CN116577626A - Micro-display chip detection system, detection method, detection device, detection equipment and storage medium - Google Patents
Micro-display chip detection system, detection method, detection device, detection equipment and storage medium Download PDFInfo
- Publication number
- CN116577626A CN116577626A CN202310694848.8A CN202310694848A CN116577626A CN 116577626 A CN116577626 A CN 116577626A CN 202310694848 A CN202310694848 A CN 202310694848A CN 116577626 A CN116577626 A CN 116577626A
- Authority
- CN
- China
- Prior art keywords
- chip
- electric displacement
- positioning
- displacement table
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 125
- 238000006073 displacement reaction Methods 0.000 claims abstract description 203
- 238000012360 testing method Methods 0.000 claims description 30
- 230000015654 memory Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 238000004590 computer program Methods 0.000 claims description 12
- 230000000630 rising effect Effects 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
Abstract
The application provides a micro-display chip detection system, a detection method, a detection device, equipment and a storage medium; the micro display chip detection system includes: the chip bearing and displacement mechanism and the chip positioning and detecting mechanism; the chip positioning and detecting mechanism is arranged above the chip bearing and displacement mechanism; the chip bearing and displacement mechanism comprises: the chip carrier is used for placing and fixing the chip; the R-direction adjusting table is connected below the chip carrier; the XY direction fine adjustment mechanism is connected below the R direction adjustment table; the Z-direction electric displacement table is connected below the XY-direction fine adjustment mechanism; the Y-direction electric displacement platform is connected below the Z-direction electric displacement platform; the chip positioning and detecting mechanism comprises: positioning camera, range sensor, detect needle card, detect camera, X to electronic displacement platform. The application can improve the detection efficiency of the micro display chip and reduce the risk of damaging the wafer by manual operation.
Description
Technical Field
The application relates to the technical field of semiconductor detection equipment, in particular to a micro-display chip detection system, a detection method, a detection device, a detection equipment and a storage medium.
Background
The micro display chip needs to detect the electrical property and the optical property before packaging, screens out defective products, and only packages qualified products, thereby saving the packaging cost. At present, the micro display chip is detected by placing the whole wafer before dicing on a detection mechanism and then detecting a single micro display chip. The existing detection method cannot realize the independent detection or the sampling detection of a single micro-display chip formed after wafer dicing.
In the prior art, a pure manual detection table is mainly adopted for detecting a single micro-display chip, and the pure manual detection table has the advantages of high detection time cost, low efficiency and poor stability. And because of being purely manual operation, there is the risk of damaging the wafer due to improper operation or the like in the detection process.
Disclosure of Invention
In order to solve at least one technical problem in the prior art, embodiments of the present application provide a micro-display chip detection system, a detection method, a detection device, a detection apparatus, and a storage medium, so as to improve the detection efficiency of a micro-display chip and reduce the risk of damaging a wafer by manual operation. In order to achieve the technical purpose, the technical scheme adopted by the embodiment of the application is as follows:
in a first aspect, an embodiment of the present application provides a micro display chip detection system, including: the chip bearing and displacement mechanism and the chip positioning and detecting mechanism; the chip positioning and detecting mechanism is arranged above the chip bearing and displacement mechanism;
the chip bearing and displacement mechanism comprises:
the chip carrier is used for placing and fixing the chip;
the R-direction adjusting table is connected below the chip carrier and used for adjusting the R-direction angle of the chip placed on the chip carrier;
the XY direction fine adjustment mechanism is connected below the R direction adjustment table and is used for carrying out position fine adjustment on a chip placed on the chip carrier in the X direction and/or the Y direction;
the Z-direction electric displacement table is connected below the XY-direction fine adjustment mechanism and is used for driving a chip placed on the chip carrier to displace in the Z direction;
the Y-direction electric displacement platform is connected below the Z-direction electric displacement platform and is used for driving a chip placed on the chip carrier to displace in the Y direction;
the chip positioning and detecting mechanism comprises:
the positioning camera is used for shooting a positioning image of the chip;
the ranging sensor is used for measuring and obtaining a Z-direction positioning position reference of the chip when the chip descends in place;
the detection needle card is used for contacting with a test point on the chip when the chip rises in place and providing a test signal for the chip through the test point;
the detection camera is used for shooting a display image during chip testing;
and the X-direction electric displacement table is used for installing and driving the positioning camera, the ranging sensor, the detection needle card and the detection camera to displace in the X direction.
Further, in the Y direction, the detection needle is clamped in the range of the optical path of the lens of the positioning camera.
Further, the XY direction fine adjustment mechanism comprises an X direction manual fine adjustment table and a Y direction manual fine adjustment table; the X-direction manual fine adjustment table is arranged on the Z-direction electric displacement table lifting block, the middle carrier plate is connected above the X-direction manual fine adjustment table, and the Y-direction manual fine adjustment table is arranged on the middle carrier plate.
Further, a chip positioning groove is formed in the chip carrier.
Further, a vacuum adsorption channel is arranged at the bottom of the chip positioning groove of the chip carrier.
Further, the positioning camera is arranged on the first manual displacement table along the Y direction; the first manual displacement table is connected with the sliding block of the X-direction electric displacement table through the loading plate.
Further, the detection camera is arranged on a second manual displacement table along the Y direction; the second manual displacement table is connected with the sliding block of the X-direction electric displacement table through the loading plate.
