CN217385261U - Laser chip testboard mechanism - Google Patents

Abstract

The utility model relates to a laser chip test bench mechanism, which comprises a chip bearing component with a chip adsorption hole at the top, a pair of liftable power supply probes is arranged above the chip bearing component, a test mounting rack capable of moving along the transverse direction is arranged at the rear side of the chip bearing component, and a power test probe and a spectrum test probe are arranged on the test mounting rack along the transverse direction in sequence; the chip correcting table is driven to move by an XY-axis electric adjusting sliding table arranged below the chip correcting table; the chip bearing assembly and the test mounting frame are both arranged on the chip correcting table, the chip bearing assembly is driven to rotate by the rotating assembly, and the test mounting frame is driven to move transversely by the transverse electric sliding table. The utility model relates to a rationally, can carry out a plurality of parameter test to laser chip at a station, convenient to use effectively improves efficiency of software testing.

Description

Laser chip testboard mechanism

The technical field is as follows:

the utility model relates to a laser chip testboard mechanism.

Background art:

currently, laser chips are tested in a strip, and a chip strip contains 80 chips, and a single test is performed on one chip. However, after testing a laser chip, the laser chip needs to be separated into individual chips, chip damage exists in the separation process, the damaged chips are tested after being packaged, 10% of defective products exist, and the defective products cause waste of packaged materials and process time. By adopting the single test, the waste of packaged materials and process time can be effectively avoided, and the production efficiency can be improved.

In the prior art, a laser chip generally needs to perform multiple parameter tests (such as spectrum, optical power, current, and voltage) to determine whether the performance and the operating state of the laser chip meet requirements. However, most of the existing devices for testing the laser chip can only measure a single parameter, and the position of the laser chip needs to be moved and corrected when measuring different parameters, so that the testing efficiency is low.

The utility model has the following contents:

the utility model discloses make the improvement to the problem that above-mentioned prior art exists, promptly the utility model aims to solve the technical problem that a laser chip testboard mechanism is provided, reasonable in design improves efficiency of software testing.

In order to realize the purpose, the utility model discloses a technical scheme is: the utility model provides a laser chip testboard mechanism, is equipped with the chip carrier assembly in chip absorption hole including the top, the top of chip carrier assembly is equipped with the power probe of a pair of liftable, and the rear side of chip carrier assembly is equipped with the test mounting bracket that can follow lateral shifting, last power test probe and the spectrum test probe of being equipped with in proper order of edge of test mounting bracket.

The device further comprises a chip correcting table, wherein the chip correcting table is driven to move by an XY-axis electric adjusting sliding table arranged below the chip correcting table; chip carrier assembly and test mounting bracket all set up on the chip correction bench, and chip carrier assembly is rotatory by the rotating assembly drive, and the test mounting bracket is by horizontal electronic slip table drive lateral shifting.

Further, rotating assembly includes rotating electrical machines, rotation axis and synchronous belt drive mechanism, the equal vertical installation of rotating electrical machines and rotation axis is rectified at the chip, is connected through synchronous belt drive mechanism between the motor shaft of rotation axis and rotating electrical machines, chip carrier assembly fixed mounting is at the top of rotation axis.

Further, vertical manual regulation slip table is installed to the removal end of horizontal electronic slip table, vertical manual regulation slip table is installed to the removal end of vertical manual regulation slip table, the removal end at vertical manual regulation slip table is fixed to the test mounting bracket.

Furthermore, the chip bearing assembly comprises a chip bearing table, a heating seat, a heat insulation seat and a padding block, the chip adsorption hole is formed in the top surface of the chip bearing table, the chip bearing table is installed on the top surface of the heating seat, and the side wall of the heating seat is connected with a heating rod and a temperature sensor; the heat insulation seat is arranged between the heating seat and the heightening block, and the bottom of the heightening block is connected with the rotating assembly.

