TW202002146A - Manipulator, bonding cavity, wafer bonding system and bonding method reducing the process of aligning the carrier wafer and the device wafer in the bonding cavity - Google Patents

Abstract

Embodiments of the present invention disclose a manipulator, a bonding cavity, a wafer bonding system, and a bonding method. The manipulator includes: a tray; at least three wafer positioning posts fixed on the tray; and at least three first wafer spacer mechanisms fixed on the tray. Each first wafer spacer mechanism includes a first wafer spacer and a first driving component configured to drive the first wafer spacer to enter a wafer carrying area of the tray. The shape positioning of the wafer is realized through the wafer positioning posts. The first wafer spacer is placed on the carrier wafer taken out by the manipulator through the first wafer spacer mechanism, and then the device wafer is taken out by the manipulator. Finally, the manipulator will carry the carrier wafer and the device wafer to the bonding cavity at one time, which reduces the process of aligning the carrier wafer and the device wafer in the bonding cavity, shortens the time for transferring the wafer to the bonding cavity, and improves the efficiency of the bonding process. The embodiment of the invention also discloses a bonding cavity, a wafer bonding system and a bonding method.

Description

Manipulator, bonding cavity, wafer bonding system and bonding method

Embodiments of the present invention relate to semiconductor process technology, such as a manipulator, a bonding cavity, a wafer bonding system, and a bonding method.

With the continuous development of semiconductor technology, thinning device wafers has become a general trend, but ultra-thin device wafers are flexible and fragile, and are prone to warpage and fluctuation. The current mainstream solution is to bond device wafers to rigidity On the carrier wafer, not only can the wafer be thinned, but also a variety of processing techniques can be supported. After the processing steps on the back are completed, the device can be peeled from the carrier wafer and the processing can continue until packaging.

A typical temporary bonding process involves completely processing the device wafer on the upper surface, rotating the carrier wafer and the device wafer with a layer of bonding adhesive, and then transferring the two wafers to the bonding cavity and carefully placing In the center of the bonding cavity, the bonding is performed in vacuum after increasing the temperature. After the temporary bonding, the wafer stack is back-processed (thinned, etched, metalized, etc.), and then the thin device wafer is peeled off from the carrier wafer. In the conventional bonding device, the device wafer and the carrier wafer must be sequentially taken out from the wafer library using a robot, and then transported to the bonding cavity, and then the spacer is inserted into the bonding cavity and the bonding cavity is evacuated. , The evacuation of the spacer, the heating of the bearing plate and the pressure plate, and the bonding operation. This bonding process must enter and exit the bonding cavity twice, and the efficiency of the bonding process needs to be improved.

Embodiments of the present invention provide a manipulator, a bonding cavity, a wafer bonding system, and a bonding method to improve the efficiency of the bonding process.

In a first aspect, an embodiment of the present invention provides a manipulator. The manipulator is characterized by including: a tray; at least three wafer positioning columns fixed on the tray; at least three first crystals fixed on the tray A circular spacer mechanism, each of the first wafer spacer mechanisms includes a first wafer spacer, and a first driving part configured to drive the first wafer spacer into the wafer carrying area of the tray.

In a second aspect, an embodiment of the present invention further provides a bonding cavity, which is characterized in that it includes: a bottom plate; a pressure plate and at least three lifting driving parts are fixed on the bottom plate, and the lifting drive Parts are arranged around the periphery of the pressure bearing plate; a bearing mechanism and a second spacer mechanism are fixed on each of the lifting drive parts, the bearing mechanism includes a bearing plate, and is used to drive the bearing plate into the bearing plate Wafer drive area of the wafer carrier area; the second spacer mechanism includes a second wafer spacer, and a second interval configured to drive the second wafer spacer into the wafer carrier area of the pressure plate Drive parts.

In a third aspect, an embodiment of the present invention further provides a wafer bonding system, characterized in that it includes a device wafer library, a carrier wafer library, a finished wafer library, a robot described in the first aspect, and a second aspect The described bonding cavity.

In a fourth aspect, an embodiment of the present invention further provides a bonding method based on the wafer bonding system described in the third aspect, the method is characterized in that it includes: a robotic arm takes the carrier wafer out of the carrier wafer library, And positioned on the tray of the manipulator; the first driving part drives the first wafer spacer into the wafer carrying area of the tray, and places the first wafer spacer on the carrier wafer; the robot Remove the device wafer from the device wafer library and position it above the first wafer spacer; the robot hand transports the carrier wafer and the device wafer to the bonding cavity; the carrier wafer and The aforementioned device wafer is unloaded into the aforementioned bonding cavity to perform a bonding operation.

