KR100318770B1 - Apparatus for picking up a memory module in a memory module test handler - Google Patents

Abstract

In the inspection apparatus of semiconductor memory modules, the memory module can be conveniently and quickly picked from the shipping tray while transferring the memory module directly using the shipping tray made of plastic, thereby simplifying the work process. A memory module picking device capable of improving the work efficiency is disclosed. According to the present invention, in the transfer operation of a memory module performed in a handler for inspecting a manufactured memory module, the pre-chuck is provided below the memory module picking device for the semiconductor memory module inspection device before picking the memory module. Air is injected through the air nozzle and the air nozzle toward the memory module contained in the shipping tray, the memory module is dropped in the desired direction, and then adsorbed to the free chuck and transported. At this time, the pair of chuck bases disposed at the lower end of the outer surface of the chuck up-down transfer moves toward the memory module picked by the free chuck to guide the side of the memory module.

Description

Memory module picking device for semiconductor memory module testing device {Apparatus for picking up a memory module in a memory module test handler}

The present invention relates to a test unit of the inspection device for inspecting the production and the completion of the semiconductor memory module is completed, and more specifically, in the inspection device of the memory module using a shipping tray of plastic material without using a process tray The present invention relates to a memory module picking device that can simplify work processes and improve work efficiency by picking a memory module from a shipping tray conveniently and quickly and accurately while transferring the memory module directly.

In the recent electronics industry, while the output and function of electronic devices such as integrated circuits and semiconductor chips are rapidly increasing, various efforts have been made to reduce their size and unit manufacturing cost. One such method is to increase the test speed of electronic devices by simultaneously testing a plurality of electronic devices in an inspection process for inspecting the characteristics and performance of manufactured electronic devices.

To this end, a new type of automatic inspection device has been developed that increases the test speed of a plurality of electronic devices. In the conventional automatic inspection apparatus, in addition to a shipping tray that holds a completed memory module and commercializes it, a process tray for exposing and retaining the memory module to be accessible for transfer of the memory module before and after the inspection is essential.

On the other hand, in the shipping tray, when the memory module does not stand in the desired direction, the free chuck of the pickup mechanism cannot be brought close to the memory module, thereby causing an expensive memory module to be damaged. In addition, since an adjustment device for adjusting the gap of the pickup mechanism according to the gap between the trays must be provided separately, there is a problem that the configuration of the whole device is complicated and the manufacturing cost is high.

One way to solve this problem is Korean Patent Application No. 99-46550, filed October 26, 1999 by the applicant, where the pre-chuck in the transfer operation of the memory module Before picking, air is injected into the memory module contained in the shipping tray through an air nozzle and an air injection hole provided in the lower portion of the memory module picking apparatus, so that the memory module contained in the shipping tray can be directly picked and transferred.

SUMMARY OF THE INVENTION The present invention has been made to further improve the above-described invention, and an object of the present invention is to provide an inspection apparatus for inspecting characteristics and performance of a semiconductor memory module, the tray for shipping plastics without using a process tray It is to provide a memory module picking device that can simplify the work process and improve the work efficiency by picking the memory module from the shipping tray conveniently and quickly and accurately while transferring the memory module directly.

1 is a schematic front view of a memory module picking apparatus for a semiconductor memory module inspecting apparatus according to a preferred embodiment of the present invention;

FIG. 2 is a schematic side view of the memory module picking apparatus for the semiconductor memory module inspecting apparatus illustrated in FIG. 1.

<Explanation of symbols for main parts of drawing>

10: memory module picking device 20: AC servo motor

24: support frame 26: up limit sensor

28: sensor flag 30: chuck up-down transfer

33: memory module up check sensor 34: shutter plate

40: Y-direction transfer 50: ball screw

52: ball screw nut 54: ball screw support

56: support bracket

60: prechuck base up-down cylinder

62a, 62b: cylinder joint block 64: pre-chuck up-down cylinder

66: Free Chuck 68: Chuck Base Drive Cylinder

70: chuck base 72: side guide

74: chuck fixing pin 80: nozzle

82: air injection port D: memory module

T: Tray

In order to achieve the above object, the present invention,

A plate-shaped vertical support frame having a first guide portion protruding by a predetermined height on both sides of the surface and extending in a longitudinal direction, and having a cutout portion at a central portion thereof;

A servo motor fixed to an upper side of the support frame by a motor bracket to generate rotational kinetic energy;

A plate-shaped chuck up-down transfer mounted on the front surface of the support frame on which the first guide portion is formed to reciprocate in a vertical direction;

