CN114883234A - Transfer device and method for automatically transferring multiple wafers and vapor deposition system - Google Patents

Transfer device and method for automatically transferring multiple wafers and vapor deposition system Download PDF

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Publication number
CN114883234A
CN114883234A CN202210480637.XA CN202210480637A CN114883234A CN 114883234 A CN114883234 A CN 114883234A CN 202210480637 A CN202210480637 A CN 202210480637A CN 114883234 A CN114883234 A CN 114883234A
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tray
wafer
vapor deposition
manipulator
station
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吕立平
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Hico Semiconductor Technology Suzhou Co ltd
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Hico Semiconductor Technology Suzhou Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a transfer device and a method for automatically transferring multiple wafers and a vapor deposition system, wherein the transfer device for automatically transferring multiple wafers comprises a tray transfer mechanism, a tray, a first manipulator, a push rod mechanism and a second manipulator, wherein: the top of the tray rotating mechanism is provided with a rotating platform capable of rotating; is arranged on the rotating platform; the first mechanical arm can support the bottom surface of the wafer; the push rod mechanism can drive the lifting rod in the vertical direction, and the driving rod can be aligned to one tray station on the tray in the vertical direction; the execution end of the second mechanical arm can support the bottom surface of the tray. The invention provides a transfer device and a transfer method for automatically transferring multiple wafers and a vapor deposition system, which solve the problem of automatic stacking and transferring of the wafers, thereby realizing the layout of multiple wafers on a tray, facilitating vapor deposition of vertical airflow, realizing automatic transfer of multiple wafers and realizing efficient operation.

Description

Transfer device and method for automatically transferring multiple wafers and vapor deposition system
Technical Field
The invention relates to the technical field of manufacturing of semiconductor devices, in particular to a transfer device and a method for automatically transferring multiple wafers and a vapor deposition system.
Background
SiC is one of the representatives of the third generation semiconductor materials, devices made of the materials have been widely applied to the fields of small volume, high withstand voltage and large current of electric vehicles, charging piles and motor cars, wherein the epitaxy of the SiC substrate is a key previous process in the device manufacturing process, and the current technologies include a Horizontal (abbreviated as H) type and a Vertical (abbreviated as V) type from the view of air flow distribution; from the number of epitaxial wafers, there are Single (S) and Multi (M) wafers; from the viewpoint of the automation degree of loading wafers, there are Automatic (abbreviated as a) and Manual (abbreviated as U). The technology combinations currently on the market are horizontal single-chip automation (HSA), horizontal multi-chip manual (HMU), vertical single-chip automation (VSA), and horizontal single-chip manual (HSU). Currently, the most efficient combination is vertical multi-slice automation (VMA), mainly because no technology for automatic loading is currently available.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a transfer device, a method and a vapor deposition system for automatically transferring multiple wafers, so as to solve the problem of automatically loading multiple wafers.
In order to solve the above technical problem, the present invention provides an automatic transfer device for transferring a plurality of wafers, comprising:
the top of the tray rotating mechanism is provided with a rotating platform capable of rotating;
the tray is arranged on the rotating platform, a plurality of uniformly distributed tray stations are arranged around the center of the tray, a through hole is formed in the center of each tray station, and the size of each through hole is smaller than that of the wafer;
the first mechanical arm is arranged on the side of the tray rotating mechanism, and an execution end of the first mechanical arm is provided with a U-shaped opening which can support the bottom surface of the wafer;
the top rod mechanism can drive a lifting rod in the vertical direction, the driving rod can be aligned to one of the through holes in the vertical direction, the top end of the lifting rod is provided with a supporting platform, the size of the supporting platform is smaller than that of the U-shaped opening, so that the supporting platform can be placed in the U-shaped opening, and the size of the supporting platform is smaller than that of the through hole, so that the supporting platform can pass through the through hole;
and the second manipulator is arranged on the other side of the tray rotating mechanism, and an execution end of the second manipulator is provided with a U-shaped bracket for supporting the bottom surface of the tray.
