CN116759370A - Die bonding device and die bonding equipment - Google Patents
Die bonding device and die bonding equipment Download PDFInfo
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- CN116759370A CN116759370A CN202310520523.8A CN202310520523A CN116759370A CN 116759370 A CN116759370 A CN 116759370A CN 202310520523 A CN202310520523 A CN 202310520523A CN 116759370 A CN116759370 A CN 116759370A
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 58
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000005489 elastic deformation Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 59
- 230000007246 mechanism Effects 0.000 description 5
- 230000006698 induction Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application belongs to the field of semiconductor technical equipment, and particularly relates to a die bonding device and die bonding equipment. The die bonding device comprises: the clamping structure is used for clamping the two opposite edges of the bearing film and tensioning the bearing film; and the pushing structure comprises an adsorption disc and a driving assembly for driving the adsorption disc to reciprocate along a preset direction, the adsorption disc is positioned at the other side of the bearing film and is used for adsorbing the bearing film, and the driving assembly is used for driving the adsorption disc to abut against the bearing film and pushing the bearing film to abut against the wafer so as to fix the wafer on the bearing film and separate from the preset position. The application can effectively reduce the local deformation of the bearing film, thereby improving the positioning precision of the wafer on the bearing film and the bonding strength between the wafer and the bearing film.
Description
Technical Field
The application belongs to the field of semiconductor technical equipment, and particularly relates to a die bonding device and die bonding equipment.
Background
Currently, in the process of manufacturing semiconductor chips, a wafer is cut into a plurality of wafers, and parameters such as appearance, performance and the like of each wafer are individually inspected, and then the wafers are classified and sorted according to inspection results; during the classification and sorting process, the wafers need to be transferred from the transfer film to another carrier film. Since the wafer transfer mechanism is often reciprocated at a high speed, the transfer mechanism needs to be designed to be light and compact, and the carrier film is usually partially lifted up and abutted against the wafer by a push rod mechanism, and the partially lifted-up area is slightly larger than the area of the wafer, so that the wafer is adhered to the carrier film.
In the prior art, the pusher mechanism is directly fixed to the platen of the apparatus, and it is necessary to partially lift the carrier film once for each wafer to be fixed to the carrier film. As the bearing film has deformation capability, the bearing film which is locally jacked up can generate protruding deformation, and the contact surface of the bearing film and the wafer can become uneven along with the continuous progress of die bonding, the positioning precision and the adhesive strength of the wafer are affected, and the positioning precision and the adhesive strength of the wafer which are fixed originally are also affected due to the deformation of the bearing film.
Disclosure of Invention
The embodiment of the application aims to provide a die bonding device, which aims to solve the problem of how to improve the positioning accuracy and the bonding strength of a wafer.
In order to achieve the above purpose, the application adopts the following technical scheme:
in a first aspect, a die bonding apparatus for fixing a wafer to a carrier film is provided, where the wafer is located at a predetermined position, and the predetermined position is located at one side of the carrier film and is spaced from the carrier film, and the die bonding apparatus includes:
the clamping structure is used for clamping the two opposite edges of the bearing film and tensioning the bearing film; and
the pushing structure comprises an adsorption disc and a driving assembly used for driving the adsorption disc to reciprocate along a preset direction, wherein the adsorption disc is positioned on the other side of the bearing film and used for adsorbing the bearing film, and the driving assembly is used for driving the adsorption disc to abut against the bearing film and pushing the bearing film to abut against the wafer so as to fix the wafer on the bearing film and separate from the preset position.
In some embodiments, the driving assembly comprises a pushing driver, an eccentric wheel arranged on a rotating shaft of the pushing driver and a pushing wheel rotationally connected with the adsorption disc, wherein a wheel surface of the eccentric wheel is abutted with a wheel surface of the pushing wheel.
In some embodiments, the driving assembly further includes a restoring member having an elastic restoring force, one end of the restoring member is fixedly disposed, the other end of the restoring member is connected to the adsorption disc, and the restoring member is elastically deformed, so that the driving wheel is in contact with the eccentric wheel.
