WO2020001521A1

WO2020001521A1 - Manipulator, bonding cavity, wafer bonding system and bonding method

Info

Publication number: WO2020001521A1
Application number: PCT/CN2019/093210
Authority: WO
Inventors: 付辉; 霍志军
Original assignee: 上海微电子装备（集团）股份有限公司
Priority date: 2018-06-29
Filing date: 2019-06-27
Publication date: 2020-01-02
Also published as: TW202002146A; CN110660723A; TWI694536B; CN110660723B

Abstract

A manipulator, a bonding cavity, a wafer bonding system, and a bonding method. The manipulator comprises: a tray (10); at least three wafer positioning columns (20) fixed on the tray (10); at least three first wafer spacing mechanisms (30) fixed on the tray (10), each first wafer spacing structure (30) comprising a first wafer spacer (31), and a first driving member (32) configured to drive the first wafer spacer (31) to enter a wafer holding region of the tray (10).

Description

Manipulator, bonding cavity, wafer bonding system and bonding method

This disclosure claims the priority of a Chinese patent application filed with the Chinese Patent Office on June 29, 2018 with application number 201810714786.1. The entire contents of the above application are incorporated herein by reference.

Technical field

Embodiments of the present invention relate to semiconductor processing technologies, for example, a robot arm, a bonding cavity, a wafer bonding system, and a bonding method.

Background technique

With the continuous development of semiconductor technology, thinning device wafers has become a general trend, but ultra-thin device wafers are flexible and fragile, and are easy to warp and undulate. The current mainstream solution is to bond device wafers to rigidity. On the carrier wafer, not only can the wafer be thinned, but it can also support a variety of processing processes. After the back processing steps are completed, the device can be peeled from the carrier wafer and continued processing until packaging.

A typical temporary bonding process involves fully processing the device wafer on the top surface, spin-coating the carrier wafer and the device wafer with a layer of bonding adhesive, and then transferring the two wafers to the bonding cavity, carefully As for the center of the bonding cavity, bonding is performed in a vacuum after increasing the temperature. After temporary bonding, the wafer stack is subjected to backside processing (thinning, etching, metallization, etc.), and then the thin device wafer is peeled from the carrier wafer. Existing bonding devices need to use a robotic arm to sequentially remove the device wafer and the carrier wafer from the wafer library, transport them to the bonding cavity, and then insert the spacers in the bonding cavity, evacuate the bonding cavity, Withdrawal of the spacer, heating of the bearing plate and the pressure plate, bonding, etc., this bonding process needs to enter and exit the bonding cavity twice, and the efficiency of the bonding process needs to be improved.

Summary of the invention

Embodiments of the present invention provide a manipulator, a bonding cavity, a wafer bonding system, and a bonding method to improve the efficiency of a bonding process.

In a first aspect, an embodiment of the present invention provides a manipulator, and the manipulator includes:

tray;

At least three wafer positioning posts fixed on the tray;

At least three first wafer spacers fixed on the tray, each of the first wafer spacer structures includes a first wafer spacer, and is configured to drive the first wafer spacer into the first wafer spacer The first drive component of the wafer carrying area of the tray.

According to a second aspect, an embodiment of the present invention further provides a bonding cavity. The bonding cavity includes:

Floor

A pressure bearing plate and at least three lifting driving members are fixed on the bottom plate, and the lifting driving members are arranged around the periphery of the pressure bearing plate;

A wafer support mechanism and a second spacer mechanism are fixed on each of the lifting driving parts, and the wafer support mechanism includes a wafer support, and a wafer carrying area for driving the wafer support into the pressure bearing plate. The second spacer mechanism includes a second wafer spacer, and a second spacer drive configured to drive the second wafer spacer into a wafer carrying area of the pressure plate component.

According to a third aspect, an embodiment of the present invention further provides a wafer bonding system, which includes a device wafer library, a carrier wafer library, a finished wafer library, the robot according to the first aspect, and the keys according to the second aspect.合 Cavity.

According to a fourth aspect, an embodiment of the present invention further provides a bonding method based on the wafer bonding system according to the third aspect, the method including:

The robot hand takes the carrier wafer out of the carrier wafer library and positions it on a tray of the robot hand;

A first driving component driving a first wafer spacer into a wafer carrying area of the tray, and placing the first wafer spacer above the carrier wafer;

Removing the device wafer from the device wafer library by the robot arm, and positioning the device wafer above the first wafer spacer;

The robot hand transports the carrier wafer and the device wafer to a bonding cavity;

The carrier wafer and the device wafer are unloaded into the bonding cavity, and a bonding operation is performed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a manipulator provided in Embodiment 1 of this document; FIG.