In a preferred scheme, each tray station is provided with a fixing groove matched with the shape and the thickness of the wafer.
In a preferred embodiment, a cover plate is disposed on the through hole, and the height of the cover plate is not higher than the height of the edge of the fixing groove.
In a preferred embodiment, the first manipulator is arranged on a vertically arranged linear guide; the first manipulator is a double manipulator, and the middle of the double manipulators is connected to a rotating shaft;
the second manipulator is a double-manipulator, and the middle of the double-manipulator is connected to a rotating shaft.
In a preferred scheme, a positioning structure is arranged on the tray, so that the tray can be positioned after rotating one tray station; preferably, the positioning structures are positioning grooves arranged on the circumference of the tray, and the number of the positioning grooves is consistent with that of the tray stations.
In a preferred scheme, the device further comprises a wafer identification device which can identify the reference edge of the wafer.
In a preferred scheme, the tray is in a shape of a disc or a regular polygon; the number of the tray stations is 3-6.
The invention also provides a wafer stacking method, which uses the automatic transfer multi-wafer transfer device and comprises the following steps:
placing the tray on a rotating platform of the tray rotating mechanism;
controlling an execution end of the first manipulator to support the bottom surface of a first wafer, identifying a reference surface of the wafer, and transferring the reference surface to a position right above a tray station corresponding to the ejector rod mechanism on the tray;
controlling a lifting rod of the top rod mechanism to move upwards, penetrating through the through hole of the tray station and supporting a supporting platform at the top end of the through hole on the bottom surface of the first wafer;
controlling the first mechanical arm to withdraw, then controlling a lifting rod of the push rod mechanism to fall back, so that the first wafer falls on the tray station, and continuously descending the lifting rod until the first wafer is separated from the tray;
and operating the tray rotating mechanism to rotate, enabling the next tray station to be correspondingly positioned right above the ejector rod mechanism, and repeating the steps until all tray stations of the trays are stacked with wafers.
The invention also provides a wafer transfer method, which uses the automatic transfer multi-wafer transfer device, and comprises the following steps:
controlling the second manipulator to place the tray full of wafers subjected to vapor deposition on a rotating platform of the tray rotating mechanism, and operating the tray rotating mechanism to enable a tray station on the tray to be aligned to the position right above the ejector rod mechanism;
operating a lifting rod of the ejector rod mechanism to lift the wafer subjected to vapor deposition above the tray station upwards so that the wafer subjected to vapor deposition is separated from the tray station;
controlling the execution end of the first mechanical arm to support the bottom surface of the wafer subjected to vapor deposition, transferring the wafer subjected to vapor deposition to a wafer box frame of a loading table, and simultaneously controlling a lifting rod of the ejector rod mechanism to descend below the tray;
controlling an execution end of the first mechanical arm to support the bottom surface of a wafer to be subjected to vapor deposition; then controlling a first mechanical arm to transfer the wafer to be subjected to vapor deposition to a position right above a tray station corresponding to the ejector rod mechanism on the tray;
controlling a lifting rod of the top rod mechanism to move upwards, penetrating through a through hole of the tray station and supporting the plane at the top end of the lifting rod at the center of the bottom surface of the wafer;
controlling the first mechanical arm to withdraw, then controlling a lifting rod of the push rod mechanism to fall back, enabling the wafer to fall on a station of the tray, and enabling the lifting rod to continuously fall until the wafer is separated from the tray;
and operating the tray rotating mechanism to rotate, enabling the next station to be correspondingly positioned right above the ejector rod mechanism, and repeating the steps until the wafers subjected to vapor deposition on all stations of the tray are replaced by the wafers to be subjected to vapor deposition.