An embodiment of the present invention provides a robot for a wafer bonding system, including a tray; at least three wafer positioning posts fixed on the tray; at least three first wafer spacing mechanisms fixed on the tray, each The first wafer spacer mechanism includes a first wafer spacer and a first driving part configured to drive the first wafer spacer into the wafer carrying area of the tray. A wafer positioning column is used to achieve the positioning of the shape of the wafer. The first wafer spacer is placed on the carrier wafer taken out by the robot, and then the device wafer is taken out by the robot. The carrier wafer and the device wafer are transported to the bonding cavity at one time by hand, reducing the process of aligning the carrier wafer and the device wafer in the bonding cavity, shortening the time for transferring the wafer to the bonding cavity, and improving the bonding Process efficiency.

10‧‧‧Tray

100‧‧‧Device wafer library

20‧‧‧ Wafer positioning post

200‧‧‧Bearing wafer library

30‧‧‧ First wafer spacer

300‧‧‧Finished wafer library

31‧‧‧ First wafer spacer

32‧‧‧ First drive parts

321‧‧‧ First cylinder

322‧‧‧rotating cylinder

323‧‧‧Second cylinder

324‧‧‧The first rack

325‧‧‧First gear

40‧‧‧Bottom plate

400‧‧‧manipulator

50‧‧‧pressure plate

500‧‧‧bond cavity

51‧‧‧Top selling

52‧‧‧Push-pin lifting driver

60‧‧‧Lifting drive parts

70‧‧‧filming agency

71‧‧‧filming

72‧‧‧Screw drive parts

721‧‧‧ third cylinder

722‧‧‧rotating cylinder

723‧‧‧ Fourth cylinder

724‧‧‧second rack

725‧‧‧Second gear

80‧‧‧Second spacer mechanism

81‧‧‧Second wafer spacer

82‧‧‧Second spacer drive parts

821‧‧‧ fifth cylinder

822‧‧‧rotating cylinder

823‧‧‧Sixth cylinder

824‧‧‧Rack

825‧‧‧ third gear

[FIG. 1] is a schematic structural diagram of a manipulator provided by Embodiment 1 of the present specification.

[FIG. 2] is a schematic structural diagram of a first driving part in Embodiment 1 of this specification.

[FIG. 3] is a schematic structural diagram of still another first driving part in Embodiment 1 of the present specification.

Fig. 4 is a schematic structural diagram of another first driving part in Embodiment 1 of the present specification.

Fig. 5 is a schematic structural diagram of a bonding cavity provided in Example 2 of the present specification.

[Figure 6] is a schematic structural view of a carrier driving part in the second embodiment of the present specification.

[Fig. 7] is a schematic structural view of still another driving part of the carrier in the second embodiment of the present specification.

[Figure 8] is a schematic structural view of another carrier driving part in the second embodiment of the present specification.

[Fig. 9] It is a schematic structural view of a second spacer driving part in Embodiment 2 of this specification.

[Fig. 10] is a schematic structural diagram of still another second spacer driving part in Embodiment 2 of the present specification.

[FIG. 11] is a schematic structural view of another second spacer driving part in Embodiment 2 of the present specification.

12 is a schematic structural diagram of a wafer bonding system provided in Embodiment 3 of the present specification.

[FIG. 13] is a schematic flowchart of a bonding method provided in Embodiment 4 of the present specification.

14 is a schematic flow chart of unloading the carrier wafer and the device wafer into the bonding cavity in the fourth embodiment of the present specification.

FIG. 15 is a schematic flow chart after unloading the carrier wafer and the device wafer into the bonding cavity in the fourth embodiment of the present specification.

FIG. 16 is a schematic flow chart of the robot in the fourth embodiment of the present specification moving the finished wafer to the finished wafer library.

The specification will be further described in detail below with reference to the drawings and examples. It can be understood that the specific embodiments described herein are only used to explain this specification, but not to limit this specification. In addition, it should be noted that, in order to facilitate description, the drawings only show parts related to this specification, but not all structures, in which the same or similar symbols indicate the same or similar elements or elements with the same or similar functions throughout.

Example one

FIG. 1 is a schematic structural diagram of a manipulator provided in Embodiment 1 of the present invention. The manipulator provided in this embodiment can be used in a wafer bonding system. The manipulator includes: a tray 10; Three wafer positioning columns 20; at least three first wafer spacers 30 fixed on the tray 10, each first wafer spacer 30 includes a first wafer spacer 31, and is configured to drive the first wafer The circular spacer 31 enters the first driving part 32 of the wafer carrying area of the tray 10.