In some embodiments, the die bonding apparatus further includes an angle adjustment structure connected to the clamping structure, where the angle adjustment structure is configured to drive the clamping structure and the adsorption disc to rotate synchronously in a plane parallel to the carrier film, so that the carrier film rotates relative to the wafer.
In some embodiments, the angle adjusting structure comprises a positioning base plate, a rotating wheel and an angle driver, the positioning base plate is provided with an adjusting through hole, the rotating wheel is rotationally arranged in the adjusting through hole, the clamping structure and the adsorption disc are both connected with the rotating wheel, and the angle driver is connected with the positioning base plate and used for driving the rotating wheel to rotate.
In some embodiments, the pushing structure further includes a suction cup adapter plate and a pushing bottom plate connected to the rotating wheel, the positioning bottom plate is located between the carrier film and the pushing bottom plate, and the suction cup adapter plate connects the pushing bottom plate and the suction cup through the adjusting through hole.
In some embodiments, the pushing base plate is provided with a first threaded hole, and the pushing structure further comprises a first bolt, and the first bolt is screwed in the first threaded hole and abuts against the rotating wheel so as to adjust the parallelism of the adsorption disc relative to the bearing film.
In some embodiments, the pushing structure further comprises a slider connected with the pushing bottom plate, a guide rail slidingly connected with the slider along the predetermined direction, and a fixing bracket connected with the guide rail, and the sucker adapter plate is connected with the guide rail.
In some embodiments, the clamping structure comprises two clamping assemblies provided with clamping grooves at intervals, and two side edges of the bearing film are respectively clamped in the two clamping grooves.
In a second aspect, a die bonding apparatus is provided, including the die bonding device, the die bonding apparatus further including a die bonding arm for clamping the wafer and moving the wafer to the predetermined position.
The application has the beneficial effects that: the die bonding device comprises a clamping structure and a pushing structure, wherein the clamping structure clamps the two opposite side edges of the bearing film and tightens the bearing film, the pushing structure comprises an adsorption disc and a driving assembly, the driving assembly is used for driving the adsorption disc to reciprocate, the bearing film is driven to integrally move towards the wafer through the adsorption disc, the bearing film can effectively reduce the local deformation of the bearing film while the bearing film adsorbs the wafer, so that the positioning precision of the wafer on the bearing film is improved, and the bonding strength between the wafer and the bearing film is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or exemplary technical descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 is a schematic perspective view of a die bonding apparatus according to an embodiment of the present application;
fig. 2 is a schematic diagram of an assembly structure of a die bonding apparatus and a carrier film according to an embodiment of the present application;
FIG. 3 is a schematic diagram illustrating an assembly structure of the die attach apparatus and the carrier film in another embodiment of FIG. 2;
FIG. 4 is a schematic cross-sectional view of FIG. 2;
FIG. 5 is a schematic perspective view of the pushing structure of FIG. 1;
FIG. 6 is an exploded view of FIG. 5;
FIG. 7 is a schematic perspective view of the angle adjustment structure of FIG. 1;
FIG. 8 is a schematic perspective view of the clamping assembly of FIG. 1;
fig. 9 is a schematic perspective view of the spacing assembly of fig. 1.
Wherein, each reference sign in the figure:
100. a die bonding device; 001. an angle adjusting structure; 101. positioning a bottom plate; 102. a rotating bearing; 103. a rotating wheel; 104. a timing belt; 105. a driving wheel; 106. an angle driver; 107. a tensioning wheel; 108. a pushing cylinder; 109. a push rod; 200. a clamping structure; 002. a clamping assembly; 201. a jaw support; 202. a clamping jaw bottom plate; 203. a linear bearing; 204. a spring; 205. a spring baffle; 206. a guide shaft; 207. a mounting base; 208. a clamping block; 209. a guide plate; 006. BIN slice; 003. a limit component; 301. a limiting block bracket; 302. a stop block; 303. a fixing plate; 304. a sensor; 005. a pushing structure; 501. pushing the bottom plate; 502. a first bolt; 503. a second bolt; 504. pushing the driver; 505. an eccentric wheel; 506. an induction rod; 507. a limit rod; 508. an inductor; 509. an induction adapter plate; 510. a bearing pin; 511. a push wheel; 512. a sucker adapter plate; 513. an adsorption plate; 514. an air pipe joint; 514. an air pipe joint; 515. a reset member; 516. a guide rail; 517. a fixed bracket; 518. a spring strut; 521. a first threaded hole; 522. a second threaded hole; 520. a slide block; 111. adjusting the through hole;
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are based on the orientation or positional relationship shown in the drawings, are for convenience of description only, and are not intended to indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application, and the specific meaning of the terms described above will be understood by those of ordinary skill in the art as appropriate. The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless specifically defined otherwise.