The invention also provides a vapor deposition system for automatically transferring a plurality of wafers, which comprises the automatic transfer device for transferring a plurality of wafers, and:
a loading table having cassette holders and the first robot thereon, the first robot being operable to remove and move a wafer on the cassette holder above one of the tray stations on the tray and to remove and move a wafer above the tray station onto the cassette holder;
the loading cavity is internally provided with the ejector rod mechanism and the tray rotating mechanism;
a transfer chamber connected to the loading chamber, wherein the second robot is disposed therein, and the second robot is operable to move the tray in the loading chamber between the loading chamber and the reaction chamber;
and the reaction cavity is connected with the transfer cavity.
Optionally, the transfer device further comprises a transfer chamber, the transfer chamber is arranged at the side of the transfer chamber and connected with the transfer chamber, and the second manipulator can enter the transfer chamber in an operation mode.
The implementation of the invention has the following beneficial effects:
the invention provides a transfer device and a transfer method for automatically transferring multiple wafers and a vapor deposition system, which solve the problem of automatic stacking and transferring of the wafers, thereby realizing the layout of multiple wafers on a tray, facilitating vapor deposition of vertical airflow, realizing automatic transfer of multiple wafers and realizing efficient operation.
Drawings
FIG. 1 is a schematic top view of a vapor deposition system for automated transfer of multiple wafers according to the present invention;
FIG. 2 is a schematic side view of a vapor deposition system for automated transfer of multiple wafers according to the present invention;
FIG. 3 is a schematic top view of the pallet of the present invention;
FIG. 4 is a schematic cross-sectional view of the pallet of the present invention;
FIG. 5 is a schematic top view of a vapor deposition system for automated transfer of multiple wafers according to another embodiment of the present invention.
In the figure:
1. a sheet cassette holder; 2. a loading table; 3. a first manipulator; 4. a tray; 5. a loading chamber; 6. a transfer chamber; 7. a second manipulator; 8. a reaction chamber; 9. a push rod mechanism; 10. a tray rotating mechanism; 11. a tray station; 12. a through hole; 13. a cover plate; 14. a linear guide rail; 15. a wafer; 16. a support platform; 17. rotating the platform; 18. a transfer chamber.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1-2, the present invention provides an automatic transfer device for transferring multiple wafers, comprising a tray rotating mechanism 10, a tray 4, a first robot 3, a lift pin mechanism 9, and a second robot 7, wherein:
the top of the tray rotating mechanism 10 is provided with a rotating platform 17 capable of rotating, the rotating platform 17 is usually circular, can be in the shape of regular polygon, can also be in a radial structure, or can be in a grid or perforated plane structure, the rotating platform 17 is used for supporting the tray 4, and through the structural design, the through hole 12 on the tray 4 is avoided, so that the lifting rod of the push rod mechanism 9 can pass through the through hole 12; the tray rotating mechanism 10 is usually driven by a stepping motor at the lower part to rotate, and may be configured to stop when rotating to a specified azimuth angle, and the rotation is not continued until receiving a next rotation instruction, the above-mentioned azimuth angle is in one-to-one correspondence with the number of through holes on the tray, for example, when the number of through holes on the tray is 3, the azimuth angle of each rotation is 120 degrees, and when the number of through holes on the tray is 5, the azimuth angle of each rotation is 72 degrees; generally, the structural size of the rotating platform 17 should be smaller than that of the tray 4 to avoid the through hole 12, so as to ensure that the rotating platform 17 of the push rod mechanism 9 can pass through the through hole 12 of the tray 4 upwards, and meet the working requirement of the push rod mechanism 9.
