CN116313873B

CN116313873B - Full-automatic wafer testing equipment and method

Info

Publication number: CN116313873B
Application number: CN202310529691.3A
Authority: CN
Inventors: 刘世文; 钟金成
Original assignee: Shenzhen Senmei Xieer Technology Co ltd
Current assignee: Shenzhen Senmei Xieer Technology Co ltd
Priority date: 2023-05-11
Filing date: 2023-05-11
Publication date: 2023-07-25
Anticipated expiration: 2043-05-11
Also published as: CN116313873A

Abstract

The application relates to the technical field of wafer detection, in particular to full-automatic wafer testing equipment and method. Wherein, a partition plate is arranged in the case, and the partition plate partitions the inside of the case into a transferring cavity and a detecting cavity; the storage bin is arranged on the chassis, the manipulator is arranged in the transfer cavity and is close to the storage bin, and the manipulator is used for transferring wafers; the support frame is arranged in the transferring cavity, the pre-positioning mechanism is arranged on the support frame and far away from the stock bin, and the pre-positioning mechanism is used for detecting the number of the front surface or the back surface of the wafer and adjusting the position of the wafer; the detection mechanism is arranged in the detection cavity, the detection mechanism comprises a chuck and a needle clamp, the needle clamp is used for clamping the needle clamp, the manipulator is used for transferring the wafer from the transfer cavity to the detection cavity, and the wafer is placed on the chuck so that the needle clamp can detect the wafer on the chuck. The wafer calibration method and device have the effect of being convenient for calibrating the position of the wafer.

Description

Full-automatic wafer testing equipment and method

Technical Field

The present disclosure relates to wafer inspection, and more particularly, to a full-automatic wafer testing apparatus and method.

Background

Currently, wafers refer to the wafers used to fabricate silicon semiconductor circuits, the starting material of which is typically silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished and sliced to form a silicon wafer, i.e., a wafer.

In the wafer manufacturing process, defects may be generated on the wafer surface, and in order to prevent the defective wafer from flowing into the packaging process, the wafer needs to be inspected. Common detection methods include needle contact methods and non-contact methods. The pin contact method is to detect the contact between the contact pin and the wafer surface.

Before the wafer is inspected, the posture of the wafer needs to be adjusted so as to facilitate the subsequent inspection of the wafer. At present, the wafer pre-positioning device determines whether the wafer is positioned accurately by detecting a preset number or notch on the wafer and comparing the number or notch with a pre-stored standard position.

For the related art in the above: on wafers of different specifications or designs, the number may be preset on the front surface of the wafer or on the back surface of the wafer, so that the number on the wafer is inconvenient to detect, and the wafer position is inconvenient to calibrate.

Disclosure of Invention

In order to facilitate calibration of the wafer position, the application provides a full-automatic wafer testing device and method.

The application provides full-automatic wafer testing equipment and method, which adopts the following technical scheme:

a fully automated wafer test apparatus comprising:

the device comprises a case, wherein a partition plate is arranged in the case, and the inside of the case is partitioned into a transfer cavity and a detection cavity by the partition plate;

the bin is arranged on the chassis and is used for storing wafers;

the manipulator is arranged in the transferring cavity and is close to the storage bin, and the manipulator is used for transferring the wafers in the storage bin into the transferring cavity and transferring the wafers in the transferring cavity and the detecting cavity;

the support frame is arranged in the transferring cavity;

the pre-positioning mechanism is arranged on the support frame and far away from the storage bin, the manipulator is used for transferring the wafers in the storage bin to the pre-positioning mechanism, and the pre-positioning mechanism is used for detecting the numbers of the front or back of the wafers and adjusting the positions of the wafers;

the detection mechanism is arranged in the detection cavity and comprises a chuck and a needle clamp, the manipulator is used for transferring the wafer from the transfer cavity to the detection cavity and placing the wafer on the chuck, the needle clamp is used for clamping the needle clamp, and the needle clamp is used for detecting the wafer on the chuck.

Through adopting above-mentioned technical scheme, the manipulator can be with the wafer in the feed bin transport to the prepositioning mechanism on, the prepositioning mechanism can be with the wafer adjustment to appointed position state, again by the manipulator with the wafer on the prepositioning mechanism transport to detection mechanism on, be convenient for detection mechanism detects, and the manipulator can be with the wafer on the detection mechanism transport to the feed bin in store, thereby be favorable to reducing the wafer detection in-process, the part of artifical participation, be convenient for carry out automated inspection to the wafer, and the prepositioning mechanism can detect the serial number on the front or the back of wafer, make the prepositioning mechanism can carry out the prepositioning to the wafer of different specifications or designs, and then be convenient for calibrate the position of wafer.

Optionally, the support frame includes the base plate, the base plate is installed on the machine case and be located transport the intracavity, the through-hole has been seted up on the base plate, pre-positioning mechanism includes drive assembly, sucking disc and camera, drive assembly sets up the base plate is close to one side of machine case bottom, the one end of sucking disc with drive assembly connects, the other end of sucking disc passes the through-hole sets up, the sucking disc is used for adsorbing the wafer, the camera sets up on the base plate, the camera is used for detecting the wafer.