Further, the chip bearing assembly comprises a bearing base connected with the rotating assembly, a chip adsorption tube is vertically fixed at the middle of the top surface of the bearing base, a top tube opening of the chip adsorption tube is a chip adsorption hole, a backlight test frame is arranged on the front side of the chip adsorption tube, and a backlight test probe is installed at the upper end of the backlight test frame.

Further, a pair of power supply probes are arranged on the probe mounting rack, and the probe mounting rack is driven by the vertical electric sliding table to lift along the vertical direction.

Furthermore, vertical electronic slip table is located the front side of chip carrier assembly, and vertical electronic slip table installs on the slip table support, the below of slip table support is equipped with fills up high seat, the top of filling up high seat is equipped with the XY axle manual regulation slip table that is used for driving the slip table support to remove.

The camera identification component comprises a camera support, a lens barrel and a camera, wherein the camera and the lens barrel are installed on the camera support from top to bottom, a lens of the lens barrel is arranged downwards, and the camera is installed at the top of the lens barrel.

Compared with the prior art, the utility model discloses following effect has: the utility model relates to a rationally, can carry out a plurality of parameter testing to laser chip at a station, convenient to use effectively improves efficiency of software testing.

Description of the drawings:

fig. 1 is a schematic front view of a first embodiment of the present invention;

fig. 2 is a schematic perspective view of a probe assembly according to a first embodiment of the present invention;

fig. 3 is a schematic perspective view of a test board assembly according to a first embodiment of the present invention;

fig. 4 is a schematic front view of a test board assembly according to a first embodiment of the present invention;

FIG. 5 is a schematic top view of a chip carrier according to an embodiment of the present invention;

fig. 6 is a schematic perspective view of a second embodiment of the present invention;

fig. 7 is a schematic front view of a second embodiment of the present invention;

fig. 8 is a schematic perspective view of a backlight testing jig according to a second embodiment of the present invention;

fig. 9 is a schematic perspective view of a chip carrier assembly according to a second embodiment of the present invention.

In the figure:

401-chip carrier assembly; 402-chip adsorption holes; 403-test mounting rack; 404-power test probe; 405-a spectroscopic test probe; 406-a power supply probe; 407-chip calibration stage; 408-XY axis electric adjusting sliding table; 409-a rotating electrical machine; 410-a rotating shaft; 411-synchronous belt drive mechanism; 412-lateral electric slipway; 413-vertical manual adjustment of the slide table; 414-longitudinal manual adjustment of the slipway; 415-a chip carrier; 416-a heating seat; 417-a thermal insulation seat; 418-block of raising; 419-heating rod; 420-a temperature sensor; 421-a probe mounting frame; 422-vertical electric sliding table; 423-a slipway bracket; 424-raised seats; 425-XY axes manual adjustment of the sliding table; 426-a camera support; 427-a lens barrel; 428-camera; 429-a load bearing base; 430-chip adsorption tube; 431-backlight test rack; 432-Back light test Probe.

The specific implementation mode is as follows:

the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description of the present invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

The first embodiment is as follows: as shown in fig. 1 to 5, the present invention relates to a laser chip test platform mechanism, which comprises a probe assembly and a test assembly, wherein the probe assembly and the test assembly are distributed relatively, the test assembly comprises a chip bearing assembly 401 having a chip adsorption hole 402 at the top, a test mounting frame 403 capable of moving along the transverse direction is arranged at the rear side of the chip bearing assembly 401, and a power test probe 404 and a spectrum test probe 405 are arranged on the test mounting frame 403 along the transverse direction in sequence; the probe assembly includes a pair of power probes 406 capable of being lifted and lowered, and the pair of power probes 406 is disposed above the chip carrier assembly 401. When the laser chip testing device works, a laser chip to be tested is placed in a chip adsorption hole 402 at the top of a chip bearing assembly 401, a pair of power supply probes 406 move downwards to be in contact with the laser chip, the laser chip is electrified through the power supply probes, a power testing probe tests the optical power of the laser chip, and a spectrum testing probe tests the spectrum of the laser chip; in a circuit formed by the pair of power supply probes and the laser chip, current and voltage parameters are tested through an ammeter and a voltmeter. The mechanism is reasonable in design, can test a plurality of parameters of the laser chip at one station, is convenient to use, and effectively improves the testing efficiency.

