TWI283037B - Cluster-tool wafer transporting device and method - Google Patents

Abstract

The present invention provides a cluster-tool wafer transporting device and method, wherein a cluster-tool wafer transporting equipment (including a front end module, a load-lock, a multi-surface opening type wafer transporting chamber, a mechanical arm, and a transporting platform controller) is associated with a batch type high-temperature cold wall CVD processing module, and they are controlled through a graphic man-machine interface of the transporting platform controller. After the operator places a cassette on the uploading port in the atmospheric environment, the transporting platform controller uploads the wafer automatically in a batch from the cassette in the front-end module onto the cassette solely for front-side sucking in the load-lock by the mechanical arm, and loads the wafer required by the batch processing into the wafer-carrying disk in the processing chamber by the mechanical arm for front-side sucking, so as to proceed the CVD process. Since the wafer-in process is automatic in present invention, the contamination is reduced and the wafer-loading efficiency is enhanced effectively to increase the yield rate. The batch type high-temperature cold wall process has the characteristic of high temperature and high efficiency. It can be applied sufficiently in cooperation with the processing demands of low contamination, large dimension, high impedance, low defect and high thickness.

Description

A^83〇37

The transfer device and method, in particular, the deposition process and other related systems - 5 ΐ 系 关于 关于 关于 关于 关于 关于 关于 关于 关于 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : BACKGROUND OF THE INVENTION When t = the equipment used in the chemical vapor deposition process plant is equipped with a manual wide-chip batch type cold wall (Batch Type c〇ld Wa (1) chemical vapor deposition port and automatic filming single chip Two types of hot-walled (Single wafer Hot Wa 11) chemical vapor deposition equipment, in which batch-type cold-wall equipment is batch-processed, depending on the size of the wafer, multiple wafers can be processed at a time, so production The speed is fast, and the cold-wall machine has the characteristics of producing high-impedance, thin-thickness wafers, but because of manual filming, it is easy to cause wafer contamination' and it is limited to manual work during filming. The standby station can be operated only when it is cooled down to the special temperature. This causes waste of time and productivity. The automatic wafer-type early-wafer hot-wall machine is less susceptible to contamination because of the automatic film placement. Only one wafer can be processed at a time, the production efficiency is not good, and the hot-wall machine cannot perform the chemical vapor deposition process with large process thickness and high impedance. Therefore, in order to overcome the above defects, we need to develop a new one. Structure to solve the above problems.

1283037 Case 1 91125m V. INSTRUCTIONS (2) [Inventions and Overview] In view of the above-mentioned traditional chemical formula, the main purpose of the invention is to provide a ^ ^ a ^ to eight chaotic phase, the problem of the product process, the main purpose of the present invention is k for a ^ It is applied to the ancient, w, and human-made ## — h Μ main i Μ β 冷 dish cold-wall chemical vapor deposition process and its 匕 related + V system process wafer transfer device and method. ο ίί 2. The purpose is to provide a bundled wafer transfer device and a process for round size. Not R into the group money, suitable for 4~18 pairs of crystal lifting it:::;;:::::;::;: low process pollution, according to the above high temperature cold wall chemistry by clustering crystal end Module ), the arm and the flat deposition process module are controlled. After that, the batch of the E-batch of the conveyor platform control group is adsorbed to the process chamber by the front side. The round conveyor equipment card 匣 carrying room controller), through the wheel operator in the large controller to automatically carry the wafer bearing load to the card bearing vacuum manipulator provides a process equipment wafer transmission (including the front end total (LoadLock And the batch type high-temperature delivery platform controller gas environment, the card robot arm will be the front side of the crystal-loading chamber according to the batch process tray, in order to carry out the automatic delivery device into a module, and convey the cold-wall type graphic placement The round is made of the special chemical gas sheet production type and method required for the front. (Front-cavity, machine chemical vaporization man-machine is located in the loading end assembly mold cassette, wafer loading phase deposition system

