TWI828481B - Semiconductor process equipment and wafer transmission system thereof - Google Patents

Abstract

A wafer transmission system comprises a transmission cavity, a first transmission component, a loading cavity, a second transmission component and a calibration cavity, wherein the transmission cavity is used for communicating with the reaction cavity; One side of the loading cavity is connected with the transmission cavity, and the other side is provided with a transmission port; The second transmission component is used to transmit the wafer to the tray in the loading cavity through the transmission port, and to remove the wafer from the tray in the loading cavity and transfer the wafer out of the loading cavity; A calibration component is arranged in the calibration chamber for calibrating the position of the tray; The first transmission component is used to transfer the tray into the calibration cavity to calibrate the tray position, take out the calibrated tray from the calibration cavity and transfer it into the loading cavity, and also to take out the tray loaded with wafers from the loading cavity and transfer it into the reaction cavity.

Description

Semiconductor process equipment and its wafer transfer system

The present invention relates to the field of semiconductor processing equipment, and in particular, to a wafer transfer system and a semiconductor processing equipment including the wafer transfer system.

Silicon carbide (SiC) is a semiconductor material with unique physical and chemical properties. The silicon-carbon bond energy making up the silicon carbide crystal is very large (4.6eV), its bandgap is 2.3~3.3eV, and it has high hardness and High chemical inertness, wide bandgap and good thermal stability enable silicon carbide power devices to operate at high temperatures of 300°C, and even ensure that the performance of silicon carbide power devices will not be degraded in higher temperature environments. Under the same voltage conditions, the on-state resistance of silicon carbide power devices is more than an order of magnitude smaller than that of silicon-based power devices, which also makes the power conversion rate of silicon carbide power devices higher than that of silicon-based power devices. However, precisely because of the particularity of its performance, silicon carbide devices are difficult to manufacture, have low yields, and have high device prices, which limits the pace of their comprehensive promotion.

Epitaxial growth is the first process in the manufacturing process of silicon carbide power semiconductor devices. Unlike the silicon epitaxy process, which uses an epitaxial temperature of 1000℃~1200℃, the temperature used in silicon carbide epitaxy is usually 1500℃~1800℃, and the temperature of silicon carbide epitaxy is The growth time is generally longer. Under this condition, if the previous method of directly removing the wafer under silicon epitaxy process conditions is used, it is easy to increase the The surface defects of the silicon carbide wafer require the entire tray containing the silicon carbide wafer to be placed into or taken out of the process chamber. That is, the pre-process wafer needs to be placed on the tray first, and then the tray and wafer are transferred into the reaction chamber as a whole for the process. After the process is completed, the tray and wafer need to be transferred out of the reaction chamber as a whole, and then removed from the tray. Remove the wafer.

However, in the existing technology, the process steps of placing the wafer on the tray and taking it off from the tray require human intervention, which greatly reduces the efficiency of the semiconductor process; moreover, manual handling of the wafer can easily cause fine particles to fall out. Falling onto the surface of the wafer, causing contamination of the wafer or scratching the surface of the wafer, affecting the yield of silicon carbide wafers.

Therefore, how to provide a transmission system for silicon carbide wafers that can realize automatic wafer transfer and removal has become an urgent technical problem in this field that needs to be solved.

The present invention aims to provide a wafer transfer system and semiconductor processing equipment including the wafer transfer system. The wafer transfer system can realize automatic transfer and removal of silicon carbide wafers.

In order to achieve the above object, as an aspect of the present invention, a wafer transfer system is provided. The wafer transfer system includes a transfer cavity, a first transfer component, a loading cavity, a second transfer component and a calibration cavity, wherein the transfer cavity It has a chamber docking port for communicating with the reaction chamber; one side of the loading chamber is connected to the transfer chamber, and the other side has a selectively opened transfer port; the second transfer component is used to transfer the crystal through the transfer port. The wafer is transferred to the tray in the loading chamber, and the wafer is removed from the tray in the loading chamber and transferred out of the loading chamber through the transfer port; the calibration chamber is connected to the transfer chamber , and the calibration cavity is provided with a calibration component, which is used to calibrate the position of the tray introduced into the calibration cavity; the first transmission component is provided in the transmission cavity, used to transfer the tray into the in the calibration chamber, and match the position of the calibration component to the tray Perform calibration, take out the calibrated tray from the calibration chamber and transfer it into the loading chamber, and also take the tray carrying the wafer in the loading chamber out of the loading chamber and pass it through The chamber interface is introduced into the reaction chamber, and the tray in the reaction chamber is taken out.

Optionally, the loading cavity includes a cavity, a base, an ejector pin driving assembly and a plurality of ejector pins. The base is disposed in the cavity, the base has a bearing surface for carrying the tray, and the ejector pin driving assembly It is used to drive a plurality of the ejector pins to pass upward from the base from the bottom of the bearing surface and pass through the plurality of ejector pin holes on the tray one by one, or to drive a plurality of the ejector pins to descend below the bearing surface.

Optionally, the ejector pin driving assembly includes a mounting plate, a lifting rod and a lifting driving assembly. A plurality of the ejector pins are arranged on the mounting plate. A mounting groove is formed on the bearing surface of the base, and a through-hole is formed at the bottom of the mounting groove. to the first through hole at the bottom of the base, the mounting plate is arranged in the mounting groove, the top end of the lifting rod passes through the first through hole and is fixedly connected to the mounting plate, and the lifting drive assembly is used to drive the lifting rod Lifting to drive the mounting plate and the plurality of ejector pins provided thereon to rise and fall.

Optionally, the plurality of ejector pins are divided into multiple groups, and the radial distance between the plurality of ejector pins in each group and the axis of the base is equal.

Optionally, the lifting drive assembly is provided below the cavity, and a second through hole is formed on the bottom wall of the cavity, and the second through hole is coaxially arranged with the first through hole; the bottom end of the lifting rod Pass through the second through hole to the outside of the cavity; the lift drive assembly includes a lift drive part and an elastic drive part; the drive shaft of the lift drive part is used to contact the bottom end of the lift rod when rising, and Push the lifting rod to rise; the elastic driving part is used to apply downward elastic force to the lifting rod, so as to drive the lifting rod to descend when the driving shaft descends.

Optionally, the bottom end of the lifting rod has an arc-shaped convex surface; the lifting driving part The top end of the driving shaft has a horizontal contact surface, and when the driving shaft of the lifting driving part pushes the lifting rod to rise, the horizontal contact surface contacts the arc-shaped convex surface.