In this embodiment, the apparatus further comprises a chip calibration table 407, wherein the chip calibration table 407 is driven by an XY-axis electric adjustment sliding table 408 arranged below the chip calibration table to move along an X axis (i.e., a transverse direction) and a Y axis (i.e., a longitudinal direction); the chip bearing component 401 and the test mounting frame 403 are both arranged on the chip calibration table 407, the chip bearing component 401 is driven to rotate by the rotating component, and the test mounting frame 403 is driven to move transversely by the transverse electric sliding table 412. The X-axis (namely, transverse) and Y-axis (namely, longitudinal) positions of the chip correcting table are adjusted through the XY-axis electric adjusting sliding table, and meanwhile, the chip bearing assembly is driven to rotate by the rotating assembly, so that the position of the laser chip can be corrected, and a pair of subsequent probes can be well contacted with the laser chip. The test mounting frame is driven by the transverse electric sliding table to move transversely, and the power test probe and the spectrum test probe can be adjusted to be respectively opposite to the laser chip, so that different parameters can be tested.

In this embodiment, the rotating assembly includes rotating electrical machines 409, rotation axis 410 and synchronous belt drive 411, rotating electrical machines 409 and rotation axis 410 are all vertically installed at chip correction platform 407, and the rotation axis is connected with chip correction platform rotation through a pair of bearings that distribute from top to bottom, is connected through synchronous belt drive 411 between rotation axis 410 and the motor shaft of rotating electrical machines 409, chip carrier assembly 401 fixed mounting is at the top of rotation axis 410. During operation, the rotating motor drives the rotating shaft to rotate through the synchronous belt transmission mechanism, and the rotating shaft drives the chip bearing assembly to rotate.

In this embodiment, in order to adjust the height and the front and back position of power test probe and spectrum test probe conveniently to better suit with the position of laser chip, vertical manual regulation slip table 413 is installed to the removal end of horizontal electronic slip table 412, vertical manual regulation slip table 414 is installed to the removal end of vertical manual regulation slip table 413, test mounting bracket 403 is fixed at the removal end of vertical manual regulation slip table 414. During the adjustment, through the height of vertical manual regulation slip table adjustment vertical manual regulation slip table and test mounting bracket, through the height of vertical manual regulation slip table adjustment test mounting bracket, promptly: the test mount is adjustable in position both vertically and longitudinally. It should be noted that both the longitudinal manual adjustment sliding table and the vertical manual adjustment sliding table are conventional, and the detailed structure and the operation mode thereof are not repeated here.

In this embodiment, the chip carrier assembly 401 includes a chip carrier 415, a heating seat 416, a heat insulation seat 417 and a block 418, the chip adsorption hole 402 is disposed on the top surface of the chip carrier 415, the chip carrier 415 is mounted on the top surface of the heating seat 416, the side wall of the heating seat 416 is connected to a heating rod 419 and a temperature sensor 420, the heating rod is powered on to heat the heating seat, the heating seat transfers heat to the chip carrier, the laser chip is tested at high temperature, and the temperature sensor is used for detecting stability; the heat insulation seat 417 is arranged between the heating seat 416 and the heightening block 418, the bottom of the heightening block 418 is connected with the top of the rotating shaft 410 of the rotating assembly, and the rotating shaft rotates and simultaneously drives the heightening block, the heat insulation seat, the heating seat, the chip bearing table and the laser chip to rotate so as to adjust the angle of the laser chip, realize angle correction and facilitate the accurate connection of the laser chip and the power supply probe.

In this embodiment, the test mounting frame 403 is transversely provided with a first mounting hole and a second mounting hole, and the power test probe and the spectrum test probe are respectively mounted in the first mounting hole and the second mounting hole.

In this embodiment, the power test probe is connected to the LIV tester, and the spectrum test probe is connected to the spectrometer.