Furthermore, the detection needle card is connected to the lower end of the second manual displacement table and is positioned below the lens of the detection camera.
In a second aspect, an embodiment of the present application provides a method for detecting a micro display chip, which is applicable to the detection system as described above, including the following steps:
a step of calibration, comprising:
controlling the Y-direction electric displacement platform and the X-direction electric displacement platform to respectively move to proper positions so that a chip on the chip carrier is positioned below the detection needle card; after the chip is adjusted in place in the R direction through the R-direction adjusting table and/or is finely adjusted in place in the X direction and/or the Y direction through the XY-direction fine adjusting mechanism, the Z-direction electric displacement table is driven to ascend in place, so that a test point on the chip is contacted with the detection needle card, and the chip is lightened;
recording the position of the Y-direction electric displacement table, the position of the X-direction electric displacement table and the position of the Z-direction electric displacement table as a Y-direction electric displacement table forward in-place reference, an X-direction electric displacement table forward in-place reference and a Z-direction electric displacement table upward in-place reference respectively;
controlling the Z-direction electric displacement platform to drive the chip to descend to a proper position, and then controlling the positioning camera to move to the position above the chip;
acquiring a positioning image of a chip and identifying a positioning mark in the positioning image;
setting a chip X-direction positioning position reference and a chip Y-direction positioning position reference according to the positioning mark;
controlling the X-direction electric displacement table to move by a preset interval so that the distance measuring sensor moves to the position right above the chip;
acquiring height data measured by a ranging sensor as a Z-direction positioning position reference of a chip;
controlling the Y-direction electric displacement platform and the X-direction electric displacement platform to retract to the positions;
the detecting step comprises the following steps:
after the chip to be tested is placed on the chip carrier and fixed, controlling the X-direction electric displacement table and the Y-direction electric displacement table to respectively move for a fixed distance, and conveying the chip to be tested to the position below the positioning camera;
acquiring a positioning image of a chip to be detected, identifying a positioning mark in the positioning image, acquiring the real-time X-direction position and the real-time Y-direction position of the chip, and calculating the compensation value of the X-direction and/or the Y-direction position of the chip according to the real-time X-direction position and the real-time Y-direction position of the chip, the reference of the X-direction positioning position and the reference of the Y-direction positioning position of the chip;
controlling the X-direction electric displacement table to move by a preset distance to enable the distance measuring sensor to move to the position right above the chip to be measured, acquiring height data measured by the distance measuring sensor as a real-time Z-direction height position of the chip, and calculating a Z-direction position compensation value of the chip according to the real-time Z-direction height position of the chip and a Z-direction positioning position reference of the chip;
the X-direction electric displacement table is controlled to move into position by the X-direction electric displacement table advancing in-position reference and the X-direction position compensation value, and the Y-direction electric displacement table is controlled to move into position by the Y-direction electric displacement table advancing in-position reference and the Y-direction position compensation value, so that the detection needle card and the detection camera are conveyed to the position above the chip to be detected;
the Z-direction electric displacement table is controlled to rise to the proper position by the Z-direction electric displacement table rising to the proper position reference and the Z-direction position compensation value, so that the chip to be detected is contacted with the detection needle card to be lightened;
and obtaining a detection image of the chip to be detected.
In a third aspect, an embodiment of the present application provides a detection apparatus for a micro display chip, including:
a calibration module, comprising:
the first control unit is used for controlling the Y-direction electric displacement platform and the X-direction electric displacement platform to respectively move to proper positions so that a chip on the chip carrier is positioned below the detection needle card; after the chip is adjusted in place in the R direction through the R-direction adjusting table and/or is finely adjusted in place in the X direction and/or the Y direction through the XY-direction fine adjusting mechanism, the Z-direction electric displacement table is driven to ascend in place, so that a test point on the chip is contacted with the detection needle card, and the chip is lightened;
a first reference setting unit for recording the position of the Y-direction electric displacement table, the position of the X-direction electric displacement table and the position of the Z-direction electric displacement table as a Y-direction electric displacement table forward in-place reference, an X-direction electric displacement table forward in-place reference and a Z-direction electric displacement table upward in-place reference respectively;
the second control unit is used for controlling the Z-direction electric displacement platform to drive the chip to descend to the position and then controlling the positioning camera to move to the position above the chip;
the first image acquisition and identification unit is used for acquiring a positioning image of the chip and identifying positioning marks in the positioning image;
the second reference setting unit is used for setting a chip X-direction positioning position reference and a chip Y-direction positioning position reference according to the positioning mark;
the third control unit is used for controlling the X-direction electric displacement table to move by a preset interval so that the ranging sensor moves to the position right above the chip;
the third reference setting unit is used for acquiring the height data measured by the ranging sensor as a Z-direction positioning position reference of the chip; the method comprises the steps of carrying out a first treatment on the surface of the
The fourth control unit is used for controlling the Y-direction electric displacement table and the X-direction electric displacement table to retract to the right;
a detection module, comprising:
the fifth control unit is used for controlling the X-direction electric displacement table and the Y-direction electric displacement table to respectively move a fixed distance after the chip to be tested is placed on the chip carrier and fixed, and conveying the chip to be tested to the position below the positioning camera;
the first compensation value calculating unit is used for acquiring a positioning image of the chip to be detected, identifying a positioning mark in the positioning image, acquiring the real-time X-direction position and the real-time Y-direction position of the chip, and calculating the compensation value of the X-direction and/or the Y-direction position of the chip according to the real-time X-direction position and the real-time Y-direction position of the chip, the reference of the X-direction positioning position and the reference of the Y-direction positioning position of the chip;
the second compensation value calculation unit is used for controlling the X-direction electric displacement table to move by a preset distance, so that the ranging sensor moves to the position right above the chip to be measured, acquiring the height data measured by the ranging sensor as the real-time Z-direction height position of the chip, and calculating the Z-direction position compensation value of the chip according to the real-time Z-direction height position of the chip and the Z-direction positioning position reference of the chip;
the sixth control unit is used for controlling the X-direction electric displacement platform to move into position according to the X-direction electric displacement platform advancing reference and the X-direction position compensation value, controlling the Y-direction electric displacement platform to move into position according to the Y-direction electric displacement platform advancing reference and the Y-direction position compensation value, and conveying the detection needle card and the detection camera to the position above the chip to be detected;
the seventh control unit is used for controlling the Z-direction electric displacement platform to rise to the proper position according to the Z-direction electric displacement platform rising reference and the Z-direction position compensation value so as to enable the chip to be detected to be in contact with the detection needle card and be lightened;
and the detection image acquisition unit is used for acquiring a detection image of the chip to be detected.