A plate-shaped Y-direction transfer mounted at regular intervals with respect to the rear surface of the support frame by a spacer block extending horizontally between the rear surface of the support frame opposite the chuck up-down transfer;

Energy conversion means disposed between the support frame and the Y-direction transfer to convert the rotational kinetic energy into linear reciprocating kinetic energy to elevate the chuck up-down transfer;

A pre-chuck base up-down cylinder, a pair of cylinder joint blocks, a pre-chuck up-down cylinder, a pre-chuck base and a pre-chuck arranged in a vertical direction on an outer side of the outer surface of the chuck up-down transfer; Module picking assembly;

Deflection means for tilting the memory module in a predetermined direction before the memory module is picked by the memory module picking assembly; And

And a memory module guiding means for guiding the side surface of the memory module when the memory module is picked by the memory module picking assembly.

An up-limit sensor is disposed on one side of the lower surface of the motor bracket, and a sensor flag is mounted on the upper edge portion of the outer surface of the chuck up-down transfer.

Memory module up check sensors are installed on both sides of the chuck up-down transfer, and immediately below the check sensor are installed shutter plates extending vertically along the chuck up-down transfer to the vicinity of the free chuck. It is supported by a shutter guide installed around the plate.

The prechuck updown cylinder is connected to the output shaft of the prechuck base updown cylinder by a cylinder joint block, and a cylinder rod extends vertically between the prechuck updown cylinder and the top of the prechuck base.

The free chuck base is mounted to be reciprocally slidable in the vertical direction along a second guide portion which protrudes in the center of the outer surface of the chuck up-down transfer and extends in the vertical direction.

The prechuck is integrally mounted to a lower portion of the prechuck base, and a vacuum suction channel is vertically formed on a rear surface of the prechuck, and vacuum suction holes are formed at both sides of the lower end of the prechuck. Extends from the back of the prechuck to the vacuum suction port and remains closed by a vacuum pad.

As described above, according to the present invention, in a transfer operation of a memory module performed in a handler for inspecting a manufactured memory module, the memory module is transferred through a shipping tray, and the memory is checked before picking the memory module. The deflecting means provided in the lower part of the memory module picking device for the module inspection device is used to knock down the memory module contained in the shipping tray in a predetermined direction, and then pick and pick the memory module using the prechuck.

Hereinafter, a memory module picking apparatus for a semiconductor memory module inspecting apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic front view of a memory module picking apparatus for a semiconductor memory module inspecting apparatus according to a preferred embodiment of the present invention, and FIG. 2 is a schematic side view of the memory module picking apparatus for a semiconductor memory module inspecting apparatus shown in FIG. 1. .

1 and 2, the memory module picking device 10 for the semiconductor memory module inspection device generates a predetermined pressure and a ball screw required to pick the memory semiconductor device D to be tested from the tray T. AC servo motor 20 for precisely controlling the raising and lowering of 50.

The AC servo motor 20 is fixed to the upper side of the plate-shaped vertical support frame 24 by the motor bracket 22. The up limit sensor 26 is disposed on one side of the lower surface of the motor bracket 22. The up limit sensor 26 is mounted on the sensor bracket 27 protruding outward from one side of the lower surface of the motor bracket 22.

The first guide part 21 protrudes by a predetermined height on both sides of one surface of the support frame 24. The first guide portion 21 extends along the longitudinal direction of the support frame 24 on one surface of the support frame 24. An incision 23 is formed at the center of the support frame 24.

A plate-shaped chuck up-down transfer 30 is mounted on the front surface of the support frame 24 on which the first guide portion 21 is formed to reciprocate in the vertical direction along the first guide portion 21. On the inner surface of the chuck up-down transfer 30 facing the front of the support frame 24, a slide 31 sliding up and down along the first guide portion 21 while contacting the first guide portion 21 is disposed.

A plate-shaped Y-direction transfer 40 is mounted on the rear surface of the support frame 24 opposite the chuck up-down transfer 30. The Y-direction transfer 40 is mounted at regular intervals with respect to the rear surface of the support frame 24 by the spacer block 42 horizontally attached to the support frame 24.

Between the support frame 24 and the Y-direction transfer 40, a vertical rod-shaped ball screw 50 and a ball screw nut 52 for guiding the vertical movement of the ball screw 50 are disposed. The upper end of the ball screw 52 arranged to pass through the ball screw nut 52 vertically extends into the ball screw support 54 attached to the chuck up-down transfer 30. In the ball screw support 54, the upper end of the ball screw 50 is connected to the output shaft 25 of the AC servo motor 20 by a coupling 51. The AC servo motor 20 controls the operation of the ball screw 50 based on the control value input in advance.