Wherein, the tray 10 is configured to place wafers. For example, referring to FIG. 1, taking the robot including three wafer positioning columns 20 and three first wafer spacing mechanisms 30 as an example, the wafer positioning columns may be cylindrical, Robots are used to acquire and transport wafers. It can be understood that wafer bonding is to place the device wafer above the carrier wafer, and then bond the device wafer and the carrier wafer together by a bonding system, and there may be at least one edge between the device wafer and the carrier wafer After the positioning groove is matched and docked with one of the three wafer positioning posts 20 of the manipulator, the remaining two wafer positioning posts 20 limit the outer edge of the wafer. The working process of the manipulator is as follows: the manipulator enters the carrier wafer library to obtain the carrier wafer, uses three wafer positioning columns 20 to position the carrier wafer in shape, fix the carrier wafer on the tray 10, and then the first driving part 32 Drive the first wafer spacer 31 into the carrying area of the tray 10, and position the first wafer spacer 31 above the carrying wafer, and then the manipulator enters the device wafer library to obtain the device wafer, using three wafers The positioning post 20 positions the device wafer in shape, fixes the device wafer on the tray 10, and positions the device wafer above the first wafer spacer 31, and finally the robot hand feeds the carrier wafer and the device wafer together Bonding cavity.

The manipulator for the wafer bonding system provided by this embodiment realizes the positioning of the outer shape of the wafer by the wafer positioning column, and the first wafer spacer is placed in the robot by the first wafer spacer mechanism. Above the carrier wafer, then use the robot to take out the device wafer, and finally the robot will transport the carrier wafer and the device wafer to the bonding cavity at one time, reducing the process of aligning the carrier wafer and the device wafer in the bonding cavity To shorten the time for wafer transfer to the bonding cavity and improve the efficiency of the bonding process.

Optionally, the driving method of the first driving part 32 may be telescopic or rotary.

The first driving part 32 is configured to drive the first wafer spacer 31 to separate the first wafer spacer 31 from the carrier wafer and the device wafer, so that the robotic arm can simultaneously obtain the carrier wafer and the device wafer. The driving method of the driving part 32 may be a telescopic type or a rotary type, to control the linear expansion and contraction or rotary movement of the first wafer spacer 31, and those with ordinary knowledge in the technical field can flexibly choose.

FIG. 2 is a schematic structural diagram of a first driving part. Optionally, the first driving component includes a first air cylinder 321, the first air cylinder 321 is fixedly connected to one end of the first wafer spacer 31, and the first cylinder 321 is configured to drive the first wafer spacer 31 to expand and contract. The dotted line indicates the state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.

FIG. 3 is a schematic structural diagram of still another first driving part. The structure of this first driving part is similar to that of the first driving part shown in FIG. 2, except that the telescopic first cylinder 321 is changed to a rotary cylinder 322, and the linear expansion and contraction movement of the first wafer spacer 31 is changed to a rotary movement . The dotted line indicates the state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.

FIG. 4 is a schematic structural diagram of another first driving part. Optionally, the first driving part includes a second cylinder 323, a first rack 324, and a first gear 325, the second cylinder 323 is fixedly connected to one end of the first rack 324, and the second cylinder 323 is configured to drive the first tooth The bar 324 expands and contracts, the tooth opening on the first rack 324 meshes with the gear teeth on the first gear 325, the first wafer spacer 31 is fixed on the first gear 325, and wraps around as the first gear 325 rotates The axis of the first gear 325 rotates. The dotted line indicates the state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.

Optionally, the first wafer spacing mechanism 30 and the wafer positioning posts 20 are alternately disposed at the edge of the tray 10.

With continued reference to FIG. 1, it can be understood that the first wafer spacing mechanism 30 and the wafer positioning column 20 are alternately spaced and evenly distributed on the edge of the tray 10, which can make the wafer more stable when placed on the tray 10.

Optionally, the tray 10 is circular, the number of the first wafer spacing mechanism 30 and the wafer positioning posts 20 are three, and the three first wafer spacing mechanisms 30 and three wafer positioning posts 20 are about the tray 10 The geometric centers are evenly distributed.

Continuing to refer to FIG. 1, the wafer is generally circular, so the tray 10 is set to a circular shape, and the geometric center of the tray 10 is evenly distributed and three wafer positioning columns 20 are arranged at intervals to achieve accurate alignment of the carrier wafer and the device wafer With respect to the geometric center of the tray 10 being evenly distributed and three wafer spacing mechanisms arranged at intervals, the device wafer can be stably supported.

Example 2

FIG. 5 is a schematic structural diagram of a bonding cavity provided in Example 2 of the present specification. The bonding cavity provided in this example can be used in a wafer bonding system, and can be used in conjunction with the manipulator provided in Example 1 to improve The efficiency of the bonding process. The bonding cavity provided in this embodiment includes: a bottom plate 40; a pressure plate 50 and at least three lifting driving parts 60 are fixed on the bottom plate 40, and the lifting driving parts 60 are arranged around the periphery of the pressure plate 50; fixed at each The lifting drive part 60 is provided with a carrier mechanism 70 and a second spacer mechanism 80. The carrier mechanism 70 includes a carrier 71, and a carrier driving component configured to drive the carrier 71 into the wafer carrying area of the pressure plate 50 72; the second spacer mechanism 80 includes a second wafer spacer 81, and a second spacer drive component 82 configured to drive the second wafer spacer 81 into the wafer carrying area of the pressure plate 50.