The tray 4 is in a disc structure (as shown in fig. 3-4) or in a regular polygon shape, is arranged on a rotating platform 17 of the tray rotating mechanism 10, is provided with a plurality of uniformly distributed tray stations 11 around the center of the disc, is provided with a through hole 12 at the center of each tray station 11, has 3-6 through holes 12, and has the size smaller than that of the wafer, so that the wafer can cover the through holes 12 and be held by the tray when falling; when the pallet 4 takes the shape of a regular polygon, typically an even number of regular polygons such as a regular hexagon, a regular quadrangle, or a regular octagon, the purpose of which is to facilitate the second robot 7 to hold the pallet from both sides thereof (if an odd number of regular polygons such as a regular pentagon, it is difficult to hold the pallet from opposite sides because it is not an axisymmetric structure). The tray is provided with a positioning structure so that the tray can be positioned after rotating one tray station; preferably, the positioning structures are positioning grooves arranged on the circumference of the tray, and the number of the positioning grooves is consistent with that of the tray stations, so that the rotation angle defined between the two positioning grooves can be ensured to be equal to the angle between the two tray stations.
The first mechanical arm 3 is arranged at the side of the tray rotating mechanism 10, and an execution end of the first mechanical arm is provided with an execution end with a U-shaped opening and can support the bottom surface of the wafer 15; due to the design of the U-shaped opening, after the wafer is vertically supported by the push rod mechanism 9, the first mechanical arm 3 can be operated to move horizontally and withdraw along the reverse direction of the U-shaped opening, so that the push rod mechanism 9 can drive the wafer to fall down and place the wafer on the tray 4 conveniently; the first manipulator has 3-6 degrees of freedom, so that the requirements of taking and placing the film in each operation can be met; the first manipulator 3 can move up and down, and at the moment, the first manipulator 3 can be driven to move up and down by virtue of the vertically-driven linear guide rail 14, but when the first manipulator has 5 or 6 degrees of freedom, the first manipulator can also move up and down by virtue of a self mechanical structure (at the moment, a vertically-driven guide rail does not need to be designed independently); optionally, the first manipulator 3 is two manipulators, the two manipulators are connected to a rotating shaft in the middle, and the two manipulators are connected to the rotating shaft in a symmetrical manner, so that the two manipulators can alternately complete the operation of taking and placing the film.
The push rod mechanism 9 can drive a lifting rod in the vertical direction, the driving rod can be aligned with one of the through holes 12 in the vertical direction, and the top end of the lifting rod is provided with a supporting platform 17 so as to support the lifting rod on the bottom surface of the wafer 15 and ensure the stability of the wafer after the execution end of the first mechanical arm 3 withdraws; the size of the supporting platform 17 is smaller than that of the U-shaped opening, so that the supporting platform can be placed in the U-shaped opening, and the lifting rod can penetrate through the U-shaped opening and be supported on the bottom surface of the wafer; the size of the support platform 17 is smaller than the size of the through hole so that the support platform 17 can move upwards through the through hole;
the second manipulator 7 is arranged at the other side of the tray rotating mechanism 10, and an execution end of the second manipulator is provided with a U-shaped bracket for holding the bottom surface of the tray 4. Alternatively, the second manipulator 7 is a double manipulator, and the double manipulators are symmetrically connected to the rotating shaft and work independently, so that the double manipulators can alternately complete the operation of taking and placing the pallet.
Further optionally, the apparatus for transferring multiple wafers automatically in transmission provided by this embodiment further includes a wafer recognition device, capable of recognizing the reference edge of the wafer, where the wafer recognition device may be disposed at an execution end of the first robot, or may be disposed at a fixed position independently from the first robot 3; the wafer identification device can identify the wafer in an image or radio frequency identification mode and judge the position and the edge of the wafer.
The invention provides a transfer device for automatically transferring multiple wafers, which solves the problem of automatic stacking and transferring of the wafers, so that the arrangement of multiple wafers on a tray can be realized, the vapor deposition of vertical airflow is facilitated, the automatic transfer of the multiple wafers can be realized, and the efficient operation is realized.