Referring to fig. 1 to 3, an embodiment of the present application provides a die bonding apparatus 100 for fixing a wafer 007 to a carrier film 008, wherein the wafer 007 is located at a predetermined position, and the wafer 007 is located at one side of the carrier film 008 and is spaced apart from the carrier film 008, and it is understood that the carrier film 008 is a blue film and has a certain adhesion on a surface on which the wafer 007 is disposed, so that the wafer 007 can be adhered and fixed, and a plurality of wafers 007 are arranged on the carrier film 008 in a plurality of rows and columns. It will be appreciated that carrier film 008 is typically disposed on BIN sheet 006, and that carrier film 008 may be carried by carrying BIN sheet 006.
Referring to fig. 2 to 6, the die bonding apparatus 100 includes: a gripping structure 200 and a pushing structure 005. The clamping structure 200 is used for clamping two opposite edges of the carrier film 008 and tensioning the carrier film 008, in this embodiment, the carrier film 008 is tightly formed into a planar shape, and the carrier film 008 is arranged along the vertical direction.
Referring to fig. 2 to 6, the pushing structure 005 includes an adsorption plate 513 and a driving assembly for driving the adsorption plate 513 to reciprocate along a predetermined direction, wherein the predetermined direction is a horizontal direction in the embodiment, and the predetermined direction is perpendicular to a plane defined by the carrier film 008. The adsorption disc 513 is located at the other side of the carrier film 008 and is used for adsorbing the carrier film 008, and it is understood that the adsorption disc 513 may be attached to the carrier film 008 by means of gluing. The driving assembly is used for driving the adsorption disc 513 to abut against the carrier film 008 and pushing the carrier film 008 to abut against the wafer 007, so that the wafer 007 is adhered to and fixed on the carrier film 008, and the wafer 007 moves along with the carrier film 008 under the continuous driving of the pushing structure 005, and meanwhile, the wafer 007 is separated from the predetermined position. It can be appreciated that the adsorption disc 513 adsorbs the surface of the carrier film 008 to form a planar arrangement, and pushes the carrier film 008 to move integrally towards the wafer 007, so that local deformation of the carrier film 008 can be effectively reduced, and the bonding strength and positioning accuracy of connection between the wafer 007 and the carrier film 008 are improved.
Referring to fig. 2 to 6, the die bonding apparatus provided in this embodiment includes a clamping structure 200 and a pushing structure 005, where the clamping structure 200 clamps two opposite side edges of the carrier film 008 and tightens the carrier film 008, the pushing structure 005 includes an adsorption disc 513 and a driving assembly, the driving assembly is used to drive the adsorption disc 513 to reciprocate, and the carrier film 008 is driven to move toward the wafer 007 through the adsorption disc 513, so that the carrier film 008 adsorbs the wafer 007, and meanwhile, local deformation of the carrier film 008 can be effectively reduced, thereby improving positioning accuracy of the wafer 007 on the carrier film 008 and improving adhesive strength between the wafer 007 and the carrier film 008.
Referring to fig. 1, it can be understood that the carrier film 008 is fixed on the BIN sheet, and the area of the adsorption surface 5131 of the adsorption disc 513 is adapted to the area of the carrier film 008, so as to push the carrier film 008 to move integrally.