Through adopting above-mentioned technical scheme, when the manipulator is transported the wafer to the sucking disc one side of keeping away from drive assembly, drive assembly can drive the sucking disc and remove for the sucking disc adsorbs the wafer, and the manipulator shrink this moment, camera work discerns the wafer on the sucking disc, thereby according to the recognition result, makes drive assembly pass through sucking disc drive wafer rotation, and then the position state of the accurate adjustment wafer of being convenient for.

Optionally, the drive assembly includes lift driving piece, connecting piece and rotation driving piece, the lift driving piece sets up on the base plate, rotation driving piece passes through the connecting piece with the lift driving piece is connected, the sucking disc is connected the output of rotation driving piece, the lift driving piece is used for the drive rotation driving piece is followed the direction of height of machine case removes, rotation driving piece is used for the drive the sucking disc is coiled the axis of through-hole rotates.

Through adopting above-mentioned technical scheme, lift driving piece can drive connecting piece, rotary driving piece and sucking disc and go up and down along the direction of height of quick-witted case for the sucking disc adsorbs the wafer, and lift driving piece can adjust the interval between wafer and the camera on the sucking disc, and the camera focus of being convenient for, rotary driving piece can drive the wafer through the sucking disc simultaneously and rotate around the axis of through-hole, thereby is convenient for utilize the camera to find the centre of a circle of wafer and the breach on the wafer, and then the serial number on the accurate discernment wafer of camera of being convenient for carries out the prepositioning to the wafer.

Optionally, the camera is provided with a plurality of, and a plurality of the camera sets up the base plate deviates from drive assembly's one side and/or set up the base plate is close to drive assembly's one side, run through on the base plate and seted up the detection mouth, the camera is close to the detection mouth sets up.

Through adopting above-mentioned technical scheme, the quantity and the position of camera can be designed according to actual demand to the serial number to the wafer front or the back of being convenient for discerns.

Optionally, the pre-positioning mechanism further includes a camera driving member, where the camera driving member is connected to the substrate and the camera, and the camera driving member is used to drive the camera to move along a mode perpendicular to the axis of the through hole.

Through adopting above-mentioned technical scheme, the discernment scope of camera can be adjusted to make the camera can discern the wafer of equidimension, and then be favorable to improving the application range of pre-positioning mechanism.

Optionally, the buffer memory mechanism is still included, buffer memory mechanism includes pillar and a plurality of temporary storage board, the support frame is including prealigning the bottom plate, prealigning the bottom plate and installing on the quick-witted case and be located transfer the intracavity, the pillar sets up prealigning the bottom plate deviates from one side of machine case bottom, a plurality of pass through between the temporary storage board the pillar is connected, and a plurality of temporary storage boards are mutual the interval setting.

Through adopting above-mentioned technical scheme, a plurality of temporary storage boards mutually support for provide the buffer memory position to the wafer, thereby be convenient for after the wafer accomplishes the predetermined position, temporarily can not carry out the time of examining, buffer memory wafer.

Optionally, the automatic box opening mechanism further comprises an automatic box opening mechanism, the automatic box opening mechanism comprises a movable plate and a movable plate driving piece connected with the movable plate, a first feeding hole is formed in the case, the first feeding hole is respectively communicated with the transferring cavity and the inside of the storage bin, the movable plate is slidably inserted in the first feeding hole, and the movable plate driving piece is used for driving the movable plate to move along the height direction of the case so as to control the movable plate to block or open the first feeding hole.

Through adopting above-mentioned technical scheme, when needs detect the wafer, fly leaf driving piece drive fly leaf removes for the fly leaf no longer blocks up first feed inlet, thereby in the manipulator of being convenient for passes first feed inlet entering feed bin, transport the wafer in the feed bin to transporting the intracavity, at this moment, the first feed inlet of fly leaf driving piece shutoff makes transporting the intracavity and is in the closed state, and then is favorable to reducing impurity such as external dust and get into the possibility of transporting the intracavity, and is favorable to reducing the wafer in the feed bin and receive exogenic action to fall into transporting the intracavity, make the wafer collide with the equipment of transporting the intracavity, lead to wafer or equipment to take place the possibility of damage.

Optionally, the second feed inlet has been seted up on the division board, the second feed inlet respectively with transport the chamber with detect the chamber intercommunication, be provided with seal assembly in the quick-witted incasement, seal assembly include the closing plate and with the closing plate driving piece that the closing plate is connected, the closing plate with division board sliding connection, the closing plate driving piece is used for the drive the closing plate is followed the direction of height of machine case removes, in order to control the closing plate shutoff or open the second feed inlet.

By adopting the technical scheme, when the movable plate is opened, the sealing plate driving piece drives the sealing plate to seal the second feeding port, so that the detection cavity is in a sealing state, and at the moment, the mechanical arm can only transfer the wafer in the storage bin to the pre-positioning mechanism, and the possibility that impurities such as dust enter the detection cavity and adversely affect the detection structure is reduced;

when the movable plate is closed, after the wafer is positioned in advance, the sealing plate driving part drives the sealing plate to move, so that the sealing plate does not seal the second feed inlet any more, at the moment, the wafer positioned on the pre-positioning mechanism can be transported to the detection mechanism by the manipulator, and when the manipulator is retracted into the transport cavity, the sealing plate driving part drives the sealing plate to seal the second feed inlet, thereby being beneficial to reducing the possibility that external factors influence the detection result, and further being beneficial to improving the detection precision of the wafer.