In this embodiment, as shown in fig. 2, a pair of power supply probes 406 is disposed on a probe mounting bracket 421, and the probe mounting bracket 421 is driven by a vertical electric sliding table 422 to vertically lift and lower, so as to contact and separate the power supply probes from the laser chip. It should be noted that, vertical electronic slip table is prior art, and the probe mount pad sets up the removal end at vertical electronic slip table, and this time does not do too much repetition to specific structure and gives unnecessary details.

In this embodiment, vertical electronic slip table 422 is located the front side of chip carrier assembly 401, and vertical electronic slip table 422 is installed on slip table support 423, the below of slip table support 423 is equipped with fills up high seat 424, the top of filling up high seat 424 is equipped with the manual regulation slip table 425 of XY axle that is used for driving slip table support 423 to remove. Before the test, the position of the power supply probe can be manually adjusted by manually adjusting the sliding table through the XY axes. It should be noted that, the manual adjustment of the sliding table in the XY axis is the prior art, and the position of the sliding table support is adjusted in the X axis and the Y axis directions, and the detailed structure and the working principle of the manual adjustment of the sliding table are not repeated herein.

In this embodiment, in order to correct the position of the laser chip, the laser chip further includes a camera recognition component disposed above the chip carrier component 401, the camera recognition component includes a camera holder 426, a lens barrel 427 and a camera 428, the camera 428 and the lens barrel 427 are mounted on the camera holder 426 from top to bottom, a lens of the lens barrel is disposed downward, the camera is mounted on the top of the lens barrel, and the camera is electrically connected to the XY-axis electric adjustment sliding table and the rotating motor through the control unit. During operation, the laser chip that awaits measuring is placed in the chip absorption hole at chip carrier assembly top, and camera discernment subassembly shoots the position of laser chip to compare with preset positional information, later XY axle electrical control slip table drive chip correction platform removes at X axle, Y axle direction, and the rotating electrical machines drive chip carrier platform is rotatory, so that laser chip adjusts to preset the position, and power test probe is just right with laser chip this moment.

In this embodiment, the operation includes the following steps: (1) a laser chip to be tested is placed in a chip adsorption hole 402 at the top of a chip bearing assembly 401, a camera identifies the position of the laser chip shot by the assembly and compares the position with preset position information, then an XY-axis electric adjusting sliding table 408 drives a chip correcting table 407 to move so that the laser chip moves to a preset position, and at the moment, a power testing probe is opposite to the laser chip; (2) the XY-axis electric adjusting sliding table 408 drives the chip correcting table 407 to move forwards, so that the laser chip is positioned under the pair of power supply probes 406, then the vertical electric sliding table drives the pair of power supply probes 406 to move downwards to be in contact with the laser chip, and the laser chip is electrified through the power supply probes; (3) in a circuit formed by the pair of power supply probes 406 and the laser chip, the current and the voltage are tested through an ammeter and a voltmeter, and the power test probe is used for testing the optical power of the laser chip and sending the measured information to an LIV tester; (4) the transverse electric sliding table 412 drives the test mounting frame 403 to move transversely, so that the spectrum test probe is opposite to the laser chip, the spectrum test probe tests the spectrum of the laser chip, and the measured information is sent to the spectrometer.

Example two: as shown in fig. 6 to 9, the difference between the present embodiment and the first embodiment lies in the difference of the structure of the chip carrier assembly, which specifically includes: the chip bearing component 401 comprises a bearing base 429 connected with the rotating component, a chip adsorption tube 430 is vertically fixed in the middle of the top surface of the bearing base 429, and a top nozzle of the chip adsorption tube 430 is a chip adsorption hole 402. Bear laser chip through only adopting the chip adsorption tube, do not set up heating structure, the test is that laser chip is in normal atmospheric temperature state, promptly: and the normal-temperature test of the laser chip is realized. And the embodiment can realize the high-temperature test of the laser chip by arranging the heating seat.