The ball screw nut 52 which moves up and down by the ball screw 50 extends from the ball screw nut 52 and passes through the cutout 23 of the support frame 24 to the chuck up-down transfer 30. It is attached to the chuck up-down transfer 30 by the support bracket 56.

The ball screw 50 receives the rotational kinetic energy provided from the AC servo motor 20 via the output shaft 25 and the ball screw support 54. The ball screw 50 moves the ball screw nut 52 while rotating by the transmitted rotational kinetic energy. The ball screw nut 52 receives the rotational kinetic energy applied from the AC servo motor 20 when the ball screw 50 is raised or lowered at the same time as the rotation, and converts the linear kinetic energy into the chuck up-down transfer 30. ) Move up and down.

On the other hand, a pre-chuck base up-down cylinder 60, which is an air cylinder, is attached to the upper central portion of the outer surface of the chuck up-down transfer 30. Under the prechuck base up-down cylinder 60, a pair of cylinder joint blocks 62a and 62b, an air cylinder pre-chuck up-down cylinder 64, a pre-chuck base 65 and a pre-chuck 66 are arranged in this order in a vertical direction. do. The sensor flag 28 is mounted on the upper edge portion of the outer surface of the chuck up-down transfer 30. The sensor flag 28 is detected by the up limit sensor 26 when the chuck up-down transfer 30 moves up.

The first cylinder joint block 62a is coupled to the lower end of the output shaft 61 of the pre-chuck base up-down cylinder 60, and the second cylinder joint block 62b is one side of the outer surface of the first cylinder joint block 62a. Is coupled to. The cylinder rod 67 extends vertically between the second cylinder joint block 62b and the free chuck base 65.

The lower end of the cylinder rod 67 extending above the inner surface of the prechuck base 65 is arranged to be integrally coupled to the prechuck base 65 above the inner surface of the prechuck base 65. Is connected to one side. The prechuck up-down cylinder 64 is moved up and down along the cylinder rod 67 extending between the second cylinder joint block 62b and the prechuck base 65.

The free chuck base 65 is mounted to reciprocate in the vertical direction along the second guide portion 32 extending in the vertical direction protruding from the center of the outer surface of the chuck up-down transfer 30. The prechuck base 65 slides in the vertical direction as the prechuck up-down cylinder 64 moves along the cylinder rod 67.

The prechuck 66 is integrally mounted to the lower portion of the prechuck base 65. The prechuck 66 is with the prechuck base 65 when the prechuck up-down cylinder 64 moves the prechuck base 65 vertically to pick the memory module D from the tray T. It works. A vacuum suction channel (not shown) is formed in the vertical direction on the rear surface of the free chuck 66, and vacuum suction holes 66a are formed through the lower ends of the free chuck 66. The vacuum suction channel extends from the back of the prechuck 66 to the vacuum suction port 66a and is kept closed by the vacuum pad 69. The vacuum suction channel and the vacuum suction port 66a of the prechuck 66 come from a vacuum device (not shown) installed above the memory module picking device 10 when picking the memory module D from the tray T. It is a transfer path of the provided vacuum.

On the other hand, a memory module up check sensor 33 is installed at both upper portions of the chuck up-down transfer 30, and immediately below the check sensor 33 is vertically along the chuck up-down transfer 30 to the vicinity of the free chuck 66. An extended shutter plate 34 is installed. The shutter plate 34 is supported by a shutter guide 36 provided around it.

At this time, the upper end of the shutter plate 34 is inserted into the space S formed under the check sensor 33, and the shutter plate 34 does not allow the pre-chuck 66 to suck the memory module D. If it doesn't, it keeps sagging down due to gravity. If the memory module D is adsorbed by the prechuck 66, the shutter plate 34 is moved by the memory module D while the lower end of the shutter plate 34 contacts the uppermost surface of the memory module D. The upper end of the shutter plate 34 is moved upward in the space S in the check sensor 33 by being pushed upward. Then, the check sensor 33 detects the adsorption of the memory module D and the size of the memory module D based on the movement distance of the upper end of the shutter plate 34.