In a fourth aspect, an embodiment of the present application provides a detection apparatus for a micro display chip, including:
a memory storing a computer program;
a processor for running the computer program, which computer program when running performs the steps of the method as described above.
In a fifth aspect, embodiments of the present application provide a storage medium having stored therein a computer program configured to perform, when run, the steps of the method as described above.
The technical scheme provided by the embodiment of the application has the beneficial effects that:
1. the detection system has reasonable structure and good flexibility, and can detect the cut single micro display chip independently.
2. Once calibration is completed, automatic control of the single micro-display chip to be detected is realized, and compared with a purely manual test bench, the risk of damaging the single micro-display chip is greatly reduced.
3. The degree of automation is high, has improved detection efficiency.
Drawings
FIG. 1 is a schematic diagram of a micro-display chip detection system according to an embodiment of the application.
FIG. 2a is a flowchart illustrating calibration steps in a method for detecting a micro-display chip according to an embodiment of the application.
Fig. 2b is a flowchart of a detection step in the micro display chip detection method according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a detection device of a micro display chip according to an embodiment of the application.
Fig. 4 is a schematic structural diagram of a detection device of a micro display chip according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
In the description of the embodiments of the present application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present application described below may be combined with each other as long as they do not collide with each other.
In the following embodiments, the micro display chip is simply referred to as a chip.
As shown in fig. 1, an embodiment of the present application provides a micro-display chip detection system, including: the chip bearing and displacement mechanism 100 and the chip positioning and detecting mechanism 200; the chip positioning and detecting mechanism 200 is arranged above the chip bearing and displacement mechanism 100;
the chip carrying and displacing mechanism 100 includes:
a chip carrier 110 for placing and fixing a chip;
an R-direction adjusting table 120, connected below the chip carrier 110, for adjusting an R-direction angle of a chip placed on the chip carrier 110;
an XY direction fine adjustment mechanism 130 connected below the R direction adjustment table 120 for fine adjustment of the position of the chip placed on the chip carrier 110 in the X direction and/or the Y direction;
a Z-direction electric displacement table 140 connected below the XY-direction fine adjustment mechanism 130 for driving the chip placed on the chip carrier 110 to displace in the Z-direction;
the Y-direction electric displacement table 150 is connected below the Z-direction electric displacement table 140, and is used for driving the chip placed on the chip carrier 110 to displace in the Y-direction;
the chip positioning and detecting mechanism 200 includes:
a positioning camera 210 for capturing a positioning image of the chip;
a ranging sensor 220 for measuring and obtaining a Z-directional positioning position reference of the chip when the chip is lowered into place;
a test pin card 230 for contacting a test point on the chip when it rises in place and providing a test signal to the chip through the test point;
a detection camera 240 for photographing a display image at the time of chip test;
the X-direction electric displacement table 250 is used for installing and driving the positioning camera 210, the ranging sensor 220, the detecting needle card 230 and the detecting camera 240 to displace in the X-direction.