In this embodiment, a backlight test frame 431 is disposed on the front side of the chip adsorption tube 430, and a backlight test probe 432 is installed at the upper end of the backlight test frame 431 and used for performing backlight test on the laser chip at normal temperature.

The utility model discloses if disclose or related to mutual fixed connection's spare part or structure, then, except that other the note, fixed connection can understand: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).

In addition, the terms used in any aspect of the present disclosure as described above to indicate positional relationships or shapes include similar, analogous, or approximate states or shapes unless otherwise stated.

The utility model provides an arbitrary part both can be assembled by a plurality of solitary component parts and form, also can be the solitary part that the integrated into one piece technology was made.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: modifications can still be made to the embodiments of the invention or equivalents may be substituted for some of the features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.

Claims (9)

1. The utility model provides a laser chip testboard mechanism which characterized in that: the chip bearing component is provided with a chip adsorption hole at the top, a pair of liftable power supply probes is arranged above the chip bearing component, the rear side of the chip bearing component is provided with a test mounting frame capable of moving along the transverse direction, and a power test probe and a spectrum test probe are sequentially arranged on the test mounting frame along the transverse direction.

2. The laser chip test bench mechanism of claim 1, wherein: the chip correcting table is driven to move by an XY-axis electric adjusting sliding table arranged below the chip correcting table; chip carrier assembly and test mounting bracket all set up on the chip correction bench, and chip carrier assembly is rotatory by the rotating assembly drive, and the test mounting bracket is by horizontal electronic slip table drive lateral shifting.

3. The laser chip test bench mechanism of claim 2, wherein: the rotating assembly comprises a rotating motor, a rotating shaft and a synchronous belt transmission mechanism, the rotating motor and the rotating shaft are vertically arranged on a chip correction platform, the rotating shaft is connected with a motor shaft of the rotating motor through the synchronous belt transmission mechanism, and the chip bearing assembly is fixedly arranged at the top of the rotating shaft.

4. The laser chip test bench mechanism of claim 3 wherein: the test device is characterized in that a vertical manual adjusting sliding table is installed at the moving end of the transverse electric sliding table, a vertical manual adjusting sliding table is installed at the moving end of the vertical manual adjusting sliding table, and the test mounting frame is fixed at the moving end of the vertical manual adjusting sliding table.

5. The laser chip test bench mechanism of claim 2, wherein: the chip bearing assembly comprises a chip bearing table, a heating seat, a heat insulation seat and a heightening block, the chip adsorption hole is arranged on the top surface of the chip bearing table, the chip bearing table is arranged on the top surface of the heating seat, and the side wall of the heating seat is connected with a heating rod and a temperature sensor; the heat insulation seat is arranged between the heating seat and the heightening block, and the bottom of the heightening block is connected with the rotating assembly.

6. The laser chip test bench mechanism of claim 2, wherein: the chip bearing assembly comprises a bearing base connected with the rotating assembly, a chip adsorption tube is vertically fixed at the middle of the top surface of the bearing base, a top tube opening of the chip adsorption tube is a chip adsorption hole, a backlight test frame is arranged on the front side of the chip adsorption tube, and a backlight test probe is installed at the upper end of the backlight test frame.

7. The laser chip test bench mechanism of claim 1, wherein: the pair of power supply probes are arranged on the probe mounting rack, and the probe mounting rack is driven by the vertical electric sliding table to lift along the vertical direction.

8. The laser chip test bench mechanism of claim 7, wherein: the vertical electric sliding table is located on the front side of the chip bearing assembly and installed on the sliding table support, a padding seat is arranged below the sliding table support, and an XY-axis manual adjusting sliding table used for driving the sliding table support to move is arranged at the top of the padding seat.

9. The laser chip test bench mechanism of claim 2, wherein: the camera identification assembly comprises a camera support, a lens barrel and a camera, wherein the camera and the lens barrel are arranged on the camera support from top to bottom, a lens of the lens barrel is arranged downwards, and the camera is arranged at the top of the lens barrel.

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