On the other hand, a pair of chuck base 70 is attached to the lower end of the outer surface of the chuck up-down transfer (30). The chuck base 70 is mounted on the lower end of the outer surface of the chuck up-down transfer 30 so as to reciprocate in the horizontal direction along a third guide portion (not shown) extending in a horizontal direction. The urethane block 71 is attached to the front end of the chuck base 70 facing each other. The urethane block 71 is for keeping the horizontal spacing of the chuck base 70 constant. A chuck stopper 73 for supporting the chuck base 70 is attached to the rear surface of the chuck base 70.

Side guides 72 are integrally coupled to both lower sides of the chuck base 70. The side guide 72 is detachably coupled to the chuck base 70 by a fastening bolt 75 passing through the lower side of the chuck base 70 and the side guide 72. The chuck fixing pins 74 are mounted at free ends of the side guides 72, respectively. The chuck fixing pin 74 is inserted into a groove formed on the rear surface of the memory module D when the pre-chuck 66 picks the memory module D to support the memory module D. .

On the outer surface of the chuck up-down transfer 30 in the upper position of the chuck base 70, chuck base drive cylinders 68, which are air cylinders, are mounted, respectively. The chuck base drive cylinder 68 reciprocates the chuck base 70 in the horizontal direction with respect to the chuck up-down transfer 30.

In the lower position of the chuck base 70, a nozzle 80 extending from an external air source (not shown) is disposed. The nozzle 80 extends horizontally below the bottom of the support frame 24 to near the prechuck 66. The free end of the nozzle 80 is provided with a plurality of air injection holes 82 for injecting air supplied from an external air supply source to the memory module D to be picked up by the free chuck 66.

An operation process of the memory module picking device 10 for a semiconductor memory module inspection device configured as described above will be briefly described with reference to FIGS. 1 and 2 as follows.

First, in a handler (not shown) that performs a characteristic and performance test of a finished semiconductor device, in order to pick a semiconductor device, that is, a memory module D, contained in a shipping tray T of a plastic material, When the memory module picking device 10 is in the position of the shipping tray T, the AC servo motor 20 generates the rotational kinetic energy for driving the ball screw 50 based on a control value input in advance. .

The generated rotational kinetic energy is transmitted to the ball screw 50 through the coupling in the motor output shaft 25 and the ball screw support 54. Thereby, the ball screw 50 moves the ball screw nut 52 while rotating, and the ball screw nut 52 continues to receive the rotational kinetic energy transmitted from the AC servo motor 20 through the ball screw 50. Converted into linear kinetic energy, the chuck up-down transfer 30 is pushed downward through the support bracket 56.

Then, as the slide 31 of the chuck up-down transfer 30 descends along the first guide portion 21, the chuck up-down transfer 30 falls to the desired height toward the shipping tray T.

At this time, the air supplied from the external air supply source through the nozzle 80 is injected from the plurality of air injection holes 82 toward the memory module D contained in the shipping tray T. As a result, the memory module D falls down in a predetermined direction.

When the memory module D falls down in a predetermined direction, the prechuck base up-down cylinder 60 starts to operate according to an operation signal applied from an external controller (not shown) to drive the pre-chuck up-down cylinder 64. Let's do it.

That is, the prechuck up-down cylinder 64 descends along the cylinder rod 67 by the power transmitted from the pre-chuck base up-down cylinder 60 through the output shaft 61 and the cylinder joint blocks 62a and 62b. The prechuck base 65 is also lowered by this.

When the prechuck base 65 descends to the memory module D, a vacuum is supplied to the prechuck 66 from a vacuum device (not shown) provided above the memory module picking device 10. Then, the prechuck 66 is collapsed in a predetermined direction in the shipping tray T by the vacuum provided through the vacuum suction channel (not shown) and the vacuum suction port 66a of the prechuck 66. (D) is adsorbed.

When the prechuck 66 adsorbs the memory module D, the shutter plate 34 is pushed upward while the lower end portion of the shutter plate 34 contacts the uppermost surface of the memory module D, whereby the shutter is pushed upward. The upper end of the plate 34 is moved upward in the space S in the check sensor 33. At this time, the check sensor 33 detects the adsorption of the memory module D and the size of the memory module D based on the moving distance of the upper end of the shutter plate 34.

Subsequently, while the prechuck 66 has attracted the memory module D, the memory module D is picked upward by continuous operation of the prechuck up-down cylinder 64 and the ball screw nut 52. . At this time, when the chuck up-down transfer 30 is moved upward by the operation of the ball screw nut 52, the up limit sensor 26 disposed on one side of the lower surface of the motor bracket 22 is the chuck up-down transfer 30. The motion of the sensor flag 28 is sensed to send a detection signal to the control device, whereby the upward movement of the memory module D is properly controlled.

