CN220438196U - Wafer detecting device - Google Patents
Wafer detecting device Download PDFInfo
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- CN220438196U CN220438196U CN202322007970.1U CN202322007970U CN220438196U CN 220438196 U CN220438196 U CN 220438196U CN 202322007970 U CN202322007970 U CN 202322007970U CN 220438196 U CN220438196 U CN 220438196U
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- 238000001514 detection method Methods 0.000 claims abstract description 92
- 238000007689 inspection Methods 0.000 claims description 26
- 239000004579 marble Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 33
- 238000003384 imaging method Methods 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The utility model discloses a wafer detection device, which comprises: the device comprises a base, a detection assembly, a transverse moving assembly and a longitudinal moving assembly, wherein the base is provided with a detection through hole; the detection assembly comprises a first CCD detection module and a second CCD detection module, and the detection through hole is positioned between the first CCD detection module and the second CCD detection module; the transverse moving assembly comprises a transverse moving plate and a transverse driving module, and the transverse moving plate is arranged on the base in a sliding manner; the longitudinal moving assembly comprises a detection placing plate and a longitudinal driving module, and the longitudinal driving module is connected with the detection placing plate. According to the wafer detection device, the base, the detection assembly, the transverse movement assembly and the longitudinal movement assembly are arranged, so that double-sided detection operation can be performed on the semiconductor wafer, the overall production efficiency is improved, and meanwhile, detection movement is performed on the semiconductor wafer through the transverse movement assembly and the longitudinal movement assembly, so that the overall detection and adjustment operation is faster and more convenient.
Description
Technical Field
The present utility model relates to a detecting mechanism, and more particularly, to a wafer detecting device.
Background
In the production process of semiconductor wafers, it is generally necessary to inspect the semiconductor wafers to determine whether the semiconductor wafers have defects such as defective dimensions or defective circuits. The existing semiconductor wafer detection equipment generally adopts a single-camera moving detection mode to carry out visual detection, so that the production efficiency is low, the single-camera moving range is limited, the detected semiconductor wafer is required to be subjected to position adjustment, or when the semiconductor wafers with different specifications are replaced to be detected, the whole detection equipment is required to be debugged, and therefore the detection operation becomes complicated.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide the wafer detection device which can perform double-sided detection operation on a semiconductor wafer and has higher overall detection efficiency.
The aim of the utility model is realized by the following technical scheme:
a wafer inspection apparatus includes: the device comprises a base, a detection assembly, a transverse moving assembly and a longitudinal moving assembly, wherein the base is provided with a detection through hole; the detection assembly comprises a first CCD detection module and a second CCD detection module, the first CCD detection module is arranged right above the base, the second CCD detection module is arranged right below the base, and the detection through hole is positioned between the first CCD detection module and the second CCD detection module; the transverse moving assembly comprises a transverse moving plate and a transverse driving module, the transverse moving plate is arranged on the base in a sliding mode, the transverse driving module is connected with the transverse moving plate, a first avoidance hole is formed in the transverse moving plate, and the first avoidance hole is communicated with the detection through hole; the longitudinal moving assembly comprises a detection placing plate and a longitudinal driving module, the detection placing plate is arranged on the transverse moving plate in a sliding mode, the longitudinal driving module is connected with the detection placing plate, a second position avoiding hole is formed in the detection placing plate, and the second position avoiding hole is communicated with the first position avoiding hole.
In one embodiment, the base is provided with a guide rail, and the transverse moving plate is slidably connected with the guide rail.
In one embodiment, the first CCD detection module includes a support frame, a lifting regulator and a CCD detector, the support frame is arranged on the base, the lifting regulator is arranged on the support frame, the CCD detector is connected with the lifting regulator, and the lifting regulator is used for driving the CCD detector to move up and down in the direction of the detection through hole.
In one embodiment, the lift adjuster is a lift motor.
In one embodiment, the lateral movement assembly further comprises a lateral anti-collision fixing block disposed on the base, and the lateral anti-collision fixing block is located on one side of the lateral movement plate.
In one embodiment, the transverse anti-collision fixing block is provided with a buffering top column.
In one embodiment, the transverse driving module and the longitudinal driving module are iron-core-free linear motors.
In one embodiment, the detecting and placing plate is provided with a plurality of placing and positioning holes.
In one embodiment, the placement positioning hole is a vacuum suction hole.
In one embodiment, the base is a marble base.