Optionally, the elastic driving part includes a spring, a blocking ring and a guide seat. The guide seat is fixedly connected to the bottom of the cavity. A guide groove is formed on the bottom surface of the guide seat. A guide groove is formed on the bottom surface of the guide groove that penetrates to the cavity. The third through hole on the top surface of the guide seat is connected to the second through hole; the bottom end of the lifting rod passes through the third through hole and the guide groove, and the retaining ring and the spring are both covered is provided on the lifting rod, wherein the blocking ring is located below the bottom surface of the guide groove and is fixedly connected to the lifting rod; the spring is located in the guide groove and between the blocking ring and the bottom surface of the guide groove, the The spring is used to apply the elastic force to the retaining ring.

Optionally, the calibration component includes a tray calibrator and a rotating base. The tray calibrator is used to detect the rotation angle of the tray introduced into the calibration chamber and the horizontal position of the center of the tray; the first transmission component is used to transfer the After the tray is introduced into the calibration chamber, the horizontal position of the tray is adjusted according to the feedback signal of the tray calibrator so that the horizontal position of the center of the tray is aligned with the horizontal position of the rotation axis of the rotating base, and then the tray is placed On the rotating base; the rotating base is used to drive the tray around the rotation axis until the feature structure on the tray faces the first preset angle.

Optionally, the tray calibrator is located above the rotating base and can emit a detection signal vertically downward at a preset position, and determine whether the feature structure on the tray is rotated toward the first preset angle based on the reflected signal. .

Optionally, the wafer transfer system further includes a fixed platform, and the loading chamber and the second transfer component are both fixedly arranged on the fixed platform.

Optionally, the wafer transfer system also includes a wafer calibrator fixedly arranged on the fixed platform. The wafer calibrator is used to calibrate the rotation direction of the wafer so that the wafer The characteristic structure on the film cassette faces the second preset angle; the fixed platform also includes a first film cassette fixing position and a second film cassette fixing position for setting the film cassette, the second transmission component, the loading chamber and the transmission chamber The centers are located on the same straight line, and the first cassette fixing position and the second cassette fixing position are respectively located between the center of the second transfer component perpendicular to the center of the second transfer component and the center of the loading chamber. both sides in the line direction; the second transfer component is used to first transfer the wafer into the wafer aligner after taking the wafer out of the wafer cassette fixed in the first cassette, and then After the wafer aligner calibrates the rotation direction of the wafer, it transfers the wafer to the tray in the loading chamber through the transfer port; and, after taking out the wafer from the loading chamber , first transfer the wafer into the wafer calibrator, and after the wafer calibrator calibrates the rotation direction of the wafer, transfer the wafer to the cassette in the second cassette fixed position .

Optionally, the wafer transfer system further includes a tray support block fixedly arranged on the fixed platform, the top of the tray support block has a tray support surface for carrying the tray, and the tray support block faces the second transfer An opening is formed in the direction of the assembly; the second transmission assembly is also used to extend into the opening and rise from below the pallet support surface to a position higher than the pallet support surface to take out the pallet carried on the pallet support surface. down, and then place the tray into the loading cavity.

Optionally, the wafer transfer system further includes a cooling chamber, the cooling chamber is connected to the transfer chamber, and the first transfer component is used to first transfer the tray containing the wafer from the reaction chamber. It is placed in the cooling cavity, and after the tray and the wafer carried on it are cooled to the preset temperature, it is then transferred to the calibration cavity; the distance between the center of the transfer cavity and the center of the calibration cavity The connection line and the connection line between the center of the transmission cavity and the center of the cooling cavity are both at an angle of 45° to the connection line between the center of the second transmission component and the center of the transmission cavity.

As a second aspect of the present invention, a semiconductor manufacturing equipment is provided, including It includes a wafer transfer system and a reaction chamber. The wafer transfer system is used to introduce a tray carrying a wafer into the reaction chamber and take out the tray carrying the wafer from the reaction chamber, and the wafer transfer system It is the wafer transfer system described above.

In the wafer transfer system and semiconductor process equipment provided by the present invention, the wafer transfer system includes a transfer cavity, a calibration cavity and a loading cavity. The first transfer component can cooperate with the calibration cavity to calibrate the position of the tray, and transfer the calibrated The tray is placed into the loading chamber. The second transfer component can place the pre-process wafer on the calibrated pallet, or remove the wafer at a determined position from the calibrated pallet, thereby enabling automatic placement of the wafer on the pallet and automatic transfer of the wafer to the pallet. Removed from the tray, the entire transfer process of the wafer and the tray does not require human intervention, thereby improving the efficiency of the semiconductor process, reducing the probability of wafer contamination or damage caused by particles attached to the surface of the wafer, and improving the efficiency of the wafer (for example, carbonization silicon wafer) product yield.

10:wafer

20:pallet

30:Reaction chamber

40: film box

100:Transmission cavity

200: First transmission component

300: Calibration cavity

310:Pallet Calibrator

400:Loading cavity

410:gate valve

420: Gate valve driving mechanism

430:Cavity

440:Pedestal

450: thimble

460:Mounting plate

461:Connection Department

462: Strip part

463:Connection hole

464: Ejector fixing hole

470:Lifting rod

471:Hemisphere

480: Lift drive assembly

480a:Lifting drive part

480b: Elastic drive part

481:Spring

482:Blocking ring

483:Guide seat

500: Second transmission component

600: Wafer aligner

700:Pallet support block

710:Open your mouth

800: Cooling chamber

The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that in accordance with standard practice in the industry, the various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a schematic structural diagram of a wafer transfer system provided by an embodiment of the present invention; FIG. 2 is a schematic structural diagram of a loading cavity in the wafer transfer system provided by an embodiment of the present invention; FIG. 3 is a schematic structural diagram of a wafer transfer system provided by an embodiment of the present invention. A schematic structural diagram of the loading cavity in the system from another perspective; Figure 4 is a partial schematic diagram of area A of the loading cavity in Figure 3; Figure 5 is a mounting plate in the loading cavity in the wafer transfer system provided by an embodiment of the present invention The structural schematic diagram; Figure 6 is the structural schematic diagram of the tray in the embodiment of the present invention; Figure 7 is a partial schematic diagram of area A of the tray in Figure 6; Figure 8 is a schematic diagram of the positional relationship between the tray and the wafer in the embodiment of the present invention; Figure 9 is the structure of the tray support block in the wafer transfer system provided by the embodiment of the present invention. Schematic diagram; Figure 10 is a principle schematic diagram of the second transmission component in the wafer transmission system provided by the embodiment of the present invention, and the tray is removed from the tray support block; Figure 11 is the first transmission component in the wafer transmission system provided by the embodiment of the present invention A schematic diagram of the principle of taking out the tray from the loading cavity; FIG. 12 is a schematic diagram of the principle of transferring the wafer to the tray in the loading cavity by the second transfer component in the wafer transfer system provided by the embodiment of the present invention.

The following disclosure provides many different embodiments or examples of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description in which a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members Embodiments may be formed between the first member and the second member such that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numbers and/or letters in various instances. This repetition is for simplicity and clarity and does not inherently indicate a relationship between the various embodiments and/or configurations discussed.