FIG. 2 is a schematic structural diagram of a first driving component in Embodiment 1 of this document; FIG.

FIG. 3 is a schematic structural diagram of still another first driving component in Embodiment 1 of this document; FIG.

4 is a schematic structural diagram of another first driving component in Embodiment 1 of the present invention;

5 is a schematic structural diagram of a bonding cavity provided in Embodiment 2 of the present invention;

FIG. 6 is a schematic structural diagram of a carrier driving component in Embodiment 2 of this document; FIG.

FIG. 7 is a schematic structural diagram of still another carrier driving component in the second embodiment of the present invention; FIG.

8 is a schematic structural diagram of another carrier driving component in the second embodiment of the present invention;

FIG. 9 is a schematic structural diagram of a second spacer driving component in Embodiment 2 of this document; FIG.

FIG. 10 is a schematic structural diagram of still another second spacer driving member according to the second embodiment of the present invention; FIG.

11 is a schematic structural diagram of another second spacer driving member in Embodiment 2 of the present invention;

FIG. 12 is a schematic structural diagram of a wafer bonding system provided in Embodiment 3 of this document; FIG.

13 is a schematic flowchart of a bonding method provided in Embodiment 4 of this document;

14 is a schematic flowchart of the process of unloading a carrier wafer and a device wafer into a bonding cavity in Embodiment 4 of this document;

15 is a schematic flowchart of a process after unloading a carrier wafer and a device wafer into a bonding cavity in Embodiment 4 of the present invention;

FIG. 16 is a schematic flow chart of a robot moving a finished wafer to a finished wafer library in the fourth embodiment of the present invention.

detailed description

The following further describes this document in detail with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain this document, but not intended to limit the present document. It should also be noted that, for the convenience of description, the drawings only show parts related to this document, but not all of the structures, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.

Example one

FIG. 1 is a schematic structural diagram of a manipulator provided in Embodiment 1 of the present invention. The manipulator provided in this embodiment can be used in a wafer bonding system. The manipulator includes:

Tray 10; at least three wafer positioning posts 20 fixed on the tray 10; at least three first wafer spacing mechanisms 30 fixed on the tray 10, each first wafer spacing structure 30 including a first wafer spacing The sheet 31 and a first driving member 32 provided to drive the first wafer spacer 31 into the wafer carrying area of the tray 10.

The tray 10 is configured to place a wafer. For example, referring to FIG. 1, a robot arm includes three wafer positioning pillars 20 and three first wafer spacing mechanisms 30 as an example. The wafer positioning pillar may be a cylinder. The robot arm Used to acquire and transport wafers. It can be understood that wafer bonding is to place the device wafer above the carrier wafer, and then bond the device wafer and the carrier wafer together through a bonding system. The edge of the device wafer and the carrier wafer can be at least One positioning groove is matched and docked with one of the wafer positioning columns 20 of the three wafer positioning columns 20 of the robot, and the remaining two wafer positioning columns 20 limit the outer edge of the wafer. The working process of the robot is as follows: the robot enters the carrier wafer library to obtain the carrier wafer, uses three wafer positioning columns 20 to position the carrier wafer in shape, fixes the carrier wafer on the tray 10, and then the first driving component 32 drives The first wafer spacer 31 extends into the carrying area of the tray 10, and the first wafer spacer 31 is positioned above the carrier wafer, and then the robot enters the device wafer library to obtain the device wafer, and uses three wafer positioning columns 20 Position the device wafer in an outline, fix the device wafer on the tray 10, and place the device wafer above the first wafer spacer 31. Finally, the robot hand sends the carrier wafer and the device wafer into the bonding cavity together. in.

The robot hand for a wafer bonding system provided in this embodiment realizes the outline positioning of a wafer through a wafer positioning post, and the first wafer spacer is placed on a carrier wafer taken out by the robot through a first wafer spacer mechanism. Then, the robotic arm is used to remove the device wafer. Finally, the robotic arm carries the carrier wafer and the device wafer to the bonding cavity at a time, reducing the process of aligning the carrier wafer and the device wafer in the bonding cavity, and shortening the wafer transfer to The bonding time of the cavity improves the efficiency of the bonding process.

Optionally, the driving manner of the first driving member 32 may be a telescopic type or a rotary type.