Optionally, still include needle card change mechanism, the bottom of machine case is provided with four-dimensional platform just four-dimensional platform is located detect the intracavity, needle card change mechanism includes carrier, needle card tray, tray driver and removes the driver, the carrier slides and sets up on the four-dimensional platform, the needle card tray rotates and installs on the carrier, the tray driver set up on the carrier and with needle card tray rotates to be connected, the tray driver is used for the drive needle card tray changes the horizontality by vertical inclination, remove the driver setting on the four-dimensional platform and with the carrier is connected, remove the driver and be used for the drive the carrier removes.

Through adopting above-mentioned technical scheme, remove the driving piece and can be through bearing frame drive needle card tray and remove to the position that is close to needle card tray, tray driving piece can drive needle card tray and change into the horizontality by vertical inclination to be convenient for remove the needle card that needs to be changed to the assigned position, and then be convenient for change the needle card.

A full-automatic wafer testing method, based on the full-automatic wafer testing apparatus of any one of the above, comprising the steps of:

the mechanical arm transfers the wafer in the stock bin to the pre-positioning mechanism;

the preset positioning mechanism detects the number of the front or back of the wafer;

the wafer position is adjusted by a pre-positioning mechanism;

the mechanical arm transfers the wafer on the preset position to a detection mechanism positioned in the detection cavity;

and detecting the wafer.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the mutual matching of the storage bin, the mechanical arm, the support frame, the pre-positioning mechanism and the detection mechanism, the wafers in the storage bin can be sequentially transferred to the pre-positioning mechanism and the detection mechanism by the mechanical arm, so that the wafers can be automatically and accurately detected, and meanwhile, the pre-positioning mechanism can identify the numbers of the front surface or the back surface of the wafers, and further, the positions of the wafers with different specifications or designs can be calibrated;

2. through the mutual matching of the lifting driving piece, the connecting piece, the rotary driving piece, the sucking disc and the camera, the distance between the wafer on the sucking disc and the camera can be adjusted so as to facilitate focusing of the camera, and the sucking disc can drive the wafer to rotate, so that the circle center of the wafer and the notch on the wafer can be conveniently found by using the camera, and the camera can accurately identify the serial number on the wafer so as to pre-position the wafer;

3. the camera driving piece can drive the camera to move along the direction perpendicular to the axis of the through hole, so that the identification range of the camera can be adjusted, and therefore, wafers with different sizes can be conveniently identified by the camera, and the use range of the pre-positioning mechanism can be improved;

4. through the mutually supporting of fly leaf, fly leaf driving piece, closing plate and closing plate driving piece for the manipulator is with the wafer in the feed bin when transporting to the pre-positioning mechanism on, or with the wafer on the pre-positioning mechanism transport to detection mechanism on, and the manipulator withdraws from the back of detecting the intracavity, detects the chamber and is in sealed state, thereby is favorable to reducing the possibility that external factor produced adverse effect to the wafer testing result, and then is favorable to improving the detection precision to the wafer.

Drawings

Fig. 1 is a schematic overall structure of a fully automatic wafer testing apparatus according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a part of an internal structure of a fully automatic wafer testing apparatus according to an embodiment of the present application.

Fig. 3 is a schematic view of a part of an internal structure of a full-automatic wafer testing apparatus according to another view of an embodiment of the present application.

Fig. 4 is a schematic structural view of an automatic box opening mechanism according to an embodiment of the present application.

Fig. 5 is a schematic structural view of a seal assembly according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a manipulator according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a pre-positioning mechanism and a buffering mechanism according to an embodiment of the present application.

Fig. 8 is a schematic structural view of a pre-positioning mechanism according to another view of an embodiment of the present application.

Fig. 9 is a schematic structural diagram of a card changing mechanism, a four-dimensional platform and a detecting mechanism according to an embodiment of the present application.

Fig. 10 is a schematic structural view of a card changing mechanism of the embodiment of the present application.

Reference numerals illustrate:

1. a chassis; 11. a partition plate; 111. a second feed inlet; 12. a transfer chamber; 13. a detection chamber; 14. a first feed port; 15. a seal assembly; 151. a sealing plate; 152. a seal plate driving member; 2. a storage bin; 16. a four-dimensional platform; 3. a manipulator; 31. a manipulator driving member; 32. a fork arm; 321. an extraction opening; 322. an adsorption port; 4. a support frame; 41. a substrate; 411. a through hole; 412. a bottom plate; 4121. a chute; 413. a detection port; 42. a support column; 43. pre-aligning the bottom plate; 5. a pre-positioning mechanism; 51. a drive assembly; 511. a lifting driving member; 512. a connecting piece; 513. a rotary driving member; 52. a suction cup; 53. a camera; 54. a camera driving member; 6. a detection mechanism; 61. a chuck; 62. a chuck driving member; 63. a needle clip clamp; 64. a needle card; 7. an automatic box opening mechanism; 71. a movable plate; 72. a movable plate driving member; 8. a buffer mechanism; 81. a support post; 82. a temporary storage plate; 9. a needle card replacement mechanism; 91. a carrier; 92. a needle card tray; 93. a moving driving member; 94. tray driving member.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-10.