At the same time, the chuck base drive cylinders 68 on both sides of the lower portion of the free chuck base 65 start operation according to an operation signal applied from an external control device to horizontally move the chuck base 70. Thereby, the chuck base 70 is moved toward the memory module D picked by the pre-chuck 66 to guide the side of the memory module D so that it does not fall while transferring the memory module D. .

As mentioned above, according to the present invention, in the transfer operation of the semiconductor element performed in the handler for inspecting the completed semiconductor element, the transfer through the memory module shipping tray (T), picking the memory module Before air is injected through the air nozzle 80 and the air injection port 82 provided in the lower portion of the memory module picking device for the memory module inspection device toward the memory module contained in the shipping tray (T), the pre-chuck (66) To pick and pick up the memory modules.

Therefore, the work process can be simplified, the work efficiency can be improved, and the stability and reliability in the transfer process of the memory module can be obtained, compared to the conventional memory module transfer work using the memory module and the process tray. .

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand that you can.

Claims (12)

The first guide portion 21 is formed on both sides of the surface to protrude by a predetermined height to extend along the longitudinal direction, the central portion of the plate-shaped vertical support frame 24 is formed with a cutout 23; A servo motor 20 fixed to an upper side of the support frame 24 by a motor bracket 22 to generate rotational kinetic energy; A plate-shaped chuck up-down transfer (30) mounted on the front surface of the support frame (24) on which the first guide portion (21) is formed to reciprocate in a vertical direction; Mounted at regular intervals to the rear surface of the support frame 24 by a spacer block 42 extending horizontally between the rear surface of the support frame 24 opposite the chuck up-down transfer 30. Plate-shaped Y-direction transfer 40; An energy conversion means disposed between the support frame 24 and the Y-direction transfer 40 for converting the rotational kinetic energy into linear reciprocating kinetic energy to elevate the chuck up-down transfer 30; Pre-chuck base up-down cylinder 60, first and second cylinder joint blocks 62a and 62b, pre-chuck up-down cylinder 64, and pre-chuck arranged sequentially in the vertical direction above the outer surface of the chuck up-down transfer 30. A memory module picking assembly having a base 65 and a free chuck 66, for picking the memory module D from the tray T; Deflection means for tilting the memory module D in a predetermined direction before the memory module D is picked by the memory module picking assembly; And And a memory module guiding means for guiding the side surface of the memory module (D) when the memory module (D) is picked by the memory module picking assembly. According to claim 1, Up-limit sensor 26 is disposed on one side of the lower surface of the motor bracket 22, The up-limit sensor 26 protrudes outward from one side of the lower surface of the motor bracket 22 The sensor flag 28 is mounted on the outer edge of the outer surface of the chuck up-down transfer 30, and the up-limit sensor 26 raises the chuck up-down transfer 30. Memory module picking device for a semiconductor device inspection device, characterized in that for sensing the sensor flag (28) when exercising. The slide 31 of claim 1, wherein an inner surface of the chuck up-down transfer 30 slides up and down along the first guide portion 21 while contacting the first guide portion 21. A memory module up check sensor 33 is installed at both upper sides of the chuck up-down transfer 30, and immediately below the check sensor 33, the pre-chuck 66 along the chuck up-down transfer 30. A shutter plate 34 extending vertically to the vicinity is provided, and the shutter plate 34 is supported by a shutter guide 36 provided around the shutter plate 34. Module picking device. The top of the shutter plate 34 is inserted into the space S formed in the lower portion of the check sensor 33, and the shutter plate 34 is formed by the pre-chuck 66. When the memory module D is not sucked, the state is sag down by gravity, and when the memory module D is sucked by the free chuck 66, the lower end of the shutter plate 34 Contacts the uppermost surface of the memory module D, and the shutter plate 34 is pushed upward by the memory module D, whereby the upper end of the shutter plate 34 has the space S ), And the check sensor 33 detects the adsorption of the memory module D and the size of the memory module D based on the movement distance of the upper end of the shutter plate 34. Memory module picking for semiconductor device inspection device, characterized in that Value. The method of claim 1, wherein the energy conversion means, the vertical rod-shaped ball screw 50 and the ball screw nut 52 for guiding the vertical movement of the ball screw 50, the ball screw ( 50 is disposed so as to pass through the ball screw nut 52 in the vertical direction, the upper end of the ball screw 52 extends into the ball screw support 54 attached to the chuck up-down transfer 30 to couple Memory module picking device for a semiconductor device inspection device, characterized in that connected to the output shaft (25) of the servo motor (20) by a ring (51). 