In the embodiment shown in fig. 1, the left-right direction is X-direction, the front-back direction is Y-direction, the up-down direction is Z-direction, and the horizontal rotation direction of the R-direction adjustment table 120 is R-direction; the chip bearing and displacement mechanism 100 and the chip positioning and detecting mechanism 200 can be fixed on a bottom plate 300, wherein the Y-direction electric displacement platform 150 is directly fixed on the bottom plate 300, the Z-direction electric displacement platform 140 is arranged on a sliding block of the Y-direction electric displacement platform 150, the XY-direction fine adjustment mechanism 130 is arranged on a lifting block of the Z-direction electric displacement platform 140, the R-direction adjustment platform 120 is arranged above the XY-direction fine adjustment mechanism 130, and the chip carrier 110 is arranged above the R-direction adjustment platform 120; the Y-direction electric displacement table 150 can drive the Z-direction electric displacement table 140, the XY-direction fine adjustment mechanism 130, the R-direction adjustment table 120 and the chip carrier 110 mounted thereon to move together in the Y-direction, so as to drive the chip placed on the chip carrier 110 to displace in the Y-direction; the Z-direction electric displacement table 140 can drive the XY-direction fine adjustment mechanism 130, the R-direction adjustment table 120 and the chip carrier 110 mounted thereon to move together in the Z-direction, so as to drive the chip placed on the chip carrier 110 to displace in the Z-direction; the XY-direction fine adjustment mechanism 130 can drive the R-direction adjustment table 120 and the chip carrier 110 mounted thereon to perform fine adjustment in the X-direction and/or the Y-direction, so that the chip placed on the chip carrier 110 can be subjected to fine adjustment in the X-direction and/or the Y-direction, and the chip is aligned to the test pin card 230 in the X-direction and the Y-direction; the R-direction adjusting table 120 can drive the chip carrier 110 mounted thereon to adjust in the R-direction, so as to adjust the R-direction angle of the chip placed on the chip carrier 110, so that the chip is aligned with the detecting pin card 230 in the R-direction;
the positioning camera 210, the ranging sensor 220, the detection needle card 230 and the detection camera 240 are all arranged on the sliding block of the X-direction electric displacement table 250 through the same carrier plate 260; thus, the X-direction electric displacement table 250 can drive the positioning camera 210, the ranging sensor 220, the detecting needle card 230 and the detecting camera 240 to displace in the X-direction at the same time; the X-direction electric displacement table 250 is mounted on a bracket 400, and the bracket 400 is fixed on the bottom plate 300;
in one embodiment, the Y-direction motorized stage 150, the Z-direction motorized stage 140, and the X-direction motorized stage 250 are all driven by a controller, and the controller can obtain position signals fed back by the Y-direction motorized stage 150, the Z-direction motorized stage 140, and the X-direction motorized stage 250; the controller can adopt a PLC, an industrial personal computer and the like; the controllers of the Y-direction electric displacement stage 150, the Z-direction electric displacement stage 140, and the X-direction electric displacement stage 250 may be provided in combination or separately but can communicate with each other;
in one embodiment, the test signals include a power supply signal and a drive signal for the chip;
specifically, in the Y direction, the detection pin card 230 is located within the optical path range of the lens of the positioning camera 210; in this manner, after the test pin card 230 is removed from above the descending chip, the positioning camera 210 can be translated above the chip without the need to readjust the Y-direction motorized displacement stage 150;
specifically, as shown in fig. 1, the XY-direction fine adjustment mechanism 130 includes an X-direction manual fine adjustment stage 131 and a Y-direction manual fine adjustment stage 132; the X-direction manual fine adjustment table 131 is arranged on a lifting block of the Z-direction electric displacement table 140, an intermediate carrier plate 133 is connected above the X-direction manual fine adjustment table 131, and the Y-direction manual fine adjustment table 132 is arranged on the intermediate carrier plate 133; the X-direction manual fine adjustment table 131 and the Y-direction manual fine adjustment table 132 can be manually adjusted by adopting the adjusting screw rod shown in fig. 1, so that the R-direction adjusting table 120 and the chip carrier 110 mounted on the X-direction manual fine adjustment table can be subjected to position fine adjustment in the X-direction and/or the Y-direction;
specifically, the chip carrier 110 is provided with a chip positioning slot; after the R-direction angle of the R-direction adjusting table 120 is adjusted, the R-direction angle of the chip positioning groove can be determined, so that the R-direction angle of the chip to be measured can be kept consistent after the chip to be measured is placed in the chip positioning groove of the chip carrier 110 every time;
further, a vacuum adsorption channel is arranged at the bottom of the chip positioning groove of the chip carrier 110; the chip can be prevented from moving when the chip bearing and displacement mechanism 100 acts through vacuum adsorption;
specifically, the positioning camera 210 is mounted on the first manual displacement stage 270 in the Y direction; the first manual displacement table 270 is connected with the sliding block of the X-direction electric displacement table 250 through the carrier plate 260; the positioning camera 210 can be installed at a proper height through the first manual displacement table 270, so that the focal length and the depth of field of the positioning camera can be conveniently adjusted;
specifically, the detection camera 240 is mounted on a second manual displacement stage 280 along the Y-direction; the second manual displacement table 280 is connected with the sliding block of the X-direction electric displacement table 250 through the carrier plate 260; the detection camera 240 can be installed at a proper height through the second manual displacement table 280, so that the focal length and the depth of field of the detection camera can be conveniently adjusted;
specifically, the detecting needle 230 is connected to the lower end of the second manual displacement stage 280, and is located below the lens of the detecting camera 240; when the detection pin card 230 is in contact with the test point of the chip to light the chip when the detection pin card rises in place, the detection camera 240 can clean and shoot the display image of the chip and send the display image to the display screen for an operator to observe the display image and judge the optical performance of the chip;