The embodiment of the application discloses full-automatic wafer test equipment.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the invention.

And in the description of this application, a number refers to one or more.

Referring to fig. 1, 2 and 3, a full-automatic wafer testing apparatus includes a casing 1, a bin 2, a robot 3, a support 4, a pre-positioning mechanism 5 and a detecting mechanism 6. Wherein, the inside of the case 1 is fixedly connected with a partition plate 11, and the partition plate 11 divides the inside of the case 1 into a transferring cavity 12 and a detecting cavity 13. The feed bin 2 fixed mounting is in the outside of quick-witted case 1, and is close to the transportation chamber 12 setting, and feed bin 2 is used for storing the wafer. The manipulator 3 and the support frame 4 are respectively and fixedly installed in the transferring cavity 12, the manipulator 3 is close to the storage bin 2, and the support frame 4 is far away from the storage bin 2. The pre-positioning mechanism 5 is mounted on the support frame 4, so that the manipulator 3 can transfer the wafers in the bin 2 onto the pre-positioning mechanism 5, and the pre-positioning mechanism 5 is convenient for pre-positioning the wafers. The detection mechanism 6 is arranged in the detection cavity 13, and the manipulator 3 can transfer the wafer on the pre-positioning mechanism 5 to the detection mechanism 6, so that the detection mechanism 6 can conveniently detect the wafer.

Referring to fig. 2, a first feed inlet 14 is formed in the case 1, and the first feed inlet 14 is respectively communicated with the transfer cavity 12 and the interior of the storage bin 2.

Referring to fig. 2, 3 and 4, a full-automatic wafer test apparatus further includes an automatic unpacking mechanism 7, a buffer mechanism 8 and a needle card replacing mechanism 9. The automatic box opening mechanism 7 includes a movable plate 71 and a movable plate driving member 72 connected to the movable plate 71. The movable plate 71 is slidably inserted into the first feed port 14, and the movable plate 71 can block the first feed port 14, so that the transfer cavity 12 is in a closed state.

The movable plate driving member 72 is fixedly installed on the inner wall of the transferring cavity 12, which is close to the storage bin 2, in this embodiment, the movable plate driving member 72 is an air cylinder, and the movable plate driving member 72 is used for driving the movable plate 71 to move vertically so as to control the movable plate 71 to block or open the first feed inlet 14.

Referring to fig. 2 and 4, when the wafer in the bin 2 needs to be transferred to the pre-positioning mechanism 5, the movable plate driving member 72 drives the movable plate 71 to move towards the bottom of the chassis 1, so that the movable plate 71 does not block the first feed inlet 14 any more, and the manipulator 3 is convenient to transfer the wafer in the bin 2 to the pre-positioning mechanism 5.

Referring to fig. 2, 3 and 5, the partition plate 11 is provided with a second inlet 111, and the second inlet 111 is respectively communicated with the transfer chamber 12 and the detection chamber 13. A seal assembly 15 is provided in the cabinet 1, and the seal assembly 15 includes a seal plate 151 and a seal plate driver 152 connected to the seal plate 151. The sealing plate 151 is slidably connected with the partition plate 11, and the sealing plate 151 can seal the second feed inlet 111, so that the transfer cavity 12 or the detection cavity 13 is in a closed state.

The seal plate driving member 152 is fixedly mounted on the partition plate 11, and the seal plate driving member 152 is an air cylinder in this embodiment. The sealing plate driving piece 152 can drive the sealing plate 151 to move vertically and drive the sealing plate 151 to move towards or away from the detection cavity 13 so as to control the sealing plate 151 to block or open the second feed inlet 111.

Referring to fig. 2, 3 and 5, when the wafer in the transfer chamber 12 needs to be transferred into the inspection chamber 13, the sealing plate driving member 152 drives the sealing plate 151 to move toward the bottom of the chassis 1, so that the sealing plate 151 no longer blocks the second feed port 111, and the manipulator 3 is convenient to transfer the wafer with the predetermined position onto the inspection mechanism 6.

Referring to fig. 6, the robot 3 includes a robot driver 31 and a fork 32 connected to the robot driver 31. In this embodiment, two fork arms 32 are provided, and the two fork arms 32 are parallel and spaced apart in the vertical direction. The fork arm 32 is provided with an extraction opening 321 and a plurality of adsorption openings 322 respectively, and the fork arm 32 is also provided with an air passage, and the extraction opening 321 is communicated with the adsorption openings 322 through the air passage.

In this embodiment, the two fork arms 32 are driven by two independent driving motors. When the fork arm 32 moves to the lower part of the wafer, the driving motor works, so that air flows from the adsorption port 322 to the extraction port 321, and the adsorption port 322 adsorbs the wafer, so that the wafer is fixed on the fork arm 32, and the fork arm 32 is convenient to drive the wafer to move.

Referring to fig. 3 and 6, the manipulator driving part 31 can drive the fork arm 32 to lift in the vertical direction and can drive the fork arm 32 to rotate in the horizontal direction, and the manipulator driving part 31 can also drive the fork arm 32 to stretch and retract in the horizontal direction, so that the movement of wafers is conveniently carried out between the driving fork arm 32 and the storage bin 2, between the transfer cavity 12 and the pre-positioning mechanism 5, between the transfer cavity 12 and the detection cavity 13 and between the detection cavity 13 and the detection mechanism 6.