In addition, for ease of description, spatially relative terms such as “below,” “below,” “lower,” “above,” “upper,” and the like may be used herein to describe one element or component in relation to another(s). The relationship between components or components, as illustrated in the figure. Spatially relative terms are intended to cover different orientations of the device in use or operation other than the orientation depicted in the figures. equipment May be otherwise oriented (rotated 90 degrees or at other orientations) and therefore the spatially relative descriptors used herein interpreted equally.

Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the values stated in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1% or 0.5% of a given value or range. Alternatively, the term "approximately" means within one acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless otherwise expressly specified, all numerical ranges such as quantities, durations of time, temperatures, operating conditions, ratios of quantities, and the like for materials disclosed herein, Quantities, values and percentages should be understood to be modified in all instances by the term "approximately". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the patent claims of this disclosure and accompanying invention claims are approximations that may vary as necessary. At a minimum, each numerical parameter should be interpreted in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one endpoint to the other endpoint or between two endpoints. All ranges disclosed herein include endpoints unless otherwise specified.

In order to solve the above technical problems, as an aspect of the present invention, a wafer transfer system is provided. As shown in Figure 1, the wafer transfer system includes a transfer cavity 100, a first transfer component 200, a calibration cavity 300, and a loading cavity 400. and the second transfer assembly 500, wherein the transfer chamber 100 has a chamber interface for communicating with the reaction chamber 30; one side of the loading chamber 400 is connected to the transfer chamber 100, and the other side has a selectively opened transfer port, That is, the transfer port can be opened or closed; the second transfer component 500 is used to transfer the wafer 10 to the tray 20 in the loading chamber 400 through the transfer port, and to remove the wafer from the tray 20 in the loading chamber 400 10 and pass the wafer 10 through the transfer port The calibration cavity 300 is connected to the transmission cavity 100, and a calibration component is provided in the calibration cavity 300. The calibration component is used to determine the position of the tray 20 (specifically including the horizontal position and the horizontal position of the tray 20) introduced into the calibration cavity 300. The rotation angle of the tray 20) is calibrated; the first transmission component 200 is disposed in the transmission cavity 100, used to transfer the tray 20 into the calibration cavity 300, and cooperates with the calibration component to calibrate the position of the tray 20, and transfer the calibrated The tray 20 is taken out from the calibration chamber 300 and introduced into the loading chamber 400. It is also used to take out the tray 20 carrying the wafer 10 in the loading chamber 400 from the loading chamber 400 and introduce the reaction through the chamber interface. into the reaction chamber 30, and take out the tray 20 from the reaction chamber 30.

For example, the first transmission component 200 is a vacuum manipulator, and the second transmission component 500 is an atmospheric manipulator.

In the embodiment of the present invention, the wafer transfer system includes a transfer cavity 100, a calibration cavity 300 and a loading cavity 400. The first transfer component 200 can cooperate with the calibration component to calibrate the position of the tray 20 and place the calibrated tray 20 on it. into the loading cavity 400. The second transfer component 500 can place the pre-process wafer 10 on the calibrated pallet 20, or remove the wafer 10 at a determined position from the calibrated pallet 20, so that the wafer 10 can be automatically placed on the pallet. 20 and automatically remove the wafer 10 from the tray 20. The entire transfer process of the wafer 10 and the tray 20 does not require human intervention, thereby improving the efficiency of the semiconductor process and reducing the contamination or damage of the wafer caused by particles adhering to the surface of the wafer. probability, improving the product yield of wafers (for example, silicon carbide wafers).

It should be noted that the transmission chamber 100 has the function of controlling internal gas pressure. Specifically, as shown in FIGS. 1 to 3 , a gate valve 410 and a gate valve driving mechanism 420 are provided at the transfer port of the loading chamber 400 . The gate valve driving mechanism 420 is used to drive the gate valve 410 to selectively close the transfer port, that is, to open or close the transfer port. The transfer port is used to pick and place films from the loading chamber 400 in the second transfer assembly 500. Before operation (i.e., transferring the wafer 10 into the loading chamber 400 or taking out the wafer 10 from the loading chamber 400), the internal air pressure of the transfer chamber 100 changes from vacuum (or close to vacuum) to the same as the external atmospheric pressure, and the back door valve is driven. The mechanism 420 drives the door valve 410 to open the transfer port; after the second transfer assembly 500 performs a pick-and-place operation on the loading chamber 400, the door valve driving mechanism 420 drives the door valve 410 to close the transfer port, and the transfer chamber 100 is evacuated to facilitate subsequent passage through the chamber. The chamber interface is connected to the reaction chamber 30, allowing the first transfer component 200 to perform a pick-and-place operation on the reaction chamber 30 in a vacuum environment, thereby preventing particles and pollutants in the atmosphere from entering the reaction chamber 30, and improving the safety of the wafer processing environment. Cleanliness.

As an optional embodiment of the present invention, both the wafer 10 and the tray 20 have characteristic structures for distinguishing orientations. By identifying the orientation of the characteristic structures on the wafer 10, the patterns or components (such as components) formed on the wafer can be determined. , wafer), similarly, the rotation direction of the tray 20 can be determined by identifying the orientation of the feature structures on the tray 20, thereby achieving precise positioning of the wafer 10 carried thereon.

Specifically, as shown in FIGS. 6 and 7 , the characteristic structure on the tray 20 may be a notch 21 formed on the edge of the tray 20 ; as shown in FIG. 8 , the characteristic structure on the wafer 10 may be a gap 21 formed on the edge of the wafer 10 The flat edge f on one side edge; as shown in Figures 6 and 8, an accommodating groove 22 for accommodating the wafer 10 is formed on the bearing surface of the tray 20, and the edge profile of the accommodating groove 22 corresponds to the edge profile of the wafer 10. That is, the accommodating groove 22 also has a corresponding flat edge g. The wafer 10 is placed on the tray 20 and then embedded into the accommodating groove 22 , thereby improving the distance between the wafer 10 and the tray 20 when the tray 20 drives the wafer 10 to rotate in the reaction chamber 30 relative position stability.

Optionally, as shown in FIGS. 6 and 7 , the orientation of the feature structure (for example, the notch 21 ) of the tray 20 is the same as the orientation of the flat side g of its receiving groove 22 . Optionally, the material of the tray 20 may be graphite.

As an optional embodiment of the present invention, the calibration component includes a tray calibration The tray calibrator 310 and the rotating base (the rotating base is blocked by the tray 20 in Figure 1 and is not shown), the tray calibrator 310 is used to detect the rotation angle of the tray 20 introduced into the calibration chamber 300 and the horizontal position of the center of the tray 20; first The transmission assembly 200 is used to adjust the horizontal position of the tray 20 according to the feedback signal of the tray calibrator 310 after the tray 20 is transferred into the calibration chamber 300, so that the horizontal position of the center of the tray 20 is aligned with the horizontal position of the rotation axis of the rotating base. , and then place the tray 20 on the rotating base; the rotating base is used to drive the tray 20 to rotate around the rotation axis until the characteristic structure (for example, the notch 21) on the tray 20 faces the first preset angle.