Exemplarily, only one lifting driving part 60 is shown in FIG. 5, the pressure plate 50 is configured to place the wafer, the support 71 is configured to support the carrier wafer, and the second wafer spacer 81 is configured to support the device wafer. Between the carrier wafer and the device wafer. When the manipulator transports the carrier wafer and the device wafer together into the bonding cavity, the carrier driving part 72 drives the carrier 71 to move to the wafer carrier area of the pressure plate 50 to support the carrier wafer and the second spacer The driving part 82 drives the second wafer spacer 81 between the carrier wafer and the device wafer to support the device wafer, and the lifting driving part 60 rises to unload the carrier wafer and the device wafer from the robot.

The bonding cavity for the wafer bonding system provided in this embodiment is used in conjunction with the manipulator provided in the above embodiment, by at least three lifting drive parts and a carrier mechanism provided on each lifting drive part And the second spacer mechanism can unload the carrier wafer and the device wafer into the bonding cavity at one time, remove the bonding cavity to align the structure of the carrier wafer and the device wafer, and reduce the carrier crystal The process of aligning the circle and the device wafer in the bonding cavity reduces the time for wafer transfer to the bonding cavity and improves the efficiency of the bonding process.

Optionally, the driving method of the carrier driving part 72 may be telescopic or rotary.

The carrier driving part 72 is configured to drive the carrier 71 to support the carrier 71. The driving mode of the carrier driving part 72 can be telescopic or rotary to control the linear expansion or rotation of the carrier 71. Those with common knowledge in the field can choose flexibly.

Fig. 6 is a schematic structural view of a driving part of a carrier. Optionally, the carrier driving component includes a third cylinder 721, which is fixedly connected to one end of the carrier 71, and the third cylinder 721 is configured to drive the carrier 71 to expand and contract. The third cylinder 721 may be provided inside the lifting drive part, and the broken line in FIG. 6 indicates the state when the bearing piece 71 is withdrawn from the wafer bearing area of the pressure plate.

FIG. 7 is a schematic structural diagram of yet another carrier driving part. This carrier driving part is similar in structure to the carrier driving part shown in FIG. 6, except that the telescopic third cylinder 721 is changed to a rotary cylinder 722, and the linear expansion and contraction motion of the carrier 71 is changed to rotary motion. The rotary cylinder 722 may be provided inside the lifting drive part, and the broken line in FIG. 7 indicates the state when the bearing piece 71 is withdrawn from the wafer bearing area of the pressure plate.

FIG. 8 is a schematic structural diagram of another carrier driving part. Optionally, the carrier driving parts include a fourth cylinder 723, a second rack 724, and a second gear 725. The fourth cylinder 723 is fixedly connected to one end of the second rack 724, and the fourth cylinder 723 is configured to drive the second tooth The bar 724 expands and contracts, and the teeth on the second rack 724 mesh with the gear teeth on the second gear 725. The bearing 71 is fixed to the second gear 725 and wraps around the second gear 725 as the second gear 725 rotates The axis rotates. The fourth cylinder 723, the second rack 724, and the second gear 725 can all be disposed inside the lifting drive part. The dotted line in FIG. 8 indicates the state when the bearing piece 71 is withdrawn from the wafer bearing area of the pressure plate.

Optionally, the driving method of the second spacer driving part 82 may be telescopic or rotary.

The second spacer driving part 82 is configured to drive the second wafer spacer 81 so that the second wafer spacer 81 is placed between the carrier wafer and the device wafer to separate the carrier wafer and the device wafer. The driving method of the two spacer driving parts 82 may be telescopic or rotary to control the linear expansion or rotation of the second wafer spacer 81, and those with ordinary knowledge in the art can flexibly choose.

9 is a schematic structural diagram of a second spacer driving part. Optionally, the second spacer driving component includes a fifth cylinder 821, which is fixedly connected to one end of the second wafer spacer 81, and the fifth cylinder 821 drives the second wafer spacer 81 to expand and contract. The fifth cylinder 821 may be provided inside the lifting drive part. The dotted line in FIG. 9 indicates the state when the second wafer spacer 81 is withdrawn from the wafer carrying area of the pressure plate.

FIG. 10 is a schematic structural diagram of still another second spacer driving part. This second spacer driving part is similar to the second spacer driving part shown in FIG. 9 except that the telescopic fifth cylinder 821 is changed to the rotary cylinder 822 and the second wafer spacer 81 is linearly telescopically moved. It is a rotary motion. The rotary cylinder 822 may be provided inside the lifting drive part, and the broken line in FIG. 10 indicates the state when the second wafer spacer 81 is withdrawn from the wafer carrying area of the pressure plate.