The invention also provides a wafer stacking method, which uses the automatic transfer multi-wafer transfer device, and comprises the following steps:
placing the tray 4 on a rotating platform 17 of the tray rotating mechanism 10, rotating the tray rotating mechanism 10 to align one tray station 11 of the tray rotating mechanism with the position right above the ejector rod mechanism 9, generally clamping two sides of the tray 4 by using a second manipulator 7, moving the tray to the position above the rotating platform 17 of the tray rotating mechanism 10, aligning the center of the rotating platform, and lightly placing the tray on the rotating platform;
controlling the execution end of the first manipulator 3 to support the bottom surface of the first wafer, wherein the execution end is usually required to support the center of the bottom surface of the wafer, and after the reference surface of the wafer is identified, the part of the U-shaped opening of the execution end is avoided from the center of the bottom surface of the wafer, so that the support platform 16 of the ejector rod mechanism 9 can be supported at the center of the bottom surface of the wafer; then, controlling the first mechanical arm 3 to transfer the wafer to the position right above a tray station 11 corresponding to the ejector rod mechanism 9 on the tray;
controlling the supporting platform 16 of the mandril mechanism 9 to move upwards, penetrating through the through hole and supporting the supporting platform 16 at the center of the bottom surface of the first wafer;
controlling the first mechanical arm 3 to withdraw, then controlling the lifting rod of the mandril mechanism 9 to fall back, so that the first wafer falls on the tray 4, and continuously descending the lifting rod until the supporting platform 16 is separated from the tray 4;
and operating the tray rotating mechanism 10 to rotate to enable the next through hole to be correspondingly positioned right above the ejector rod mechanism 9, and repeating the steps until all the through holes of the tray are stacked with wafers.
When the first manipulator 3 adopts two manipulators, the two manipulators can continuously and simply alternately operate the wafer taking and placing, so that the wafer stacking efficiency is doubled.
The invention provides a stacking method for automatically transferring multiple wafers, which solves the problems of automatic stacking and transferring of the wafers, thereby realizing the layout of multiple wafers on a tray, facilitating vapor deposition of vertical airflow, realizing automatic transfer of multiple wafers and realizing efficient operation.
The invention also provides a wafer transfer method, which uses the automatic transfer multi-wafer transfer device, and comprises the following steps:
controlling a second manipulator 7 to place the tray 4 full of wafers subjected to vapor deposition on a rotating platform of the tray rotating mechanism 10, operating the tray rotating mechanism to enable one tray station 11 on the tray to be aligned to be right above the ejector rod mechanism 9, generally, the second manipulator 7 is used for holding the tray 4 from the lower edge of the tray, moving the tray to be above the rotating platform of the tray rotating mechanism 10, and aligning the center of the platform to be lightly placed on the rotating platform;
operating a supporting platform 16 of the ejector rod mechanism 9 to lift the wafer subjected to vapor deposition above the supporting platform upwards so as to separate the wafer from the tray station 11 (namely the position of the through hole);
controlling the execution end of the first mechanical arm 3 to support the bottom surface of the wafer subjected to vapor deposition, transferring the wafer subjected to vapor deposition to the wafer box frame 1 of the loading table 2, and simultaneously controlling the supporting platform 16 of the ejector rod mechanism to descend below the tray;
controlling the execution end of the first mechanical arm 3 to support the bottom surface of a wafer to be subjected to vapor deposition, wherein the execution end is generally required to support the center of the bottom surface of the wafer, and the U-shaped opening part of the execution end is avoided from the center of the bottom surface of the wafer, so that the supporting platform 16 of the ejector rod mechanism 9 can be supported at the center of the bottom surface of the wafer; then, controlling the first mechanical arm 3 to transfer the wafer to the position right above the through hole on the tray corresponding to the push rod mechanism 9;
controlling the supporting platform 16 of the mandril mechanism 9 to move upwards, penetrating through the through hole 12 and supporting the plane of the top end of the supporting platform at the center of the bottom surface of the wafer;
controlling the first mechanical arm 3 to withdraw, then controlling the supporting platform 16 of the mandril mechanism 9 to fall back, so that the wafer is placed on the station of the tray 4, and the supporting platform 16 is continuously descended until the wafer is separated from the tray 4;
and operating the tray rotating mechanism 10 to rotate, so that the next station (namely the position of the next through hole) is correspondingly positioned right above the push rod mechanism 9, and repeating the steps until the wafers subjected to vapor deposition on all the stations of the tray are replaced by the wafers to be subjected to vapor deposition.