In the embodiment of the present invention, the first transmission assembly 200 can adjust the horizontal position of the tray 20 according to the feedback signal of the tray calibrator 310, so that the axis of the tray 20 is aligned with the axis of the rotation axis of the rotating base, that is, the axis of the tray 20 is aligned with the axis of the rotation axis of the rotating base. The center of the projection of the axis on the horizontal plane coincides with the center of the projection of the axis of the rotation axis of the rotating base on the horizontal plane. Specifically, the pallet calibrator 310 can feed back to the first transmission assembly 200 the offset of the axis of the pallet 20 relative to the axis of the rotation axis of the rotary base along the X-axis and Y-axis. The X-axis and Y-axis are the pallet calibrator. 310 establishes the two axes of the X-Y horizontal rectangular coordinate system, the first transmission component 200 moves the horizontal position of the pallet 20 according to the above-mentioned feedback information from the pallet calibrator 310, and performs reverse position compensation on the pallet 20 (that is, moving the pallet 20 along the The Y-axis and the Y-axis perform a displacement equal to the offset amount and in the opposite direction), so that the axis of the tray 20 is aligned with the axis of the rotation axis of the rotating base.

The rotating base can drive the tray 20 to rotate around the rotation axis until the characteristic structure (for example, the notch 21) on the tray 20 faces the first preset angle, thereby achieving the calibration of the horizontal position and orientation of the tray 20, thereby ensuring the first transmission component 200 The accuracy of the horizontal position and orientation of the tray 20 when the tray 20 is taken out of the calibration chamber 300 and sent into the loading chamber 400 again.

As an optional implementation of the present invention, the tray calibrator 310 detects the characteristic structures on the tray 20 based on the principle of optical distance measurement to determine the characteristic structures on the tray 20 . Whether the structure is facing the first preset angle. Specifically, as shown in FIG. 1 , the tray calibrator 310 is located above the rotating base, and can emit detection signals vertically downward at a preset position, and determine whether the feature structure on the tray 20 is facing the first preset position based on the reflected signal. angle, the rotating base stops rotating after the tray calibrator 310 determines that the characteristic structure has moved toward the first preset angle based on the reflected signal, thereby achieving calibration of the rotation direction of the tray 20 .

For example, when the characteristic structure on the pallet 20 is the notch 21, the pallet calibrator 310 can emit the detection signal vertically downward at the preset position. When the notch 21 is not facing the first preset angle, the notch 21 has not reached the pallet calibrator. Just below the preset position where 310 is located, the detection signal will be reflected on the upper surface of the tray 20 to form a reflection signal. When the notch 21 faces the first preset angle, the notch 21 reaches the preset position where the tray calibrator 310 is located. Directly below, at this time, the detection signal propagates downward through the gap 21 to the objects below the tray 20 (such as the bottom wall of the calibration chamber 300, the rotating seat, or other objects arranged below the tray 20) and then reflects. The reflected signal received by the tray calibrator 310 is changed, and then it is determined that the notch 21 is facing the first preset angle.

It should be noted that when the second transfer component 500 picks up the wafer 10, the orientation of the wafer 10 is a certain angle to ensure that the flat edge f of the wafer 10 is aligned with the flat edge g of the receiving groove 22 on the tray 20. . Specifically, the wafer 10 before being placed in the loading chamber 400 can be calibrated through other calibration modules in the wafer transfer system. For example, as an optional implementation of the present invention, as shown in Figure 1, the wafer transfer system also includes a wafer calibrator 600. The wafer calibrator 600 is used to calibrate the rotation direction of the wafer 10 so that the wafer 10 can The feature structure (for example, the flat edge f) on the circle 10 faces the second preset angle, and the second transfer component 500 is used to first transfer the wafer 10 into the wafer calibration after taking the wafer 10 out of the cassette 40 In the wafer 600 , and after the wafer aligner 600 calibrates the rotation direction of the wafer 10 , the wafer 10 is transferred to the tray 20 in the loading cavity 400 through the transfer port.

In the embodiment of the present invention, the calibration component in the calibration chamber 300 can calibrate the rotation angle of the tray 20, and the wafer calibrator 600 can calibrate the rotation angle of the wafer 10. The first preset angle and the second preset angle The angle is set such that after the tray 20 with the feature structure (eg, notch 21 ) facing the first preset angle is taken out of the calibration chamber 300 by the first transfer assembly 200 and transferred into the loading chamber 400 , the feature structure (eg, flat edge) f) The wafer 10 facing the second preset angle is taken out of the wafer aligner 600 by the second transfer assembly 500 and transferred into the loading chamber 400. At this time, the characteristic structures on the wafer 10 (for example, flat edges f ) corresponds to the position and angle of the flat side g of the receiving groove 22 on the tray 20 .

In order to improve the stability of placing the wafer 10 on or removing the wafer 10 from the tray 20 in the loading cavity 400, as a preferred embodiment of the present invention, as shown in Figures 3 and 4, the loading cavity 400 It includes a cavity 430, a base 440, an ejector pin driving assembly and a plurality of ejector pins 450 (PINs). The base 440 is disposed in the cavity 430. The base 440 has a bearing surface for carrying the tray 20. The ejector pin driving assembly is used for driving. The plurality of ejector pins 450 pass upward from the base 440 from the bottom of the bearing surface and pass through the plurality of ejector pin holes on the tray 20 one by one, or the plurality of ejector pins 450 are driven to descend below the bearing surface.

In the embodiment of the present invention, the loading cavity 400 includes a cavity 430, a base 440, an ejection pin driving assembly and a plurality of ejection pins 450. The ejection pin driving assembly can drive the plurality of ejection pins 450 upward and out of the bearing surface of the base 440 and through Multiple ejector pin holes on the tray 20, or multiple ejector pins 450 can be driven downward and retracted below the carrying surface, so that when the second transfer assembly 500 places the wafer 10 on the tray 20, the ejector pin driving assembly can first drive multiple ejector pins 450. The ejector pins 450 rise, place the wafer 10 on the plurality of ejector pins 450, and then drive the plurality of ejector pins 450 down through the ejector pin driving assembly, so that the wafer 10 falls smoothly on the tray 20; similarly, in the second transport assembly 500 When removing the wafer 10 from the tray 20 , first drive the plurality of ejector pins 450 to rise through the ejector pin driving assembly to lift the wafer 10 until it is detached. The tray 20 can be used to remove the wafer 10 from the plurality of ejector pins 450 through the second transfer assembly 500 , thereby improving the stability of placing the wafer 10 on the tray 20 or removing the wafer 10 from the tray 20 in the loading chamber 400 . This ensures the stability of the position between the wafer 10 and the tray 20 .

