft 13;
the fixed plate 1 is connected with an edge-patrol support 16, the edge-patrol support 16 is connected with a cylinder 17, a driving block of the cylinder 17 is connected with an edge-patrol fixed plate 18, the edge-patrol fixed plate 18 is connected with a first laser sensor 19 and a second laser sensor 20 for detecting products with different sizes, and the second laser sensor 20 is positioned on the inner side of the first laser sensor 19 and is parallel to the first laser sensor 19.
The height of the positioning column is higher than that of the product on the sucker 4, so that the positioning column can be always contacted with the product, and the positioning accuracy of the product is ensured.
The first driving motor and the second driving motor are stepping motors.
The positioning column 10 is sleeved with a guide retainer ring.
The space between the inner side end of each positioning sliding hole 9 and the rotating shaft is equal, so that the positioning columns (clamping jaws) can reach the rotating shaft at the same time, the positioning accuracy is ensured, and the positioning accuracy is within 0.5 mm.
The air suction interface 15 is externally connected to an air suction device.
The working principle of the utility model is as follows:
when the device is in specific work, a product (wafer) is placed on the sucker, the rack is driven to rotate by the driving of the first driving motor, so that the rotating disk is driven to rotate, all positioning columns (clamping jaws) are driven to shrink inwards under the rotation of the rotating disk, so that the product is positioned at the center position, after the product is positioned, the product is adsorbed by the sucker, then the driving wheel of the second driving motor is driven by the synchronous belt to rotate, the rotating shaft is driven to rotate under the rotation of the driven wheel, the rotating shaft is driven to rotate the product on the sucker, the product is positioned at an angle under the detection of the corresponding laser sensor, and the next procedure is waited after the angular positioning.
The first laser sensor is directed to the positioning of the flat edge of a 6 inch wafer lens and the second laser sensor is directed to the positioning of an 8 inch wafer notch.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "horizontal", "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is conventionally put in use of the product of this application, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or vertical, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present utility model, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims (6)
1. The utility model provides a be applicable to location and the device of patrolling and tracing limit of wafer which characterized in that: the positioning and fixing device comprises a fixing plate (1), wherein a positioning fixing plate (2) is connected to the fixing plate (1) through a supporting column, a rotating shaft (3) is connected to the center of the positioning fixing plate (2) in a penetrating way, a sucking disc (4) is connected to the upper part of the rotating shaft (3) above the positioning fixing plate, a rotating disc (5) is connected to the lower part of the rotating shaft (3) below the positioning fixing plate through a bearing, a semicircular rack (6) is connected to one half edge of the rotating disc (5), a first driving motor (7) is connected to the fixing plate (1), a driving gear (8) is connected to a driving shaft of the first driving motor (7), the driving gear (8) is meshed with the rack (6), at least 6 positioning slide holes (9) which take the rotating shaft as the center and are equal in length are formed in the positioning fixing plate (2) along the periphery of the rotating shaft, a lower end of the positioning slide hole (10) is connected with one end of a connecting sheet (11), the other end of the positioning column (10) is connected with one end of the connecting sheet (11) in a synchronous sliding way through the rotating disc (5) when the rotating shaft (5) rotates, the upper part of the positioning column (10) protrudes out of the top surface of the positioning fixing plate and is in contact with a product, a second driving motor (12) is connected to the fixing plate (1), a driving wheel (13) is connected to a driving shaft of the second driving motor (12), a driven wheel (14) which rotates synchronously with the driving wheel is connected to the lower part of the rotating shaft (3), a synchronous belt is connected between the driving wheel (13) and the driven wheel (14), and the rotating shaft (3) is of a hollow structure and the lower end of the rotating shaft is connected with an air suction interface (15);
the automatic inspection device is characterized in that an edge inspection support (16) is connected to the fixed plate (1), an air cylinder (17) is connected to the edge inspection support (16), an edge inspection fixed plate (18) is connected to a driving block of the air cylinder (17), a first laser sensor (19) and a second laser sensor (20) for detecting products of different sizes are connected to the edge inspection fixed plate (18), and the second laser sensor (20) is located on the inner side of the first laser sensor (19) and is arranged in parallel with the first laser sensor and the second laser sensor.
2. A positioning and edge inspection apparatus for wafers as claimed in claim 1 wherein: the height of the positioning column is higher than that of the product on the sucker (4).
3. A positioning and edge inspection apparatus for wafers as claimed in claim 1 wherein: the first driving motor and the second driving motor are stepping motors.
4. A positioning and edge inspection apparatus for wafers as claimed in claim 1 wherein: and a guide retainer ring is sleeved on the positioning column (10).
5. A positioning and edge inspection apparatus for wafers as claimed in claim 1 wherein: the space between the inner side end of each positioning sliding hole (9) and the rotating shaft is equal.
6. A positioning and edge inspection apparatus for wafers as claimed in claim 1 wherein: the air suction interface (15) is externally connected to an air suction device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321591327.1U CN220041825U (en) | 2023-06-21 | 2023-06-21 | Positioning and edge inspection device suitable for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321591327.1U CN220041825U (en) | 2023-06-21 | 2023-06-21 | Positioning and edge inspection device suitable for wafer |
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| Publication Number | Publication Date |
|---|---|
| CN220041825U true CN220041825U (en) | 2023-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321591327.1U Active CN220041825U (en) | 2023-06-21 | 2023-06-21 | Positioning and edge inspection device suitable for wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN220041825U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524963A (en) * | 2024-01-05 | 2024-02-06 | 厦门特仪科技有限公司 | Wafer edge inspection device based on laser and control method thereof |
-
2023
- 2023-06-21 CN CN202321591327.1U patent/CN220041825U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524963A (en) * | 2024-01-05 | 2024-02-06 | 厦门特仪科技有限公司 | Wafer edge inspection device based on laser and control method thereof |
| CN117524963B (en) * | 2024-01-05 | 2024-03-15 | 厦门特仪科技有限公司 | Wafer edge inspection device based on laser and control method thereof |
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