The first driving component 32 is configured to drive the first wafer spacer 31 so that the first wafer spacer 31 separates the carrier wafer and the device wafer, so that the robot arm simultaneously acquires the carrier wafer and the device wafer. The first drive The driving method of the component 32 may be a telescopic type or a rotary type, so as to control the linear telescopic or rotational movement of the first wafer spacer 31, and those skilled in the art may flexibly choose.

FIG. 2 is a schematic structural diagram of a first driving component. Optionally, the first driving component includes a first air cylinder 321, the first air cylinder 321 is fixedly connected to one end of the first wafer spacer 31, and the first air cylinder 321 is configured to drive the first wafer spacer 31 to expand and contract. The dotted line indicates the state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.

FIG. 3 is a schematic structural diagram of another first driving component. This first driving component is similar in structure to the first driving component shown in FIG. 2 except that the first telescopic cylinder 321 is changed to a rotary cylinder 322, and the linear movement of the first wafer spacer 31 is changed to a rotary motion. . The dotted line indicates the state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.

FIG. 4 is a schematic structural diagram of another first driving component. Optionally, the first driving component includes a second cylinder 323, a first rack 324, and a first gear 325. The second cylinder 323 is fixedly connected to one end of the first rack 324, and the second cylinder 323 is configured to drive the first tooth. The bar 324 expands and contracts, the tooth opening on the first rack 324 meshes with the gear teeth on the first gear 325, and the first wafer spacer 31 is fixed on the first gear 325, and rotates as the first gear 325 rotates. The first gear 325 is pivoted. The dotted line indicates the state when the first wafer spacer 31 is withdrawn from the wafer carrying area of the tray.

Optionally, the first wafer spacing mechanism 30 and the wafer positioning pillars 20 are alternately disposed on the edge of the tray 10 at intervals.

Continuing to refer to FIG. 1, it can be understood that the first wafer spacing mechanism 30 and the wafer positioning posts 20 are alternately and evenly distributed on the edge of the tray 10, which can make the wafer more stable when the tray 10 is placed.

Optionally, the tray 10 is circular, and the number of the first wafer spacing mechanism 30 and the wafer positioning pillars 20 are three. The three first wafer spacing mechanisms 30 and the three wafer positioning pillars 20 are about the tray 10. The geometric centers are evenly distributed.

Continuing to refer to FIG. 1, the wafer is generally circular, so the tray 10 is set to be circular. The geometric center of the tray 10 is evenly spaced and three wafer positioning columns 20 are arranged at an interval to achieve accurate alignment of the carrier wafer and the device wafer. With regard to the uniform distribution of the geometric center of the tray 10 and the setting of three wafer spacing mechanisms at intervals, stable device wafer support can be achieved.

Example two

FIG. 5 is a schematic structural diagram of a bonding cavity provided in Embodiment 2 of the present document. The bonding cavity provided in this embodiment can be used in a wafer bonding system, and can be used in conjunction with the robot arm provided in Embodiment 1 to improve the bonding. Efficiency of the process. The bonding cavity provided in this embodiment includes:

Base plate 40; fixed on the bottom plate 40 is provided with a pressure bearing plate 50 and at least three lifting driving members 60, the lifting driving member 60 is arranged around the pressure bearing plate 50; a fixing plate mechanism 70 is provided on each lifting driving member 60 And a second spacer mechanism 80, the wafer support mechanism 70 includes a wafer 71, and a wafer drive member 72 configured to drive the wafer 71 into the wafer carrying area of the pressure plate 50; the second spacer mechanism 80 includes a second A wafer spacer 81 and a second spacer driving member 82 provided to drive the second wafer spacer 81 into the wafer carrying area of the pressure receiving plate 50.

Exemplarily, only one lift driving component 60 is shown in FIG. 5. The pressure bearing plate 50 is provided to place a wafer, the carrier plate 71 is provided to support a carrier wafer, and the second spacer 81 is provided to support a device wafer. Between the carrier wafer and the device wafer. When the manipulator transports the carrier wafer and the device wafer into the bonding cavity together, the carrier driving part 72 drives the carrier 71 to move to the wafer carrying area of the pressure plate 50 to support the carrier wafer, and the second spacer drives The component 82 drives the second wafer spacer 81 between the carrier wafer and the device wafer to support the device wafer, and the lift driving component 60 rises to unload the carrier wafer and the device wafer from the robot.

The bonding cavity for the wafer bonding system provided in this embodiment is used in cooperation with the robot hand provided in the above embodiment, and the at least three lifting driving components and the carrier mechanism and the first supporting mechanism provided on each lifting driving component are used. The two spacer mechanism can unload the carrier wafer and the device wafer into the bonding cavity at one time, eliminating the structure of the bonding cavity for aligning the carrier wafer and the device wafer, reducing the number of The process of device wafer alignment in the bonding cavity shortens the time for wafer transfer to the bonding cavity and improves the efficiency of the bonding process.