6. The ball screw nut (52) according to claim 5, wherein the ball screw nut (52) extends from the ball screw nut (52) and passes through the cutout (23) by a support bracket (56) attached to the chuck up-down transfer (30). Is mounted to the chuck up-down transfer 30, the ball screw 50 receives the rotational kinetic energy provided from the servo motor 20 via the output shaft 25 and the ball screw support 54, The ball screw nut 52 is moved while being rotated by the rotational kinetic energy thus transmitted, wherein the ball screw nut 52 is the rotary motion when the ball screw 50 is raised or lowered simultaneously with the rotation. Memory module picking device for a semiconductor device inspection device, characterized in that by receiving the energy is converted to the linear kinetic energy to lift the chuck up-down transfer (30). The first cylinder joint block 62a is coupled to a lower end of the output shaft 61 of the pre-chuck base up-down cylinder 60, and the second cylinder joint block 62b is coupled to the first cylinder joint. It is coupled to one side of the outer surface of the block 62a, the cylinder rod 67 extends vertically between the second cylinder joint block 62b and the free chuck base 65, the inner surface of the free chuck base 65 A lower end portion of the cylinder rod 67 extending upwardly is connected to one side of the prechuck up-down cylinder 64 disposed to be integrally coupled to the prechuck base 65 on the inner surface of the prechuck base 65. The prechuck up-down cylinder 64 moves up and down along the cylinder rod 67 extending between the cylinder joint block 62b and the prechuck base 65, and the prechuck base 65. Pretend It is mounted so as to reciprocate in the vertical direction along the second guide portion 32 extending in the vertical direction protruding to the center portion of the outer surface of the transfer 30, the lower portion of the free chuck base (65) Memory module picking device for a semiconductor device inspection device, characterized in that 66) is integrally mounted. The vacuum suction channel of claim 7, wherein a vacuum suction channel is formed in a vertical direction on the rear surface of the prechuck 66, and vacuum suction holes 66a are formed on both sides of the lower end of the prechuck 66. A channel extends from the back side of the prechuck 66 to the vacuum suction port 66a and remains closed by a vacuum pad 69, the prechuck up down cylinder 64 being the prechuck base up down. As the cylinder rod 67 is stretched in the vertical direction by receiving power from the cylinder 60, the cylinder rod 67 slides in the vertical direction, whereby the free chuck base 65 and the free chuck 66 interlock in the vertical direction. The pre-chuck 66 is configured to lift the memory module D when a vacuum is formed through the vacuum suction channel and the vacuum suction port 66a from a vacuum device installed above the memory module picking device. A semiconductor device inspection apparatus memory module picking apparatus characterized in that the picking suction from the tray (T). The nozzle 80 and the nozzle 80 of claim 1, wherein the deflecting means extends horizontally from an external air supply source to below the lower end of the support chuck 24 near the lower end of the free chuck 66. Memory module picking device for a semiconductor device inspection device, characterized in that it comprises a plurality of air injection holes (82) for injecting air supplied from the external air supply source to the memory module (D) . The chuck up-down transfer device of claim 1, wherein the memory module guide means comprises a pair of chuck bases 70 attached to a lower end of an outer surface of the chuck up-down transfer 30, and a chuck up-down transfer at an upper position of the chuck base 70. And a chuck base drive cylinder (68) mounted on the outer surface of the substrate (30) for reciprocating the chuck base (70) in the horizontal direction with respect to the chuck up-down transfer (30). Memory module picking device for the device. The chuck base 70 is mounted to the lower end of the outer surface of the chuck up-down transfer 30 so as to reciprocate in a horizontal direction along a third guide portion extending in a horizontal direction and facing each other. A urethane block 71 is attached to the distal end of the chuck base 70 to maintain a constant horizontal distance of the chuck base 70, and supports the chuck base 70 on the rear surface of the chuck base 70. And a chuck stopper (73) for attaching and side guides (72) are integrally coupled to both lower sides of the chuck base (70). The method of claim 11, wherein the side guide 72 is coupled to be detachable to the chuck base 70 by a fastening bolt 75 passing through the lower side of the chuck base 70 and the side guide 72. The chuck fixing pins 74 are mounted at free ends of the side guides 72, respectively, and the chuck fixing pins 74 are mounted when the free chuck 66 picks the memory module D. A memory module picking device for a semiconductor device testing device, characterized in that it is inserted into a groove formed on the rear surface of the memory module (D) to support the memory module (D).