Compared with the prior art, the utility model has at least the following advantages:
according to the wafer detection device, the base, the detection assembly, the transverse movement assembly and the longitudinal movement assembly are arranged, so that double-sided detection operation can be performed on the semiconductor wafer, the overall production efficiency is improved, and meanwhile, detection movement is performed on the semiconductor wafer through the transverse movement assembly and the longitudinal movement assembly, so that the overall detection and adjustment operation is faster and more convenient.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described.
Fig. 1 is a schematic structural diagram of a wafer inspection apparatus according to an embodiment of the utility model.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Referring to fig. 1, a wafer inspection apparatus 10 includes: the device comprises a base 100, a detection assembly 200, a transverse moving assembly 300 and a longitudinal moving assembly 400, wherein the base 100 is provided with a detection through hole 110; the detection assembly 200 comprises a first CCD detection module 210 and a second CCD detection module, the first CCD detection module 210 is arranged right above the base 100, the second CCD detection module is arranged right below the base 100, and the detection through hole 110 is arranged between the first CCD detection module 210 and the second CCD detection module; the lateral movement assembly 300 comprises a lateral movement plate 310 and a lateral driving module 320, wherein the lateral movement plate 310 is arranged on the base 100 in a sliding manner, the lateral driving module 320 is connected with the lateral movement plate 310, a first avoidance hole 311 is formed in the lateral movement plate 310, and the first avoidance hole 311 is communicated with the detection through hole 110; the longitudinal moving assembly 400 comprises a detection placing plate 410 and a longitudinal driving module 420, the detection placing plate 410 is slidably arranged on the transverse moving plate 310, the longitudinal driving module 420 is connected with the detection placing plate 410, a second avoidance hole 411 is formed in the detection placing plate 410, and the second avoidance hole 411 is communicated with the first avoidance hole 311.
The base 100 is provided with a through hole 110 for detecting the double-sided operation of the semiconductor wafer. The detecting assembly 200 is composed of a first CCD detecting module 210 and a second CCD detecting module, wherein the first CCD detecting module 210 is disposed right above the base 100, so that imaging detection can be performed on one surface of the semiconductor wafer, and the second CCD detecting module is disposed right below the base 100, so that imaging detection can be performed on the other surface of the semiconductor wafer. Specifically, the semiconductor wafer is placed on the inspection placement plate 410 of the longitudinal movement assembly 400, the inspection placement plate 410 is driven by the longitudinal driving module 420 to longitudinally move on the transverse movement plate 310, so that the semiconductor wafer on the inspection placement plate 410 is longitudinally inspected and moved, meanwhile, the transverse movement plate 310 is slidably arranged on the base 100, so that the transverse movement plate 310 can be driven by the transverse driving module 320 to transversely move on the base 100, and thus, the semiconductor wafer on the inspection placement plate 410 can be transversely moved, and thus, the semiconductor wafer can be rapidly and double-sided inspected through the first CCD inspection module 210 and the second CCD inspection module which are symmetrically arranged up and down, so that the inspection efficiency is improved, and meanwhile, the transverse movement plate 310 and the inspection placement plate 410 are moved, so that the semiconductor wafer can be rapidly moved in the inspection process, so that the inspection operation is more convenient. The wafer detection device 10 of the utility model can carry out double-sided detection operation on the semiconductor wafer by arranging the base 100, the detection assembly 200, the transverse movement assembly 300 and the longitudinal movement assembly 400, so that the overall production efficiency is improved, and meanwhile, the detection movement of the semiconductor wafer is carried out by the transverse movement assembly 300 and the longitudinal movement assembly 400, so that the overall detection and adjustment operation is faster and more convenient.
In an embodiment, referring to fig. 1, a guide rail 120 is disposed on a base 100, and a lateral moving plate 310 is slidably connected to the guide rail 120, so that a moving direction of the lateral moving plate 310 can be limited by disposing the guide rail 120, so that a lateral moving operation is faster and more stable; as another example, the lateral moving assembly 300 further includes a lateral anti-collision fixing block 330, the lateral anti-collision fixing block 330 is disposed on the base 100, and the lateral anti-collision fixing block 330 is located at one side of the lateral moving plate 310, so that the moving position of the lateral moving plate 310 can be defined by the lateral anti-collision fixing block 330, so that the lateral moving plate 310 can perform a rapid moving operation within a set range; in this embodiment, the buffering top column 331 is disposed on the transverse anti-collision fixing block 330, for example, the buffering top column 331 is a rubber buffering column, so as to play a role in buffering when the transverse moving plate 310 contacts with the transverse anti-collision fixing block 330, and avoid the damage of the transverse moving plate 310.