Optionally, the driving mode of the carrier driving member 72 may be a telescopic type or a rotary type.

The carrier driving member 72 is configured to drive the carrier 71 to support the carrier wafer 71. The driving method of the carrier driving member 72 can be telescopic or rotary to control the linear extension or rotation of the carrier 71. Technicians have the flexibility to choose.

FIG. 6 is a schematic structural diagram of a carrier driving member. Optionally, the carrier driving member includes a third cylinder 721, the third cylinder is fixedly connected to one end of the 721 carrier 71, and the third cylinder 721 is configured to drive the carrier 71 to expand and contract. The third cylinder 721 may be provided inside the lifting driving component, and the dashed line in FIG. 6 indicates a state when the supporting plate 71 is withdrawn from the wafer bearing area of the pressure plate.

FIG. 7 is a schematic structural diagram of another type of support member for driving a sheet. This sheet driving member is similar in structure to the sheet driving member shown in FIG. 6, except that the telescopic third cylinder 721 is changed to a rotary cylinder 722, and the linear movement mode of the sheet 71 is changed to rotary motion. The rotary cylinder 722 may be provided inside the lifting driving component, and the broken line in FIG. 7 indicates a state when the supporting plate 71 is withdrawn from the wafer bearing area of the pressure plate.

FIG. 8 is a schematic structural diagram of another sheet bearing driving component. Optionally, the carrier driving component includes a fourth cylinder 723, a second rack 724, and a second gear 725. The fourth cylinder 723 is fixedly connected to one end of the second rack 724, and the fourth cylinder 723 is configured to drive the second tooth. The bar 724 telescopes, the tooth opening on the second rack 724 meshes with the gear teeth on the second gear 725, and the bracket 71 is fixed on the second gear 725, and rotates around the second gear 725 as the second gear 725 rotates. The axis rotates. The fourth cylinder 723, the second rack 724, and the second gear 725 can all be disposed inside the lifting driving component. The dotted line in FIG. 8 indicates the state when the carrier 71 is withdrawn from the wafer carrying area of the pressure plate.

Optionally, the driving method of the second spacer driving member 82 may be a telescopic type or a rotary type.

The second spacer driving member 82 is configured to drive the second wafer spacer 81 so that the second wafer spacer 81 is placed between the carrier wafer and the device wafer to separate the carrier wafer and the device wafer. The driving method of the two spacer driving members 82 may be telescopic or rotary, so as to control the linear extension or rotation of the second wafer spacer 81. Those skilled in the art can flexibly choose.

FIG. 9 is a schematic structural diagram of a second spacer driving member. Optionally, the second spacer driving member includes a fifth cylinder 821, the fifth cylinder 821 is fixedly connected to one end of the second wafer spacer 81, and the fifth cylinder 821 drives the second wafer spacer 81 to expand and contract. The fifth cylinder 821 may be provided inside the lift driving component, and the broken line in FIG. 9 indicates a state when the second wafer spacer 81 is withdrawn from the wafer carrying area of the pressure plate.

FIG. 10 is a schematic structural diagram of another second spacer driving member. This second spacer driving member is similar to the second spacer driving member shown in FIG. 9 except that the telescopic fifth cylinder 821 is changed to a rotary cylinder 822, and the second wafer spacer 81 is linearly telescopically moved. For rotary motion. The rotary cylinder 822 may be provided inside the lifting driving component, and the broken line in FIG. 10 indicates a state when the second wafer spacer 81 is withdrawn from the wafer carrying area of the pressure plate.

FIG. 11 is a schematic structural diagram of another second spacer driving member. Optionally, the second spacer driving component includes a sixth cylinder 823, a third rack 824, and a third gear 825. The sixth cylinder 823 is fixedly connected to one end of the third rack 824, and the sixth cylinder 823 is configured to drive the first cylinder. The three racks 824 are telescopic, the tooth openings on the third rack 824 mesh with the teeth on the third gear 825, and the second wafer spacer 81 is fixed on the third gear 825, and with the rotation of the third gear 825 And rotate around the axis of the third gear 825. Among them, the sixth cylinder 823, the third rack 824, and the third gear 825 can be disposed inside the lifting driving part. The dotted line in FIG. 11 indicates the state when the second wafer spacer 81 is withdrawn from the wafer bearing area of the pressure plate. .