Referring to fig. 2 to 6, alternatively, the adsorption disc 513 is a ceramic adsorption disc 513, an air passage is formed in the adsorption disc 513, an adsorption hole is formed in the adsorption surface 5131 of the adsorption disc 513, the air passage is communicated to an exhaust fan through an air pipe connector 514, and negative pressure can be generated at the adsorption surface 5131 of the adsorption disc 513 through the exhaust fan, so that the carrier film 008 can be adsorbed to the adsorption disc 513 through the negative pressure, and the driving assembly drives the adsorption disc 513 to perform periodic reciprocating motion, so that the wafers 007 can be sequentially solidified, the wafers 007 are arranged in a plurality of rows and a plurality of columns, and the error range of linear precision is +/-10 μm.
It will be appreciated that the die attach arm picks up a single wafer 007 from the transfer film and moves the wafer 007 to one side of the carrier film 008 such that the wafer 007 is in a predetermined position to be die attach.
Referring to fig. 2 to 6, in some embodiments, the driving assembly includes a driving driver 504, an eccentric 505 disposed on a rotation shaft of the driving driver 504, and a driving wheel 511 rotatably connected to the suction disc 513, wherein a wheel surface of the eccentric 505 abuts against a wheel surface of the driving wheel 511, the driving wheel 511 may be a bearing, an inner ring of the bearing is connected to the suction disc 513, and an outer ring of the bearing abuts against the eccentric 505.
Optionally, the pushing driver 504 is a servo motor, the eccentric wheel 505 is disposed on an output shaft of the servo motor, the output shaft of the servo motor is disposed along a vertical direction, the eccentric wheel 505 is disposed horizontally, a wheel surface of the eccentric wheel 505 is in sliding contact with a wheel surface of the pushing wheel 511, the servo motor drives the eccentric wheel 505 to rotate, and the adsorption disc 513 can be driven to reciprocate by the pushing wheel 511, so that the structure is simple and compact.
Referring to fig. 2 and 6, in some embodiments, the driving assembly further includes a restoring member 515 having an elastic restoring force, one end of the restoring member 515 is fixedly disposed, the other end of the restoring member 515 is connected to the adsorption disk 513, and the restoring member 515 is elastically deformed to bring the push wheel 511 into contact with the eccentric wheel 505.
Referring to fig. 2 to 6, alternatively, the return member 515 is a tube spring, and when the eccentric 505 drives the adsorption disk 513 toward the wafer 007, the return member 515 is in a stretched state, and when the wafer 007 is separated from a predetermined position, the return member 515 is restored from the stretched state, and the push wheel 511 is kept in contact with the eccentric 505.
Referring to fig. 1 and 7, in some embodiments, the die bonding apparatus further includes an angle adjustment structure 001 connected to the clamping structure 200, where the angle adjustment structure 001 is used to drive the clamping structure 200 and the adsorption disc 513 to rotate synchronously in a plane parallel to the carrier film 008, so that the carrier film 008 rotates relative to the wafer 007.
Referring to fig. 1 and 7, it will be appreciated that the angular position of the wafer 007 relative to the carrier film 008 may be accidentally changed during the transfer of the wafer 007 to a predetermined position by the bond arm, i.e., the wafer 007 may be tilted relative to the horizontal. The relative position of the wafer 007 and the carrier film 008 is consistent with the expected setting by measuring the fluctuation of the relative reference position of the wafer 007 and driving the clamping structure 200 and the adsorption plate 513 to synchronously rotate by the corresponding fluctuation through the angle adjusting structure 001, so that the positioning accuracy of the wafer 007 adhered to the carrier film 008 is improved, and the wafers 007 positioned in the same row or the same column are arranged in a straight line.
Referring to fig. 1 and 7, in some embodiments, the angle adjusting structure 001 includes a positioning base plate 101, a rotating wheel 103 and an angle driver 106, the positioning base plate 101 is provided with an adjusting through hole 111, the rotating wheel 103 is rotatably disposed in the adjusting through hole 111, the clamping structure 200 and the adsorption disc 513 are both connected to the rotating wheel 103, and the angle driver 106 is connected to the positioning base plate 101 and is used for driving the rotating wheel 103 to rotate. The angle drive 106 may also be a servo motor.