In order to ensure the consistency of the top heights of multiple ejector pins 450 and improve the levelness of the wafer 10, as a preferred embodiment of the present invention, as shown in Figure 4, the ejector pin drive assembly includes a mounting plate 460, a lift rod 470 and a lift drive. In the assembly 480, a plurality of ejector pins 450 are arranged on the mounting plate 460. A mounting slot is formed on the bearing surface of the base 440. A first through hole a is formed at the bottom of the mounting slot that penetrates to the bottom of the base 440. The mounting plate 460 is arranged on In the installation slot, the top of the lifting rod 470 passes through the first through hole a and is fixedly connected to the mounting plate 460. The lifting drive assembly 480 is used to drive the lifting rod 470 to move in the first through hole a to drive the mounting plate 460 and the mounting plate 460. Set of multiple ejector pins 450 lifts.

In the embodiment of the present invention, multiple ejector pins 450 are arranged on the mounting plate 460, and the lifting drive assembly 480 drives the mounting plate 460 through the lifting rod 470 to drive the multiple ejector pins 450 to move up and down, thereby realizing the synchronous movement of the multiple ejector pins 450 and ensuring that multiple ejector pins 450 move up and down. The feed amount of each ejector pin 450 in the vertical direction is consistent, thus ensuring the parallelism between the wafer 10 and the tray 20 .

In order to improve the compatibility of the wafer transfer system for wafers 10 and trays 20 of different sizes, as a preferred embodiment of the present invention, as shown in FIGS. 4 and 5 , multiple sets of ejector pins 450 are fixedly provided on the mounting plate 460 , the radial distance between the plurality of ejector pins 450 in each group and the axis of the base 440 is equal, thereby achieving compatibility with wafers 10 and trays 20 of different sizes. Optionally, the radial distance between the multiple ejector pins 450 in different groups and the axis of the base 440 may be equal or unequal.

As an optional embodiment of the present invention, as shown in FIG. 5 , the mounting plate 460 includes a connecting portion 461 and three strip portions fixedly arranged at equal intervals around the connecting portion 461 in the circumferential direction. 462, a connecting hole 463 is formed in the center of the connecting portion 461, and the top end of the lifting rod 470 is fixedly arranged in the connecting hole 463; the strip portion 462 extends in the radial direction, and a plurality of strip portions 462 are formed at intervals in the radial direction. Each set of ejector pins 450 includes three ejector pins 450 whose bottom ends are fixed in three ejector pin fixing holes 464 on the three strip portions 462 one-to-one.

That is, for the wafer 10 and the tray 20 of any size, a corresponding three-pin structure can be formed by three ejection pins 450 on the three bar-shaped portions 462 located on the same index circle, and the three-pin structure passes through the tray 20 The three ejection pin holes on the top of the ejection pin 450 form a stable positioning on the plane of the wafer 10 through the tops of the three pins, and the tops of each ejection pin 450 are equally stressed, so that the wafer 10 will not be tilted due to uneven stress, thereby achieving a stable positioning of the wafer 10. The steady rise and fall of the circle 10.

In order to ensure the stability of the movement direction of the plurality of ejector pins 450, as a preferred embodiment of the present invention, as shown in Figure 4, the lifting drive assembly 480 is disposed below the cavity 430, and a second ejector is formed on the bottom wall of the cavity 430. Through hole b, the second through hole b is coaxially arranged with the first through hole a; the bottom end of the lifting rod 470 penetrates to the outside of the cavity 430 through the second through hole b; the lifting driving assembly 480 includes a lifting driving part 480a and an elastic The driving part 480b; the driving shaft of the lifting driving part 480a is used to contact the bottom end of the lifting rod 470 when rising, and push the lifting rod 470 to rise; the elastic driving part 480b is used to apply downward elastic force to the lifting rod 470 to lift the lifting rod 470. When the drive shaft of the lifting drive part 480a moves downward, the lifting rod 470 is driven downward.

In the embodiment of the present invention, the bottom end of the lifting rod 470 has an arc-shaped convex surface 471, which is, for example, a hemispherical surface; the top end of the driving shaft of the lifting driving part 480a has a horizontal contact surface e. When the driving shaft pushes the lifting rod 470 upward, the horizontal contact surface e contacts the arc-shaped convex surface 471 . The lifting rod 470 is driven to rise by pushing up the arc-shaped convex surface 471 at the bottom end of the lifting rod 470 through the horizontal contact surface e, which can effectively ensure that the lifting driving part 480a only exerts a vertical upward lifting force on the lifting rod 470 and will not lift the lifting rod 470 . Lift rod 470 applies level The directional force causes the direction of the lifting rod 470 to deflect, which can effectively ensure the stability of the movement directions of the multiple ejector pins 450 and improve the levelness of the wafer 10 .

As an optional embodiment of the present invention, as shown in Figure 4, the elastic driving part 480b includes a spring 481, a blocking ring 482 and a guide seat 483. The guide seat 483 is fixedly connected to the bottom of the cavity 430, and the bottom surface of the guide seat 483 forms There is a guide groove d, and a third through hole c penetrating to the top surface of the guide base 483 is formed on the bottom surface of the guide groove d. The third through hole c is connected with the second through hole b.

The bottom end of the lifting rod 470 passes through the third through hole c and the guide groove d of the guide seat 483. The blocking ring 482 and the spring 481 are both sleeved on the lifting rod 470, where the blocking ring 482 is located below the bottom surface of the guide groove d. And fixedly connected with the lifting rod 470; the spring 481 is located in the guide groove d and between the blocking ring 482 and the bottom surface of the guide groove d. The spring 481 is used to apply elastic force to the blocking ring 482 to lower the lifting rod 470.

In the embodiment of the present invention, the elastic driving part 480b includes a spring 481, a blocking ring 482 and a guide seat 483. The spring 481 is sleeved on the lifting rod 470 and located in the guide groove d of the guide seat 483, thereby effectively preventing the spring 481 from moving towards the guide seat 483. pops out to improve the overall reliability of the device. Moreover, under the dual guiding action of the outer wall of the lifting rod 470 and the inner wall of the guide groove d, the spring 481 pushes the retaining ring 482 through the elastic force to drive the lifting rod 470 to descend, further reducing the component force received by the lifting rod 470 in the horizontal direction, thereby further This ensures the stability of the movement directions of the multiple ejector pins 450 and improves the levelness of the wafer 10 .