in one embodiment, the spacing between the positioning camera 210 and the ranging sensor 220, the spacing between the ranging sensor 220 and the detection pin card 230 are all kept constant;
based on the micro-display chip detection system provided by the embodiment, the embodiment of the application also provides a detection method of the micro-display chip; the method comprises the following steps:
the calibration steps, please refer to fig. 2a, include:
step S110, controlling the Y-direction electric displacement stage 150 and the X-direction electric displacement stage 250 to move to the appropriate positions, respectively, so that the chip on the chip carrier 110 is located below the probe card 230; after the chip is adjusted in place in the R direction through the R-direction adjusting table 120 and/or is finely adjusted in place in the X direction and/or the Y direction through the XY-direction fine adjusting mechanism 130, the Z-direction electric displacement table 140 is driven to ascend in place so that a test point on the chip is contacted with the detection needle card 230, and the chip is lightened;
step S120, recording the position of the Y-direction electric displacement table 150, the position of the X-direction electric displacement table 250 and the position of the Z-direction electric displacement table 140 at this time as a Y-direction electric displacement table forward in-place reference, an X-direction electric displacement table forward in-place reference and a Z-direction electric displacement table upward in-place reference respectively;
step S130, the Z-direction electric displacement table 140 is controlled to drive the chip to descend to the position, and then the positioning camera 210 is controlled to move to the position above the chip;
step S140, acquiring a positioning image of the chip and identifying a positioning mark in the positioning image;
in one embodiment, the chip is provided with a positioning mark, and the image including the positioning mark captured by the positioning camera 210 is a positioning image of the chip; the controller acquires the positioning image and then performs image recognition;
step S150, setting a chip X-direction positioning position reference and a chip Y-direction positioning position reference according to the positioning mark;
in one embodiment, the chip may be configured with three positioning marks, and after image recognition, the center coordinates of the three positioning marks may be used as the chip X-direction positioning position reference and the chip Y-direction positioning position reference; in other embodiments, more than three positioning marks may be provided on the chip;
step S160, controlling the X-direction electric displacement table 250 to move by a preset distance so that the ranging sensor 220 moves to the position right above the chip;
step S170, acquiring height data measured by the ranging sensor 220 as a Z-directional positioning position reference of the chip;
in this embodiment, the height distance between the ranging sensor 220 and the chip when it is lowered into position is used as the reference for the Z-directional positioning position of the chip;
step S180, controlling the Y-direction electric displacement table 150 and the X-direction electric displacement table 250 to retract to the positions;
thus, the calibration is completed;
the detecting step, please refer to fig. 2b, includes:
step S210, after the chip to be tested is placed on the chip carrier 110 and fixed, the X-direction electric displacement table 250 and the Y-direction electric displacement table 150 are controlled to move a fixed distance respectively, and the chip to be tested is conveyed to the position below the positioning camera 210;
step S220, a positioning image of the chip to be detected is obtained, positioning marks in the positioning image are identified, the real-time X-direction position and the real-time Y-direction position of the chip are obtained, and the compensation value of the X-direction and/or the Y-direction position of the chip is calculated according to the real-time X-direction position and the real-time Y-direction position of the chip, the reference of the X-direction positioning position of the chip and the reference of the Y-direction positioning position of the chip;
step S230, controlling the X-direction electric displacement table 250 to move by a preset distance so that the ranging sensor 220 moves to the position right above the chip to be measured, acquiring the height data measured by the ranging sensor 220 as the real-time Z-direction height position of the chip, and calculating the Z-direction position compensation value of the chip according to the real-time Z-direction height position of the chip and the Z-direction positioning position reference of the chip;
step S240, the X-direction electric displacement table 250 is controlled to move into position by the X-direction electric displacement table forward reference and the X-direction position compensation value, the Y-direction electric displacement table 150 is controlled to move into position by the Y-direction electric displacement table forward reference and the Y-direction position compensation value, and the detection needle card 230 and the detection camera 240 are conveyed above the chip to be detected;
step S250, the Z-direction electric displacement table 140 is controlled to be lifted to be in place by the Z-direction electric displacement table lifting to-be-in-place reference and the Z-direction position compensation value, so that the chip to be tested is contacted with the detection pin card 230 to be lightened;
step S260, obtaining a detection image of the chip to be detected;
the detection image is sent to the display screen, and an operator can manually judge the optical performance of the chip to be detected according to the picture on the display screen. After the test is finished, the Z-direction electric displacement stage 140 is firstly lowered to the position, the Y-direction electric displacement stage 150 and the X-direction electric displacement stage 250 are retracted to the position, the vacuumizing state of the chip carrier 110 is disconnected, and an operator can take out a single chip to detect the next chip.
According to the detection method, the micro-display chip detection system provided by the application has high automation degree, so that the detection efficiency is improved on one hand, the manual operation is reduced on the other hand, and the risk of damaging a single micro-display chip is greatly reduced compared with a pure manual test bench.