Referring to fig. 1 and 7, the angle adjusting structure 001 further includes a rotating bearing 102, a timing belt 104, a driving wheel 105 disposed on an output shaft of the angle driver 106, a tensioning wheel 107 connected to the positioning base 101 and used for tensioning the timing belt 104, a pushing cylinder 108, and a push rod 109. The swivel bearing 102 is arranged in the adjusting through hole 111 and is used for enabling the swivel wheel 103 to be rotationally connected with the positioning base plate 101, the swivel wheel 103 and the driving wheel 105 are synchronous wheels, one end of the synchronous belt 104 is connected with the swivel wheel 103, the other end of the synchronous belt 104 is connected with the driving wheel 105, and therefore the rotating power of the angle driver 106 can be transmitted to the swivel wheel 103, angle compensation can be provided in the die bonding process, and the position accuracy of die bonding is improved.
The pushing cylinder 108 is connected to the positioning base 101 and is used for driving the push rod 109 to reciprocate, and the push rod 109 is used for assisting the clamping structure 200 to clamp the carrier film 008.
Referring to fig. 2 to 6, in some embodiments, the pushing structure 005 further includes a chuck adapter plate 512 and a pushing base plate 501 connected to the rotating wheel 103, the positioning base plate 101 is located between the carrier film 008 and the pushing base plate 501, and the chuck adapter plate 512 connects the pushing base plate 501 and the adsorption plate 513 through the adjusting through hole 111, so that the overall structure of the die bonding apparatus 100 is compact, and the occupied space of the die bonding apparatus is reduced.
Referring to fig. 2 to 4, in some embodiments, the pushing base plate 501 is provided with a first threaded hole 521, the pushing structure 005 further includes a first bolt 502, and the first bolt 502 is screwed into the first threaded hole 521 and abuts against the rotating wheel 103, so as to adjust the parallelism of the adsorption disc 513 relative to the carrier film 008.
Referring to fig. 2 to 6, alternatively, four first bolts 502 are provided, the number of first threaded holes 521 is adapted to the number of first bolts 502, and the first bolts 502 are circumferentially arranged on the pushing base plate 501, and the distance between the rotating wheel 103 and the pushing base plate 501 can be adjusted by driving the first bolts 502 to rotate, so that the parallelism adjustment between the adsorption disc 513 and the carrier film 008 can be realized, and finally the positioning accuracy of the wafer 007 is improved.
Referring to fig. 2 to 6, optionally, the pushing structure 005 further includes a second bolt 503, a second threaded hole 522 is formed at a position of the rotating wheel 103 where the first bolt 502 abuts, the first bolt 502 is formed with a locking through hole axially arranged along the first threaded hole 522, the through hole is communicated with the second threaded hole 522, and the second bolt 503 penetrates through the locking through hole and is screwed to the second threaded hole 522, so that the pushing base plate 501 is connected to the rotating wheel 103.
Referring to fig. 2 to 6, in some embodiments, the pushing structure 005 further includes a slider 520 connected to the pushing base 501, a guide rail 516 slidably connected to the slider 520 along the predetermined direction, and a fixing bracket 517 connected to the guide rail 516, and the suction cup adapter plate 512 is connected to the guide rail 516, so that the suction cup adapter plate 512 is guided to slide by the cooperation of the slider 520 and the guide rail 516, thereby improving the sliding stability of the suction cup 513.
The sucker adapter plate 512, the adsorption disk 513 and the air pipe joint 514 are connected and fixed into a whole, and the sucker adapter plate is connected and arranged on the guide rail 516 through the guide rail 516, so that a mechanism that the eccentric wheel 505 with a compact structure pushes the plane sucker to move relatively is realized.
Referring to fig. 2 to 6, the pusher plate 501 further includes an induction lever 506, a stopper lever 507, an inductor 508, an induction adapter plate 509 for connecting the inductor 508 to the pusher plate 501, and a spring support 518. The spring post 518 is attached to the fixed bracket 517 and one end of the return 515 is attached to the spring post 518. The push wheel 511 is rotatably connected to the chuck adapter plate 512 by means of a bearing pin 510.