When starting a semiconductor process, for example, when performing a semiconductor process on the first wafer 10 in the same batch of wafers 10 , the tray 20 needs to be introduced into the transfer chamber 100 from the outside through the loading chamber 400 . In order to achieve automatic Run this step to achieve comprehensive automated control. As a preferred embodiment of the present invention, as shown in Figures 1 and 9, the wafer transfer system also includes a tray support block 700. The top of the tray support block 700 has a structure for carrying the tray. 20mm pallet support surface, and The tray support block 700 is formed with an opening 710 in a direction toward the second transport assembly 500 .

As shown in FIG. 10 , the second transmission assembly 500 is also used to extend into the opening 710 when the semiconductor process is started, and to be raised from below the tray support surface to above the tray support surface, thereby transferring the tray 20 carried on the tray support surface. Take it off and put the tray 20 into the loading cavity 400 .

In order to improve the cooling efficiency of the wafer 10 after completing the semiconductor process, as a preferred embodiment of the present invention, as shown in FIG. 1 , the wafer transfer system further includes a cooling chamber 800 , and the cooling chamber 800 is connected with the transfer chamber 100 . After each wafer 10 is processed, the first transfer assembly 200 takes out the tray 20 containing the wafer 10 from the reaction chamber 30 and first puts it into the cooling chamber 800 . After the wafer 10 is cooled to room temperature, it is transferred to the calibration chamber 300 to calibrate the tray 20 , and then is placed into the loading chamber 400 to separate the wafer 10 from the tray 20 .

In order to ensure the stability of the positions between different chambers, as a preferred embodiment of the present invention, as shown in Figure 1, the wafer transfer system also includes a fixed platform 900, a loading chamber 400, a wafer aligner 600, and a tray. The support block 700 and the second transmission component 500 are both fixedly installed on the fixed platform 900 .

Specifically, as an optional embodiment of the present invention, as shown in Figure 1, the transmission chamber 100 has a regular octagonal prism structure, the loading chamber 400 and the chamber interface are respectively located on two opposite sides of the transmission chamber 100, and the fixed platform 900 corresponds to the position of the loading cavity 400. The calibration cavity 300 and the cooling cavity 800 are respectively provided on the two side walls of the transmission cavity 100 adjacent to the side of the loading cavity 400, that is, the upper and lower sides of the right side of the transmission cavity 100 in Figure 1 On the two sides with an included angle of 45°, the connection between the center of the transmission cavity 100 and the center of the calibration cavity 300 and the connection between the center of the transmission cavity 100 and the center of the cooling cavity 800 are both connected to the second transmission component. 500 and the center of the transfer chamber 100 form an included angle of 45°; the second transfer component 500 is located on the side of the loading cavity 400 away from the transfer cavity 100, and the second The centers of the transfer assembly 500, the loading chamber 400 and the transfer chamber 100 are located on the same straight line.

Optionally, the fixed platform 900 also includes two cassette fixing positions for setting the cassette 40, including a first cassette fixing position (located above the second transport assembly 500 in Figure 1) and a second cassette fixing position. (located below the second transport assembly 500 in FIG. 1 ), respectively used to set the cassettes 40 for loading pre-process wafers and post-process wafers.

In order to improve the compactness of the wafer transmission system structure and improve the transmission accuracy and transmission efficiency of the wafer 10, as a preferred embodiment of the present invention, as shown in Figure 1, two cassette fixed bits are respectively located in the second transmission component 500 is on both sides perpendicular to the connecting direction between the second transmission component 500 and the loading cavity 400 (ie, the upper and lower sides of the second transmission component 500 in FIG. 1 ).

The second transfer component 500 is used to first transfer the wafer 10 into the wafer aligner 600 after taking the wafer 10 out of the wafer cassette 40 where the first wafer cassette is fixed, and align the wafer 10 in the wafer aligner 600 After the rotation direction of the circle 10 is calibrated, the wafer 10 is transferred to the tray 20 in the loading cavity 400 through the transfer port; and, after the wafer 10 is taken out of the loading cavity, the wafer 10 is first transferred in In the wafer aligner 600, and after the wafer aligner 600 calibrates the rotation direction of the wafer 10, the wafer 10 is transferred to the cassette 40 in the second cassette fixed position.

Optionally, the tray support block 700 and the wafer aligner 600 are arranged symmetrically with respect to the connection between the second transfer assembly 500 and the loading chamber 400. For example, based on the up, down, left and right directions in Figure 1, the tray support block 700 is located in a direction of 48° to the upper left of the second transfer assembly 500, and the opening 710 of the tray support block 700 is toward the center of the second transfer assembly 500. The wafer aligner 600 is located in a direction of 48° to the lower left of the second transfer assembly 500.

It should be noted that, in order to demonstrate the positional relationship between the tray 20 or the wafer 10 and the chamber or device when it is on each chamber or device station, each chamber and device in Figure 1 is shown as loaded. The state of the tray 20 or wafer 10. For example, calibration chamber 300, loading chamber 400, cooling chamber 800 is shown as being loaded with the tray 20 and the wafer 10 carried thereon, the tray support block 700 is shown as being loaded with the tray 20 , and the wafer aligner 600 is shown as being loaded with the wafer 10 . However, in actual use, only some of these chambers and device stations carry the trays 20 or wafers 10 .

As a second aspect of the present invention, a semiconductor processing equipment is provided, including a wafer transfer system and a reaction chamber 30 . The wafer transfer system is used to transfer the tray 20 carrying the wafer 10 into the reaction chamber 30 and transfer the loaded tray 20 to the reaction chamber 30 . The tray 20 with the wafer 10 is taken out from the reaction chamber 30, and the wafer transfer system is a wafer transfer system provided by the embodiment of the present invention.

In the semiconductor processing equipment provided by the embodiment of the present invention, the wafer transfer system includes a transfer cavity 100, a calibration cavity 300 and a loading cavity 400. The first transfer component 200 can cooperate with the calibration cavity 300 to calibrate the position of the tray 20, and The calibrated pallet 20 is placed into the loading cavity 400, so that the pre-process wafer 10 can be placed on the calibrated pallet 20 by the second transfer assembly 500, or the position determined by the removal position of the calibrated pallet 20. The wafer 10 can automatically place the wafer 10 on the tray 20 and automatically remove the wafer 10 from the tray 20. The entire transmission process of the wafer 10 and the tray 20 does not require human intervention, thereby improving the efficiency of the semiconductor process and It reduces the probability of wafer contamination or damage caused by particles attached to the wafer surface, and improves the product yield of wafers (for example, silicon carbide wafers).

In order to facilitate the understanding of technicians, the following provides a specific embodiment of using the wafer transfer system provided by the embodiment of the present invention to perform semiconductor processing on the same batch of wafers: before the first process starts (that is, the first wafer 10 (before semiconductor manufacturing process), the second transmission component 500 extends into the opening 710 of the tray support block 700 and is raised from below the tray support surface to above the tray support surface of the tray support block 700 (as shown in FIG. 10 ), thereby Remove the pallet 20 carried on the pallet support surface; The gate valve driving mechanism 420 drives the gate valve 410 to open, and the second transport assembly 500 sends the tray 20 into the loading chamber 400 and places it on the base 440 (the rotation direction of the tray 20 is not calibrated at this time).