The embodiment of the application also provides a detection device of the micro display chip, wherein the detection device is a functional module which can be operated in a controller in a software mode, as shown in fig. 3, and comprises:
a calibration module, comprising:
a first control unit, configured to control the Y-direction electric displacement stage 150 and the X-direction electric displacement stage 250 to move to appropriate positions, respectively, so that the chip on the chip carrier 110 is located below the probe card 230; after the chip is adjusted in place in the R direction through the R-direction adjusting table 120 and/or is finely adjusted in place in the X direction and/or the Y direction through the XY-direction fine adjusting mechanism 130, the Z-direction electric displacement table 140 is driven to ascend in place so that a test point on the chip is contacted with the detection needle card 230, and the chip is lightened;
a first reference setting unit for recording the position of the Y-direction electric displacement stage 150, the position of the X-direction electric displacement stage 250, and the position of the Z-direction electric displacement stage 140 at this time as a Y-direction electric displacement stage advance in-place reference, an X-direction electric displacement stage advance in-place reference, and a Z-direction electric displacement stage rise in-place reference, respectively;
the second control unit is used for controlling the Z-direction electric displacement platform 140 to drive the chip to descend to the position and then controlling the positioning camera 210 to move to the position above the chip;
the first image acquisition and identification unit is used for acquiring a positioning image of the chip and identifying positioning marks in the positioning image;
the second reference setting unit is used for setting a chip X-direction positioning position reference and a chip Y-direction positioning position reference according to the positioning mark;
a third control unit for controlling the X-direction electric displacement table 250 to move by a preset interval so that the ranging sensor 220 moves to a position right above the chip;
a third reference setting unit, configured to obtain the height data measured by the ranging sensor 220 as a reference of the Z-directional positioning position of the chip; the method comprises the steps of carrying out a first treatment on the surface of the
A fourth control unit for controlling the Y-direction electric displacement stage 150 and the X-direction electric displacement stage 250 to retract to the positions;
a detection module, comprising:
the fifth control unit is configured to control the X-direction electric displacement table 250 and the Y-direction electric displacement table 150 to move a fixed distance respectively after the chip to be tested is placed on the chip carrier 110 and fixed, and convey the chip to be tested to the position under the positioning camera 210;
the first compensation value calculating unit is used for acquiring a positioning image of the chip to be detected, identifying a positioning mark in the positioning image, acquiring the real-time X-direction position and the real-time Y-direction position of the chip, and calculating the compensation value of the X-direction and/or the Y-direction position of the chip according to the real-time X-direction position and the real-time Y-direction position of the chip, the reference of the X-direction positioning position and the reference of the Y-direction positioning position of the chip;
the second compensation value calculating unit is configured to control the X-direction electric displacement table 250 to move by a preset distance, so that the ranging sensor 220 moves to a position right above the chip to be measured, obtain the height data measured by the ranging sensor 220 as a real-time Z-direction height position of the chip, and calculate a chip Z-direction position compensation value according to the real-time Z-direction height position of the chip and a reference of the chip Z-direction positioning position;
a sixth control unit for controlling the X-direction electric displacement stage 250 to move in place with the X-direction electric displacement stage forward in-place reference and the X-direction position compensation value, controlling the Y-direction electric displacement stage 150 to move in place with the Y-direction electric displacement stage forward in-place reference and the Y-direction position compensation value, and conveying the test needle card 230 and the test camera 240 above the chip to be tested;
a seventh control unit, configured to control the Z-direction electric displacement stage 140 to rise in place according to the Z-direction electric displacement stage rising reference and the Z-direction position compensation value, so as to make the chip to be tested contact with the test pin card 230 and light up;
and the detection image acquisition unit is used for acquiring a detection image of the chip to be detected.
The embodiment of the application also provides a detection device of the micro display chip, as shown in fig. 4, comprising: a processor and a memory; the processor and the memory are in communication with each other, for example, by a communication bus; the memory stores a computer program; the processor is configured to run the computer program, which when run performs the steps of the method as described above; the processor may be a CPU, or other general purpose processor, digital signal processor (Digital Signal Processor, DSP), application specific integrated circuit (ApplicationSpecific Integrated Circuit, ASIC), field programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or a combination thereof; the memory may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk, or solid state disk; the memory may also include a combination of the above types of memories;
the embodiments of the present application also propose a storage medium in which a computer program is stored, which computer program is configured to, when run, carry out the steps of the method as described hereinbefore; the storage medium may be a magnetic Disk, an optical Disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a Flash Memory (Flash Memory), a Hard Disk (HDD), a Solid State Drive (SSD), or the like; the storage medium may also comprise a combination of memories of the kind described above.
Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solution of the present application, and not for limiting the same, and although the present application has been described in detail with reference to the examples, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present application without departing from the spirit and scope of the technical solution of the present application, and all such modifications and equivalents are intended to be encompassed in the scope of the claims of the present application.
Claims (12)
1. A micro-display chip detection system, comprising: the chip bearing and displacement mechanism (100) and the chip positioning and detecting mechanism (200); the chip positioning and detecting mechanism (200) is arranged above the chip bearing and displacement mechanism (100);
the chip carrying and displacing mechanism (100) comprises:
a chip carrier (110) for placing and fixing the chip;
the R-direction adjusting table (120) is connected below the chip carrier (110) and is used for adjusting the R-direction angle of a chip placed on the chip carrier (110);
the XY direction fine adjustment mechanism (130) is connected below the R direction adjustment table (120) and is used for carrying out position fine adjustment on the chip placed on the chip carrier (110) in the X direction and/or the Y direction;
a Z-direction electric displacement table (140) connected below the XY-direction fine adjustment mechanism (130) and used for driving a chip placed on the chip carrier (110) to displace in the Z direction;
the Y-direction electric displacement table (150) is connected below the Z-direction electric displacement table (140) and is used for driving a chip placed on the chip carrier (110) to displace in the Y direction;
the chip positioning and detecting mechanism (200) includes:
a positioning camera (210) for capturing a positioning image of the chip;
a ranging sensor (220) for measuring and obtaining a Z-directional positioning position reference of the chip when the chip descends into place;
a test pin card (230) for contacting a test point on the chip when raised in place and providing a test signal to the chip through the test point;
a detection camera (240) for photographing a display image at the time of chip test;
and the X-direction electric displacement table (250) is used for installing and driving the positioning camera (210), the ranging sensor (220), the detection needle card (230) and the detection camera (240) to displace in the X direction.
2. The micro-display chip detection system according to claim 1, wherein,
in the Y direction, the detection needle card (230) is positioned in the lens light path range of the positioning camera (210).