Optionally, the pressure receiving plate 50 is circular, and the number of the lifting driving members 60 is three. The three lifting driving members 60 are evenly distributed about the geometric center of the pressure receiving plate 50.

It can be understood that the wafer is generally circular, so the pressure bearing plate 50 is set to be circular, and the three lifting driving members 60 arranged uniformly on the geometric center of the pressure bearing plate 50 can realize stable support and lifting of the wafer.

Continuing to refer to FIG. 5, optionally, the pressure bearing plate 50 is provided with at least three ejector pins 51 and ejector lifting drives 52. At least three ejector pins 51 are evenly distributed about the geometric center of the pressure receiving plate 50. It is set to drive the ejector pin 51 to rise above the preset height of the upper surface of the pressure receiving plate 50 or drive the ejector pin 51 to fall below the preset height of the upper surface of the pressure receiving plate 50.

Exemplarily, only the ejector pin 51 and the ejector pin driver 52 of one lift driving member 60 are shown in FIG. 5. The ejector pin 51 is configured to support the carrier wafer, so that the carrier wafer is supported when the carrier wafer is placed on the bearing plate 50. Tablet 71 can be withdrawn.

Example three

FIG. 12 is a schematic structural diagram of a wafer bonding system provided in Embodiment 3 of the present document. The wafer bonding system includes a device wafer library 100, a carrier wafer library 200, a finished wafer library 300, and the first embodiment described above. The robot hand 400 and the bonding cavity 500 described in the second embodiment.

Example 4

FIG. 13 is a schematic flowchart of a bonding method provided in Embodiment 4 of the present document. This method can be executed by the wafer bonding system provided in Embodiment 3, and includes the following steps:

Step 10. The robot hand takes the carrier wafer out of the carrier wafer library, and positions the wafer on the tray of the robot hand.

Wherein, the pallet of the robot includes at least three wafer positioning columns, and at least three wafer positioning columns are configured to fix the carrier wafer on the tray.

Step 20: The first driving component drives the first wafer spacer into the wafer carrying area of the tray, and places the first wafer spacer above the carrier wafer.

The driving method of the first driving member may be a telescopic or rotary type. The first driving member is configured to drive the first wafer spacer to linearly expand or contract into the wafer carrying area of the tray, and the first wafer spacer is to be driven. Placed above the carrier wafer.

Step 30: The manipulator removes the device wafer from the device wafer library, and positions the device wafer above the first wafer spacer.

Wherein, the first wafer spacer is placed between the carrier wafer and the device wafer, and the first wafer spacer is set to support the device wafer, preventing the carrier wafer and the device wafer from contacting each other, so that the robot hand tray The carrier wafer and the device wafer can be placed at the same time. Through the function of at least three wafer positioning posts, accurate alignment of the carrier wafer and the device wafer can be achieved.

Step 40: The robot hand transports the carrier wafer and the device wafer to the bonding cavity.

Step 50: Unload the carrier wafer and the device wafer into the bonding cavity, and perform a bonding operation.

In the technical solution provided by this embodiment, the carrier wafer is sequentially taken out from the carrier wafer library by a robotic arm, the device wafer is taken out from the device wafer library, and the position of the carrier wafer and the device wafer is aligned. The wafer and device wafers are transported into the bonding cavity, which realizes that the robot can enter the bonding cavity only once, shortening the time for the wafer to be transferred to the bonding cavity, and improving the efficiency of the bonding process.

FIG. 14 is a schematic diagram of a process of unloading a carrier wafer and a device wafer into a bonding cavity. Optionally, unloading the carrier wafer and the device wafer into the bonding cavity includes:

Step 501: The robot hand transports the carrier wafer and the device wafer above the pressure plate.

Step 502: The carrier driving component drives the carrier into the wafer carrying area of the pressure bearing plate, and places the carrier under the carrier wafer.

Wherein, the driving mode of the carrier driving component can be telescopic or rotary. The carrier driving component is configured to drive the carrier to linearly retract or rotate into the wafer carrying area of the pressure bearing plate, and place the carrier under the carrier wafer. .

Step 503: The second spacer driving member drives the second wafer spacer into the wafer carrying area of the pressure plate, and places the second wafer spacer between the carrier wafer and the device wafer.

The driving method of the second spacer driving member may be telescopic or rotary. The second spacer driving member is configured to drive the second wafer spacer to linearly retract or rotate into the wafer carrying area of the pressure plate, and The second wafer spacer is placed between the carrier wafer and the device wafer. The second wafer spacer is configured to separate the carrier wafer and the device wafer, and is also provided to support the device wafer.