Referring to fig. 2 and 7, the support frame 4 includes a base 41, a support column 42 and a pre-alignment bottom plate 43, where the pre-alignment bottom plate 43 is fixedly installed in the chassis 1 and located in the transfer cavity 12, and in this embodiment, the pre-alignment bottom plate 43 is horizontally disposed.

The support column 42 is fixedly connected to the side of the prealigned bottom plate 43 near the bottom of the cabinet 1. In this embodiment, four support columns 42 are provided, and the four support columns 42 are distributed in a rectangular array on a pre-alignment base plate 43.

The substrate 41 is disposed parallel to the pre-alignment base plate 43, and the substrate 41 is fixedly connected to one end of the support columns 42 away from the pre-alignment base plate 43, so that the four support columns 42 can stably support the substrate 41, so that the relative positions of the substrate 41 and the pre-alignment base plate 43 are fixed.

Referring to fig. 7 and 8, a through hole 411 is opened at a central position of the substrate 41, and an axis of the through hole 411 is parallel to a length direction of the support column 42. A bottom plate 412 is fixedly connected to one side of the base plate 41 away from the support columns 42, and a chute 4121 is vertically and penetratingly formed in the bottom plate 412.

Referring to fig. 2 and 7, the pre-positioning mechanism 5 includes a driving assembly 51, a suction cup 52, a camera 53, and a camera driver 54. Wherein the driving assembly 51 is disposed at a side of the base plate 41 near the bottom of the chassis 1. The driving assembly 51 includes a lifting driving member 511, a connecting member 512 and a rotating driving member 513, wherein the lifting driving member 511 is fixedly connected to an end of the bottom plate 412 away from the substrate 41.

The lifting drive 511 in this embodiment comprises a closed loop stepper motor and a screw. Wherein, closed loop step motor fixed connection is at the one end that base plate 412 kept away from base plate 41, and the one end and the output fixed connection of closed loop step motor of lead screw, the other end and the base plate 41 rotation of lead screw are connected, and the lead screw is vertical to be set up.

Referring to fig. 7 and 8, one end of the connecting member 512 passes through the sliding groove 4121 to be in threaded connection with the screw rod, and the other end of the connecting member 512 is fixedly connected with the rotary driving member 513, so that when the closed-loop stepping motor drives the screw rod to rotate, the connecting member 512 can move along the axial direction of the screw rod, and the rotary driving member 513 is conveniently driven to lift.

Referring to fig. 7, one end of the suction cup 52 is fixedly connected to the output end of the rotation driving member 513, the other end of the suction cup 52 extends out of the through hole 411 to a side of the substrate 41 near the pre-alignment base plate 43, and the axis of the suction cup 52 coincides with the axis of the through hole 411.

In this embodiment, the rotation driving member 513 is a closed-loop hollow shaft stepper motor, so that the rotation driving member 513 can drive the suction cup 52 to rotate around the axis of the through hole 411.

When the fork arm 32 drives the wafer to move above the chuck 52, the closed-loop stepper motor drives the screw rod to rotate, so that the chuck 52 is driven to move upwards through the connecting piece 512 and the rotary driving piece 513, and the chuck 52 is attached to the wafer. At this time, the chuck 52 suctions the wafer, and the fork arms 32 no longer suctions the wafer, thereby transferring the wafer to the pre-positioning mechanism 5.

Referring to fig. 7, the cameras 53 are provided in several numbers, in this embodiment, one or two cameras 53 may be provided according to the needs of the customer, and the positions of the cameras 53 may also be designed according to the needs of the customer.

The substrate 41 is provided with a detection port 413, the detection port 413 can be provided according to the number and positions of the cameras 53, and the cameras 53 are provided near the detection port 413. The detection port 413 is provided in an elliptical shape in this embodiment.

When the camera 53 is provided with one and the camera 53 is provided on the side of the substrate 41 facing away from the support columns 42, the camera 53 can recognize the number of the front surface of the wafer sucked on the suction cup 52. When the camera 53 is provided with one and the camera 53 is provided on the side of the substrate 41 close to the support column 42, the camera 53 can recognize the number of the back surface of the wafer sucked on the suction cup 52 through the detection port 413.

Referring to fig. 7, when two cameras 53 are provided in the present embodiment, one of the two cameras 53 is provided on the side of the substrate 41 facing away from the support column 42, and the other camera 53 is provided on the side of the substrate 41 facing the support column 42. At this time, the two cameras 53 are engaged with each other, and the numbers of the front and rear surfaces of the wafer can be identified at the same time.

Referring to fig. 7, when the camera 53 is located on the side of the substrate 41 facing away from the support post 42, the camera driver 54 fixedly mounts the side of the substrate 41 facing away from the support post 42; when the camera 53 is positioned on the side of the substrate 41 adjacent to the support column 42, the camera driver 54 is fixedly mounted on the side of the pre-alignment base plate 43 adjacent to the support column 42.