Referring to fig. 1 and 8, in some embodiments, the clamping structure 200 includes clamping assemblies 002 with clamping grooves, two clamping assemblies 002 are arranged at intervals, and two side edges of the carrier film 008 are respectively clamped in the two clamping grooves.
Referring to fig. 1 and 8, the clamping assembly 002 includes: a jaw support 201 connected to the swivel wheel 103, a jaw base 202 connected to the jaw support 201, a linear bearing 203 connected to the jaw base 202, a spring 204 connected to the linear bearing 203, a spring damper 205 located at one end of the spring 204, a mount 207, a clamping block 208 arranged on the mount 207, a guide shaft 206 for guiding the clamping block 208, and a guide plate 209. Wherein the spring damper 205, the guide shaft 206, the mounting base 207, and the clamping block 208 are coupled together slidably by the linear bearing 203. The clamping groove is formed in the clamping block 208, and the clamping block 208 is always in a retreating clamping state under the action of the spring 204. Two clamping assemblies 002 are fixed on the left and right sides of the rotating wheel 103, and are used for clamping the carrier film 008 and synchronously rotating along with the rotating wheel 103.
Referring to fig. 9, optionally, the die bonding apparatus 100 further includes a limiting component 003 under the carrier film 008, where the limiting component 003 includes: a stopper bracket 301 connected to the positioning base 101, a stopper 302 connected to the stopper bracket 301 and adapted to block the carrier film 008 upward, a sensor 304 adapted to sense the carrier film 008, and a fixing plate 303 adapted to fix the sensor 304. The limiting component 003 is fixed below the rotating wheel 103 and plays a limiting role on the bearing film 008 placed on the clamping component 002; while the sensor 304 can monitor in real time whether the carrier film 008 is present on the current clamping assembly 002.
Referring to fig. 1 and 9, alternatively, the pushing cylinder 108 protrudes through the push rod 109 to simultaneously eject the mounting block 207 and the clamping block 208; the carrier film 008 is arranged on the BIN sheet 006, the carrier arm inserts the BIN sheet 006 into the clamping groove, the block 302 positions the BIN sheet 006, and after the sensor 304 monitors the BIN sheet 006, the pushing cylinder 108 and the push rod 109 retract, and the clamping block 208 synchronously returns to clamp the BIN sheet 006. It can be appreciated that the fast movement of the clamping block 208 can be achieved by pushing the cylinder 108 and the push rod 109, thereby facilitating the replacement of the carrier film 008 and improving die bonding efficiency.
The application also provides a die bonding device, which comprises a die bonding device 100, wherein the specific structure of the die bonding device 100 refers to the above embodiment, and because all the technical schemes of all the embodiments are adopted, the die bonding device also has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted.
In some embodiments, the die bonding apparatus further comprises a die bonding arm for clamping the wafer 007 and moving the wafer 007 to the predetermined position.
The foregoing is merely an alternative embodiment of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A die bonding apparatus for securing a wafer to a carrier film, wherein the wafer is located at a predetermined position, and the predetermined position is located at one side of the carrier film and is spaced from the carrier film, the die bonding apparatus comprising:
the clamping structure is used for clamping the two opposite edges of the bearing film and tensioning the bearing film; and
the pushing structure comprises an adsorption disc and a driving assembly used for driving the adsorption disc to reciprocate along a preset direction, wherein the adsorption disc is positioned on the other side of the bearing film and used for adsorbing the bearing film, and the driving assembly is used for driving the adsorption disc to abut against the bearing film and pushing the bearing film to abut against the wafer so as to fix the wafer on the bearing film and separate from the preset position.
2. The die attach apparatus of claim 1, wherein: the driving assembly comprises a pushing driver, an eccentric wheel arranged on a rotating shaft of the pushing driver and a pushing wheel rotationally connected with the adsorption disc, and the wheel surface of the eccentric wheel is abutted with the wheel surface of the pushing wheel.
3. The die attach apparatus of claim 2, wherein: the driving assembly further comprises a reset piece with elastic restoring force, one end of the reset piece is fixedly arranged, the other end of the reset piece is connected with the adsorption disc, and the reset piece is in a contact state with the eccentric wheel through elastic deformation.