Referring to fig. 1 again, in an embodiment, the first CCD detecting module 210 includes a supporting frame 211, a lifting adjuster 212 and a CCD detector, the supporting frame 211 is disposed on the base 100, the lifting adjuster 212 is disposed on the supporting frame 211, the CCD detector is connected to the lifting adjuster 212, and the lifting adjuster 212 is used for driving the CCD detector to move up and down in a direction of the detecting through hole 110.
The lifting regulator 212 is a lifting motor, so that the CCD detector can be driven to perform lifting movement, and thus the device can adapt to detection and regulation of semiconductor wafers with different specifications; the CCD detector is a CCD imaging camera, so that imaging detection operation can be performed on the semiconductor wafer. In this embodiment, the second CCD detection module is a CCD imaging camera, and is disposed directly under the base 100 and aligned with the CCD detector, so that the imaging detection operation can be performed on the other surface of the semiconductor wafer, so that the overall detection efficiency is improved.
In one embodiment, the lateral driving module and the longitudinal driving module are iron-core-free linear motors, so that the moving speed and stability of the lateral moving plate 310 and the detection placing plate 410 can be improved, so that the efficiency and accuracy of the overall detection operation are higher; for another example, a plurality of placing positioning holes are formed in the detecting and placing plate, so that the semiconductor wafer can be installed and fixed; for example, the placement positioning holes are vacuum-adsorbed, so that the semiconductor wafer can be fixed on the detection placement plate 410 by means of negative pressure adsorption, thereby being capable of achieving placement fixation of the semiconductor wafer; for example, the base is a marble base, so that the influence of temperature or humidity in the detection environment on the base can be avoided, namely, the base cannot be slightly deformed due to the change of the temperature or the humidity, and the overall detection precision is ensured.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model, which are within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. A wafer inspection apparatus, comprising:
the base is provided with a detection through hole;
the detection assembly comprises a first CCD detection module and a second CCD detection module, the first CCD detection module is arranged right above the base, the second CCD detection module is arranged right below the base, and the detection through hole is positioned between the first CCD detection module and the second CCD detection module;
the transverse moving assembly comprises a transverse moving plate and a transverse driving module, the transverse moving plate is arranged on the base in a sliding mode, the transverse driving module is connected with the transverse moving plate, a first position avoiding hole is formed in the transverse moving plate, and the first position avoiding hole is communicated with the detection through hole; and
The longitudinal movement assembly comprises a detection placing plate and a longitudinal driving module, the detection placing plate is arranged on the transverse movement plate in a sliding mode, the longitudinal driving module is connected with the detection placing plate, a second avoidance hole is formed in the detection placing plate, and the second avoidance hole is communicated with the first avoidance hole.
2. The wafer inspection apparatus of claim 1 wherein the base is provided with a guide rail, and the lateral movement plate is slidably coupled to the guide rail.
3. The wafer inspection apparatus according to claim 1, wherein the first CCD inspection module includes a support frame, a lifting adjuster, and a CCD detector, the support frame is disposed on the base, the lifting adjuster is disposed on the support frame, the CCD detector is connected to the lifting adjuster, and the lifting adjuster is configured to drive the CCD detector to perform lifting movement in a direction of the inspection through hole.
4. The wafer inspection apparatus of claim 3 wherein the lift adjuster is a lift motor.
5. The wafer inspection apparatus of claim 1, wherein the lateral movement assembly further comprises a lateral anti-collision fixed block disposed on the base and located on one side of the lateral movement plate.
6. The wafer inspection apparatus of claim 5, wherein the lateral anti-collision mounting block is provided with a bumper post.
7. The wafer inspection apparatus of claim 1, wherein the lateral drive module and the longitudinal drive module are coreless linear motors.
8. The wafer inspection apparatus of claim 1, wherein the inspection placement plate is provided with a plurality of placement positioning holes.
9. The wafer inspection apparatus of claim 8, wherein the placement positioning holes are vacuum suction holes.
10. The wafer inspection apparatus of claim 1 wherein the base is a marble base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322007970.1U CN220438196U (en) | 2023-07-27 | 2023-07-27 | Wafer detecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322007970.1U CN220438196U (en) | 2023-07-27 | 2023-07-27 | Wafer detecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220438196U true CN220438196U (en) | 2024-02-02 |
Family
ID=89690789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322007970.1U Active CN220438196U (en) | 2023-07-27 | 2023-07-27 | Wafer detecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220438196U (en) |
-
2023
- 2023-07-27 CN CN202322007970.1U patent/CN220438196U/en active Active
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