When the first manipulator 3 adopts two manipulators, the two manipulators can continuously and simply alternately operate the wafer taking and placing, so that the wafer stacking efficiency is doubled.
The invention provides a stacking method for automatically transferring multiple wafers, which solves the problems of automatic stacking and transferring of the wafers, thereby realizing the layout of multiple wafers on a tray, facilitating vapor deposition of vertical airflow, realizing automatic transfer of multiple wafers and realizing efficient operation.
The invention also provides a vapor deposition system for automatically transferring a plurality of wafers, which comprises the automatic transfer device for transferring a plurality of wafers.
The automatic transfer multi-wafer vapor deposition system further comprises a loading platform 2, a loading cavity 5, a transfer cavity 6 and a reaction cavity 8, wherein:
the loading platform 2 is provided with a wafer box frame 1 and the first mechanical arm 3, and the first mechanical arm 3 can be used for removing and moving the wafer on the wafer box frame 1 to the position above one tray station 11 of the tray 4 and removing and moving the wafer above the tray station to the wafer box frame;
the push rod mechanism 9 and the tray rotating mechanism 10 are arranged in the loading cavity 5;
a transfer chamber 6 is connected to the loading chamber 5, in which a second robot 7 is arranged, the second robot 7 being operable to move the trays in the loading chamber between the loading chamber and the reaction chamber; the execution end of the second manipulator 7 adopts a clamping structure design, and can clamp the tray from two sides of the tray; the second manipulator can also adopt double manipulators, so that the work of taking and placing the film can be finished alternately;
the reaction chamber 8 is connected to said transfer chamber 6 and separated from it by a door of the transfer chamber 6.
As shown in fig. 5, optionally, the automated multi-wafer transferring vapor deposition system provided in this embodiment further includes a transferring chamber 18, the transferring chamber 18 is disposed at a side of the transferring chamber 6 and connected to the transferring chamber, and the second robot 7 can enter the transferring chamber 18. Through the design of transfer chamber 18, can operate the second manipulator and keep in the tray in transfer chamber 18 to the tray that makes reaction chamber 8 take out can be put in transfer chamber 18, and put in reaction chamber 8 the tray that is kept in transfer chamber 18 and is loaded with the vapour deposition wafer, makes reaction chamber 8 can continuous operation, thereby has improved work efficiency.
The invention provides a vapor deposition system for automatically transferring multiple wafers, which solves the problem of automatic stacking and transferring of the wafers, thereby realizing the layout of multiple wafers on a tray, facilitating vapor deposition of vertical airflow, realizing automatic transfer of multiple wafers and realizing efficient operation.