In this embodiment, the camera driving member 54 is an air cylinder, and the camera 53 is fixedly connected with the output end of the camera driving member 54, so that the camera driving member 54 can drive the camera 53 to move along the axial direction perpendicular to the through hole 411, so that the camera 53 is close to or far away from the through hole 411, and the position of the wafer identified by the camera 53 can be conveniently adjusted, so that the camera 53 can identify wafers with different sizes.

The position adjustment of the camera 53 in this embodiment can identify 8-inch and 12-inch wafers.

Referring to fig. 2 and 7, when a wafer needs to be pre-positioned, the camera 53 is first adjusted to a designated position by the camera driver 54 according to the size of the wafer. And then the wafer is transferred onto the sucker 52 by the manipulator 3, so that the sucker 52 adsorbs the wafer.

Then, the closed-loop stepper motor is started to drive the screw rod to rotate so as to vertically adjust the positions of the connecting piece 512, the rotary driving piece 513, the sucker 52 and the wafer, thereby facilitating focusing of the camera 53. The rotary driving member 513 is then started, so that the chuck 52 drives the wafer to rotate, and the camera 53 is convenient to collect the edge points of the wafer, so as to determine the center of the wafer. And the camera 53 is used to find the notch position on the wafer.

Finally, the rotation driving member 513 is stopped, so that the camera 53 can conveniently identify the serial numbers on the wafer, and the wafer is adjusted to the designated position, so that the wafer is pre-positioned.

Referring to fig. 7, the buffer mechanism 8 includes a pillar 81 and a plurality of temporary storage plates 82. Wherein, the pillar 81 is provided with a plurality of, a plurality of pillars 81 are distributed in rectangular array. The temporary storage plates 82 and the pre-alignment bottom plate 43 are connected through the support posts 81, so that the temporary storage plates 82 are arranged at intervals, and the temporary storage plates 82 and the pre-alignment bottom plate 43 are also arranged at intervals.

The temporary storage plates 82 in the same group are vertically and uniformly distributed and mutually parallel, the two temporary storage plates 82 are arranged in one-to-one correspondence, and the two temporary storage plates 82 corresponding to each other are positioned in the same plane.

In this embodiment, there is a mutual space between two temporary storage plates 82 located in the same plane, so that the fork arm 32 is convenient for transferring the wafer onto the temporary storage plates 82 for buffering.

Referring to fig. 3 and 9, a four-dimensional platform 16 is disposed at the bottom of the cabinet 1, and the four-dimensional platform 16 is located in the detection chamber 13.

Referring to fig. 3 and 9, the detection mechanism 6 includes a chuck 61, a chuck driving member 62, and a needle clamp 63. Wherein, chuck driving piece 62 is installed on four-dimensional platform 16, needle card anchor 63 is installed at the top of machine case 1, and needle card anchor 63 is located in detection chamber 13.

Referring to fig. 2, 3 and 9, a chuck 61 is used to carry a wafer, and the chuck 61 is connected to a chuck driver 62. In this embodiment, the chuck driving member 62 is used to drive the chuck 61 to move on the four-dimensional platform 16, so that the chuck 61 is close to the needle clamping fixture 63 or the second feeding port 111, so that the manipulator 3 is convenient to transfer the wafer with the pre-positioned wafer onto the chuck 61 through the second feeding port 111, and the chuck 61 is convenient to drive the wafer to move to a position close to the needle clamping fixture 63.

The pin clamp 63 is used to clamp the pin 64, thereby facilitating the inspection of the wafer with the pin 64. The pin card 64 in this embodiment is a wafer probe card, thereby facilitating wafer inspection.

Referring to fig. 9 and 10, the card changing mechanism 9 includes a carrier 91, a card tray 92, a movement drive 93, and a tray drive 94. The carrier 91 is slidably mounted on the four-dimensional platform 16, and the moving driving member 93 is fixedly mounted on the four-dimensional platform 16 and connected to the carrier 91.

A card tray 92 is rotatably mounted to the end of the carrier 91 remote from the four-dimensional platform 16, the card tray 92 being adapted to carry the cards 64. In this embodiment, the moving driving member 93 is an air cylinder, so that the moving driving member 93 can drive the carrier 91 to move on the four-dimensional platform 16, so that the carrier 91 drives the card tray 92 to move in a direction approaching the card holder 63.

Referring to fig. 10, the tray driving member 94 in this embodiment is also a cylinder. The tray driving member 94 is fixedly installed on the carrier 91, and an output end of the tray driving member 94 is rotatably connected with the card tray 92, so that the tray driving member 94 can drive the card tray 92 to be changed from a vertical inclined state to a horizontal state.

Referring to fig. 3 and 10, when a card 64 needs to be replaced, the old card 64 is first removed from the card holder 63 and the tray driving member 94 is activated to drive the card tray 92 to a horizontal state. A new card 64 is placed on card tray 92 and movement drive 93 is activated to drive carrier 91 and card tray 92 to a position adjacent card holder 63. The position of the needle card 64 on the needle card tray 92 corresponds to the mounting position of the needle card 64 on the needle card holder 63, so that a new needle card 64 is placed on the needle card holder 63, and is clamped and fixed by the needle card holder 63, thereby completing the replacement of the needle card 64.