The gate valve driving mechanism 420 drives the gate valve 410 to close and isolate the outside atmosphere from the chamber environment. The first transfer assembly takes out the tray 20 from the loading chamber 400 (as shown in FIG. 11 ).

The first transmission component sends the tray 20 into the calibration chamber 300, and adjusts the position of the tray 20 along the X-axis and Y-axis according to the feedback signal from the tray calibrator 310 (the horizontal position of the center of the tray 20 relative to the horizontal position of the rotation axis of the rotating base). (measurement) to adjust the horizontal position of the tray 20 so that the horizontal position of the center of the tray 20 is aligned with the horizontal position of the rotation axis of the rotating base. The tray 20 is then placed on the rotating base, and the rotating base drives the tray 20 to rotate until the tray calibrator 310 detects that the notch 21 on the driving tray 20 rotates to a preset position and then stops rotating.

The first transport assembly takes the calibrated tray 20 out of the calibration chamber 300 and puts it back on the base 440 in the loading chamber 400 again. The ejector pin driving assembly drives the plurality of ejector pins 450 upward to pass through the plurality of ejector pins on the tray 20 . pinhole.

The gate valve driving mechanism 420 drives the gate valve 410 to open, and the second transfer assembly 500 takes out the first wafer 10 from the wafer cassette 40 where the first wafer cassette is fixed and puts it into the wafer aligner 600 to adjust the rotation direction of the wafer. After calibration, the calibrated wafer 10 is then transferred to the plurality of ejectors 450 raised in the loading cavity 400 (as shown in FIG. 12 ). The gate valve driving mechanism 420 drives the gate valve 410 to close and isolate the outside atmosphere from the chamber environment.

The ejector pin driving assembly drives the plurality of ejector pins 450 to retract downward, so that the wafer 10 falls into the receiving groove 22 on the tray 20 .

The first transfer component takes out the tray 20 and the wafer 10 carried thereon from the loading chamber 400 and transfers it into the reaction chamber 30 for semiconductor processing.

After each wafer 10 completes the semiconductor process, the first transport component takes out the tray 20 and the wafers 10 carried thereon from the reaction chamber 30 and transfers them to the cooling chamber 800 to wait for the tray 20 and the wafers 10 carried thereon. After the wafer 10 is cooled to room temperature, it is transferred to the calibration chamber 300 , the tray 20 is calibrated, and then it is placed into the loading chamber 400 . , the ejector pin driving assembly drives the plurality of ejector pins 450 upward through the plurality of ejector pin holes on the tray 20 to separate the wafer 10 from the tray 20 .

The gate valve driving mechanism 420 drives the gate valve 410 to open. The second transfer assembly 500 removes the wafer 10 from the plurality of ejector pins 450 and puts it into the wafer aligner 600 to calibrate the rotation direction of the wafer. The calibrated wafer is then calibrated. The circle 10 is transferred to the cassette 40 in the second cassette fixing position.

Subsequently, the second transfer assembly 500 takes out the next wafer 10 from the wafer cassette 40 where the first wafer cassette is fixed and puts it into the wafer aligner 600 to calibrate the rotation direction of the wafer, and then calibrates the calibrated wafer. The circle 10 is transferred to the plurality of ejector pins 450 raised in the loading chamber 400 . The gate valve driving mechanism 420 drives the gate valve 410 to close and isolate the outside atmosphere from the chamber environment.

Repeat the second transfer assembly 500 to take out the wafer 10 to be processed from the cassette 40 in the first cassette fixed position to the second transfer assembly 500 to transfer the processed wafer 10 into the second cassette fixed position. In 40 steps, fully automated production of wafer 10 can be achieved.

The foregoing content summarizes the features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can be variously changed, replaced and modified herein without departing from the spirit and scope of the present disclosure.

10:wafer

20:pallet

30:Reaction chamber

40: film box

100:Transmission cavity

200: First transmission component

300: Calibration cavity

310:Pallet Calibrator

400:Loading cavity

410:gate valve

500: Second transmission component

600: Wafer aligner

700:Pallet support block

800: Cooling chamber

Claims (14)