The working process of the vapor deposition system for automatically transferring a plurality of wafers provided by the embodiment can be as follows:
step one, vacuumizing (less than or equal to 10) the reaction chamber 8 -3 After Kpa) state, raising the temperature to be not more than 1000 ℃;
step two, mounting the Cassette filled with the wafers on the wafer Cassette rack 1;
step three, the first mechanical arm 3 scans, finds the wafer to be selected according to the setting and takes away the wafer;
step four, placing the wafer on an edge finder (not shown) to find the characteristics (such as the coordinates of a reference edge or a center point) of the wafer, and simultaneously filling the loading chamber 5 with gas to atmospheric pressure;
fifthly, the first mechanical arm 3 takes back the wafer with the found edge, the door of the loading cavity 5 is opened, and the first mechanical arm 3 is used for conveying the wafer to the upper part of the tray 4;
sixthly, the mandril mechanism 9 is used for ascending to support and support the wafer on the first mechanical arm 3, the first mechanical arm 3 withdraws, the lifting rod of the mandril mechanism 9 falls down, and the wafer enters a tray station (namely the position of the through hole);
seventhly, positioning the tray station to the next station (the position of the next through hole) through the tray rotating mechanism 10, and repeating the steps from three to six until all the stations of the tray are provided with the wafers;
step eight, after all the wafers are placed, performing flushing and pumping on the loading cavity 5 for multiple times, and finally maintaining the pressure at a set pressure;
step nine, after the set pressure is kept, the doors of the transfer cavity 6, the loading cavity 5 and the reaction cavity 8 are opened;
step ten, transferring the tray 4 to the reaction chamber 8 by using the second manipulator 7, withdrawing the second manipulator 7, and closing the door of the reaction chamber 8;
step eleven, operating a wafer operation program (Recipe);
step twelve, after the program operation is finished, cooling to the chip taking temperature, and taking back the tray 4 to the loading cavity 5 by using the second manipulator 7;
step thirteen, closing the door between the loading cavity 5 and the transfer cavity 6, and inflating the loading cavity 5 to atmospheric pressure;
step fourteen, the tray rotating mechanism 10 accurately positions the tray 4 to a set position;
step fifteen, the ejector rod mechanism 9 jacks up the wafer, and the wafer is placed back to the case according to the reverse process from the step three to the step six;
sixthly, after all the wafers on the tray 4 are placed back to cassette, all the processes of the equipment are finished.
In the above steps, the order is not absolutely limited according to the sequence number, for example, step one and step two do not require step one to precede step two, step two may actually precede step one, and other steps are similar in order and will not be described again.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An automatic change transmission multi-disc wafer transfer device which characterized in that includes:
the top of the tray rotating mechanism is provided with a rotating platform capable of rotating;
the tray is arranged on the rotating platform, a plurality of uniformly distributed tray stations are arranged around the center of the tray, a through hole is formed in the center of each tray station, and the size of each through hole is smaller than that of the wafer;
the first mechanical arm is arranged on the side of the tray rotating mechanism, and an execution end of the first mechanical arm is provided with a U-shaped opening which can support the bottom surface of the wafer;
the top rod mechanism can drive a lifting rod in the vertical direction, the driving rod can be aligned to one of the through holes in the vertical direction, the top end of the lifting rod is provided with a supporting platform, the size of the supporting platform is smaller than that of the U-shaped opening, so that the supporting platform can be placed in the U-shaped opening, and the size of the supporting platform is smaller than that of the through hole, so that the supporting platform can pass through the through hole;
and the second manipulator is arranged on the other side of the tray rotating mechanism, and an execution end of the second manipulator is provided with a U-shaped bracket for supporting the bottom surface of the tray.
2. The automated multi-wafer transfer device of claim 1,
each tray station is provided with a fixing groove matched with the shape and the thickness of the wafer.
3. The automated multi-wafer transfer device of claim 2,
and the cover plate is arranged on the through hole, and the height of the cover plate is not higher than that of the edge of the fixing groove.
4. The automated multi-wafer transfer device of claim 1,
the first manipulator is arranged on a linear guide rail which is vertically arranged.
Optionally, the first manipulator is a double manipulator, and the middle of the double manipulators is connected to a rotating shaft.
Optionally, the second manipulator is a double manipulator, and the middle of the double manipulators is connected to a rotating shaft.
5. The automated multi-wafer transfer device of claim 1,
the tray is provided with a positioning structure so that the tray can be positioned after rotating one tray station; preferably, the positioning structures are positioning grooves arranged on the circumference of the tray, and the number of the positioning grooves is consistent with that of the tray stations.
6. The automated multi-wafer transfer device of claim 1,
the wafer identification device is further included and can identify the reference edge of the wafer.