FIG. 11 is a schematic structural diagram of another second spacer driving component. Optionally, the second spacer driving component includes a sixth cylinder 823, a third rack 824, and a third gear 825. The sixth cylinder 823 is fixedly connected to one end of the third rack 824, and the sixth cylinder 823 is configured to drive the first The third rack 824 expands and contracts, the tooth mouth on the third rack 824 meshes with the gear teeth on the third gear 825, the second wafer spacer 81 is fixed on the third gear 825, and rotates with the third gear 825 And rotate around the axis of the third gear 825. Among them, the sixth cylinder 823, the third rack 824, and the third gear 825 can all be disposed inside the lifting drive part. The dotted line in FIG. 11 indicates the state when the second wafer spacer 81 is withdrawn from the wafer carrying area of the pressure plate .

Optionally, the pressure-bearing plate 50 is circular, and the number of the lifting drive parts 60 is three, and the three lifting-drive parts 60 are evenly distributed about the geometric center of the pressure plate 50.

It can be understood that the wafer is generally circular, so the pressure plate 50 is set to a circle, and the three lifting driving parts 60 evenly distributed about the geometric center of the pressure plate 50 can achieve stable support and lifting of the wafer.

Continuing to refer to FIG. 5, optionally, the pressure plate 50 is provided with at least three ejector pins 51 and ejector lift drivers 52. At least three ejector pins 51 are evenly distributed about the geometric center of the pressure plate 50, and the ejector lift drivers 52 It is set that the driving jack 51 is raised above the preset height of the upper surface of the pressure plate 50 or the driving jack 51 is lowered below the preset height of the upper surface of the pressure plate 50.

Exemplarily, FIG. 5 shows only the ejector pin 51 and ejector lift driver 52 of one lifting drive part 60. The ejector pin 51 is configured to support the carrier wafer so that the carrier wafer is supported on the pressure plate 50 The piece 71 can be withdrawn.

Example Three

FIG. 12 is a schematic structural diagram of a wafer bonding system provided in Embodiment 3 of the present specification. The wafer bonding system includes a device wafer library 100, a carrier wafer library 200, a finished wafer library 300, and the foregoing first embodiment. The manipulator 400 and the bonding cavity 500 described in the second embodiment above.

Example 4

FIG. 13 is a schematic flowchart of a bonding method provided in Embodiment 4 of the present specification. The method may be performed by the wafer bonding system provided in Embodiment 3 above, and specifically includes the following steps:

Step 10: The manipulator takes the carrier wafer from the carrier wafer library and positions it on the tray of the manipulator.

The tray of the manipulator includes at least three wafer positioning columns, and the at least three wafer positioning columns are configured to fix the carrier wafer on the tray.

Step 20: The first driving part drives the first wafer spacer into the wafer carrying area of the tray, and places the first wafer spacer above the carrying wafer.

Wherein, the driving method of the first driving part may be telescopic or rotary, and the first driving part is configured to drive the first wafer spacer to linearly retract or rotate into the wafer carrying area of the tray, and the first wafer spacer Place above the carrier wafer.

Step 30: The manipulator takes the device wafer from the device wafer library and positions it above the first wafer spacer.

Among them, the first wafer spacer is placed between the carrier wafer and the device wafer, and the first wafer spacer is configured to support the device wafer to prevent the carrier wafer from contacting the device wafer to make the robot tray The carrier wafer and the device wafer can be placed simultaneously on the top. With the function of at least three wafer positioning posts, accurate alignment of the carrier wafer and the device wafer can be achieved.

Step 40: The manipulator transports the carrier wafer and the device wafer to the bonding cavity.

Step 50: Unload the carrier wafer and the device wafer into the bonding cavity, and perform the bonding operation.

The technical means provided in this embodiment uses a manipulator to sequentially take out the carrier wafer from the carrier wafer library and the device wafer from the device wafer library, and to achieve the alignment of the carrier wafer and the device wafer, and then to The carrier wafer and the device wafer are transported into the bonding cavity, so that the robot enters the bonding cavity only once, shortening the time for wafer transfer to the bonding cavity, and improving the efficiency of the bonding process.

FIG. 14 is a schematic flowchart of unloading the carrier wafer and the device wafer into the bonding cavity. Optionally, unloading the carrier wafer and device wafer into the bonding cavity includes:

Step 501: The manipulator transports the carrier wafer and the device wafer above the pressure plate.

Step 502: The carrier driving part drives the carrier into the wafer carrying area of the pressure plate, and places the carrier under the carrier wafer.

Among them, the driving method of the carrier driving part can be telescopic or rotary, and the carrier driving part is set to drive the carrier to linearly expand or contract into the wafer carrying area of the pressure plate, and place the carrier under the carrier wafer .