Step 504: The first driving component drives the first wafer spacer to leave the wafer carrying area of the tray.

Due to the support of the device wafer by the second wafer spacer, the first driving component drives the first wafer spacer to withdraw, preventing the first wafer spacer from blocking the rising of the carrier wafer.

Step 505: The lift driving component drives the carrier wafer and the second wafer spacer to rise, and simultaneously drives the carrier wafer and the device wafer to rise to a height of the carrier wafer greater than the height of the wafer positioning pillar.

The lifting wafer drives the carrier wafer and the device wafer to lift away from the robot arm. When the height of the carrier wafer is greater than the height of the wafer positioning column, the carrier wafer is completely separated from the robot arm, and the robot arm can be withdrawn.

Step 506: The manipulator withdraws the bonding cavity.

Step 507: The ejector pin on the pressure-bearing plate is raised to a preset height higher than the pressure-bearing plate, and the lifting driving component drives the carrier wafer and the device wafer to fall to the ejector pin falling on the pressure-bearing plate.

Step 508: The wafer support driving component drives the wafer to withdraw from the wafer bearing area of the pressure bearing plate, and the ejector pin on the pressure bearing plate is lowered until the load wafer falls on the pressure bearing plate.

After the robotic arm is withdrawn, the lifting and driving components drive the carrier wafer and the device wafer to fall. When the carrier wafer is dropped on the ejector pin of the pressure plate, the unloading process of the carrier wafer and the device wafer is completed. The wafer is driven out of the wafer carrying area of the pressure plate.

FIG. 15 is a schematic flow chart after unloading a carrier wafer and a device wafer into a bonding cavity. Optionally, after step 508, the method further includes:

Step 509: Evacuate the bonding cavity so that the vacuum degree of the bonding cavity reaches a preset vacuum degree.

It can be understood that the operation of evacuating the bonding cavity can be completed by a vacuum pump connected to the bonding cavity, and can be specifically selected according to common technical means in the art.

Step 510: The second spacer driving member drives the second wafer spacer to withdraw from the wafer carrying area of the pressure plate, so that the device wafer falls directly above the carrier wafer.

The driving method of the second spacer driving member may be telescopic or rotary. The second spacer driving member is configured to drive the second wafer spacer to linearly retract or rotate to withdraw the wafer carrying area of the pressure plate. When the driving method of the second spacer driving member is a rotation type, for example, the second spacer driving member may be rotated by 90 ° and separated from the device wafer.

Step 511: The pressure bearing plate is heated to a first preset value, and a bonding operation is performed.

The pressure-bearing plate may have a built-in electric heating temperature control device, and the first preset temperature value is selected according to the characteristics of the specific bonded wafer.

Optionally, after the bonding operation is completed, it further includes:

Step 512: The pressure bearing plate is cooled down to a second preset value.

The second preset value of the temperature is selected according to the characteristics of the specific bonded wafer.

Step 513: The bonding cavity is subjected to a vacuum breaking operation, and the cavity is opened after the vacuum breaking operation is completed.

The vacuum breaking operation is a reverse process of vacuuming, and can be specifically selected according to technical means commonly used in the art.

Step 514: The robot enters the bonding cavity and transports the finished wafer to the finished wafer library.

It can be understood that a finished wafer is formed after the bonding of the carrier wafer and the device wafer is completed.

FIG. 16 is a schematic diagram showing a flow of a robot moving a finished wafer to a finished wafer library. Optionally, the robotic arm enters the bonding cavity and transports the finished wafer to the finished wafer library including:

Step 514a: The ejector pin on the pressure bearing plate is raised to a preset height, so that the finished wafer is separated from the pressure bearing plate.

In step 514b, the wafer driving member drives the wafer into the wafer carrying area of the pressure plate, and places the wafer under the finished wafer.

Wherein, the driving method of the carrier driving component can be telescopic or rotary. The carrier driving component is configured to drive the carrier to linearly retract or rotate into the wafer bearing area of the pressure plate, and place the carrier under the finished wafer.

Step 514c: The lift driving component drives the finished wafer to rise to a preset height.

The preset height is greater than the height of the wafer positioning post when the robot is located on the pressure plate.

In step 514d, the robot enters the bonding cavity and is placed under the finished wafer.

The robot enters the bonding cavity, so that the wafer carrying area of the tray is located directly below the finished wafer, so that the finished wafer falls into the carrying area of the tray when it falls.

Step 514e: The lift driving component drives the finished wafer down to the robot, the wafer driving component drives the wafer to withdraw from the wafer carrying area of the pressure plate, unloads the finished wafer to the robot, and the robot transfers the finished wafer to the finished Wafer library.