The implementation principle of the full-automatic wafer testing equipment provided by the embodiment of the application is as follows: when the wafer needs to be detected, the movable plate 71 is opened first, the wafer in the bin 2 is transported to the upper part of the sucker 52 by the manipulator 3, and the wafer is adsorbed and fixed by the sucker 52. At this time, the movable plate 71 closes the first feed port 14. The closed loop stepper motor is then activated to vertically adjust the position of the link 512, the rotary drive 513, the chuck 52 and the wafer for focusing by the camera 53.

Then, the rotation driving member 513 is started to drive the chuck 52 to rotate the wafer, so that the camera 53 can find the center of the circle on the wafer and the position of the notch on the wafer. The rotation driving part 513 is stopped again, so that the camera 53 recognizes the number on the wafer, and thus the wafer is adjusted to a designated position. The sealing plate 151 is opened, the chuck 61 is driven to a position close to the second feed port 111 by the chuck driving member 62, and the wafer on the chuck 52 is removed by the robot arm 3 and transferred to the chuck 61 through the second feed port 111. At this time, the sealing plate 151 closes the second feed port 111.

Finally, the chuck 61 is driven to a position close to the needle holder 63 by the chuck driving member 62, and the wafer is brought into contact with the needle holder 64, thereby completing the inspection of the wafer. The chuck 61 is driven to a position close to the second feed port 111 by the chuck driving member 62, the sealing plate 151 is opened, and the wafer on the chuck 61 is transferred into the rotary transfer chamber 12 by the robot arm 3 and transferred from the transfer chamber 12 to the storage bin 2 for storage.

The embodiment of the application also discloses a full-automatic wafer testing method, which comprises the following steps:

the movable plate 71 is driven by the movable plate driving piece 72 to not block the first feed inlet 14 any more;

starting the manipulator driving piece 31, driving the fork arm 32 to move upwards to a position close to the first feed inlet 14, and driving the fork arm 32 to extend to the bin 2 for adsorbing the wafer;

the manipulator driving piece 31 drives the fork arm 32 to retract into the transferring cavity 12 and drives the wafer to rotate to a position close to the sucker 52, and drives the fork arm 32 to extend so as to transfer the wafer to the position above the sucker 52;

the lifting driving part 511 drives the sucker 52 to lift and adsorb the wafer, meanwhile, the manipulator driving part 31 drives the fork arm 32 to shrink, and then the lifting driving part 511 drives the sucker 52 to drive the wafer to lift so as to facilitate focusing of the camera 53;

the rotary driving piece 513 drives the sucker 52 to drive the wafer to rotate so that the camera 53 can find out the circle center of the wafer and the notch on the wafer;

stopping the rotation driving part 513, so that the camera 53 can identify the serial numbers of the front or back of the wafer, starting the rotation driving part 513, and correspondingly adjusting the position of the wafer to finish the wafer pre-positioning;

the manipulator driving piece 31 drives the fork arm 32 to extend, the wafer is taken down from the sucker 52, and the wafer is driven to rotate to a position close to the second feed port 111;

the sealing plate 151 is driven by the sealing plate driving member 152 to no longer block the second feeding port 111, and simultaneously the chuck driving member 62 drives the chuck 61 to move to a position close to the second feeding port 111;

the manipulator driving piece 31 drives the fork arms 32 to extend so as to transfer the wafer to the chuck 61, drives the fork arms 32 to retract into the transfer cavity 12, and drives the sealing plate 151 to seal the second feed port 111 by the sealing plate driving piece 152;

the chuck driving member 62 drives the chuck 61 to move to a position close to the needle card 64 and makes the wafer collide with the needle card 64 so as to facilitate the needle card 64 to detect the wafer;

the chuck driving part 62 drives the chuck 61 to move to a position close to the second feeding hole 111 again, and the sealing plate 151 is driven by the sealing plate driving part 152 to not block the second feeding hole 111 any more;

the manipulator driving piece 31 drives the fork arm 32 to extend so as to take the wafer off the chuck 61 and transfer the wafer into the bin 2 for storage through the transfer cavity 12;

and finishing automatic detection of the wafer.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. A fully automated wafer test apparatus, comprising:

the device comprises a case (1), wherein a partition plate (11) is arranged in the case (1), and the partition plate (11) divides the interior of the case (1) into a transfer cavity (12) and a detection cavity (13);

the bin (2) is arranged on the case (1), and the bin (2) is used for storing wafers;

the manipulator (3) is arranged in the transferring cavity (12) and is close to the storage bin (2), and the manipulator (3) is used for transferring the wafer in the storage bin (2) into the transferring cavity (12) and transferring the wafer in the transferring cavity (12) and the detecting cavity (13);

the support frame (4) is arranged in the transferring cavity (12);

the pre-positioning mechanism (5) is arranged on the supporting frame (4) and far away from the storage bin (2), the manipulator (3) is used for transferring the wafer in the storage bin (2) to the pre-positioning mechanism (5), and the pre-positioning mechanism (5) is used for detecting the number of the front surface or the back surface of the wafer and adjusting the position of the wafer;

detection mechanism (6) is in detection chamber (13), detection mechanism (6) include chuck (61) and needle card anchor clamps (63), manipulator (3) are used for with the wafer follow transport chamber (12) transport extremely in detection chamber (13), and place the wafer on chuck (61), needle card anchor clamps (63) are used for centre gripping needle card (64), needle card (64) are used for detecting the wafer on chuck (61).