Step 503: The second spacer driving component drives the second wafer spacer into the wafer carrying area of the pressure plate, and places the second wafer spacer between the carrying wafer and the device wafer.

The driving method of the second spacer driving part may be telescopic or rotary. The second spacer driving part is configured to drive the second wafer spacer to linearly expand or contract into the wafer carrying area of the pressure plate, and The second wafer spacer is placed between the carrier wafer and the device wafer. The second wafer spacer is configured to separate the carrier wafer and the device wafer, and is also configured to support the device wafer.

Step 504: The first driving part drives the first wafer spacer from the wafer carrying area of the tray.

Because the second wafer spacer supports the device wafer, the first driving part drives the first wafer spacer to withdraw, preventing the first wafer spacer from blocking the rise of the carrier wafer.

Step 505: The lifting drive part drives the carrier wafer and the second wafer spacer to rise, and simultaneously drives the carrier wafer and the device wafer to a height that the carrier wafer is higher than the height of the wafer positioning column.

The lifting and driving parts drive the carrier wafer and the device wafer upward to detach from the robot. When the height of the carrier wafer is greater than the height of the wafer positioning column, the carrier wafer and the robot are completely detached, and the robot can be withdrawn.

Step 506: The manipulator withdraws the bonding cavity.

Step 507: The ejector pin on the pressure plate is raised to a predetermined height higher than the pressure plate, and the lifting and driving parts drive the carrier wafer and the device wafer to fall onto the ejector pin on the pressure plate.

Step 508: The bearing driving part drives the bearing to withdraw from the wafer bearing area of the pressure plate, and the push pin on the pressure plate is lowered until the bearing wafer falls on the pressure plate.

After the manipulator is withdrawn, the lifting drive parts drive the carrier wafer and the device wafer down. When the carrier wafer falls onto the top pin of the pressure plate, the unloading process of the carrier wafer and device wafer is completed, and the carrier drive part The wafer can be driven out of the wafer bearing area of the pressure plate.

FIG. 15 is a schematic flow chart after unloading the carrier wafer and the device wafer into the bonding cavity. Optionally, after step 508, it further includes:

Step 509: Evacuate the bonding cavity, so that the vacuum degree of the bonding cavity reaches a preset vacuum degree.

It can be understood that the vacuuming operation of the bonding cavity can be completed by a vacuum pump connected to the bonding cavity, and can be specifically selected according to common technical means in the technical field.

Step 510: The second spacer driving part drives the second wafer spacer to withdraw from the wafer carrying area of the pressure plate, so that the device wafer falls directly above the carrying wafer.

Wherein, the driving method of the second spacer driving part may be telescopic or rotary. The second spacer driving part is configured to drive the second wafer spacer to linearly retract or rotate and withdraw from the wafer bearing area of the pressure plate. When the driving method of the second spacer driving part is a rotary type, for example, the second wafer spacer may be driven to be rotated by 90° to separate from the device wafer.

Step 511: The pressure-bearing plate is heated to the first preset value, and a bonding operation is performed.

Among them, the pressure-bearing plate can be built with an electrothermal temperature control device, and the first preset temperature value is selected according to the characteristics of the specific bonded wafer.

Optionally, after the bonding operation is completed, it further includes:

Step 512: The pressure-bearing plate is cooled to the second preset value.

The second preset value of temperature is selected according to the characteristics of the specific bonded wafer.

Step 513: The bonding cavity performs a vacuum breaking operation, and the cavity is opened after the vacuum breaking operation is completed.

Among them, the vacuum breaking operation is the reverse process of evacuation, which can be selected according to common technical means in the technical field.

Step 514: The robot enters the bonding cavity and transports the finished wafer to the finished wafer library.

It can be understood that the finished wafer is formed after the bonding of the carrier wafer and the device wafer is completed.

FIG. 16 is a schematic diagram of the process of the robot moving the finished wafer to the finished wafer library. Optionally, the robot enters the bonding cavity and transports the finished wafer to the finished wafer library including:

Step 514a. The ejector pin on the pressure-bearing plate is raised to a preset height to disengage the finished wafer from the pressure-bearing plate.

Step 514b: The carrier driving part drives the carrier into the wafer carrying area of the pressure plate, and places the carrier under the finished wafer.

Wherein, the driving mode of the carrier driving part may be telescopic or rotary. The carrier driving part is set to drive the carrier to linearly expand or contract into the wafer carrying area of the pressure plate, and place the carrier under the finished wafer.

Step 514c: The lifting and driving parts drive the finished wafer to a preset height.

Wherein, the preset height is greater than the height of the wafer positioning column when the manipulator is on the pressure plate.

Step 514d. The robot enters the bonding cavity and places it under the finished wafer.

The manipulator enters the bonding cavity, so that the wafer carrying area of the tray is located directly below the finished wafer, so that the finished wafer falls exactly into the carrying area of the tray when it falls.