ΪΗ 1283037 曰Revision_Case No. 91125183 V. OBJECT DESCRIPTION OF THE INVENTION (3) The purpose and many advantages of the present invention will be explained in detail, and the details of the present invention are attached to the 昭 所附 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The drawings are not, but are completely disclosed. DETAILED DESCRIPTION OF THE INVENTION The embodiments of the present invention will be described in detail and the various parts are not in accordance with actual size. The relevant scale ratios of the components are in an exaggerated representation; for more:: degrees and other parts = those skilled in the art understand the description of the present invention to assist the embodiment as shown in the first figure First, the card containing the wafer 5 is placed on the '20'. Next, the layout of the wafer transport stroke and the configuration of the path selection configuration are input to the transport platform controller no. The terminal-: ϊΓ 二 二 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 110 The bearing seat (not shown in the figure) 罝^曰 axis function can be combined with the front suction robot to take the front or the bottom of the suction method, and can be combined with the front suction special cassette, one-time installation and can cooperate with the operation of the system. , the wafer slot (not shown) --- position; here 'a clean device 140 can be provided to clean the 10th page 1283037 曰 case number 91125〗 rib five, invention description (4) qiqiao Into the front end assembly module 4〇, and the discharge end assembly module 40 is cleaned, and at the same time, by the crystal sound, the round 5 and the front wafer angle to ensure the wafer 5 according to the established eight-position device 32 is fixed to the cavity 90, and the wafer code discrimination device 35 discriminates the above-mentioned process reaction supply platform controller 110 as a wafer process: material day = Next, the front end assembly module 40 and the card isolation valve are closed 55, and open this multi-faceted open type = 60 brothers ^ ^ - u ^ type sundial infusion cavity and The first and third isolation valves 7〇, 75 between the process chambers and the first wafer transport member 8〇 in the wafer transport chamber 130, where the sweat-positive front arm is attached to the card E The wafer 5 within the carrier chamber 60 is removed and placed into the wafer carrier disk 1 within the process chamber 90.

After the above operations are repeatedly performed until the wafer loading at all the specified positions is completed, the second isolation valve 75 between the multi-faceted open wafer transfer chamber 丨3 and the process reaction chamber 90 is closed for processing. After the process is completed, the third isolation valve 75 between the multi-faceted wafer transfer chamber 13 and the process reaction chamber g is opened, and the front adsorption robot 80 in the multi-faceted wafer transfer chamber 13 is opened. The wafer 5 on the wafer carrier 1 is retrieved and transported back to the cassette carrier. The second figure is a top view of the first figure. It can be seen from the figure that the multi-faceted wafer transport cavity used here is a six-sided open cavity, which can be compared with other crystals according to the actual process requirements. Circular transport chambers (e.g., analog cavities 132, 136) are joined to form a cluster-type delivery device.

Page 11 V. Description of the invention (5) > CVD process equipment for private order. First, after the program is opened, the operator logs into the system, and the operation and error recovery functions (such as the manual mode or the manual mode) are performed. The self-module controller delivers the carrier disk to open the card carrier room, carries the load compartment, and performs the wafer transfer carrier. The notification process is continued by the process module. The system is compatible with the chemical gas phase:::: The whole system operation and execution performed during the rotation, the human-machine interface program is started, etc. :: After the system The system will perform a self-test: as shown in the four figures), after selecting the automatic mode, the system waits; the signal of the right, such as wafer upload? ί ... change (or upload), #close card =, transferred from the wafer carrier to the module controller to return the control of the carrier, and process. After the process is completed, the conveyor system obtains the control right. The operator replaces the card. After the process is completed, the process data of the wafer is based. The module notifies the delivery of the control of the carrier, transfers the wafer to the cassette carrier, and records the process results through the platform controller and uses the wafer identification code as the wafer identification interview: L enters the standby state. The operator is tried by the person*; the fixed point transmission of the wafer is selected, and the wafer transfer between the measurement positions of the hardware device is performed. , j, according to (4), ^, the wafer is used as a reference 1283037, the number of the 91125183, the fifth day of the invention, the invention (6) The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Equivalent changes or modifications made without departing from the spirit of the invention are intended to be included within the scope of the appended claims. Page 13 1283037

[Simplified Schematic] The first figure is a clustered wafer transfer device and a schematic diagram of the device structure of the present invention. The second figure is a top view of the first figure. The second picture is shown in the wafer rotation of the present invention: the oxygen phase deposition (CVD) process is provided with a flow chart of the whole system operation procedure; and 曰曰5102030323540506070 The fourth picture is the method according to the present round. The main symbols of the main part of the program flow are: 晶圆 匣 匣 匣 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 埠 晶圆 晶圆 晶圆 晶圆匣 Carrying chamber isolation valve type bundle type wafer conveying device and process chart.

1283037 Case No. 91125183_Yearly Day Correction Drawing Simple Description 80 晶圆One Wafer Handling Element 90 Process Reaction Chamber 100 Wafer Carrier Disk 110 Transfer Platform Controller 120 Carrier Disk Controller 130 Transport Reaction Chamber 140 Clean Device 200 Start System 210 Login System 220 Mode Selection 230 Standby 240 Device Test 250 Wafer Fixed Point Transfer 260 Standby 270 Open Door 280 Card Replacement 290 Process Completion (PM Notification) 300 Transfer Wafer 310 Close Door 320 Transfer Wafer 330 Notification P Μ Transfer Complete 400 System Start 410 Loading record slot 420 ends normally

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1283037 _ Case No. 91125183_年月月日 Revision Diagram Simple Description 4 3 0 Error Report 440 Processing Error 450 Data 460 System Self Test 470 Self Test Pass 4 8 0 Error Report 490 Error Record

5 0 0 Login prompt 510 Processing error 5 2 0 Error report 530 System reset 540 System status display 550 Operating mode prompt 5 6 0 Standby

Page 16

Claims (1)

1283037 --- 玍 修正 修正 、 、 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种a multi-faceted open wafer transfer chamber coupled to the cassette carrying chamber ′ includes a first wafer transporting member for automatically passing the wafer in the cassette carried in the cassette carrying chamber through the multi-faceted open crystal The circular transport chamber is transported to one or more process 靡 chambers connected to the wafer transport chamber; ～ a plurality of isolation valves, each of which can be independently operated to respectively respectively carry the cassette load chamber The multi-faceted open wafer transfer chamber and the process reaction chamber are isolated from each other; and a transport platform controller is respectively connected to the cassette carrying chamber and the multi-turn round transfer chamber for controlling the wafer In each of the above devices, the planning and path selection of the appropriate travel can be performed, and each device can be tested separately. 2. As in the middle, species. The bundled wafer transfer device according to claim 1, wherein the cassette carrying chamber is selected from the group consisting of a dynamic load chamber and a static load, and the cluster type is as described in the scope of the patent application. The wafer transfer device further includes a terminal assembly module connected to the cassette carrying chamber, the front end assembly module including one or more uploading cassettes for carrying the card IE and Page 17 1283037 Revision Case No. 91125183 6. Patent application scope Transfers the wafers in the cassette from the uploading cassette to the wafer carrying unit of the cassette carrying chamber, and the front end assembly module is used as the interface of the I and one cassette carrying room. And can be used to isolate the atmospheric environment and the process environment and the 4. The bundled wafer transport described in claim 3, the front end assembly module further has a clean device, / 'gas guides the front end total Into the module, side by side Α ^ clean assembly module clean. The sub-day tamping and the W-end 5. The bundled wafer conveyance as described in claim 4 of the patent scope: the J front-end assembly module further includes a wafer angle setting: loading, second: wafer angle To ensure that the wafer is at a given angle =: face-open wafer transfer cavity. &lt; The multi-port 6 is transported by the bundled wafer as described in claim 5: the front-end assembly module further includes a wafer code identification, and the code of the second identification wafer is supplied to the conveyance Platform control: set, ^ identification of data. 1 is a wafer system. 7 The bundled wafer transport unit described in claim 3 includes an atmospheric mechanical arm or a mechanical arm. 々 front suction, such as the bundled wafer transport nesting described in the first application of the patent scope, Page 18 Color Moonlight Repair" Color Moonlight Repair" ^, Patent Application Range /, 'The number of openings of the multi-faceted open wafer transfer cavity can be 1, 2, 4, 5 ··· to 12 . 9. The bundled wafer transfer apparatus of claim 1, wherein the first wafer transporting component comprises an atmospheric mechanical arm or a front suction mechanical arm. The bundled wafer transfer device according to claim 9, wherein the front adsorption robot comprises an end effector for positively adsorbing crystals without physically contacting the effective crystal grains on the wafer. surface. 1J. A cluster type wafer transfer device comprising one or more card loading chambers for carrying a wafer front end assembly module, and the cassette loading chamber Carrying a card (4) and a second wafer transporting unit for moving the card (4) to the card storage compartment; === an atmosphere and a process environment; The multi-faceted open wafer transfer chamber is connected to the inter-card II, and includes a first wafer transporting member for connecting to the load-bearing chamber. The wafer in the card maker is automatically passed through the multi-faceted open type 3: Planting, the multi-faceted open wafer transport chamber is connected to the second, the chamber is transported to the reaction chamber. The process chamber has a group or a group::: The above system is 1283037 - the level is 91125183__ Sixth, the scope of application for patents &quot; ------ multi-wafer wafer carrier tray and connected to a carrier controller; two &amp; multiple isolation valves, each of which can operate independently for separate The front end assembly module, the cassette carrying chamber, and the multi-faceted open wafer transfer The chamber and the process chamber are isolated from each other; and a transport platform controller is coupled to the front end assembly module, the cassette carrier chamber, the multi-face outlet wafer transport chamber, and the carrier controller For controlling the planning and routing of the wafer in the above-mentioned various devices, and testing each device separately. The bundled wafer conveyance device according to the above aspect of the invention, wherein the far-carriage carrying chamber is selected from the group consisting of a dynamic bearing chamber and a static bear plant. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; To clean the module of the end assembly. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The angle is to ensure that the wafer is at a predetermined angle = wheel, and the multi-faceted wafer transport cavity is closed. (1) 迗 enters 1 5 · The bundled wafer transfer device as described in claim 14 Page 20 Case No. 91125] «^ 1283037 ',, please if,] Range &quot;&quot; β ^ 2 'The end assembly module further includes the ancient one ^ [to identify the code of the wafer and provide :::Identification of the identification of the data. Appreciation,,. The rudder platform controller is used as a cluster type crystal according to the scope of the invention, and the first wafer handling component includes a clothing, a ° and a mechanical arm. Or - front side 1. 7. The cluster type wafer wheel according to item 16 of the range, the crystal η is used for the front side adsorption robot arm including an end effector for positive solidity and does not physically contact the effective crystal on the wafer. Surface of the granules. Surface adsorption 2· As in the bundled wafer transport package described in claim 11 of the patent application scope, the number of openings of the multi-faceted open wafer transport chamber can be summer '3, 4, 5··· Up to 12, Tough, 2, 19, wherein the bundled wafer transport device described in claim 11 of the patent scope, m' the second wafer transporting component includes an atmospheric mechanical arm 戋x and a mechanical arm. A front-end f 20 · A cluster type wafer transfer device comprising: a plurality of dynamic cassette carrying chambers and cassette holders for carrying a front side adsorption dedicated cassette containing a wafer, and the cassette holder With Z-axis operation; 1283037 月曰—Revised the 911251 along the sixth, applying for a patent range, a front-end assembly module, connected to the dynamic card-carrying compartment, and the package card =2=a number of front-side adsorption special cards E Transferring the wafer from the wafer to the loading device of the dynamic card storage chamber, the front assembly module is used as an interface of the uploading load chamber and can be used to isolate the atmosphere and Forming a multi-faceted open wafer transfer cavity, wherein each surface opening process is connected to the plurality of dynamic Kachen carrier chambers and a plurality of process anti-μ chambers, and the multi-face open wafer transfer chamber The body includes a first front adsorption robot arm for transporting the wafer in the front side of the dynamic cassette carrier through the multi-faceted wafer transport chamber to the open wafer transport cavity The plurality of process chambers are connected to the plurality of process chambers, and the plurality of process chambers have one or more sets of wafer carrier trays for placing two or more wafers and are connected to a carrier controller; Valve, each of which Each of the two can independently operate to isolate the front end assembly module, the dynamic cassette carrier chamber, the multi-face open wafer transfer chamber, and the plurality of process reaction chambers from each other; and a &lt; a controller, which is respectively connected to the front end assembly module, the dynamic cassette carrying chamber, the multi-faceted open wafer transfer chamber and the retainer controller for controlling the flow of the wafer in the above devices With path selection, each device can be tested separately. The bundled wafer conveyance device of claim 20, wherein the front end assembly module further has a cleaning device for cleaning the 1283037 ---- case number 911251W_^ ^ day _ ___— VI. Applying for a patent range A gas is introduced into the cassette carrier chamber and the wafer transport chamber, and discharged to maintain the cleanliness of the wafer and the front end assembly module. The bundled wafer transport device of claim 2, wherein the front end assembly module further includes a wafer angle positioning device for positioning the wafer angle to ensure that the wafer is in accordance with the established The angle is fed into the multi-faceted open wafer transfer cavity. 2) The bundled wafer transport apparatus of claim 22, wherein the 4-terminal assembly module further comprises a wafer code discrimination device for identifying the code of the wafer and providing the same The platform device identifies the process data. A method for assembling a bundled soil ball by a 24. device in a wafer processing process, the device comprising a carrier chamber for carrying a wafer containing a wafer, the card maker :d' is connected to the card s carrying room, including an upper raft for supporting the upper dynasty 3 or more and a first one for transferring the wafer in the cassette from the + uploading raft to the kakun carrying room一曰::::圆^ Atmospheric environment fish process ring load 埠 and the interface of the Kaqun load room ^ Brother Yi Yi 枉% 丨 brother's isolation interface; Connect, including the eve of the first open 曰 Π Π J J J The cavity is connected with the cassette carrying chamber. The card is used to carry the card E to the indoor chamber... The B-opening wafer transport chamber is transported to the statement! 283〇37 Correction nickname 9Π251 Fantasy Patent application scope 2 open crystal (four) to send cavity connection... more than one process of the process and the process chamber has a wafer carrier to properly accept the reversed wafer; Each of them can be operated independently to separately use the ^^^0 module,匣承公宫, w, m η ^ ^ 卜匝枣战到, the multi-faceted open wafer transfer cavity and the process reaction chamber are isolated from each other; and a transport platform controller, respectively connected to the front end assembly The module, the 匣 carrying compartment and the multi-faceted open wafer transporting cavity are used for controlling the pair of 装置 装置 devices: planning and routing of the transporting stroke, and testing can be performed separately and separately, the method includes the following Steps: (a) placing the plurality of cassettes containing the wafers on the upload; inputting the plan of the wafer transport route, the path selection, and the operations of the sub-system groups into the transport platform controller; 〜 (b) the transport platform controller removes and places the cassette in the cassette into the cassette carrying chamber according to the selected transport stroke mode by the second wafer transporting component in the front end assembly module;曰曰 (c) closing the isolation valve between the front end assembly module and the cassette carrying chamber, and respectively opening the cassette carrying chamber and the multi-faceted open wafer carrier and the multi-faceted wafer transfer chamber Isolation valve between the reaction chamber and the process chamber; The circular carrying member takes out the crystal (d) in the reaction chamber of the crucible with the wafer in the first cassette carrying chamber in the wafer transfer chamber and places the wafer into the circular carrying tray; e) Repeat the above actions until all fingers 1283037 are completed. The recording is in the future. After the patent application range is loaded, the multi-faceted open wafer transfer cavity and the process cavity are closed. The isolation valve is disposed between the process; and (f) after the process is completed, the process cavity and the multi-face open wafer transfer cavity and the multi-face open wafer transfer cavity and the card II carrier are respectively opened The isolation valve of the chamber is used to retrieve the wafer on the wafer carrier by the robot arm in the multi-faceted wafer transport chamber, and transport it back to the cassette carrier 25 5 ^ as described in claim 24 The cluster wafer transfer method, the order of 'step (a) and step (b) can be interchanged. In the case of the bundled wafer conveyance method described in claim 25, 输送 a, before the step (b), the conveyance platform controller may first perform the relevant test actions for each system. , 2 j, * as in the bundled wafer transfer method described in claim 24, the transfer platform controller can be changed from the automatic control mode to the manual control 2 8 as in the patent application scope 24 The clustering wafer transfer method described above, ^ 'The mechanical arm of step (c) uses the vacuum adsorption and the field knife to perform the pick-and-place of the wafer by the suction force generated by the pressure type. If the bundled wafer is delivered as described in claim 24, go, Page 25 29 1283037 _ Case No. 91125183_年月曰 修正 Amendment _ VI. Patent Application Scope In the step (C), the robot arm uses the suction generated by electrostatic adsorption to pick up and place the wafer. The bundled wafer conveyance method according to claim 24, wherein an environmental cleaning procedure can be simultaneously performed while the step (c) is performed. 3. The method of the bundled wafer conveyance according to claim 24, wherein the wafer in the step (f) is directly transported to other process chambers after the process is completed. Page 26 1283037 _ Case No. 91125183_Year of the Month Amendment VI. Designated Representative Map Page 6