3. The micro-display chip detection system according to claim 1, wherein,
the XY direction fine adjustment mechanism (130) comprises an X direction manual fine adjustment table (131) and a Y direction manual fine adjustment table (132); the X-direction manual fine adjustment table (131) is arranged on a lifting block of the Z-direction electric displacement table (140), the middle carrier plate (133) is connected above the X-direction manual fine adjustment table (131), and the Y-direction manual fine adjustment table (132) is arranged on the middle carrier plate (133).
4. The micro-display chip detection system according to claim 1, wherein,
the chip carrier (110) is provided with a chip positioning groove.
5. The micro-display chip detection system of claim 4, wherein,
the bottom of the chip positioning groove of the chip carrier (110) is provided with a vacuum adsorption channel.
6. The micro-display chip detection system according to claim 1, wherein,
the positioning camera (210) is arranged on the first manual displacement table (270) along the Y direction; the first manual displacement table (270) is connected with the sliding block of the X-direction electric displacement table (250) through the carrier plate (260).
7. The micro-display chip detection system according to claim 1, wherein,
the detection camera (240) is mounted on a second manual displacement stage (280) along the Y direction; the second manual displacement table (280) is connected with the sliding block of the X-direction electric displacement table (250) through the carrier plate (260).
8. The micro-display chip detection system of claim 7, wherein,
the detection needle card (230) is connected to the lower end of the second manual displacement table (280) and is positioned below the lens of the detection camera (240).
9. A method for detecting a micro display chip, which is suitable for the detection system according to any one of claims 1 to 8, and is characterized by comprising the following steps:
a step of calibration, comprising:
controlling the Y-direction electric displacement table (150) and the X-direction electric displacement table (250) to respectively move to proper positions so that a chip on the chip carrier (110) is positioned below the detection needle card (230); after the chip is adjusted in place in the R direction through the R direction adjusting table (120) and/or is finely adjusted in place in the X direction and/or the Y direction through the XY direction fine adjusting mechanism (130), the Z direction electric displacement table (140) is driven to ascend in place so that a test point on the chip is contacted with the detection needle card (230), and the chip is lightened;
recording the position of the Y-direction electric displacement table (150), the position of the X-direction electric displacement table (250) and the position of the Z-direction electric displacement table (140) at the moment as a Y-direction electric displacement table forward in-place reference, an X-direction electric displacement table forward in-place reference and a Z-direction electric displacement table upward in-place reference respectively;
controlling the Z-direction electric displacement table (140) to drive the chip to descend to the position, and then controlling the positioning camera (210) to move to the position above the chip;
acquiring a positioning image of a chip and identifying a positioning mark in the positioning image;
setting a chip X-direction positioning position reference and a chip Y-direction positioning position reference according to the positioning mark;
controlling the X-direction electric displacement table (250) to move by a preset interval so that the ranging sensor (220) moves to be right above the chip;
acquiring height data measured by a ranging sensor (220) as a Z-direction positioning position reference of a chip;
controlling the Y-direction electric displacement table (150) and the X-direction electric displacement table (250) to retract to the positions;
the detecting step comprises the following steps:
after the chip to be tested is placed and fixed on the chip carrier (110), controlling the X-direction electric displacement table (250) and the Y-direction electric displacement table (150) to respectively move for a fixed distance, and conveying the chip to be tested to the position below the positioning camera (210);
acquiring a positioning image of a chip to be detected, identifying a positioning mark in the positioning image, acquiring the real-time X-direction position and the real-time Y-direction position of the chip, and calculating the compensation value of the X-direction and/or the Y-direction position of the chip according to the real-time X-direction position and the real-time Y-direction position of the chip, the reference of the X-direction positioning position and the reference of the Y-direction positioning position of the chip;
controlling the X-direction electric displacement table (250) to move by a preset distance, enabling the ranging sensor (220) to move to the position right above the chip to be measured, acquiring height data measured by the ranging sensor (220) as a real-time Z-direction height position of the chip, and calculating a Z-direction position compensation value of the chip according to the real-time Z-direction height position of the chip and a Z-direction positioning position reference of the chip;
an X-direction electric displacement table is controlled to move into position by an X-direction electric displacement table advancing in-position reference and an X-direction position compensation value, a Y-direction electric displacement table is controlled to move into position by a Y-direction electric displacement table advancing in-position reference and a Y-direction position compensation value, and a detection needle card (230) and a detection camera (240) are conveyed above a chip to be detected;
the Z-direction electric displacement table (140) is controlled to be lifted to be in place by the Z-direction electric displacement table lifting reference and the Z-direction position compensation value, so that the chip to be tested is contacted with the detection needle card (230) to be lightened;
and obtaining a detection image of the chip to be detected.