Step 514e. The lifting drive part drives the finished wafer down to the robot. The carrier drive part drives the carrier to withdraw from the wafer bearing area of the pressure plate, unloads the finished wafer to the robot, and the robot moves the finished wafer. Ship to finished wafer library.

The lifting drive parts drive the finished wafers down to the carrying area where the finished wafers fall into the pallet, the bearing drive parts drive the bearing drawers out, and the manipulator transports the finished wafers to the finished wafer library.

10‧‧‧Tray

20‧‧‧ Wafer positioning post

30‧‧‧ First wafer spacer

31‧‧‧ First wafer spacer

32‧‧‧ First drive parts

Claims (21)

A manipulator, characterized in that it includes: a tray (10); at least three wafer positioning posts (20) fixed on the tray (10); at least three first crystals fixed on the tray (10) A circular spacer mechanism (30), each of the first wafer spacer mechanisms (30) includes a first wafer spacer (31), and is configured to drive the first wafer spacer (31) into the tray (10) The first driving part (32) of the wafer carrying area. According to the manipulator described in item 1 of the patent application scope, the driving method of the first driving component is a telescopic type or a rotary type. The manipulator described in item 2 of the patent application scope, wherein the first driving part (32) includes a first cylinder (321), and the first cylinder (321) and the first wafer spacer (31) One end is fixedly connected, and the first cylinder (321) is configured to drive the first wafer spacer (31) to expand or contract. The manipulator as described in item 2 of the patent application scope, wherein the first driving part (32) includes a second cylinder (323), a first rack (324) and a first gear (325), and the second cylinder (323) is fixedly connected to one end of the first rack (324), the second cylinder (323) is configured to drive the first rack (324) to expand and contract, and the mouth of the first rack (324) is The teeth on the first gear (325) mesh, the first wafer spacer (31) is fixed on the first gear (325), and rotates around the first as the first gear (325) rotates The axis of the gear (325) rotates. The manipulator described in item 1 of the scope of the patent application, wherein the first wafer spacing mechanism (30) and the wafer positioning column (20) are alternately arranged at the edge of the tray (10). The manipulator described in item 1 of the patent application scope, wherein the tray (10) is circular, and the number of the first wafer spacing mechanism (30) and the wafer positioning column (20) are three, The three aforementioned first wafer spacing mechanisms (30) and the three aforementioned wafer positioning posts (20) are evenly distributed about the geometric center of the tray (10). A bonding cavity, characterized in that it includes: a bottom plate (40); a pressure plate (50) and at least three lifting driving parts (60) fixed on the bottom plate (40), and the lifting driving parts (60) ) Around the periphery of the pressure plate (50); fixed on each of the lifting drive parts (60) is provided with a bearing mechanism (70) and a second spacer mechanism (80), the bearing mechanism (70) includes The carrier (71), and the carrier driving part (72) configured to drive the carrier (71) into the wafer bearing region of the pressure plate (50); the second spacer mechanism (80) includes a second A wafer spacer (81), and a second spacer drive part (82) provided to drive the second wafer spacer (81) into the wafer carrying area of the pressure plate (50). The bonding cavity as described in item 7 of the patent application scope, wherein the driving method of the carrier driving part is a telescopic type or a rotary type. The bonding cavity as described in item 8 of the patent application range, wherein the carrier driving part (72) includes a third cylinder (721), and the third cylinder (721) is fixed to one end of the carrier (71) In connection, the third cylinder (721) is configured to drive the carrier (71) to expand or contract. The bonding cavity as described in item 8 of the patent application scope, wherein the carrier driving part (72) includes a fourth cylinder (723), a second rack (724), and a second gear (725), and the foregoing The four cylinders (723) are fixedly connected to one end of the second rack (724), the fourth cylinder (723) is configured to drive the second rack (724) to expand and contract, and the teeth on the second rack (724) The mouth meshes with the gear teeth on the second gear (725), the carrier (71) is fixed on the second gear (725), and rotates with the second gear (725) around the second gear (725) 725) The axis rotates. The bonding cavity as described in item 7 of the patent application range, wherein the driving method of the second spacer driving part (82) is a telescopic type or a rotary type. The bonding cavity as described in item 11 of the patent application range, wherein the second spacer driving part (82) includes a fifth cylinder (821), the fifth cylinder (821) and the second wafer spacer One end of (81) is fixedly connected, and the fifth cylinder (821) drives the second wafer spacer (81) to expand or contract or rotate. The bonding cavity described in item 11 of the patent application scope, wherein the second spacer driving part (82) includes a sixth cylinder (823), a third rack (824), and a third gear (825), The sixth cylinder (823) is fixedly connected to one end of the third rack (824), the sixth cylinder (823) is configured to drive the third rack (824) to expand and contract, and the third rack (824) The tooth mouth of the gear meshes with the gear teeth on the third gear (825), the second wafer spacer (81) is fixed on the third gear (825), and rotates with the third gear (825) Turn around the axis of the aforementioned third