7. The automated multi-wafer transfer device of claim 1,
the tray is in a disc or regular polygon shape; the number of the tray stations is 3-6.
8. A method for stacking wafers, using the automated multi-wafer transfer apparatus of any one of claims 1-7, comprising:
placing the tray on a rotating platform of the tray rotating mechanism;
controlling an execution end of the first manipulator to support the bottom surface of a first wafer, identifying a reference surface of the wafer, and transferring the reference surface to a position right above a tray station corresponding to the ejector rod mechanism on the tray;
controlling a lifting rod of the top rod mechanism to move upwards, penetrating through the through hole of the tray station and supporting a supporting platform at the top end of the through hole on the bottom surface of the first wafer;
controlling the first mechanical arm to withdraw, then controlling a lifting rod of the push rod mechanism to fall back, so that the first wafer falls on the tray station, and continuously descending the lifting rod until the first wafer is separated from the tray;
and operating the tray rotating mechanism to rotate, enabling the next tray station to be correspondingly positioned right above the ejector rod mechanism, and repeating the steps until all tray stations of the trays are stacked with wafers.
9. A method for transferring a wafer, using the automated transfer multi-wafer transfer apparatus of any one of claims 1-7, comprising:
controlling the second manipulator to place the tray full of wafers subjected to vapor deposition on a rotating platform of the tray rotating mechanism, and operating the tray rotating mechanism to enable a tray station on the tray to be aligned to the position right above the ejector rod mechanism;
operating a lifting rod of the ejector rod mechanism to lift the wafer subjected to vapor deposition above the tray station upwards so that the wafer subjected to vapor deposition is separated from the tray station;
controlling the execution end of the first mechanical arm to support the bottom surface of the wafer subjected to vapor deposition, transferring the wafer subjected to vapor deposition to a wafer box frame of a loading table, and simultaneously controlling a lifting rod of the ejector rod mechanism to descend below a tray;
controlling an execution end of the first mechanical arm to support the bottom surface of a wafer to be subjected to vapor deposition; then controlling a first mechanical arm to transfer the wafer to be subjected to vapor deposition to a position right above a tray station corresponding to the ejector rod mechanism on the tray;
controlling a supporting platform of the ejector rod mechanism to move upwards, penetrating through a through hole of the tray station and supporting the plane at the top end of the supporting platform at the center of the bottom surface of the wafer;
controlling the first mechanical arm to withdraw, then controlling a supporting platform of the ejector rod mechanism to fall back, enabling the wafer to fall on a station of the tray, and enabling the supporting platform to continuously descend until the supporting platform is separated from the tray;
and operating the tray rotating mechanism to rotate, enabling the next station to be correspondingly positioned right above the ejector rod mechanism, and repeating the steps until the wafers subjected to vapor deposition on all stations of the tray are replaced by the wafers to be subjected to vapor deposition.
10. An automated multi-wafer transfer robot for vapor deposition, comprising the automated multi-wafer transfer robot of any of claims 1-7, and:
a loading table having cassette holders and the first robot thereon, the first robot being operable to remove and move a wafer on the cassette holder above one of the tray stations on the tray and to remove and move a wafer above the tray station onto the cassette holder;
the loading cavity is internally provided with the ejector rod mechanism and the tray rotating mechanism;
a transfer chamber connected to the loading chamber, wherein the second robot is disposed therein, and the second robot is operable to move the tray in the loading chamber between the loading chamber and the reaction chamber;
and the reaction cavity is connected with the transfer cavity.
Optionally, the transfer device further comprises a transfer chamber, the transfer chamber is arranged at the side of the transfer chamber and connected with the transfer chamber, and the second manipulator can enter the transfer chamber in an operation mode.
CN202210480637.XA 2022-05-05 2022-05-05 Transfer device and method for automatically transferring multiple wafers and vapor deposition system Pending CN114883234A (en)

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