4. A die attach apparatus as claimed in any one of claims 1 to 3, wherein: the die bonding device further comprises an angle adjusting structure connected with the clamping structure, wherein the angle adjusting structure is used for driving the clamping structure and the adsorption disc to synchronously rotate in a plane parallel to the bearing film so that the bearing film rotates relative to the wafer.
5. The die attach apparatus of claim 4, wherein: the angle adjusting structure comprises a positioning bottom plate, a rotating wheel and an angle driver, wherein an adjusting through hole is formed in the positioning bottom plate, the rotating wheel is rotatably arranged in the adjusting through hole, the clamping structure and the adsorption disc are both connected with the rotating wheel, and the angle driver is connected with the positioning bottom plate and used for driving the rotating wheel to rotate.
6. The die attach apparatus of claim 5, wherein: the pushing structure further comprises a sucker adapter plate and a pushing bottom plate connected with the rotating wheel, the positioning bottom plate is located between the bearing film and the pushing bottom plate, and the sucker adapter plate is connected with the pushing bottom plate and the adsorption disc through the adjusting through hole.
7. The die attach apparatus of claim 6, wherein: the pushing bottom plate is provided with a first threaded hole, the pushing structure further comprises a first bolt, and the first bolt is in threaded locking with the first threaded hole and abuts against the rotating wheel so as to adjust the parallelism of the adsorption disc relative to the bearing film.
8. The die attach apparatus of claim 6, wherein: the pushing structure further comprises a sliding block connected with the pushing bottom plate, a guide rail slidingly connected with the sliding block along the preset direction and a fixed support connected with the guide rail, and the sucker adapter plate is connected with the guide rail.
9. A die attach apparatus as claimed in any one of claims 1 to 3, wherein: the clamping structure comprises clamping assemblies provided with clamping grooves, two clamping assemblies are arranged at intervals, and two side edges of the bearing film are respectively clamped in the two clamping grooves.
10. A die bonding apparatus comprising the die bonding device according to any one of claims 1 to 9, further comprising a die bonding arm for holding the wafer and moving the wafer to the predetermined position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310520523.8A CN116759370A (en) | 2023-05-09 | 2023-05-09 | Die bonding device and die bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310520523.8A CN116759370A (en) | 2023-05-09 | 2023-05-09 | Die bonding device and die bonding equipment |
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| Publication Number | Publication Date |
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| CN116759370A true CN116759370A (en) | 2023-09-15 |
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| CN202310520523.8A Pending CN116759370A (en) | 2023-05-09 | 2023-05-09 | Die bonding device and die bonding equipment |
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| CN (1) | CN116759370A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116741682A (en) * | 2023-05-09 | 2023-09-12 | 深圳市标谱半导体股份有限公司 | Material moving device and blue film braid packaging equipment |
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| CN113506764A (en) * | 2021-06-30 | 2021-10-15 | 深圳市丰泰工业科技有限公司 | Wafer moving device and wafer fixing equipment |
| CN215869332U (en) * | 2021-08-20 | 2022-02-18 | 苏州迈为科技股份有限公司 | Carrying platform device |
| CN115249634A (en) * | 2021-04-28 | 2022-10-28 | 梭特科技股份有限公司 | High-speed positioning method for crystal grain |
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| CN110605245A (en) * | 2019-09-20 | 2019-12-24 | 深圳市矽电半导体设备有限公司 | Sorting machine |
| CN115249634A (en) * | 2021-04-28 | 2022-10-28 | 梭特科技股份有限公司 | High-speed positioning method for crystal grain |
| CN113506764A (en) * | 2021-06-30 | 2021-10-15 | 深圳市丰泰工业科技有限公司 | Wafer moving device and wafer fixing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116741682A (en) * | 2023-05-09 | 2023-09-12 | 深圳市标谱半导体股份有限公司 | Material moving device and blue film braid packaging equipment |
| CN116741682B (en) * | 2023-05-09 | 2024-02-13 | 深圳市标谱半导体股份有限公司 | Material moving device and blue film braid packaging equipment |
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Application publication date: 20230915 |