gear (825). The bonding cavity as described in item 7 of the patent application scope, wherein the pressure bearing plate (50) is circular, the number of the lifting driving parts (60) is three, and the three lifting driving parts (60) The geometric center of the aforementioned pressure plate (50) is evenly distributed. The bonding cavity as described in item 7 of the patent application scope, wherein the pressure-bearing plate (50) is provided with at least three ejector pins (51) and an ejector lift driver (52), and at least three ejector pins (51) With respect to the geometric center of the pressure plate (50) being evenly distributed, the jack lift driver (52) is configured to drive the jack (51) to rise above a predetermined height or drive above the upper surface of the pressure plate (50) The ejector pin (51) is lowered below the preset height of the upper surface of the pressure plate (50). A wafer bonding system, characterized in that it includes a device wafer library (100), a carrier wafer library (200), a finished wafer library (300), as described in any of items 1 to 6 of the patent application scope The described manipulator, and the bonding cavity as described in any of items 7 to 15 of the patent application. A bonding method based on the wafer bonding system described in Item 16 of the patent application range, characterized in that it includes: a manipulator takes the carrier wafer from the carrier wafer library (300) and positions it on the manipulator On the tray (10); the first driving part drives the first wafer spacer (31) into the wafer carrying area of the tray (10), and places the first wafer spacer (31) on the carrier wafer Above the circle; the manipulator takes the device wafer from the device wafer library (100) and positions it above the first wafer spacer (31); the manipulator transports the carrier wafer and the device wafer To the bonding cavity; unloading the carrier wafer and the device wafer into the bonding cavity, and performing a bonding operation. The bonding method as described in Item 17 of the patent application scope, wherein at least three ejector pins (51) and ejector lift drivers (52) are provided on the pressure plate (50); the carrier wafer and the aforementioned The unloading of the device wafer into the bonding cavity includes: a robot hand transports the carrier wafer and the device wafer above the pressure plate (50); the carrier driving part (72) drives the carrier (71) into the carrier The wafer carrying area of the pressing plate (50), and the supporting piece (71) is placed under the supporting wafer; the second spacer driving part (82) drives the second wafer spacer (81) into the supporting pressure The wafer carrying area of the board (50), and the second wafer spacer (81) is placed between the carrying wafer and the device wafer; the first driving part (32) drives the first wafer The spacer (31) leaves the wafer carrying area of the tray (10); the lifting driving part (60) drives the carrying wafer and the device wafer to a height where the height of the carrying wafer is greater than that of the wafer positioning column (20) Height; the manipulator withdraws from the bonding cavity; the ejector pin (51) on the pressure plate (50) is raised to a predetermined height above the pressure plate (50), and the lifting drive part (60) Drive the carrier wafer and the device wafer down to the ejector pin (51) that falls on the pressure plate (50); the carrier drive part (72) drives the carrier (71) to withdraw from the pressure In the wafer carrying area of the board (50), the ejector pin (51) on the pressure bearing plate (50) is lowered until the carrying wafer falls on the pressure bearing plate (50). The bonding method as described in item 18 of the patent application scope, wherein after the carrier wafer falls on the pressure-bearing plate, the bonding method further includes: evacuating the bonding cavity to make the bond The vacuum degree of the combined cavity reaches the preset vacuum degree; the second spacer driving part (82) drives the second wafer spacer (81) to withdraw from the wafer carrying area of the pressure plate (50), so that the device crystal The circle falls directly above the carrier wafer; the pressure plate (50) heats up to the first preset value and performs the bonding operation. The bonding method as described in Item 19 of the patent application scope, wherein after the bonding operation is completed, the bonding method further includes: the temperature of the pressure plate (50) is lowered to a second preset value; the bonding cavity is performed Vacuum breaking operation, the cavity is opened after the vacuum breaking operation is completed; the manipulator enters the bonding cavity to transport the finished wafer to the finished wafer library (300). The bonding method as described in item 20 of the patent application scope, wherein the manipulator enters the bonding cavity and transports the finished wafer to the finished wafer library (300) including: the pressure bearing plate (50) The ejector pin (51) is raised to a predetermined height to disengage the finished wafer from the pressure plate (50); the chip driving part (72) drives the chip into the wafer carrying area of the pressure plate (50) And place the carrier (71) under the finished wafer; the lifting drive part (60) drives the finished wafer to a preset height; the robot enters the bonding cavity and is placed on the finished product Below the wafer; the lifting drive part (60) drives the finished wafer down to the manipulator, the bearing drive part (72) drives the bearing plate (71) to withdraw from the wafer bearing of the pressure plate (50) In the area, the finished wafer is unloaded to the robot, and the robot transports the finished wafer to the finished wafer library (300).

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