2. The fully automated wafer test equipment of claim 1, wherein: the support frame (4) comprises a base plate (41), the base plate (41) is installed on the machine case (1) and is located in the transferring cavity (12), through holes (411) are formed in the base plate (41), the pre-positioning mechanism (5) comprises a driving component (51), a sucker (52) and a camera (53), the driving component (51) is arranged on one side, close to the bottom of the machine case (1), of the base plate (41), one end of the sucker (52) is connected with the driving component (51), the other end of the sucker (52) penetrates through the through holes (411), the sucker (52) is used for adsorbing a wafer, the camera (53) is arranged on the base plate (41), and the camera (53) is used for detecting the wafer.

3. The fully automated wafer test equipment of claim 2, wherein: the driving assembly (51) comprises a lifting driving piece (511), a connecting piece (512) and a rotating driving piece (513), wherein the lifting driving piece (511) is arranged on the substrate (41), the rotating driving piece (513) is connected with the lifting driving piece (511) through the connecting piece (512), the sucker (52) is connected with the output end of the rotating driving piece (513), the lifting driving piece (511) is used for driving the rotating driving piece (513) to move along the height direction of the chassis (1), and the rotating driving piece (513) is used for driving the sucker (52) to rotate around the axis of the through hole (411).

4. The fully automated wafer test equipment of claim 2, wherein: the camera (53) is provided with a plurality of, and a plurality of camera (53) are in base plate (41) deviate from one side of drive assembly (51) and/or set up base plate (41) are close to one side of drive assembly (51), run through on base plate (41) and have seted up detection mouth (413), camera (53) are close to detection mouth (413) setting.

5. The fully automated wafer test equipment of claim 2, wherein: the pre-positioning mechanism (5) further comprises a camera driving piece (54), the camera driving piece (54) is respectively connected with the base plate (41) and the camera (53), and the camera driving piece (54) is used for driving the camera (53) to move along the mode perpendicular to the axis of the through hole (411).

6. The fully automated wafer test equipment of claim 1, wherein: still include buffer gear (8), buffer gear (8) include pillar (81) and a plurality of board (82) of keeping in, support frame (4) are including prealigning bottom plate (43), prealigning bottom plate (43) are installed on quick-witted case (1) and are located in transferring chamber (12), pillar (81) set up prealigning bottom plate (43) deviate from one side of machine case (1) bottom, a plurality of pass through between board (82) of keeping in pillar (81) are connected, and a plurality of board (82) of keeping in are mutual interval setting.

7. The fully automated wafer test equipment of claim 1, wherein: still include automatic unpacking mechanism (7), automatic unpacking mechanism (7) include fly leaf (71) and with fly leaf driving piece (72) that fly leaf (71) are connected, first feed inlet (14) have been seted up on quick-witted case (1), first feed inlet (14) respectively with transfer chamber (12) with feed bin (2) inside intercommunication, fly leaf (71) slip is inserted and is established in first feed inlet (14), fly leaf driving piece (72) are used for the drive fly leaf (71) are followed the direction of height of machine case (1) removes, in order to control fly leaf (71) shutoff or open first feed inlet (14).

8. The fully automated wafer test equipment of claim 7, wherein: the utility model discloses a sealing device for the high-pressure gas turbine, including baffle (11), baffle (11) are last to have seted up second feed inlet (111), second feed inlet (111) respectively with transfer chamber (12) with detect chamber (13) intercommunication, be provided with seal assembly (15) in quick-witted case (1), seal assembly (15) include closing plate (151) and with closing plate driving piece (152) that closing plate (151) are connected, closing plate (151) with baffle (11) sliding connection, closing plate driving piece (152) are used for the drive closing plate (151) are followed the direction of height of machine case (1) is removed, in order to control closing plate (151) shutoff or opening second feed inlet (111).

9. The fully automated wafer test equipment of claim 1, wherein: still include needle card change mechanism (9), the bottom of machine case (1) is provided with four-dimensional platform (16) just four-dimensional platform (16) are located in detection chamber (13), needle card change mechanism (9) are including carrier (91), needle card tray (92), tray driver (94) and remove driver (93), carrier (91) slide and set up on four-dimensional platform (16), needle card tray (92) rotate and install on carrier (91), tray driver (94) set up on carrier (91) and with needle card tray (92) rotate and connect, tray driver (94) are used for the drive needle card tray (92) are changed into the horizontality by vertical inclination, remove driver (93) set up on four-dimensional platform (16) and with carrier (91) are connected, remove driver (93) are used for the drive carrier (91) remove.

10. A fully automatic wafer testing method based on the fully automatic wafer testing apparatus of any one of claims 1-9, comprising the steps of:

the mechanical arm (3) transfers the wafers in the bin (2) to the pre-positioning mechanism (5);

the pre-positioning mechanism (5) detects the number of the front surface or the back surface of the wafer;

the pre-positioning mechanism (5) adjusts the position of the wafer;

the mechanical arm (3) transfers the wafer on the preset position to a detection mechanism (6) positioned in a detection cavity (13);

and detecting the wafer.