10. A device for detecting a micro-display chip, comprising:
a calibration module, comprising:
the first control unit is used for controlling the Y-direction electric displacement platform (150) and the X-direction electric displacement platform (250) to respectively move to proper positions so that a chip on the chip carrier (110) is positioned below the detection needle card (230); after the chip is adjusted in place in the R direction through the R direction adjusting table (120) and/or is finely adjusted in place in the X direction and/or the Y direction through the XY direction fine adjusting mechanism (130), the Z direction electric displacement table (140) is driven to ascend in place so that a test point on the chip is contacted with the detection needle card (230), and the chip is lightened;
a first reference setting unit for recording the position of the Y-direction electric displacement table (150), the position of the X-direction electric displacement table (250) and the position of the Z-direction electric displacement table (140) at this time as a Y-direction electric displacement table forward in-place reference, an X-direction electric displacement table forward in-place reference and a Z-direction electric displacement table upward in-place reference, respectively;
the second control unit is used for controlling the Z-direction electric displacement platform (140) to drive the chip to descend to the position and then controlling the positioning camera (210) to move to the position above the chip;
the first image acquisition and identification unit is used for acquiring a positioning image of the chip and identifying positioning marks in the positioning image;
the second reference setting unit is used for setting a chip X-direction positioning position reference and a chip Y-direction positioning position reference according to the positioning mark;
the third control unit is used for controlling the X-direction electric displacement table (250) to move by a preset interval so that the ranging sensor (220) moves to the position right above the chip;
the third reference setting unit is used for acquiring height data measured by the ranging sensor (220) as a Z-direction positioning position reference of the chip; the method comprises the steps of carrying out a first treatment on the surface of the
A fourth control unit for controlling the Y-direction electric displacement table (150) and the X-direction electric displacement table (250) to retract to the positions;
a detection module, comprising:
the fifth control unit is used for controlling the X-direction electric displacement table (250) and the Y-direction electric displacement table (150) to respectively move a fixed distance after the chip to be tested is placed on the chip carrier (110) and fixed, and conveying the chip to be tested to the position below the positioning camera (210);
the first compensation value calculating unit is used for acquiring a positioning image of the chip to be detected, identifying a positioning mark in the positioning image, acquiring the real-time X-direction position and the real-time Y-direction position of the chip, and calculating the compensation value of the X-direction and/or the Y-direction position of the chip according to the real-time X-direction position and the real-time Y-direction position of the chip, the reference of the X-direction positioning position and the reference of the Y-direction positioning position of the chip;
the second compensation value calculating unit is used for controlling the X-direction electric displacement table (250) to move by a preset interval, so that the ranging sensor (220) moves to the position right above the chip to be measured, acquiring the height data measured by the ranging sensor (220) as the real-time Z-direction height position of the chip, and calculating the Z-direction position compensation value of the chip according to the real-time Z-direction height position of the chip and the Z-direction positioning position reference of the chip;
a sixth control unit for controlling the X-direction electric displacement table (250) to move into position by the X-direction electric displacement table forward reference and the X-direction position compensation value, controlling the Y-direction electric displacement table (150) to move into position by the Y-direction electric displacement table forward reference and the Y-direction position compensation value, and conveying the detection needle card (230) and the detection camera (240) to above the chip to be detected;
a seventh control unit, configured to control the Z-direction electric displacement table (140) to rise to a position by using the Z-direction electric displacement table rising to a reference and the Z-direction position compensation value, so as to make the chip to be tested contact with the detection pin card (230) and light up;
and the detection image acquisition unit is used for acquiring a detection image of the chip to be detected.
11. A detection apparatus for a micro display chip, comprising:
a memory storing a computer program;
a processor for running the computer program, which computer program when run performs the steps of the method as claimed in claim 9.
12. A storage medium, characterized in that,
the storage medium has stored therein a computer program configured to perform the steps of the method of claim 9 when run.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310694848.8A CN116577626A (en) | 2023-06-13 | 2023-06-13 | Micro-display chip detection system, detection method, detection device, detection equipment and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310694848.8A CN116577626A (en) | 2023-06-13 | 2023-06-13 | Micro-display chip detection system, detection method, detection device, detection equipment and storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116577626A true CN116577626A (en) | 2023-08-11 |
Family
ID=87535900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310694848.8A Pending CN116577626A (en) | 2023-06-13 | 2023-06-13 | Micro-display chip detection system, detection method, detection device, detection equipment and storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116577626A (en) |
-
2023
- 2023-06-13 CN CN202310694848.8A patent/CN116577626A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7135883B2 (en) | Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object | |
| US20160192552A1 (en) | Electronic component mounting machine and transfer confirmation method | |
| CN114733782A (en) | Laser chip testing and sorting machine and working method thereof | |
| CN217369300U (en) | Laser chip test sorting machine | |
| CN114325351A (en) | Laser chip testing device and laser chip testing method | |
| CN113804701B (en) | Visual inspection device | |
| CN109001926B (en) | Alignment module | |
| KR20190103957A (en) | Inspection system | |
| CN116577626A (en) | Micro-display chip detection system, detection method, detection device, detection equipment and storage medium | |
| CN216487998U (en) | Bonding strength detection device and detection platform | |
| CN115274483B (en) | Wafer electrical property detection equipment | |
| US20190187180A1 (en) | Prober | |
| CN215768288U (en) | Visual detection platform | |
| CN115993470A (en) | Inspection apparatus and inspection method | |
| CN113466292A (en) | Defect detection method and device for display module | |
| KR100318770B1 (en) | Apparatus for picking up a memory module in a memory module test handler | |
| CN220438196U (en) | Wafer detecting device | |
| CN216013216U (en) | Defect detection equipment of display module | |
| KR101668037B1 (en) | Contacting Device of Display Module for Testing | |
| CN219084775U (en) | Frame image acquisition device | |
| CN220751227U (en) | Novel instrument check out test set | |
| CN217385261U (en) | Laser chip testboard mechanism | |
| CN107195951B (en) | Battery cell blanking detection equipment | |
| CN213239415U (en) | Quick optical axis alignment system of optical lens modulation transfer function detection equipment | |
| CN211627746U (en) | Contact chip detection equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |