CN110660723B - Manipulator, bonding cavity, wafer bonding system and bonding method - Google Patents
Manipulator, bonding cavity, wafer bonding system and bonding method Download PDFInfo
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- CN110660723B CN110660723B CN201810714786.1A CN201810714786A CN110660723B CN 110660723 B CN110660723 B CN 110660723B CN 201810714786 A CN201810714786 A CN 201810714786A CN 110660723 B CN110660723 B CN 110660723B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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Abstract
The embodiment of the invention discloses a manipulator, a bonding cavity, a wafer bonding system and a bonding method, wherein the manipulator comprises: a tray; at least three wafer positioning columns fixed on the tray; at least three first wafer spacing mechanisms fixed on the tray, wherein the first wafer spacing mechanisms comprise first wafer spacing sheets and first driving parts used for driving the first wafer spacing sheets to enter the wafer bearing area of the tray. The appearance positioning of the wafer is realized through the wafer positioning column, the first wafer spacing piece is placed above the bearing wafer taken out by the mechanical arm through the first wafer spacing mechanism, then the device wafer is taken out by the mechanical arm, and finally the bearing wafer and the device wafer are conveyed to the bonding cavity by the mechanical arm at one time, so that the aligning process of the bearing wafer and the device wafer in the bonding cavity is reduced, the time for transferring the wafer to the bonding cavity is shortened, and the efficiency of the bonding process is improved. The embodiment of the invention also discloses a bonding cavity, a wafer bonding system and a bonding method.
Description
Technical Field
The embodiment of the invention relates to a semiconductor process technology, in particular to a manipulator, a bonding cavity, a wafer bonding system and a bonding method.
Background
With the continuous development of semiconductor technology, thinning of device wafers is a great trend, but ultrathin device wafers have flexibility and fragility, and are easy to warp and undulate.
A typical temporary bonding process involves completely processing the device wafer on the top surface, spin coating the carrier wafer and the device wafer with a layer of bonding adhesive, then transferring the two wafers to the bonding chamber, carefully centering the bonding chamber, and increasing the temperature before bonding in a vacuum. After temporary bonding, the wafer stack is subjected to backside processing (thinning, etching, metallization, etc.) and the thin device wafer is then peeled from the carrier wafer. In the existing bonding device, a manipulator is required to sequentially take out a device wafer and a carrier wafer from a wafer library, the device wafer and the carrier wafer are respectively conveyed into a bonding cavity, and then the operations of inserting a spacer, vacuumizing the bonding cavity, withdrawing the spacer, heating a carrier disc and a pressure disc, bonding and the like are completed in the bonding cavity.
Disclosure of Invention
The embodiment of the invention provides a manipulator, a bonding cavity, a wafer bonding system and a bonding method, which are used for improving the efficiency of a bonding process.
In a first aspect, an embodiment of the present invention provides a manipulator, including:
a tray;
at least three wafer positioning columns fixed on the tray;
the first wafer spacing structure comprises a first wafer spacing piece and a first driving part used for driving the first wafer spacing piece to enter a wafer bearing area of the tray.
In a second aspect, an embodiment of the present invention further provides a bonding chamber, where the bonding chamber includes:
a base plate;
the lifting driving part is arranged around the periphery of the bearing plate;
the wafer bearing mechanism and the second interval spacer mechanism are fixed on each lifting driving part, and the wafer bearing mechanism comprises a bearing sheet and a wafer bearing driving part used for driving the bearing sheet to enter a wafer bearing area of the pressure bearing plate; the second spacer mechanism includes a second wafer spacer and a second spacer driving member for driving the second wafer spacer into the wafer carrying area of the pressure bearing plate.
In a third aspect, an embodiment of the present invention further provides a wafer bonding system, which includes a device wafer library, a carrier wafer library, a finished product wafer library, the manipulator described in the first aspect, and the bonding cavity described in the second aspect.
In a fourth aspect, an embodiment of the present invention further provides a bonding method based on the wafer bonding system in the third aspect, where the method includes:
the mechanical arm takes the bearing wafer out of the bearing wafer library and positions the bearing wafer on a tray of the mechanical arm;
a first driving part drives a first wafer spacing piece to enter a wafer bearing area of the tray, and the first wafer spacing piece is placed above the bearing wafer;
the manipulator takes the device wafer out of the device wafer library and positions the device wafer above the first wafer spacing piece;
the mechanical arm conveys the bearing wafer and the device wafer to a bonding cavity;
and unloading the bearing wafer and the device wafer into the bonding cavity, and performing bonding operation.
The embodiment of the invention provides a manipulator for a wafer bonding system, which comprises a tray; at least three wafer positioning columns fixed on the tray; at least three first wafer spacing mechanisms fixed on the tray, wherein the first wafer spacing mechanisms comprise first wafer spacing sheets and first driving parts used for driving the first wafer spacing sheets to enter the wafer bearing area of the tray. The appearance positioning of the wafer is realized through the wafer positioning column, the first wafer spacing piece is placed above the bearing wafer taken out by the mechanical arm through the first wafer spacing mechanism, then the device wafer is taken out through the mechanical arm, and finally the bearing wafer and the device wafer are conveyed to the bonding cavity by the mechanical arm at one time, so that the alignment process of the bearing wafer and the device wafer in the bonding cavity is reduced, the time for transferring the wafer to the bonding cavity is shortened, and the bonding process efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a manipulator according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a first driving member according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a first driving member according to a first embodiment of the present invention;
FIG. 4 is a schematic structural diagram of another first driving member according to a first embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a bonding chamber according to a second embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a wafer driving component according to a second embodiment of the present invention;
FIG. 7 is a schematic structural diagram of another supporting sheet driving component according to the second embodiment of the present invention;
FIG. 8 is a schematic structural view of another exemplary embodiment of a wafer driving device;
FIG. 9 is a schematic structural view of a second spacer driving part according to a second embodiment of the present invention;
FIG. 10 is a schematic structural view of a second spacer driving part according to a second embodiment of the present invention;
FIG. 11 is a schematic structural view of another second spacer driving part according to the second embodiment of the present invention;
fig. 12 is a schematic structural diagram of a wafer bonding system according to a third embodiment of the present invention;
fig. 13 is a schematic flow chart of a bonding method according to a fourth embodiment of the present invention;
FIG. 14 is a schematic flow chart illustrating the unloading of a carrier wafer and a device wafer into a bonding chamber according to a fourth embodiment of the present invention;
FIG. 15 is a schematic flow chart illustrating the process after the carrier wafer and the device wafer are unloaded into the bonding chamber according to the fourth embodiment of the present invention;
fig. 16 is a schematic flow chart illustrating the robot moving the finished wafer to the finished wafer stocker according to the fourth embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for convenience of description, only a part of structures related to the present invention, not all of the structures, are shown in the drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout.
Example one
Fig. 1 is a schematic structural diagram of a robot according to an embodiment of the present invention, where the robot provided in this embodiment may be used in a wafer bonding system, and the robot includes:
a tray 10; at least three wafer positioning columns 20 fixed on the tray 10; at least three first wafer spacing mechanisms 30 are secured to the tray 10, the first wafer spacing mechanisms 30 including first wafer spacing pieces 31, and first drive members 32 for driving the first wafer spacing pieces 31 into the wafer carrying area of the tray 10.
In which the tray 10 is used for placing wafers, for example, referring to fig. 1, a robot including three wafer positioning posts 20, which may be cylinders, and three first wafer spacing mechanisms 30 is used for picking up and transporting wafers. It is understood that the wafer bonding is to place the device wafer above the carrier wafer, and then bond the device wafer and the carrier wafer together through the bonding system, and the device wafer and the carrier wafer may have at least one positioning groove at the edge, and after the device wafer and the carrier wafer are mated and connected with one wafer positioning column 20 of the three wafer positioning columns 20 of the robot, the remaining two wafer positioning columns 20 limit the outer edge of the wafer. The working process of the manipulator is as follows: the mechanical arm enters a bearing wafer library to obtain a bearing wafer, the bearing wafer is subjected to shape positioning by using three wafer positioning columns 20 and is fixed on a tray 10, then a first driving part 32 drives a first wafer spacing piece 31 to extend into a bearing area of the tray 10, the first wafer spacing piece 31 is positioned above the bearing wafer, then the mechanical arm enters a device wafer library to obtain a device wafer, the device wafer is subjected to shape positioning by using the three wafer positioning columns 20 and is fixed on the tray 10, the device wafer is positioned above the first wafer spacing piece 31, and finally the mechanical arm sends the bearing wafer and the device wafer into a bonding cavity together.
According to the manipulator for the wafer bonding system, the appearance positioning of the wafer is realized through the wafer positioning column, the first wafer spacer is placed above the bearing wafer taken out by the manipulator through the first wafer spacing mechanism, then the device wafer is taken out through the manipulator, and finally the bearing wafer and the device wafer are conveyed to the bonding cavity by the manipulator once, so that the process of aligning the bearing wafer and the device wafer in the bonding cavity is reduced, the time of transferring the wafer to the bonding cavity is shortened, and the efficiency of a bonding process is improved.
Alternatively, the first driving member 32 may be driven in a telescopic or rotary manner.
The first driving unit 32 is used for driving the first wafer spacing piece 31, so that the first wafer spacing piece 31 separates the carrier wafer from the device wafer, so that the robot can simultaneously obtain the carrier wafer and the device wafer, and the driving mode of the first driving unit 32 may be telescopic or rotary, so as to control the first wafer spacing piece 31 to linearly telescope or rotate, which can be flexibly selected by a person skilled in the art.
Fig. 2 is a schematic structural diagram of a first driving member. Optionally, the first driving component includes a first air cylinder 321, the first air cylinder 321 is fixedly connected to one end of the first wafer spacing piece 31, and the first air cylinder 321 is used for driving the first wafer spacing piece 31 to extend and retract. Wherein the dotted line represents a state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.
Fig. 3 is a schematic structural view of another first driving member. The first driving part is similar to the first driving part shown in fig. 2, except that the telescopic first cylinder 321 is changed to a rotary cylinder 322, and the first inter-wafer spacer 31 is changed to a rotary motion by a linear telescopic motion. Wherein the dotted line represents a state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.
Fig. 4 is a schematic structural view of another first driving member. Optionally, the first driving component includes a second cylinder 323, a rack 324 and a gear 325, the second cylinder 323 is fixedly connected to one end of the rack 324, the second cylinder 323 is configured to drive the rack 324 to extend and retract, a tooth opening on the rack 324 is engaged with a tooth on the gear 325, and the first wafer spacer 31 is fixed on the gear 325 and rotates around its axis along with the rotation of the gear 325. Wherein the dotted line represents a state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.
Optionally, the first wafer spacing mechanisms 30 and the wafer positioning columns 20 are alternately arranged at the edge of the tray 10.
With continued reference to fig. 1, it can be appreciated that the alternating spacing of the first wafer spacing mechanism 30 and the wafer positioning posts 20 at the edge of the tray 10 can make the wafer more stable when the tray 10 is placed.
Optionally, the tray 10 is circular, the number of the first wafer spacing mechanisms 30 and the number of the wafer positioning pillars 20 are three, and the three first wafer spacing mechanisms 30 and the three wafer positioning pillars 20 are uniformly distributed about the geometric center of the tray 10.
With continued reference to fig. 1, the wafer is generally circular, so that the tray 10 is configured to be circular, the three wafer positioning posts 20 are uniformly distributed and spaced about the geometric center of the tray 10 to achieve precise alignment between the carrier wafer and the device wafer, and the three wafer spacing mechanisms are uniformly distributed and spaced about the geometric center of the tray 10 to achieve stable support of the device wafer.
Example two
Fig. 5 is a schematic structural diagram of a bonding chamber according to a second embodiment of the present invention, and the bonding chamber according to the present embodiment may be used in a wafer bonding system, and may be used in cooperation with a robot according to the first embodiment, so as to improve efficiency of a bonding process. The bonding cavity provided by the embodiment comprises:
a base plate 40; a pressure bearing plate 50 fixed on the base plate 40 and at least three lifting driving parts 60, wherein the lifting driving parts 60 are arranged around the periphery of the pressure bearing plate 50; a support mechanism 70 and a second spacing mechanism 80 fixed on each elevation driving member 60, the support mechanism 70 including a support 71, and a support driving member 72 for driving the support 71 into the wafer carrying area of the pressure bearing plate 50; the second spacing plate mechanism 80 includes a second wafer spacing plate 81, and a second spacing plate driving member 82 for driving the second wafer spacing plate 81 into the wafer carrying area of the pressure bearing plate 50.
Illustratively, only one elevation driving unit 60 is shown in fig. 5, the pressure plate 50 is used for placing a wafer, the support plate 71 is used for supporting a carrier wafer, and the second spacer 81 is used for supporting a device wafer and is disposed between the carrier wafer and the device wafer. When the robot arm carries the carrier wafer and the device wafer together into the bonding chamber, the carrier driving part 72 drives the carrier 71 to move to the wafer carrying area of the pressure plate 50 to support the carrier wafer, the second spacer driving part 82 drives the second wafer spacer 81 between the carrier wafer and the device wafer to support the device wafer, and the elevation driving part 60 ascends to unload the carrier wafer and the device wafer from the robot arm.
The bonding cavity for the wafer bonding system provided by the embodiment is used in cooperation with the manipulator provided by the embodiment, and the wafer bearing and device wafers on the manipulator can be unloaded into the bonding cavity at one time through the at least three lifting driving parts and the wafer bearing mechanism and the second spacing piece mechanism which are arranged on each lifting driving part, so that the structure of the bonding cavity for aligning the wafer bearing and device wafers is removed, the alignment process of the wafer bearing and device wafers in the bonding cavity is reduced, the time for transferring the wafers to the bonding cavity is shortened, and the efficiency of the bonding process is improved.
Alternatively, the driving means of the support piece driving part 72 may be telescopic or rotary.
The supporting sheet driving component 72 is used for driving the supporting sheet 71, so that the supporting sheet 71 supports and carries the wafer, the driving mode of the supporting sheet driving component 72 can be telescopic or rotary, so as to control the linear telescopic or rotary motion of the supporting sheet 71, and the skilled person can select flexibly.
Fig. 6 is a schematic structural view of a blade driving part. Optionally, the supporting piece driving part includes a third cylinder 721, the third cylinder is fixedly connected to one end of the supporting piece 71 of the third cylinder 721, and the third cylinder 721 drives the supporting piece 71 to extend and retract. The third cylinder 721 may be disposed inside the elevation driving part, and the dotted line in fig. 6 represents a state where the supporting plate 71 is withdrawn from the wafer carrying area of the supporting plate.
Fig. 7 is a schematic structural view of another carrying sheet driving member. The supporting piece driving part is similar to the supporting piece driving part shown in fig. 6, except that the telescopic third cylinder 721 is changed into the rotary cylinder 722, and the linear telescopic motion mode of the supporting piece 71 is changed into the rotary motion mode. The rotary cylinder 722 may be disposed inside the elevation driving part, and the dotted line in fig. 7 represents a state where the blade 71 is withdrawn from the wafer loading area of the pressure receiving plate.
Fig. 8 is a schematic structural view of another support driving member. Optionally, the carrying sheet driving part includes a fourth cylinder 723, a rack 724 and a gear 725, the fourth cylinder 723 is fixedly connected with one end of the rack 724, the fourth cylinder 723 is used for driving the rack 724 to extend and retract, a toothed opening on the rack 724 is engaged with a gear tooth on the gear 725, and the carrying sheet 71 is fixed on the gear 725 and rotates around an axis thereof along with the rotation of the gear 725. Wherein the fourth cylinder 723, the rack 724 and the gear 725 may be disposed inside the elevation driving part, and the dotted line in fig. 8 represents a state where the blade 71 is withdrawn from the wafer carrying area of the pressure plate.
Alternatively, the second spacer driving part 82 may be driven in a telescopic or rotary manner.
The second spacer driving part 82 is used for driving the second wafer spacer 81 such that the second wafer spacer 81 is interposed between the carrier wafer and the device wafer to separate the carrier wafer and the device wafer, and the driving manner of the second spacer driving part 82 may be a telescopic type or a rotary type to control the linear telescopic or rotary motion of the second wafer spacer 81, which may be flexibly selected by those skilled in the art.
Fig. 9 is a schematic structural view showing a second spacer driving part. Optionally, the second spacing piece driving part includes a fifth cylinder 821, the fifth cylinder 821 is fixedly connected to one end of the second wafer spacing piece 81, and the fifth cylinder 821 drives the second wafer spacing piece 81 to extend and retract. The fifth cylinder 821 may be disposed inside the elevation driving part, and a dotted line in fig. 9 represents a state where the second wafer spacing piece 81 is withdrawn from the wafer loading area of the pressure receiving plate.
Fig. 10 is a schematic view showing a structure of still another second spacer driving part. This second spacer driving means is similar to that shown in fig. 9, except that a telescopic fifth cylinder 821 is changed to a rotary cylinder 822, and a linear telescopic motion of the second wafer spacer 81 is changed to a rotary motion. Wherein the rotary cylinder 822 can be disposed inside the elevating driving part, and the dotted line in fig. 10 represents a state when the second wafer spacing piece 81 is withdrawn from the wafer carrying area of the pressure receiving plate.
Fig. 11 is a schematic view showing a structure of another second spacer driving part. Optionally, the second spacer driving member includes a sixth cylinder 823, a rack 824, and a gear 825, the sixth cylinder 823 is fixedly connected to one end of the rack 824, the sixth cylinder 823 is configured to drive the rack 824 to extend and retract, a tooth opening of the rack 824 is engaged with a tooth of the gear 825, and the second spacer 81 is fixed to the gear 825 and rotates around an axis thereof along with rotation of the gear 825. Wherein the sixth cylinder 823, the rack 824 and the gear 825 are disposed inside the elevating driving part, and the dotted line in fig. 11 represents a state where the second wafer spacing piece 81 is withdrawn from the wafer carrying area of the pressure bearing plate.
Alternatively, the pressure bearing plate 50 is circular, the number of the lifting driving parts 60 is three, and the three lifting driving parts 60 are uniformly distributed about the geometric center of the pressure bearing plate 50.
It is understood that the wafer is generally circular, and thus the pressure bearing plate 50 is configured to be circular, and the three elevation driving parts 60 uniformly distributed about the geometric center of the pressure bearing plate 50 may achieve stable support and elevation of the wafer.
With reference to fig. 5, optionally, at least three pins 51 and pin lifting drivers 52 are disposed on the pressure bearing plate 50, the at least three pins 51 are uniformly distributed about the geometric center of the pressure bearing plate 50, and the pin lifting drivers 52 are configured to drive the pins 51 to be lifted above the upper surface of the pressure bearing plate 50 by a predetermined height or drive the pins 51 to be lowered below the upper surface of the pressure bearing plate 50 by a predetermined height.
Illustratively, only one lift driving unit 60, a lift pin 51 and a lift pin lift driver 52, are shown in fig. 5, and the lift pin 51 is used to support the carrier wafer so that the support piece 71 can be withdrawn when the carrier wafer is placed on the pressure bearing plate 50.
EXAMPLE III
Fig. 12 is a schematic structural diagram of a wafer bonding system according to a third embodiment of the present invention, which includes a device wafer library 100, a carrier wafer library 200, a finished product wafer library 300, a robot 400 according to the first embodiment, and a bonding chamber 500 according to the second embodiment.
Example four
Fig. 13 is a schematic flow chart illustrating a bonding method according to a fourth embodiment of the present invention, which can be executed by the wafer bonding system according to the third embodiment of the present invention, and the bonding method specifically includes the following steps:
and step 10, taking the bearing wafer out of the bearing wafer library by the mechanical arm, and positioning the bearing wafer on a tray of the mechanical arm.
The tray of the manipulator comprises at least three wafer positioning columns for fixing the bearing wafer on the tray.
And 20, driving the first wafer spacing piece into a wafer bearing area of the tray by the first driving part, and placing the first wafer spacing piece above the bearing wafer.
The first driving component can be driven in a telescopic or rotary mode and is used for driving the first wafer spacing piece to linearly stretch or rotate to enter the wafer bearing area of the tray and placing the first wafer spacing piece above the bearing wafer.
The first wafer spacing piece is arranged between the bearing wafer and the device wafer and used for supporting the device wafer and preventing the bearing wafer from contacting with the device wafer, so that the bearing wafer and the device wafer can be simultaneously arranged on a tray of the manipulator. Through the action of at least three wafer positioning columns, the bearing wafer and the device wafer can be accurately aligned.
And step 40, the mechanical arm conveys the bearing wafer and the device wafer to the bonding cavity.
And 50, unloading the bearing wafer and the device wafer into the bonding cavity, and performing bonding operation.
According to the technical scheme provided by the embodiment, the bearing wafer is sequentially taken out from the bearing wafer library through the mechanical arm, the device wafer is taken out from the device wafer library, the bearing wafer and the device wafer are aligned in position, and then the bearing wafer and the device wafer are conveyed into the bonding cavity at one time, so that the mechanical arm only enters the bonding cavity once, the time for transferring the wafer to the bonding cavity is shortened, and the efficiency of the bonding process is improved.
Fig. 14 is a schematic flow chart illustrating the unloading of a carrier wafer and a device wafer into a bonding chamber. Optionally, the unloading the carrier wafer and the device wafer into the bonding cavity includes:
step 501, the robot transfers the carrier wafer and the device wafer to the upper side of the pressure plate.
Step 502, the wafer driving component drives the wafer into the wafer carrying area of the bearing plate, and places the wafer under the wafer.
The wafer bearing driving part can be driven in a telescopic or rotary mode and is used for driving the wafer bearing part to linearly extend or rotate to enter the wafer bearing area of the bearing plate and placing the wafer bearing part below the bearing wafer.
And 503, driving the second wafer spacer into the wafer bearing area of the bearing plate by the second spacer driving part, and placing the second wafer spacer between the bearing wafer and the device wafer.
The driving mode of the second spacing piece driving part can be telescopic or rotary and is used for driving the second wafer spacing piece to linearly telescope or rotate to enter the wafer bearing area of the bearing plate, the second wafer spacing piece is placed between the bearing wafer and the device wafer, and the second wafer spacing piece is used for spacing the bearing wafer and the device wafer and is also used for supporting the device wafer.
Step 504, the first driving member drives the first spacer wafer away from the wafer-supporting area of the tray.
Due to the support of the second wafer spacing piece on the device wafer, the first driving part drives the first wafer spacing piece to withdraw, and the first wafer spacing piece is prevented from blocking the bearing wafer to rise.
Step 505, the lifting driving component drives the wafer carrier and the second wafer spacer to rise, and simultaneously drives the carrier wafer and the device wafer to rise until the height of the carrier wafer is greater than the height of the wafer positioning post.
The lifting driving part drives the bearing wafer and the device wafer to rise so as to separate the manipulator, and when the height of the bearing wafer is larger than that of the wafer positioning column, the bearing wafer is completely separated from the manipulator, and the manipulator can be withdrawn.
And 507, the top pin on the pressure bearing plate is lifted to a preset height higher than the pressure bearing plate, and the lifting driving part drives the bearing wafer and the device wafer to fall onto the top pin on the pressure bearing plate.
And step 508, the wafer bearing driving part drives the bearing wafer to withdraw from the wafer bearing area of the bearing plate, and the ejector pin on the bearing plate descends until the bearing wafer falls on the bearing plate.
After the manipulator withdraws, the lifting driving part drives the bearing wafer and the device wafer to descend, when the bearing wafer falls onto the top pin of the bearing plate, the unloading process of the bearing wafer and the device wafer is completed, and the bearing sheet driving part can drive the bearing sheet to withdraw from the wafer bearing area of the bearing plate.
Fig. 15 is a schematic flow chart illustrating the process after the carrier wafer and the device wafer are unloaded into the bonding chamber. Optionally, after step 508, the method further includes:
step 509, the bonding cavity is vacuumized to make the vacuum degree of the bonding cavity reach the preset vacuum degree.
It is understood that the operation of evacuating the bonding chamber may be performed by a vacuum pump connected to the bonding chamber, and may be selected according to the means commonly used in the art, and the embodiments of the present invention are not limited thereto.
And step 510, the second spacing piece driving part drives the second wafer spacing piece to withdraw from the wafer bearing area of the bearing plate, so that the device wafer falls right above the bearing wafer.
The second spacing plate driving member may be driven in a telescopic or rotary manner to linearly extend or rotate the second wafer spacing plate out of the wafer bearing area of the pressure plate, and when the second spacing plate driving member is driven in a rotary manner, for example, the second wafer spacing plate may be driven to rotate by 90 ° to be detached from the device wafer.
And 511, heating the pressure bearing plate to a first preset value, and executing bonding operation.
The pressure plate may have an internal electric heating temperature control device, and the first preset temperature value is selected according to the characteristics of the specific bonded wafer, which is not limited in the embodiments of the present invention.
Optionally, after the bonding operation is completed, the method further includes:
and step 512, cooling the pressure bearing plate to a second preset value.
The second preset temperature value is selected according to the characteristics of the specific bonded wafer, and the embodiment of the invention is not limited in particular.
And 513, carrying out vacuum breaking operation on the bonding cavity, and opening the cavity after the vacuum breaking operation is finished.
The vacuum breaking operation is the reverse process of the vacuum pumping, and may be specifically selected according to a commonly used technical means in the field, and the embodiment of the present invention is not specifically limited.
And 514, the mechanical arm enters the bonding cavity to convey the finished product wafer to a finished product wafer warehouse.
It is understood that the carrier wafer and the device wafer are bonded to form a finished wafer.
Fig. 16 is a schematic flow chart illustrating the robot moving the finished wafer to the finished wafer stocker. Optionally, the entering of the manipulator into the bonding cavity and the transporting of the finished product wafer to the finished product wafer library by the manipulator includes:
and 514a, lifting the top pin on the pressure bearing plate to a preset height so as to separate the finished wafer from the pressure bearing plate.
And 514b, driving the bearing piece to enter the wafer bearing area of the bearing plate by the bearing piece driving part, and placing the bearing piece below the finished wafer.
The wafer bearing driving part can be in a telescopic or rotary driving mode and is used for driving the wafer bearing part to linearly stretch or rotate to enter the wafer bearing area of the bearing plate and placing the wafer under the finished wafer.
Step 514c, the lifting driving component drives the finished wafer to rise to a predetermined height.
The preset height is larger than the height of the wafer positioning column when the manipulator is positioned on the bearing plate.
And 514d, the mechanical arm enters the bonding cavity and is placed below the finished wafer.
The mechanical arm enters the bonding cavity, so that the wafer bearing area of the tray is positioned under the finished product wafer, and the finished product wafer just falls into the bearing area of the tray when falling.
And 514e, the lifting driving part drives the finished product wafer to descend to be close to the mechanical arm, the wafer bearing driving part drives the wafer bearing part to withdraw the wafer bearing area of the bearing plate, the finished product wafer is unloaded onto the mechanical arm, and the mechanical arm conveys the finished product wafer to the finished product wafer warehouse.
The lifting driving part drives the finished product wafer to descend to the bearing area of the tray, the wafer bearing driving part drives the wafer bearing to withdraw, and the manipulator conveys the finished product wafer to the finished product wafer warehouse.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements and substitutions will now be apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (21)
1. A bonding chamber, comprising:
a base plate;
the lifting driving part is arranged around the periphery of the bearing plate;
the wafer bearing mechanism and the second interval spacer mechanism are fixed on each lifting driving part, and the wafer bearing mechanism comprises a bearing sheet and a wafer bearing driving part used for driving the bearing sheet to enter a wafer bearing area of the pressure bearing plate; the second spacer mechanism includes a second wafer spacer and a second spacer driving member for driving the second wafer spacer into the wafer carrying area of the pressure bearing plate.
2. The bonding chamber of claim 1, wherein the blade driving member is driven in a telescoping or rotating manner.
3. The bonding chamber of claim 2, wherein the supporting plate driving member comprises a third cylinder, the third cylinder is fixedly connected to one end of the supporting plate, and the third cylinder drives the supporting plate to extend or rotate.
4. The bonding chamber of claim 2, wherein the wafer driving member comprises a fourth cylinder, a rack and a gear, the fourth cylinder is fixedly connected to one end of the rack, the fourth cylinder is used to drive the rack to extend and retract, a gear opening of the rack is engaged with a gear tooth of the gear, and the wafer is fixed to the gear and rotates around an axis thereof along with the rotation of the gear.
5. The bonding chamber of claim 1, wherein the second spacer drive member is driven in a telescoping or rotary manner.
6. The bonding chamber of claim 5, wherein the second spacer driving member comprises a fifth cylinder, the fifth cylinder is fixedly connected to one end of the second wafer spacer, and the fifth cylinder drives the second wafer spacer to extend or rotate.
7. The bonding chamber as claimed in claim 5, wherein the second spacer driving member comprises a sixth cylinder, a rack and a gear, the sixth cylinder is fixedly connected to one end of the rack, the sixth cylinder is used for driving the rack to extend and retract, a gear opening of the rack is engaged with a gear tooth of the gear, and the second spacer is fixed on the gear and rotates around its axis along with the rotation of the gear.
8. The bonding chamber of claim 6, wherein the pressure bearing plate is circular, the number of lift drive members is three, and three lift drive members are evenly distributed about the geometric center of the pressure bearing plate.
9. The bonding chamber of claim 6, wherein the pressure plate has at least three pins and at least three pin lifting drivers, the at least three pins are uniformly distributed about the geometric center of the pressure plate, and the pin lifting drivers are configured to drive the pins to be raised above a predetermined height of the upper surface of the pressure plate or to be lowered below the predetermined height of the upper surface of the pressure plate.
10. A wafer bonding system comprising a device wafer library, a carrier wafer library, a finished wafer library, a robot, and the bonding chamber of any one of claims 1 to 9.
11. The wafer bonding system of claim 10, wherein the robot comprises:
a tray;
at least three wafer positioning columns fixed on the tray;
the first wafer spacing structure comprises a first wafer spacing piece and a first driving part used for driving the first wafer spacing piece to enter a wafer bearing area of the tray.
12. The wafer bonding system of claim 11, wherein the first driving member is driven in a telescopic or rotary manner.
13. The wafer bonding system of claim 12, wherein the first driving component comprises a first cylinder, the first cylinder is fixedly connected to one end of the first wafer spacer, and the first cylinder is configured to drive the first wafer spacer to extend or rotate.
14. The wafer bonding system according to claim 12, wherein the first driving member comprises a second cylinder, a rack and a gear, the second cylinder is fixedly connected to one end of the rack, the second cylinder is used for driving the rack to extend and retract, a gear opening of the rack is engaged with a gear tooth of the gear, and the first wafer spacer is fixed on the gear and rotates around the axis of the first wafer spacer along with the rotation of the gear.
15. The wafer bonding system of claim 11, wherein the first wafer spacing mechanism and the wafer positioning posts are alternately spaced at the edge of the tray.
16. The wafer bonding system of claim 11, wherein the tray is circular, the number of the first wafer spacing mechanisms and the number of the wafer positioning columns are three, and the three first wafer spacing mechanisms and the three wafer positioning columns are uniformly distributed about the geometric center of the tray.
17. A bonding method based on the wafer bonding system of claim 10, comprising:
the mechanical arm takes the bearing wafer out of the bearing wafer library and positions the bearing wafer on a tray of the mechanical arm;
a first driving part drives a first wafer spacing piece to enter a wafer bearing area of the tray, and the first wafer spacing piece is placed above the bearing wafer;
the manipulator takes the device wafer out of the device wafer library and positions the device wafer above the first wafer spacing piece;
the mechanical arm conveys the bearing wafer and the device wafer to a bonding cavity;
and unloading the bearing wafer and the device wafer into the bonding cavity, and performing bonding operation.
18. The bonding method of claim 17, wherein unloading the carrier wafer and the device wafer into the bonding chamber comprises:
the mechanical arm conveys the bearing wafer and the device wafer to the upper part of the bearing plate;
the wafer bearing driving part drives the bearing wafer to enter a wafer bearing area of the bearing plate, and the bearing wafer is placed below the bearing wafer;
a second spacing piece driving part drives a second wafer spacing piece to enter a wafer bearing area of the bearing plate and places the second wafer spacing piece between the bearing wafer and the device wafer;
the first driving part drives the first wafer spacing piece to leave the wafer bearing area of the tray;
the lifting driving part drives the bearing wafer and the device wafer to rise until the height of the bearing wafer is greater than that of the wafer positioning column;
the manipulator withdraws from the bonding cavity;
the jacking pin on the pressure bearing plate is lifted to a preset height higher than the pressure bearing plate, and the lifting driving part drives the bearing wafer and the device wafer to fall onto the jacking pin on the pressure bearing plate;
the wafer bearing area of the bearing plate is withdrawn by the bearing piece driven by the bearing piece driving part, and the ejector pin on the bearing plate descends until the bearing wafer falls on the bearing plate.
19. The bonding method according to claim 18, further comprising, after the carrier wafer is dropped on the pressure bearing plate:
vacuumizing the bonding cavity to enable the vacuum degree of the bonding cavity to reach a preset vacuum degree;
the second spacing piece driving part drives a second wafer spacing piece to withdraw from the wafer bearing area of the bearing plate, so that the device wafer falls right above the bearing wafer;
and heating the pressure bearing plate to a first preset value, and executing bonding operation.
20. The bonding method of claim 19, further comprising, after the bonding operation is completed:
the pressure bearing plate is cooled to a second preset value;
the bonding cavity is subjected to vacuum breaking operation, and the cavity is opened after the vacuum breaking operation is finished;
and the manipulator enters the bonding cavity and conveys the finished product wafer to a finished product wafer warehouse.
21. The bonding method of claim 20, wherein the robot enters the bonding chamber and transports the product wafers to a product wafer stocker comprises:
lifting the top pin on the pressure bearing plate to a preset height to separate the finished product wafer from the pressure bearing plate;
the wafer bearing driving part drives the bearing wafer to enter a wafer bearing area of the bearing plate, and the bearing wafer is placed below the finished wafer;
the lifting driving part drives the finished product wafer to rise to a preset height;
the mechanical arm enters the bonding cavity and is placed below the finished product wafer;
the lifting driving part drives the finished product wafer to descend to be close to the mechanical arm, the wafer bearing driving part drives the wafer bearing part to withdraw from the wafer bearing area of the bearing plate, the finished product wafer is unloaded onto the mechanical arm, and the mechanical arm conveys the finished product wafer to the finished product wafer warehouse.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810714786.1A CN110660723B (en) | 2018-06-29 | 2018-06-29 | Manipulator, bonding cavity, wafer bonding system and bonding method |
| PCT/CN2019/093210 WO2020001521A1 (en) | 2018-06-29 | 2019-06-27 | Manipulator, bonding cavity, wafer bonding system and bonding method |
| TW108122985A TWI694536B (en) | 2018-06-29 | 2019-06-28 | Manipulator, bonding cavity, wafer bonding system and bonding method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810714786.1A CN110660723B (en) | 2018-06-29 | 2018-06-29 | Manipulator, bonding cavity, wafer bonding system and bonding method |
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| CN110660723B true CN110660723B (en) | 2022-05-10 |
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| CN112447561B (en) * | 2020-12-03 | 2024-04-02 | 苏州工业园区纳米产业技术研究院有限公司 | Vacuum bonding device |
| TWI776665B (en) * | 2021-09-03 | 2022-09-01 | 天虹科技股份有限公司 | Alignment mechanism and bonding machine using the alignment mechanism |
| CN114005777B (en) * | 2021-12-24 | 2022-03-29 | 湖北三维半导体集成创新中心有限责任公司 | Bonding apparatus and bonding method |
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| US20130199730A1 (en) * | 2012-02-08 | 2013-08-08 | Innovative Micro Technology | Wafer bonding chamber with dissimilar wafer temperatures |
| CN104979223A (en) * | 2014-04-03 | 2015-10-14 | 中芯国际集成电路制造(上海)有限公司 | Wafer bonding process |
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| TWI257515B (en) * | 2002-11-16 | 2006-07-01 | Lg Philips Lcd Co Ltd | Substrate bonding apparatus for liquid crystal display device |
| JP4460477B2 (en) * | 2005-02-25 | 2010-05-12 | セメス株式会社 | Substrate transfer device |
| KR101622415B1 (en) * | 2008-03-13 | 2016-05-18 | 가부시키가이샤 니콘 | Substrate holder, substrate holder unit, substrate transfer apparatus and substrate bonding apparatus |
| JP5586992B2 (en) * | 2010-03-09 | 2014-09-10 | ラピスセミコンダクタ株式会社 | Wafer processing apparatus and wafer processing method |
| TWI538789B (en) * | 2011-08-10 | 2016-06-21 | Kawasaki Heavy Ind Ltd | A end effector device, and a substrate transport robot including the end effector device |
| TWI616975B (en) * | 2011-12-14 | 2018-03-01 | Nikon Corp | Substrate holder and substrate bonding device |
| JP6501447B2 (en) * | 2013-03-26 | 2019-04-17 | 芝浦メカトロニクス株式会社 | Bonding device and method of manufacturing bonded substrate |
| CN104241165B (en) * | 2013-06-19 | 2017-08-29 | 上海微电子装备（集团）股份有限公司 | A kind of distance piece control device and method |
| US10825705B2 (en) * | 2015-05-15 | 2020-11-03 | Suss Microtec Lithography Gmbh | Apparatus, system, and method for handling aligned wafer pairs |
| JP6596353B2 (en) * | 2016-02-17 | 2019-10-23 | 東京応化工業株式会社 | Pasting device, pasting system, and pasting method |
| CN107393855B (en) * | 2016-05-17 | 2020-10-09 | 上海新昇半导体科技有限公司 | Wafer positioning device and method |
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2018
- 2018-06-29 CN CN201810714786.1A patent/CN110660723B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20130199730A1 (en) * | 2012-02-08 | 2013-08-08 | Innovative Micro Technology | Wafer bonding chamber with dissimilar wafer temperatures |
| CN104979223A (en) * | 2014-04-03 | 2015-10-14 | 中芯国际集成电路制造(上海)有限公司 | Wafer bonding process |
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| WO2020001521A1 (en) | 2020-01-02 |
| TW202002146A (en) | 2020-01-01 |
| CN110660723A (en) | 2020-01-07 |
| TWI694536B (en) | 2020-05-21 |
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