A wafer transfer system includes a transfer chamber, a first transfer component, a loading chamber, a second transfer component and a calibration chamber, wherein the transfer chamber has a chamber pair for communicating with a reaction chamber. interface; one side of the load chamber is connected to the transfer chamber, and the other side has a selectively opened transfer port; the second transfer component is used to transfer a wafer to the load chamber through the transfer port On a tray, and remove the wafer from the tray in the loading chamber and transfer the wafer out of the loading chamber through the transfer port; the calibration chamber is connected to the transfer chamber, and the calibration chamber A calibration component is provided, the calibration component is used to calibrate the position of the tray introduced into the calibration chamber; the first transfer component is provided in the transfer chamber, used to transfer the tray into the calibration chamber, and The position of the pallet is calibrated with the calibration component, and the calibrated pallet is taken out of the calibration cavity and transferred into the loading cavity, and is also used to load the pallet carrying the wafer in the loading cavity. It is taken out from the loading chamber and introduced into the reaction chamber through the chamber docking interface, and the tray in the reaction chamber is taken out; wherein the loading chamber includes a base, an ejector driving assembly and a plurality of The ejector pin driving assembly is used to drive a plurality of the ejector pins to pass upward from the base from the bottom of the bearing surface of the base and pass through the plurality of ejector pin holes on the tray in one-to-one correspondence, or to drive multiple ejector pins. The ejector pin descends below the bearing surface. The wafer transfer system of claim 1, wherein the ejector drive assembly includes a mounting plate, a lifting rod and a lifting drive assembly. A plurality of the ejector pins are arranged on the mounting plate. A mounting groove is formed on the bearing surface of the base. The bottom of the mounting groove is formed with a first thread penetrating to the bottom of the base. through hole, the mounting plate is arranged in the mounting groove, the top of the lifting rod passes through the first through hole and is fixedly connected to the mounting plate, and the lifting drive assembly is used to drive the lifting rod to lift to drive the mounting plate and A plurality of the thimbles provided on it are lifted and lowered. The wafer transfer system of claim 2, wherein the plurality of ejection pins are divided into multiple groups, and the radial distance between the plurality of ejection pins in each group and the axis of the base is equal. The wafer transfer system according to claim 2, wherein the lifting drive assembly is disposed below the cavity, and a second through hole is formed on the bottom wall of the cavity, and the second through hole is connected with the first through hole. The holes are coaxially arranged; the bottom end of the lifting rod penetrates to the outside of the cavity through the second through hole; the lifting driving assembly includes a lifting driving part and an elastic driving part; a driving shaft of the lifting driving part is used for When rising, it contacts the bottom end of the lifting rod and pushes the lifting rod upward; the elastic driving part is used to apply downward elastic force to the lifting rod to drive the lifting rod downward when the driving shaft descends. The wafer transfer system according to claim 4, wherein the bottom end of the lifting rod has an arc-shaped convex surface; the top end of the driving shaft of the lifting driving part has a horizontal contact surface, and when the driving shaft of the lifting driving part pushes When the lifting rod rises, the horizontal contact surface contacts the arc-shaped convex surface. The wafer transfer system according to claim 4, wherein the elastic driving part includes a spring, a retaining ring and a guide seat, the guide seat is fixedly connected to the bottom of the cavity, and the bottom surface of the guide seat A guide groove is formed, and a third through hole penetrating to the top surface of the guide base is formed on the bottom surface of the guide groove. The third through hole is connected with the second through hole; the bottom end of the lifting rod passes through the The third through hole and the guide groove, the blocking ring and the spring are all sleeved on the lifting rod, wherein the blocking ring is located below the bottom surface of the guide groove and is fixedly connected to the lifting rod; the spring is located on the guide The spring is located in the groove and between the baffle ring and the bottom surface of the guide groove, and is used to apply the elastic force to the baffle ring. A wafer transfer system includes a transfer chamber, a first transfer component, a loading chamber, a second transfer component and a calibration chamber, wherein the transfer chamber has a chamber pair for communicating with a reaction chamber. interface; one side of the load chamber is connected to the transfer chamber, and the other side has a selectively opened transfer port; the second transfer component is used to transfer a wafer to the load chamber through the transfer port on a tray, and remove the wafer from the tray in the loading chamber and transfer the wafer out of the loading chamber through the transfer port; the calibration chamber is connected to the transfer chamber, and the calibration chamber A calibration component is provided, the calibration component is used to calibrate the position of the tray introduced into the calibration chamber; the first transfer component is provided in the transfer chamber, used to transfer the tray into the calibration chamber, and The position of the pallet is calibrated with the calibration component, and the calibrated pallet is taken out of the calibration cavity and transferred into the loading cavity. It is also used to load the pallet carrying the wafer in the loading cavity. It is taken out from the loading chamber and introduced into the reaction chamber through the chamber docking interface, and the tray in the reaction chamber is taken out; wherein, the calibration component includes a tray calibrator and a rotating base, and the tray is calibrated for appliances To detect the rotation angle of the tray introduced into the calibration chamber and the horizontal position of the center of the tray. The wafer transfer system of claim 7, wherein the first transfer component is used to adjust the horizontal position of the tray according to the feedback signal of the tray calibrator after the tray is transferred into the calibration chamber, so that the The horizontal position of the center of the tray is aligned with the horizontal position of the rotation axis of the rotating base, and then the tray is placed on the rotating base; the rotating base is used to drive the tray to rotate around the rotating axis until the characteristic structure on the pallet Toward the first preset angle. The wafer transfer system of claim 7, wherein the tray calibrator is located above the rotating base and can emit a detection signal vertically downward at a preset position, and determine the position of the tray on the basis of a reflected signal. Whether the feature structure faces the first preset angle. A wafer transfer system includes a transfer chamber, a first transfer component, a loading chamber, a second transfer component and a calibration chamber, wherein the transfer chamber has a chamber pair for communicating with a reaction chamber. interface; one side of the load chamber is connected to the transfer chamber, and the other side has a selectively opened transfer port; the second transfer component is used to transfer a wafer to the load chamber through the transfer port on a tray, and remove the wafer from the tray in the loading chamber and transfer the wafer out of the loading chamber through the transfer port; the calibration chamber is connected to the transfer chamber, and the calibration chamber A calibration component is provided, the calibration component is used to calibrate the position of the tray introduced into the calibration chamber; the first transfer component is provided in the transfer chamber, used to transfer the tray into the calibration chamber , and cooperate with the calibration component to calibrate the position of the tray, take the calibrated tray out of the calibration cavity and transfer it into the loading cavity, and also use it to load the wafer in the loading cavity The tray is taken out from the loading chamber and introduced into the reaction chamber through the chamber docking interface, and the tray in the reaction chamber is taken out; wherein, the wafer transfer system also includes a fixed platform, which carries Both the inlet cavity and the second transmission component are fixedly arranged on the fixed platform. The wafer transfer system according to claim 10, wherein the wafer transfer system further includes a wafer calibrator fixedly installed on the fixed platform, and the wafer calibrator is used to calibrate the rotation direction of the wafer, Make the feature structure on the wafer face a second preset angle; the fixed platform also includes a first cassette fixing position and a second cassette fixing position for setting the cassette, the second transmission component, the The centers of the loading chamber and the transfer chamber are located on the same straight line, and the first cassette fixing position and the second cassette fixing position are respectively located between the center of the second transfer component and the carrier perpendicular to the second transfer component. Both sides in the connecting direction between the centers of the cavity; the second transfer component is used to first transfer the wafer into the wafer cassette after taking the wafer out of the wafer cassette fixed in the first wafer cassette. In the circular calibrator, and after the wafer calibrator calibrates the rotation direction of the wafer, the wafer is transferred to the tray in the loading chamber through the transfer port; and, after the wafer is transferred from After being taken out of the loading cavity, the wafer is first transferred into the wafer calibrator, and after the wafer calibrator calibrates the rotation direction of the wafer, the wafer is transferred to the second wafer. The cassette is fixed in the film cassette. The wafer transfer system according to claim 11, wherein the wafer transfer system further includes a tray support block fixedly arranged on the fixed platform, and the top of the tray support block has a The pallet support surface of the carrying pallet, and the pallet support block forms an opening in the direction toward the second transmission component; the second transmission component is also used to extend into the opening and rise from below the tray support surface to above the The position of the tray support surface is such that the tray carried on the tray support surface is removed, and then the tray is placed into the loading cavity. The wafer transfer system as claimed in claim 12, wherein the wafer transfer system further includes a cooling chamber, the cooling chamber is connected with the transfer chamber, and the first transfer component is used to place the wafer in the After the tray is taken out of the reaction chamber, it is first placed into the cooling chamber. After the tray and the wafer carried on it are cooled to a preset temperature, they are then transferred to the calibration chamber; the transfer chamber The connection between the center of the second transmission component and the center of the calibration cavity and the connection between the center of the transmission cavity and the center of the cooling cavity are both connected with the connection between the center of the second transmission component and the center of the transmission cavity. The lines form an angle of 45°. A semiconductor processing equipment, which includes a wafer transfer system and a reaction chamber. The wafer transfer system is used to introduce a tray carrying a wafer into the reaction chamber and remove the tray carrying the wafer from the reaction chamber. be taken out, and the wafer transfer system is the wafer transfer system described in any one of claims 1 to 13.