The lift driving component drives the finished wafer to descend until the finished wafer falls into the carrying area of the tray, the carrier driving component drives the carrier to withdraw, and the robot hand transports the finished wafer to the finished wafer library.

Claims

A manipulator including:

Tray (10);

At least three wafer positioning posts (20) fixed on the tray (10);

At least three first wafer spacer mechanisms (30) fixed on the tray (10), each of the first wafer spacer structures (30) includes a first wafer spacer (31), and is configured to A first drive member (32) that drives the first wafer spacer (31) into a wafer carrying area of the tray (10).
The manipulator according to claim 1, wherein a driving method of the first driving member is a telescopic type or a rotary type.
The robot arm according to claim 1 or 2, wherein the first driving member (32) includes a first cylinder (321), the first cylinder (321) and the first wafer spacer (31) One end is fixedly connected, and the first air cylinder (321) is configured to drive the first wafer spacer (31) to expand or contract.
The robot arm according to claim 1 or 2, wherein the first driving member (32) includes a second cylinder (323), a first rack (324), and a first gear (325), the second cylinder (323) is fixedly connected to one end of the first rack (324), and the second cylinder (323) is arranged to drive the first rack (324) to expand and contract, and the first rack (324) The tooth opening is engaged with gear teeth on the first gear (325), the first wafer spacer (31) is fixed on the first gear (325), and the first gear (325) Rotation around the axis of the first gear (325).
The robot arm according to claim 1, wherein the first wafer spacing mechanism (30) and the wafer positioning posts (20) are alternately disposed at an edge of the tray (10) at intervals.
The robot arm according to claim 1, wherein the tray (10) is circular, and the number of the first wafer spacing mechanism (30) and the wafer positioning post (20) are three, three The first wafer spacing mechanisms (30) and the three wafer positioning posts (20) are evenly distributed with respect to the geometric center of the tray (10).
A bonding cavity includes:

Bottom plate (40);

A pressure bearing plate (50) and at least three lifting driving members (60) are fixed on the bottom plate (40), and the lifting driving member (60) is arranged around the periphery of the pressure receiving plate (50);

A sheet support mechanism (70) and a second spacer sheet mechanism (80) are fixed on each of the lifting driving parts (60), the sheet support mechanism (70) includes a sheet support (71), and is configured to drive The carrier (71) enters a carrier driving part (72) of the wafer carrying area of the pressure plate (50); the second spacer mechanism (80) includes a second wafer spacer (81) And a second spacer driving member (82) configured to drive the second wafer spacer (81) into a wafer carrying area of the pressure receiving plate (50).
The bonding cavity according to claim 7, wherein a driving method of the carrier driving member is a telescopic type or a rotary type.
The bonding cavity according to claim 7 or 8, wherein the carrier driving member (72) comprises a third cylinder (721), and the third cylinder (721) and the carrier (71) One end is fixedly connected, and the third air cylinder (721) is configured to drive the support plate (71) to expand or contract.
The bonding cavity according to claim 7 or 8, wherein the carrier driving member (72) comprises a fourth cylinder (723), a second rack (724), and a second gear (725), and A fourth cylinder (723) is fixedly connected to one end of the second rack (724), and the fourth cylinder (723) is configured to drive the second rack (724) to expand and contract, and the second rack (724) 724) meshes with gear teeth on the second gear (725), the carrier (71) is fixed on the second gear (725), and as the second gear (725) Rotate to rotate around the axis of the second gear (725).
The bonding cavity according to claim 7, wherein a driving method of the second spacer driving member (82) is a telescopic type or a rotary type.
The bonding cavity according to claim 10 or 11, wherein the second spacer driving member (82) comprises a fifth cylinder (821), the fifth cylinder (821) and the second wafer One end of the spacer (81) is fixedly connected, and the fifth cylinder (821) drives the second wafer spacer (81) to expand or contract.
The bonding cavity according to claim 10 or 11, wherein the second spacer driving member (82) includes a sixth cylinder (823), a third rack (824), and a third gear (825), The sixth cylinder (823) is fixedly connected to one end of the third rack (824), and the sixth cylinder (823) is configured to drive the third rack (824) to expand and contract, and the third tooth The teeth on the bar (824) mesh with the teeth on the third gear (825), the second wafer spacer (81) is fixed on the third gear (825), and as the first The rotation of the three gears (825) rotates around the axis of the third gear (825).
The bonding cavity according to claim 7, wherein the pressure bearing plate (50) is circular, the number of the lifting driving members (60) is three, and the three lifting driving members (60) The geometric center of the pressure-receiving plate (50) is uniformly distributed.
The bonding cavity according to claim 7, wherein the pressure receiving plate (50) is provided with at least three ejector pins (51) and ejector pin lifting drives (52), and at least three ejector pins ( 51) Regarding the geometric center of the pressure bearing plate (50) being uniformly distributed, the ejector pin lifting driver (52) is arranged to drive the ejector pin (51) to rise above the upper surface of the pressure bearing plate (50) and preset The height or driving of the ejector pin (51) is lowered below a preset height of the upper surface of the pressure bearing plate (50).
A wafer bonding system includes a device wafer library (100), a carrier wafer library (200), a finished wafer library (300), a manipulator according to any one of claims 1-6, and claims The bonding cavity according to any one of 7-15.
A bonding method based on a wafer bonding system according to claim 16, comprising:

The robotic arm takes the carrier wafer from the carrier wafer library (300) and positions it on the pallet (10) of the robot;

A first driving component driving a first wafer spacer (31) into a wafer carrying area of the tray (10), and placing the first wafer spacer (31) above the carrier wafer;

Removing the device wafer from the device wafer library (100) by the robot arm and positioning the device wafer above the first wafer spacer (31);

The robot hand transports the carrier wafer and the device wafer to a bonding cavity;

The carrier wafer and the device wafer are unloaded into the bonding cavity, and a bonding operation is performed.
The bonding method according to claim 17, wherein the pressure receiving plate (50) is provided with at least three ejector pins (51) and ejector pin lifters (52);

Unloading the carrier wafer and the device wafer into the bonding cavity includes:

A robot hand transports the carrier wafer and the device wafer above the pressure bearing plate (50);

The carrier support member (72) drives the carrier (71) into the wafer carrying area of the pressure bearing plate (50), and places the carrier (71) under the carrier wafer;

The second spacer driving part (82) drives the second wafer spacer (81) into the wafer carrying area of the pressure plate (50), and places the second wafer spacer (81) in the Between the carrier wafer and the device wafer;

The first driving component (32) drives the first wafer spacer (31) to leave a wafer carrying area of the tray (10);

The lift driving component (60) drives the carrier wafer and the device wafer to rise to a height where the carrier wafer is greater than a height of a wafer positioning post (20);

The robot hand withdraws from the bonding cavity;

The ejector pin (51) on the pressure bearing plate (50) is raised to a preset height higher than the pressure bearing plate (50), and the lifting driving member (60) drives the carrier wafer and the device The wafer descends to the ejector pin (51) falling on the pressure bearing plate (50);

The carrier support member (72) drives the carrier (71) to withdraw from the wafer carrying area of the pressure bearing plate (50), and the ejector pin (51) on the pressure bearing plate (50) is lowered to The carrier wafer falls on the pressure plate (50).
The bonding method according to claim 18, wherein after the carrier wafer has landed on the pressure plate, the bonding method further comprises:

Evacuating the bonding cavity so that the vacuum degree of the bonding cavity reaches a preset vacuum degree;

The second spacer driving member (82) drives the second wafer spacer (81) to withdraw from the wafer carrying area of the pressure plate (50), so that the device wafer falls on the carrying wafer Directly above;

The pressure receiving plate (50) is heated to a first preset value, and a bonding operation is performed.
The bonding method according to claim 19, wherein after the bonding operation is completed, the bonding method further comprises:

Cooling the pressure bearing plate (50) to a second preset value;

The bonding cavity is subjected to a vacuum breaking operation, and the cavity is opened after the vacuum breaking operation is completed;

The robot hand enters the bonding cavity and transports a finished wafer to a finished wafer library (300).
The bonding method according to claim 20, wherein the manipulator enters the bonding cavity and transports a finished wafer to a finished wafer library (300) comprising:

The ejector pin (51) on the pressure bearing plate (50) is raised to a preset height, so that the finished wafer is separated from the pressure bearing plate (50);

The carrier driving member (72) drives the carrier into the wafer carrying area of the pressure plate (50), and places the carrier (71) under the finished wafer;

The lifting driving component (60) drives the finished wafer to rise to a preset height;

The robot hand enters the bonding cavity and is placed under the finished wafer;

The lifting driving member (60) drives the finished wafer to descend close to the robot, and the carrier driving member (72) drives the carrier (71) to withdraw the wafer carrier of the pressure bearing plate (50). Area, the finished wafer is unloaded to the robot, and the robot carries the finished wafer to the finished wafer library (300).